Novel freezing fat dissolving control system

Abstract

The invention relates to the technical field of medical apparatus and instruments, in particular to a novel freezing fat dissolving control system which comprises a handle temperature detection element, an air pressure detection element, a turbidity detection element, a water tank temperature detection element and a refrigeration piece temperature detection element. A turbidity detection element and a water tank temperature detection element are arranged in the water tank, and a refrigeration sheet temperature detection element is installed on the hot end face of the semiconductor refrigeration sheet B. According to the novel freezing fat dissolving control system, by integrating various detection elements and intelligent control strategies, comprehensive monitoring and accurate control over the treatment process are achieved, the safety and the effect of treatment are improved, resources are saved, and the maintenance process is simplified.

Description

Technical Field

[0001] The present invention relates to the technical field of medical devices, and in particular to a novel cryolipolysis control system. Background Art

[0002] With the development of modern medical technology, non-invasive fat reduction methods have gradually gained favor among consumers. Among them, cryolipolysis technology is an emerging and relatively safe means of fat reduction. Its principle is based on the fact that fat cells are more sensitive to low temperatures. It induces apoptosis of fat cells by precisely controlling the freezing temperature, and then excretes them from the body through natural metabolic processes, thereby achieving a fat reduction effect. However, although cryolipolysis technology has shown great potential in the field of fat reduction, the safety and efficiency of its control system are still key factors restricting its widespread application.

[0003] The control systems of the current cryolipolysis equipment on the market generally have many deficiencies, which are mainly manifested in the following aspects: Frequent failures in the water circulation system: The water pump design failed to effectively prevent air inhalation, resulting in the inability to form effective water circulation in the cryolipolysis handle, which in turn caused the semiconductor refrigeration chip to be damaged due to dry burning. This not only increased the maintenance cost of the equipment, but also seriously threatened the safety of the treatment process; Insufficient negative pressure control accuracy: The negative pressure pump lacks precise air pressure value limits during the inhalation process, which can easily cause excessive negative pressure on the treatment area, forming blood bubbles, causing unnecessary pain and potential health risks to the patient; Unstable temperature control: The temperature control mechanism of the semiconductor refrigeration chip is not accurate enough. Limited by the performance of the temperature sensor and the response speed of the feedback system, the treatment area may be over-frozen or the temperature may be insufficient, which may affect the fat reduction effect, seriously affecting the safety and effectiveness of the treatment; Energy consumption and water waste: Traditional designs require frequent replacement of clean water in the water tank, which not only increases the complexity of the operation, but also causes a large amount of water waste. At the same time, excessively high water temperature in the water tank will reduce the cooling efficiency of the cryolipolysis handle, further affecting the treatment effect; Lack of monitoring of the auxiliary refrigeration system: There is a lack of effective monitoring means for the working status of the semiconductor refrigeration chip and its cooling fan used to cool the water in the water tank. When the fan fails, it cannot be discovered in time, which often leads to overheating and damage of the semiconductor refrigeration chip, affecting the stability and service life of the overall system.

[0004] In view of the above problems, a more advanced, safe and efficient cryolipolysis control system is urgently needed to address the deficiencies in existing technologies, improve the comfort, safety and therapeutic effects of the treatment process, and achieve effective resource utilization and environmental protection. Summary of the invention

[0005] In order to solve the above problems, the present invention provides a new type of cryolipolysis control system. The new type of cryolipolysis control system realizes comprehensive monitoring and precise control of the treatment process by integrating multiple detection elements and intelligent control strategies, which not only improves the safety and effectiveness of the treatment, but also saves resources and simplifies the maintenance process.

[0006] The technical solution of the present invention is as follows: A novel cryolipolysis control system is used to control a cryolipolysis instrument. The cryolipolysis instrument consists of a controller, a cryolipolysis handle, a negative pressure pump, a water pump, a water tank, a fan, a semiconductor refrigeration sheet A and a semiconductor refrigeration sheet B. The cryolipolysis handle is connected to the negative pressure pump. A semiconductor refrigeration sheet A is arranged in the cryolipolysis handle. The semiconductor refrigeration sheet A draws water from the water tank for cooling through the water pump. A semiconductor refrigeration sheet B is arranged in the water tank. A fan is arranged next to the semiconductor refrigeration sheet B. The controller is communicatively connected with the negative pressure pump, the water pump, the semiconductor refrigeration sheet A, the semiconductor refrigeration sheet B and the fan. The controller includes a handle temperature detection element, an air pressure detection element, a turbidity detection element, a water tank temperature detection element and a refrigeration sheet temperature detection element. A handle temperature detection element and an air pressure detection element are arranged in the cryolipolysis handle. A turbidity detection element and a water tank temperature detection element are arranged in the water tank. A refrigeration sheet temperature detection element is installed on the hot end surface of the semiconductor refrigeration sheet B.

[0007] The novel cryolipolysis control system also includes a screen, which is communicatively connected with the controller.

[0008] The handle temperature detection element is temperature sensor A.

[0009] The air pressure detection element is an air pressure sensor.

[0010] The turbidity detection element is a turbidity sensor.

[0011] The water tank temperature detection element is temperature sensor B.

[0012] The temperature sensor C is the temperature detection element of the refrigeration plate.

[0013] The beneficial effects of the present invention are: 1. The present invention discloses a novel cryolipolysis control system, which has simple control, high safety and reliability, and can monitor important data, thus facilitating subsequent fault repair.

[0014] 2. The present invention discloses a new type of cryolipolysis control system. The air pressure value, turbidity value and temperature data of the new cryolipolysis control system will be displayed on the screen for safety monitoring. When any value is abnormal, the entire machine will be powered off and stop working, avoiding damage to the instrument, waste of water resources and the risk of harm to human skin.

[0015] 3. The present invention discloses a new type of cryolipolysis control system. By introducing multiple detection elements (such as handle temperature detection elements, air pressure detection elements, turbidity detection elements, water tank temperature detection elements and cooling plate temperature detection elements), the system can monitor key parameters in the cryolipolysis process in real time, such as handle temperature, treatment area air pressure, water tank water quality and temperature, and semiconductor cooling plate temperature. These monitoring measures effectively avoid equipment damage and patient injury risks caused by abnormal parameters (such as water pump sucking air, excessive negative pressure, cooling plate overheating, etc.), and significantly improve the safety of the treatment process.

[0016] 4. The present invention discloses a novel cryolipolysis control system, which ensures that the treatment area achieves a predetermined cooling effect through precise temperature control (such as temperature control of semiconductor refrigeration plate A), and neither overcooling to cause frostbite nor insufficient temperature to affect the fat reduction effect. This precise control improves the predictability and stability of the treatment effect.

[0017] 5. The present invention discloses a new type of cryolipolysis control system. The system can evaluate the water quality in the water tank through the monitoring of the turbidity sensor, thereby avoiding unnecessary frequent water changes and significantly saving water resources. For medical institutions, this not only reduces operating costs, but also conforms to the concept of environmental protection.

[0018] 6. The present invention discloses a new type of cryolipolysis control system, in which all key parameters of the new cryolipolysis control system are displayed in real time on the screen, so that the operator can intuitively understand the operating status of the equipment, and it is convenient to find and solve problems in time. In addition, this centralized monitoring method also simplifies the daily maintenance and management process of the equipment and improves work efficiency.

[0019] 7. The present invention discloses a novel cryolipolysis control system, which can enhance the patient's trust and satisfaction with the treatment process by providing real-time feedback and safety assurance, thereby improving the overall user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] By reading the detailed description of the preferred embodiment below, the scheme and advantages of the present application will become clear to those skilled in the art. The accompanying drawings are only for the purpose of illustrating the preferred embodiment and are not to be considered as limiting the present invention.

[0021] In the attached picture: Figure 1 It is a schematic diagram of the composition of a novel cryolipolysis control system according to an embodiment of the present invention; Figure 2It is a working logic diagram of a negative pressure pump control system of a novel cryolipolysis control system according to an embodiment of the present invention; Figure 3 This is a working logic diagram of a semiconductor refrigeration chip A of a novel cryolipolysis control system according to an embodiment of the present invention; Figure 4 This is a working logic diagram of a semiconductor refrigeration plate B of a novel cryolipolysis control system according to an embodiment of the present invention; The components represented by the reference numerals in the figure are: The present invention comprises: 1. a screen, 2. a controller, 3. a cryolipolysis handle, 4. a negative pressure pump, 5. a water pump, 6. a water tank, 7. a fan, 8. a semiconductor cooling sheet A, 9. a semiconductor cooling sheet B, 10. a temperature sensor A, 11. a temperature sensor B, 12. a temperature sensor C, 13. an air pressure sensor, and 14. a turbidity sensor. DETAILED DESCRIPTION Example

[0022] like Figure 1 As shown, the novel cryolipolysis control system includes a controller 2, a cryolipolysis handle 3, a negative pressure pump 4, a water pump 5, a water tank 6, a fan 7, a semiconductor cooling sheet A8, a semiconductor cooling sheet B9, a screen 1, a temperature sensor A10 (handle temperature detection element), an air pressure sensor 13 (air pressure detection element), a turbidity sensor 14 (turbidity detection element), a temperature sensor B11 (water tank temperature detection element) and a temperature sensor C12 (cooling sheet temperature detection element).

[0023] In the prior art, a cryolipolysis apparatus is composed of a controller 2, a cryolipolysis handle 3, a negative pressure pump 4, a water pump 5, a water tank 6, a fan 7, a semiconductor refrigeration sheet A8 and a semiconductor refrigeration sheet B9. The cryolipolysis handle 3 is connected to the negative pressure pump 4, a semiconductor refrigeration sheet A8 is arranged in the cryolipolysis handle 3, the semiconductor refrigeration sheet A8 draws water from the water tank 6 for cooling through the water pump 5, a semiconductor refrigeration sheet B9 is arranged in the water tank 6, a fan 7 is arranged next to the semiconductor refrigeration sheet B9, the controller 2 and the negative pressure pump 4, the water pump 5, the semiconductor refrigeration sheet A8, the semiconductor refrigeration sheet B9 and the fan 7 are connected through cable communication; the cryolipolysis handle 3 is connected to the negative pressure pump 4 through a pipeline, which is used to suck up skin and fat during treatment; the semiconductor refrigeration sheet A8 is installed inside the cryolipolysis handle 3, and the cooling water in the water tank 6 is drawn by the water pump 5 for cooling; a semiconductor refrigeration sheet B9 is arranged in the water tank 6 for lowering the water temperature in the water tank, and a fan 7 is installed next to it to assist in heat dissipation.

[0024] The controller 2 is communicatively connected with the negative pressure pump 4, the water pump 5, the semiconductor cooling sheet A8, the semiconductor cooling sheet B9, the fan 7, the temperature sensor A10, the air pressure sensor 13, the turbidity sensor 14, the temperature sensor B11 and the temperature sensor C12, and is responsible for receiving sensor data and controlling the operation of each component.

[0025] The screen 1 is connected to the controller 2 for displaying the data, working status and alarm information of each sensor.

[0026] When in use, the operator starts the system, and the screen 1 displays the initial data of each sensor. Preferably, the screen 1 is a PLC touch screen.

[0027] The negative pressure pump 4 is started, and the air pressure in the cryolipolysis handle 3 is monitored in real time through the air pressure sensor 13. When the air pressure reaches the set value, it automatically stops working to avoid skin damage caused by excessive negative pressure.

[0028] The water pump 5 starts to work, and draws cooling water from the water tank 6 for cooling through the semiconductor cooling sheet A8. The temperature sensor A10 monitors the temperature of the handle in real time to ensure that the temperature of the treatment area is within a safe range.

[0029] The semiconductor refrigeration chip B9 works, and the fan 7 assists in heat dissipation. The temperature sensor B11 monitors the water tank temperature to ensure that the cooling water temperature is appropriate.

[0030] The turbidity sensor 14 regularly detects the water quality in the water tank to prevent impurities from affecting the cooling effect.

[0031] The temperature sensor C12 monitors the temperature of the hot end of the semiconductor cooling plate B9 to ensure the normal operation of the cooling system and prevent overheating damage.

[0032] During the treatment, all sensor data are displayed in real time on the screen 1. If there is any abnormality (such as high temperature, excessive air pressure, turbid water, etc.), the controller 2 will automatically cut off the power supply of related components to prevent accidents. Example

[0033] like Figure 1 As shown, the new control system includes a screen, a temperature sensor, a water pressure sensor, an air pressure sensor, a water pump, a semiconductor cooling sheet, a negative pressure pump, a water tank, a turbidity sensor, and a fan. The cryolipolysis handle is equipped with a temperature sensor, an air pressure sensor, a semiconductor cooling sheet, and a negative pressure pump. The entire cryolipolysis operation can be divided into two stages. The first stage is the negative pressure adsorption stage. The machine is running, the screen button starts, and the negative pressure pump starts. At this time, the skin and fat of the human body to be treated are adsorbed into the inner shell of the cryolipolysis handle. The air pressure sensor monitors the air pressure inside the cryolipolysis handle. The specific operation logic program of the negative pressure pump is as follows: Figure 2As shown, when the air pressure in the handle reaches the set value, the air pressure pump stops working. The second stage is the cryotherapy stage, the semiconductor refrigeration piece A starts working, the temperature sensor A monitors the temperature inside the cryolipolysis handle, and the working logic program of the semiconductor refrigeration piece A is as follows Figure 3 As shown in the figure, when the temperature in the handle reaches the set temperature, the rated current of the semiconductor refrigeration piece A is reduced to the limited current, the temperature difference between the hot end and the cold end of the semiconductor refrigeration piece A is fixed, and the temperature in the handle does not change until the treatment time is over and the machine is turned off. If the monitored temperature in the handle is lower than the set temperature by more than 1 degree, the machine is directly turned off and the semiconductor refrigeration piece A stops working.

[0034] On the other side of the control system, temperature sensor B, turbidity sensor, semiconductor cooling piece B, fan are installed on the water tank. One side of the water tank is connected to the water pump through a conduit. Semiconductor cooling piece B cools the water tank and the water inside. The fan cools semiconductor cooling piece B with air cooling. The water pump draws the clean water in the water tank into the cryolipolysis handle to cool semiconductor cooling piece A with water. Then the water flows back to the water tank through the conduit. Temperature sensor B monitors the temperature of the water tank. Once the temperature exceeds the value set by the controller, the screen alarms and stops running. Turbidity sensor monitors the turbidity of the water in the water tank. If the turbidity of the water exceeds the value set by the controller, the screen alarms and the machine stops running, and reminds the staff to change the water. Temperature sensor C is installed on the hot end face of semiconductor cooling piece B. The working logic program of semiconductor cooling piece B is as follows Figure 4 As shown, the semiconductor refrigeration piece B is working, and the temperature sensor C monitors the hot end surface temperature of the semiconductor refrigeration piece B. When the monitored temperature is higher than the controller set temperature, the screen alarm will stop the machine.

Claims

1. A novel cryolipolysis control system for controlling a cryolipolysis instrument, the cryolipolysis instrument comprising a controller (2), a cryolipolysis handle (3), a negative pressure pump (4), a water pump (5), a water tank (6), a fan (7), a semiconductor cooling sheet A (8) and a semiconductor cooling sheet B (9), the cryolipolysis handle (3) being connected to the negative pressure pump (4), a semiconductor cooling sheet A (8) being arranged in the cryolipolysis handle (3), the semiconductor cooling sheet A (8) being cooled by water drawn from the water tank (6) by the water pump (5), a semiconductor cooling sheet B (9) being arranged in the water tank (6), a fan (7) being arranged next to the semiconductor cooling sheet B (9), the controller (2) being connected to the negative pressure pump (4), the water pump (5), the semiconductor cooling sheet A (8), the semiconductor cooling sheet B (9) and the fan (7), and characterized in that: It comprises a handle temperature detection element, an air pressure detection element, a turbidity detection element, a water tank temperature detection element and a cooling plate temperature detection element. The handle temperature detection element and the air pressure detection element are arranged in the cryolipolysis handle (3), the turbidity detection element and the water tank temperature detection element are arranged in the water tank (6), and the cooling plate temperature detection element is installed on the hot end surface of the semiconductor cooling plate B (9).

2. A novel cryolipolysis control system according to claim 1, characterized in that: It also includes a screen (1), which is communicatively connected with the controller (2).

3. A novel cryolipolysis control system according to claim 2, characterized in that: The handle temperature detection element is a temperature sensor A (10).

4. A novel cryolipolysis control system according to claim 2, characterized in that: The air pressure detection element is an air pressure sensor (13).

5. A novel cryolipolysis control system according to claim 2, characterized in that: The turbidity detection element is a turbidity sensor (14).

6. A novel cryolipolysis control system according to claim 2, characterized in that: The water tank temperature detection element is a temperature sensor B (11).

7. A novel cryolipolysis control system according to claim 2, characterized in that: The refrigeration fin temperature detection element is a temperature sensor C (12).

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