Packaging product and electronic equipment

Abstract

The invention discloses a packaging product and electronic equipment, and relates to the technical field of packaging product heat dissipation, the packaging product comprises a substrate, a heating element, a heat dissipation piece, a first insulation heat conduction piece and a plastic packaging layer, the heating element is installed on the substrate, the first insulation heat conduction piece is connected with the heating element and the heat dissipation piece, and the first insulation heat conduction piece is installed on the substrate. The plastic package layer wraps the first insulation heat conduction piece, the heat dissipation piece and the heating element, and the heat dissipation piece is partially exposed out of the plastic package layer. When the packaging product runs, the heating assembly emits heat, the heat emitted by the heating assembly is transmitted to the first insulating heat conduction part, then the first insulating heat conduction part transmits the heat to the heat dissipation part, and the heat dissipation part is exposed to the plastic packaging layer, so that the heat dissipation part is in contact with the outside and transmits the heat to the outside for heat dissipation; in this way, heat dissipation of the packaged product is completed. The structural arrangement of the packaging product can improve the heat dissipation efficiency of the packaging product.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of packaged products, and in particular to a packaged product and electronic equipment. Background Art

[0002] Currently available high-power packaging products generally require a larger spacing between the various components in the packaging products in order to dissipate heat, so that each component can dissipate heat sufficiently; however, with the miniaturization of various electronic devices, the packaging products also need to reduce the structural size, which will result in a reduction in the spacing between the various components in the packaging products, resulting in poor heat dissipation.

[0003] In view of this, it is necessary to provide a new packaging product and electronic device to solve or at least alleviate the above technical defects. Summary of the invention

[0004] The main purpose of the present invention is to provide a packaging product and an electronic device, aiming to solve the technical problem of poor heat dissipation of packaging products in the prior art.

[0005] To achieve the above object, according to one aspect of the invention, the present invention provides a packaging product, comprising:

[0006] substrate;

[0007] A heating element is mounted on the substrate;

[0008] Heat sink;

[0009] a first insulating heat-conducting member, wherein the first insulating heat-conducting member is respectively connected to the heating element and the heat dissipating member;

[0010] A plastic encapsulation layer, wherein the plastic encapsulation layer encapsulates the first insulating heat-conducting member, the heat dissipating member and the heating element, and the heat dissipating member is partially exposed to the plastic encapsulation layer.

[0011] In one embodiment, a side of the heat dissipation element away from the first insulating heat conductive element is exposed to the plastic packaging layer.

[0012] In one embodiment, the packaged product further includes an inductor, which is mounted on the substrate and located outside the plastic packaging layer.

[0013] In one embodiment, the plastic packaging layer between the heating element and the heat sink is formed with a first connecting hole.

[0014] In one embodiment, the packaged product also includes a second insulating heat conductive component and a capacitor assembly, the second insulating heat conductive component is respectively connected to the capacitor assembly and the heat sink, the plastic encapsulation layer cooperates with the substrate to form a placement cavity, the capacitor assembly is arranged in the placement cavity, and the capacitor assembly is connected to the substrate.

[0015] In one embodiment, the capacitor assembly includes a first capacitor and a second capacitor, the placement cavity includes a first cavity and a second cavity separated from each other, the first capacitor is arranged in the first cavity, the second capacitor is arranged in the second cavity, the second insulating thermal conductive member includes a first insulating thermal conductive block and a second insulating thermal conductive block, the first insulating thermal conductive block is respectively connected to the first capacitor and the heat sink, and the second insulating thermal conductive block is respectively connected to the second capacitor and the heat sink.

[0016] In one embodiment, the number of the placement cavities, the capacitor components and the second insulating thermal conductive parts are all multiple, the multiple placement cavities are arranged at intervals, the number of the multiple placement cavities, the multiple capacitor components and the multiple second insulating thermal conductive parts are equal and are arranged one by one.

[0017] In one embodiment, the plastic packaging layer is formed with a second communicating hole interconnected with the placement cavity.

[0018] In one embodiment, the first insulating heat-conducting member and the second insulating heat-conducting member are both made of silicone thermally conductive adhesive.

[0019] In one embodiment, the packaged product includes a power module, the heating element is a power supply, and the heat sink is a heat dissipation copper block.

[0020] According to another aspect of the invention, the present invention further provides an electronic device, wherein the electronic device comprises the packaged product described above.

[0021] In the above scheme, the packaged product includes a substrate, a heating element, a heat sink, a first insulating thermal conductive member and a plastic sealing layer. The heating element is installed on the substrate. The first insulating thermal conductive member is connected to the heating element and the heat sink respectively. The plastic sealing layer wraps the first insulating thermal conductive member, the heat sink and the heating element, and the heat sink is partially exposed to the plastic sealing layer. Specifically, the two sides of the first insulating thermal conductive member are connected to the heating element and the heat sink respectively. The first insulating thermal conductive member connects the heating element and the heat sink. This can prevent the heating element from directly contacting the heat sink and causing a short circuit, while not affecting the efficiency of heat transfer between the heating element and the heat sink. The heating element is then connected to the substrate and then packaged and plastic sealed. The plastic sealing material is injected into the mold so that the plastic sealing material covers the first insulating thermal conductive member, the heat sink and the heating element. The plastic sealing material is then hardened to form a plastic sealing layer. In this way, the plastic sealing layer can increase the mechanical properties of the entire packaged product, while increasing reliability, and protect the first insulating thermal conductive member, the heat sink and the heating element in the plastic sealing layer. After the plastic sealing is completed, the plastic sealing layer is ground to expose the heat sink. In this way, the assembly of the entire packaged product is completed; when the packaged product is running, the heating component will emit heat, and the heat emitted by the heating component will be transferred to the first insulating heat-conducting component, and then the first insulating heat-conducting component will transfer the heat to the heat sink. Since the heat sink is exposed to the plastic sealing layer, the heat sink will be in contact with the outside world, and the heat sink will transfer the heat to the outside world for heat dissipation, thus completing the heat dissipation of the packaged product; the present invention sets a heat sink and exposes the heat sink to the outside world by grinding, so that the heat dissipated by the heating component can be conducted to the heat sink, thereby reducing the heat of the heating component, and then the outside air cools the heat sink, and the heat sink can continue to absorb the heat of the heating component. Such a structure improves the heat dissipation efficiency of the packaged product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0023] Figure 1 A schematic diagram of the internal structure of a packaging product according to an embodiment of the present invention from one perspective;

[0024] Figure 2 A schematic diagram of the internal structure of a packaging product according to an embodiment of the present invention from another perspective;

[0025] Figure 3 This is a schematic diagram of the internal structure of a packaging product according to another embodiment of the present invention.

[0026] Description of labels:

[0027] 100. Packaged product; 1. Substrate; 11. Placement cavity; 111. First cavity; 112. Second cavity; 2. Heat-generating element; 3. Heat sink; 4. First insulating thermally conductive member; 5. Plastic layer; 51. First connecting hole; 52. Second connecting hole; 6. Inductor; 7. Second insulating thermally conductive member; 71. First insulating thermally conductive block; 72. Second insulating thermally conductive block; 8. Capacitor assembly; 81. First capacitor; 82. Second capacitor.

[0028] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, in the present invention, the descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0032] Furthermore, the technical solutions between the various embodiments of the present invention may be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in the field. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0033] Packaged products generally refer to the process of integrating electronic components or integrated circuits into a protective housing to provide physical support, protection, heat dissipation and other functions, and enable the components to be electrically connected to other circuits or systems. There are many types of packaged products, ranging from simple dual in-line packages to complex system-level packages to the latest three-dimensional packaging technology.

[0034] Currently available high-power packaging products generally require a larger spacing between the various components in the packaging products in order to dissipate heat, so that each component can dissipate heat sufficiently; however, with the miniaturization of various electronic devices, the packaging products also need to reduce the structural size, which will result in a reduction in the spacing between the various components in the packaging products, resulting in poor heat dissipation. In order to ensure the heat dissipation of the heating elements in the packaged products of small electronic devices, the applicant tried to add a heat sink for heat dissipation. The heat sink is usually made of materials with good thermal conductivity such as aluminum or copper. However, when using the packaged products with such a structure, the applicant still found that whether the heat sink is set inside the packaging layer or attached to the outer surface of the packaging layer, the heat dissipation effect is very small. After many experiments and studies, it was found that if the heat sink is set inside the packaging layer, although the heat of the heating element can be transferred to the heat sink, the heat sink cannot be cooled in the packaging layer, which results in very little heat dissipation effect; if the heat sink is set on the outer surface of the packaging layer, since the general packaging layer cannot conduct heat, the heat emitted by the internal heating element cannot be transferred to the packaging layer, which results in very little heat dissipation effect. Although the heat dissipation effect can be improved by changing the packaging layer to a material with thermal conductivity, this will increase the production cost of the packaged product; through research, the applicant designed a packaging product structure that improves the heat dissipation efficiency without changing the material of the packaging layer.

[0035] According to one aspect of the invention, see Figure 1 and Figure 2The present invention provides a packaging product 100, including a substrate 1, a heating element 2, a heat sink 3, a first insulating heat conductive component 4 and a plastic sealing layer 5, the heating element 2 is mounted on the substrate 1, the first insulating heat conductive component 4 is respectively connected to the heating element 2 and the heat sink 3, the plastic sealing layer 5 wraps the first insulating heat conductive component 4, the heat sink 3 and the heating element 2, and the heat sink 3 is partially exposed to the plastic sealing layer 5. Specifically, the two sides of the first insulating heat-conducting member 4 are connected to the heating element 2 and the heat sink 3 respectively, and the first insulating heat-conducting member 4 connects the heating element 2 and the heat sink 3, so that the heating element 2 can be prevented from directly contacting the heat sink 3 to cause a short circuit, and at the same time, the efficiency of heat transfer between the heating element 2 and the heat sink 3 is not affected, and then the heating element 2 is connected to the substrate 1, and then the encapsulation is performed, and the encapsulation material is injected into the mold so that the encapsulation material covers the first insulating heat-conducting member 4, the heat sink 3 and the heating element 2, and then the encapsulation material is hardened to form a encapsulation layer 5, so that the encapsulation layer 5 can increase the mechanical properties of the entire packaged product 100, while increasing the reliability, and protecting the first insulating heat-conducting member 4, the heat sink 3 and the heating element 2 in the encapsulation layer 5, after the encapsulation is completed, the encapsulation layer 5 is ground to expose the heat sink 3, In this way, the assembly of the entire packaging product 100 is completed; when the packaging product 100 is running, the heating component will emit heat, and the heat emitted by the heating component will be transferred to the first insulating heat-conducting component 4, and then the first insulating heat-conducting component 4 will transfer the heat to the heat sink 3. Since the heat sink 3 is exposed to the plastic sealing layer 5, the heat sink 3 will be in contact with the outside world, and the heat sink 3 will transfer the heat to the outside world for heat dissipation, thus completing the heat dissipation of the packaging product 100; in this embodiment, the heat sink 3 is provided and the heat sink 3 is exposed to the outside world by grinding, so that the heat dissipated by the heating component can be conducted to the heat sink 3, thereby reducing the heat of the heating component, and then the outside air cools the heat sink 3, and the heat sink 3 can continue to absorb the heat of the heating component. Such a structure improves the heat dissipation efficiency of the packaging product 100.

[0036] In one embodiment, the side of the heat sink 3 away from the first insulating heat conductive member 4 is exposed to the plastic sealing layer 5. Exposing the top of the heat sink 3 to the outside world has a better cooling effect on the heat sink 3 than exposing other positions of the heat sink 3 to the outside world. The reason is that generally speaking, the heat sink 3 is set as a rectangular body, and the height of the heat sink 3 is less than the length of the heat sink 3. In this way, when the top of the heat sink 3 is exposed to the outside world, the heat dissipation area of ​​the heat sink 3 is the product of the length and width of the heat sink 3. In this way, the heat dissipation area of ​​the heat sink 3 is the largest, and the cooling effect of the heat sink 3 is the best. Therefore, such a setting can further improve the heat dissipation efficiency of the packaged product 100.

[0037] See also Figure 1 and Figure 2In one embodiment, the packaged product 100 further includes an inductor 6, which is mounted on the substrate 1 and is located outside the plastic layer 5. The inductor 6 can store energy. When the packaged product 100 is in use, the inductor 6 will store energy; when the packaged product 100 is turned off, the inductor 6 will release energy to maintain the current on the load until the energy stored in the inductor 6 is consumed. This energy storage mechanism helps to smooth the output current and prevent voltage fluctuations. The inductor 6 can also filter out high-frequency noise. Among them, in the power module, the inductor 6 often forms an LC filter together with the capacitor to smooth the DC output and reduce the ripple voltage. The inductor 6 presents a higher impedance to the AC component, so the inductor 6 can effectively suppress high-frequency noise and make the output voltage more stable; however, when the inductor 6 is running, the inductor 6 itself has a certain resistance. When current flows through the inductor 6, power loss will be generated in the inductor 6. This part of the loss will be converted into heat, so the inductor 6 will also dissipate heat; in this embodiment, the inductor 6 is arranged on the outside of the plastic packaging layer 5, so that the heat generated by the inductor 6 can be directly dissipated to the outside air, which will reduce the heat dissipated by the inductor 6, so that the heat dissipation efficiency of the packaged product 100 can be further improved.

[0038] See also Figure 3 In one embodiment, the plastic sealing layer 5 between the heating element 2 and the heat sink 3 is formed with a first connecting hole 51. The plastic sealing material is injected into the mold so that the plastic sealing material covers the first insulating heat conductive part 4, the heat sink 3 and the heating element 2. The mold is provided with a convex column between the heat sink 3 and the heating element 2, and then the plastic sealing material is hardened to form the plastic sealing layer 5. In this way, a first connecting hole 51 will be formed between the heat sink 3 and the heating element 2 after plastic sealing. In this way, the plastic sealing layer 5 can increase the mechanical properties of the entire packaged product 100, while increasing reliability, and protect the first insulating heat conductive part 4, the heat sink 3 and the heating element 2 in the plastic sealing layer 5. After the plastic sealing is completed, the plastic sealing layer 5 is ground to expose the heat sink 3, and thus the assembly of the entire packaged product 100 is completed; when the packaged product 100 is running, the heating component will emit heat, and the heat emitted by the heating component is transferred to the first insulating heat conductive part 4 At the same time, part of the heat dissipated by the heating component will be directly transferred from the air in the first connecting hole 51 to the heat sink 3, and then the first insulating heat conductive member 4 will transfer the heat to the heat sink 3. Since the heat sink 3 is exposed to the plastic sealing layer 5, the heat sink 3 will be in contact with the outside world, and the heat sink 3 will transfer the heat to the outside world for heat dissipation, thus completing the heat dissipation of the packaged product 100. In the structure of this embodiment, the heating component can simultaneously transfer the heat to the heat sink 3 through the first insulating heat conductive member 4 and through the air in the first heat dissipation hole, thereby realizing the heat dissipation of the heating component, which can improve the efficiency of heat transfer of the heating component. More heat will be transferred to the heat sink 3 per unit time, thus further improving the heat dissipation efficiency of the packaged product 100.

[0039] In fact, there can be multiple first connecting holes 51, so that the heat of the heating component can be transferred to the heat sink 3 through more first connecting holes 51, which further improves the efficiency of heat transfer of the heating component, thereby further improving the heat dissipation efficiency of the packaged product 100.

[0040] See also Figure 1 and Figure 2 In one embodiment, the packaged product 100 also includes a second insulating heat-conducting member 7 and a capacitor assembly 8. The second insulating heat-conducting member 7 is respectively connected to the capacitor assembly 8 and the heat sink 3. The plastic sealing layer 5 cooperates with the substrate 1 to form a placement cavity 11. The capacitor assembly 8 is arranged in the placement cavity 11, and the capacitor assembly 8 is connected to the substrate 1. The capacitor component 8 is an indispensable component in the packaged product 100, and its functions include but are not limited to decoupling, bypassing, filtering, energy storage, oscillation, timing, coupling and impedance matching. When the packaged product 100 is running, the capacitor component 8 will also generate heat. In this embodiment, during packaging, the plastic sealing layer 5 and the substrate 1 are matched through a mold to form a placement cavity 11, and the capacitor component 8 is arranged in this placement cavity 11. Before packaging, a second insulating heat conductive member 7 is provided to connect the capacitor component 8 to the heat sink 3, so that the heat dissipated by the capacitor component 8 will be transferred to the second insulating heat conductive member 7, and then the second insulating heat conductive member 7 will transfer the heat to the heat sink 3. Since the heat sink 3 is exposed to the plastic sealing layer 5, the heat sink 3 will contact the outside world, and the heat sink 3 will transfer the heat to the outside world for heat dissipation, thereby completing the heat dissipation of the capacitor component 8; through the above structure, the heat dissipation efficiency of the capacitor component 8 can be improved.

[0041] See also Figure 1 and Figure 2In one embodiment, the capacitor assembly 8 includes a first capacitor 81 and a second capacitor 82, the placement cavity 11 includes a first cavity 111 and a second cavity 112 that are separated, the first capacitor 81 is arranged in the first cavity 111, and the second capacitor 82 is arranged in the second cavity 112, and the second insulating heat-conductive member 7 includes a first insulating heat-conductive block 71 and a second insulating heat-conductive block 72, the first insulating heat-conductive block 71 is respectively connected to the first capacitor 81 and the heat sink 3, and the second insulating heat-conductive block 72 is respectively connected to the second capacitor 82 and the heat sink 3. In order to ensure that the capacitor component 8 can achieve multiple functions in the packaged product 100, multiple different types of capacitors are generally provided. Here, two capacitors are taken as an example. The capacitor component 8 includes a first capacitor 81 and a second capacitor 82. During the plastic packaging, the placement cavity 11 is divided into a first cavity 111 and a second cavity 112. The first capacitor 81 is arranged in the first cavity 111, and the second capacitor 82 is arranged in the second cavity 112. In this way, the first capacitor 81 and the second capacitor 82 are separated to prevent the heat emitted by the first capacitor 81 and the second capacitor 82 from being transferred to each other and damaging the capacitors. The second insulating heat-conducting member 7 includes a first insulating heat-conducting block 71 and a second insulating heat-conducting block 72. In this way, the heat of the first capacitor 81 will be transferred to the first insulating heat-conducting block 71, and the heat of the second capacitor 82 will be transferred to the second insulating heat-conducting block 72, and finally transferred to the heat dissipation block, and then the heat dissipation block will transfer the heat to the outside, so that the common heat dissipation of multiple capacitors can be achieved.

[0042] See also Figure 1 and Figure 2 In one embodiment, the number of the placement cavity 11, the capacitor assembly 8 and the second insulating heat conductive member 7 are all multiple, and the multiple placement cavities 11 are arranged at intervals. The number of the multiple placement cavities 11, the multiple capacitor assemblies 8 and the multiple second insulating heat conductive members 7 are equal and arranged one by one. In order to improve the stability of the packaged product 100, multiple capacitor assemblies 8 with the same function are generally arranged in the packaged product 100. In this way, it is necessary to dissipate heat for the multiple capacitor assemblies 8. Through the structural arrangement of this embodiment, it is possible to achieve simultaneous heat dissipation of the multiple capacitor assemblies 8.

[0043] See also Figure 3In one embodiment, the plastic sealing layer 5 is formed with a second connecting hole 52 interconnected with the placement cavity 11. When the packaged product 100 is in operation, the capacitor component 8 will also generate heat. In this embodiment, during packaging, the plastic sealing layer 5 and the substrate 1 are matched through a mold to form a placement cavity 11. The capacitor component 8 is arranged in this placement cavity 11, and the plastic sealing layer 5 is formed with a second connecting hole 52 interconnected with the placement cavity 11. Before packaging, a second insulating heat-conducting member 7 is arranged to connect the capacitor component 8 with the heat sink 3, so that the heat emitted by the capacitor component 8 will be transferred to the second insulating heat-conducting member 7, and part of the heat emitted by the capacitor component 8 will be transferred to the heat sink 3 through the second connecting hole 52, and then the second insulating heat-conducting member 7 is connected to the capacitor component 8. The insulating heat-conducting member 7 will transfer the heat to the heat sink 3. Since the heat sink 3 is exposed to the plastic sealing layer 5, the heat sink 3 will be in contact with the outside world, and the heat sink 3 will transfer the heat to the outside world for heat dissipation, thus completing the heat dissipation of the packaged product 100. In the structure of this embodiment, the capacitor component 8 can simultaneously transfer the heat to the heat sink 3 through the second insulating heat-conducting member 7 and through the air in the second heat dissipation hole, thereby realizing the heat dissipation of the heating component, which can improve the efficiency of heat transfer of the heating component. More heat will be transferred to the heat sink 3 per unit time, thus further improving the heat dissipation efficiency of the capacitor component 8.

[0044] In one embodiment, the first insulating heat-conducting member 4 and the second insulating heat-conducting member 7 are both silicone thermally conductive adhesives. Silicon thermally conductive adhesives usually contain fillers with high thermal conductivity, which can significantly improve the thermal conductivity of the material, thereby effectively transferring heat from the heating element 2 to the heat sink; silicon-based materials usually have good electrical insulation properties, which means that silicone thermally conductive adhesives can provide efficient heat conduction without affecting the electrical performance of the packaged product 100. Silicon thermally conductive adhesives have good chemical stability, are not easily affected by environmental factors, and can maintain their performance over a wide temperature range; silicone thermally conductive adhesives are usually in the form of pastes or gels, which are easy to apply and adjust the thickness, and are suitable for surfaces of various shapes and sizes. Once cured, silicone thermally conductive adhesives can provide long-term stable thermal conductivity and will not easily crack or fall off. Silicon thermally conductive adhesives can fill the tiny gaps between the heating element 2 and the heat sink, eliminate the presence of air, and improve the efficiency of heat transfer; silicone thermally conductive adhesives usually have a certain degree of flexibility, which can absorb mechanical vibrations to a certain extent and protect sensitive electronic components from damage.

[0045] In one embodiment, the packaged product 100 includes a power module, the heating element 2 is a power supply, and the heat sink 3 is a heat sink copper block. In a specific application scenario, the packaged product 100 is a power module, the heating element 2 is a power supply, and the heat sink 3 is a heat sink copper block. The two sides of the silicone thermal conductive glue are respectively connected to the power supply and the heat sink copper block, so as to prevent the power supply from directly contacting the heat sink copper block and causing a short circuit, while not affecting the efficiency of heat transfer between the power supply and the heat sink copper block. The power supply is then connected to the substrate 1, and then the packaging is performed by plastic sealing. The plastic sealing material is injected into the mold so that the plastic sealing material covers the thermal conductive silicone, the heat sink copper block and the power supply, and then the plastic sealing material is hardened to form a plastic sealing layer 5. In this way, the plastic sealing layer 5 can increase the mechanical properties of the entire power module, while increasing reliability, and protect the thermal conductive silicone, the heat sink copper block and the power supply in the plastic sealing layer 5. After the plastic sealing is completed, the plastic sealing layer 5 is ground to expose the heat sink copper block. In this way, the assembly of the entire power module is completed; when the power module is running, the heating component will emit heat, and the heat emitted by the heating component will be transferred to the thermally conductive silicone, and then the thermally conductive silicone will transfer the heat to the heat dissipation copper block. Since the heat dissipation copper block is exposed to the plastic sealing layer 5, the heat dissipation copper block will contact the outside world, and the heat dissipation copper block will transfer the heat to the outside world for heat dissipation, thus completing the heat dissipation of the power module; in this embodiment, a heat dissipation copper block is set and the heat dissipation copper block is exposed to the outside world by grinding, so that the heat dissipated by the heating component can be conducted to the heat dissipation copper block, thereby reducing the heat of the heating component, and then the outside air cools the heat dissipation copper block, and the heat dissipation copper block can continue to absorb the heat of the heating component. Such a structure improves the heat dissipation efficiency of the power module.

[0046] According to another aspect of the invention, the present invention further provides an electronic device, which includes the above-mentioned packaged product 100. Since the electronic device includes all technical solutions of the above-mentioned packaged product 100, it has at least all the beneficial effects brought by all the above-mentioned technical solutions, which will not be described one by one here.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and do not limit the patent scope of the present invention; although the present application is described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that under the technical concept of the present invention, the technical solutions recorded in the aforementioned embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; or directly / indirectly applied to other related technical fields, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A packaged product, characterized in that: include: substrate; A heating element is mounted on the substrate; Heat sink; a first insulating heat-conducting member, wherein the first insulating heat-conducting member is respectively connected to the heating element and the heat dissipating member; A plastic encapsulation layer, wherein the plastic encapsulation layer encapsulates the first insulating heat-conducting member, the heat dissipating member and the heating element, and the heat dissipating member is partially exposed to the plastic encapsulation layer.

2. The packaged product according to claim 1, characterized in that: A side of the heat dissipation component away from the first insulating heat conductive component is exposed to the plastic packaging layer.

3. The packaged product according to claim 1, characterized in that: The packaged product further includes an inductor, which is mounted on the substrate and is located outside the plastic packaging layer.

4. The packaged product according to any one of claims 1 to 3, characterized in that: The plastic sealing layer between the heating element and the heat sink is formed with a first communication hole.

5. The packaged product according to claim 4, characterized in that: The packaged product also includes a second insulating heat-conducting component and a capacitor assembly, the second insulating heat-conducting component is respectively connected to the capacitor assembly and the heat sink, the plastic encapsulation layer and the substrate cooperate to form a placement cavity, the capacitor assembly is arranged in the placement cavity, and the capacitor assembly is connected to the substrate.

6. The packaged product according to claim 5, characterized in that: The capacitor assembly includes a first capacitor and a second capacitor, the placement cavity includes a first cavity and a second cavity that are separated, the first capacitor is arranged in the first cavity, the second capacitor is arranged in the second cavity, the second insulating thermal conductive member includes a first insulating thermal conductive block and a second insulating thermal conductive block, the first insulating thermal conductive block is respectively connected to the first capacitor and the heat sink, and the second insulating thermal conductive block is respectively connected to the second capacitor and the heat sink.

7. The packaged product according to claim 5, characterized in that: The number of the placement cavities, the capacitor components and the second insulating heat conductive parts are all multiple, the multiple placement cavities are arranged at intervals, the number of the multiple placement cavities, the multiple capacitor components and the multiple second insulating heat conductive parts are equal and arranged one by one.

8. The packaged product according to claim 5, characterized in that: The plastic sealing layer is formed with a second communicating hole which is interconnected with the placement cavity.

9. The packaged product according to claim 5, characterized in that: The first insulating heat-conducting member and the second insulating heat-conducting member are both made of silicone thermally conductive adhesive.

10. The packaged product according to any one of claims 1 to 3, characterized in that: The packaged product comprises a power module, the heating element is a power supply, and the heat sink is a heat dissipation copper block.

11. An electronic device, characterized in that: The electronic device comprises the packaged product according to any one of claims 1 to 10 above.

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