Low-cost high-temperature-resistant PCB base material and manufacturing process thereof
By adding high thermal conductivity ceramic particles and reinforcement materials to PCB substrates, the problems of low mechanical strength and reduced electrical performance of existing substrates in high temperature environments are solved, and better thermal conductivity and stability are achieved. It is suitable for high-quality Power electronics.
Patent Information
- Application Number
- CN202411161744.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2025-01-03
AI Technical Summary
The existing PCB substrates have low mechanical strength, reduced electrical performance, and high cost, making it difficult to carry high-power lamp beads.
By adding high-thermal conductivity ceramic particles and high-strength reinforcement materials, such as aluminum nitride or silicon nitride ceramic particles and aramid fibers or carbon fibers to the substrate, it is fully mixed and heat-treated to form a low-cost, high-temperature-resistant PCB substrate. And a copper foil layer is printed on its surface.
It significantly improves the thermal conductivity and mechanical strength of the substrate, maintains the electrical insulation performance and dielectric constant stability in high-temperature environments, and meets the needs of high-power electronic equipment.
Smart Images
Figure CN119255477A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of PCB manufacturing, and in particular to a low-cost, high-temperature-resistant PCB substrate and a manufacturing process thereof. Background Art
[0002] The most critical component of LED light strips, besides the lamp beads, is the PCB board. PCB (Printed Circuit Board), also known as printed circuit board or printed circuit board, is an important electronic component, which is the support of electronic components and the carrier of electrical connection of electronic components. PCB includes circuit layer, insulation layer and substrate. Common substrates include MCPCB substrate, FR-4 substrate and CEM3 substrate.
[0003] like Figure 1 MCPCB substrate is a unique metal-based copper-clad board. Currently, more than 95% of the light strips in the display field modules use this type of substrate, which has good thermal conductivity, electrical insulation and mechanical processing performance. However, the cost is high. When the power of the direct-type lamp beads is higher than 3.0W and the side-type lamp beads is higher than 0.7W, the temperature rise of the light strip and the module is too high, and the life of the lamp beads will be affected when lit for a long time.
[0004] like Figure 2 FR-4 substrate is a flame-retardant copper-clad modified epoxy glass fiber cloth laminate, which is a type of substrate with epoxy resin as adhesive and electronic grade glass fiber cloth as reinforcing material. Its bonding sheet and inner core thin copper-clad laminate are important substrates for making multi-layer printed circuit boards. However, its thermal conductivity is poor, with a thermal conductivity coefficient of 0.3-0.6W / mK, and it cannot carry high-power lamp beads. The power requirement for direct-type lamp beads is less than 1.4W, and the power requirement for side-entry lamp beads is no more than 0.2W.
[0005] like Figure 3 The CEM3 substrate has been almost eliminated from the market because it cannot be punched, has low production efficiency, has great resistance to mass production, and contains halogen. Summary of the invention
[0006] Some of the commonly used PCB substrates currently available have the problems of being too costly and having a short lifespan, while others have low mechanical strength and reduced electrical performance in high temperature environments.
[0007] In response to the above problems, a low-cost, high-temperature resistant PCB substrate and its manufacturing process are proposed. By adding high thermal conductivity ceramic particles, the thermal conductivity of the substrate is effectively improved, which can better dissipate heat. By using high-strength reinforcing materials, the tensile and bending resistance of the substrate is improved. Experiments have shown that in high temperature environments, the electrical insulation properties and dielectric constant of the substrate can remain stable.
[0008] First, low-cost high-temperature resistant PCB substrates, including:
[0009] Copper foil layer;
[0010] substrate layer;
[0011] The substrate layer is composed of:
[0012] The polyimide resin and the high thermal conductivity ceramic particles are fully mixed and stirred in accordance with the prescribed mass ratio, and the reinforcing material is added and fully mixed, and then pressed and heat treated.
[0013] Made of;
[0014] The copper foil layer is printed on the surface of the substrate layer.
[0015] In conjunction with the low-cost, high-temperature resistant PCB substrate described in the first aspect of the present invention, in a first possible implementation, the high thermal conductivity ceramic particles are aluminum nitride ceramic particles, and the reinforcing material is aramid fiber.
[0016] In combination with the first possible implementation manner of the first aspect of the present invention, in a second possible implementation manner, the mass ratio is:
[0017] Polyimide resin: aluminum nitride ceramic particles = 80:20.
[0018] In combination with the second possible implementation manner of the first aspect of the present invention, in a third possible implementation manner, the copper foil layer is printed on the first surface or the second surface of the substrate layer.
[0019] In combination with the second possible implementation manner of the first aspect of the present invention, in a fourth possible implementation manner, the number of the copper foil layers is two, and the copper foil layers are respectively printed on the first surface and the second surface of the substrate layer.
[0020] In combination with the low-cost, high-temperature resistant PCB substrate described in the first aspect of the present invention, in a fifth possible implementation, the high thermal conductivity ceramic particles are silicon nitride ceramic particles, and the reinforcing material is carbon fiber.
[0021] In combination with the fifth possible implementation manner of the first aspect of the present invention, in a sixth possible implementation manner, the mass ratio is:
[0022] Polyimide resin: silicon nitride ceramic particles = 75:25.
[0023] Second, low-cost high-temperature resistant PCB substrate manufacturing process, including:
[0024] Step 100, making a substrate layer: fully mixing the polyimide resin and the high thermal conductivity ceramic particles according to a specified mass ratio and stirring them evenly, then adding the reinforcing material and fully mixing them, and then performing compression molding and heat treatment;
[0025] Step 200, printing a copper foil layer: printing the copper foil layer on the first surface and / or the second surface of the substrate layer.
[0026] In combination with the low-cost high-temperature resistant PCB substrate manufacturing process described in the second aspect of the present invention, in a first possible implementation manner, the high thermal conductivity ceramic particles are aluminum nitride ceramic particles, the reinforcing material is aramid fiber, and the mass ratio is: polyimide resin: aluminum nitride ceramic particles = 80:20.
[0027] In combination with the low-cost high-temperature resistant PCB substrate manufacturing process described in the second aspect of the present invention, in a second possible implementation manner, the high thermal conductivity ceramic particles are silicon nitride ceramic particles, the reinforcing material is carbon fiber, and the mass ratio is: polyimide resin: silicon nitride ceramic particles = 75:25.
[0028] The low-cost, high-temperature-resistant PCB substrate and its manufacturing process described in the present invention are implemented to effectively improve the thermal conductivity of the substrate by adding high-thermal-conductivity ceramic particles, which can better dissipate heat. The tensile and bending resistance of the substrate are improved by using high-strength reinforcing materials. Experiments have shown that the electrical insulation performance and dielectric constant of the substrate can remain stable in a high-temperature environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0030] Figure 1 It is a schematic diagram of the structure of the MCPCB substrate in the prior art;
[0031] Figure 2 It is a schematic diagram of the structure of the FR-4 substrate in the prior art;
[0032] Figure 3 It is a schematic diagram of the structure of a CEM-3 substrate in the prior art;
[0033] Figure 4 This is a schematic structural diagram of a low-cost, high-temperature-resistant PCB substrate according to structural embodiment 1 of the present invention;
[0034] Figure 5 This is a schematic structural diagram of a low-cost, high-temperature-resistant PCB substrate according to structural embodiment 2 of the present invention;
[0035] Figure 6This is a schematic diagram of the process flow for manufacturing a low-cost, high-temperature-resistant PCB substrate according to process example 1 of the present invention. DETAILED DESCRIPTION
[0036] The following will be combined with the accompanying drawings in the invention to clearly and completely describe the technical solutions in the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the present invention.
[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0039] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0041] The existing PCB substrate has low mechanical strength and reduced electrical performance in high temperature environments, such as Figure 1 , Figure 2 and Figure 3 , Figure 1 It is a schematic diagram of the MCPCB substrate structure in the prior art. Figure 2 It is a schematic diagram of the FR-4 substrate structure in the prior art. Figure 3 It is a schematic diagram of the structure of CEM-3 substrate in the prior art. Figure 1 In the embodiment, a copper foil layer 11, an insulating layer 12 and an aluminum plate layer 13 are included in sequence. Figure 2 In the embodiment, the copper foil layer 11 is provided on both sides and the glass cloth layer 21 is provided in the middle. Figure 3 The copper foil layer 11, the glass cloth layer 31, the glass non-woven fabric layer 32, the glass cloth layer 31 and the copper foil layer 11 are included in sequence.
[0042] In view of the above problems, a low-cost, high-temperature-resistant PCB substrate and its manufacturing process are proposed.
[0043] Structural Example 1
[0044] like Figure 4 , Figure 4 This is a schematic structural diagram of a low-cost, high-temperature resistant PCB substrate of structural embodiment 1 of the present invention; a low-cost, high-temperature resistant PCB substrate, comprising a copper foil layer 11 and a substrate layer 41; the substrate layer 41 is made by fully mixing and stirring polyimide resin (PI) and high thermal conductivity ceramic particles in a specified mass ratio, adding reinforcing materials and fully mixing, and then pressing and heat treating; the copper foil layer 11 is printed on the surface of the substrate layer 41.
[0045] In this embodiment, high temperature stable polyimide (PI) is used as the main material; high thermal conductivity ceramic particles are added to improve the thermal conductivity of the substrate; and reinforcing materials are used to enhance the mechanical strength of the substrate. By adding high thermal conductivity ceramic particles, the thermal conductivity of the substrate is effectively improved, which can better dissipate heat. By using high strength reinforcing materials, the tensile and bending resistance of the substrate is improved. Experiments show that the electrical insulation performance and dielectric constant of the substrate can remain stable in a high temperature environment.
[0046] In this embodiment, the high thermal conductivity ceramic particles are aluminum nitride (AIN) ceramic particles, and the reinforcing material is aramid fiber (Kevlar). The mass ratio is: polyimide resin (PI): aluminum nitride (AIN) ceramic particles = 80:20. The copper foil layer 11 is a layer, printed on the first surface or the second surface of the substrate layer 41.
[0047] Structural Example 2
[0048] Different from the structural embodiment 1, in this embodiment, Figure 5 , Figure 5 It is a schematic structural diagram of a low-cost, high-temperature-resistant PCB substrate of structural embodiment 2 of the present invention; the number of copper foil layers 11 is two, and the copper foil layers 11 are printed on the first surface and the second surface of the substrate layer 41 respectively.
[0049] Structural Example 3
[0050] Different from the structural embodiment 1, in this embodiment, the high thermal conductivity ceramic particles are silicon nitride (Si3N4) ceramic particles, and the reinforcing material is carbon fiber. The mass ratio is: polyimide resin (PI): silicon nitride (Si3N4) ceramic particles = 75:25. Figure 4 The copper foil layer 11 is a single layer and is printed on the first surface or the second surface of the substrate layer 41 .
[0051] Structural Example 4
[0052] Different from the structural embodiment 3, in this embodiment, reference can be made to Figure 5 The number of layers of the copper foil layer 11 is two, and the copper foil layer 11 is printed on the first surface and the second surface of the substrate layer 41 respectively.
[0053] experiment
[0054] The experimental results are shown in Table 1, which shows the performance parameters of various PCB substrates.
[0055] Table 1 Performance parameters of various PCB substrates
[0056]
[0057] In the performance tests of Structural Example 1 and Structural Example 2, a heat aging test was conducted at a high temperature of 250° C., and the results showed that the substrate maintained good mechanical strength and electrical properties.
[0058] In the performance tests of Structural Examples 3 and 4, heat aging tests were conducted at a high temperature of 300° C., and the results showed that the substrate maintained good mechanical strength and electrical properties.
[0059] Experiments show that the low-cost high-temperature resistant PCB substrate (HTP--High Temperature PCB) in this application significantly improves the performance of the substrate in a high-temperature environment by selecting suitable high-temperature stable materials, high thermal conductivity fillers and high-strength reinforcing materials. It can meet the needs of high-power and high-density electronic equipment and has broad application prospects.
[0060] Process Example 1
[0061] A low-cost high-temperature resistant PCB substrate manufacturing process, such as Figure 6 , Figure 6 The schematic diagram of the process flow of manufacturing a low-cost high-temperature resistant PCB substrate according to process embodiment 1 of the present invention comprises:
[0062] Step 100, making the substrate layer 41: fully mixing the polyimide resin (PI) and the high thermal conductivity ceramic particles according to the specified mass ratio and stirring evenly, then adding the reinforcing material and fully mixing, and then pressing and heat treating; Step 200, printing the copper foil layer 11: printing the copper foil layer 11 on the first surface or / and the second surface of the substrate layer 41. The high thermal conductivity ceramic particles are aluminum nitride (AIN) ceramic particles, and the reinforcing material is aramid fiber (Kevlar), and the mass ratio is: polyimide resin (PI): aluminum nitride (AIN) ceramic particles = 80:20.
[0063] Process Example 2
[0064] Different from process example 1, in this example, the high thermal conductivity ceramic particles are silicon nitride (Si3N4) ceramic particles, the reinforcing material is carbon fiber, and the mass ratio is: polyimide resin (PI): silicon nitride (Si3N4) ceramic particles = 75:25.
[0065] The high temperature resistant PCB substrate and its manufacturing process of the present invention are implemented, and the thermal conductivity of the substrate is effectively improved by adding high thermal conductivity ceramic particles, which can better dissipate heat. The tensile and bending resistance of the substrate are improved by using high-strength reinforcing materials. Experiments show that the electrical insulation performance and dielectric constant of the substrate can remain stable in a high temperature environment.
[0066] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. Low-cost high-temperature resistant PCB substrate, characterized by comprising: Copper foil layer; substrate layer; The substrate layer is composed of: The polyimide resin and the high thermal conductivity ceramic particles are fully mixed and stirred in accordance with the prescribed mass ratio, and the reinforcing material is added and fully mixed, and then pressed and heat treated. Made of; The copper foil layer is printed on the surface of the substrate layer.
2. The low-cost, high-temperature-resistant PCB substrate according to claim 1, characterized in that: The high thermal conductivity ceramic particles are aluminum nitride ceramic particles, and the reinforcing material is aramid fiber.
3. The low-cost, high-temperature-resistant PCB substrate according to claim 2, characterized in that: The mass ratio is: Polyimide resin: aluminum nitride ceramic particles = 80:
20.
4. The low-cost high-temperature resistant PCB substrate according to claim 3, characterized in that: The copper foil layer is printed on the first surface or the second surface of the substrate layer.
5. The low-cost high-temperature resistant PCB substrate according to claim 3, characterized in that: The number of the copper foil layers is two, and the copper foil layers are printed on the first surface and the second surface of the substrate layer respectively.
6. The low-cost, high-temperature-resistant PCB substrate according to claim 1, characterized in that: The high thermal conductivity ceramic particles are silicon nitride ceramic particles, and the reinforcing material is carbon fiber.
7. The low-cost, high-temperature-resistant PCB substrate according to claim 6, characterized in that: The mass ratio is: Polyimide resin: silicon nitride ceramic particles = 75:
25.
8. A low-cost, high-temperature-resistant PCB substrate manufacturing process, used to manufacture the low-cost, high-temperature-resistant PCB substrate according to any one of claims 1 to 7, characterized in that: include: Step 100, making a substrate layer: fully mixing the polyimide resin and the high thermal conductivity ceramic particles according to a specified mass ratio and stirring them evenly, then adding the reinforcing material and fully mixing them, and then performing compression molding and heat treatment; Step 200, printing a copper foil layer: printing a copper foil layer on the first surface and / or the second surface of the substrate layer.
9. The low-cost high-temperature resistant PCB substrate manufacturing process according to claim 8, characterized in that: The high thermal conductivity ceramic particles are aluminum nitride ceramic particles, the reinforcing material is aramid fiber, and the mass ratio is: polyimide resin: aluminum nitride ceramic particles = 80:
20.
10. The low-cost high-temperature resistant PCB substrate manufacturing process according to claim 8, characterized in that: The high thermal conductivity ceramic particles are silicon nitride ceramic particles, the reinforcing material is carbon fiber, and the mass ratio is: polyimide resin: silicon nitride ceramic particles = 75:25.