Monocrystalline silicon preparation sorting feeding table fragment removing device and using method thereof

Abstract

The invention relates to the technical field of single crystal silicon preparation sorting feeding table fragment removal, and discloses a single crystal silicon preparation sorting feeding table fragment removal device and a use method thereof, the single crystal silicon preparation sorting feeding table fragment removal device comprises a feeding table, and the middle of the feeding table is fixedly connected with a fixed table. A rotating disc rotates to drive a plurality of push rods on a transmission belt to rotate, when first extrusion columns on the push rods extrude a pressure extrusion plate, the first extrusion columns extrude an extrusion telescopic rod on one side of the pressure extrusion plate to contract, an extrusion spring is extruded to contract, and the elastic force of the extrusion spring is increased; the extrusion force of an extrusion spring on an extrusion arc piece at one end of an extrusion telescopic rod is increased, and the extrusion force between the extrusion arc piece and the side wall of the monocrystalline silicon piece is increased, so that on one hand, the monocrystalline silicon piece at the bottommost layer in the feeding barrel is separated from the other monocrystalline silicon pieces in the feeding barrel; therefore, friction between the monocrystalline silicon wafer at the bottommost layer and the bottoms of other monocrystalline silicon wafers is reduced, and scratches caused by friction on the surface of the monocrystalline silicon wafer at the bottommost layer are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of single crystal silicon preparation and sorting loading platform debris removal equipment, and in particular to a single crystal silicon preparation and sorting loading platform debris removal device and a use method thereof. Background Art

[0002] Single crystal silicon usually refers to a material formed by silicon atoms in a certain arrangement. Silicon is the most common and widely used semiconductor material. When molten silicon solidifies, silicon atoms are arranged in a diamond lattice to form crystal nuclei, which grow into crystal grains with the same crystal plane orientation to form single crystal silicon. As a relatively active non-metallic element crystal, single crystal silicon is an important component of crystal materials and is at the forefront of the development of new materials. The manufacturing of single crystal silicon materials must go through the following processes: quartz sand-metallurgical grade silicon-purification and refining-deposition of polycrystalline silicon ingots-single crystal silicon-silicon wafer cutting. Its main uses are as semiconductor materials and using solar photovoltaic power generation and heating. With the continuous maturity and improvement of semiconductor manufacturing technology, the cost of silicon wafer manufacturing has been continuously reduced, but the cost of silicon wafers used in solar cells has remained high. In the process of preparing single crystal silicon wafers, single crystal silicon wafer sorting equipment is involved, which is a device for efficiently removing unqualified single crystal silicon wafers.

[0003] The single crystal silicon rejection device under the existing technology usually needs to place several single crystal silicon wafers on the loading table. During the process of one-by-one inspection, friction or collision is likely to occur between the surfaces of several single crystal silicon wafers, thereby damaging the quality of the single crystal silicon wafers and increasing the unqualified rate of single crystal silicon wafer products. Summary of the invention

[0004] The object of the present invention is to provide a single crystal silicon preparation and sorting loading platform debris removal device and a method of using the same, so as to solve the problems raised in the above-mentioned background technology.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a single crystal silicon preparation and sorting loading platform debris removal device and a use method thereof, comprising a loading platform, a fixed platform is fixedly connected to the middle of the loading platform, a plurality of support legs are fixedly connected to the bottom of the fixed platform, a plurality of connecting plates are fixedly connected to the side wall of the loading platform, an end of the connecting plate away from the loading platform is fixedly connected to a feeding barrel, a plurality of single crystal silicon wafers are arranged inside the feeding barrel, and further comprising:

[0007] The material selection mechanism is pushed, and the material selection mechanism includes a fixed plate fixedly connected to the side wall of the fixed table, an end of the fixed plate away from the fixed table is fixedly connected to a driving motor 1, an output end of the driving motor 1 is fixedly connected to an output rotating shaft 1, and an end of the output rotating shaft 1 away from the driving motor 1 is fixedly connected to a rotating disk.

[0008] Furthermore, the material selection mechanism also includes a transmission belt connected to the rotating disk, a side wall of the transmission belt away from the driving motor is fixedly connected to a plurality of pushing rods, an outer wall of the feeding barrel is fixedly connected to a fixed block, and an image sensor is fixedly connected to the bottom of the fixed block.

[0009] Furthermore, an auxiliary sliding mechanism is arranged just above the loading platform, and the auxiliary sliding mechanism includes a plurality of fixing bars fixedly connected just above the loading platform, and a plurality of auxiliary rollers are rotatably connected to the side walls of the fixing bars.

[0010] Furthermore, a lifting mechanism is provided on the outer wall of the feed barrel, which includes an extrusion column 1 fixedly connected to both ends of the push rod, an end of the extrusion column 1 away from the push rod is fixedly connected to an extrusion column 2, a plurality of sliding grooves are provided on the outer wall of the feed barrel, an extrusion telescopic rod is slidably connected inside the sliding groove, an extrusion arc plate is slidably connected to the inner wall of the feed barrel, and the side of the extrusion arc plate away from the single crystal silicon wafer is fixedly connected to the extrusion telescopic rod.

[0011] Furthermore, the lifting mechanism also includes an extrusion spring sleeved on the end of the extrusion telescopic rod away from the extrusion arc piece, the end of the extrusion telescopic rod away from the extrusion arc piece is fixedly connected to a pressure extrusion plate, and the bottom of the pressure extrusion plate is fixedly connected to a lifting extrusion plate.

[0012] Furthermore, a rejection mechanism is provided in the middle part of the loading platform, and the rejection mechanism includes a driving motor 2 fixedly connected to the side wall of the fixed platform, the output end of the driving motor 2 is fixedly connected to an output shaft 2, the end of the output shaft 2 away from the driving motor 2 is connected to a rejection wheel, the outer wall of the rejection wheel is transmission-connected to a rejection conveyor belt, the rejection conveyor belt is made of elastic material, and the inner wall of the loading platform is fixedly connected to a bottom plate.

[0013] Furthermore, the rejection mechanism also includes a plurality of electric push rods fixedly connected to both sides of the base plate, the end of the electric push rod away from the base plate is rotatably connected to a plurality of linkage rods, the side wall of the loading platform is fixedly connected to a plurality of rejection telescopic rods, the end of the rejection telescopic rod away from the loading platform is fixedly connected to a connecting block, the end of the connecting block away from the rejection telescopic rod is rotatably connected to a rising roller, the end of the linkage rod away from the push plate is rotatably connected to the rising roller, and the end of the fixed platform away from the driving motor 2 is fixedly connected to a storage box.

[0014] The method for using the single crystal silicon preparation sorting loading platform debris removal device comprises the following steps:

[0015] S1: Push detection. When the push rod on the transmission belt rotates to the bottom of the feed barrel, the push rod can push out the single crystal silicon wafer at the bottom of the feed barrel. At this time, the push rod pushes the single crystal silicon wafer to slide along the top of the loading platform. At this time, the image sensor under the fixed block can take pictures and detect the surface of the single crystal silicon wafer.

[0016] S2: Auxiliary detection: the rotation of the transmission belt drives several push rods on the transmission belt to rotate. When the push rods on the transmission belt rotate to the bottom of the feeding barrel, the push rods can push out the single crystal silicon wafer at the bottom of the feeding barrel. At this time, the bottom of the single crystal silicon wafer contacts the auxiliary roller on the fixed bar.

[0017] S3: Auxiliary pushing, the rotation of the rotating disk drives several pushing rods on the transmission belt to rotate, when the extrusion column 1 on the pushing rod is squeezed by the pressure extrusion plate, the extrusion column 1 squeezes the extrusion telescopic rod on one side of the pressure extrusion plate to contract, the extrusion spring is squeezed and contracted, the elastic force of the extrusion spring increases, the extrusion arc sheet at one end of the extrusion telescopic rod is increased by the extrusion force of the extrusion spring, and the extrusion force between the extrusion arc sheet and the side wall of the single crystal silicon wafer increases. At this time, the extrusion column 2 on the extrusion column 1 is squeezed by the lifting extrusion plate, and the lifting extrusion plate is squeezed to drive the extrusion telescopic rod on the pressure extrusion plate to move upward along the sliding groove, and the extrusion telescopic rod drives the single crystal silicon wafer at one end of the extrusion arc sheet to slide upward along the inner wall of the feeding barrel;

[0018] S4: Reject unqualified products. The output end of the driving motor 2 rotates to drive the rejection wheel on the output shaft 2 to rotate. The rotation of the rejection wheel drives the rejection conveyor belt to rotate. When the image sensor detects that the single crystal silicon wafer is an unqualified product, the electric push rod starts and drives the push plate to move toward the end away from the electric push rod. The movement of the push plate drives the rising roller at one end of the linkage rod to move upward along the rejection telescopic rod. At this time, the rising roller drives the rejection conveyor belt to move upward until the surface of the rejection conveyor belt contacts the bottom of the unqualified single crystal silicon wafer. At this time, the rejection conveyor belt drives the unqualified single crystal silicon wafer to move toward the end close to the storage box, and the rejection conveyor belt transports the unqualified single crystal silicon wafer to the inside of the storage box.

[0019] The present invention has the following beneficial effects:

[0020] (1) The present invention provides a lifting mechanism, and the rotation of the rotating disk drives several pushing rods on the transmission belt to rotate. When the extrusion column 1 on the pushing rod is squeezed by the pressure extrusion plate, the extrusion column 1 squeezes the extrusion telescopic rod on one side of the pressure extrusion plate to contract, the extrusion spring is squeezed and contracted, the elastic force of the extrusion spring increases, and the extrusion arc sheet at one end of the extrusion telescopic rod is increased by the extrusion force of the extrusion spring, and the extrusion force between the extrusion arc sheet and the side wall of the single crystal silicon wafer increases. At this time, the extrusion column 2 on the extrusion column 1 is squeezed by the lifting extrusion plate, and the lifting extrusion plate is squeezed to drive the extrusion telescopic rod on the pressure extrusion plate to move upward along the sliding groove, and the extrusion telescopic rod drives the single crystal silicon wafer at one end of the extrusion arc sheet to slide upward along the inner wall of the feeding barrel. This arrangement is beneficial to separating the single crystal silicon wafer at the bottom layer in the feeding barrel from several other single crystal silicon wafers in the feeding barrel, thereby reducing the friction between the single crystal silicon wafer at the bottom layer and the bottom of other single crystal silicon wafers, thereby reducing the scratches on the surface of the single crystal silicon wafer at the bottom layer caused by friction, and on the other hand, it is beneficial for the single crystal silicon wafer at the bottom layer to slide out of the feeding barrel smoothly, thereby improving the working efficiency of the device.

[0021] (2) According to the present invention, when the single crystal silicon is prepared and the sorting loading table debris removal device is used, firstly, a plurality of single crystal silicon wafers to be processed are placed in the feed barrel, and then the drive motor 1 is started, and the output end of the drive motor 1 drives the output shaft 1 to rotate, and the rotation of the output shaft 1 drives the transmission belt on the rotating disk to rotate, and the rotation of the transmission belt drives a plurality of push rods on the transmission belt to rotate, and when the push rod on the transmission belt rotates to the bottom of the feed barrel, the push rod can push the single crystal silicon wafer at the bottom of the feed barrel, and then the push rod pushes the single crystal silicon wafer to slide along the top of the loading table, and then the image sensor under the fixed block can shoot and detect the surface of the single crystal silicon wafer, and by setting a pushing and selecting mechanism, the single crystal silicon wafer in the feed barrel can be continuously sent to the bottom of the image sensor for detection, thereby reducing the interference of personnel and improving the sorting efficiency of the device.

[0022] (3) In the present invention, an auxiliary sliding mechanism is provided. The rotation of the transmission belt drives a plurality of push rods on the transmission belt to rotate. When the push rods on the transmission belt rotate to the bottom of the feed barrel, the push rods can push out the single crystal silicon wafer at the bottom of the feed barrel. At this time, the bottom of the single crystal silicon wafer contacts the auxiliary roller on the fixed bar. Such a setting is conducive to the rolling friction between the single crystal silicon wafer and the auxiliary roller, avoiding the sliding friction between the bottom of the single crystal silicon wafer and the surface of the loading platform, thereby avoiding scratches on the bottom of the single crystal silicon wafer.

[0023] (4) The present invention sets a rejection mechanism. Since the image sensor is electrically connected to the electric push rod, the output end of the second driving motor rotates to drive the rejection wheel on the output shaft to rotate. The rotation of the rejection wheel drives the rejection conveyor belt to rotate. When the image sensor detects that the single crystal silicon wafer is an unqualified product, the electric push rod starts and drives the push plate to move toward the end away from the electric push rod. The movement of the push plate drives the rising roller at one end of the linkage rod to move upward along the rejection telescopic rod. At this time, the rising roller drives the rejection conveyor belt to move upward until the surface of the rejection conveyor belt contacts the bottom of the unqualified single crystal silicon wafer. At this time, the rejection conveyor belt drives the unqualified single crystal silicon wafer to move toward the end close to the storage box. The rejection conveyor belt conveys the unqualified single crystal silicon wafer to the inside of the storage box. This arrangement is conducive to timely rejection of unqualified single crystal silicon wafers.

[0024] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0026] Figure 1 It is a structural schematic diagram of the overall perspective of the present invention;

[0027] Figure 2 This is a schematic diagram of the overall structure of the second viewing angle of the present invention;

[0028] Figure 3 This is a schematic diagram of the structure of the material selection mechanism of the present invention;

[0029] Figure 4 For the present invention Figure 3 A magnified view of middle;

[0030] Figure 5 It is a schematic diagram of the lifting mechanism structure of the present invention;

[0031] Figure 6 It is a schematic diagram of the structure of the rejecting mechanism of the present invention;

[0032] Figure 7 It is a schematic diagram of the local structure of the rejecting mechanism of the present invention;

[0033] Figure 8 For the present invention Figure 7 Enlarged view of middle B;

[0034] Fig. 9 The figure is a flow chart of the method for using the present invention.

[0035] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0036] In the figure: 1. Loading platform; 11. Fixed platform; 12. Support legs; 13. Connecting plate; 14. Feeding barrel; 15. Monocrystalline silicon wafer; 2. Material selection mechanism; 201. Fixed plate; 202. Driving motor 1; 203. Output shaft 1; 204. Rotating disk; 205. Transmission belt; 206. Push rod; 207. Fixed block; 208. Image sensor; 3. Auxiliary sliding mechanism; 301. Fixed bar; 302. Auxiliary roller; 4. Lifting mechanism; 401. Extrusion column 1; 402. Extrusion Pressure column 2; 403, sliding groove; 404, extrusion arc plate; 405, extrusion telescopic rod; 406, extrusion spring; 407, pressure extrusion plate; 408, lifting extrusion plate; 5, rejection mechanism; 501, driving motor 2; 502, output shaft 2; 503, rejection wheel; 504, rejection conveyor belt; 505, bottom plate; 506, electric push rod; 507, push plate; 508, linkage rod; 509, rejection telescopic rod; 510, connecting block; 511, rising roller; 512, storage box. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Example 1, please refer to Figure 1-Figure 5 As shown, the present invention is a single crystal silicon preparation and sorting loading platform debris removal device and its use method, comprising a loading platform 1, a fixed platform 11 is fixedly connected to the middle of the loading platform 1, a plurality of support legs 12 are fixedly connected to the bottom of the fixed platform 11, a plurality of connecting plates 13 are fixedly connected to the side wall of the loading platform 1, an end of the connecting plate 13 away from the loading platform 1 is fixedly connected to a feed barrel 14, and a plurality of single crystal silicon wafers 15 are arranged inside the feed barrel 14, and further comprising:

[0039] The material selection mechanism 2 is pushed, and the material selection mechanism 2 includes a fixed plate 201 fixedly connected to the side wall of the fixed table 11, and the end of the fixed plate 201 away from the fixed table 11 is fixedly connected to a driving motor 202, the output end of the driving motor 202 is fixedly connected to an output shaft 203, and the end of the output shaft 203 away from the driving motor 202 is fixedly connected to a rotating disk 204.

[0040] The material selection mechanism 2 further comprises a transmission belt 205 which is connected to the rotating disk 204, and a plurality of push rods 206 are fixedly connected to the side wall of the transmission belt 205 away from the driving motor 202, and a fixed block 207 is fixedly connected to the outer wall of the feeding barrel 14, and an image sensor 208 is fixedly connected to the bottom of the fixed block 207. The function of this component is that when the single crystal silicon is used to prepare a fragment removal device for a sorting loading table, a plurality of single crystal silicon wafers 15 to be processed are first placed into the feeding barrel 14, and then the driving motor 202 is started, and the output end of the driving motor 202 drives the output shaft 203 to rotate, and the output shaft 203 rotates to drive the transmission belt 20 on the rotating disk 204 5 rotates, the transmission belt 205 rotates to drive several push rods 206 on the transmission belt 205 to rotate. When the push rods 206 on the transmission belt 205 rotate to the bottom of the feeding barrel 14, the push rods 206 can push out the single crystal silicon wafer 15 at the bottom of the feeding barrel 14. At this time, the push rods 206 push the single crystal silicon wafer 15 to slide along the top of the loading platform 1. At this time, the image sensor 208 under the fixed block 207 can shoot and detect the surface of the single crystal silicon wafer 15. By setting the pushing material selection mechanism 2, the single crystal silicon wafer 15 in the feeding barrel 14 can be continuously sent to the bottom of the image sensor 208 for detection, thereby reducing the interference of personnel and improving the sorting efficiency of the device.

[0041] An auxiliary sliding mechanism 3 is arranged directly above the loading platform 1. The auxiliary sliding mechanism 3 includes a plurality of fixed bars 301 fixedly connected directly above the loading platform 1. The side walls of the fixed bars 301 are rotatably connected to a plurality of auxiliary rollers 302. The function of this component is to arrange the auxiliary sliding mechanism 3, and the rotation of the transmission belt 205 drives the rotation of a plurality of push rods 206 on the transmission belt 205. When the push rod 206 on the transmission belt 205 rotates to directly below the feed barrel 14, the push rod 206 can push out the single crystal silicon wafer 15 at the bottom layer of the feed barrel 14. At this time, the bottom of the single crystal silicon wafer 15 contacts the auxiliary roller 302 on the fixed bar 301. This arrangement is conducive to the rolling friction between the single crystal silicon wafer 15 and the auxiliary roller 302, thereby avoiding sliding friction between the bottom of the single crystal silicon wafer 15 and the surface of the loading platform 1, thereby avoiding scratches on the bottom of the single crystal silicon wafer 15.

[0042] The outer wall of the feed barrel 14 is provided with a lifting mechanism 4, which includes an extrusion column 1 401 fixedly connected to both ends of the push rod 206, and the end of the extrusion column 1 401 away from the push rod 206 is fixedly connected to the extrusion column 2 402, and the outer wall of the feed barrel 14 is provided with a plurality of sliding grooves 403, and the sliding grooves 403 are slidably connected with an extrusion telescopic rod 405, and the inner wall of the feed barrel 14 is slidably connected with an extrusion arc plate 404, and the side of the extrusion arc plate 404 away from the single crystal silicon wafer 15 is fixedly connected to the extrusion telescopic rod 405.

[0043] The lifting mechanism 4 also includes an extrusion spring 406 sleeved on the end of the extrusion telescopic rod 405 away from the extrusion arc piece 404, and the end of the extrusion telescopic rod 405 away from the extrusion arc piece 404 is fixedly connected to a pressure extrusion plate 407, and the bottom of the pressure extrusion plate 407 is fixedly connected to a lifting extrusion plate 408. The function of this component is to set the lifting mechanism 4, and the rotation of the rotating disk 204 drives the several pushing rods 206 on the transmission belt 205 to rotate. When the extrusion column 401 on the pushing rod 206 is squeezed by the pressure extrusion plate 407, the extrusion column 401 squeezes the extrusion telescopic rod 405 on one side of the pressure extrusion plate 407 and contracts, the extrusion spring 406 is squeezed and contracted, and the elastic force of the extrusion spring 406 increases. The extrusion force of the extrusion arc piece 404 at one end of the extrusion telescopic rod 405 increases, and the extrusion arc piece 404 and the single The squeezing pressure on the side wall of the crystalline silicon wafer 15 increases. At this time, the squeezing column 2 402 on the squeezing column 1 401 and the lifting squeezing plate 408 are squeezed. The lifting squeezing plate 408 is squeezed to drive the squeezing telescopic rod 405 on the pressure squeezing plate 407 to move upward along the sliding groove 403. The squeezing telescopic rod 405 drives the single crystal silicon wafer 15 at one end of the squeezing arc plate 404 to slide upward along the inner wall of the feeding barrel 14. On the one hand, this arrangement is conducive to separating the single crystal silicon wafer 15 at the bottom layer in the feeding barrel 14 from several other single crystal silicon wafers 15 in the feeding barrel 14, thereby reducing the friction between the single crystal silicon wafer 15 at the bottom layer and the bottom of other single crystal silicon wafers 15, thereby reducing the scratches on the surface of the single crystal silicon wafer 15 at the bottom layer caused by friction. On the other hand, it is conducive to the single crystal silicon wafer 15 at the bottom layer to slide smoothly in and out of the feeding barrel 14, thereby improving the working efficiency of the device.

[0044] Embodiment 2 is different from Embodiment 1 in that: Figure 1-Figure 9 As shown, a rejection mechanism 5 is arranged in the middle of the loading platform 1, and the rejection mechanism 5 includes a driving motor 501 fixedly connected to the side wall of the fixed platform 11, and the output end of the driving motor 501 is fixedly connected to the output shaft 502, and the end of the output shaft 502 away from the driving motor 501 is connected to the rejection wheel 503, and the outer wall of the rejection wheel 503 is transmission-connected to the rejection conveyor belt 504, and the rejection conveyor belt 504 is made of elastic material, and the inner wall of the loading platform 1 is fixedly connected to the bottom plate 505.

[0045] The rejection mechanism 5 also includes a plurality of electric push rods 506 fixedly connected to both sides of the bottom plate 505, and the end of the electric push rod 506 away from the bottom plate 505 is rotatably connected to a plurality of linkage rods 508, and the side wall of the loading platform 1 is fixedly connected to a plurality of rejection telescopic rods 509, and the end of the rejection telescopic rod 509 away from the loading platform 1 is fixedly connected to a connecting block 510, and the end of the connecting block 510 away from the rejection telescopic rod 509 is rotatably connected to a rising roller 511, and the end of the linkage rod 508 away from the push plate 507 is rotatably connected to the rising roller 511, and the end of the fixed platform 11 away from the driving motor 2 501 is fixedly connected to a storage box 512. The function of this component is to set the rejection mechanism 5, and since the image sensor 208 is electrically connected to the electric push rod 506, at this time, the output end of the driving motor 2 501 rotates to drive the output shaft 2 502 The rejecting wheel 503 on the top rotates, and the rejecting wheel 503 rotates to drive the rejecting conveyor belt 504 to rotate. When the image sensor 208 detects that the single crystal silicon wafer 15 is an unqualified product, the electric push rod 506 starts and drives the push plate 507 to move toward the end away from the electric push rod 506. The movement of the push plate 507 drives the rising roller 511 at one end of the linkage rod 508 to move upward along the rejecting telescopic rod 509. At this time, the rising roller 511 drives the rejecting conveyor belt 504 to move upward until the surface of the rejecting conveyor belt 504 contacts the bottom of the unqualified single crystal silicon wafer 15. At this time, the rejecting conveyor belt 504 drives the unqualified single crystal silicon wafer 15 to move toward the end close to the storage box 512, and the rejecting conveyor belt 504 conveys the unqualified single crystal silicon wafer 15 to the inside of the storage box 512. This arrangement is conducive to timely rejecting unqualified single crystal silicon wafers 15.

[0046] The method for using the single crystal silicon preparation sorting loading platform debris removal device comprises the following steps:

[0047] S1: Push detection, when the push rod 206 on the transmission belt 205 rotates to the bottom of the feeding barrel 14, the push rod 206 can push out the single crystal silicon wafer 15 at the bottom of the feeding barrel 14, and then the push rod 206 pushes the single crystal silicon wafer 15 to slide along the top of the loading platform 1, and the image sensor 208 under the fixed block 207 can take pictures and detect the surface of the single crystal silicon wafer 15;

[0048] S2: Auxiliary detection: the transmission belt 205 rotates to drive several push rods 206 on the transmission belt 205 to rotate. When the push rods 206 on the transmission belt 205 rotate to the bottom of the feeding barrel 14, the push rods 206 can push out the single crystal silicon wafer 15 at the bottom of the feeding barrel 14. At this time, the bottom of the single crystal silicon wafer 15 contacts the auxiliary roller 302 on the fixed bar 301.

[0049] S3: Auxiliary pushing, the rotation of the rotating disk 204 drives several pushing rods 206 on the transmission belt 205 to rotate, when the squeezing column 1 401 on the pushing rod 206 is squeezed by the pressure squeezing plate 407, the squeezing column 1 401 squeezes the squeezing telescopic rod 405 on one side of the pressure squeezing plate 407 to contract, the squeezing spring 406 is squeezed and contracted, the elastic force of the squeezing spring 406 increases, the squeezing arc piece 404 at one end of the squeezing telescopic rod 405 is squeezed by the squeezing spring 406, and the squeezing force of the squeezing arc piece 404 and the side wall of the single crystal silicon wafer 15 increases. At this time, the squeezing column 2 402 on the squeezing column 1 401 is squeezed by the lifting squeezing plate 408, and the lifting squeezing plate 408 is squeezed to drive the squeezing telescopic rod 405 on the pressure squeezing plate 407 to move upward along the sliding groove 403, and the squeezing telescopic rod 405 drives the single crystal silicon wafer 15 at one end of the squeezing arc piece 404 to slide upward along the inner wall of the feeding barrel 14;

[0050] S4: Reject unqualified products. The output end of the driving motor 2 501 rotates to drive the rejection wheel 503 on the output shaft 2 502 to rotate. The rejection wheel 503 rotates to drive the rejection conveyor belt 504 to rotate. When the image sensor 208 detects that the single crystal silicon wafer 15 is an unqualified product, the electric push rod 506 starts and drives the push plate 507 to move toward the end away from the electric push rod 506. The movement of the push plate 507 drives the rising roller 511 at one end of the linkage rod 508 to move upward along the rejection telescopic rod 509. At this time, the rising roller 511 drives the rejection conveyor belt 504 to move upward until the surface of the rejection conveyor belt 504 contacts the bottom of the unqualified single crystal silicon wafer 15. At this time, the rejection conveyor belt 504 drives the unqualified single crystal silicon wafer 15 to move toward the end close to the storage box 512, and the rejection conveyor belt 504 conveys the unqualified single crystal silicon wafer 15 to the inside of the storage box 512.

[0051] A specific application of this embodiment is:

[0052] When the single crystal silicon is prepared and the sorting loading table debris removal device is used, firstly, several single crystal silicon wafers 15 to be processed are placed in the feeding barrel 14, and then the driving motor 202 is started, and the output end of the driving motor 202 drives the output shaft 203 to rotate, and the rotation of the output shaft 203 drives the transmission belt 205 on the rotating disk 204 to rotate, and the rotation of the transmission belt 205 drives several push rods 206 on the transmission belt 205 to rotate, and when the push rod 206 on the transmission belt 205 rotates to the bottom of the feeding barrel 14, the push rod 206 can push out the single crystal silicon wafer 15 at the bottom of the feeding barrel 14, and then the push rod 206 pushes the single crystal silicon wafer 15 to slide along the top of the loading table 1, and then the image sensor 208 directly below the fixed block 207 can shoot and detect the surface of the single crystal silicon wafer 15, By setting up a pushing material selection mechanism 2, the single crystal silicon wafer 15 inside the feed barrel 14 can be continuously sent to the bottom of the image sensor 208 for detection, thereby reducing human interference and improving the sorting efficiency of the device; by setting up an auxiliary sliding mechanism 3, the transmission belt 205 rotates to drive a number of push rods 206 on the transmission belt 205 to rotate. When the push rod 206 on the transmission belt 205 rotates to the bottom of the feed barrel 14, the push rod 206 can push out the single crystal silicon wafer 15 at the bottom of the feed barrel 14. At this time, the bottom of the single crystal silicon wafer 15 contacts the auxiliary roller 302 on the fixed bar 301. This arrangement is conducive to the rolling friction between the single crystal silicon wafer 15 and the auxiliary roller 302, avoiding sliding friction between the bottom of the single crystal silicon wafer 15 and the surface of the loading platform 1, thereby avoiding scratches on the bottom of the single crystal silicon wafer 15;

[0053] By setting the lifting mechanism 4, the rotation of the rotating disk 204 drives the several push rods 206 on the transmission belt 205 to rotate. When the extrusion column 1 401 on the push rod 206 is squeezed with the pressure extrusion plate 407, the extrusion column 1 401 squeezes the extrusion telescopic rod 405 on one side of the pressure extrusion plate 407 to contract, and the extrusion spring 406 is squeezed and contracted, and the elastic force of the extrusion spring 406 increases. The extrusion arc piece 404 at one end of the extrusion telescopic rod 405 is increased by the extrusion force of the extrusion spring 406, and the extrusion force between the extrusion arc piece 404 and the side wall of the single crystal silicon wafer 15 increases. At this time, the extrusion column 1 401 The second squeezing column 402 and the lifting squeezing plate 408 are squeezed, and the lifting squeezing plate 408 is squeezed to drive the squeezing telescopic rod 405 on the pressure squeezing plate 407 to move upward along the sliding groove 403, and the squeezing telescopic rod 405 drives the single crystal silicon slice 15 at one end of the squeezing arc piece 404 to slide upward along the inner wall of the feeding barrel 14. This arrangement is conducive to separating the single crystal silicon slice 15 at the bottom layer in the feeding barrel 14 from the other single crystal silicon slices 15 in the feeding barrel 14, thereby reducing the friction between the single crystal silicon slice 15 at the bottom layer and the bottom of other single crystal silicon slices 15, thereby reducing the single crystal silicon slice 15 at the bottom layer On the other hand, the surface of the wafer 15 is scratched by friction, which is beneficial for the bottom layer of the single crystal silicon wafer 15 to slide smoothly into and out of the barrel 14, thereby improving the working efficiency of the device; by setting the rejection mechanism 5, since the image sensor 208 is electrically connected to the electric push rod 506, the output end of the driving motor 2 501 rotates to drive the rejection wheel 503 on the output shaft 2 502 to rotate, and the rejection wheel 503 rotates to drive the rejection conveyor belt 504 to rotate. When the image sensor 208 detects that the single crystal silicon wafer 15 is a defective product, the electric push rod 506 starts and drives the push plate 507 to move away from the electric push rod 506. One end of the push rod 506 moves, and the push plate 507 moves to drive the rising roller 511 at one end of the linkage rod 508 to move upward along the rejection telescopic rod 509. At this time, the rising roller 511 drives the rejection conveyor belt 504 to move upward until the surface of the rejection conveyor belt 504 contacts the bottom of the unqualified single crystal silicon wafer 15. At this time, the rejection conveyor belt 504 drives the unqualified single crystal silicon wafer 15 to move toward one end close to the storage box 512, and the rejection conveyor belt 504 conveys the unqualified single crystal silicon wafer 15 to the inside of the storage box 512. This arrangement is conducive to timely rejection of unqualified single crystal silicon wafers 15.

[0054] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A single crystal silicon preparation and sorting loading platform debris removal device, comprising a loading platform (1), a fixed platform (11) is fixedly connected to the middle of the loading platform (1), a plurality of support legs (12) are fixedly connected to the bottom of the fixed platform (11), a plurality of connecting plates (13) are fixedly connected to the side walls of the loading platform (1), an end of the connecting plate (13) away from the loading platform (1) is fixedly connected to a feed barrel (14), and a plurality of single crystal silicon wafers (15) are arranged inside the feed barrel (14), characterized in that: Also includes: A material selection mechanism (2) is provided, wherein the material selection mechanism (2) comprises a fixed plate (201) fixedly connected to the side wall of a fixed platform (11), an end of the fixed plate (201) away from the fixed platform (11) is fixedly connected to a drive motor 1 (202), an output end of the drive motor 1 (202) is fixedly connected to an output shaft 1 (203), and an end of the output shaft 1 (203) away from the drive motor 1 (202) is fixedly connected to a rotating disk (204).

2. A single crystal silicon preparation and sorting loading platform debris removal device according to claim 1, characterized in that: The pushing and selecting mechanism (2) further comprises a transmission belt (205) which is transmission-connected to the rotating disk (204); a plurality of pushing rods (206) are fixedly connected to the side wall of the transmission belt (205) which is away from the driving motor (202); a fixing block (207) is fixedly connected to the outer wall of the feeding barrel (14); and an image sensor (208) is fixedly connected to the bottom of the fixing block (207).

3. A single crystal silicon preparation and sorting loading platform debris removal device according to claim 2, characterized in that: An auxiliary sliding mechanism (3) is arranged directly above the loading platform (1), and the auxiliary sliding mechanism (3) comprises a plurality of fixing bars (301) fixedly connected to the loading platform (1), and a plurality of auxiliary rollers (302) are rotatably connected to the side walls of the fixing bars (301).

4. The single crystal silicon preparation and sorting loading platform debris removal device according to claim 3, characterized in that: The outer wall of the feed barrel (14) is provided with a lifting mechanism (4), and the lifting mechanism (4) includes an extrusion column 1 (401) fixedly connected to both ends of a push rod (206), and one end of the extrusion column 1 (401) away from the push rod (206) is fixedly connected to an extrusion column 2 (402), and the outer wall of the feed barrel (14) is provided with a plurality of sliding grooves (403), and an extrusion telescopic rod (405) is slidably connected inside the sliding groove (403), and an extrusion arc plate (404) is slidably connected to the inner wall of the feed barrel (14), and the extrusion arc plate (404) is fixedly connected to the extrusion telescopic rod (405) on the side away from the single crystal silicon wafer (15).

5. The single crystal silicon preparation and sorting loading platform debris removal device according to claim 1, characterized in that: The lifting mechanism (4) further comprises an extrusion spring (406) sleeved on one end of the extrusion telescopic rod (405) away from the extrusion arc piece (404); the one end of the extrusion telescopic rod (405) away from the extrusion arc piece (404) is fixedly connected to a pressure extrusion plate (407); and the bottom of the pressure extrusion plate (407) is fixedly connected to a lifting extrusion plate (408).

6. The single crystal silicon preparation and sorting loading platform debris removal device according to claim 5, characterized in that: A rejection mechanism (5) is arranged in the middle of the loading platform (1), and the rejection mechanism (5) comprises a second driving motor (501) fixedly connected to the side wall of the fixed platform (11), the output end of the second driving motor (501) is fixedly connected to a second output shaft (502), the end of the second output shaft (502) away from the second driving motor (501) is connected to a rejection wheel (503), the outer wall of the rejection wheel (503) is transmission-connected to a rejection conveyor belt (504), and the rejection conveyor belt (504) is made of elastic material, and the inner wall of the loading platform (1) is fixedly connected to a bottom plate (505).

7. A single crystal silicon preparation and sorting loading platform debris removal device according to claim 6, characterized in that: The rejecting mechanism (5) also includes a plurality of electric push rods (506) fixedly connected to both sides of the bottom plate (505); one end of the electric push rod (506) away from the bottom plate (505) is rotatably connected to a plurality of linkage rods (508); a plurality of rejecting telescopic rods (509) are fixedly connected to the side wall of the loading platform (1); one end of the rejecting telescopic rod (509) away from the loading platform (1) is fixedly connected to a connecting block (510); one end of the connecting block (510) away from the rejecting telescopic rod (509) is rotatably connected to a rising roller (511); one end of the linkage rod (508) away from the push plate (507) is rotatably connected to the rising roller (511); and one end of the fixed platform (11) away from the driving motor 2 (501) is fixedly connected to a storage box (512).

8. A method for using a single crystal silicon preparation and sorting loading platform debris removal device, using the single crystal silicon preparation and sorting loading platform debris removal device as claimed in claim 7, characterized in that: It includes the following steps: S1: Push detection, when the push rod (206) on the transmission belt (205) rotates to the bottom of the feeding barrel (14), the push rod (206) can push out the single crystal silicon wafer (15) at the bottom of the feeding barrel (14), and then the push rod (206) pushes the single crystal silicon wafer (15) to slide along the top of the loading platform (1), and the image sensor (208) under the fixed block (207) can take pictures and detect the surface of the single crystal silicon wafer (15); S2: Auxiliary detection, the transmission belt (205) rotates to drive a plurality of push rods (206) on the transmission belt (205) to rotate. When the push rods (206) on the transmission belt (205) rotate to the bottom of the feed barrel (14), the push rods (206) can push out the single crystal silicon wafer (15) at the bottom of the feed barrel (14). At this time, the bottom of the single crystal silicon wafer (15) contacts the auxiliary roller (302) on the fixed bar (301); S3: Auxiliary pushing, the rotating disk (204) rotates to drive the plurality of pushing rods (206) on the transmission belt (205) to rotate, when the squeezing column 1 (401) on the pushing rod (206) is squeezed by the pressure squeezing plate (407), the squeezing column 1 (401) squeezes the squeezing telescopic rod (405) on one side of the pressure squeezing plate (407) to contract, the squeezing spring (406) is squeezed and contracted, the elastic force of the squeezing spring (406) increases, and the squeezing arc piece (404) at one end of the squeezing telescopic rod (405) is squeezed by the squeezing spring ( The extrusion pressure of the extrusion arc sheet (404) and the side wall of the single crystal silicon wafer (15) increases, and the extrusion column (402) on the extrusion column (401) and the lifting extrusion plate (408) are squeezed. The lifting extrusion plate (408) is squeezed to drive the extrusion telescopic rod (405) on the pressure extrusion plate (407) to move upward along the sliding groove (403). The extrusion telescopic rod (405) drives the single crystal silicon wafer (15) at one end of the extrusion arc sheet (404) to slide upward along the inner wall of the feeding barrel (14); S4: rejecting unqualified products, the output end of the second driving motor (501) rotates to drive the rejecting wheel (503) on the second output shaft (502) to rotate, and the rejecting wheel (503) rotates to drive the rejecting conveyor belt (504) to rotate. When the image sensor (208) detects that the single crystal silicon wafer (15) is an unqualified product, the electric push rod (506) starts and drives the push plate (507) to move toward the end away from the electric push rod (506), and the push plate (507) moves to drive the linkage rod (508) The rising roller (511) at one end moves upward along the rejection telescopic rod (509), and the rising roller (511) drives the rejection conveyor belt (504) to move upward until the surface of the rejection conveyor belt (504) contacts the bottom of the unqualified single crystal silicon wafer (15). At this time, the rejection conveyor belt (504) drives the unqualified single crystal silicon wafer (15) to move toward one end close to the storage box (512), and the rejection conveyor belt (504) conveys the unqualified single crystal silicon wafer (15) to the inside of the storage box (512).

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