Mainboard assembly and head-mounted device

Abstract

The embodiment of the invention provides a mainboard assembly and head-mounted equipment. The mainboard assembly comprises a mainboard; the heightening plate is arranged on the main plate; the flexible circuit board is connected to the side, away from the main board, of the heightening board so that the flexible circuit board and the main board can be arranged in a spaced mode, an installation space used for containing components is formed between the flexible circuit board and the main board, and the flexible circuit board is electrically connected with the main board through the heightening board. The electric connection between the flexible circuit board and the main board is realized by arranging the heightening plate, and the heightening plate is arranged on the main board, and the flexible circuit board is connected to one side, deviating from the main board, of the heightening plate, so that the flexible circuit board and the main board are arranged at an interval; in this way, the space, facing the side where the main board is located, of the flexible circuit board can be fully utilized to install the components, the space utilization rate of the main board is improved, the structure of the head-mounted device is more compact, and the cost of the head-mounted device is reduced. And miniaturization and light and thin design of the head-mounted equipment are facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of augmented reality (AR), and in particular to a mainboard assembly and a head-mounted device. Background Art

[0002] Augmented Reality (AR) and Virtual Reality (VR) technologies can give users a visual experience that is almost the same as the real scene, and are currently hot research areas. In order to enable users to better experience AR and VR technologies, AR and VR are usually displayed using head-mounted devices.

[0003] Current head-mounted devices tend to be lightweight and thin in design, and the legs tend to be narrower and thinner in design. Batteries, motherboards, displays and other components need to be installed in the effective leg space. Among them, the motherboard is usually a rigid circuit board, and the motherboard needs to be connected to other devices through a flexible printed circuit (FPC).

[0004] In the related art, the motherboard and the flexible circuit board are generally electrically connected by a board-to-board connector. However, the board-to-board connector takes up too much layout space of the motherboard, resulting in the head-mounted device requiring a larger installation space to install other components, which is not conducive to the miniaturization and thinness of the head-mounted device. Summary of the invention

[0005] The embodiments of the present application provide a mainboard assembly and a head-mounted device, which are conducive to the miniaturization and lightweight design of the head-mounted device.

[0006] In a first aspect, an embodiment of the present application provides a mainboard assembly, which is applied to a head-mounted device, wherein the head-mounted device includes a wearing body, and the mainboard assembly is used to be arranged on the wearing body, and the mainboard assembly includes:

[0007] Motherboard;

[0008] A heightening plate, disposed on the main board; and

[0009] A flexible circuit board is connected to the side of the elevated plate away from the main board and is spaced apart from the main board. An installation space for accommodating components is formed between the flexible circuit board and the main board. The flexible circuit board is electrically connected to the main board through the elevated plate.

[0010] In a second aspect, an embodiment of the present application also provides a head-mounted device, including.

[0011] The wearing body is provided with a receiving space;

[0012] A mainboard, arranged in the accommodation space;

[0013] A pad plate, arranged on the main board;

[0014] a flexible circuit board connected to a side of the elevated plate away from the main board so as to be spaced apart from the main board, with a mounting space formed between the flexible circuit board and the main board, and the flexible circuit board being electrically connected to the main board through the elevated plate; and

[0015] Components are arranged in the installation space.

[0016] The motherboard assembly and head-mounted device provided in the embodiments of the present application realize electrical connection between the flexible circuit board and the motherboard by setting a raising plate, and by setting the raising plate on the motherboard and connecting the flexible circuit board to the side of the raising plate facing away from the motherboard, so that the flexible circuit board and the motherboard are spaced apart, thereby forming an installation space for accommodating components between the flexible circuit board and the motherboard. In this way, the space on the side of the flexible circuit board facing the motherboard can be fully utilized to install components, thereby improving the space utilization rate of the motherboard, thereby making the structure of the head-mounted device more compact, and more conducive to the miniaturization and lightweight design of the head-mounted device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0018] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0019] Figure 1 A schematic diagram of the first structure of the head mounted device provided in an embodiment of the present application.

[0020] Figure 2 A second structural schematic diagram of the head mounted device provided in an embodiment of the present application.

[0021] Figure 3 A schematic diagram of the structure of the mainboard assembly provided in an embodiment of the present application when installed in the accommodating space.

[0022] Figure 4 A first structural schematic diagram of a motherboard assembly provided in an embodiment of the present application.

[0023] Figure 5 A schematic diagram of the structure of the mainboard provided in an embodiment of the present application.

[0024] Figure 6 A schematic diagram of the structure of the elevated plate provided in an embodiment of the present application.

[0025] Figure 7 It is a structural schematic diagram of a motherboard component in the related art.

[0026] Figure 8 It is a structural diagram of a mainboard in the related art.

[0027] Fig. 9 A second structural schematic diagram of the mainboard assembly provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0029] Reference to "embodiment" or "implementation" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment or implementation may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0030] As technology continues to improve and demand gradually increases, augmented reality (AR) and virtual reality (VR) technologies can give users a visual experience that is almost the same as the real scene, and are currently hot research areas. In order to enable users to better experience AR and VR technologies, AR and VR are usually displayed using head-mounted devices.

[0031] For example, the principle of augmented reality (AR) devices is to superimpose computer-generated images on the user's real vision, so that the virtual image and the real image are seamlessly integrated. In this way, the digital images of the virtual world and the physical objects of the real world are combined to give users a sensory experience beyond reality.

[0032] In head-mounted devices, taking AR glasses as an example, its working principle is to project projection light onto the waveguide lens through a micro-projection optical machine. After the projection light is transmitted in the waveguide lens, it enters the human eye to form a virtual projection picture.

[0033] In the example of AR glasses, the head-mounted device may be configured to pass data to and receive data from an external processing device via a signal connection, which may be a wired connection, a wireless connection, or a combination thereof. In other cases, the head-mounted device may be used as a standalone device, i.e., data processing is performed on the head-mounted device itself. The signal connection may be configured to carry any kind of data, such as image data (e.g., still images and / or full motion video, including 2D and 3D images), audio, multimedia, voice, and / or any other type of data. The external processing device may be, for example, a game console, a personal computer, a tablet computer, a smart phone, or other type of processing device. The signal connection may be, for example, a universal serial bus (USB) connection, a Wi-Fi connection, a Bluetooth or Bluetooth low energy (BLE) connection, an Ethernet connection, a cable connection, a DSL connection, a cellular connection (e.g., 3G, LTE / 4G, or 5G), or the like, or a combination thereof. Additionally, the external processing device may communicate with one or more other external processing devices via a network, which may be or include, for example, a local area network (LAN), a wide area network (WAN), an intranet, a metropolitan area network (MAN), the global Internet, or a combination thereof.

[0034] Understandable, see Figure 1 , Figure 1 A first structural diagram of a head-mounted device provided in an embodiment of the present application. The head-mounted device 100 generally includes a wearing body 20, which can be worn on a human body, such as, can be worn on a human head. The wearing body 20 can be installed with a display component, an optical device, a sensor, a processor, and the like. In the example of AR glasses, the display component is designed to overlay an image on the user's view of his or her real-world environment, for example, by projecting light into the user's eyes. The head-mounted device may also include an ambient light sensor, and may also include an electronic circuit system to control at least some of the above components and perform associated data processing functions. The electronic circuit system may include, for example, one or more processors and one or more memories.

[0035] For example, see Figure 1 and Figure 2 , Figure 2 A second structural schematic diagram of a head-mounted device provided in an embodiment of the present application. The head-mounted device includes a wearing body 20 and two optical waveguide components 10, and the two optical waveguide components 10 are arranged on the wearing body 20. When the wearing body 20 is worn by a user, one optical waveguide component 10 corresponds to the user's left eye, and the other optical waveguide component 10 corresponds to the user's right eye. Among them, the optical waveguide component 10 includes a waveguide lens 11 and a projection optical machine 12. The projection optical machine 12 is used to project image light onto the waveguide lens 11. After the image light is transmitted in the waveguide lens 11, it is incident on the human eye to form a virtual projection picture.

[0036] It can be understood that the projection optical machine 12 provides light to the waveguide lens 11, and the light includes information and / or images for enhancing the user's observation of the material world. The light from the projection optical machine 12 can be coupled into the waveguide lens 11, and the light undergoes total internal reflection in the waveguide lens 11, and then the light is coupled out of the waveguide lens 11, so that the light can be seen by the user. Among them, the projection optical machine 12 can be a self-luminous active device, such as a micro display, and the projection optical machine 12 can use a planar image source, including but not limited to an image source of an integrated light source or a single image source. For example, electronic devices based on display principles such as OLED (Organic Light-Emitting Diode), LCOS (Liquid Crystal On Silicon), LCD (Liquid Crystal Display), MEMS (Micro Electrome Chanical Systems), DMD (Digital Micro-mirror Device), etc. Among them, OLED and LCD are image sources of integrated light sources, and LCOS, MEMS and DMD are single image sources. It should be noted that a single image source also requires an additional light source as an auxiliary light source for the single image source. The requirements for the projection optical machine 12 are that it needs to provide sufficiently strong light and be small enough to occupy as little volume as possible in the head-mounted device 100. However, various projection optical machines 12 now have their own advantages and disadvantages, and a specific light source needs to be selected through a specific solution.

[0037] It can also be understood that in the head-mounted device 100, the waveguide lens 11 in one optical waveguide component 10 corresponds to the left eye, and the waveguide lens 11 in the other optical waveguide component 10 corresponds to the right eye, so that both the left and right eyes can see the image.

[0038] Taking the head-mounted device 100 as AR glasses as an example, the wearing body 20 may include two temples 21 and a frame 22, the two temples 21 are respectively connected to the opposite ends of the frame 22, the frame 22 includes two mounting holes, the waveguide lens 11 in one optical waveguide component 10 is installed in one mounting hole, and the waveguide lens 11 in the other optical waveguide component 10 is installed in the other mounting hole.

[0039] The waveguide lens 11 includes a light coupling-in end 111 and a light coupling-out end 112 which are arranged opposite to each other. The light coupling-in end 111 is used to receive the image light from the projection optical machine 12 , and the light coupling-out end 112 is used to emit the image light to the human eye.

[0040] Exemplarily, a coupling-in grating is provided at the light coupling-in end 111 of the waveguide lens 11, and a coupling-out grating is provided at the light coupling-out end 112 of the waveguide lens 11. A turning grating may also be provided on the waveguide lens 11, and the turning grating is located between the coupling-in grating and the coupling-out grating. The coupling-in grating is used to receive image light from the projection optical machine 12, the turning grating is used to receive light from the coupling-in grating and transmit the light to expand the pupil, and the coupling-out grating is used to receive light from the coupling-in grating and the turning grating, and couple the light out to the human eye for imaging. The coupling-in grating can diffract the incident light into different angles for transmission in the waveguide lens 11, with the purpose of introducing the light of the projection optical machine 12 into the waveguide lens 11 with maximum efficiency. The period of the coupling-in grating is designed to diffract the light and meet the total reflection condition to transmit the image light into the waveguide lens 11. The turning grating can transmit the light in the waveguide lens 11 in one or two dimensions, with the purpose of transmitting the internal light along a specific direction, and its function is to expand the pupil of the light image information of the projection optical machine 12. The coupling-out grating can receive the light transmitted by the turning grating, further expand the pupil and couple it out, with the purpose of coupling the information of the projection optical machine 12 out to the human eye evenly and efficiently.

[0041] In order to better adapt to the facial structure of the human body, in the embodiment of the present application, the waveguide lens 11 is tilted from the light coupling end 112 toward the light coupling end 111 and toward the direction close to the human eye. Figure 2 As shown, an obtuse angle less than 180 degrees is formed between the two waveguide lenses 11. It can be understood that the angle of the frame 22 is also adapted to the setting angle of the waveguide lenses 11. In this way, the wearing comfort of the head mounted device 100 can be improved, and the appearance of the head mounted device 100 can also be made more beautiful.

[0042] The inclination angle of the waveguide lens 11 may be greater than 0 degrees and less than or equal to 30 degrees. For example, the inclination angle of the waveguide lens 11 may be 10 degrees, 15 degrees, 20 degrees, 25 degrees or 30 degrees.

[0043] Please note that Figure 1 and Figure 2 In the head mounted device 100, it is usually necessary to control various functional devices 40 in the head mounted device 100 through the mainboard assembly 30, for example, the functional device 40 may be at least one of the projection optical machine 12, a sensor, a restarter, a fan, a microphone, and a speaker. It can be understood that the mainboard assembly 30 and the functional device 40 are both disposed on the wearing body 20 of the head mounted device.

[0044] For example, see Figure 3 and Figure 4 Combined with Figure 1 and Figure 2 , Figure 3This is a schematic diagram of the structure of the motherboard assembly provided in the embodiment of the present application when it is installed in the accommodation space. Figure 4 The first structural diagram of the mainboard assembly provided in the embodiment of the present application is as follows: The wearing body 20 is provided with a receiving space 211 , such as the temple 21 of the wearing body 20 is provided with a receiving space 211 , and the mainboard assembly 30 is provided in the receiving space 211 .

[0045] Among them, the mainboard assembly 30 may include a mainboard 31, and the mainboard 31 may be, for example, a main control board to realize the control function. It should be noted that the mainboard 31 is usually a rigid circuit board. Since the head-mounted device 100, such as AR glasses, has a foldable feature, a flexible circuit board is required. It can be understood that the mainboard assembly 30 may also include a flexible circuit board 32, wherein the mainboard 31 is electrically connected to the flexible circuit board 32, and is electrically connected to the functional device 40 through the flexible circuit board 32, such as the mainboard 31 is electrically connected to at least one of the projection light machine 12, the sensor, the restarter, the fan, the microphone, and the speaker through the flexible circuit board 32. Of course, it can also be understood that the functional device 40 is not limited to the projection light machine 12, the sensor, the restarter, the fan, the microphone, and the speaker, and it can also be other devices related to the head-mounted device 100 that can realize the corresponding functions.

[0046] It should be noted that since the mainboard and the flexible circuit board need to be electrically connected, in the related art, the mainboard and the flexible circuit board are generally electrically connected using a board-to-board connector (BTB connector). The BTB connector is divided into two components, a male head and a female socket. The mainboard and the flexible circuit board are each connected to one component. After the BTB connector is fastened, the conductive pins of the male head and the female socket are in contact, connecting the circuits of the mainboard and the flexible circuit board. However, the setting of the BTB connector occupies too much layout space of the mainboard, resulting in part of the mainboard space not being reasonably utilized, which in turn results in the head-mounted device requiring a larger installation space to install other components, which is not conducive to the miniaturization and thinness of the head-mounted device.

[0047] Based on this, please continue to refer to Figure 3 and Figure 4 The motherboard assembly 30 provided in the embodiment of the present application further includes a padding plate 33, which replaces the board-to-board connector in the related art, wherein the padding plate 33 is disposed on the motherboard 31 and electrically connected to the motherboard 31, and the flexible circuit board 32 is connected to the side of the padding plate 33 away from the motherboard 31 and is spaced apart from the motherboard 31, and an installation space 60 for accommodating components 50 is formed between the flexible circuit board 32 and the motherboard 31. The components 50 may be at least one of a capacitor, a resistor, and a chip.

[0048] It can be understood that the flexible circuit board 32 is electrically connected to the elevated board 33 , and thus, the flexible circuit board 32 is electrically connected to the main board 31 through the elevated board 33 .

[0049] In the motherboard assembly 30 and the head-mounted device 100 provided in the embodiment of the present application, an electrical connection between the flexible circuit board 32 and the motherboard 31 is achieved by setting a heightening plate 33, and by setting the heightening plate 33 on the motherboard 31, the flexible circuit board 32 is connected to the side of the heightening plate 33 facing away from the motherboard 31, so that the flexible circuit board 32 and the motherboard 31 are spaced apart, thereby allowing an installation space 60 for accommodating components 50 to be formed between the flexible circuit board 32 and the motherboard 31. In this way, the space on the side of the flexible circuit board 32 facing the motherboard 31 can be fully utilized to install the components 50, thereby improving the space utilization rate of the motherboard 31, thereby making the structure of the head-mounted device more compact, and more conducive to the miniaturization and lightweight design of the head-mounted device 100.

[0050] See also Figure 5 Combined with Figure 4 , Figure 5 A schematic diagram of the structure of the motherboard provided in an embodiment of the present application. The motherboard 31 includes a first electrical connection area 311 and a second electrical connection area 312, and the projection of the flexible circuit board 32 on the motherboard 31 at least covers the first electrical connection area 311 and the second electrical connection area 312. The first electrical connection area 311 is electrically connected to the padding plate 33, and the second electrical connection area 312 is used to electrically connect to the components 50, such as at least one of a capacitor, a resistor and a chip can be electrically connected to the second electrical connection area 312 of the motherboard 31. It can be understood that when the flexible circuit board 32 is electrically connected to the motherboard 31 through the padding plate 33, due to the padding effect of the padding plate 33, the position below the flexible circuit board 32 corresponding to the second electrical connection area 312 of the motherboard 31 can better accommodate the components 50, and can make full use of the space on the side of the flexible circuit board 32 facing the motherboard 31 to install the components 50, thereby improving the space utilization of the motherboard 31, thereby making the structure of the head-mounted device more compact, and more conducive to the miniaturization and thinness design of the head-mounted device 100.

[0051] It is understandable that in order to allow the position below the flexible circuit board 32 corresponding to the second electrical connection area 312 of the mainboard 31 to better accommodate the components 50, the height of the padding plate 33 is at least equal to the height of the components 50. It is also understandable that when the heights of the components 50 are not uniform, such as the heights of capacitors, resistors and chips, the height of the padding plate 33 is at least equal to the height of the tallest component 50 among the capacitors, resistors and chips.

[0052] It is also understandable that the specific height of the padding plate 33 can be selected according to actual conditions. For example, when the mainboard assembly 30 is installed in the receiving space 211 of the wearing body 20, the specific height of the padding plate 33 can be set according to the size of the receiving space 211.

[0053] For example, see Figure 3 The wearing body 20 includes a first wall 23 and a second wall 24 that are arranged opposite to each other, that is, the first wall 23 and the second wall 24 form a part of the accommodating space 211, and the mainboard assembly 30 is arranged between the first wall 23 and the second wall 24. Among them, the mainboard 31 is arranged on the first wall 23, the padding plate 33 is arranged on the side of the mainboard 31 away from the first wall 23, the flexible circuit board 32 is arranged on the side of the padding plate 33 away from the mainboard 31, and the second wall 24 is located on the side of the flexible circuit board 32 away from the padding plate 33. At this time, the height D3 of the padding plate 33 can be set to be equal to or slightly less than the distance L1 between the first wall 23 and the second wall 24 minus the thickness D1 of the mainboard 31 and the thickness D2 of the flexible circuit board 32. In this way, the space of the wearing body 20 can be fully utilized to make the interval between the flexible circuit board 32 and the main board 31 as large as possible to accommodate higher components 50, so that the installation space 60 formed between the flexible circuit board 32 and the main board 31 can accommodate more components 50 of different types and heights, further improving the space utilization of the main board 31, thereby making the structure of the head-mounted device more compact, which is more conducive to the miniaturization and lightweight design of the head-mounted device 100.

[0054] Among them, see Figure 6 Combined with Figure 4 , Figure 6 A schematic diagram of the structure of the elevating plate provided in an embodiment of the present application. In order to facilitate the electrical connection between the elevating plate 33 and the main board 31 and the flexible circuit board 32, the elevating plate 33 may include a first connection surface 331 and a second connection surface 332 arranged opposite to each other, the first connection surface 331 facing the side where the main board 31 is located, the first connection surface 331 is provided with a first solder pad 333, and the first solder pad 333 is electrically connected to the main board 31. The second connection surface 332 faces the side where the flexible circuit board 32 is located, the second connection surface 332 is provided with a second solder pad 334 electrically connected to the first solder pad 333, and the second solder pad 334 is electrically connected to the flexible circuit board 32. It can be understood that by providing the first solder pad 333 on the first connection surface 331 of the elevating plate 33 and the second solder pad 334 on the second connection surface 332 of the elevating plate 33, an electrical connection can be achieved, so that the electrical connection between the main board 31 and the flexible circuit board 32 can be realized through the elevating plate 33.

[0055] Exemplarily, the pad 33 is provided with a via 335, the via 335 is connected to the first connection surface 331 and the second connection surface 332, and the first pad 333 and the second pad 334 are electrically connected through the via 335. It can be understood that the via 335 is provided with a conductive metal layer, and the conductive metal layer is electrically connected to the first pad 333 and the second pad 334, so that the electrical connection between the first pad 333 and the second pad 334 can be achieved through the conductive metal layer in the via 335. Among them, the pad 33 can be made of phenolic resin, glass fiber or epoxy resin.

[0056] It should be noted that in the related art, the mainboard and the flexible circuit board are generally electrically connected using a board-to-board connector (BTB connector). Since the board-to-board connector has corresponding specifications and dimensions, that is, the specifications and dimensions of the board-to-board connector are relatively fixed, and in order to facilitate the plugging and unplugging of the board-to-board connector, a corresponding operating space needs to be reserved around the board-to-board connector. In addition, in order to avoid knocking off the surrounding components when the board-to-board connector is plugged in and out, a certain safety distance needs to be reserved for the board-to-board connector. Therefore, the use of board-to-board connectors in related technologies will occupy a large layout space of the mainboard, which is not conducive to the miniaturization and thinness of the head-mounted device.

[0057] In the present application, a pair of first pads 333 and second pads 334 can realize a signal connection, so the number of pads on the padding plate 33 can be designed according to the number of signals actually required, such as, when the number of signals is three, the first pads 333 can be set to three, and the corresponding second pads 334 can also be set to three. Since the number of pads determines the area size of the first connection surface 331 and the area size of the second connection surface 332 of the padding plate 33, that is, the projection area of ​​the padding plate 33 on the main board 31 is related to the number of pads, the padding plate 33 can be set to the smallest size according to the number of signals, such as the area occupied by the padding plate 33 can be set to about 1.6 square millimeters, 2.0 square millimeters, 2.5 square millimeters, 3 square millimeters or 4 square millimeters, so as to avoid the padding plate 33 occupying too much area of ​​the main board 31, so as to free up a larger installation area on the main board 31 to install more components 50. In addition, a height-adjusting plate 33 of appropriate height can be designed according to the size of the accommodation space 211 in the wearing body 20, so that the height dimension of the space on the side where the flexible circuit board 32 faces the main board 31 can be made as large as possible, so that the space on the side where the flexible circuit board 32 faces the main board 31 can be fully utilized to install the components 50, thereby improving the space utilization rate of the main board 31, thereby making the structure of the head-mounted device more compact, and more conducive to the miniaturization and thinness design of the head-mounted device 100. In this way, the present application can use a height-adjusting plate 33 with a small occupation area and a height suitable for the height of the accommodation space 211 of the wearing body 20 to increase the space utilization rate of the space on the side where the flexible circuit board 32 faces the main board 31.

[0058] It should also be noted that from the perspective of flexible circuit boards, please refer to Figure 7 , Figure 7 Schematic diagram of the structure of the motherboard assembly in the related art. Because the flexible circuit board 32a is relatively soft, in the related art, in order to allow the board-to-board connector 33a to be welded on the flexible circuit board 32a, a reinforcing plate 34a needs to be provided on the back of the board-to-board connector 33a, that is, a reinforcing plate 34a needs to be provided on the side of the flexible circuit board 32a away from the motherboard 31a to improve the hardness and flatness of the flexible circuit board 32a here.

[0059] from Figure 7It can be seen that due to the existence of the reinforcing plate 34a, the first space 35a between the second wall 24a and the flexible circuit board 32a is occupied, and this part of the space cannot be used. In addition, since the reinforcing plate 34a occupies the first space 35a between the second wall 24a and the flexible circuit board 32a, and the distance between the first wall 23a and the second wall 24a cannot be made too large due to the miniaturized design of the head-mounted device, the second space 36a between the flexible circuit board 32a and the main board 31a cannot be made larger, so that the conditions for installing components cannot be met, such as the conditions for installing capacitors, resistors and chips. In this way, the head-mounted device requires a larger installation space to install other components, which is not conducive to the miniaturization and thinness design of the head-mounted device 100.

[0060] And the pins of the board-to-board connector 33a on the flexible circuit board 32a need to be pulled out to connect other electrical signals. The board-to-board connector 33a on the flexible circuit board 32a and the reinforcing plate 34a on the back of the flexible circuit board 32a are both hard, while the flexible circuit board 32a is soft. In order to avoid the board-to-board connector 33a on the flexible circuit board 32a from breaking the wiring due to excessive stress at the junction of the soft and hard parts at the pin outlet, it is usually necessary to increase the area of ​​the reinforcing plate 34a on the back of the board-to-board connector 33a to reduce stress and ensure the reliability of the wiring. However, the increase in the area size of the reinforcing plate 34a occupies a larger area of ​​the first space 35a, thereby increasing the area of ​​the second space 36a between the flexible circuit board 32a and the main board 31a that cannot be used, thereby further reducing the space utilization rate of the main board 31a. Therefore, the board-to-board connector 33a occupies a large layout space of the main board 31a. It is necessary to consider not only the size of the board-to-board connector 33a, but also the size of the reinforcing plate 34a on the back of the flexible circuit board 32a. Figure 8 As shown, Figure 8 The dotted box A represents the area of ​​the main board 31a that is occupied and cannot be used, which is much larger than the area occupied by the board-to-board connector 33a, which is not conducive to the miniaturization and thinness of the glasses.

[0061] In the present application, since the electrical connection between the main board 31 and the flexible circuit board 32 is realized by the raising plate 33, and the reinforcing plate 34a is not required to be arranged on the back side of the flexible circuit board 32 by setting the raising plate 33, and the raising plate 33 is set on the main board 31, and the flexible circuit board 32 is connected to the side of the raising plate 33 away from the main board 31, so that the flexible circuit board 32 and the main board 31 are spaced apart, so that an installation space 60 for accommodating components 50 can be formed between the flexible circuit board 32 and the main board 31, that is, except for the area occupied by the raising plate 33 itself, the other area of ​​the main board 31 can be fully utilized. In this way, the space on the side of the flexible circuit board 32 facing the main board 31 can be fully utilized to install components 50, thereby improving the space utilization rate of the main board 31, thereby making the structure of the head-mounted device more compact, which is more conducive to the miniaturized design of the head-mounted device 100.

[0062] It should also be noted that the reinforcement plate itself has a high density and a large mass. Since the present application does not need to set a reinforcement plate on the back of the flexible circuit board 32, the overall weight of the head-mounted device 100 is also reduced, which is conducive to the lightweight design of the head-mounted device 100.

[0063] Among them, the elevation plate 33 can be electrically connected to the main board 31 through a patch process, such as electrically connecting the elevation plate 33 to the first electrical connection area 311 of the main board 31 through a patch process. Exemplarily, the elevation plate 33 can be patched to the first electrical connection area 311 of the main board 31 by a patch machine. When installing the elevation plate 33, the patch machine absorbs the elevation plate 33 in the same way as the components 50, and places it at the corresponding position of the main board 31 for welding. Because the elevation plate 33 is a machine patch, the distance of the surrounding components to avoid the elevation plate 33 can be reduced, and this distance depends on the accuracy of the machine patch. It can be seen that compared with the manual plug-in and unplug of the board-to-board connector, the avoidance space required when installing the elevation plate 33 through the patch process can be greatly reduced, thereby improving the space utilization of the main board 31.

[0064] Among them, the flexible circuit board 32 can be connected to the elevated plate 33 by a hot pressing welding process. That is, the flexible circuit board 32 can be welded to the second connection surface 332 of the elevated plate 33 by a hot pressing welding process. It can be understood that hot pressing welding is to use heating and pressure to press the metal wire and the metal welding area together. The principle is to use heating and pressure to make the metal in the welding area plastically deform, and at the same time destroy the oxide layer on the pressure welding interface, so that the atomic gravitational range is reached between the pressure-welded metal wire and the metal contact surface, thereby generating attraction between atoms and achieving the purpose of bonding. In the present application, by adopting a hot pressing welding process, the flexible circuit board 32 does not need to be provided with a reinforcement plate when connecting to the elevated plate 33, and the flexible circuit board 32 can be firmly electrically connected to the second connection surface 332 of the elevated plate 33, thereby avoiding the reinforcement plate occupying the accommodating space 211 of the wearing body 20.

[0065] In some embodiments, the flexible circuit board 32 can also be used to connect the two signal terminals on the main board 31. Fig. 9 , Fig. 9 A second structural schematic diagram of a motherboard assembly provided in an embodiment of the present application. The elevated plate may include a first elevated plate 336 and a second elevated plate 337, the motherboard 31 includes a first signal terminal and a second signal terminal, one end of the flexible circuit board 32 is electrically connected to the first signal terminal through the first elevated plate 336, and the other end of the flexible circuit board 32 is electrically connected to the second signal terminal through the second elevated plate 337.

[0066] It can be understood that the first signal terminal and the second signal terminal can be used to transmit electrical signals or control signals. For example, when the two signal terminals on the main board 31 need to be connected to each other, if the wiring space on the main board 31 is insufficient, one end of the flexible circuit board 32 can be electrically connected to the first signal terminal through the first padding plate 336, and the other end of the flexible circuit board 32 can be electrically connected to the second signal terminal through the second padding plate 337, that is, the first signal terminal and the second signal terminal can be connected by an external flexible circuit board 32. At this time, other required components 50, such as capacitors, resistors or chips, can be installed in the area below the flexible circuit board 32 corresponding to the main board 31.

[0067] Of course, it is understandable that the number is not limited to two signal terminals and two elevated boards, and the number of elevated boards and flexible circuit boards can be adaptively increased according to actual needs.

[0068] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above drawings are used to distinguish different objects rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0069] The mainboard assembly and the head-mounted device provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A motherboard assembly, characterized in that: Applied to a head mounted device, the head mounted device comprises a wearing body, the mainboard assembly is used to be arranged on the wearing body, and the mainboard assembly comprises: Motherboard; A heightening plate, disposed on the main board; and A flexible circuit board is connected to the side of the elevated plate away from the main board and is spaced apart from the main board. An installation space for accommodating components is formed between the flexible circuit board and the main board. The flexible circuit board is electrically connected to the main board through the elevated plate.

2. The motherboard assembly according to claim 1, characterized in that: The main board comprises: A first electrical connection region electrically connected to the elevated plate; and A second electrical connection region, used for electrically connecting to the component; Wherein, the projection of the flexible circuit board on the main board at least covers the first electrical connection area and the second electrical connection area.

3. The motherboard assembly according to claim 1, characterized in that: The raised plate comprises: A first connection surface, the first connection surface facing the side where the main board is located, the first connection surface being provided with a first soldering pad, the first soldering pad being electrically connected to the main board; and A second connection surface, the second connection surface faces the side where the flexible circuit board is located, the second connection surface is provided with a second solder pad electrically connected to the first solder pad, and the second solder pad is electrically connected to the flexible circuit board.

4. The motherboard assembly according to claim 3, characterized in that: The padding plate is provided with a via hole, the via hole connects the first connection surface and the second connection surface, and the first pad and the second pad are electrically connected through the via hole.

5. The motherboard assembly according to any one of claims 1 to 4, characterized in that: The padding plate is electrically connected to the main board through a patch process.

6. The motherboard assembly according to any one of claims 1 to 4, characterized in that: The height of the raising plate is at least equal to the height of the component.

7. The motherboard assembly according to any one of claims 1 to 4, characterized in that: The flexible circuit board is connected to the elevated plate through a thermal compression welding process.

8. A head mounted device, characterized in that: include: The wearing body is provided with a receiving space; A mainboard, arranged in the accommodation space; A pad plate, arranged on the main board; A flexible circuit board is connected to a side of the elevated plate away from the main board, so as to be spaced apart from the main board, and a mounting space is formed between the flexible circuit board and the main board. The flexible circuit board is electrically connected to the main board through the elevated plate; and Components are arranged in the installation space.

9. The head mounted device according to claim 8, wherein: The components include at least one of a capacitor, a resistor and a chip.

10. The head mounted device according to claim 8, wherein: The height of the raising plate is at least equal to the height of the component.

11. The head mounted device according to claim 10, wherein: The wearing body includes a first wall and a second wall arranged opposite to each other, the main board is arranged on the first wall, and the raising plate is arranged on the side of the main board away from the first wall, and the height of the raising plate is equal to the distance between the first wall and the second wall minus the thickness of the main board and the thickness of the flexible circuit board.

12. The head mounted device according to claim 8, wherein: The head mounted device further comprises a functional device, and the flexible circuit board is electrically connected to the functional device.

13. The head mounted device according to claim 12, wherein: The functional device includes at least one of a projection light engine, a sensor, a restarter, a fan, a microphone and a speaker.

14. The head mounted device according to claim 8, wherein: The raised plate includes a first raised plate and a second raised plate, the main board includes a first signal end and a second signal end, one end of the flexible circuit board is electrically connected to the first signal end through the first raised plate, and the other end of the flexible circuit board is electrically connected to the second signal end through the second raised plate.

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