Wafer adsorption method and device and wafer grinding equipment

Abstract

The invention provides a wafer adsorption method and device and wafer grinding equipment, and belongs to the technical field of semiconductor manufacturing. The device comprises a blasting head and a blasting disc, wherein the blasting head comprises a blasting head inner ring and a blasting head outer ring surrounding the blasting head inner ring; the first air pipe is used for feeding air into the blasting head inner ring; the second air pipe is used for feeding air into the blasting head outer ring; the adsorption pad is used for adsorbing the wafer; the pressure sensor is arranged in the ramming head outer ring, and the pressure sensing end of the pressure sensor is exposed on the lower surface, in contact with the adsorption pad, of the ramming head outer ring and is in contact with the adsorption pad; the adsorption pad clamping ring is arranged on the outer ring of the adsorption pad and is used for limiting the wafer adsorbed by the adsorption pad; the control unit controls the second air pipe to supply air to the outer ring of the blasting head, so that the adsorption pad clamping ring is in contact with the blasting disc, and whether the blasting head is successfully loaded or not is judged according to the response time of the pressure sensor and the detected pressure value. The problem that during wafer grinding, a wafer is not limited by a polishing head outer ring adsorption pad clamping ring and is thrown out at the moment of being in contact with a polishing disc, and then fragments are caused can be solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer adsorption method and device, and wafer grinding equipment. Background Art

[0002] In the prior art, when grinding a wafer, a polishing head adsorption structure is used to adsorb the wafer for grinding the wafer. The polishing head of the polishing head adsorption structure includes an inner ring of the polishing head and an outer ring of the polishing head surrounding the inner ring of the polishing head. The outer ring of the polishing head is provided with an adsorption pad clamp ring for limiting the position of the wafer.

[0003] Currently, before polishing the wafer, the polishing equipment does not determine whether the outer ring of the polishing head has been lowered and loaded onto the polishing plate. Instead, it controls the outer ring of the polishing head to descend first and then the inner ring of the polishing head to descend based on the time sequence. However, once a delay occurs during the descent of the outer ring of the polishing head, the inner ring of the polishing head will contact the polishing plate earlier than the outer ring of the polishing head. The wafer is not limited by the clamping ring of the adsorption pad of the outer ring of the polishing head and will be thrown out at the moment of contacting the polishing plate, resulting in fragments, increasing production costs, and causing equipment downtime, affecting equipment operating efficiency. Summary of the invention

[0004] The present invention provides a wafer adsorption method and device, and wafer grinding equipment, which can solve the problem that when the wafer is ground, the wafer is not limited by the clamping ring of the adsorption pad on the outer ring of the grinding head, and is thrown out at the moment of contacting the grinding disk, thereby causing fragments.

[0005] In order to achieve the above object, the technical solution adopted in the embodiment of the present invention is:

[0006] A wafer adsorption device, comprising:

[0007] A blasting head and a blasting disk are arranged opposite to each other, wherein the blasting head comprises an inner blasting head ring and an outer blasting head ring surrounding the inner blasting head ring;

[0008] A first air pipe for supplying air to the inner ring of the blasting head and a second air pipe for supplying air to the outer ring of the blasting head;

[0009] An adsorption pad disposed on the side of the polishing head facing the polishing plate and used for adsorbing the wafer;

[0010] A pressure sensor is arranged on the outer ring of the polishing head, and a pressure sensing end of the pressure sensor is in contact with the adsorption pad;

[0011] An adsorption pad clamping ring is arranged on the outer ring of the polishing head and located on the side of the adsorption pad facing the polishing disk, and is used to limit the wafer adsorbed by the adsorption pad, and the position of the pressure sensor corresponds to the position of the adsorption pad clamping ring;

[0012] The control unit is used to control the second air pipe to supply air to the outer ring of the blasting head so that the adsorption pad clamping ring contacts the blasting disc, and judge whether the outer ring of the blasting head is successfully uploaded according to the response time of the pressure sensor and the detected pressure value.

[0013] In some embodiments, the control unit is specifically used to determine that the upload of the outer ring of the blasting head is successful when the response time of the pressure sensor is less than the preset pressure detection completion time and the detected pressure value is greater than the preset pressure critical value; and to determine that the upload of the outer ring of the blasting head has failed when the response time of the pressure sensor is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure critical value.

[0014] In some embodiments, the pressure detection completion time is no more than 3s, and the pressure critical value is 4500-4800N.

[0015] In some embodiments, it also includes:

[0016] The alarm unit is used to give an alarm when the control unit determines that the outer ring of the blasting head fails to be uploaded.

[0017] In some embodiments, the control unit is further used to control the first air pipe to supply air to the inner circle of the polishing head when it is determined that the outer circle of the polishing head is successfully uploaded, so that the wafer adsorbed by the adsorption pad contacts the polishing disk.

[0018] An embodiment of the present invention further provides a wafer grinding device, comprising the wafer adsorption device as described above.

[0019] An embodiment of the present invention further provides a wafer adsorption method, which is applied to the wafer adsorption device as described above, and the method comprises:

[0020] Controlling the second air pipe to supply air to the outer ring of the polishing head so that the adsorption pad clamping ring contacts the polishing disc;

[0021] The control unit is controlled to judge whether the blasting head is successfully uploaded according to the response time and the detected pressure value of the pressure sensor.

[0022] In some embodiments, controlling the control unit to determine whether the wafer is successfully adsorbed according to the response time and the detected pressure value of the pressure sensor includes:

[0023] The control unit determines that the upload of the outer ring of the blasting head is successful when the response time of the pressure sensor is less than the preset pressure detection completion time and the detected pressure value is greater than the preset pressure critical value; and determines that the upload of the outer ring of the blasting head fails when the response time of the pressure sensor is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure critical value.

[0024] In some embodiments, the method further comprises:

[0025] When the control unit determines that the uploading of the outer ring of the blasting head fails, the alarm unit is controlled to sound an alarm.

[0026] In some embodiments, the method further comprises:

[0027] When the control unit determines that the outer ring of the polishing head is successfully loaded, the control unit controls the first air pipe to supply air to the inner ring of the polishing head, so that the wafer adsorbed by the adsorption pad contacts the polishing plate.

[0028] The beneficial effects of the present invention are:

[0029] In this embodiment, a pressure sensor is arranged on the outer ring of the polishing head, and the pressure sensing end of the pressure sensor contacts the adsorption pad. The response time of the pressure sensor and the detected pressure value can be used to determine whether the outer ring of the polishing head is successfully uploaded, and then the upload of the inner ring of the polishing head can be controlled, including alarming in the case of failure to upload the outer ring of the polishing head, stopping the upload of the inner ring of the polishing head; in the case of judging that the upload of the outer ring of the polishing head is successful, the inner ring of the polishing head is uploaded again, thereby effectively avoiding the problem that when the wafer is ground, the wafer is not limited by the clamping ring of the adsorption pad of the outer ring of the polishing head, and is thrown out at the moment of contacting the polishing disk, thereby causing fragments. The technical solution of this embodiment can effectively reduce wafer fragments, thereby achieving the purpose of saving costs and improving equipment efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 and Figure 2 A schematic diagram showing the structure of a wafer adsorption device according to an embodiment of the present invention;

[0031] Figure 3 A bottom view schematically shows a blasting head according to an embodiment of the present invention.

[0032] Reference numerals

[0033] 01 Trachea

[0034] 02 Pressure Sensor

[0035] 03 Absorption pad

[0036] 04 Adsorption pad clip

[0037] 05 Head

[0038] 06 Inner ring of polishing head

[0039] 07Throwing head outer ring

[0040] 08 Wafer

[0041] 09 Selling DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0043] The embodiment of the present invention provides a wafer adsorption method and device, and a wafer grinding device, which can solve the problem that when the wafer 08 is ground, the wafer 08 is not limited by the adsorption pad retaining ring 04 of the grinding head outer ring 07, and is thrown out at the moment of contacting the grinding plate 09, thereby causing fragments.

[0044] The embodiment of the present invention provides a wafer adsorption device, such as Figure 1 and Figure 2 As shown, including:

[0045] The blasting head 05 and the blasting disk 09 are arranged opposite to each other, the blasting head 05 comprises a blasting head inner circle 06 and a blasting head outer circle 07 surrounding the blasting head inner circle 06, and the blasting head 05 is located above the blasting disk 09;

[0046] The air pipe 01 includes a first air pipe for supplying air to the inner ring 06 of the blasting head and a second air pipe for supplying air to the outer ring 07 of the blasting head;

[0047] An adsorption pad 03 disposed on the side of the polishing head 05 facing the polishing plate 09 and used for adsorbing the wafer 08;

[0048] A pressure sensor 02 is disposed on the outer ring 07 of the polishing head, and a pressure sensing end of the pressure sensor 02 is in contact with the adsorption pad 03;

[0049] The adsorption pad clamp ring 04 is arranged on the outer ring 07 of the polishing head and located on the side of the adsorption pad 03 facing the polishing plate 09, and is used to limit the wafer 08 adsorbed by the adsorption pad 03. The position of the pressure sensor 02 corresponds to the position of the adsorption pad clamp ring 04;

[0050] The control unit is used to control the second air pipe to supply air to the blasting head outer ring 07 so that the adsorption pad clamp ring 04 contacts the blasting disc 09, and judge whether the blasting head outer ring 07 is uploaded successfully according to the response time of the pressure sensor 02 and the detected pressure value.

[0051] In this embodiment, a pressure sensor 02 is provided on the outer ring 07 of the polishing head, and the pressure sensing end of the pressure sensor 02 is in contact with the adsorption pad 03. The response time of the pressure sensor 02 and the detected pressure value can be used to determine whether the outer ring 07 of the polishing head is successfully uploaded, and then the upload of the inner ring 06 of the polishing head can be controlled, including alarming in the case of failure to upload the outer ring 07 of the polishing head, stopping the upload of the inner ring 06 of the polishing head; in the case of judging that the upload of the outer ring 07 of the polishing head is successful, the inner ring 06 of the polishing head is uploaded again, thereby effectively avoiding the problem that when the wafer 08 is ground, the wafer 08 is not limited by the retaining ring 04 of the adsorption pad of the outer ring 07 of the polishing head, and is thrown out at the moment of contacting the polishing disk 09, thereby causing fragments. The technical solution of this embodiment can effectively reduce the fragments of the wafer 08, thereby achieving the purpose of saving costs and improving equipment efficiency.

[0052] In this embodiment, when the wafer 08 needs to be ground, the wafer adsorption device can be used to adsorb the wafer 08. Figure 1 and Figure 2 As shown, the wafer adsorption device includes an air pipe 01, and the air pipe 01 includes second air pipes ① and ③ for supplying air to the outer ring 07 of the polishing head, and a first air pipe ② for supplying air to the inner ring 06 of the polishing head; a pressure sensor 02 and an adsorption pad retaining ring 04 are arranged on the outer ring 07 of the polishing head, and the positions of the pressure sensor 02 and the adsorption pad retaining ring 04 correspond to each other, and the orthographic projection of the pressure sensor 02 on the horizontal plane falls within the orthographic projection of the adsorption pad retaining ring 04 on the horizontal plane. When the polishing head 05 is lowered and loaded onto the polishing plate 09, the contact between the adsorption pad retaining ring 04 and the polishing plate 09 will transmit the pressure to the pressure sensor 02. If the outer ring 07 of the polishing head is successfully uploaded, the pressure sensor 02 will detect a pressure value greater than the preset pressure critical value within the preset pressure detection completion time; if the outer ring 07 of the polishing head is not successfully uploaded, the pressure sensor 02 will not be able to detect a pressure value greater than the preset pressure critical value within the preset pressure detection completion time. Therefore, the response time of the pressure sensor 02 and the detected pressure value can be used to determine whether the polishing head outer ring 07 is uploaded successfully.

[0053] like Figure 3 As shown, in this embodiment, three pressure sensors 02 can be evenly arranged on the outer ring 07 of the polishing head. Of course, in this embodiment, it is not limited to evenly arranging three pressure sensors 02 on the outer ring 07 of the polishing head, and a greater number of pressure sensors 02 can be arranged. When multiple pressure sensors 02 are arranged, the response time of the pressure sensor 02 can be determined by the average response time of the multiple pressure sensors 02, and the detected pressure value of the pressure sensor 02 can be determined by the average detected pressure value of the multiple pressure sensors 02.

[0054] In some embodiments, the control unit is specifically used to determine that the upload of the blasting head outer ring 07 is successful when the response time of the pressure sensor 02 is less than the preset pressure detection completion time and the detected pressure value is greater than the preset pressure critical value; and to determine that the upload of the blasting head outer ring 07 fails when the response time of the pressure sensor 02 is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure critical value.

[0055] In this embodiment, the preset pressure detection completion time and the preset pressure critical value can be determined in advance through a large amount of test data. Specifically, when the blasting head outer ring 07 is successfully uploaded, the response time and the detected pressure value of the pressure sensor 02 can be recorded; when the blasting head outer ring 07 is not successfully uploaded, the response time and the detected pressure value of the pressure sensor 02 can be recorded; the preset pressure detection completion time and the preset pressure critical value can be determined through the recorded numerical values.

[0056] For example, when the outer ring 07 of the grinding head is successfully uploaded, the pressure sensor 02 will detect the pressure value within 3s, and the detected pressure value is not less than 4500N. Therefore, after a large amount of test data, it can be determined that the pressure detection completion time is no more than 3s, for example, it can be 0.5s, 0.6s, 0.7s, 0.8s, 0.9s, 1.0s, 1.1s, 1.2s, 1.3s, 1.4s, 1.5s, 1.6s, 1.7s, 1.8s, 1.9s, 2.0s, 2.1s, 2.2s, 2.3s, 2.4s, 2.5s, 2.6s, 2.7s, 2.8s, 2.9s or 3s; the pressure critical value is 4500-4800N, for example, it can be 4500N, 4550N, 4600N, 4650N, 4700N, 4750N or 4800N.

[0057] For example, if the critical pressure value is 4500N, when the response time of the pressure sensor 02 is not more than 3s and the detected pressure value of the pressure sensor 02 is not less than 4500N, it can be judged that the outer ring 07 of the grinding head is uploaded successfully; when the response time of the pressure sensor 02 is more than 3s, or the detected pressure value of the pressure sensor 02 is less than 4500N, it can be judged that the outer ring 07 of the grinding head is not uploaded successfully.

[0058] In some embodiments, the device further comprises:

[0059] The alarm unit is used to alarm when the control unit determines that the polishing head outer ring 07 fails to upload. In the case of a failure to upload the polishing head outer ring 07, the alarm unit can notify the operator by honking, flashing lights, sending an alarm code by email, etc. After the operator is informed of the alarm information, he can manually intervene to check the wafer adsorption device to avoid equipment downtime.

[0060] In some embodiments, the control unit is further configured to control the first air pipe to supply air to the inner ring 06 of the polishing head when it is determined that the polishing head outer ring 07 is successfully loaded, so that the wafer 08 adsorbed by the adsorption pad 03 contacts the polishing plate 09. When the polishing head outer ring 07 is successfully loaded, the inner ring 06 of the polishing head can be continuously loaded to contact the wafer 08 with the polishing plate 09, and the wafer 08 can be polished.

[0061] An embodiment of the present invention further provides a wafer grinding device, comprising the wafer adsorption device as described above.

[0062] The wafer grinding equipment of this embodiment can detect in advance whether the polishing head outer ring 07 is successfully uploaded before grinding the wafer, and then control the loading of the polishing head inner ring 06, including alarming in the case of failure to load the polishing head outer ring 07 and stopping the loading of the polishing head inner ring 06; when it is judged that the loading of the polishing head outer ring 07 is successful, the polishing head inner ring 06 is loaded again, thereby effectively avoiding the problem that when the wafer 08 is ground, the wafer 08 is not limited by the retaining ring 04 of the adsorption pad of the polishing head outer ring 07, and is thrown out at the moment of contacting the polishing plate 09, resulting in fragments. The technical solution of this embodiment can effectively reduce the fragments of the wafer 08, thereby saving costs and improving equipment efficiency.

[0063] An embodiment of the present invention further provides a wafer adsorption method, which is applied to the wafer adsorption device as described above, and the method comprises:

[0064] Control the second air pipe to supply air to the outer ring 07 of the polishing head, so that the adsorption pad clamp ring 04 is in contact with the polishing disc 09;

[0065] The control unit is controlled to determine whether the blasting head 05 is successfully uploaded according to the response time of the pressure sensor 02 and the detected pressure value.

[0066] In this embodiment, a pressure sensor 02 is provided on the outer ring 07 of the polishing head, and the pressure sensing end of the pressure sensor 02 is in contact with the adsorption pad 03. The response time of the pressure sensor 02 and the detected pressure value can be used to determine whether the outer ring 07 of the polishing head is successfully uploaded, and then the upload of the inner ring 06 of the polishing head can be controlled, including alarming in the case of failure to upload the outer ring 07 of the polishing head, stopping the upload of the inner ring 06 of the polishing head; in the case of judging that the upload of the outer ring 07 of the polishing head is successful, the inner ring 06 of the polishing head is uploaded again, thereby effectively avoiding the problem that when the wafer 08 is ground, the wafer 08 is not limited by the retaining ring 04 of the adsorption pad of the outer ring 07 of the polishing head, and is thrown out at the moment of contacting the polishing disk 09, thereby causing fragments. The technical solution of this embodiment can effectively reduce the fragments of the wafer 08, thereby achieving the purpose of saving costs and improving equipment efficiency.

[0067] In some embodiments, controlling the control unit to determine whether the wafer 08 is successfully adsorbed according to the response time and the detected pressure value of the pressure sensor 02 includes:

[0068] The control unit determines that the upload of the blasting head outer ring 07 is successful when the response time of the pressure sensor 02 is less than the preset pressure detection completion time and the detected pressure value is greater than the preset pressure critical value; and determines that the upload of the blasting head outer ring 07 fails when the response time of the pressure sensor 02 is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure critical value.

[0069] In this embodiment, the preset pressure detection completion time and the preset pressure critical value can be determined in advance through a large amount of test data. Specifically, when the blasting head outer ring 07 is successfully uploaded, the response time and the detected pressure value of the pressure sensor 02 can be recorded; when the blasting head outer ring 07 is not successfully uploaded, the response time and the detected pressure value of the pressure sensor 02 can be recorded; the preset pressure detection completion time and the preset pressure critical value can be determined through the recorded numerical values.

[0070] For example, when the outer ring 07 of the grinding head is successfully uploaded, the pressure sensor 02 will detect the pressure value within 3s, and the detected pressure value is not less than 4500N. Therefore, after a large amount of test data, it can be determined that the pressure detection completion time is no more than 3s, for example, it can be 0.5s, 0.6s, 0.7s, 0.8s, 0.9s, 1.0s, 1.1s, 1.2s, 1.3s, 1.4s, 1.5s, 1.6s, 1.7s, 1.8s, 1.9s, 2.0s, 2.1s, 2.2s, 2.3s, 2.4s, 2.5s, 2.6s, 2.7s, 2.8s, 2.9s or 3s; the pressure critical value is 4500-4800N, for example, it can be 4500N, 4550N, 4600N, 4650N, 4700N, 4750N or 4800N.

[0071] The critical pressure value can be 4500N. In this way, when the response time of the pressure sensor 02 is not more than 3s and the detected pressure value of the pressure sensor 02 is not less than 4500N, it can be judged that the outer ring 07 of the grinding head is uploaded successfully; when the response time of the pressure sensor 02 is more than 3s, or the detected pressure value of the pressure sensor 02 is less than 4500N, it can be judged that the outer ring 07 of the grinding head is not uploaded successfully.

[0072] In a specific embodiment, when the grinding action of the blasting head 05 begins, the air intake of air pipes ① and ③ is controlled to act on the outer ring 07 of the blasting head, so that the adsorption pad clamping ring 04 on the outer ring of the adsorption pad 03 first contacts the blasting disc 09 within 3 seconds, and the detection pressure value of the pressure sensor 02 is detected, and the detected detection pressure value is fed back to the control unit, and the control unit determines that the loading action of the outer ring 07 of the blasting head is completed.

[0073] If the pressure value detected by the pressure sensor 02 is not less than 4500N within 3s, it means that the outer ring 07 of the polishing head has been successfully uploaded, and the suction pad retaining ring 04 has been effectively uploaded to the polishing plate 09. The control unit can control the air intake from the air pipe ② to act on the inner ring 06 of the polishing head to give internal pressure, so that the wafer 08 adsorbed by the suction pad 03 contacts the polishing plate 09, and the wafer 08 is pressed on the polishing plate 09 to start grinding. If the pressure value detected by the pressure sensor 02 does not reach 4500N within 3s, it means that the outer ring 07 of the polishing head has failed to be uploaded, and the suction pad retaining ring 04 has not been effectively uploaded to the polishing plate 09. The alarm unit can notify the operator by whistling, flashing lights, sending an alarm code by email, etc., or control the equipment to shut down. After receiving the alarm information, the operator can manually intervene to check the wafer adsorption device.

[0074] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.

[0075] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0076] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0077] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0078] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A wafer adsorption device, characterized in that: include: A throwing head and a throwing disk are arranged opposite to each other, wherein the throwing head comprises an inner throwing ring and an outer throwing ring surrounding the inner throwing ring; A first air pipe for supplying air to the inner ring of the blasting head and a second air pipe for supplying air to the outer ring of the blasting head; An adsorption pad disposed on the side of the polishing head facing the polishing plate and used for adsorbing the wafer; A pressure sensor is arranged on the outer ring of the polishing head, and a pressure sensing end of the pressure sensor is in contact with the adsorption pad; An adsorption pad clamping ring is arranged on the outer ring of the polishing head and located on the side of the adsorption pad facing the polishing disk, and is used to limit the wafer adsorbed by the adsorption pad, and the position of the pressure sensor corresponds to the position of the adsorption pad clamping ring; The control unit is used to control the second air pipe to supply air to the outer ring of the blasting head so that the adsorption pad clamping ring contacts the blasting disc, and judge whether the outer ring of the blasting head is successfully uploaded according to the response time of the pressure sensor and the detected pressure value.

2. The wafer adsorption device according to claim 1, characterized in that: The control unit is specifically used to judge that the upload of the outer ring of the blasting head is successful when the response time of the pressure sensor is less than the preset pressure detection completion time and the detected pressure value is greater than the preset pressure critical value; and to judge that the upload of the outer ring of the blasting head fails when the response time of the pressure sensor is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure critical value.

3. The wafer adsorption device according to claim 2, characterized in that: The pressure detection completion time is no more than 3s, and the pressure critical value is 4500-4800N.

4. The wafer adsorption device according to claim 1, characterized in that: Also includes: The alarm unit is used to give an alarm when the control unit determines that the outer ring of the blasting head fails to be uploaded.

5. The wafer adsorption device according to claim 1, characterized in that: The control unit is further configured to control the first air pipe to supply air to the inner circle of the polishing head when it is determined that the outer circle of the polishing head is successfully uploaded, so that the wafer adsorbed by the adsorption pad contacts the polishing disk.

6. A wafer grinding device, characterized in that: It comprises a wafer adsorption device as described in any one of claims 1-5.

7. A wafer adsorption method, characterized in that: Applied to the wafer adsorption device according to any one of claims 1 to 5, the method comprises: Controlling the second air pipe to supply air to the outer ring of the polishing head so that the adsorption pad clamping ring contacts the polishing disc; The control unit is controlled to judge whether the blasting head is successfully uploaded according to the response time and the detected pressure value of the pressure sensor.

8. The wafer adsorption method according to claim 7, characterized in that: Controlling the control unit to judge whether the wafer is adsorbed successfully according to the response time and the detected pressure value of the pressure sensor includes: The control unit determines that the upload of the outer ring of the blasting head is successful when the response time of the pressure sensor is less than the preset pressure detection completion time and the detected pressure value is greater than the preset pressure critical value; and determines that the upload of the outer ring of the blasting head fails when the response time of the pressure sensor is not less than the preset pressure detection completion time or the detected pressure value is not greater than the preset pressure critical value.

9. The wafer adsorption method according to claim 8, characterized in that: The method further comprises: When the control unit determines that the uploading of the outer ring of the blasting head fails, the alarm unit is controlled to sound an alarm.

10. The wafer adsorption method according to claim 8, characterized in that: The method further comprises: When the control unit determines that the outer ring of the polishing head is successfully loaded, the control unit controls the first air pipe to supply air to the inner ring of the polishing head, so that the wafer adsorbed by the adsorption pad contacts the polishing plate.

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