Surface grinding machining platform for semiconductor precision parts

Abstract

The invention discloses a surface grinding machining platform for semiconductor precision parts, and relates to the technical field of numerical control machine tools, the surface grinding machining platform for the semiconductor precision parts comprises a workbench, a lifting frame is fixedly mounted above the workbench, and a mounting plate is fixedly mounted at the output end of the lifting frame; the surface grinding machining platform comprises a mounting plate, a servo motor is fixedly mounted below the mounting plate, the surface grinding machining platform further comprises a grinding device, and the grinding device comprises a supporting plate, a rotating rod, a clamp, a fixing disc, a grinding disc, a bearing rod, a connecting rod, a sliding block and a limiting block. The condition that some areas are slightly abraded due to insufficient contact and other areas are excessively abraded is avoided, meanwhile, the situation that due to excessive grinding, the structural strength of parts is insufficient, and the failure risk in use is increased is avoided, and the product quality and the production efficiency are guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of numerically controlled machine tools, in particular to a surface grinding processing platform for semiconductor precision parts. Background Art

[0002] Surface grinding of semiconductor precision parts is one of the most critical links in the semiconductor manufacturing process, involving multiple high-precision processing technologies and equipment. This process is mainly used to ensure the smoothness, flatness and dimensional accuracy of the part surface to meet the requirements of subsequent processes.

[0003] The patent with patent announcement number CN218801457U relates to a CNC machine tool for precision grinding of dials, including a mineral workbench, a column and a slide seat are arranged above the workbench, a slide seat is provided on the slide, a turntable is installed on the slide, a support fixture is provided on the turntable, and the support fixture is used to clamp the workpiece; a lifting module is provided on the side of the column facing the slide, a rotating grinding assembly is installed below the lifting module through a connecting plate, a grinding disc is provided at the output end of the rotating grinding assembly, and the grinding disc is used for grinding the workpiece. This patent can control the position of the workpiece to be processed from multiple directions, and can also control the position of the grinding disc from multiple directions. The combination of the two can significantly enhance the flexibility of this machine tool and the diversity of processing orientations, can perform a full range of processing on the workpiece, and can be better used for grinding precision parts such as dials.

[0004] In the above patent, the position of the workpiece to be processed can be controlled from multiple directions, and the position of the grinding disc can also be controlled from multiple directions. The combination of the two can significantly enhance the flexibility of the machine tool and the diversity of processing orientations, and can perform full-range processing on the workpiece. It can be well used for grinding precision parts such as dials. However, when grinding the parts, there may be problems of insufficient grinding or excessive grinding, which in turn affects the structural strength of the parts. For this reason, a surface grinding processing platform for semiconductor precision parts with better grinding effect is designed. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a surface grinding processing platform for semiconductor precision parts, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a surface grinding processing platform for semiconductor precision parts, including a workbench, a lifting frame is fixedly installed above the workbench, a mounting plate is fixedly installed at the output end of the lifting frame, a servo motor is fixedly installed below the mounting plate, and also includes: a grinding device, the grinding device includes a support plate, a rotating rod, a clamp, a fixed disk, a grinding disk, a receiving rod, a connecting rod, a sliding block and a limit block, the grinding disk moves upward to drive the receiving rod to move upward, and the receiving rod moves upward to drive one end of the connecting rod to move upward, the support plate is fixedly installed above the workbench, and the rotating rod is fixedly installed on the output end of the lifting frame. The movable rod rotates and penetrates the left and right walls of the supporting plate, the clamp is fixedly installed on the end of the rotating rod away from the supporting plate, the fixed disk is fixedly installed on the output end of the servo motor, the grinding disk is slidably installed on the circumferential surface of the output end of the servo motor, the receiving rod slides and penetrates the upper and lower walls of the fixed disk, the connecting rod is rotatably installed inside the receiving rod, the sliding block is slidably installed above the fixed disk, a sliding groove is opened above the fixed disk, the limit block is slidably installed inside the sliding groove, the bottom of the receiving rod is fixedly connected to the grinding disk, the grinding disk moves downward to contact the parts and moves upward under its action, so that the grinding disk and the parts are in contact more fully.

[0007] According to the above technical solution, a spring is arranged between the fixed disk and the grinding disk, a telescopic elastic rod is fixedly installed on the inner wall of the slide groove, the free end of the telescopic elastic rod is fixedly connected to the limit block, the upper part of the limit block is arranged with a bevel surface, the limit block moves downward to squeeze the telescopic elastic rod to contract, and the telescopic elastic rod is reset after contraction to achieve the limitation of the sliding block.

[0008] The U-shaped rod is fixedly mounted on the surface of the pressure plate, the arc block is fixedly mounted on the circumferential surface of the rotating rod, the surface of the U-shaped rod is provided with a fixing groove, and the bump is slidably mounted on the inside of the fixing groove to realize and grind the other side of the part, thereby ensuring that both sides of the part can be fully ground and improving the applicability of the equipment.

[0009] According to the above technical solution, a second spring is arranged between the limit rod and the counterweight block, the movement of the protrusion away from the fixed groove is set as an arc surface, and a slot is opened under the pressure plate. When the mounting plate moves downward, it drives the pressure plate downward, and the downward movement of the pressure plate causes the slot to contact the counterweight block and achieve limiting.

[0010] According to the above technical solution, a telescopic elastic rod 2 is fixedly installed on the inner wall of the fixed groove, and the free end of the telescopic elastic rod 2 is fixedly connected to the protrusion. When the limiting rod rotates 180 degrees, it enters the interior of the limiting groove under the action of the spring 2 and realizes limiting.

[0011] According to the above technical scheme, a cleaning device for cleaning the surface of the fixture is arranged above the workbench, and the cleaning device includes a fixed frame and a sliding plate, the fixed frame is fixedly installed above the workbench, and the sliding plate is slidably installed on the inner wall of the fixed frame, and the cleaning device also includes an L-shaped rod, a partition, an air guide frame and a baffle, when the U-shaped rod moves downward, it contacts and squeezes the L-shaped rod to move downward, and the downward movement of the L-shaped rod drives the sliding plate to move downward, the L-shaped rod slides through the inner and outer walls of the fixed frame, the partition is slidably installed on the inner wall of the fixed frame, the air guide frame is fixedly installed on the side of the support plate close to the fixture, and the baffle is rotatably installed on the surface of the air guide frame, the air guide frame is connected to the fixed frame by a conduit, and the gas squeezed inside the fixed frame enters the interior of the air guide frame through the conduit and is discharged, and the discharged gas cleans impurities above the fixture and parts.

[0012] According to the above technical solution, a spring three is arranged between the sliding plate and the fixed frame, a telescopic elastic rod three is fixedly installed on the bottom of the inner wall of the fixed frame, the free end of the telescopic elastic rod three is fixedly connected to the partition, and a vent hole is opened on the surface of the partition. The sliding plate continues to move downward to contact and drive the partition to move downward, and the partition moves downward so that the vent hole on the surface coincides with the conduit.

[0013] According to the above technical solution, an air intake valve is arranged on the surface of the fixed frame, which allows outside air to enter the interior of the fixed frame. Air holes are arranged on the top of the fixed frame, which can maintain the stability of the sliding plate during the up and down movement.

[0014] The present invention provides a surface grinding processing platform for semiconductor precision parts. It has the following beneficial effects:

[0015] (1) The surface grinding processing platform of the semiconductor precision parts can make the grinding disk and the parts contact more fully under the action of the fixed disk, the receiving rod, the spring and the grinding disk, so as to avoid the situation that some areas are lightly worn and other areas are heavily worn due to insufficient contact. At the same time, the receiving rod is limited under the action of the connecting rod, the sliding block, the limit block and the telescopic spring rod, so as to avoid excessive grinding leading to insufficient structural strength of the parts, increase the risk of failure during use, and ensure product quality and production efficiency.

[0016] (2) The surface grinding processing platform for semiconductor precision parts can realize the flipping of the fixture and the parts under the action of the pressure plate, U-shaped rod, counterweight block, rotating rod, arc block and protrusion, and then grind the other side of the parts to ensure that both sides of the parts can be fully ground, thereby improving the applicability of the equipment. At the same time, the rotating rod can be limited under the action of the limit rod, limit groove and spring 2 to avoid shaking during the subsequent grinding process after the fixture is flipped.

[0017] (3) The surface grinding processing platform for semiconductor precision parts, under the action of the U-shaped rod, L-shaped rod, sliding plate, partition, telescopic spring rod and the air guide frame, allows the gas inside the fixed frame to be discharged to remove impurities above the fixture and the parts, avoiding foreign matter from remaining on the surface of the parts, making the parts contact with the grinding disc more uniform, thereby improving the grinding effect. At the same time, under the action of the baffle, foreign matter and impurities are prevented from entering the air guide frame during the grinding process to cause blockage, reducing subsequent maintenance costs and extending the service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 This is a schematic diagram of the position structure of the fixed disk and the grinding disk of the present invention;

[0020] Figure 3 For the present invention Figure 2 The enlarged structural diagram of part A in the middle;

[0021] Figure 4 This is a schematic diagram of the position structure of the support plate and the counterweight block of the present invention;

[0022] Figure 5 For the present invention Figure 4 The enlarged structural diagram of part B in the middle;

[0023] Figure 6 This is a schematic diagram of the position structure of the fixing frame and the partition of the present invention;

[0024] Figure 7 It is a schematic diagram of the position structure of the air guide frame and the baffle of the present invention.

[0025] In the figure: 1. workbench; 2. lifting frame; 3. mounting plate; 4. servo motor; 5. support plate; 6. rotating rod; 7. clamp; 8. fixed plate; 9. grinding plate; 10. receiving rod; 11. connecting rod; 12. sliding block; 13. limiting block; 14. spring one; 15. telescopic elastic rod one; 161. counterweight block; 162. pressure plate; 163. limiting groove; 164. limiting rod; 165. U-shaped rod; 166. arc block; 167. convex block; 168. spring two; 169. slot; 1610. telescopic elastic rod two; 171. fixed frame; 172. sliding plate; 173. L-shaped rod; 174. partition; 175. air guide frame; 176. baffle; 177. spring three; 178. telescopic elastic rod three; 179. vent. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] See also Figure 1-Figure 7 , one embodiment of the present invention is: a surface grinding processing platform for semiconductor precision parts, including a workbench 1, a lifting frame 2 is fixedly installed above the workbench 1, a mounting plate 3 is fixedly installed at the output end of the lifting frame 2, a servo motor 4 is fixedly installed below the mounting plate 3, and also includes: a grinding device, the grinding device includes a support plate 5, a rotating rod 6, a clamp 7, a fixed plate 8, a grinding plate 9, a receiving rod 10, a connecting rod 11, a sliding block 12 and a limit block 13, the grinding plate 9 moves upward to drive the receiving rod 10 to move upward, the receiving rod 10 moves upward to drive one end of the connecting rod 11 to move upward, the support plate 5 is fixedly installed above the workbench 1, and the rotating rod 6 rotates through the support plate 5 The left and right walls, the clamp 7 is fixedly installed at the end of the rotating rod 6 away from the support plate 5, the fixed disk 8 is fixedly installed at the output end of the servo motor 4, the grinding disk 9 is slidably installed on the circumferential surface of the output end of the servo motor 4, the receiving rod 10 slides through the upper and lower walls of the fixed disk 8, the connecting rod 11 is rotatably installed inside the receiving rod 10, the sliding block 12 is slidably installed above the fixed disk 8, a slide groove is opened above the fixed disk 8, and the limit block 13 is slidably installed inside the slide groove, and the bottom of the receiving rod 10 is fixedly connected to the grinding disk 9, the grinding disk 9 moves downward to contact the parts and moves upward under its action, so that the grinding disk 9 is in contact with the parts more fully, avoiding lighter wear in certain areas due to insufficient contact.

[0028] A spring 14 is arranged between the fixed disk 8 and the grinding disk 9, and a telescopic elastic rod 15 is fixedly installed on the inner wall of the slide groove. The free end of the telescopic elastic rod 15 is fixedly connected to the limit block 13, and the upper part of the limit block 13 is arranged with a chamfered surface. The limit block 13 moves downward to squeeze the telescopic elastic rod 15 to contract, and the telescopic elastic rod 15 is reset after contraction to achieve the limitation of the sliding block 12, which can avoid excessive grinding resulting in insufficient strength of the part structure, increase the risk of failure during use, and ensure product quality and production efficiency.

[0029] When the present embodiment is working, the part is fixed by the clamp 7, and then the lifting frame 2 is started, the output end of the lifting frame 2 moves downward to drive the mounting plate 3 to move downward, the mounting plate 3 moves downward to drive the servo motor 4 to move downward, the servo motor 4 moves downward to drive the grinding disc 9 to move downward, the grinding disc 9 moves downward to contact the part and moves upward under its action, the grinding disc 9 moves upward to drive the receiving rod 10 to move upward, the receiving rod 10 moves upward to drive one end of the connecting rod 11 to move upward, one end of the connecting rod 11 moves upward to make the other end move toward the direction close to the output end of the servo motor 4, the other end of the connecting rod 11 moves to drive the sliding block 12 to move, the sliding block 12 moves to contact the part The beveled surface of the limit block 13 drives it to move downward, and the limit block 13 moves downward to squeeze the telescopic elastic rod 15 to contract. The telescopic elastic rod 15 is retracted and reset to limit the sliding block 12. When the servo motor 4 is started, the output end of the servo motor 4 rotates to drive the grinding disc 9 to rotate. The grinding disc 9 rotates to grind the parts, which can make the grinding disc 9 contact with the parts more fully, avoiding the situation where some areas are lighter due to insufficient contact, while other areas are too heavy, thereby causing uneven distribution of surface hardness, affecting the service life of the parts, and at the same time avoiding excessive grinding that leads to insufficient structural strength of the parts, increasing the risk of failure during use, and ensuring product quality and production efficiency.

[0030] See also Figure 1-Figure 7On the basis of the above embodiment, in another embodiment of the present invention, a flipping device for flipping the clamp 7 is provided on the surface of the support plate 5, and the flipping device includes a counterweight block 161 and a pressure plate 162, the counterweight block 161 is fixedly mounted on the end of the rotating rod 6 away from the clamp 7, and the pressure plate 162 is fixedly mounted below the mounting plate 3, and the flipping device also includes a limiting groove 163, a limiting rod 164, a U-shaped rod 165, an arc block 166 and a protrusion 167, the output end of the lifting frame 2 moves upward to drive the mounting plate 3 to move upward, the mounting plate 3 moves upward to drive the pressure plate 162 to move upward, and the pressure plate 162 moves upward to drive the U-shaped rod 165 moves upward, the limit groove 163 is opened on the side of the support plate 5 close to the counterweight block 161, the limit rod 164 slides through the left and right walls of the counterweight block 161, the U-shaped rod 165 is fixedly installed on the surface of the pressure plate 162, the arc block 166 is fixedly installed on the circumferential surface of the rotating rod 6, and the surface of the U-shaped rod 165 is provided with a fixing groove, and the protrusion 167 is slidably installed inside the fixing groove, so as to realize and grind the other side of the part, ensure that both sides of the part can be fully ground, improve the applicability of the equipment, and do not need the staff to manually turn over, reduce the work intensity of the staff and increase the overall performance and production efficiency of the parts.

[0031] A spring 168 is arranged between the limiting rod 164 and the counterweight block 161, and the movement of the protrusion 167 away from the fixed groove is set to an arc surface. A slot 169 is opened under the pressure plate 162. When the mounting plate 3 moves downward, it drives the pressure plate 162 to move downward. The downward movement of the pressure plate 162 makes the slot 169 contact the counterweight block 161 and realizes the limiting, thereby avoiding shaking caused by the rotation of the rotating rod 6 during grinding.

[0032] A telescopic spring rod 1610 is fixedly installed on the inner wall of the fixed groove, and the free end of the telescopic spring rod 1610 is fixedly connected to the protrusion 167. When the limit rod 164 rotates 180 degrees, it enters the interior of the limit groove 163 under the action of the spring 168 and realizes the limit, thereby preventing the clamp 7 from shaking during the subsequent grinding process after being turned over.

[0033] A cleaning device for cleaning the surface of the fixture 7 is provided above the workbench 1. The cleaning device includes a fixed frame 171 and a sliding plate 172. The fixed frame 171 is fixedly installed above the workbench 1. The sliding plate 172 is slidably installed on the inner wall of the fixed frame 171. The cleaning device also includes an L-shaped rod 173, a partition 174, an air guide frame 175 and a baffle 176. When the U-shaped rod 165 moves downward, it contacts and presses the L-shaped rod 173 to move downward. The L-shaped rod 173 moves downward to drive the sliding plate 172 to move downward. The L-shaped rod 173 slides through the fixed frame 1 The inner and outer walls of the fixed frame 171 are provided with a partition plate 174 which is slidably mounted on the inner wall of the fixed frame 171; the air guide frame 175 is fixedly mounted on the side of the support plate 5 close to the clamp 7; the baffle plate 176 is rotatably mounted on the surface of the air guide frame 175; the air guide frame 175 is connected to the fixed frame 171 through a conduit; the gas squeezed inside the fixed frame 171 enters the inside of the air guide frame 175 through the conduit and is discharged; the discharged gas removes impurities from the top of the clamp 7 and the parts to prevent foreign matter from remaining on the surface of the parts, so that the parts are in contact with the grinding disc 9 more evenly, thereby improving the grinding effect.

[0034] A spring three 177 is provided between the sliding plate 172 and the fixed frame 171, and a telescopic elastic rod three 178 is fixedly installed on the bottom of the inner wall of the fixed frame 171. The free end of the telescopic elastic rod three 178 is fixedly connected to the partition 174, and a vent hole 179 is opened on the surface of the partition 174. The sliding plate 172 continues to move downward to contact and drive the partition 174 to move downward. The partition 174 moves downward so that the vent hole 179 on the surface coincides with the conduit. At this time, the squeezed gas inside the fixed frame 171 enters the interior of the gas guide frame 175 through the conduit and is discharged.

[0035] An air intake valve is provided on the surface of the fixed frame 171 , which allows outside air to enter the interior of the fixed frame 171 . An air hole is provided on the top of the fixed frame 171 , which can maintain the stability of the sliding plate 172 during the up and down movement.

[0036] When the present embodiment is working, the mounting plate 3 moves downward, driving the pressing plate 162 to move downward. The pressing plate 162 moves downward, causing the slot 169 to contact the counterweight 161 and realize the limit position, so as to avoid the shaking of the rotating rod 6 during the grinding, thereby affecting the grinding effect of the part. At the same time, when one side of the part is ground, the output end of the lifting frame 2 moves upward, driving the mounting plate 3 to move upward. The mounting plate 3 moves upward, driving the pressing plate 162 to move upward. The pressing plate 162 moves upward, driving the U-shaped rod 165 to move upward. The U-shaped rod 165 moves upward, driving the protrusion 167 to move upward. The protrusion 167 moves upward, contacts and drives the arc block 166 to rotate. The arc block 166 rotates and drives The rotating rod 6 rotates, and the rotating rod 6 drives the clamp 7 to rotate. The rotation of the clamp 7 drives the part to rotate and turn over. The rotating rod 6 drives the counterweight block 161 to rotate. The counterweight block 161 drives the limiting rod 164 to rotate. When the limiting rod 164 rotates one hundred and eighty degrees, it enters the limiting groove 163 under the action of the spring 168 and realizes the limit, so as to avoid the shaking of the clamp 7 during the subsequent grinding process after turning over, and then realize and grind the other side of the part, ensuring that both sides of the part can be fully ground, improving the applicability of the equipment, and eliminating the need for manual turning by the staff, reducing the work intensity of the staff and increasing the overall performance and production efficiency of the part.

[0037] When the U-shaped rod 165 moves downward, it contacts and squeezes the L-shaped rod 173 to move downward. The L-shaped rod 173 moves downward, driving the sliding plate 172 to move downward. The sliding plate 172 moves downward to squeeze the gas inside the fixed frame 171 and increase the air pressure. The sliding plate 172 continues to move downward, contacts and drives the partition 174 to move downward. The partition 174 moves downward so that the vent hole 179 on the surface coincides with the conduit. At this time, the gas squeezed inside the fixed frame 171 enters the interior of the air guide frame 175 through the conduit and is discharged. The discharged gas removes impurities from the top of the clamp 7 and the parts to prevent foreign matter from remaining on the surface of the parts, so that the parts are in contact with the grinding disc 9 more evenly, thereby improving the grinding effect. Under the action of the partition 174, the impact force of gas discharge can be effectively increased, and the impurity removal effect can be improved. At the same time, when the gas is discharged, it contacts and drives the baffle 176 to rotate. The baffle 176 is reset after rotation, which can effectively prevent foreign matter and impurities from entering the interior of the air guide frame 175 and causing blockage during the grinding process, thereby reducing subsequent maintenance costs and extending the service life of the equipment.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A surface grinding processing platform for semiconductor precision parts, comprising a workbench (1), a lifting frame (2) is fixedly installed above the workbench (1), a mounting plate (3) is fixedly installed at the output end of the lifting frame (2), and a servo motor (4) is fixedly installed below the mounting plate (3), characterized in that: Also includes: A grinding device, the grinding device comprising a support plate (5), a rotating rod (6), a clamp (7), a fixed disk (8), a grinding disk (9), a receiving rod (10), a connecting rod (11), a sliding block (12) and a limit block (13), wherein the support plate (5) is fixedly mounted above a workbench (1), the rotating rod (6) rotates through the left and right walls of the support plate (5), the clamp (7) is fixedly mounted on one end of the rotating rod (6) away from the support plate (5), and the fixed disk (8) is fixedly mounted on the servo motor. The output end of the servo motor (4), the grinding disc (9) is slidably mounted on the circumferential surface of the output end of the servo motor (4), the receiving rod (10) slides through the upper and lower walls of the fixed disc (8), the connecting rod (11) is rotatably mounted inside the receiving rod (10), the sliding block (12) is slidably mounted above the fixed disc (8), a sliding groove is provided above the fixed disc (8), the limiting block (13) is slidably mounted inside the sliding groove, and the lower side of the receiving rod (10) is fixedly connected to the grinding disc (9); Wherein, a turning device for turning over the clamp (7) is provided on the surface of the support plate (5), and the turning device comprises a counterweight block (161) and a pressure plate (162), wherein the counterweight block (161) is fixedly mounted on an end of the rotating rod (6) away from the clamp (7), and the pressure plate (162) is fixedly mounted below the mounting plate (3); Wherein, a de-dusting device for de-dusting the surface of the fixture (7) is arranged above the workbench (1), and the de-dusting device comprises a fixed frame (171) and a sliding plate (172), wherein the fixed frame (171) is fixedly mounted above the workbench (1), and the sliding plate (172) is slidably mounted on the inner wall of the fixed frame (171).

2. A surface grinding processing platform for semiconductor precision parts according to claim 1, characterized in that: A spring (14) is provided between the fixed disk (8) and the grinding disk (9); a telescopic spring rod (15) is fixedly mounted on the inner wall of the slide groove; the free end of the telescopic spring rod (15) is fixedly connected to a limit block (13); and the upper portion of the limit block (13) is provided with a beveled surface.

3. A surface grinding processing platform for semiconductor precision parts according to claim 2, characterized in that: The turning device further comprises a limit groove (163), a limit rod (164), a U-shaped rod (165), an arc block (166) and a protrusion (167); the limit groove (163) is arranged on a side of the support plate (5) close to the counterweight block (161); the limit rod (164) slides through the left and right walls of the counterweight block (161); the U-shaped rod (165) is fixedly mounted on the surface of the pressure plate (162); the arc block (166) is fixedly mounted on the circumferential surface of the rotating rod (6); a fixed groove is arranged on the surface of the U-shaped rod (165); and the protrusion (167) is slidably mounted inside the fixed groove.

4. A surface grinding processing platform for semiconductor precision parts according to claim 3, characterized in that: A second spring (168) is provided between the limiting rod (164) and the counterweight block (161); the projection (167) is arranged to move away from the fixing groove in an arc surface; and a clamping groove (169) is provided below the pressure plate (162).

5. The surface grinding processing platform for semiconductor precision parts according to claim 4, characterized in that: A second telescopic elastic rod (1610) is fixedly mounted on the inner wall of the fixing groove, and a free end of the second telescopic elastic rod (1610) is fixedly connected to the protrusion (167).

6. A surface grinding processing platform for semiconductor precision parts according to claim 5, characterized in that: The impurity removal device further comprises an L-shaped rod (173), a partition (174), an air guide frame (175) and a baffle (176); the L-shaped rod (173) slides through the inner and outer walls of the fixed frame (171); the partition (174) is slidably mounted on the inner wall of the fixed frame (171); the air guide frame (175) is fixedly mounted on a side of the support plate (5) close to the clamp (7); the baffle (176) is rotatably mounted on the surface of the air guide frame (175); and the air guide frame (175) and the fixed frame (171) are connected via a conduit.

7. The surface grinding processing platform for semiconductor precision parts according to claim 6, characterized in that: A spring three (177) is provided between the sliding plate (172) and the fixed frame (171); a telescopic elastic rod three (178) is fixedly installed at the bottom of the inner wall of the fixed frame (171); a free end of the telescopic elastic rod three (178) is fixedly connected to the partition (174); and a vent hole (179) is provided on the surface of the partition (174).

8. The surface grinding processing platform for semiconductor precision parts according to claim 7, characterized in that: An air intake valve is provided on the surface of the fixing frame (171), and an air hole is provided above the fixing frame (171).

Images