Intelligent manufacturing method of gold jewelry

Abstract

The invention relates to an intelligent manufacturing method of gold jewelry, which comprises the following steps: processing a jewelry body through a high-precision electroforming technology, and reserving an accommodating space for accommodating a chip; preparing a conductive channel by using a photoetching technology; depositing a high-conductivity metal material to the conductive channel by using an electroforming technology to form an antenna structure; installing the chip in the accommodating space through a micro-welding technology to form a jewelry blank body; coating the outer surface of the jewelry blank with a protective layer to form a semi-finished jewelry product; and performing heat treatment on the semi-finished jewelry product to form a finished jewelry product. Through precise 3D modeling and a high-precision manufacturing technology, modern intelligent application is achieved, and meanwhile the appearance of the jewelry is not affected. In addition, high-efficiency integration and stable performance of the antenna and the chip are ensured by adopting high-precision technologies such as photoetching, etching and electroforming, and improvement of signal transmission efficiency and oxidation resistance is facilitated. In addition, the structural strength and durability of the embedded part are enhanced through a local heat treatment technology.

Description

Technical Field

[0001] The present invention relates to the technical field of intelligent jewelry manufacturing, and in particular to an intelligent manufacturing method for gold jewelry. Background Art

[0002] Currently, most gold jewelry is mainly used for decoration, collection and value preservation. Although some smart jewelry products have begun to enter the market with the rise of wearable devices, their functions and structural designs are relatively simple, making it difficult to achieve high-end intelligent applications such as identity recognition and payment. Traditional processes cannot meet the requirements of close integration of miniaturized electronic components and jewelry metal materials, resulting in low integration and affecting service life and functional reliability.

[0003] When embedding RFID or NFC chips in jewelry, it is necessary to embed antennas at the same time to ensure effective signal transmission. However, the conductivity and shielding effect of precious metals increase the technical difficulty of chip and antenna integration. Traditional welding, packaging and other processes cannot fully guarantee the stability of antenna signal transmission, and may damage the appearance of jewelry, reducing the beauty and commercial value of the product.

[0004] Micro-nano manufacturing technologies such as photolithography, etching and electroforming are widely used in the semiconductor and electronics fields, but are relatively rarely used in jewelry processing. These technologies have the ability to manufacture high-precision and fine structures, and can achieve antenna production and chip embedding at the micron level. However, there are still technical challenges in introducing these technologies into jewelry manufacturing to achieve integrated processing of electronic components and precious metals, such as how to ensure the conductive performance of the antenna, the firmness of chip embedding and the integrity of the appearance. Summary of the invention

[0005] The purpose of the present invention is to provide an intelligent manufacturing method for gold jewelry, which aims to solve the technical problems of existing gold jewelry such as loose connection, poor conductivity and incomplete appearance when embedding chips and antennas.

[0006] In order to solve the above technical problems, a method for intelligent manufacturing of gold jewelry is provided, comprising:

[0007] The jewelry body is processed through high-precision electroforming technology, and a space is reserved for accommodating the chip;

[0008] Conductive channels were fabricated using photolithography;

[0009] Using electroforming technology to deposit a highly conductive metal material onto the conductive channel to form an antenna structure;

[0010] The chip is mounted in the accommodating space by micro-welding technology to form a jewelry embryo;

[0011] Coating a protective layer on the outer surface of the jewelry blank to form a semi-finished jewelry product;

[0012] The semi-finished jewelry product is heat treated to form a finished jewelry product.

[0013] Furthermore, the step of preparing the conductive channel using photolithography technology includes:

[0014] Applying positive photoresist to the predetermined antenna area of ​​the jewelry body, with the coating thickness controlled within the range of 1-5 microns;

[0015] Exposing the mask having the antenna pattern to ultraviolet light to cause a chemical reaction in the portion of the positive photoresist not blocked by the mask;

[0016] Putting the exposed jewelry body into a developer to remove the positive photoresist on the exposed part;

[0017] Plasma dry etching or wet chemical etching technology is used to remove the metal layer of the exposed portion of the surface of the jewelry body to form the conductive path.

[0018] Further, the etched conductive channel is cleaned and deoxidized before electroforming;

[0019] Electroforming liquid is used for deposition, and the deposition thickness is controlled at 5-10 microns.

[0020] Furthermore, the deposition using the electroforming liquid includes: during the electroforming process, the current density is controlled at 2-5A / dm 2 , the electroforming time does not exceed 60 minutes.

[0021] Furthermore, the step of installing the chip in the accommodating space by micro-welding technology to form a jewelry embryo comprises: connecting the chip to the conductive terminals of the antenna structure by electroplating gold welding, and the size of the welding point is controlled within 5-10 microns.

[0022] Furthermore, after welding is completed, the welding point is tested. If the resistance value of the welding point is within the range of 1-5 ohms, the product is qualified.

[0023] Furthermore, coating the outer surface of the jewelry body with a protective layer includes:

[0024] Coating an epoxy resin encapsulation layer on the outer surface of the jewelry body, wherein the thickness of the epoxy resin layer is controlled to be 20-50 microns;

[0025] Gold is used for electroplating on the outer surface of the epoxy resin packaging layer, and the thickness of the electroplating layer is controlled at 3-5 microns.

[0026] Furthermore, a nano coating is formed on the surface of the jewelry blank using a nano coating protection technology, and the thickness of the nano coating is 10-50 nanometers.

[0027] Furthermore, the heat treatment of the semi-finished jewelry product includes: local heating of the area where the chip and the antenna structure are installed, the heating temperature is controlled within the range of 100-200°C, the heating time does not exceed 15 minutes, and the heating rate during heat treatment is controlled within 2-5°C / minute.

[0028] Furthermore, before processing the jewelry body, a computer-aided design tool is used to perform 3D modeling design.

[0029] Implementing the embodiments of the present invention will have the following beneficial effects:

[0030] The smart manufacturing method of gold jewelry in this embodiment, on the one hand, integrates identity recognition and payment functions into gold jewelry through precise 3D modeling and high-precision manufacturing technology, and reserves a special space in the design, which not only realizes modern intelligent applications, but also ensures that the embedding of chips and antennas will not affect the appearance of jewelry. On the other hand, high-precision technologies such as lithography, etching and electroforming are used to ensure the efficient integration and stable performance of antennas and chips, which is conducive to improving signal transmission efficiency and oxidation resistance, and ensuring reliability in long-term use. In addition, the structural strength and durability of the embedded part are enhanced through local heat treatment technology, avoiding the problem of peeling or cracking caused by differences in the thermal expansion coefficient of the material, and ensuring the overall quality and durability of the jewelry. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 This is a schematic diagram of the structure of the gold jewelry according to an embodiment of the present invention;

[0033] Figure 2 This is a flow chart of the intelligent manufacturing method of gold jewelry according to an embodiment of the present invention;

[0034] Figure 3 This is a flow chart of a method for preparing a conductive channel according to an embodiment of the present invention;

[0035] Figure 4 A flow chart of a method for preparing an antenna structure in a conductive channel according to an embodiment of the present invention;

[0036] Figure 5 The present invention is a flowchart of a method for forming a protective layer according to an embodiment of the present invention.

[0037] Among them: 100, gold jewelry; 110, jewelry body; 111, storage space; 120, antenna structure; 130, chip; 140, protective layer; 150, necklace. DETAILED DESCRIPTION

[0038] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0039] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0041] In this embodiment, a smart gold necklace is designed, which has identity recognition and payment functions to meet the diverse needs of users. The gold necklace includes a necklace 150 and a pendant part, and the pendant is connected to the necklace 150. The preparation method in this embodiment is mainly for the pendant part, that is, the gold jewelry 100 described below.

[0042] Please refer to Figure 1-Figure 5 The embodiment of the present invention provides an intelligent manufacturing method of gold jewelry 100, comprising:

[0043] The jewelry body 110 is processed by high-precision electroforming technology, and a storage space 111 for accommodating the chip 130 is reserved; illustratively, gold with a purity of 99.999% is used as the material of the jewelry during electroforming, and electroforming technology is used for processing. The jewelry body 110 is prepared by a multi-layer electroforming process and is divided into a base layer and a functional layer. The thickness of the base layer is controlled at 0.4 mm to ensure that the necklace 150 is strong enough while retaining the embedding space for the antenna and the chip 130. When electroforming the jewelry body 110, the reserved width of the storage space 111 in the embedding area of ​​the antenna structure 120 is 0.6 mm and the depth is 0.5 mm to ensure the firm integration of the antenna structure 120 and the chip 130.

[0044] Conductive channels were fabricated using photolithography;

[0045] The antenna structure 120 is formed by depositing a highly conductive metal material onto a conductive channel using electroforming technology. For example, in the manufacture of the antenna structure 120 , a spiral micro-nano coil structure is used, and the antenna structure 120 is made of pure gold to ensure conductivity and corrosion resistance.

[0046] The chip 130 is installed in the accommodating space 111 by micro-welding technology to form a jewelry embryo; illustratively, the chip 130 is used to realize identity recognition and payment functions.

[0047] Coating a protective layer 140 on the outer surface of the jewelry blank to form a semi-finished jewelry product;

[0048] The semi-finished jewelry is heat treated to form a finished jewelry product. For example, the finished jewelry product is the gold jewelry 100 mentioned above.

[0049] Please refer to Figure 1 , Figure 2 In one possible implementation, preparing a conductive channel using photolithography technology includes:

[0050] A positive photoresist is applied to the predetermined antenna area of ​​the jewelry body 110, and the coating thickness is controlled within the range of 1-5 microns; illustratively, photoresist is a light-sensitive material that undergoes a chemical reaction when exposed to ultraviolet light. The positive photoresist changes from a dissolved state to an insoluble state in the exposed portion, while the unexposed portion remains dissolved.

[0051] The mask with the antenna pattern is exposed to ultraviolet light, causing the part of the positive photoresist not blocked by the mask to undergo a chemical reaction; specifically, the positive photoresist undergoes a cross-linking reaction under ultraviolet light, which changes the molecular structure of the exposed part and makes it insoluble in the developer. The unexposed part remains intact and continues to dissolve in the developer and is removed.

[0052] The exposed jewelry body 110 is placed in a developer to remove the positive photoresist in the exposed part; illustratively, the developer contains organic solvents, alkaline solutions and other components, which can effectively decompose and remove the photoresist. After ultraviolet light exposure, the photoresist is placed in the developer for processing. The developer acts on the photoresist in the exposed part, dissolving it from the surface of the mother body to form a conductive path.

[0053] The metal layer of the exposed part of the surface of the jewelry body 110 is removed by plasma dry etching or wet chemical etching technology to form a conductive path. For example, the metal surface of the exposed part is removed by plasma dry etching technology, and the etching depth is 5 microns to ensure the formation of a conductive path of the antenna structure 120. In order to ensure the conductivity and signal stability of the antenna structure 120, a subsequent electroplating process is performed. The electroplating material is gold, and the deposition thickness is controlled at 8 microns to ensure that the antenna structure 120 has good electromagnetic performance and stability in long-term use.

[0054] Please refer to Figure 1 , Figure 3 In one possible implementation, the etched conductive path is cleaned and deoxidized before electroforming; illustratively, the cleaning and deoxidation treatment can remove impurities and oxides on the surface of the conductive path, which, if not removed, may affect the adhesion and uniformity of the electroformed metal. By ensuring the cleanliness of the surface, the quality and uniformity of the electroformed layer can be improved. A clean surface can enhance the adhesion between the electroformed metal and the substrate material. This is because obstacles that may prevent the metal from directly contacting the substrate are removed, thereby enhancing the bonding strength between the two. If there are contaminants or oxides on the surface of the conductive path, bubbles or other defects may form during the electroforming process, which will affect the electromagnetic properties of the final product. Deoxidation treatment helps to avoid the occurrence of such defects. Oxides and other contaminants are generally non-conductive, and their presence on the conductive path will reduce the overall conductive performance. By cleaning and deoxidation treatment, it can be ensured that the conductive path has good conductive properties. Cleaning and deoxidation treatment not only improves the quality of the electroforming process, but also helps to extend the service life of the final product. Because a good electroformed layer can reduce maintenance requirements and improve corrosion resistance.

[0055] Please refer to Figure 1 , Figure 4 , using electroforming liquid for deposition, and the deposition thickness is controlled at 5-10 microns. For example, firstly, a 2-micron thick positive photoresist is coated on the antenna area of ​​the jewelry body 110 to ensure that the photoresist layer is uniform and flat. Through mask exposure technology, the micro-nano coil pattern of the antenna is exposed on the photoresist layer, and the line width of the antenna coil is 15 microns and the coil spacing is 20 microns.

[0056] Please refer to Figure 1, Figure 4 In one possible implementation, the deposition using the electroforming solution includes: controlling the current density during the electroforming process to be 2-5 A / dm 2 , the electroforming time does not exceed 60 minutes. Exemplarily, during electroforming, pure gold electroforming liquid is used, and preferably, the current density is set to 3A / dm 2 , the electroforming time is set to 40 minutes to ensure uniform coating. It should be noted that special attention should be paid to the surface smoothness and thickness control of the embedded antenna area to avoid affecting the antenna signal transmission due to excessive thickness of the electroforming layer. Of course, in specific applications, the current density can also be set to 2A / dm 2 , or 4A / dm 2 , or 5A / dm 2 The electroforming time can also be set to 30 minutes, 40 minutes, or 50 minutes.

[0057] Please refer to Figure 1 , Figure 2 In a possible embodiment, the chip 130 is installed in the accommodation space 111 by micro-welding technology to form a jewelry embryo, including: connecting the chip 130 to the conductive terminal of the antenna structure 120 by electroplating gold welding, and the size of the welding point is controlled to be 5-10 microns. Exemplarily, the RFID / NFC chip 130 is embedded in the accommodation space 111, and the chip 130 is connected to the antenna structure 120 by micro-welding technology, the diameter of the welding point is 6 microns, and the electroplating gold welding process is adopted to ensure that the resistance of the connection point does not exceed 2 ohms, thereby ensuring the reliability of signal transmission. Micro-welding technology can achieve extremely high-precision control of the welding point size, within the range of 5-10 microns mentioned in the text. This precision welding ensures that the connection between the chip 130 and the antenna has a high degree of reliability and stability, which is essential for maintaining long-term signal transmission performance. Through micro-welding technology, the resistance value of the welding point can be accurately controlled within the range of 1-5 ohms. Low and stable resistance values ​​help reduce energy loss during signal transmission and improve the efficiency and response speed of the entire system. Since micro-welding technology allows for very small welding points, it supports the miniaturization of jewelry. This means that the chip 130 and the antenna can be embedded more compactly in the jewelry without affecting the appearance and wearing comfort of the jewelry. The precise welding process helps to better protect the chip 130 and the antenna during the packaging process, avoiding damage caused by packaging materials or processes, thereby extending the service life of the smart jewelry.

[0058] In a possible implementation, after welding is completed, the welding point is tested. If the resistance value of the welding point is within the range of 1-5 ohms, the product is qualified. Exemplarily, after welding, a precision instrument is used to test the resistance of the connection between the chip 130 and the antenna structure 120 (i.e., the welding point) to ensure that the resistance value is between 1-5 ohms. After the chip 130 is embedded, the gold jewelry 100 is tested to ensure that the electromagnetic coupling between the antenna structure 120 and the chip 130 is good, the reading distance is not less than 6 cm, and the data transmission rate of 106 kbps is supported.

[0059] Please refer to Figure 1 , Figure 5 In a possible implementation, coating the protective layer 140 on the outer surface of the jewelry blank includes:

[0060] An epoxy resin encapsulation layer is coated on the outer surface of the jewelry embryo, and the thickness of the epoxy resin layer is controlled to be 20-50 microns; illustratively, in order to protect the embedded chip 130 and the antenna structure 120, epoxy resin is used for encapsulation in this embodiment. The thickness of the epoxy resin encapsulation layer is 30 microns, ensuring transparency and firmness, and effectively preventing the corrosion and wear of the chip 130 by the external environment. The epoxy resin encapsulation layer covers the outer surface of the jewelry embryo, and its thickness is controlled within the range of 20-50 microns. The setting of this layer can effectively protect the internal chip 130 and antenna structure 120, and prevent the external environment such as moisture, dust and other possible corrosive factors from damaging the internal electronic components. Secondly, by performing gold electroplating on the outer surface of the epoxy resin, not only the protective function of the encapsulation layer is enhanced, but also the consistency of the color and appearance of the encapsulated jewelry with the parent material can be ensured. This not only improves the durability and functionality of the jewelry, but also maintains the beauty and commercial value of the jewelry, and achieves a perfect combination of function and aesthetics.

[0061] Gold is used to electroplate the outer surface of the epoxy resin encapsulation layer, and the thickness of the electroplating layer is controlled to be 3-5 microns. For example, after the epoxy resin is cured, electroplating is performed on its surface, and the thickness of the electroplating layer is 4 microns. The electroplating material is gold, which is conducive to the appearance of the encapsulation area being consistent with the main body of the necklace 150. Of course, in specific applications, the thickness of the electroplating layer can also be set to 3 microns or 5 microns.

[0062] In a possible implementation, nano-coating protection technology is used to form a nano-coating on the surface of the jewelry embryo, and the thickness of the nano-coating is 10-50 nanometers. Exemplarily, the protective layer 140 includes an epoxy resin encapsulation layer, an electroplating layer, and a nano-coating arranged sequentially from the inside to the outside. In order to further improve the wear resistance of the gold jewelry 100, nano-coating technology is used to protect the surface of the necklace 150. The coating material is silicon dioxide with a thickness of 30 nanometers, which has excellent waterproof, scratch-resistant and anti-fingerprint effects, and is conducive to the gold jewelry 100 to maintain a bright appearance during long-term wear. Of course, in specific applications, the thickness of the nano-coating can also be set to 20 nanometers, or 40 nanometers.

[0063] Please refer to Figure 1 , Figure 2 In a possible implementation, heat treatment of the semi-finished jewelry product includes: local heating of the area where the chip 130 and the antenna structure 120 are installed, the heating temperature is controlled within the range of 100-200°C, the heating time does not exceed 15 minutes, and the heating rate during heat treatment is controlled at 2-5°C / minute. Exemplarily, after the chip 130 and the antenna structure 120 are embedded, the embedded area is strengthened by local heat treatment technology. The heat treatment temperature is controlled at 150°C and the treatment time is 10 minutes, ensuring that the hardness and durability of the overall structure of the necklace 150 are enhanced. The heating rate is 3°C / minute to ensure that the electroforming layer and the metal of the jewelry body 110 are well bonded to avoid peeling or cracking problems caused by differences in the thermal expansion coefficient of the material. Through heat treatment, the bonding strength between the electroforming layer and the antenna structure 120 and the chip 130 is significantly improved, which is conducive to improving the durability and electromagnetic performance of the gold jewelry 100 in actual wear. Of course, in specific applications, the heating temperature can also be set to 120°C, or 180°C, or 200°C. The heating rate can also be set to 2°C / min, 4°C / min, or 5°C / min.

[0064] In summary, the reasons why the jewelry necklace 150 of the present application can improve signal transmission efficiency and anti-oxidation performance are mainly attributed to the following points:

[0065] First, high-precision antenna design: The spiral micro-nano coil antenna is precisely manufactured through photolithography to ensure the conductive performance of the antenna. The precise control of the antenna line width and coil spacing (10-20 microns and no more than 30 microns respectively) optimizes high-frequency signal transmission, improves energy transmission efficiency, and sets the operating frequency to 13.56 MHz to support NFC functions.

[0066] Second, electroforming deposition technology: high-precision electroforming deposition is performed in the conductive channel of the antenna, using gold materials with a thickness controlled at 5-10 microns, ensuring the electromagnetic performance and oxidation resistance of the antenna. Strict control of current density and electroforming time (2-5A / dm2 and no more than 60 minutes) to ensure the uniformity and good conductivity of the coating. Third, efficient connection between chip 130 and antenna: the RFID / NFC chip 130 is connected to the antenna using electroplating gold welding technology, and the size of the welding point is controlled at 5-10 microns, ensuring the reliability of the connection between chip 130 and antenna. In addition, after welding, the connection point is tested, and the resistance value is kept in the range of 1-5 ohms, further ensuring the stability and efficiency of signal transmission.

[0067] Fourth, packaging protection: transparent epoxy resin is used as the packaging material with a thickness of 20-50 microns. It not only provides good protection for the chip 130 and the antenna area to prevent corrosion from the external environment, but also performs gold electroplating on its surface (3-5 microns thick) to ensure that the material and color of the package are consistent with the jewelry mother body, without affecting the appearance quality.

[0068] Fifth, nano-coating protection technology: The surface of gold jewelry 100 is treated with nano-coating protection, using aluminum oxide or silicon dioxide materials with a coating thickness of 10-50 nanometers, which provides waterproof, wear-resistant and anti-fingerprint effects, extending the service life of the jewelry while maintaining its clean appearance, indirectly improving the stability and antioxidant properties of signal transmission.

[0069] In a possible implementation, before processing the jewelry body 110, a computer-aided design tool is used for 3D modeling design. Exemplarily, the necklace 150 is accurately modeled as a whole using CAD software, and the design focuses on hiding the RFID / NFC chip 130 and the antenna structure 120 to ensure a balance between functional integration and aesthetic appearance. The chip 130 is embedded in the pendant part of the necklace 150, the thickness of the pendant is 3 mm, the depth of the accommodation space 111 is 0.8 mm, and the diameter is 1.2 mm, ensuring that the chip 130 is firmly embedded. It can be understood that the accommodation space 111 can fully accommodate the chip 130, so that the gold jewelry 100 of the present application does not affect the appearance of the jewelry itself after the chip 130 and the antenna are embedded. In this embodiment, the accommodation space 111 is cylindrical. Of course, in a specific application, the shape of the accommodation space 111 is not limited to this. For example, as an alternative, the shape of the accommodation space 111 can also be a prism, or an elliptical cylinder, and its shape and size are adapted to the size and size of the chip 130. The antenna is designed as a spiral micro-nano coil structure and is located in the middle section of the necklace 150 chain. The chain width is 2 mm, the antenna width is 0.6 mm, and the length is approximately 5 cm, ensuring that it can effectively transmit signals and remain concealed.

[0070] The actual effect of embedding the chip 130 is simulated by computer-aided design tools (such as CAM), taking into account the wearing comfort, the installation position of the chip 130 and the rationality of the space for embedding the antenna. After the final design is completed, the model is 3D printed to ensure that the size and shape of each component meet the expected standards.

[0071] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An intelligent manufacturing method for gold jewelry, characterized in that: include: The jewelry body is processed through high-precision electroforming technology, and a space is reserved for accommodating the chip; Conductive channels were fabricated using photolithography; Using electroforming technology to deposit a highly conductive metal material onto the conductive channel to form an antenna structure; The chip is mounted in the accommodating space by micro-welding technology to form a jewelry embryo; Coating a protective layer on the outer surface of the jewelry blank to form a semi-finished jewelry product; The semi-finished jewelry product is heat treated to form a finished jewelry product.

2. The intelligent manufacturing method of gold jewelry according to claim 1, characterized in that: The method of preparing the conductive channel using photolithography technology comprises: Applying positive photoresist to the predetermined antenna area of ​​the jewelry body, with the coating thickness controlled within the range of 1-5 microns; Exposing the mask having the antenna pattern to ultraviolet light to cause a chemical reaction in the portion of the positive photoresist not blocked by the mask; Putting the exposed jewelry body into a developer to remove the positive photoresist on the exposed part; Plasma dry etching or wet chemical etching technology is used to remove the metal layer of the exposed portion of the surface of the jewelry body to form the conductive path.

3. The intelligent manufacturing method of gold jewelry according to claim 2, characterized in that: Performing cleaning and deoxidation treatment on the etched conductive channel before electroforming; Electroforming liquid is used for deposition, and the deposition thickness is controlled at 5-10 microns.

4. The intelligent manufacturing method of gold jewelry according to claim 3 is characterized in that: The deposition using electroforming liquid includes: controlling the current density during electroforming to be 2-5A / dm 2 , the electroforming time does not exceed 60 minutes.

5. The intelligent manufacturing method of gold jewelry according to claim 1, characterized in that: The step of installing the chip in the accommodating space by micro-welding technology to form a jewelry embryo comprises: connecting the chip with the conductive terminals of the antenna structure by electroplating gold welding, and the size of the welding point is controlled within 5-10 microns.

6. The intelligent manufacturing method of gold jewelry according to claim 5, characterized in that: After welding is completed, the welding point is tested. If the resistance value of the welding point is within the range of 1-5 ohms, the product is qualified.

7. The intelligent manufacturing method of gold jewelry according to claim 1, characterized in that: The step of coating the outer surface of the jewelry body with a protective layer comprises: Coating an epoxy resin encapsulation layer on the outer surface of the jewelry body, wherein the thickness of the epoxy resin layer is controlled to be 20-50 microns; Gold is used for electroplating on the outer surface of the epoxy resin packaging layer, and the thickness of the electroplating layer is controlled at 3-5 microns.

8. The intelligent manufacturing method of gold jewelry according to claim 1, characterized in that: A nano coating is formed on the surface of the jewelry blank using a nano coating protection technology, wherein the thickness of the nano coating is 10-50 nanometers.

9. The intelligent manufacturing method of gold jewelry according to claim 8, characterized in that: The heat treatment of the semi-finished jewelry product includes: local heating of the area where the chip and the antenna structure are installed, the heating temperature is controlled within the range of 100-200°C, the heating time does not exceed 15 minutes, and the heating rate during heat treatment is controlled within 2-5°C / minute.

10. The intelligent manufacturing method of gold jewelry according to claim 1, characterized in that: Before processing the jewelry body, a computer-aided design tool is used to perform 3D modeling design.

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