Wafer cassette storage device

Abstract

The invention provides wafer cassette storage equipment. The wafer cassette storage equipment comprises a main frame; the storage position is fixed on the frame and is used for storing the wafer box; the track moving equipment is arranged on the track, can move on the track and is provided with a telescopic manipulator, the telescopic manipulator can move up and down on the track moving equipment, and the track moving equipment is used for conveying the wafer box to the storage position or taking out the wafer box in the storage position; the power supply device comprises a power supply end and a power receiving end, the power supply end supplies power to the power receiving end in a wireless and non-contact mode, the power supply end comprises a power distribution cabinet and a litz wire, the litz wire is laid along a track to form a single loop as a primary side, and the power receiving end serves as a secondary side and transfers electric energy of the primary side to the secondary side through electromagnetic coupling; and the track mobile equipment takes power from the track through the power receiving end. According to the wafer box storage equipment, non-contact power supply is adopted, sparks and dust cannot be generated, the storage quality of wafers can be guaranteed, and the maintenance cost of a clean vertical warehouse can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer box storage device. Background Art

[0002] Cleanroom is a storage method for temporarily storing finished products in the semiconductor production process. A large number of storage devices need to be placed on the line in semiconductor wafer factories, which require high cleanliness and fast cycle time. Cleanroom can meet the storage and access needs of semiconductor factories.

[0003] In the related technology, when semiconductor wafer factories use clean warehouses to access wafer boxes, the common power supply method is busbars or tank chains. Busbars or tank chains will generate dust and sparks due to friction, which will affect the quality of wafers, pose safety hazards, and increase the operation and maintenance costs of clean warehouses. Summary of the invention

[0004] In order to solve the above technical problems, a first object of the present invention is to provide a wafer box storage device.

[0005] The technical solution adopted by the present invention is as follows: An embodiment of the present invention proposes a wafer box storage device, comprising: a main frame; a storage position, the storage position is fixed on the frame, and the storage position is used to store wafer boxes; a track moving device, the track moving device is set on the track and can move on the track, the track moving device is provided with a retractable manipulator, the retractable manipulator can move up and down on the track moving device, the track moving device is used to transport the wafer box to the storage position or take out the wafer box in the storage position; a power supply device, the power supply device includes a power supply end and a power receiving end, the power supply end supplies power to the power receiving end in a wireless and contactless manner, the power supply end includes a distribution cabinet and a Litz wire, the Litz wire is laid along the track to form a single-circuit loop as a primary side, the power receiving end acts as a secondary side and transfers the primary side electric energy to the secondary side through electromagnetic coupling, and the track moving device draws power on the track through the power receiving end.

[0006] The wafer box storage device proposed in the present invention may also have the following additional technical features: According to one embodiment of the present invention, the power distribution cabinet includes: a circuit breaker, one end of which is connected to a power supply line at the grid end; an EMI (Electromagnetic Interference) filter, one end of which is connected to the other end of the circuit breaker; an AC contactor, one end of which is connected to the other end of the EMI filter through a fuse; a three-phase SCR (Silicon Controlled Rectifier) ​​bridge, the AC input end of the three-phase SCR bridge is connected to the other end of the AC contactor, and the three-phase SCR bridge is used to convert three-phase AC power into a first DC power; an inverter bridge, the DC input end of the inverter is connected to the DC output end of the three-phase SCR bridge through a filter inductor and a discharge resistor; a compensation capacitor array, one end of the compensation capacitor array is connected to the AC output end of the inverter bridge through a resonant inductor; an isolation transformer, the primary side of the isolation transformer is connected to the other end of the compensation capacitor array, and the secondary side of the isolation transformer is connected to the Litz wire as the output end of the power distribution cabinet.

[0007] According to an embodiment of the present invention, the power receiving end includes a magnetic core made of ferrite material, and the Litz wire is wound around the magnetic core.

[0008] According to an embodiment of the present invention, the Litz wire is an enameled stranded wire.

[0009] According to one embodiment of the present invention, the above-mentioned wafer box storage device also includes: a rectifier circuit and a boost circuit. After the power receiving end obtains electricity through the principle of electromagnetic induction, it is rectified by the rectifier circuit and connected to the boost circuit, so as to perform boost processing through the boost circuit and generate a second direct current, and the voltage of the second direct current is greater than the voltage of the first direct current.

[0010] According to one embodiment of the present invention, the boost circuit includes: a first inductor, one end of the first inductor is connected to the negative terminal of a first preset power supply, and the other end of the first inductor is connected to the output end of a rectifier circuit; a second inductor, one end of the second inductor is connected to the negative terminal of the second preset power supply, and the other end of the second inductor is connected to the output end of the rectifier circuit; a first capacitor, one end of the first capacitor is connected to the other end of the first inductor; a second capacitor, the other end of the second capacitor is connected to the other end of the first capacitor; a first diode, the cathode of the first diode is connected to the other end of the second capacitor, and the anode of the first diode is connected to the positive terminal of the first preset power supply; a first MOS transistor, the first end of the first MOS transistor is connected to the positive terminal of the first preset power supply, and the The second end is grounded; a third capacitor, one end of the third capacitor is connected to the other end of the second inductor; a fourth capacitor, one end of the fourth capacitor is connected to the other end of the third capacitor and then grounded, and the other end of the fourth capacitor is connected to the cathode of the first diode; a second diode, the cathode of the second diode is connected to the other end of the fourth capacitor, and the anode of the second diode is connected to the positive terminal of the second preset power supply; a second MOS tube, a first end of the second MOS tube is connected to the positive terminal of the second preset power supply, and the second end of the second MOS tube is grounded; a fifth capacitor and a sixth capacitor, one end of the fifth capacitor and the sixth capacitor are connected to the other end of the fourth capacitor, the other ends of the fifth capacitor and the sixth capacitor are grounded, and one end of the fifth capacitor and the sixth capacitor serves as the output end of the boost circuit.

[0011] Beneficial effects of the present invention: The wafer box storage device of the present invention adopts non-contact power supply and will not generate sparks or dust, which can not only ensure the storage quality of the wafers but also reduce the maintenance cost of the clean warehouse. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic diagram of the three-dimensional structure of a wafer box storage device according to an embodiment of the present invention; Figure 2 is a schematic cross-sectional structural diagram of a wafer box storage device according to an embodiment of the present invention; Figure 3 is a schematic diagram of the arrangement of a track moving device of a wafer box storage device according to an embodiment of the present invention; Figure 4 is a schematic diagram of a circuit topology of a power distribution cabinet according to an embodiment of the present invention; Figure 5 4 is a schematic diagram of a circuit topology of a boost circuit according to an embodiment of the present invention. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0014] Figure 1 is a schematic diagram of a three-dimensional structure of a wafer box storage device according to an embodiment of the present invention, Figure 2 FIG. 1 is a schematic cross-sectional view of a wafer box storage device according to an embodiment of the present invention. Figure 1-2 As shown, the wafer box storage device includes: a main frame 1, storage positions 2, a track moving device 3 and a power supply device.

[0015] Among them, storage position 2 is fixed on frame 1, and storage position 2 is used to store wafer boxes; track moving device 3 is set on track and can move on track 4, track moving device 3 is provided with retractable manipulator, and retractable manipulator can move up and down on track moving device 3, and track moving device 3 is used to transport wafer boxes to storage position 2 or take out wafer boxes in storage position 2. The power supply device includes a power supply end and a power receiving end, and the power supply end supplies power to the power receiving end in a wireless and contactless manner. The power supply end includes a distribution cabinet and a Litz wire, and the Litz wire is laid along the track to form a single-circuit loop as the primary side. The power receiving end, as the secondary side, transfers the primary side power energy to the secondary side through electromagnetic coupling, and the track moving device 3 draws power on the track through the power receiving end.

[0016] Specifically, Figure 2 The main frame 1 can be built with aluminum profiles, connected with angle pieces, and the bottom is installed with feet 11 to ensure the level of the storage position. The mask of the main frame 1 can be made of transparent PVC (Polyvinyl Chloride) and aluminum-plastic plate to ensure the appearance of the equipment. Storage position 2 is fixed on frame 1 and is made of mirror stainless steel. Three positioning pins can be installed on storage position 2 to match the positioning slot of storage position 2. A reflector is installed on storage position 2 to cooperate with the sensor on the wafer robot to identify whether there is material in the storage position. Figure 3As shown, the track 4 is fixed on the ground through a fixed bottom plate 41, and the track moving device 3 can move on the track 4. At the same time, the retractable manipulator on the track moving device 3 can move up and down under the drive of the lifting mechanism, and the retractable manipulator itself can be retracted, so that the track moving device 3 transports the wafer box to the storage position 2 or takes out the wafer box in the storage position 2 through the retractable manipulator. The power supply device of the entire wafer box storage device adopts non-contact power supply, including a power supply end and a power receiving end. The power supply end is an AC constant current source. The power supply end includes a distribution cabinet and a Litz wire. The Litz wire is laid along the track to form a single-circuit loop as the primary side of the transformer. The power receiving end transfers the primary side electric energy to the secondary side through electromagnetic coupling. The track moving device 3 takes power on the track 4 through the power receiving end. Therefore, the wafer box storage device of the present invention adopts non-contact power supply, does not generate sparks and dust, can not only ensure the storage quality of wafers, but also reduce the maintenance cost of clean warehouses.

[0017] In an embodiment of the present invention, the power receiving end includes a magnetic core made of ferrite material, and the Litz wire is wound around the magnetic core. The Litz wire can be an enameled stranded wire.

[0018] Specifically, the power transmission method between the power supply end and the power receiving end is similar to the principle of a transformer. The power supply end is an AC constant current source, which consists of a distribution cabinet and Litz wire. The Litz wire led out is laid along the track to form a single-turn loop as the primary side of the transformer, while the power receiving end includes a magnetic core made of ferrite material. The Litz wire is wound around the magnetic core. Through the principle of electromagnetic induction, the electric energy of the primary side is transmitted to the secondary side, thereby achieving the purpose of power transmission.

[0019] In a specific embodiment of the present invention, Figure 4 As shown, the power distribution cabinet includes: circuit breaker, EMI filter, AC contactor KM, three-phase SCR bridge, inverter bridge, compensation capacitor array and isolation transformer T1.

[0020] Among them, one end of the circuit breaker is connected to the power supply lines A, B, and C at the grid end, one end of the EMI filter is connected to the other end of the circuit breaker, and one end of the AC contactor KM is connected to the other end of the EMI filter through a fuse; a three-phase SCR bridge, the AC input end of the three-phase SCR bridge is connected to the other end of the AC contactor KM, and the three-phase SCR bridge is used to convert the three-phase AC power into the first DC power; the DC input end of the inverter is connected to the DC output end of the three-phase SCR bridge through the filter inductor C and the discharge resistor R; one end of the compensation capacitor array is connected to the AC output end of the inverter bridge through the resonant inductor L; the primary side of the isolation transformer T1 is connected to the other end of the compensation capacitor array, and the secondary side of the isolation transformer T1 is connected to the Litz wire as the output end of the distribution cabinet.

[0021] Specifically, the circuit breaker is used to control the opening / closing of the distribution cabinet circuit. The 380V / 50Hz standard three-phase AC output by the power grid is first filtered by the EMI filter, and then converted into the first DC by the 380V / 50Hz SCR bridge. The software algorithm controls the switch tube of the inverter bridge to convert the first DC into 20kHz AC. The compensation capacitor array performs power factor compensation, and the isolation transformer outputs the compensated current to the Litz wire. In the control of the distribution cabinet, a closed-loop algorithm is used to keep the current constant at the required size to realize the design of the AC constant current source.

[0022] In one embodiment of the present invention, it also includes: a rectifier circuit and a boost circuit. After the power receiving end obtains electricity through the principle of electromagnetic induction, it is rectified by the rectifier circuit and connected to the boost circuit, so that the boost circuit performs boost processing and generates a second direct current, and the voltage of the second direct current is greater than the voltage of the first direct current.

[0023] In a specific embodiment of the present invention, Figure 5 As shown, the boost circuit includes: a first inductor L1, a second inductor L2, a first capacitor C1, a second capacitor C2, a first diode D1, a first MOS transistor Q1, a third capacitor C3, a fourth capacitor C4, a second diode D2, a second MOS transistor Q2, a fifth capacitor C5 and a sixth capacitor C6.

[0024] Among them, one end of the first inductor L1 is connected to the negative terminal VCC1- of the first preset power supply, and the other end of the first inductor L1 is connected to the output terminal Vin boost+ of the rectifier circuit; one end of the second inductor L2 is connected to the negative terminal VCC2- of the second preset power supply, and the other end of the second inductor L2 is connected to the output terminal Vin boost+ of the rectifier circuit; one end of the first capacitor C1 is connected to the other end of the first inductor L1; the other end of the second capacitor C2 is connected to the other end of the first capacitor C1; the cathode of the first diode D1 is connected to the other end of the second capacitor, and the anode of the first diode D1 is connected to the positive terminal VCC1- of the first preset power supply; the first end of the first MOS tube Q1 is connected to the positive terminal VCC1+ of the first preset power supply, and the second end of the first MOS tube Q1 is grounded; one end of the third capacitor C3 is connected to the other end of the second inductor L2; one end of the fourth capacitor C4 is connected to the other end of the third capacitor C3 and then grounded , the other end of the fourth capacitor C4 is connected to the cathode of the first diode D1; the cathode of the second diode D2 is connected to the other end of the fourth capacitor C4, and the anode of the second diode D2 is connected to the positive terminal VCC2+ of the second preset power supply; the first end of the second MOS tube Q2 is connected to the positive terminal VCC2+ of the second preset power supply, and the second end of the second MOS tube Q2 is grounded; one end of the fifth capacitor C5 and the sixth capacitor C6 are connected to the other end of the fourth capacitor C4, and the other ends of the fifth capacitor C5 and the sixth capacitor C6 are grounded, and one end of the fifth capacitor C5 and the sixth capacitor C6 serves as the output end of the boost circuit.

[0025] Specifically, the power receiving end is composed of a magnetic core and Litz wire. After receiving electricity through the principle of electromagnetic induction, it passes through a rectifier circuit. The rectifier circuit first rectifies and then connects to a boost circuit. The boost circuit increases the input DC voltage to the required voltage. The specific working principle of the boost circuit is as follows: When Q1 and Q2 are turned on, L1 and L2 are charged at a certain speed, and the energy is stored in L1 and L2. When Q1 and Q2 are turned off, L1 and L2 generate reverse induction voltage, and the stored electric energy is released to C5 and C6 at another speed through diodes D1 and D2. That is, the inductor starts to charge the capacitor, and the voltage across the capacitor increases. At this time, the voltage is higher than the input voltage, and the boost is completed. If the capacitance is large enough, the output end can maintain a continuous current during the discharge process. If this on-off process is repeated continuously, a voltage higher than the input voltage can be obtained at both ends of the capacitor.

[0026] Safety devices can also be installed in the wafer box storage equipment, including EMO emergency stop button, safety door lock, signal tower, buzzer and ladder, etc., to improve the safety of equipment use.

[0027] To sum up, the wafer box storage device according to the embodiment of the present invention adopts non-contact power supply, which will not generate sparks or dust, and can not only ensure the storage quality of the wafers, but also reduce the maintenance cost of the clean warehouse; the design of the AC constant current source can improve the stability and reliability of the circuit operation.

[0028] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0030] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code comprising one or more executable instructions for implementing the steps of a custom logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present invention belong.

[0031] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as an ordered list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by an instruction execution system, device or apparatus (such as a computer-based system, a system including a processor, or other system that can fetch instructions from an instruction execution system, device or apparatus and execute instructions), or in combination with these instruction execution systems, devices or apparatuses. For the purposes of this specification, "computer-readable medium" can be any device that can contain, store, communicate, propagate or transmit a program for use by an instruction execution system, device or apparatus, or in combination with these instruction execution systems, devices or apparatuses. More specific examples (non-exhaustive list) of computer-readable media include the following: an electrical connection with one or more wires (electronic device), a portable computer disk box (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disk read-only memory (CDROM). In addition, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium and then editing, interpreting or processing in other suitable ways if necessary, and then stored in a computer memory.

[0032] It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0033] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

[0034] In addition, each functional unit in each embodiment of the present invention may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0035] The storage medium mentioned above may be a read-only memory, a magnetic disk or an optical disk, etc. Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present invention. A person of ordinary skill in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A wafer box storage device, characterized in that: include: Main frame; A storage location, the storage location is fixed on the frame, and the storage location is used to store a wafer box; A track moving device, the track moving device is arranged on a track and can move on the track, the track moving device is provided with a retractable manipulator, the retractable manipulator can move up and down on the track moving device, and the track moving device is used to transport the wafer box to the storage position or take out the wafer box in the storage position; A power supply device, the power supply device includes a power supply end and a power receiving end, the power supply end supplies power to the power receiving end in a wireless and contactless manner, the power supply end includes a distribution cabinet and a Litz wire, the Litz wire is laid along the track to form a single-circuit loop as the primary side, the power receiving end is used as the secondary side to transfer the primary side electric energy to the secondary side through electromagnetic coupling, and the track mobile device draws power on the track through the power receiving end.

2. The wafer box storage device according to claim 1, characterized in that: The power distribution cabinet comprises: A circuit breaker, one end of which is connected to a power supply line at the grid end; An EMI filter, one end of which is connected to the other end of the circuit breaker; An AC contactor, one end of which is connected to the other end of the EMI filter through a fuse; A three-phase SCR bridge, wherein an AC input end of the three-phase SCR bridge is connected to the other end of the AC contactor, and the three-phase SCR bridge is used to convert three-phase AC power into a first DC power; An inverter bridge, wherein the DC input end of the inverter is connected to the DC output end of the three-phase SCR bridge through a filter inductor and a bleeder resistor; A compensation capacitor array, one end of which is connected to the AC output end of the inverter bridge via a resonant inductor; An isolation transformer, wherein the primary side of the isolation transformer is connected to the other end of the compensation capacitor array, and the secondary side of the isolation transformer is connected to the Litz wire as the output end of the power distribution cabinet.

3. The wafer box storage device according to claim 1, characterized in that: The power receiving end comprises a magnetic core made of ferrite material, and the Litz wire is wound around the magnetic core.

4. The seed wafer box storage device according to claim 2, characterized in that: The Litz wire is an enameled stranded wire.

5. The wafer box storage device according to claim 2, characterized in that: Also includes: A rectifier circuit and a boost circuit. After the power receiving end obtains electricity through the principle of electromagnetic induction, the electricity is rectified by the rectifier circuit and connected to the boost circuit, so as to perform a boost process through the boost circuit and generate a second direct current, and the voltage of the second direct current is greater than the voltage of the first direct current.

6. The wafer box storage device according to claim 5, characterized in that: The boost circuit comprises: A first inductor, one end of the first inductor is connected to the negative terminal of the first preset power supply, and the other end of the first inductor is connected to the output end of the rectifier circuit; a second inductor, one end of the second inductor being connected to the negative terminal of the second preset power supply, and the other end of the second inductor being connected to the output end of the rectifier circuit; a first capacitor, one end of the first capacitor being connected to the other end of the first inductor; a second capacitor, the other end of the second capacitor being connected to the other end of the first capacitor; a first diode, wherein a cathode of the first diode is connected to the other end of the second capacitor, and an anode of the first diode is connected to a positive terminal of the first preset power supply; A first MOS transistor, wherein a first end of the first MOS transistor is connected to a positive terminal of the first preset power supply, and a second end of the first MOS transistor is grounded; a third capacitor, one end of the third capacitor being connected to the other end of the second inductor; a fourth capacitor, one end of the fourth capacitor being connected to the other end of the third capacitor and then grounded, and the other end of the fourth capacitor being connected to the cathode of the first diode; a second diode, wherein a cathode of the second diode is connected to the other end of the fourth capacitor, and an anode of the second diode is connected to the positive terminal of the second preset power supply; A second MOS tube, wherein a first end of the second MOS tube is connected to the positive terminal of the second preset power supply, and a second end of the second MOS tube is grounded; A fifth capacitor and a sixth capacitor, one end of the fifth capacitor and the sixth capacitor are connected to the other end of the fourth capacitor, the other end of the fifth capacitor and the sixth capacitor are grounded, and one end of the fifth capacitor and the sixth capacitor serve as the output end of the boost circuit.

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