Wafer grinding and polishing device for mobile phone chip processing

Abstract

The invention relates to the technical field of wafer grinding and polishing, in particular to a wafer grinding and polishing device for mobile phone chip machining. Comprising a shell, the shell is fixedly connected with a mounting plate, the mounting plate is provided with a hydraulic push rod, the telescopic end of the hydraulic push rod is fixedly connected with a moving shaft, the moving shaft is fixedly connected with a first middleware, the first middleware is in spline connection with a second middleware, and the second middleware is rotationally connected with a rotating disc; the second middle piece is fixedly connected with first plates which are arranged in a central symmetry mode, and the rotating disc is fixedly connected with second plates which are arranged in a central symmetry mode. The grinding and polishing degree of the wafer is judged through the relative movement between the second plate and the adjacent first plate, so that the wafer in the grinding and polishing process is detected in real time, and the situation that the wafer is exposed in the air and is damaged due to the fact that the grinding and polishing degree of the wafer is detected by interrupting the grinding and polishing process is prevented. Therefore, the normal grinding and polishing are influenced by oxidation and pollutant adsorption.

Description

Technical Field

[0001] The invention relates to the technical field of wafer grinding and polishing, and in particular to a wafer grinding and polishing device for processing mobile phone chips. Background Art

[0002] Wafers are an indispensable basic material in the manufacturing process of mobile phone chips. They are usually made of high-purity single-crystal silicon, gallium arsenide, silicon carbide and other materials. Since the surface of the wafer is uneven after being cut, and the wafer has extremely high requirements on its own surface roughness in subsequent processes such as lithography, etching and deposition, the cut wafer needs to be ground and polished to remove the wafer's own defects and improve the wafer's quality.

[0003] The existing grinding and polishing technology is usually accompanied by the detection of the grinding and polishing status of the wafer when grinding and polishing the wafer. The grinding and polishing process needs to be interrupted when the wafer is inspected, which will disrupt the original grinding and polishing rhythm, resulting in over-grinding or under-polishing of individual areas of the wafer, affecting the thickness uniformity of the wafer. At the same time, when the grinding and polishing process is interrupted for inspection, the wafer is exposed to the air, causing oxidation and adsorption of pollutants, affecting the normal progress of subsequent grinding and polishing work, and in severe cases reducing the grinding and polishing effect of the wafer. Summary of the invention

[0004] In order to overcome the shortcomings of the prior art that the wafer interrupts the grinding and polishing process, is exposed to the air, is oxidized and adsorbs pollutants, thereby affecting the normal subsequent grinding and polishing of the wafer, the present invention provides a wafer grinding and polishing device for mobile phone chip processing.

[0005] The technical implementation scheme of the present invention is as follows: a wafer grinding and polishing device for processing mobile phone chips, comprising a shell, the shell is fixedly connected to a mounting plate, the shell is installed with a first motor through a mounting frame, the output shaft of the first motor is fixedly connected to a rotating shaft, the rotating shaft is fixedly connected to a grinding pad, the mounting plate is installed with a hydraulic push rod, the telescopic end of the hydraulic push rod is fixedly connected to a moving shaft, the moving shaft is fixedly connected to a first middle piece, the first middle piece is spline-connected to a second middle piece, the second middle piece is rotatably connected to a rotating disk, a cavity is provided between the second middle piece and the rotating disk, and the rotating disk is away from the side of the moving shaft. A suction cup module with an annular array is installed, a first plate arranged symmetrically is fixedly connected to the side of the second middle piece close to the rotating disk, the first plate is in contact with the rotating disk, a first elastic element is fixedly connected between the rotating disk and the second middle piece, a second plate arranged symmetrically is fixedly connected to the side of the rotating disk close to the second middle piece, the second plate is in contact with the second middle piece, a display mechanism for reflecting the grinding and polishing status of the wafer is arranged on the side of the second middle piece away from the moving axis, and a power mechanism for rotating the moving axis is arranged on the side of the mounting plate close to the hydraulic push rod.

[0006] As a further preferred embodiment, the display mechanism includes a first arc-shaped shell, which is rotatably connected to the side of the second middle piece away from the moving axis, the cavity between the second middle piece and the rotating disk is connected to the first arc-shaped shell, the first plate and the second plate arranged symmetrically are both located in the cavity, and divide the cavity equally, and the diagonal cavities are filled with transmission medium, the second middle piece is rotatably connected to a side close to the rotating disk with an outer cover, the outer cover is fixedly connected to the first arc-shaped shell, the outer cover is fixedly connected to the first shell, the first shell and the first arc-shaped shell are connected through an intermediate tube, the first arc-shaped shell and the first shell are both filled with transmission medium, the mounting plate is slidably connected to a sliding member on the side close to the second middle piece, the sliding member is fixedly connected to the outer cover, an indicator rod is slidably connected in the first shell, and a second elastic element is fixedly connected between the indicator rod and the first shell.

[0007] As a further preferred scheme, the power mechanism includes a second motor, the second motor is installed on the mounting plate through a mounting member, the output shaft of the second motor is fixedly connected to the first bevel gear, the movable shaft is splined with the second bevel gear, the second bevel gear is meshed with the first bevel gear, and a support member is fixedly connected to the side of the mounting plate close to the first middle member, the support member is rotatably connected to the second bevel gear, and the support member is slidably connected to a guide member.

[0008] As a further preferred scheme, a third elastic element is fixedly connected between the first middle piece and the second middle piece, the second middle piece is slidably connected with a first limit piece, the first limit piece is provided with a first protrusion, a fourth elastic element is fixedly connected between the first limit piece and the second middle piece, the first middle piece is slidably connected with a second limit piece on a side close to the first limit piece, the second limit piece is provided with second protrusions arranged equidistantly, the second protrusion cooperates with the first protrusion in limiting manner, a third limit piece is fixedly connected to a side of the second limit piece away from the first limit piece, and a fifth elastic element is fixedly connected between the third limit piece and the first middle piece.

[0009] As a further preferred scheme, a moving part is slidably connected to a side of the first intermediate piece close to the moving shaft, and an extrusion ring is fixed to the moving part, and the extrusion ring is limitedly matched with the third limiting piece. A fixed frame is fixed to a side of the first intermediate piece close to the mounting plate, and the fixed frame is fixed to evenly arranged second shells, and the second shells are filled with transmission medium. The evenly arranged second shells are connected through an intermediate pipe, and a sliding plate is slidably connected to the second shell away from the first intermediate piece, and a sixth elastic element is fixed between the sliding plate and the adjacent second shell. A first extrusion piece is slidably connected to the second shell close to the first intermediate piece, and the first extrusion piece is fixed to the moving part. A second extrusion piece is fixed to a side of the mounting plate close to the fixed frame, and the second extrusion piece is extrusion-matched with the sliding plate.

[0010] As a further preferred scheme, it also includes a cooling mechanism for cooling the wafer, the cooling mechanism is arranged on the side of the mounting plate close to the first middle piece, the cooling mechanism includes a pump body, the pump body is installed on the mounting plate, a water pipe is connected between the outer cover and the external water tank, the water pipe is connected to the pump body, the first middle piece is rotatably connected to the side close to the movable axis with a second arc shell, the second arc shell is filled with a transmission medium, the second arc shell is fixed to the guide member, the second arc shell is connected to the side close to the water pipe with a third shell, and the third shell is slidably connected to a third extrusion member.

[0011] As a further preferred scheme, the second arc-shaped shell and the outer cover are both fixedly connected to a fourth shell through a frame, the third extruded member is slidably connected to the adjacent fourth shell, the fourth shell cuts off the water pipe, a sealing member is arranged in the fourth shell, the third extruded member is fixedly connected to the adjacent sealing member, the sealing member is in contact and cooperate with the adjacent fourth shell, a cavity is arranged in the first middle member, the cavity is filled with a transmission medium, the cavity is connected to the second arc-shaped shell, and an extrusion protrusion is arranged on a side of the second middle member close to the first middle member, and the extrusion protrusion slides in the cavity.

[0012] As a further preferred solution, a side of the first arc-shaped shell close to the water pipe is connected to a fifth shell, a fourth extrusion piece is slidably connected inside the fifth shell, the fourth extrusion piece is slidably connected to the adjacent fourth shell, and the fourth extrusion piece is fixedly connected to the adjacent blocking piece.

[0013] As a further preferred solution, the rotating disk is fixedly connected to a guide ring, and both upper and lower sides of the guide ring are inclined surfaces for guiding the wafer.

[0014] As a further preferred embodiment, there is a gap between the outer cover and the guide ring, and the vertical distance between the side of the outer cover away from the second middle piece and the side of the rotating disk away from the second middle piece is smaller than the thickness of the wafer, so as to uniformly cool the wafer.

[0015] Compared with the prior art, the present invention has at least the following advantages: the present invention determines the degree of grinding and polishing of the wafer by the relative movement between the second plate and the adjacent first plate, thereby performing real-time detection of the wafer during the grinding and polishing process, and preventing the wafer from being exposed to the air and causing oxidation and adsorption of pollutants to affect normal grinding and polishing by interrupting the grinding and polishing process to detect the degree of grinding and polishing of the wafer when the conventional grinding and polishing technology is used to grind and polish the wafer; the second protrusion on the second limiting member is used to limit the first protrusion on the first limiting member, thereby stabilizing the third elastic element provided to the second intermediate member Elastic force can stabilize the stability of the wafer in the subsequent grinding and polishing process, thereby improving the effect of wafer grinding and polishing; the third limit piece is squeezed by the extrusion ring, so that the second limit piece and the first middle piece slide relative to each other, and lose the limit on the first limit piece, so that the second middle piece is automatically reset, thereby reducing the operating steps of the staff and improving work efficiency; the third extrusion piece and the fourth extrusion piece are respectively squeezed on the upper and lower sides of the blocking piece, so that the amount of grinding and polishing liquid flowing through the two fourth shells matches the friction between the wafer and the grinding pad, so as to avoid overheating and damage of the wafer due to insufficient grinding and polishing liquid or waste caused by excessive grinding and polishing liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 It is a three-dimensional structural schematic diagram of the housing and its internal parts of the present invention; Figure 3 It is a three-dimensional structural schematic diagram of the mounting plate and parts thereon of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure when the first middle piece and the second middle piece of the present invention slide relative to each other; Figure 5 It is a schematic diagram of the three-dimensional structure when the support member and the guide member of the present invention slide relative to each other; Figure 6 It is a three-dimensional structural cross-sectional view of the first middle piece and the second middle piece and the parts thereon of the present invention; Figure 7 is a schematic diagram of the three-dimensional structure of the third elastic element of the present invention when it is compressed; Figure 8 It is a three-dimensional structural exploded view of the second middle piece and some parts on it of the present invention; Fig. 9 It is a cross-sectional view of the three-dimensional structure when the second shell and the sliding plate of the present invention slide relative to each other; Fig.10 It is a sectional view of the three-dimensional structure when the third shell and the third extrusion member of the present invention slide relative to each other; Fig.11 For the present invention Fig.10 A magnified view of the three-dimensional structure at center A; Fig.12 It is a three-dimensional structural exploded diagram of the first middle piece and the parts thereon of the present invention.

[0017] In the accompanying drawings: 101-wafer, 1-housing, 2-mounting plate, 3-first motor, 4-rotating shaft, 5-grinding pad, 6-hydraulic push rod, 7-moving shaft, 8-first middle piece, 9-second middle piece, 10-rotating disk, 11-suction cup module, 12-first plate, 13-first elastic element, 14-second plate, 1501-first arc shell, 1502-outer cover, 1503-first shell, 1504-sliding member, 1505-indicating rod, 1506-second elastic element, 1601-second motor, 1602-first bevel gear, 1603-second bevel gear, 1604-support member, 1605-guide member, 1701-third elastic element, 170 2-first limit member, 1703-fourth elastic element, 1704-second limit member, 1705-third limit member, 1706-fifth elastic element, 1801-moving member, 1802-extrusion ring, 1803-fixed frame, 1804-second shell, 1805-sliding plate, 1806-sixth elastic element, 1807-first extrusion member, 1808-second extrusion member, 1901-pump body, 1902-water pipe, 1903-second arc-shaped shell, 1904-third shell, 1905-third extrusion member, 2001-fourth shell, 2002-sealing member, 2003-cavity, 2101-fifth shell, 2102-fourth extrusion member, 22-guide ring. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] The existing grinding and polishing technology needs to interrupt the grinding and polishing process when the wafer is being inspected. During the inspection process, the wafer will be exposed to the air, causing the wafer to oxidize and absorb pollutants, affecting the normal progress of subsequent grinding and polishing work, and in severe cases reducing the grinding and polishing effect of the wafer.

[0020] Embodiment 1: A wafer grinding and polishing device for processing mobile phone chips, such as Figure 1-Figure 8 As shown, it includes a shell 1, a mounting plate 2 is fixedly connected to the upper side of the shell 1, a first motor 3 is installed on the lower side of the shell 1 through a mounting frame, the output shaft of the first motor 3 is fixedly connected to a rotating shaft 4 rotatably connected to the shell 1, a grinding pad 5 is fixedly connected to the upper side of the rotating shaft 4, a hydraulic push rod 6 is installed on the left part of the front side of the mounting plate 2, a moving shaft 7 is fixedly connected to the telescopic end of the hydraulic push rod 6, a first middle piece 8 is fixedly connected to the lower side of the moving shaft 7, the first middle piece 8 is spline-connected to the second middle piece 9, a rotating disk 10 is rotatably connected to the lower side of the second middle piece 9, a cavity is provided between the second middle piece 9 and the rotating disk 10, and four suction cup modules 1 in a circular array are installed on the lower side of the rotating disk 10 1, the suction cup module 11 is used to absorb and fix the wafer 101, the lower side of the second middle piece 9 is fixedly connected with two first plates 12 which are arranged symmetrically in the left and right centers, the first plates 12 are in contact with the rotating disk 10, a first elastic element 13 is fixedly connected between the rotating disk 10 and the second middle piece 9, the first elastic element 13 is a torsion spring, which is used to apply torsion to the rotating disk 10, the upper side of the rotating disk 10 is fixedly connected with two second plates 14 which are arranged symmetrically in the front and back centers, the second plates 14 are in contact with the second middle piece 9, a display mechanism for reflecting the grinding and polishing state of the wafer 101 is arranged on the upper side of the second middle piece 9, and a power mechanism for rotating the movable shaft 7 is arranged on the front side of the mounting plate 2.

[0021] like Figure 2-Figure 6 and Fig. 9As shown, the display mechanism includes a first arcuate shell 1501, the first arcuate shell 1501 is rotatably connected to the lower part of the outer side of the second middle piece 9, the cavity between the second middle piece 9 and the rotating disk 10 is connected to the first arcuate shell 1501, the two first plates 12 and the two second plates 14 are both located in the cavity, and the cavity is divided into four equal parts, the diagonal cavities are filled with transmission medium, the transmission medium in the left front area and the right rear area of ​​the cavity is hydraulic oil, and the transmission medium in the left rear area and the right front area of ​​the cavity is air, the lower part of the outer side of the second middle piece 9 is rotatably connected to the outer cover 1502 fixed to the first arcuate shell 1501, and the upper side of the outer cover 1502 A first shell 1503 is fixedly connected to the left part, and the first shell 1503 is connected to the first arc-shaped shell 1501 through an intermediate tube. The first arc-shaped shell 1501 and the first shell 1503 are both filled with a transmission medium, and the transmission medium is hydraulic oil. A sliding member 1504 fixed to the outer cover 1502 is slidably connected to the lower side of the mounting plate 2, and an indicator rod 1505 is slidably connected to the first shell 1503. A scale mark is set on the front side of the indicator rod 1505 for providing reference data to the staff. A second elastic element 1506 is fixedly connected between the indicator rod 1505 and the first shell 1503, and the second elastic element 1506 is a spring for resetting the indicator rod 1505.

[0022] like Figure 3-Figure 5 and Fig. 9 As shown, the power mechanism includes a second motor 1601, which is installed on the lower part of the left side of the mounting plate 2 through a mounting member, the output shaft of the second motor 1601 is fixedly connected to the first bevel gear 1602, the movable shaft 7 is splinedly connected to the second bevel gear 1603 meshing with the first bevel gear 1602, and the lower part of the front side of the mounting plate 2 is fixedly connected to a support member 1604 rotatably connected to the second bevel gear 1603, and the support member 1604 is limitedly slidably connected to a guide member 1605.

[0023] like Figure 6 and Figure 7As shown, a third elastic element 1701 is fixedly connected between the first middle piece 8 and the second middle piece 9, and the third elastic element 1701 is a spring for applying pressure to the second middle piece 9. The left portion of the upper side of the second middle piece 9 is slidably connected with a first limiting piece 1702, and a first protrusion is provided at the left end of the first limiting piece 1702. The left side of the first protrusion is an inclined surface, which gradually inclines upward from left to right, and the lower side of the first protrusion is a horizontal plane. A fourth elastic element 1703 is fixedly connected between the first limiting piece 1702 and the second middle piece 9, and the fourth elastic element 1703 is a tension spring for resetting the first limiting piece 1702. The left portion of the inner side of the first middle piece 8 is slidably connected with a second limiting piece 1704, and the second limiting piece 1704 is provided with a plurality of second protrusions arranged equidistantly, and the right side of the second protrusion is an inclined surface, which gradually inclines upward from left to right, and the lower side of the first protrusion is a horizontal plane. It gradually tilts upward to the right, and the lower side of the second protrusion is a horizontal plane. The second protrusion cooperates with the first protrusion to limit the position, and the inclined surface on the second protrusion is limited and squeezed against the inclined surface on the first protrusion, so that the second limiting member 1704 and the second middle member 9 slide relative to each other. The left side of the second limiting member 1704 is fixedly connected to the third limiting member 1705, and the left part of the third limiting member 1705 is provided with an inclined surface, which gradually tilts upward from left to right. The left and right projection lengths of the inclined surface on the third limiting member 1705 and the horizontal direction are greater than the left and right lengths of the horizontal plane of the second protrusion on the second limiting member 1704. A fifth elastic element 1706 is fixedly connected between the third limiting member 1705 and the first middle member 8. The fifth elastic element 1706 is a tension spring for resetting the third limiting member 1705, and the fifth elastic element 1706 is initially in a stretched state.

[0024] like Figure 3 , Figure 5 , Figure 6 , Figure 7 , Fig. 9 and Fig.12As shown, a moving member 1801 is slidably connected to the upper portion of the outer side of the first middle piece 8, and the moving member 1801 is fixedly connected to an extrusion ring 1802 that is limitedly matched with the inclined surface on the third limiting member 1705. The inclined surface on the third limiting member 1705 is squeezed by the extrusion ring 1802, so that the third limiting member 1705 and the first middle piece 8 move relative to each other. A fixing frame 1803 is fixedly connected to the left rear side of the first middle piece 8, and the fixing frame 1803 is fixedly connected to two second shells 1804 that are evenly arranged front and back. The second shells 1804 are filled with a transmission medium, and the transmission medium is hydraulic oil. The two second shells 1804 are connected through an intermediate pipe, and a sliding plate 180 is slidably connected to the rear second shell 1804. 5. A sixth elastic element 1806 is fixedly connected between the sliding plate 1805 and the second shell 1804 at the rear side. The sixth elastic element 1806 is a spring, and the sixth elastic element 1806 is initially in a compressed state, and is used to reset the sliding plate 1805. A first extrusion member 1807 fixedly connected to the moving member 1801 is slidably connected in the second shell 1804 at the front side. A second extrusion member 1808 that is extruded and matched with the sliding plate 1805 is fixedly connected to the lower left part of the front side of the mounting plate 2. The sliding plate 1805 is extruded by the second extrusion member 1808, so that the extrusion ring 1802 and the third limiting member 1705 move relative to each other, thereby separating the first limiting member 1702 and the second limiting member 1704 from each other.

[0025] When it is necessary to use this device to grind and polish the wafer 101, the staff places the wafer 101 on the lower side of the rotating disk 10 and starts the four suction cup modules 11, so that the four suction cup modules 11 adsorb and fix the wafer 101, and then starts the first motor 3, the hydraulic push rod 6 and the second motor 1601. The output shaft of the first motor 3 drives the grinding pad 5 to start rotating counterclockwise (looking down) through the rotating shaft 4, and the output shaft of the second motor 1601 drives the first bevel gear 1602 to start rotating clockwise (looking from the left), the first bevel gear 1602 drives the second bevel gear 1603 to rotate clockwise (looking down), the second bevel gear 1603 drives the moving shaft 7 to rotate clockwise together, the moving shaft 7 drives the first middle piece 8 to rotate clockwise together, the first middle piece 8 drives the second middle piece 9 to rotate clockwise together, the second middle piece 9 drives the rotating disk 10 to rotate clockwise together through the first elastic element 13, and the rotating disk 10 drives the wafer 101 to rotate clockwise together through the four suction cup modules 11.

[0026] After the hydraulic push rod 6 is started, the telescopic end of the hydraulic push rod 6 starts to move downward, and the telescopic end of the hydraulic push rod 6 drives the moving shaft 7 to move downward together, and the moving shaft 7 slides relatively with the second bevel gear 1603, and the moving shaft 7 drives the first middle piece 8 to move downward together, and the first middle piece 8 drives the second middle piece 9 and the third elastic element 1701 therebetween to move downward together, and during the downward movement of the first middle piece 8, the first middle piece 8 drives the fixing frame 1803 to move downward together, and the fixing frame 1803 drives the two second shells 1804 to move downward together, and the second shell 1804 on the rear side drives the sixth elastic element 1806 to move downward together, and the sixth elastic element 1806 gradually loses its elastic force, and during the process, the sliding plate 1805 is moved downwardly with the second extrusion piece 1 under the action of the elastic force of the sixth elastic element 1806. 808 remains relatively still, the rear second shell 1804 and the sliding plate 1805 slide relative to each other and generate negative pressure, and then the hydraulic oil of the front second shell 1804 is drawn into the rear second shell 1804 under the action of negative pressure, and then the moving part 1801, the extrusion ring 1802 and the first extrusion part 1807 all move downward relative to the first middle part 8, and the extrusion ring 1802 gradually loses the extrusion on the third limit member 1705. The third limit member 1705 begins to move to the right under the action of the pulling force of the fifth elastic element 1706, and the third limit member 1705 drives the second limit member 1704 to move to the right together until the sliding plate 1805 is separated from the second extrusion member 1808. At this time, the inclined surface on the second protrusion on the lower side of the second limit member 1704 contacts the inclined surface on the first protrusion on the first limit member 1702.

[0027] During the downward movement of the first middle piece 8, the first middle piece 8 drives the second limit piece 1704 and the parts thereon to move downward together. When the wafer 101 moves downward until it contacts the clockwise rotating grinding pad 5, as the first middle piece 8 continues to move downward, the first middle piece 8 moves downward relative to the second middle piece 9, and the third elastic element 1701 is compressed. During this process, the second protrusion on the second limit piece 1704 begins to squeeze the first protrusion on the first limit piece 1702, and then the first limit piece 1702 begins to move to the right, and the fourth elastic element 1703 is stretched. After the first protrusion on the first limit piece 1702 passes through the adjacent second protrusion on the second limit piece 1704, the fourth elastic element 1703 is stretched. After the second protrusion, the first limit piece 1702 moves to the left under the action of the pulling force of the fourth elastic element 1703. As the first middle piece 8 continues to move downward, the first limit piece 1702 repeatedly moves left and right until the third elastic element 1701 is compressed to provide an elastic force to the second middle piece 9 to reach the target pressure. Then the staff closes the hydraulic push rod 6 and uses the second protrusion on the second limit piece 1704 to limit the first protrusion on the first limit piece 1702, so as to stabilize the elastic force provided by the third elastic element 1701 to the second middle piece 9, stabilize the stability of the wafer 101 during the subsequent grinding and polishing process, and thereby improve the grinding and polishing effect of the wafer 101.

[0028] After the wafer 101 moves downward to contact the grinding pad 5, the wafer 101 is subjected to resistance in the opposite direction of the original rotation (resistance in the counterclockwise direction), the rotating disk 10 rotates counterclockwise relative to the second middle piece 9, the first elastic element 13 is deformed, and the rotating disk 10 drives the two second plates 14 to rotate counterclockwise together. The space in the left front area of ​​the cavity increases, and negative pressure is generated therein, and the hydraulic oil in the first shell 1503 is extracted through the first arc-shaped shell 1501 and the adjacent intermediate tube. The indicator rod 1505 begins to move downward, and the second elastic element 1506 is stretched. As the rotating disk 10 continues to rotate relative to the second middle piece 9, when the torque generated by the gradually deformed first elastic element 13 is equal to the resistance of the wafer 101 during grinding and polishing, the rotating disk 10 remains relatively still relative to the second middle piece 9, and then the rotating grinding pad 5 grinds and polishes the rotating wafer 101.

[0029] As the grinding and polishing time of the wafer 101 increases, the surface of the wafer 101 gradually becomes smoother, and the friction between the wafer 101 and the grinding pad 5 gradually decreases. When the friction between the two is less than the torsion of the first elastic element 13, the rotating disk 10 begins to rotate clockwise relative to the second middle piece 9 under the action of the torsion of the first elastic element 13, and the second middle piece 9 drives the two second plates 14 to rotate clockwise together. The front second plate 14 squeezes the hydraulic oil in the left front area of ​​the cavity, and the squeezed hydraulic oil enters the first arc shell 1501. The hydraulic oil in the first arc shell 1501 then enters the first shell 1 through the adjacent intermediate pipe. 503, and then the amount of hydraulic oil in the first shell 1503 increases, and the indicator rod 1505 is squeezed upward, and the staff determines the degree of grinding and polishing of the wafer 101 by observing the scale on the indicator rod 1505, so as to perform real-time detection of the wafer 101 during the grinding and polishing process, and prevent the grinding and polishing process from being interrupted to detect the degree of grinding and polishing of the wafer 101 when the conventional grinding and polishing technology is used to grind and polish the wafer 101, causing the wafer 101 to be exposed to the air, thereby causing oxidation and adsorption of pollutants to affect the normal grinding and polishing, and at the same time prolonging the duration of the grinding and polishing work and reducing work efficiency.

[0030] When the polishing of the wafer 101 is completed, the staff starts the hydraulic push rod 6 again. The telescopic end of the hydraulic push rod 6 drives the moving shaft 7 and the parts thereon to start moving upward. The first middle piece 8 drives the first limit piece 1702 to move upward together through the second limit piece 1704. The first limit piece 1702 drives the second middle piece 9 to move upward together. The second middle piece 9 drives the rotating disk 10 and the parts thereon to move upward together. The wafer 101 is separated from the grinding pad 5. During the upward movement of the first middle piece 8, the first middle piece 8 drives the fixed frame 1803 and the parts thereon to move upward together. When the sliding plate 1805 moves upward until it contacts the second extrusion piece 1808, as the fixed frame 1803 continues to move upward, the second extrusion piece 1808 squeezes the sliding plate 1805. The sliding plate 1805 moves downward along the second shell 1804 on the rear side and squeezes the hydraulic oil therein. The hydraulic oil in the second shell 1804 on the rear side enters the second shell 1804 on the front side through the adjacent intermediate pipe. The hydraulic oil in 1804 squeezes the first extrusion piece 1807 upward, and the first extrusion piece 1807 drives the extrusion ring 1802 to move upward through the moving piece 1801, and the moving piece 1801 slides upward along the first intermediate piece 8, and the extrusion ring 1802 squeezes the third limit piece 1705, and the third limit piece 1705 begins to move to the left, and the fifth elastic element 1706 is stretched, and the third limit piece 1705 drives the second limit piece 1704 to move to the left together, and the second limit piece 1704 loses the limit on the first limit piece 1702, and then the rotating disk 10 begins to carry the parts thereon downward for reset under the action of the elastic force of the third elastic element 1701 until the third elastic element 1701 returns to its original state, thereby reducing the operating steps of the staff, reducing the work intensity of the staff, and improving the efficiency of grinding and polishing the wafer 101, and then the staff turns off the first motor 3, the hydraulic push rod 6, the second motor 1601 and the four suction cup modules 11, and the staff takes out the wafer 101.

[0031] Embodiment 2: Based on embodiment 1, Figure 2-Figure 6 , Fig. 9 and Fig.10 As shown, a cooling mechanism for cooling the wafer 101 is also included, and the cooling mechanism is arranged on the front side of the mounting plate 2. The cooling mechanism includes a pump body 1901, and the pump body 1901 is installed on the front side of the mounting plate 2. A water pipe 1902 connected to the pump body 1901 is connected between the outer cover 1502 and the external water tank. The upper part of the outer side of the first intermediate piece 8 is rotatably connected to a second arc-shaped shell 1903 fixedly connected to the guide piece 1605. The second arc-shaped shell 1903 is filled with a transmission medium, and the transmission medium is hydraulic oil. The left side of the second arc-shaped shell 1903 is connected to a third shell 1904, and the third shell 1904 is slidably connected to a third extrusion piece 1905.

[0032] like Figure 6 and Fig.10 As shown, the right side of the second arc-shaped shell 1903 and the right side of the outer cover 1502 are both fixedly connected with the fourth shell 2001 through the frame, the fourth shell 2001 is connected with the water pipe 1902, the third extrusion member 1905 is slidably connected with the fourth shell 2001 on the upper side, the fourth shell 2001 cuts off the water pipe 1902, and a blocking member 2002 is arranged in the fourth shell 2001, the blocking member 2002 is made of rubber, the third extrusion member 1905 is fixedly connected with the left part of the upper blocking member 2002, the right side of the upper blocking member 2002 is fixedly connected with the right side of the upper fourth shell 2001, and the left side of the lower blocking member 2002 is fixedly connected with the lower fourth shell 2001. 01 is fixedly connected to the left side, and the sealing member 2002 is in contact with the adjacent fourth shell 2001. The deformation of the sealing member 2002 is used to change the contact degree between it and the adjacent fourth shell 2001, thereby changing the ability of the adjacent fourth shell 2001 to circulate the grinding and polishing liquid, thereby cooling the wafer 101 accordingly and improving the grinding and polishing effect of the wafer 101. The first middle piece 8 is provided with a cavity 2003 connected to the second arc-shaped shell 1903, and the cavity 2003 is filled with a transmission medium, and the transmission medium is hydraulic oil. The upper side of the second middle piece 9 is provided with an extrusion protrusion, and the extrusion protrusion slides in the cavity 2003 in a sealed manner.

[0033] like Figure 6 , Figure 7 , Fig.10 and Fig.11 As shown, the right side of the first arc-shaped shell 1501 is connected to the fifth shell 2101, and the fourth extrusion piece 2102 slidably connected to the fourth shell 2001 on the lower side is slidably connected inside the fifth shell 2101, and the fourth extrusion piece 2102 is fixedly connected to the left part of the lower sealing piece 2002, and the rotating disk 10 is fixedly connected to the guide ring 22, and the upper and lower sides of the guide ring 22 are both inclined surfaces, and the lower inclined surface of the guide ring 22 is used to guide and center the wafer 101, and the upper inclined surface of the guide ring 22 is used to guide the grinding and polishing liquid, and there is a gap between the outer cover 1502 and the guide ring 22, and the distance between the lower side of the outer cover 1502 and the lower side of the rotating disk 10 in the vertical direction is less than the thickness of the wafer 101, which is used to uniformly and fully cool the wafer 101, and to form a "water film" and prevent the grinding and polishing liquid in the outer cover 1502 from leaking out.

[0034] When it is necessary to grind and polish the wafer 101, the staff starts the pump body 1901, and the pump body 1901 draws the grinding and polishing liquid in the external water tank through the water pipe 1902, and then transfers the grinding and polishing liquid to the grinding and polishing area of ​​the wafer 101, so as to cool the wafer 101 and the grinding pad 5. In the process of the first middle piece 8 moving downward relative to the second middle piece 9, the extrusion protrusion on the second middle piece 9 slides upward in the cavity 2003 and squeezes the hydraulic oil in the cavity 2003. The hydraulic oil in the cavity 2003 enters the second arc shell 1903, and the hydraulic oil in the second arc shell 1903 enters the third shell 1904. The hydraulic oil in the third shell 1904 begins to squeeze the third extrusion piece 1905. The third extrusion protrusion The pressing piece 1905 moves to the right and squeezes the upper sealing piece 2002, the upper sealing piece 2002 is deformed, and the left side of the upper sealing piece 2002 is separated from the upper fourth shell 2001, so that the elastic force applied by the third elastic element 1701 to the second middle piece 9 (i.e., the positive pressure between the wafer 101 and the grinding pad 5) is determined through the relative sliding distance between the first middle piece 8 and the second middle piece 9, and the third squeezing piece 1905 squeezes the upper sealing piece 2002 to a corresponding degree, so that the amount of grinding and polishing fluid flowing through the upper fourth shell 2001 matches the friction between the wafer 101 and the grinding pad 5, so as to avoid overheating and damage of the wafer 101 due to insufficient grinding and polishing fluid or waste caused by excessive grinding and polishing fluid.

[0035] When the wafer 101 just contacts the grinding pad 5, the wafer 101 rotates counterclockwise relative to the second middle piece 9, and the space in the right rear area of ​​the cavity between the second middle piece 9 and the rotating disk 10 gradually increases. The hydraulic oil in the first arc-shaped shell 1501 gradually transfers to the right rear area of ​​the cavity, and the hydraulic oil in the fifth shell 2101 enters the first arc-shaped shell 1501. Negative pressure is generated in the fifth shell 2101 and causes the fourth extrusion member 2102 to move to the left. The fourth extrusion member 2102 squeezes the lower sealing member 2002, and the distance between the right side of the lower sealing member 2002 and the lower fourth shell 2001 increases, thereby increasing the ability of the lower fourth shell 2001 to circulate the grinding and polishing liquid, so that the amount of the grinding and polishing liquid matches the resistance of the wafer 101 during the grinding and polishing process.

[0036] During the clockwise rotation of the rotating disk 10 relative to the second middle piece 9 (the surface roughness of the wafer 101 gradually decreases, and the friction between the wafer 101 and the grinding pad 5 gradually decreases), the space in the right rear area of ​​the cavity gradually decreases, and the hydraulic oil therein gradually transfers to the first arc-shaped shell 1501. The hydraulic oil in the first arc-shaped shell 1501 enters the fifth shell 2101, and the hydraulic oil in the fifth shell 2101 squeezes the fourth extrusion piece 2102 to the right. The fourth extrusion piece 2102 moves to the right and squeezes the lower sealing piece 2002. The lower sealing piece 2002 is deformed, and the distance between its right side and the lower fourth shell 2001 gradually decreases, thereby reducing the ability of the lower fourth shell 2001 to circulate the grinding and polishing liquid.

[0037] After the grinding and polishing liquid enters the outer cover 1502, the grinding and polishing liquid forms a "water film" in the gap between the outer cover 1502 and the grinding pad 5, thereby delaying the leakage of the grinding and polishing liquid in the outer cover 1502, thereby extending the residence time of the grinding and polishing liquid in the grinding and polishing area, improving the cooling effect on the wafer 101 and the grinding pad 5, and then improving the grinding and polishing effect on the wafer 101. After completing the grinding and polishing of the wafer 101, the staff can close the pump body 1901.

[0038] The above description is only an example of the present invention and is not intended to limit the present invention. Any equivalent substitutions made within the principles of the present invention should be included in the protection scope of the present invention. The contents not elaborated in detail in the present invention belong to the existing technologies known to those skilled in the art.

Claims

1. A wafer grinding and polishing device for processing mobile phone chips, comprising a housing (1), the housing (1) being fixedly connected to a mounting plate (2), the housing (1) being mounted with a first motor (3) via a mounting frame, the output shaft of the first motor (3) being fixedly connected to a rotating shaft (4), the rotating shaft (4) being fixedly connected to a grinding pad (5), the mounting plate (2) being mounted with a hydraulic push rod (6), the telescopic end of the hydraulic push rod (6) being fixedly connected to a moving shaft (7), the moving shaft (7) being fixedly connected to a first middle piece (8), the first middle piece (8) being spline-connected to a second middle piece (9), the second middle piece (9) being rotatably connected to a rotating disk (10), a cavity being provided between the second middle piece (9) and the rotating disk (10), the rotating disk (10) being mounted with a suction cup module (11) in an annular array, the second middle piece (9) being fixedly connected to a first plate (12) arranged symmetrically with respect to the center on a side of the rotating disk (10), the first plate (12) being in contact with and mating with the rotating disk (10), wherein: The invention also comprises a first elastic element (13), the first elastic element (13) being fixedly connected between the rotating disk (10) and the second middle piece (9), a second plate (14) being fixedly connected to a side of the rotating disk (10) close to the second middle piece (9) and arranged symmetrically with respect to the center, the second plate (14) being in contact with and fitting with the second middle piece (9), a display mechanism for reflecting the grinding and polishing state of the wafer (101) being arranged on a side of the second middle piece (9) away from the moving shaft (7), and a power mechanism for rotating the moving shaft (7) being arranged on a side of the mounting plate (2) close to the hydraulic push rod (6).

2. The wafer grinding and polishing device for mobile phone chip processing according to claim 1 is characterized in that: The display mechanism comprises a first arc-shaped shell (1501), the first arc-shaped shell (1501) being rotatably connected to a side of the second middle piece (9) away from the moving axis (7), a cavity between the second middle piece (9) and the rotating disk (10) being connected to the first arc-shaped shell (1501), the first plate (12) and the second plate (14) being arranged symmetrically with respect to the center are both located in the cavity and divide the cavity into equal parts, the diagonal cavities are both filled with a transmission medium, the second middle piece (9) being rotatably connected to a side close to the rotating disk (10) with an outer cover (1502), the outer cover (1502) being rotatably connected to the first arc-shaped shell (1501), ), the outer cover (1502) is fixedly connected to the first shell (1503), the first shell (1503) is connected to the first arc-shaped shell (1501) through an intermediate tube, the first arc-shaped shell (1501) and the first shell (1503) are both filled with a transmission medium, a sliding member (1504) is slidably connected to the side of the mounting plate (2) close to the second middle member (9), the sliding member (1504) is fixedly connected to the outer cover (1502), an indicating rod (1505) is slidably connected to the first shell (1503), and a second elastic element (1506) is fixedly connected between the indicating rod (1505) and the first shell (1503).

3. The wafer grinding and polishing device for mobile phone chip processing according to claim 2 is characterized in that: The power mechanism comprises a second motor (1601), the second motor (1601) is mounted on the mounting plate (2) via a mounting member, the output shaft of the second motor (1601) is fixedly connected to a first bevel gear (1602), the movable shaft (7) is spline-connected to a second bevel gear (1603), the second bevel gear (1603) is meshed with the first bevel gear (1602), a support member (1604) is fixedly connected to a side of the mounting plate (2) close to the first intermediate member (8), the support member (1604) is rotatably connected to the second bevel gear (1603), and the support member (1604) is slidably connected to a guide member (1605).

4. The wafer grinding and polishing device for mobile phone chip processing according to claim 1 is characterized in that: A third elastic element (1701) is fixedly connected between the first middle piece (8) and the second middle piece (9); the second middle piece (9) is slidably connected to a first limiting piece (1702); the first limiting piece (1702) is provided with a first protrusion; a fourth elastic element (1703) is fixedly connected between the first limiting piece (1702) and the second middle piece (9); a second limiting piece (1704) is slidably connected to a side of the first middle piece (8) close to the first limiting piece (1702); the second limiting piece (1704) is provided with second protrusions arranged equidistantly; the second protrusions are limitedly matched with the first protrusions; a third limiting piece (1705) is fixedly connected to a side of the second limiting piece (1704) away from the first limiting piece (1702); and a fifth elastic element (1706) is fixedly connected between the third limiting piece (1705) and the first middle piece (8).

5. The wafer grinding and polishing device for mobile phone chip processing according to claim 4 is characterized in that: A moving member (1801) is slidably connected to a side of the first intermediate member (8) close to the moving shaft (7); the moving member (1801) is fixedly connected to an extrusion ring (1802); the extrusion ring (1802) is limitedly matched with the third limiting member (1705); a fixing frame (1803) is fixedly connected to a side of the first intermediate member (8) close to the mounting plate (2); the fixing frame (1803) is fixedly connected to uniformly arranged second shells (1804); the second shells (1804) are filled with a transmission medium; the uniformly arranged second shells (1804) are connected to each other through an intermediate pipe, and are away from the first intermediate member ( A sliding plate (1805) is slidably connected inside the second shell (1804) of the mounting plate (2), a sixth elastic element (1806) is fixedly connected between the sliding plate (1805) and the adjacent second shell (1804), a first extrusion member (1807) is slidably connected inside the second shell (1804) close to the first intermediate member (8), the first extrusion member (1807) is fixedly connected to the moving member (1801), a second extrusion member (1808) is fixedly connected to one side of the mounting plate (2) close to the fixing frame (1803), and the second extrusion member (1808) is extruded and matched with the sliding plate (1805).

6. The wafer grinding and polishing device for mobile phone chip processing according to claim 5 is characterized in that: The invention also comprises a cooling mechanism for cooling the wafer (101), the cooling mechanism being arranged on a side of the mounting plate (2) close to the first middle piece (8), the cooling mechanism comprising a pump body (1901), the pump body (1901) being mounted on the mounting plate (2), a water pipe (1902) being connected between the outer cover (1502) and an external water tank, the water pipe (1902) being connected to the pump body (1901), a second arc-shaped shell (1903) being rotatably connected to a side of the first middle piece (8) close to the movable shaft (7), the second arc-shaped shell (1903) being filled with a transmission medium, the second arc-shaped shell (1903) being fixedly connected to the guide piece (1605), a third shell (1904) being connected to a side of the second arc-shaped shell (1903) close to the water pipe (1902), the third shell (1904) being slidably connected to a third extrusion piece (1905).

7. The wafer grinding and polishing device for mobile phone chip processing according to claim 6 is characterized in that: The second arc-shaped shell (1903) and the outer cover (1502) are both fixedly connected to the fourth shell (2001) through a frame, the third extruded component (1905) is slidably connected to the adjacent fourth shell (2001), the fourth shell (2001) cuts off the water pipe (1902), a blocking component (2002) is arranged in the fourth shell (2001), the third extruded component (1905) is fixedly connected to the adjacent blocking component (2002), the blocking component (2002) is in contact with the adjacent fourth shell (2001), a cavity (2003) is arranged in the first middle component (8), the cavity (2003) is filled with a transmission medium, the cavity (2003) is communicated with the second arc-shaped shell (1903), and an extrusion protrusion is arranged on a side of the second middle component (9) close to the first middle component (8), and the extrusion protrusion slides in the cavity (2003).

8. The wafer grinding and polishing device for mobile phone chip processing according to claim 7 is characterized in that: The side of the first arc-shaped shell (1501) close to the water pipe (1902) is connected to the fifth shell (2101), and a fourth extruded component (2102) is slidably connected inside the fifth shell (2101). The fourth extruded component (2102) is slidably connected to the adjacent fourth shell (2001), and the fourth extruded component (2102) is fixedly connected to the adjacent blocking component (2002).

9. The wafer grinding and polishing device for mobile phone chip processing according to claim 6 is characterized in that: The rotating disk (10) is fixedly connected to a guide ring (22), and both upper and lower sides of the guide ring (22) are inclined surfaces for guiding the wafer (101).

10. The wafer grinding and polishing device for mobile phone chip processing according to claim 9, characterized in that: There is a gap between the outer cover (1502) and the guide ring (22), and the distance in the vertical direction between the side of the outer cover (1502) away from the second middle piece (9) and the side of the rotating disk (10) away from the second middle piece (9) is smaller than the thickness of the wafer (101), so as to uniformly cool the wafer (101).

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