Process manufacturing system, length measuring system and process manufacturing method

Abstract

A design image based on design data is set for each image acquisition condition, and a length measurement cursor is set for each of a plurality of design images. A process creation system for creating a process in which a length measurement step of an observation object is described, the process creation system executing: a storage process for storing design data of the observation object including a plurality of layers; a layer setting process for acquiring a condition for each image of the object to be observed, and setting one or more layers from among the plurality of layers; and a length measurement cursor setting process for setting a length measurement cursor indicating a length measurement region of the object to be observed in a design image comprising the design present in the one or more layers set by the setting process.

Description

Technical Field

[0001] The present disclosure relates to a process manufacturing system, a length measurement system and a process manufacturing method. Background Art

[0002] In order to achieve large-scale and high-integration semiconductor devices, the stacking of devices continues to develop. If multi-layering is performed in 3D-NAND structures and the like, it is necessary to measure deep grooves and deep holes. Therefore, a scanning electron microscope (for example, refer to patent document 1) with multiple detectors (for example, a detector for detecting secondary electrons and a detector for detecting reflected electrons) is proposed. The scanning electron microscope of patent document 1 is equipped with multiple detectors, so the SEM image is diversified. Therefore, even at the same measurement position, the pattern of multiple layers can sometimes be observed or not observed according to the SEM image.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2009-243993 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In the manufacturing process of devices, CD-SEM (Critical Dimension Scanning Electron Microscope) is used to measure semiconductor patterns, etc. for dimensional management. In order to measure semiconductor patterns, etc., it is necessary to create a process that describes the measurement steps. When creating a process on a CD-SEM, it moves to the measurement coordinate value on the wafer, confirms the pattern to be measured (SEM image), and sets the measurement cursor, so it takes time to create a process on a CD-SEM.

[0008] When a process is produced on a CD-SEM, the operating time of the device is reduced, so there is an offline process production system that can produce a CD-SEM process offline. In the offline process production system, the CD-SEM process is generated offline (without using a SEM image) by using the design data of the semiconductor pattern.

[0009] Fig.11 An example of measuring the length of a semiconductor pattern according to a process produced by a conventional off-line process production system is shown. Fig.11As shown, first, in the offline process manufacturing system, a process for measuring the length of a semiconductor pattern is manufactured. For example, in the offline process manufacturing system, in order to measure the distance between semiconductor patterns, a length measurement cursor 1020 is set on a semiconductor pattern 1010 in a design image 1000 based on design data of the semiconductor pattern.

[0010] The above-mentioned length measurement cursor 1020 is set on the SEM image 2000 photographed by the CD-SEM, and the distance between the semiconductor patterns 2010 on the SEM image 2000 is measured. Here, the case where SEM image A and SEM image B are obtained due to the diversification of SEM images is described. In SEM image A, only the semiconductor pattern 2010 as the observation object is included, so the distance between the semiconductor patterns 2010 can be accurately measured by the length measurement cursor 1020. However, in SEM image B, in addition to the semiconductor pattern 2010 as the observation object, the semiconductor pattern 2020 of other layers is included, so the distance between the semiconductor patterns 2010 as the observation object cannot be measured by the length measurement cursor 1020 overlapping with the semiconductor pattern 2020 of other layers.

[0011] In this way, if the design image 1000 based on the design data displayed in the off-line process production system and the SEM image 2000 are substantially inconsistent, the length measurement cursor 1020 cannot be arranged at an appropriate position.

[0012] In this case, the user needs to correct the length measurement cursor in the CD-SEM, and the correction of the process takes time. In addition, in the conventional off-line process production system, there is only one design image based on the design data that can set the length measurement cursor, while there are multiple SEM images depending on the image acquisition conditions, so it is difficult to measure the length of multiple SEM images using the length measurement cursor for one design image.

[0013] Therefore, the present disclosure provides a process manufacturing system capable of setting a design image based on design data for each image acquisition condition and capable of setting a length measurement cursor for each of a plurality of design images.

[0014] Means for solving problems

[0015] In order to solve the above-mentioned problems, the process production system disclosed in the present invention produces a process that records the length measurement steps of the observation object through a computer system, and the computer system performs the following processing: storage processing, storing the design data of the observation object including multiple layers in a storage device; layer setting processing, setting one or more layers from multiple layers for each image acquisition condition of the observation object; and length measurement cursor setting processing, setting a length measurement cursor representing the length measurement area of ​​the observation object in a design image composed of designs existing in one or more layers set by the setting processing.

[0016] Effects of the Invention

[0017] According to the present disclosure, a design image based on design data can be set for each image acquisition condition, and a length measurement cursor can be set for each of a plurality of design images.

[0018] The following description of the embodiments will make other problems, structures, and effects clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a diagram showing the overall structure of the length measurement system of Example 1.

[0020] Figure 2 It is a data flow diagram in the offline process production system of Example 1.

[0021] Figure 3 This is a flowchart showing the processing performed in the off-line recipe production system of Example 1.

[0022] Figure 4 This is a diagram showing a design layout setting screen according to Example 1.

[0023] Figure 5 This is a diagram showing a layer detail setting screen according to the first embodiment.

[0024] Figure 6 This is a diagram showing an example of setting a length measurement cursor for a design image in the off-line process preparation system of the first embodiment.

[0025] Figure 7 This is a diagram showing the SEM image display screen of Example 2.

[0026] Figure 8 This is a diagram showing a SEM image display screen of Example 3.

[0027] Fig. 9 This is a diagram showing the configuration of a system including a learning system according to a fourth embodiment.

[0028] Fig.10 This is a diagram showing the result output of the learning system of Example 4.

[0029] Fig.11 The diagram shows an example of measuring the length of a semiconductor pattern according to a process produced by a conventional off-line process production system. DETAILED DESCRIPTION

[0030] The embodiments of the present disclosure are described in detail based on the accompanying drawings. In the following embodiments, the structure (including the steps of the flowchart) is not necessarily required except for the cases that are specifically indicated and the cases that are clearly considered to be necessary in principle. The preferred embodiments of the present disclosure are described below using the accompanying drawings.

[0031] Example 1

[0032] [Structure of the length measurement system 1]

[0033] Figure 1 1 is a diagram showing the overall structure of the length measurement system of Example 1. Figure 1 , the structure of the length measuring system 1 is described. Figure 1 As shown, the length measurement system 1 includes an offline process production system 100 and a CD-SEM (charged particle beam device) 200. The offline process production system 100 is communicatively connected to the CD-SEM 200. The offline process production system 100 has a computer system with a processor, a memory, etc., for example, an information processing device such as a personal computer, a server, a tablet computer, a smart phone, etc. The offline process production system 100 generates a CD-SEM process (information describing the length measurement steps of the observed object) offline (without using a SEM image). The CD-SEM 200 is a device for measuring the dimensions of fine patterns of semiconductors, etc., and measures the length of the desired part according to the process. The CD-SEM 200 has multiple detectors and can photograph the observed object under various image acquisition conditions according to the process.

[0034] [Structure of the Offline Process Manufacturing System 100]

[0035] Next, the structure of the offline recipe production system 100 is described. The offline recipe production system 100 includes a control unit 110, an input unit 120, and an output unit 130. The control unit 110 is a computer system, and includes a processor 111, a main storage unit 112, an auxiliary storage unit 113, an input / output interface 114 (hereinafter, the interface is abbreviated as I / F), and a communication I / F 115.

[0036] The processor 111 is a central processing unit that controls the operation of each part of the control unit 110. The processor 111 is, for example, a CPU (Central Processing Unit), a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), etc. The processor 111 expands the program stored in the auxiliary storage unit 113 in the working area of ​​the main storage unit 112 to make it executable. The main storage unit 112 stores the program executed by the processor 111, the data processed by the processor, etc. The main storage unit 112 is a flash memory, a RAM (Random Access Memory), etc. The auxiliary storage unit 113 stores various programs and various data. The auxiliary storage unit 113 stores various programs such as an OS (Operating System), a length measurement cursor setting program 113a, etc. The auxiliary storage unit 113 is a solid state drive device (SSD), a hard disk (HDD) device, etc. The input unit 120 is, for example, a keyboard and a mouse. The output unit 130 is, for example, a display unit.

[0037] In addition, CD-SEM 200 also includes a control unit 210, an input unit 220, and an output unit 230. The control unit 210, input unit 220, and output unit 230 of CD-SEM 200 are respectively the same as the control unit 110, input unit 120, and output unit 130 of the above-mentioned offline process production system 100, and thus their description is omitted.

[0038] [Data Flow in Offline Process Production System 100]

[0039] Figure 2 This is a data flow diagram in the off-line process production system of Example 1. Figure 2 , illustrating the flow of data in the offline process production system 100.

[0040] (1. Design data input)

[0041] First, the user inputs design data 201 of an observation object (semiconductor pattern) to the offline process production system 100. The design data 201 is, for example, CAD (Computer-Aided Design) data. The input design data 201 is registered in the design data DB 202. The design data DB 202 is stored in the auxiliary storage unit 113, for example.

[0042] (2. Image acquisition condition input)

[0043] Next, the user inputs one or more image acquisition conditions 203 for capturing an image of the observation object by the CD-SEM 200. The image acquisition conditions are, for example, information indicating the imaging position (coordinate value), imaging range, imaging magnification, and detector to be used.

[0044] (3. Design layout setting)

[0045] Next, the user sets the design layout 204 for each image acquisition condition 203 input. The design layout 204 is set as follows: Figure 4 and Figure 5 Detailed description in.

[0046] (4. Design template production)

[0047] When the design layout 204 is set for each image acquisition condition 203, the off-line recipe creation system 100 creates a design template 205. The design template 205 is data obtained by combining designs included in one or more layers selected by the user from among one or more layers constituting the design data.

[0048] (5. Length measurement cursor setting)

[0049] When the design template is created, the off-line process creation system 100 sets a length measurement cursor 206 for each design template 205. The length measurement cursor indicates a length measurement area (X-direction dimension, Y-direction dimension) of the SEM image captured by the CD-SEM 200.

[0050] (6. Process production and preservation)

[0051] The off-line recipe creation system 100 creates a recipe in which the length measurement cursor 206 is set in the design template 205, and stores the recipe in the recipe file DB 207. The recipe file DB 207 is stored in the auxiliary storage unit 113, for example.

[0052] (7. Process delivery)

[0053] The off-line recipe creation system 100 sends the recipe stored in the recipe file DB 207 to the CD-SEM 200 .

[0054] The CD-SEM 200 captures an image of the observation object according to the image acquisition conditions 203 defined in the recipe, and measures the length of the observation object within the length measurement range indicated by the length measurement cursor defined in the recipe.

[0055] [Data Processing in Offline Recipe Production System 100 (Recipe Production Method)]

[0056] Figure 3 FIG. 1 is a flowchart showing the processing executed in the off-line recipe creation system of the first embodiment. Figure 3 , which illustrates the data processing performed by the offline process production system 100. For example, the processor 111 of the control unit 110 of the offline process production system 100 executes the length measurement cursor setting program 113a stored in the auxiliary storage unit 113, thereby performing Figure 3 The steps of the flowchart shown in FIG. Figure 2 "1. Design data input", "2. Image acquisition condition input", "3. Design layout setting", "4. Design template creation", "5. Length measurement cursor setting", "6. Process creation and saving" and "7. Process sending" in Figure 3 Corresponding to steps S301 to 307.

[0057] (Step S301: Input of design data)

[0058] The user inputs design data (layout file) of an observation object (eg, semiconductor pattern) into the off-line process production system 100. The design data (layout file) is data composed of a plurality of layers. The off-line process production system 100 can store a plurality of design data in the design data DB 202.

[0059] (Step S302: Input of Image Acquisition Conditions of SEM Image)

[0060] Next, the user inputs the image acquisition conditions of the SEM image. The coordinate values ​​and imaging magnifications of the image acquisition conditions can be input using a file that lists the coordinate values ​​and imaging magnifications in pairs.

[0061] (Step S303: Setting of Design Layout for Each Image Acquisition Condition)

[0062] Next, the user sets the design layout for each image acquisition condition of the SEM image. Specifically, the user sets the design layout on the design layout setting screen (see Figure 4 ), the design layout is set for each image acquisition condition of the SEM image. First, the user sets the design data name 402 for each image acquisition condition. In addition, the user selects the image acquisition condition 403 from the pull-down. The image acquisition condition saves the conditions set by the user in advance as a template. In addition, the image acquisition condition can also be input each time in the design layout screen. Next, the user sets the top unit name 401 of the design layout that constitutes the observation object. In the design layout, the pattern is composed of units, and the top unit is composed of multiple units. It is also possible to set a different design data name and top unit name for each image acquisition condition.

[0063] In addition, the user can set one or more layers for each image acquisition condition. Figure 4 The layer setting button 404 shown shows Figure 5. In the layer detail setting screen, the user imagines a design that can be observed when the CD-SEM 200 photographs the observation object under the image acquisition conditions, and selects a layer to configure the design. In the layer detail setting screen, all layer numbers 502 included in the top unit are displayed. The user sets the layer type 503 and the layer order 504 for each layer. For example, with respect to the layer type 503, the user sets the layer with the design of the observation object as the target, sets the layer with the observable design as low, medium, or reference, and sets the layer with the unobservable design as none (not use). In addition, with respect to the layer order 504, the user sets the numbering from the upper layer. Furthermore, in the layer presence or absence 501, the user sets the layer with the observable design as "yes", and sets the layer with the unobservable design as "no".

[0064] After completing the above-mentioned various settings, the user selects the registration button 505 to obtain the details of the condition registration layer for each image. When the registration button 505 is selected, the design layout setting screen ( Figure 4 ). Here, when the save button 406 is selected, various information set for each image acquisition condition is saved. Since the image observed for each image acquisition condition is different, the user repeats the setting of the layer for each image acquisition condition.

[0065] (Step S304: Preparation of design template)

[0066] The off-line recipe creation system 100 creates a design template based on image acquisition conditions and design layout settings. A design template is a file that represents a design image composed of designs included in a layer set in the design layout settings with designated coordinate values ​​and imaging magnifications.

[0067] (Step S305: Setting of length measurement cursor)

[0068] The offline process production system 100 sets the length measurement cursor based on the produced design template. The computer system automatically sets the length measurement cursor by avoiding designs other than the target from the design image based on the design template. That is, in this embodiment, the length measurement cursor can be set to match the design image for each image acquisition condition.

[0069] (Step S306: Process creation and storage)

[0070] The above steps S305 and S306 are repeated for each design template to set the length measurement cursor for each design template. Then, the computer system creates a recipe based on the image acquisition conditions and the length measurement cursor set by the design template. The design template and the recipe are saved in the recipe file DB 207.

[0071] (Step S307: Sending of process)

[0072] The off-line recipe making system 100 sends the stored recipe to the CD-SEM 200. The CD-SEM 200 selects and executes the received recipe.

[0073] (Example of setting the length measurement cursor)

[0074] Figure 6 This shows an example of setting a length measurement cursor for a design image in the off-line process preparation system of the first embodiment. Figure 6 This section explains an example of setting the length measurement cursor.

[0075] The design image 601 based on the design data set for the image acquisition condition A includes a line pattern 602. Based on the design template set for the image acquisition condition A, the off-line process preparation system 100 sets a length measurement cursor 603 for measuring the width of the line pattern 602.

[0076] The SEM image 604 obtained by imaging the observation object in the CD-SEM 200 under the image acquisition condition A includes a line pattern 605. Since the length measurement cursor 606 is set in the line pattern 605 in the SEM image 604, the width of the line pattern 605 can be accurately measured.

[0077] The design image 611 based on the design data set for the image acquisition condition B is a pattern in which the line pattern 612 overlaps with the hole 613 thereunder. The offline process production system 100 sets the length measurement cursor 614 for measuring the width of the line pattern 612 avoiding the hole 613 based on the design template set for the image acquisition condition B.

[0078] The SEM image 615 obtained by imaging the observation object in the CD-SEM 200 under the image acquisition condition B includes a line pattern 616 and a hole 617. By setting a length measurement cursor 618 in the line pattern 616 of the SEM image 615 while avoiding the hole 617, the width of the line pattern 616 can be accurately measured.

[0079] The design image 621 based on the design data set for the image acquisition condition C is a pattern including a vertical line pattern 622 and a horizontal line pattern 623 below or above the vertical line pattern 622. The offline process production system 100 sets a length measurement cursor 624 for measuring the width of the vertical line pattern 622 so as not to include the horizontal line pattern 623 based on the design template set for the image acquisition condition C.

[0080] The SEM image 625 obtained by photographing the observation object in the CD-SEM 200 under the image acquisition condition 3 includes a vertical line pattern 626 and a horizontal line pattern 627. The length measurement cursor 628 is set in the vertical line pattern 626 of the SEM image 625 so as not to include the horizontal line pattern 627, so that the width of the vertical line pattern 626 can be accurately measured.

[0081] (Effects of Example 1)

[0082] In the first embodiment, a design image based on design data can be set for each image acquisition condition, and a length measurement cursor can be set for each design image. Thus, the length measurement cursor can be set to match various SEM images acquired by the CD-SEM 200. As a result, the inconsistency between the design image and the SEM image can be reduced, so it is not necessary to correct the length measurement cursor while observing the SEM image on the CD-SEM 200.

[0083] The off-line recipe preparation system 100 can display the design image and the length measurement cursor on one screen, so that when manually setting the length measurement cursor, the user can easily set the length measurement cursor.

[0084] Furthermore, the user (expert) can select an appropriate layer from a plurality of layers constituting the design data for each image acquisition condition and set the design image.

[0085] In addition, since the user can select a design to be observed in the layer type 503, the offline process preparation system 100 can set the length measurement cursor without using designs other than the design to be observed.

[0086] Example 2

[0087] The CD-SEM 200 of the second embodiment receives the design template from the off-line process production system 100 and displays a design image based on the received design template. In the second embodiment, the design image is displayed as an overlay on the SEM image captured by the CD-SEM 200.

[0088] Next, a description will be given of a procedure for overlaying a design image on a SEM image using the CD-SEM 200 of the second embodiment.

[0089] (1. Select the process through CD-SEM200)

[0090] CD-SEM 200 stores the recipe received from the offline recipe production system 100 (refer to Figure 3 The user selects the process received from the offline process production system 100 through the CD-SEM 200.

[0091] (2. Process Execution)

[0092] Then, the CD-SEM 200 executes the selected process, captures an image of the observation object according to the image acquisition conditions set in the process, and measures the length of the observation object in the SEM image using the length measurement cursor set in the process.

[0093] (3. Confirmation of execution results (designed overlay display))

[0094] When the above process is completed, the user can view the SEM image display screen ( Figure 7 ) to visually confirm whether the length of the object being observed can be measured using the length measurement cursor set in the design image based on the design template. SEM image display screen ( Figure 7 ) is displayed on the output unit (display unit) 230 of the CD-SEM 200. When the image acquisition condition 701 is selected in the SEM image display screen, the SEM image acquired under the selected image acquisition condition is displayed in the image display area 705.

[0095] Furthermore, the CD-SEM 200 of the second embodiment displays the design image on the SEM image in an overlaid manner. Figure 7 ), and when a design image is selected in the pull-down menu of design 702 of the display 700, and a design 706 is selected in the pull-down menu of overlay 703, the design image is displayed in an overlay on the SEM image in the image display area 705. Furthermore, when a cursor 708 is selected in the pull-down menu of overlay 703, the length measurement cursor is displayed in an overlay on the SEM image in the image display area 705. In addition, both the design 706 and the cursor 708 can be selected at the same time, and both the design image and the length measurement cursor can be displayed in an overlay on the SEM image at the same time.

[0096] (Effects of Example 2)

[0097] In the second embodiment, the design image and the length measurement cursor can be displayed overlaid on the SEM image, so it is easy to confirm the position of the length measurement cursor. If there is no such display function, when the display of the length measurement cursor deviates from the SEM image and causes a measurement error, the original design image cannot be confirmed on the CD-SEM200. Therefore, in order to correct the original design image, it is also necessary to return to the offline process production system to confirm the screen, so the correction takes time. By overlaying the image to confirm where the deviation occurs, it is possible to correct it to a design that is more consistent with the SEM image, which can shorten the process production time.

[0098] Example 3

[0099] The CD-SEM 200 of Example 3 can change the design image in accordance with the SEM image. In Example 3, when the SEM image displayed in the image display area 705 (see Example 2) deviates from the design image and thus causes a measurement error, the CD-SEM 200 can change the design image while referring to the SEM image.

[0100] (1. Design image display)

[0101] The CD-SEM 200 of Example 3 displays a SEM image 801 and a design image 802 on the output unit (display unit) 230. In the SEM image 801, there are two horizontal line patterns 804 that are not present in the design image 802. In addition, the CD-SEM 200 of Example 3 displays an overlay image 803 in which the design image is overlaid on the SEM image, similarly to Example 2. In addition, a length measurement cursor 806 is also overlaid on the overlay image 803. The horizontal line pattern 804 of the layer that is not set in the design image 802 exists in the SEM image 801. Therefore, in Figure 8 In the region R in FIG. 8 , the length measurement cursor 806 covers the horizontal line pattern 804 , resulting in a measurement error. Therefore, in the CD-SEM 200 , it is necessary to refer to the SEM image 801 to reset the position and range of the length measurement cursor 806 so that the length measurement cursor 806 does not cover the horizontal line pattern 804 .

[0102] (2. Correction of design image and length measurement cursor)

[0103] The user modifies the design image in CD-SEM200 to match the SEM image. For example, when Figure 7 When the design setting button 704 is pressed, the design layout setting screen ( Figure 4 ) on this screen. When the image acquisition condition 403 of the SEM image is selected and the layer setting button 404 of the layer setting 405 is selected, the layer detail setting screen ( Figure 5 Here, the user selects the layer number 502 corresponding to the two horizontal lines seen in the SEM image, and sets "yes" in the layer presence 501. Then, the user selects the register button 505 to return to the design layout setting screen ( Figure 3 ), select Save button 406 to make corrections.

[0104] Here, when the save button 406 is selected, the design template managed by the offline recipe creation system 100 is also modified in the same manner. The design template managed by the offline recipe creation system 100 and the design template managed by the CD-SEM 200 are synchronized to have the same contents.

[0105] (Effects of Example 3)

[0106] As described above, in Example 3, the user can correct the layer presence or absence 501 on the CD-SEM 200 and display the corrected design image. Then, the user can again select the image display screen ( Figure 7 ) and setting the display of the design 706 to on in the overlay 703, so that the corrected design image 809 can be displayed.

[0107] In addition, when the save button 707 is pressed on the device, the length measurement cursor 808 that is corrected to not cover the horizontal pattern 807 to match the corrected design image is saved, and the length measurement cursor of the process located on the offline process production system 100 can also be saved synchronously, thereby significantly shortening the process production time.

[0108] In the third embodiment, the design image and the length measurement cursor can be corrected on the CD-SEM 200 .

[0109] Example 4

[0110] In Examples 2 and 3, the user sets the design layout for each image acquisition condition. In Example 4, the system that causes AI to learn automatically sets the design image based on the image acquisition condition. In Example 1, an experienced user who can predict the SEM image acquired according to the image acquisition condition sets the design image for each image acquisition condition, but here, the AI ​​learns the skills of the experienced user and anyone can set the design.

[0111] (1. Learning in the learning system)

[0112] like Fig. 9 As shown, the off-line process production system 901 and the CD-SEM 200 are connected to the learning system 903 via a network. In the off-line process production system 901, in the setting of the design layout for each image acquisition condition, the design setting 905 of the presence or absence of the layer is performed for each image acquisition condition 904. This information (learning data) is input to the learning system 903.

[0113] In addition, the correction contents of the design setting 905 of the presence or absence of the layer for each image acquisition condition 904 performed in the CD-SEM 200 are also input to the learning system 903. The design setting 905 may be corrected in the offline process production system 901, and the correction contents may be input to the learning system 903. Thus, the design setting 905 for each image acquisition condition 904 becomes a setting more in line with the SEM image, and the accuracy is improved. By repeatedly inputting this information to the learning system 903, the learning system 903 can learn the design setting 905 for each image acquisition condition in addition.

[0114] (2. Automatic design settings in offline process production system)

[0115] The user selects an image acquisition condition. Based on the selected image acquisition condition, the learning system 903 acquires a design image that meets the image acquisition condition and automatically sets it. At this time, the length measurement cursor can also be set in the design image. Regarding the design image to be set, the design layout setting screen ( Figure 3 ) are all settable items.

[0116] like Fig.10 As shown, when the image acquisition condition 1001 is input to the offline recipe production system 901, the learning system 903 can output the design image 1002 based on the image acquisition condition 1001. For example, when the user selects the image acquisition condition A, the offline recipe production system 901 automatically sets a design image 1006 that does not include the patterns of layer 2 and layer 3 from the layers included in the original design 1004. In addition, when the user selects the image acquisition condition B, the offline recipe production system 901 automatically sets a design image 1007 that does not include the pattern of layer 3 from the layers included in the original design 1004. In addition, when the user selects the image acquisition condition C, the offline recipe production system 901 automatically sets a design image 1008 that does not include the pattern of layer 2 from the layers included in the original design 1004.

[0117] (Effects of Example 4)

[0118] This eliminates the need for layer settings for each image acquisition condition, which can be performed only by skilled users, and significantly improves the production efficiency of the process.

[0119] In addition, the present disclosure is not limited to the above-mentioned embodiments, and includes various modified examples. The above-mentioned embodiments are examples described in detail in order to easily explain the present disclosure, and are not necessarily limited to having all the structures described. In addition, a part of the structure of a certain embodiment can also be replaced with the structure of other embodiments, and in addition, the structure of other embodiments can also be added to the structure of a certain embodiment. In addition, for a part of the structure of each embodiment, other structures can also be added, deleted, or replaced.

[0120] For example, in the first embodiment, the offline recipe creation system 100 automatically sets the length measurement cursor for the design image, but the length measurement cursor may be manually set by the user. In this case, it is also possible to determine whether the position of the manually set length measurement cursor is appropriate, and notify a warning or the like.

[0121] Description of Reference Numerals

[0122] 1: length measurement system, 100: off-line process production system, 110: control unit, 111: processor, 112: main storage unit, 113: auxiliary storage unit, 114: input and output I / F, 115: communication I / F, 120: input unit, 130: output unit, 200: CD-SEM, 201: design data, 202: design data DB, 203: image acquisition condition, 204: design layout, 205: design template, 206: length measurement cursor, 207: process file DB, 210: control unit, 220: input unit, 230: output unit.

Claims

1. A process preparation system, which prepares a process in which a length measurement step of an observation object is described by a computer system, characterized in that: The computer system performs the following processing: A storage process of storing the design data of the observation object including a plurality of layers in a storage device; a layer setting process of setting one or more layers from the plurality of layers for each image acquisition condition of the observation object; as well as The length measurement cursor setting process sets a length measurement cursor indicating a length measurement area of ​​the observation object in a design image composed of designs existing in the one or more layers set by the layer setting process.

2. The process manufacturing system according to claim 1, characterized in that: The computer system further executes a display process of displaying the design image and the length measurement cursor on one screen.

3. The process manufacturing system according to claim 1, characterized in that: The layer setting process includes a process of setting one or more layers from among the plurality of layers according to a user's selection.

4. The process manufacturing system according to claim 1, characterized in that: The layer setting process includes a process of setting one or more layers from among the plurality of layers based on the image acquisition condition.

5. The process manufacturing system according to claim 1, characterized in that: The computer system further executes a layer type setting process of setting a layer type indicating whether each of the plurality of layers is to be set as the observation target. The length measurement cursor setting process includes a process of setting the length measurement cursor in the design image while avoiding the design of a layer other than the layer set as the observation target by the layer type setting process.

6. The process manufacturing system according to claim 1, characterized in that: The computer system further executes a transmission process of transmitting a recipe including the image acquisition condition and the length measurement cursor to a charged particle beam device that measures the length of the observation object according to the recipe.

7. A length measuring system, comprising: A process preparation system for preparing a process in which a length measurement step of an observation object is described by a first computer system; and A charged particle beam device, which measures the length of the observation object by executing the process through a second computer system, It is characterized in that The first computer system performs the following processing: A storage process of storing the design data of the observation object including a plurality of layers in a storage device; a layer setting process of setting one or more layers from the plurality of layers for each image acquisition condition of the observation object; as well as a length measurement cursor setting process of setting a length measurement cursor indicating a length measurement area of ​​the observation object in a design image composed of designs existing in the one or more layers set by the layer setting process; The second computer system performs the following processing: receiving process, receiving the design image; and The display process displays the SEM image obtained by photographing the length measurement area indicated by the length measurement cursor and the design image received by the receiving process.

8. The length measuring system according to claim 7, characterized in that: The display processing includes a process of displaying the length measurement cursor in a superimposed manner on the SEM image.

9. The length measuring system according to claim 7, characterized in that: The second computer system further performs the following correction processing: correcting the length measurement cursor on the SEM image displayed by the display processing.

10. The length measuring system according to claim 7, characterized in that: The length measurement system further includes a learning system that performs learning using learning data including the image acquisition condition and one or more layers set for the image acquisition condition. The learning system executes the layer setting process of setting one or more layers from among the plurality of layers for each image acquisition condition of the observation object.

11. The length measuring system according to claim 10, characterized in that: The first computer system or the second computer system further performs the following layer modification processing: modifying one or more layers set for the image acquisition condition, The learning system performs additional learning using learning data including the image acquisition condition and one or more layers corrected in the layer correction process.

12. A method for producing a process, wherein the process describes a step of measuring the length of an observation object, characterized in that: The process manufacturing method has the following steps: storing design data of the observation object including a plurality of layers in a storage device; For each image acquisition condition of the observation object, one or more layers are set from the plurality of layers; In a design image composed of designs existing in the set one or more layers, a length measurement cursor indicating a length measurement area of ​​the observation object is set; as well as A process is produced including the image acquisition condition and the length measurement cursor set.

13. The process manufacturing method according to claim 12, characterized in that: The process manufacturing method further includes a step of displaying the design image and the length measurement cursor on one screen.

14. The process manufacturing method according to claim 12, characterized in that: The step of setting the one or more layers includes setting one or more layers from the plurality of layers according to a user's selection.

15. The process manufacturing method according to claim 12, characterized in that: The step of setting the one or more layers includes setting one or more layers from the plurality of layers based on the image acquisition condition.

16. The process manufacturing method according to claim 12, characterized in that: The process manufacturing method further comprises a step of setting a layer type, wherein the layer type indicates whether each of the plurality of layers is set as the observation object. The step of setting the length measurement cursor includes setting the length measurement cursor while avoiding a design of a layer other than a layer set as the observation target in the design image.

17. The process manufacturing method according to claim 12, characterized in that: The recipe preparation method further includes the step of sending the recipe including the image acquisition condition and the length measurement cursor to a charged particle beam device that measures the length of the observation object according to the recipe.

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