Printed circuit board (PCB) laser splitting device

Abstract

The invention relates to the technical field of PCB splitting, in particular to a PCB laser splitting device which comprises a feeding conveyor and two carrying assemblies, each carrying assembly comprises a linear conveyor and a carrying table, each carrying table comprises a moving seat, a lifting plate and four lifting rods, the lifting plate is provided with a plurality of slag falling openings, the tail end of the feeding conveyor is provided with a transfer arm, and the tail end of the transfer arm is provided with a plurality of slag falling openings. Laser cutting heads are arranged in the middles of the two sets of linear conveyors, material taking pieces are arranged at the tail ends of the two sets of linear conveyors, each material taking piece comprises a first three-axis displacement table, a negative pressure adsorption piece and an elastic clamping piece, each elastic clamping piece comprises an elastic clamping jaw and four sets of elastic pressing rods, and a discharging conveyor is arranged beside each set of linear conveyors; when the PCB daughter boards are unloaded, the elastic clamping jaw on the material taking piece can firstly clamp the cut outer edge leftover materials, then the negative pressure adsorption piece can adsorb all the PCB daughter boards on the lifting board, and finally synchronous unloading of the outer edge leftover materials and the PCB daughter boards is achieved, so that the unloading efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board depaneling, and in particular to a PCB board laser depaneling device. Background Art

[0002] PCB depaneling, that is, the process of dividing a printed circuit board, is to cut a large motherboard or contiguous board into multiple small boards according to design requirements to facilitate subsequent assembly, testing and use.

[0003] There are many ways to separate PCB boards. The following are some commonly used methods: Mechanical cutting method: Use special tools and equipment, such as milling cutter type panel splitter, to cut along the predetermined cutting line. This method is suitable for mass production and has a fast cutting speed, but it requires professional equipment and operating technology.

[0004] V-CUT cutting method: Cut a V-shaped groove on the circuit board, and then break the circuit board into multiple small boards. This method is simple to operate and suitable for small batch production, but it has certain requirements on the material and thickness of the circuit board.

[0005] Drilling and cutting method: Drill holes in the circuit board and then use crack propagation to split the circuit board into multiple small boards. This method is suitable for circuit boards with special shapes, but requires professional equipment and technical support.

[0006] Laser cutting method: Use high-energy laser beams to accurately cut PCB circuit boards. Laser cutting has the characteristics of high precision and non-contact cutting, and is suitable for PCB circuit board cutting needs with extremely high precision requirements. However, the equipment cost is high and the technical requirements for operators are also high.

[0007] The existing Chinese patent with publication number CN116275567B discloses a PCB laser panel separation system and method, but the above patent and the prior art also have the following defects: First, after the PCB motherboard is laser cut, a circle of outer edge scraps and a number of waste materials will be cut out on the board, among which the waste materials are connecting strips connecting adjacent PCB sub-boards. In the above patents and traditional technologies, the cut waste materials cannot be removed during the cutting process, so the waste materials remaining in the carrier will affect the subsequent unloading of PCB sub-boards; Secondly, after the PCB motherboard is cut, it will be divided into several PCB daughter boards. When unloading the PCB daughter boards, the outer edge scraps need to be taken out. The traditional technology is to unload them in sections, that is, first take out the outer edge scraps on the carrier, and then unload the PCB daughter boards on the carrier. Although this method can unload all the sheets on the carrier, it will reduce the unloading efficiency.

[0008] Thirdly, most traditional PCB splitters have a carrier. Since it takes a certain amount of time for the PCB motherboard to be laser cut, the transfer arm that transfers the PCB motherboard can only be in standby mode when the PCB motherboard is being cut. After the PCB motherboard is cut, the PCB sub-board on the carrier needs to be unloaded. Therefore, the laser cutting head can only be in standby mode when unloading. In summary, the entire cutting process is discontinuous, and the laser cutting head and the transfer arm will be in a cutting state from time to time, which will eventually reduce production efficiency.

[0009] Therefore, it is necessary to provide a PCB laser panel separation device to solve the above problems. Summary of the invention

[0010] Based on this, it is necessary to provide a PCB laser panel separation device to address the existing technical problems.

[0011] In order to solve the problems of the prior art, the technical solution adopted by the present invention is: a PCB board laser board separation device, including a feed conveyor and two groups of carrier components, the two groups of carrier components are arranged at the end of the feed conveyor, and the two groups of carrier components are symmetrical about the feed conveyor, each group of carrier components includes a linear conveyor and a carrier, the carrier includes a shift seat, a lifting plate and four groups of lifting rods, the shift seat is arranged on the linear conveyor, the lifting plate is horizontally arranged in the shift seat, the four groups of lifting rods are arranged in the shift seat, and the four groups of lifting rods are respectively located at the four end corners of the lifting plate, a plurality of groups of slag dropping ports are arranged on the lifting plate, a No. 1 drop frame is arranged in each group of linear conveyors, and a No. 1 drop frame is arranged at the end of the feed conveyor A transfer arm capable of three-axis displacement, a laser cutting head capable of horizontal translation is arranged in the middle of the two groups of linear conveyors, and a material picking piece is arranged at the end of the two groups of linear conveyors, and the material picking piece includes a No. 1 three-axis displacement table, a negative pressure adsorption piece and an elastic clamping piece, the negative pressure adsorption piece includes several groups of adsorption heads arranged at the bottom of the No. 1 three-axis displacement table, the elastic clamping piece includes an elastic clamping claw and four groups of elastic pressing rods, the No. 1 three-axis displacement table is rectangular, and the four groups of elastic pressing rods are distributed in a matrix at the four end corners of the bottom of the No. 1 three-axis displacement table, and the elastic clamping claw is arranged on the outer edge of the bottom of the No. 1 three-axis displacement table, and a discharging conveyor is arranged on the side of each group of linear conveyors, and a No. 2 blanking frame is arranged on the side of the discharging conveyor.

[0012] Furthermore, each group of linear conveyors includes a support frame and two groups of linear drive components, the support frame includes two groups of strip support plates, each group of strip support plates is horizontal, the two groups of strip support plates are spaced apart in the horizontal direction, a No. 1 blanking frame is fixed between the two groups of strip support plates, the two groups of linear drive components are respectively arranged on the two groups of strip support plates, each group of linear drive components includes a slide rail and an electric slider, the slide rail is horizontally fixed on the corresponding strip support plate, the electric slider is arranged on the slide rail, the moving seat is horizontal, and both ends of the moving seat are formed with fixing ears, and each fixing ear is fixed on the corresponding electric slider.

[0013] Furthermore, a through groove is opened in the moving seat, and the lifting plate covers the through groove. Four No. 1 columnar sleeves distributed in a matrix are fixedly provided at the bottom of the moving seat, and four limiting columns are fixedly provided at the bottom of the lifting plate. Each limiting column passes downward through the corresponding No. 1 columnar sleeve, and the bottom of the lifting plate is erected on the top of the four No. 1 columnar sleeves, and the top of the lifting plate is lower than the top of the moving seat. A vertical through pipe is fixedly provided at the bottom of the moving seat, and the through pipe corresponds to several groups of slag dropping openings.

[0014] Furthermore, four No. 2 columnar sleeves distributed in a matrix are fixedly provided at the bottom of the moving seat, each lifting rod passes downward through the corresponding No. 2 columnar sleeve, and a No. 1 limiting circular plate is formed on the top of each lifting rod, which is downwardly in conflict with the top of the No. 2 columnar sleeve. A notch for avoiding the No. 1 limiting circular plate is opened on each end corner of the lifting plate, and four L-shaped connecting rods are provided at the bottom of the lifting plate, and the four L-shaped connecting rods correspond to the four lifting rods respectively. The vertical end of each L-shaped connecting rod is fixedly connected to the bottom of the lifting plate upward, and a vertical No. 3 columnar sleeve is formed on the horizontal end of each L-shaped connecting rod, and each lifting rod passes downward through the corresponding No. 3 columnar sleeve, and two horizontal plates are provided under the moving seat, and the two ends of each horizontal plate are fixedly connected to the lower ends of the two lifting rods respectively. Two groups of hydraulic cylinders located beside the No. 1 blanking frame are fixedly provided between the two groups of strip support plates, and each group of hydraulic cylinders is vertical.

[0015] Furthermore, each group of elastic pressing rods includes a vertical pole, a No. 1 spring and a No. 1 limit nut. Four limit sleeves are fixedly provided at the bottom of the No. 1 three-axis translation platform. The four limit sleeves respectively correspond to the four end corners of the No. 1 three-axis translation platform. Each vertical pole passes through the corresponding limit sleeve. A No. 2 limit circular plate is formed at the lower end of each vertical pole. The No. 1 limit nut is screwed on the upper end of the corresponding vertical pole. The No. 1 spring is sleeved on the vertical pole. The two ends of the No. 1 spring respectively conflict with the limit sleeve and the No. 2 limit circular plate.

[0016] Furthermore, the elastic clamp includes four groups of elastic hooks distributed in a matrix, each group of elastic hooks includes a fixed rod, a No. 2 spring, an L-shaped hook rod and a No. 2 limit nut. The fixed rod is horizontally arranged at the bottom of the No. 1 three-axis displacement platform, one end of the fixed rod is fixedly connected to the No. 1 three-axis displacement platform through a connecting plate, the L-shaped hook rod is arranged below the fixed rod, and a vertical slide plate is formed on the horizontal end of the L-shaped hook rod, and the fixed rod passes through the slide plate. The No. 2 limit nut is screwed on the end of the fixed rod away from the connecting plate, the No. 2 spring is sleeved on the fixed rod, and the No. 2 spring is respectively in conflict with the connecting plate and the slide plate, and a triangular hook head is formed on the vertical end of the L-shaped hook rod, and the hook head has an inclined surface and a flat surface.

[0017] Furthermore, each group of adsorption heads includes a No. 1 columnar seat and a No. 1 suction cup. The No. 1 columnar seat is vertically fixed to the bottom of the No. 1 three-axis translation table. The No. 1 suction cup is fixed to the bottom of the No. 1 columnar seat. The discharge conveyor includes a strip fixed table and a conveyor belt. The strip fixed table is fixed to the side of the support frame, and the conveyor belt is arranged in the strip fixed table.

[0018] Furthermore, each No. 2 blanking frame is provided with a resistance member on both sides, and the resistance member includes a horizontal pressure rod and a vertical frame, the vertical frame is fixed to the side of the No. 2 blanking frame, the horizontal pressure rod is fixed to the top of the vertical frame, and the horizontal pressure rod is located above the No. 2 blanking frame.

[0019] Furthermore, the feed conveyor includes two groups of belt conveyor platforms spaced apart in the horizontal direction, each group of belt conveyor platforms includes a bar bracket and a conveyor belt, the bar bracket is fixedly arranged below the transfer arm, the conveyor belt is arranged on the bar bracket, and a horizontal lifting platform is arranged between the two groups of bar brackets, the lifting platform is close to the starting end of the linear conveyor, and two cylinders respectively connected to the bar brackets are fixedly arranged below the lifting platform, and the output end of each cylinder is fixed upward to the lifting platform.

[0020] Furthermore, the transfer arm includes a No. 2 three-axis translation platform, four No. 2 columnar seats and four No. 2 suction cups. The No. 2 three-axis translation platform is horizontal, and the four No. 2 columnar seats are distributed in a matrix at the bottom of the No. 2 three-axis translation platform. Each No. 2 columnar seat is fixedly connected to the No. 2 three-axis translation platform, and each No. 2 suction cup is connected to the corresponding No. 2 columnar seat.

[0021] Compared with the prior art, the present invention has the following beneficial effects: First, the PCB motherboard is placed on the lifting plate in the transfer seat, and a slag drop opening corresponding to the connecting strip is opened on the lifting plate. After the PCB motherboard is cut, the cut connecting strip will directly fall down into the No. 1 blanking frame through the slag drop opening, so there is no need to worry about the impact of waste when unloading the PCB motherboard in the carrier later; Secondly, when unloading the PCB sub-boards, the elastic clamp on the material taking part will first clamp the cut outer edge scraps, and then the negative pressure adsorption part will adsorb all the PCB sub-boards on the lifting plate, and finally realize the synchronous unloading of the outer edge scraps and PCB sub-boards, so as to improve the unloading efficiency; Thirdly, the device has two carriers. When the PCB motherboard on one of the carriers is being cut, the PCB daughter board on the other carrier will be unloaded through the material picking piece. After unloading, the transfer arm will place the new PCB motherboard on the empty carrier. When the laser cutting head completes the current cutting, the laser cutting head will move horizontally to the other carrier to cut the new PCB motherboard. Ultimately, the production efficiency of PCB daughter boards can be improved in this way. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional structural schematic diagram of the present invention; Figure 2 It is a three-dimensional structural diagram of the feeding conveyor; Figure 3 It is a plan view of the infeed conveyor; Figure 4 It is a three-dimensional structural diagram of a linear conveyor; Figure 5 It is a three-dimensional structural diagram of the discharge conveyor and the No. 2 blanking frame; Figure 6 This is a schematic diagram of the three-dimensional structure of the carrier. Figure 1 ; Figure 7 This is a schematic diagram of the three-dimensional structure of the carrier. Figure 2 ; Figure 8 is a top view of the carrier; Fig. 9 yes Figure 8 Section view along line AA; Fig.10 yes Fig. 9 A1 is a partial enlarged schematic diagram; Fig.11 It is a three-dimensional structural schematic diagram of the shifting seat; Fig.12 It is a three-dimensional structural schematic diagram of the lifting plate; Fig.13 It is a schematic diagram of the three-dimensional structure of the transfer arm; Fig.14 This is a schematic diagram of the three-dimensional structure of the material picking part. Figure 1 ; Fig.15 yes Fig.14 A2 is a partial enlarged schematic diagram; Fig.16 This is a schematic diagram of the three-dimensional structure of the material picking part. Figure 2 ; Fig.17 yes Fig.16 A3 is a partial enlarged schematic diagram; Fig.18 It is a plan view of the material to be picked up; Fig.19 yes Fig.18 Sectional view along line BB; Fig. 20 yes Fig.19 A4 is a partial enlarged schematic diagram; Fig.21 It is a three-dimensional structural diagram of the PCB motherboard; Fig. 22 This is a schematic diagram of the three-dimensional structure after the outer edge scraps and PCB sub-board are ejected; Fig.23 It is a schematic diagram of the three-dimensional structure after the outer edge scraps are clamped by the elastic clamping claws.

[0023] The numbers in the figure are: 1. feeding conveyor; 2. linear conveyor; 3. carrier; 4. shifting seat; 5. lifting plate; 6. lifting rod; 7. slag outlet; 8. No. 1 blanking frame; 9. transfer arm; 10. laser cutting head; 11. material picking piece; 12. No. 1 three-axis displacement table; 13. discharging conveyor; 14. No. 2 blanking frame; 15. support frame; 16. strip support plate; 17. slide rail; 18. electric slide block; 19. fixing ear; 20. through groove; 21. No. 1 columnar sleeve; 22. limit column; 23. through pipe; 24. No. 2 columnar sleeve; 25. No. 1 limit circular plate; 26. notch; 27. L-shaped connecting rod; 28. No. 3 columnar sleeve; 29. ​​horizontal plate; 30. hydraulic cylinder; 31. Vertical pole; 32. No. 1 spring; 33. No. 1 limiting nut; 34. Limiting sleeve; 35. No. 2 limiting circular plate; 36. Fixed rod; 37. No. 2 spring; 38. L-shaped hook rod; 39. No. 2 limiting nut; 40. Connecting plate; 41. Slide plate; 42. Hook head; 43. Inclined surface; 44. Plane; 45. No. 1 columnar seat; 46. No. 1 suction cup; 47. Strip fixed platform; 48. Conveyor belt; 49. Horizontal pressure rod; 50. Vertical frame; 51. Strip bracket; 52. Conveyor belt; 53. Lifting support platform; 54. Cylinder; 55. No. 2 three-axis translation platform; 56. No. 2 columnar seat; 57. No. 2 suction cup; 58. Outer edge scraps; 59. Waste; 60. Through-hole. DETAILED DESCRIPTION

[0024] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0025] refer to Figures 1 to 23 The PCB laser depaneling device shown in the figure comprises a feed conveyor 1 and two sets of carrier assemblies, the two sets of carrier assemblies are arranged at the end of the feed conveyor 1, and the two sets of carrier assemblies are symmetrical with respect to the feed conveyor 1, each set of carrier assemblies comprises a linear conveyor 2 and a carrier 3, the carrier 3 comprises a shift seat 4, a lifting plate 5 and four sets of lifting rods 6 (combined with Figure 1 and Figure 6), the shift seat 4 is arranged on the linear conveyor 2, the lifting plate 5 is horizontally arranged in the shift seat 4, four groups of lifting rods 6 are arranged in the shift seat 4, and the four groups of lifting rods 6 are respectively located at the four end corners of the lifting plate 5, and a plurality of groups of slag dropping ports 7 are arranged on the lifting plate 5, and a No. 1 material dropping frame 8 is arranged in each group of linear conveyors 2, and a transfer arm 9 capable of three-axis displacement is arranged at the end of the feeding conveyor 1, and a laser cutting head 10 capable of horizontal translation is arranged in the middle of the two groups of linear conveyors 2, and a material picking piece 11 is arranged at the end of the two groups of linear conveyors 2, and the material picking piece 11 includes a No. 1 three-axis displacement platform 12, a negative pressure adsorption piece and an elastic clamping piece, and the negative pressure adsorption piece includes a plurality of groups of adsorption heads (such as Fig.14 As shown in the figure, the elastic clamping member includes an elastic clamping claw and four groups of elastic pressing rods. The No. 1 three-axis translation platform 12 is rectangular. The four groups of elastic pressing rods are distributed in a matrix at the four end corners of the bottom of the No. 1 three-axis translation platform 12. The elastic clamping claw is arranged on the outer edge of the bottom of the No. 1 three-axis translation platform 12. A discharge conveyor 13 is arranged next to each group of linear conveyors 2, and a No. 2 blanking frame 14 is arranged next to the discharge conveyor 13.

[0026] The PCB motherboard is transported to the bottom of the transfer arm 9 through the feed conveyor 1, and then the transfer arm 9 will transfer the PCB motherboard on the end of the feed conveyor 1 to the carrier 3 on one of the linear conveyors 2. During this process, the PCB motherboard is horizontally embedded in the corresponding shift seat 4, and the lifting plate 5 supports the middle part of the PCB motherboard. The four groups of lifting rods 6 correspond to the four end corners of the PCB motherboard respectively. When the PCB motherboard is located in the shift seat 4, the shift seat 4 will send the PCB motherboard to the bottom of the laser cutting head 10, and then the laser cutting head 10 will cut the PCB motherboard on the shift seat 4. The PCB motherboard will be cut into several groups of PCB sub-boards, and after the PCB motherboard is cut, a circle of outer edge scraps 58 and several wastes 59 (such as Fig.21As shown in the figure, the waste material 59 is a connecting strip connecting adjacent PCB sub-boards before cutting. After cutting, the waste material 59 will fall downward into the No. 1 blanking frame 8 through the corresponding slag drop port 7. After the PCB motherboard is cut, the shift seat 4 will drive the outer edge scraps 58 and several groups of PCB sub-boards to move to the end of the linear conveyor 2. At this time, the No. 1 three-axis displacement table 12 will move to the top of the shift seat 4, and the four groups of elastic pressing rods will correspond to the four groups of lifting rods 6 respectively. When the No. 1 three-axis displacement table 12 moves to the top of the shift seat 4, the four groups of lifting rods 6 will rise synchronously, and the lifting plate 5 will rise subsequently. At this time, the outer edge scraps 58 will The four groups of lifting rods 6 will be pushed out of the moving seat 4, and several groups of PCB sub-boards will be pushed out of the moving seat 4 by the lifting plate 5, and the outer edge scraps 58 will be higher than the PCB sub-boards. After that, the No. 1 three-axis translation platform 12 will descend, and the outer edge scraps 58 will be clamped between the four groups of lifting rods 6 and the four groups of elastic pressing rods. When the outer edge scraps 58 are pressed, the elastic clamps will clamp the outer edge scraps 58 on the No. 1 three-axis translation platform 12, and as the No. 1 three-axis translation platform 12 continues to descend, several groups of adsorption heads will adsorb several groups of PCB sub-boards on the No. 1 three-axis translation platform 12, and then the No. 1 three-axis translation platform 12 will be translated to the exit The transfer arm 9 and the first three-axis displacement platform 12 are connected to a first three-axis displacement device (not shown in the figure) and a second three-axis displacement device (not shown in the figure) respectively, and the laser cutting head 10 is connected to a transverse movement device (not shown in the figure). When the laser cutting head 10 is connected to the PC board on one of the displacement seats 4, the elastic clamping claws 58 are placed on the feed conveyor 13. At this time, several groups of adsorption heads will place the PCB sub-board on the discharge conveyor 13, and then the No. 1 three-axis displacement platform 12 will continue to move horizontally. When the No. 1 three-axis displacement platform 12 moves horizontally to the top of the No. 2 blanking frame 14, the elastic clamping claws will place the outer edge scraps 58 in the No. 2 blanking frame 14. Among them, the transfer arm 9 and the No. 1 three-axis displacement platform 12 are respectively connected to a No. 1 three-axis displacement device (not shown in the figure) and a No. 2 three-axis displacement device (not shown in the figure). The laser cutting head 10 is connected to a transverse movement device (not shown in the figure). When the laser cutting head 10 moves the PC board on one of the displacement seats 4, the elastic clamping claws 58 are placed on the feed conveyor 13. When the B motherboard is cut, the shift seat 4 will drive the PCB motherboard that has been cut to move to the bottom of the material picking piece 11. At this time, the material picking piece 11 will take out the outer edge scraps 58 and the PCB sub-board in the shift seat 4. Thereafter, the shift seat 4 will move horizontally toward the feed conveyor 1. When the shift seat 4 stops, the transfer arm 9 will transfer the PCB motherboard on the feed conveyor 1 to the current shift seat 4. Thereafter, the shift seat 4 will drive the new PCB motherboard to move to the vicinity of the laser cutting head 10 to wait for cutting. In this way, the laser cutting head 10 will move horizontally to the shift seat 4 next to it to cut the next PCB motherboard after cutting the current PCB motherboard.

[0027] In order to show the specific structure of the linear conveyor 2, the following features are set: Each group of linear conveyors 2 includes a support frame 15 and two groups of linear drive components. The support frame 15 includes two groups of strip support plates 16. Each group of strip support plates 16 is horizontal. The two groups of strip support plates 16 are spaced apart in the horizontal direction. The No. 1 blanking frame 8 is fixed between the two groups of strip support plates 16. The two groups of linear drive components are respectively arranged on the two groups of strip support plates 16. Each group of linear drive components includes a slide rail 17 and an electric slider 18. The slide rail 17 is horizontally fixed on the corresponding strip support plate 16. The electric slider 18 is arranged on the slide rail 17. The moving seat 4 is horizontal. Both ends of the moving seat 4 are formed with fixing ears 19, and each fixing ear 19 is fixed on the corresponding electric slider 18.

[0028] The shift seat 4 is installed between two electric sliders 18 through the fixing ears 19 at both ends thereof. The two electric sliders 18 are displaced synchronously to drive the entire shift seat 4 to translate. When the PCB motherboard on the feed conveyor 1 is transferred, the shift seat 4 will be driven by the electric slider 18 to the end close to the feed conveyor 1. When the PCB motherboard on the shift seat 4 is laser cut, the shift seat 4 will be driven by the electric slider 18 to the laser cutting head 10. When the PCB sub-board on the shift seat 4 is picked up, the shift seat 4 will be driven by the electric slider 18 to the picking piece 11.

[0029] In order to show how the lifting plate 5 is installed in the shifting seat 4, the following features are provided: A through slot 20 is provided in the shifting seat 4 (such as Fig.11 As shown, the lifting plate 5 covers the through slot 20, and the bottom of the shifting seat 4 is fixed with four No. 1 columnar sleeves 21 (as shown in FIG. Figure 7 As shown in the figure, four limiting columns 22 are fixedly provided at the bottom of the lifting plate 5, and each limiting column 22 passes downward through the corresponding No. 1 columnar sleeve 21. The bottom of the lifting plate 5 is placed on the top of the four No. 1 columnar sleeves 21, and the top of the lifting plate 5 is lower than the top of the moving seat 4. A vertical through pipe 23 is fixedly provided at the bottom of the moving seat 4, and the through pipe 23 corresponds to several groups of slag dropping openings 7.

[0030] When installing the lifting plate 5, lay the lifting plate 5 flat, and then insert the limiting column 22 arranged at the bottom of the lifting plate 5 downward into the corresponding No. 1 columnar sleeve 21, and finally the lifting plate 5 will be downwardly erected on the four No. 1 columnar sleeves 21, and when the lifting plate 5 is embedded in the shift seat 4, the top of the lifting plate 5 is lower than the top of the shift seat 4, so that an embedding groove for the PCB motherboard to be embedded is formed between the lifting plate 5 and the shift seat 4, and when the shift seat 4 is translated to the end close to the feed conveyor 1, the transfer arm 9 will transfer the PCB motherboard on the feed conveyor 1 to the embedding groove between the lifting plate 5 and the shift seat 4, and limit the left and right deviation of the PCB motherboard falling into the shift seat 4 through the embedding groove, and when the PCB motherboard is cut, the cut waste 59 will fall into the through pipe 23 from the corresponding slag outlet 7, and finally the waste 59 will be discharged downward from the through pipe 23 into the No. 1 blanking frame 8.

[0031] In order to show how the lifting rod 6 is installed in the shifting seat 4, the following features are provided: The bottom of the shifting seat 4 is fixedly provided with four second columnar sleeves 24 (such as Fig.10 As shown in FIG. 1 , each lifting rod 6 passes downward through the corresponding No. 2 columnar sleeve 24, and a No. 1 limiting circular plate 25 is formed on the top of each lifting rod 6 to contact the top of the No. 2 columnar sleeve 24 downward, and a notch 26 (as shown in FIG. 1 ) is provided on each end corner of the lifting plate 5 to avoid the No. 1 limiting circular plate 25. Figure 6 As shown in the figure, four L-shaped connecting rods 27 are provided at the bottom of the lifting plate 5, and the four L-shaped connecting rods 27 correspond to the four lifting rods 6 respectively. The vertical end of each L-shaped connecting rod 27 is fixedly connected to the bottom of the lifting plate 5 upwards, and a vertical No. 3 columnar sleeve 28 is formed on the horizontal end of each L-shaped connecting rod 27. Each lifting rod 6 passes downward through the corresponding No. 3 columnar sleeve 28. Two horizontal plates 29 are provided under the shift seat 4, and the two ends of each horizontal plate 29 are fixedly connected to the lower ends of the two lifting rods 6 respectively. Two groups of hydraulic cylinders 30 located beside the No. 1 blanking frame 8 are fixedly provided between the two groups of strip support plates 16, and each group of hydraulic cylinders 30 is vertical.

[0032] When installing the lifting rod 6, first install the No. 2 columnar sleeve 24 on the bottom of the shift seat 4, and then pass the vertical lifting rod 6 downward through the No. 2 columnar sleeve 24. After the lifting rod 6 passes through the No. 2 columnar sleeve 24, the No. 3 columnar sleeve 28 is upwardly sleeved on the lifting rod 6, and then the vertical end of the L-shaped connecting rod 27 is connected to the bottom of the lifting plate 5, and finally the two ends of the horizontal plate 29 are respectively fixed to the lower ends of the two lifting rods 6. When the PCB motherboard is cut, the shift seat 4 will be translated to the top of the two groups of hydraulic cylinders 30, and then the two groups of hydraulic cylinders 30 will be The output end will rise synchronously, thereby driving the two horizontal plates 29 to move upward respectively. When the two horizontal plates 29 move upward, the four lifting rods 6 will move upward synchronously, thereby ejecting the cut outer edge scraps 58 to the outside of the shift seat 4 through the four lifting rods 6. When the horizontal plate 29 rises to conflict with the third columnar sleeve 28, as the horizontal plate 29 continues to rise, the two horizontal plates 29 will drive the entire lifting plate 5 to rise through the four L-shaped connecting rods 27, so that the lifting plate 5 will eject the cut PCB sub-boards to the outside of the shift seat 4 (such as Fig. 22 As shown in the figure, since the lifting rod 6 rises first and the lifting plate 5 rises later, the ejected outer edge scraps 58 will be higher than several PCB sub-boards. Among them, when processing the horizontal plates 29, two through holes 60 are opened on each horizontal plate 29, and each through hole 60 is used for the corresponding limit column 22 to pass through.

[0033] In order to show the specific structure of each group of elastic pressing rods, the following features are set: Each set of elastic pressing rods includes a vertical rod 31, a No. 1 spring 32 and a No. 1 limiting nut 33. Four limiting sleeves 34 (such as Fig.16 As shown in the figure, four limit sleeves 34 respectively correspond to the four end corners of the No. 1 three-axis translation platform 12, each vertical rod 31 passes through the corresponding limit sleeve 34, and the lower end of each vertical rod 31 is formed with a No. 2 limit circular plate 35. The No. 1 limit nut 33 is screwed on the upper end of the corresponding vertical rod 31, and the No. 1 spring 32 is sleeved on the vertical rod 31. The two ends of the No. 1 spring 32 respectively conflict with the limit sleeve 34 and the No. 2 limit circular plate 35.

[0034] In the initial state, the release of the elastic force of the No. 1 spring 32 will drive the vertical rod 31 to descend until the No. 1 limit nut 33 is downwardly opposed to the top of the No. 1 three-axis translation platform 12, and the No. 1 limit nut 33 is used to prevent the vertical rod 31 from sliding out of the limit sleeve 34. When the No. 1 three-axis translation platform 12 descends, each vertical rod 31 is pressed downward toward the corresponding lifting rod 6, so that the four end corners of the outer edge scrap 58 held up by the lifting rod 6 will be pressed between the vertical rod 31 and the lifting rod 6. When the four end corners of the outer edge scrap 58 are pressed, the entire outer edge scrap 58 will be in a taut state, so as to facilitate the subsequent elastic clamp to clamp the entire outer edge scrap 58 downward.

[0035] In order to show the specific structure of the elastic clamp, the following features are set: The elastic clamp includes four groups of elastic hooks arranged in a matrix, each group of elastic hooks includes a fixing rod 36, a second spring 37, an L-shaped hook rod 38 and a second limiting nut 39, and the fixing rod 36 is horizontally arranged at the bottom of the first triaxial translation platform 12 (such as Fig.17 As shown in the figure, one end of the fixing rod 36 is fixedly connected to the No. 1 three-axis translation stage 12 through the connecting plate 40, and the L-shaped hook rod 38 is arranged below the fixing rod 36. A vertical slide plate 41 is formed on the horizontal end of the L-shaped hook rod 38. The fixing rod 36 passes through the slide plate 41. The No. 2 limit nut 39 is screwed on the end of the fixing rod 36 away from the connecting plate 40. The No. 2 spring 37 is sleeved on the fixing rod 36. The No. 2 spring 37 respectively contacts the connecting plate 40 and the slide plate 41. A triangular hook head 42 is formed on the vertical end of the L-shaped hook rod 38. The hook head 42 has an inclined surface 43 and a flat surface 44.

[0036] In the initial state, the second spring 37 releases its elastic force to drive the slide plate 41 to press against the second limit nut 39. When the first three-axis translation platform 12 descends, each upright pole 31 presses downward against the corresponding lifting rod 6, so that the four end corners of the outer edge scrap 58 held up by the lifting rod 6 will be pressed between the upright pole 31 and the lifting rod 6. When the four end corners of the outer edge scrap 58 are pressed, the entire outer edge scrap 58 will be in a taut state. Thereafter, when the first three-axis translation platform 12 continues to descend, The hook head 42 on each L-shaped hook rod 38 will press downward toward the side of the outer edge scrap 58. During this process, the inclined surface 43 on each hook head 42 will interfere with the side of the outer edge scrap 58. Through the interference, the L-shaped hook rod 38 will translate toward the outside of the outer edge scrap 58. Finally, the two sides of the outer edge scrap 58 will be clamped between the vertical ends of the two L-shaped hook rods 38, and the entire outer edge scrap 58 will be placed on the plane 44 of the four hook heads 42.

[0037] In order to show the specific structure of the material conveyor 13 and each group of adsorption heads, the following features are set: Each set of adsorption heads includes a first columnar seat 45 and a first suction cup 46. The first columnar seat 45 is vertically fixed to the bottom of the first three-axis displacement platform 12. The first suction cup 46 is fixed to the bottom of the first columnar seat 45. The discharge conveyor 13 includes a strip-shaped fixed platform 47 and a conveyor belt 48. The strip-shaped fixed platform 47 is fixed to the side of the support frame 15. The conveyor belt 48 is arranged in the strip-shaped fixed platform 47 (such as Figure 5 as shown).

[0038] Each No. 1 suction cup 46 is connected to a negative pressure tube (not shown in the figure), and several negative pressure tubes are connected to a negative pressure source (not shown in the figure). By turning the negative pressure source on and off, it is possible to control whether the No. 1 suction cup 46 generates suction. When the outer edge scrap 58 is clamped between the vertical ends of the two L-shaped hook rods 38, the No. 1 three-axis translation platform 12 continues to descend, so that the No. 1 suction cup 46 arranged on the No. 1 columnar seat 45 will adsorb the PCB sub-board on the lifting plate 5. When the PCB sub-board is adsorbed on the No. 1 suction cup 46, the No. 1 three-axis translation platform 12 will drive several PCB sub-boards to move to the top of the conveyor belt 48. At this time, the No. 1 suction cup 46 loses suction, and finally several PCB sub-boards will fall onto the conveyor belt 48, and the conveyor belt 48 will bring several PCB sub-boards to the next process.

[0039] In order to show how to make the elastic clamping jaws loosen the outer edge scrap 58, the following features are set: Each No. 2 blanking frame 14 is provided with a resistance member on both sides, and the resistance member includes a horizontal pressure rod 49 and a vertical frame 50. The vertical frame 50 is fixed to the side of the No. 2 blanking frame 14, and the horizontal pressure rod 49 is fixed to the top of the vertical frame 50, and the horizontal pressure rod 49 is located above the No. 2 blanking frame 14.

[0040] When the PCB sub-board falls from the No. 1 suction cup 46 onto the conveyor belt 48, the No. 1 three-axis translation table 12 moves horizontally toward the No. 2 blanking frame 14. When the entire No. 1 three-axis translation table 12 moves to the top of the No. 2 blanking frame 14, the No. 1 three-axis translation table 12 stops moving horizontally. At this time, the No. 1 three-axis translation table 12 rises, and the upper end of each vertical rod 31 will contact the horizontal pressure rod 49. Through the contact force of the horizontal pressure rod 49, the vertical rod 31 will press the outer edge scrap 58 clamped between the two L-shaped hook rods 38 into the No. 2 blanking frame 14.

[0041] In order to show the specific structure of the infeed conveyor 1, the following features are provided: The feed conveyor 1 includes two groups of belt conveyor platforms spaced apart in the horizontal direction, each group of belt conveyor platforms includes a strip bracket 51 and a conveying belt 52, the strip bracket 51 is fixedly arranged below the transfer arm 9, and the conveying belt 52 is arranged on the strip bracket 51, and a horizontal lifting platform 53 is arranged between the two groups of strip brackets 51, and the lifting platform 53 is close to the starting end of the linear conveyor 2, and two cylinders 54 respectively connected to the strip bracket 51 are fixedly arranged below the lifting platform 53, and the output end of each cylinder 54 is fixed upward to the lifting platform 53.

[0042] When conveying the PCB motherboard to the carrier 3, the PCB motherboard is placed horizontally between the two bar-shaped brackets 51, and the two ends of the PCB motherboard are respectively placed on the two conveyor belts 52, and then the PCB motherboard is driven to be transported forward by the conveyor belts 52. When the PCB motherboard is transported to the vicinity of the transfer arm 9, the two cylinders 54 will drive the lifting platform 53 to rise, so that the PCB motherboard will be lifted by the lifting platform 53, and then the lifted PCB motherboard will be transferred to the corresponding carrier 3 by the transfer arm 9.

[0043] In order to show the specific structure of the transfer arm 9, the following features are set: The transfer arm 9 includes a No. 2 three-axis displacement platform 55, four No. 2 columnar seats 56 and four No. 2 suction cups 57. The No. 2 three-axis displacement platform 55 is horizontal (such as Fig.13 As shown in the figure, four No. 2 columnar seats 56 are distributed in a matrix at the bottom of the No. 2 three-axis translation platform 55, each No. 2 columnar seat 56 is fixedly connected to the No. 2 three-axis translation platform 55, and each No. 2 suction cup 57 is connected to the corresponding No. 2 columnar seat 56.

[0044] When the PCB motherboard moves to the end of the feed conveyor 1, the No. 2 three-axis translation platform will move to the top of the PCB motherboard. Thereafter, the No. 2 three-axis translation platform 55 will descend to press the four No. 2 suction cups 57 onto the four end corners of the PCB motherboard. Since the PCB motherboard is lifted by the lifting platform 53 at this time, the PCB motherboard will eventually be adsorbed on the four No. 2 suction cups 57. After the PCB motherboard is adsorbed on the No. 2 suction cups 57, the No. 2 three-axis translation platform 55 will drive the PCB motherboard to be transferred to the corresponding carrier 3.

[0045] Working principle: The PCB motherboard is transported to the bottom of the transfer arm 9 through the feed conveyor 1, and then the transfer arm 9 will transfer the PCB motherboard on the end of the feed conveyor 1 to the carrier 3 on one of the linear conveyors 2. During this process, the PCB motherboard is horizontally embedded in the corresponding shift seat 4, and the lifting plate 5 supports the middle part of the PCB motherboard. The four groups of lifting rods 6 correspond to the four end corners of the PCB motherboard respectively. When the PCB motherboard is located in the shift seat 4, the shift seat 4 will send the PCB motherboard to the bottom of the laser cutting head 10, and then the laser cutting head 10 will cut the PCB motherboard on the shift seat 4. The PCB motherboard will be cut into several groups of PCB sub-boards, and the PCB motherboard will also form a circle of outer edge scraps 58 and several wastes 59 after cutting. Fig.21As shown, the waste 59 is a connecting strip connecting adjacent PCB sub-boards before cutting. After cutting, the waste 59 will fall downward into the No. 1 blanking frame 8 through the corresponding slag drop port 7. After the PCB motherboard is cut, the shift seat 4 will drive the outer edge scraps 58 and several groups of PCB sub-boards to move to the end of the linear conveyor 2. At this time, the No. 1 three-axis displacement table 12 will move to the top of the shift seat 4, and the four groups of elastic pressing rods correspond to the four groups of lifting rods 6 respectively. When the No. 1 three-axis displacement table 12 moves to the top of the shift seat 4, the four groups of lifting rods 6 rise synchronously, and the lifting plate 5 rises subsequently. At this time, the outer edge scraps 58 will be The four groups of lifting rods 6 are pushed out of the shifting seat 4, and several groups of PCB sub-boards are pushed out of the shifting seat 4 by the lifting plate 5, and the outer edge scraps 58 are higher than the PCB sub-boards. After that, the No. 1 three-axis translation platform 12 descends, and the outer edge scraps 58 are clamped between the four groups of lifting rods 6 and the four groups of elastic pressing rods. When the outer edge scraps 58 are pressed, the elastic clamps clamp the outer edge scraps 58 on the No. 1 three-axis translation platform 12, and as the No. 1 three-axis translation platform 12 continues to descend, several groups of adsorption heads adsorb several groups of PCB sub-boards on the No. 1 three-axis translation platform 12, and then the No. 1 three-axis translation platform 12 will be translated to the discharge port. On the conveyor 13, at this time, several groups of adsorption heads will place the PCB sub-board on the discharge conveyor 13, and then the No. 1 three-axis displacement table 12 will continue to move horizontally. When the No. 1 three-axis displacement table 12 moves horizontally to the top of the No. 2 blanking frame 14, the elastic clamp will place the outer edge scraps 58 in the No. 2 blanking frame 14, wherein the transfer arm 9 and the No. 1 three-axis displacement table 12 are respectively connected with a No. 1 three-axis displacement device (not shown in the figure) and a No. 2 three-axis displacement device (not shown in the figure), and the laser cutting head 10 is connected with a transverse movement device (not shown in the figure). When the laser cutting head 10 moves the PC on one of the shift seats 4 When the B motherboard is cut, the shift seat 4 will drive the PCB motherboard that has been cut to move to the bottom of the material picking piece 11. At this time, the material picking piece 11 will take out the outer edge scraps 58 and the PCB sub-board in the shift seat 4. Thereafter, the shift seat 4 will move horizontally toward the feed conveyor 1. When the shift seat 4 stops, the transfer arm 9 will transfer the PCB motherboard on the feed conveyor 1 to the current shift seat 4. Thereafter, the shift seat 4 will drive the new PCB motherboard to move to the vicinity of the laser cutting head 10 to wait for cutting. In this way, the laser cutting head 10 will move horizontally to the shift seat 4 next to it to cut the next PCB motherboard after cutting the current PCB motherboard.

[0046] The above embodiments only express one or several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the attached claims.

Claims

1. A PCB laser panel separation device, characterized in that: The invention comprises a feed conveyor (1) and two groups of transport components, wherein the two groups of transport components are arranged at the end of the feed conveyor (1), and the two groups of transport components are symmetrical with respect to the feed conveyor (1), each group of transport components comprises a linear conveyor (2) and a carrier (3), the carrier (3) comprises a shift seat (4), a lifting plate (5) and four groups of lifting rods (6), the shift seat (4) is arranged on the linear conveyor (2), the lifting plate (5) is arranged horizontally in the shift seat (4), the four groups of lifting rods (6) are arranged in the shift seat (4), and the four groups of lifting rods (6) are respectively located at the four end corners of the lifting plate (5), the lifting plate (5) is provided with a plurality of groups of slag drop ports (7), each group of linear conveyors (2) is provided with a first drop frame (8), and the end of the feed conveyor (1) is provided with a transfer arm (9) capable of three-axis displacement. A laser cutting head (10) capable of lateral translation is provided in the middle of the two groups of linear conveyors (2), and a material picking member (11) is provided at the end of the two groups of linear conveyors (2). The material picking member (11) comprises a No. 1 three-axis displacement platform (12), a negative pressure adsorption member and an elastic clamping member. The negative pressure adsorption member comprises a plurality of adsorption heads arranged at the bottom of the No. 1 three-axis displacement platform (12), and the elastic clamping member comprises an elastic clamping claw and four groups of elastic pressing rods. The No. 1 three-axis displacement platform (12) is rectangular, and the four groups of elastic pressing rods are distributed in a matrix at the four end corners of the bottom of the No. 1 three-axis displacement platform (12). The elastic clamping claw is arranged on the outer edge of the bottom of the No. 1 three-axis displacement platform (12). A discharging conveyor (13) is provided on the side of each group of linear conveyors (2), and a No. 2 blanking frame (14) is provided on the side of the discharging conveyor (13).

2. A PCB laser panel separation device according to claim 1, characterized in that: Each set of linear conveyors (2) comprises a support frame (15) and two sets of linear drive members, the support frame (15) comprises two sets of strip support plates (16), each set of strip support plates (16) is horizontal, the two sets of strip support plates (16) are spaced apart in the horizontal direction, a No. 1 blanking frame (8) is fixedly arranged between the two sets of strip support plates (16), the two sets of linear drive members are respectively arranged on the two sets of strip support plates (16), each set of linear drive members comprises a slide rail (17) and an electric slider (18), the slide rail (17) is horizontally fixed on the corresponding strip support plate (16), the electric slider (18) is arranged on the slide rail (17), the moving seat (4) is horizontal, and both ends of the moving seat (4) are formed with fixing ears (19), and each fixing ear (19) is fixed on the corresponding electric slider (18).

3. The PCB laser panel separation device according to claim 1, characterized in that: A through groove (20) is provided in the shift seat (4), and the lifting plate (5) covers the through groove (20). Four No. 1 columnar sleeves (21) distributed in a matrix are fixedly provided at the bottom of the shift seat (4). Four limiting columns (22) are fixedly provided at the bottom of the lifting plate (5), and each limiting column (22) passes downward through a corresponding No. 1 columnar sleeve (21). The bottom of the lifting plate (5) is mounted on the top of the four No. 1 columnar sleeves (21), and the top of the lifting plate (5) is lower than the top of the shift seat (4). A vertical through pipe (23) is fixedly provided at the bottom of the shift seat (4), and the through pipe (23) corresponds to a plurality of groups of slag drop openings (7).

4. The PCB laser panel separation device according to claim 2, characterized in that: Four No. 2 columnar sleeves (24) arranged in a matrix are fixedly provided at the bottom of the shift seat (4); each lifting rod (6) passes downward through the corresponding No. 2 columnar sleeve (24); the top of each lifting rod (6) is formed with a No. 1 limiting circular plate (25) which contacts the top of the No. 2 columnar sleeve (24) downward; each end corner of the lifting plate (5) is provided with a notch (26) for avoiding the No. 1 limiting circular plate (25); four L-shaped connecting rods (27) are provided at the bottom of the lifting plate (5); the four L-shaped connecting rods (27) correspond to the four lifting rods (6) respectively, and each L The vertical ends of the L-shaped connecting rods (27) are fixedly connected upward to the bottom of the lifting plate (5), and a vertical No. 3 columnar sleeve (28) is formed on the horizontal end of each L-shaped connecting rod (27). Each lifting rod (6) passes through the corresponding No. 3 columnar sleeve (28) downward. Two horizontal plates (29) are provided below the shift seat (4), and the two ends of each horizontal plate (29) are respectively fixedly connected to the lower ends of the two lifting rods (6). Two groups of hydraulic cylinders (30) located beside the No. 1 blanking frame (8) are fixedly provided between the two groups of strip support plates (16), and each group of hydraulic cylinders (30) is vertical.

5. The PCB laser panel separation device according to claim 1, characterized in that: Each set of elastic pressing rods comprises a vertical rod (31), a No. 1 spring (32) and a No. 1 limiting nut (33); four limiting sleeves (34) are fixedly provided at the bottom of the No. 1 three-axis displacement platform (12); the four limiting sleeves (34) respectively correspond to the four end corners of the No. 1 three-axis displacement platform (12); each vertical rod (31) passes through a corresponding limiting sleeve (34); a No. 2 limiting circular plate (35) is formed at the lower end of each vertical rod (31); the No. 1 limiting nut (33) is screwed onto the upper end of the corresponding vertical rod (31); the No. 1 spring (32) is sleeved on the vertical rod (31); and the two ends of the No. 1 spring (32) respectively contact the limiting sleeve (34) and the No. 2 limiting circular plate (35).

6. The PCB laser panel separation device according to claim 1, characterized in that: The elastic clamp comprises four groups of elastic hooks arranged in a matrix, each group of elastic hooks comprises a fixing rod (36), a second spring (37), an L-shaped hook rod (38) and a second limiting nut (39), the fixing rod (36) is horizontally arranged at the bottom of the first triaxial displacement platform (12), one end of the fixing rod (36) is fixedly connected to the first triaxial displacement platform (12) through a connecting plate (40), the L-shaped hook rod (38) is arranged below the fixing rod (36), and a nut is formed on the horizontal end of the L-shaped hook rod (38). A vertical slide plate (41) is provided, a fixing rod (36) passes through the slide plate (41), a second limit nut (39) is screwed on an end of the fixing rod (36) away from the connecting plate (40), a second spring (37) is sleeved on the fixing rod (36), the second spring (37) is respectively in contact with the connecting plate (40) and the slide plate (41), and a triangular hook head (42) is formed on the vertical end of the L-shaped hook rod (38), and the hook head (42) has an inclined surface (43) and a flat surface (44).

7. The PCB laser depaneling device according to claim 2, characterized in that: Each group of adsorption heads comprises a first columnar seat (45) and a first suction cup (46), wherein the first columnar seat (45) is vertically fixed to the bottom of a first three-axis displacement platform (12), and the first suction cup (46) is fixed to the bottom of the first columnar seat (45). The discharge conveyor (13) comprises a strip-shaped fixed platform (47) and a conveyor belt (48), wherein the strip-shaped fixed platform (47) is fixed to the side of the support frame (15), and the conveyor belt (48) is arranged in the strip-shaped fixed platform (47).

8. The PCB laser panel separation device according to claim 1, characterized in that: Both sides of each No. 2 blanking frame (14) are provided with a resistance member, the resistance member comprising a horizontal pressure rod (49) and a vertical frame (50), the vertical frame (50) is fixed to the side of the No. 2 blanking frame (14), the horizontal pressure rod (49) is fixed to the top of the vertical frame (50), and the horizontal pressure rod (49) is located above the No. 2 blanking frame (14).

9. The PCB laser depaneling device according to claim 1, characterized in that: The feed conveyor (1) comprises two groups of belt transport platforms spaced apart in the horizontal direction, each group of belt transport platforms comprises a strip support (51) and a conveyor belt (52), the strip support (51) is fixedly arranged below the transfer arm (9), the conveyor belt (52) is arranged on the strip support (51), a horizontal lifting platform (53) is arranged between the two groups of strip supports (51), the lifting platform (53) is close to the starting end of the linear conveyor (2), two cylinders (54) respectively connected to the strip support (51) are fixedly arranged below the lifting platform (53), and the output end of each cylinder (54) is fixed upward to the lifting platform (53).

10. The PCB laser panel separation device according to claim 1, characterized in that: The transfer arm (9) comprises a No. 2 three-axis displacement platform (55), four No. 2 columnar seats (56) and four No. 2 suction cups (57); the No. 2 three-axis displacement platform (55) is horizontal; the four No. 2 columnar seats (56) are distributed in a matrix at the bottom of the No. 2 three-axis displacement platform (55); each No. 2 columnar seat (56) is fixedly connected to the No. 2 three-axis displacement platform (55); and each No. 2 suction cup (57) is connected to a corresponding No. 2 columnar seat (56).

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