Wafer back surface tin plating device and method

Abstract

The invention provides a wafer back surface tin plating device and method, and belongs to the technical field of wafer tin plating. The wafer back tin plating device is characterized by comprising a machining table, a wafer bearing table, a front-back moving lifting mechanism and a left-right moving tin plating mechanism, a plurality of containing grooves used for containing the wafer bearing table are formed in the machining table in an array mode, and a third drainage hole is formed in the groove bottom of each containing groove; the plurality of wafer bearing tables are arrayed in sequence and are clamped in the placing groove of the processing table; the front-back moving lifting mechanism comprises two first mounting plates which are symmetrically mounted on the left side and the right side of the machining table, a first driving motor is mounted on one side of each first mounting plate, a first lead screw is in transmission connection with an output shaft of each first driving motor, and first guide rails are mounted on the left side and the right side of the machining table; and a first sliding seat is arranged on the first guide rail in a sliding mode, the first sliding seat is connected with a first lead screw, a first lifting motor is fixed to the sliding seat, and a tin plating mechanism capable of moving left and right is fixed to the first lifting motor. The method has the advantage of modularized rapid tin plating.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer tinning, and specifically relates to a wafer back side tinning device and method. Background Art

[0002] Tin plating and its alloys are coatings with good solderability and certain corrosion resistance, and are widely used in electronic components and printed circuit boards. In addition to physical methods such as hot dipping and spraying, chemical plating and other methods for preparing the tin layer have been widely used in industry because they are simple and easy. The tin-lead alloy is in liquid state at high temperature, and the chip is attached to the tin-lead alloy solder through a suction nozzle. During the production process, problems such as chip tilt or offset, too much or too little tin-lead solder, insufficient solder distribution, and excess solder are prone to occur. When tin-lead alloy is plated on the back side, the wafer can only be placed on a wafer tinning platform for tinning the back side of a single wafer. It takes a lot of time to take the wafer out or put the wafer in, resulting in low processing efficiency. Summary of the invention

[0003] The purpose of the present invention is to address the above-mentioned problems in the prior art and to propose a wafer back side tinning device and method, which has the advantages of modular rapid tinning.

[0004] The purpose of the present invention can be achieved through the following technical solutions: a device and method for tinning the back of a wafer, characterized by comprising a processing table, a wafer carrying table, a front-to-back moving lifting mechanism, and a left-to-right moving tinning mechanism,

[0005] A plurality of placement slots for placing wafer carriers are arranged in an array on the processing table, and a third drainage hole is provided at the bottom of each placement slot;

[0006] A plurality of the wafer carriers are arranged in an array in sequence and clamped in the placement slots of the processing table;

[0007] The front-to-back moving lifting mechanism comprises two first mounting plates symmetrically installed on the left and right sides of the processing table, a first driving motor is installed on one side of the first mounting plate, a first screw rod is connected to the output shaft of the first driving motor, first guide rails are installed on the left and right sides of the processing table, a first sliding seat is slidably arranged on the first guide rail, the first sliding seat is connected to the first screw rod, a first lifting motor is fixed on the sliding seat, and a left-right moving tinning mechanism is fixed on the first lifting motor;

[0008] The left-right moving tin-plating mechanism includes a box body, a first lifting motor is connected to the box body, a second driving motor is installed on one side of the box body, a second screw rod is transmission-connected to the output shaft of the second driving motor, a second guide rail is fixed in the box body, a second sliding seat is slidably arranged on the second guide rail, the second sliding seat is connected to the second screw rod, a rotating seat is installed on the second sliding seat, a rotating cylinder is rotatably connected to the rotating seat, and a spray cleaning component and an electroplating part are fixed on the rotating cylinder.

[0009] Preferably, the wafer carrier comprises a box body, the box body has protruding sliding parts on all four sides, the groove wall of the placement groove is provided with sliding grooves on all four sides, and the protruding sliding parts are slidably matched with the sliding grooves.

[0010] Preferably, the box body is provided with a partition plate, which divides the box body into a first part and a second part from top to bottom. The first part includes four hydraulic cylinders arranged around the box body, and a clamping part is fixed on the piston rod of the hydraulic cylinder for clamping the wafer. A first drainage hole is also provided on the partition plate. The second part includes a sealing cylinder and a second drainage hole. The first drainage hole is connected to the second drainage hole, and the second drainage hole is connected to the third drainage hole. A shock-absorbing spring and a matching damper are arrayed in the sealing cylinder, and the damper is connected to the shock-absorbing spring, and the shock-absorbing spring is connected to the partition plate.

[0011] Preferably, the side of the clamping portion facing the wafer further includes a shock-absorbing buffer pad.

[0012] Preferably, the top of the box body also includes a water tank, one side of the water tank has a delivery pipe, the delivery pipe is connected to the spray cleaning assembly, the spray cleaning assembly includes a water storage cylinder, the water storage cylinder has a high-pressure pump, the water storage cylinder is fixedly connected to a spray head, and the spray head is aligned with the wafer surface.

[0013] Preferably, the sliding directions of the first sliding seat and the second sliding seat are perpendicular.

[0014] Preferably, a wafer backside tinning device and method comprises the following steps:

[0015] S1. First, pre-place the wafers on each wafer carrier, and use the transport clamp and the robot arm to accurately place the wafer carriers into the placement slots on the processing table in sequence;

[0016] S2, pushing the clamping parts in four directions by hydraulic cylinders to clamp the wafer;

[0017] S3, adjusting the horizontal position of the electroplated part by driving the first sliding seat on the first driving motor and the second sliding seat on the second driving motor, and then adjusting the vertical position of the electroplated part by raising or lowering the first lifting motor to perform electroplating on each wafer;

[0018] S4, the tinning current range of the electroplated part is 0-10A; the tinning time range is 30s-10m; the rotating drum speed is 1-10 rpm; the temperature range is 25-70°C;

[0019] S5. After electroplating, the back side of the wafer is sprayed with a shower head, and then cleaned and drained;

[0020] S6. Take out the wafer carrier and the wafer.

[0021] Compared with the prior art, the advantages of the present invention are: 1. A plurality of wafer carriers arranged in an array are added on the processing table, which is conducive to the one-time batch tinning of the back of the wafer, reducing the time for replacing the original wafer and disassembling, installing and replacing, greatly improving the processing efficiency of the device, and having a higher degree of mechanization;

[0022] 2. The horizontal position of the electroplated part is adjusted by driving the first sliding seat on the first driving motor and the second sliding seat on the second driving motor, and then the vertical position of the electroplated part is adjusted by raising or lowering the first lifting motor to perform electroplating on each wafer, which is beneficial to greatly improve the processing efficiency and quality of the device and automatically tin-plating. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a front view of the present invention.

[0024] Figure 2 It is a top view of the processing table of the present invention.

[0025] Figure 3 It is a top view of the wafer carrier of the present invention.

[0026] Figure 4 It is a connection structure diagram of the processing table and the wafer supporting table in the present invention.

[0027] Figure 5 It is a structural diagram of the part below the second sliding seat in the present invention.

[0028] In the figure, 2, processing table; 21, placement groove; 22, third drainage hole; 3, wafer carrier; 31, box body; 311, partition plate; 3111, hydraulic cylinder; 3112, clamping part; 312, first drainage hole; 3131, sealing cylinder; 3132, second drainage hole; 32, protruding sliding part; 33, sliding groove; 4, first mounting plate; 42, first screw rod; 43, first guide rail; 44, first sliding seat; 45, first lifting motor; 51, box body; 52, second driving motor; 53, second screw rod; 54, second guide rail; 55, second sliding seat; 56, rotating seat; 57, rotating cylinder; 59, electroplating part; 61, shock-absorbing spring; 62, damper; 63, shock-absorbing cushion; 71, water storage tank; 72, delivery pipe; 73, water storage cylinder; 74, sprinkler head; 81, fourth drainage hole. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] like Figures 1 to 5 As shown, a device and method for tinning the back of a wafer, through the following device, characterized in that it includes a processing table 2, a wafer carrier table 3, a front-to-back moving lifting mechanism, and a left-to-right moving tinning mechanism,

[0031] A plurality of placement slots 21 for placing the wafer carrier 3 are arranged in an array on the processing table 2, and a third drainage hole 22 is opened at the bottom of each placement slot 21;

[0032] A plurality of the wafer carriers 3 are arranged in an array and clamped in the placement groove 21 of the processing table 2;

[0033] The forward and backward moving lifting mechanism includes two first mounting plates 4 symmetrically installed on the left and right sides of the processing table 2, a first driving motor is installed on one side of the first mounting plate 4, a first screw rod 42 is drivingly connected to the output shaft of the first driving motor, first guide rails 43 are installed on the left and right sides of the processing table 2, a first sliding seat 44 is slidably arranged on the first guide rails 43, the first sliding seat 44 is connected to the first screw rod 42, a first lifting motor 45 is fixed on the sliding seat, and a left and right moving tinning mechanism is fixed on the first lifting motor 45;

[0034] The left-right moving tin-plating mechanism includes a box body 51, a first lifting motor 45 is connected to the box body 51, a second driving motor 52 is installed on one side of the box body 51, and a second screw rod 53 is transmission-connected to the output shaft of the second driving motor 52, a second guide rail 54 is fixed in the box body 51, a second sliding seat 55 is slidingly arranged on the second guide rail 54, the second sliding seat 55 is connected to the second screw rod 53, a rotating seat 56 is installed on the second sliding seat 55, a rotating cylinder 57 is rotatably connected to the rotating seat 56, and a spray cleaning component and an electroplating part 59 are fixed on the rotating cylinder 57.

[0035] With the above structure, the wafers are first pre-placed on each wafer carrier 3, and the wafer carrier 3 is accurately placed in the placement groove 21 on the processing table 2 in sequence by the transport clamp and the robot arm; the clamping parts 3112 in four directions are pushed by the hydraulic cylinder 3111 to clamp the wafer; the horizontal position of the electroplating part 59 is adjusted by driving the first sliding seat 44 on the first driving motor and the second sliding seat 55 on the second driving motor 52, and then the vertical position of the electroplating part 59 is adjusted by raising or lowering the first lifting motor 45 to perform electroplating on each wafer; the tinning current range of the electroplating part 59 is 0-10A; the tinning time range is 30s-10m; the rotation speed of the rotating drum 57 is 1-10 rpm; the temperature range is 25-70°C; after electroplating, the back of the wafer is sprayed by the spray cleaning component, and cleaning and drainage are performed; finally, the wafer carrier 3 and the wafer are taken out. The setting of this structure is conducive to flexible adjustment of the position of the electroplating part 59 on the second sliding seat 55 in any horizontal direction, and the electroplating part 59 can rotate during electroplating. At the same time, a plurality of arranged wafer support tables 3 are added to the processing table 2, which is conducive to the one-time batch tinning of the back of the wafer, reducing the time for replacing the original wafer and disassembly, installation and replacement, greatly improving the processing efficiency of the device and increasing the degree of mechanization.

[0036] Specifically, if Figures 1 to 5 As shown, the wafer carrier 3 includes a box body 31 , and the box body 31 has protruding sliding parts 32 on all sides. The groove wall of the placement groove 21 is provided with sliding grooves 33 on all sides, and the protruding sliding parts 32 are slidably matched with the sliding grooves 33 .

[0037] With the above structure, the protruding sliding portion 32 and the sliding groove 33 slide together, which is conducive to more convenient placement of the wafer carrier 3 when it is placed on the box body 31, and is conducive to improving the efficiency of placing or removing the wafer carrier 3.

[0038] like Figures 1 to 5As shown, a partition plate 311 is provided in the box body 31, and the partition plate 311 divides the box body 31 into a first part and a second part from top to bottom. The first part includes four hydraulic cylinders 3111 arranged around the box body 31, and a clamping part 3112 is fixed on the piston rod of the hydraulic cylinder 3111 for clamping the wafer. A first drainage hole 312 is also provided on the partition plate 311, and the second part includes a sealing cylinder 3131 and a second drainage hole 3132, the first drainage hole 312 is connected to the second drainage hole 3132, and the second drainage hole 3132 is connected to the third drainage hole 22; a shock-absorbing spring 61 and a damper 62 matched therewith are arranged in an array in the sealing cylinder 3131, the damper 62 is connected to the shock-absorbing spring 61, and the shock-absorbing spring 61 is connected to the partition plate 311.

[0039] The damper 62 and the shock-absorbing spring 61 are provided to reduce the vibration and shaking of the wafer placed on the box body 31, and the wafer is clamped by the clamping parts 3112 in four directions, which is conducive to better fixing the wafer when the wafer surface is tinned, thereby improving the quality of the tinning on the wafer surface. The first drain hole 312 is connected with the second drain hole 3132, and the second drain hole 3132 is connected with the third drain hole 22, which is conducive to conveying and discharging the remaining water after the spray cleaning component sprays and cools the wafer. The fourth drain hole 81 also provided on the processing table 2 can also discharge the accumulated water remaining on the processing table 2 to the outside.

[0040] like Figures 1 to 5 As shown, the side of the clamping portion 3112 facing the wafer further includes a shock-absorbing cushion 63. The provision of the shock-absorbing cushion 63 is helpful in reducing the deflection and vibration of the wafer during tinning.

[0041] like Figures 1 to 5 As shown, the top of the box body 51 also includes a water tank 71, and one side of the water tank 71 has a delivery pipe 72, and the delivery pipe 72 is connected to the spray cleaning component. The spray cleaning component includes a water storage cylinder 73, and the water storage cylinder 73 has a high-pressure pump. The water storage cylinder 73 is fixedly connected to a spray head 74, and the spray head 74 is aligned with the wafer surface.

[0042] like Figures 1 to 5 As shown, the sliding directions of the first sliding seat 44 and the second sliding seat 55 are perpendicular. By driving the first sliding seat 44 on the first driving motor and the second sliding seat 55 on the second driving motor 52, the horizontal position of the electroplating part 59 is adjusted, which is conducive to flexibly adjusting the position of the electroplating part 59 on the second sliding seat 55 in any horizontal direction, and is more practical.

[0043] like Figures 1 to 5 As shown, the following steps are included:

[0044] S1, first pre-place the wafers on each wafer carrier 3, and use the transport clamp and the robot arm to accurately place the wafer carrier 3 in the placement slot 21 on the processing table 2 in sequence;

[0045] S2, pushing the clamping parts 3112 in four directions by the hydraulic cylinder 3111 to clamp the wafer;

[0046] S3, by driving the first sliding seat 44 on the first driving motor and the second sliding seat 55 on the second driving motor 52, the horizontal position of the electroplating part 59 is adjusted, and then the vertical position of the electroplating part 59 is adjusted by lifting or lowering the first lifting motor 45 to perform electroplating treatment on each wafer;

[0047] S4, the tinning current range of the electroplating part 59 is 0-10A; the tinning time range is 30s-10m; the rotation speed of the rotating drum 57 is 1-10 rpm; the temperature range is 25-70°C;

[0048] S5, after electroplating, the back side of the wafer is sprayed by the shower head 74, and cleaning and drainage are performed;

[0049] S6, taking out the wafer carrier 3 and the wafer.

[0050] The tin-plating operation is carried out in the above-mentioned sequence, and a plurality of wafer carriers 3 are added to the processing table 2 in an arranged manner, which is conducive to the one-time batch tin-plating of the back side of the wafers, reducing the time for replacing the original wafers and disassembling, installing and replacing them, greatly improving the processing efficiency of the device, and achieving a higher degree of mechanization; by driving the first sliding seat 44 on the first driving motor and the second sliding seat 55 on the second driving motor 52 to adjust the horizontal position of the electroplating part 59, and then by raising or lowering the first lifting motor 45 to adjust the vertical position of the electroplating part 59, electroplating treatment is carried out on each wafer, which is conducive to greatly improving the processing efficiency and quality of the device and automatically tinning.

[0051] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0052] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. At the same time, the meaning of "and / or" appearing in the full text is that it includes three schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0053] The above components are all common standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0054] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A wafer backside tinning device and method, comprising the following device, characterized in that: It comprises a processing table (2), a wafer carrying table (3), a front-to-back moving lifting mechanism, and a left-to-right moving tinning mechanism. A plurality of placement grooves (21) for placing wafer carriers (3) are arranged in an array on the processing table (2), and a third drainage hole (22) is provided at the bottom of each placement groove (21); A plurality of the wafer carriers (3) are arranged in an array in sequence and clamped in a placement groove (21) of the processing table (2); The front-to-rear moving lifting mechanism comprises two first mounting plates (4) symmetrically mounted on the left and right sides of the processing table (2); a first driving motor is mounted on one side of the first mounting plate (4); a first screw rod (42) is drivingly connected to the output shaft of the first driving motor; first guide rails (43) are mounted on the left and right sides of the processing table (2); a first sliding seat (44) is slidably arranged on the first guide rails (43); the first sliding seat (44) is connected to the first screw rod (42); a first lifting motor (45) is fixed on the first sliding seat (44); and a left-right moving tinning mechanism is fixed on the first lifting motor (45); The left-right movable tin-plating mechanism comprises a box body (51), a first lifting motor (45) connected to the box body (51), a second driving motor (52) is installed on one side of the box body (51), a second screw rod (53) is transmission-connected to the output shaft of the second driving motor (52), a second guide rail (54) is fixed in the box body (51), a second sliding seat (55) is slidably arranged on the second guide rail (54), the second sliding seat (55) is connected to the second screw rod (53), a rotating seat (56) is installed on the second sliding seat (55), a rotating cylinder (57) is rotatably connected to the rotating seat (56), and a spray cleaning component and a plating part (59) are fixed on the rotating cylinder (57).

2. A wafer backside tinning device and method according to claim 1, characterized in that: The wafer carrier (3) comprises a box body (31), the box body (31) has protruding sliding parts (32) on all four sides, the slot wall of the placement slot (21) is provided with sliding slots (33) on all four sides, and the protruding sliding parts (32) are slidably matched with the sliding slots (33).

3. A wafer backside tinning device and method according to claim 2, characterized in that: The box body (31) has a partition plate (311) therein, and the partition plate (311) divides the box body (31) into a first part and a second part at the top and bottom. The first part includes four hydraulic cylinders (3111) arranged around the box body (31). A clamping part (3112) is fixed on the piston rod of the hydraulic cylinder (3111) for clamping the wafer. The partition plate (311) is also provided with a first drainage hole (312). The second part includes a sealing cylinder (3111). 131) and a second drainage hole (3132), the first drainage hole (312) is connected to the second drainage hole (3132), the second drainage hole (3132) is connected to the third drainage hole (22); a shock absorbing spring (61) and a damper (62) matched therewith are arranged in an array inside the sealing cylinder (3131), the damper (62) is connected to the shock absorbing spring (61), and the shock absorbing spring (61) is connected to the partition plate (311).

4. A wafer backside tinning device and method according to claim 3, characterized in that: The side of the clamping portion (3112) facing the wafer also includes a shock-absorbing cushion (63).

5. A wafer backside tinning device and method according to claim 1, characterized in that: The top of the box body (51) also includes a water storage tank (71), one side of the water storage tank (71) has a delivery pipe (72), the delivery pipe (72) is connected to the spray cleaning component, the spray cleaning component includes a water storage cylinder (73), the water storage cylinder (73) has a high-pressure pump, the water storage cylinder (73) is fixedly connected to a spray head (74), and the spray head (74) is aimed at the surface of the wafer.

6. A wafer backside tinning device and method according to claim 1, characterized in that: The sliding directions of the first sliding seat (44) and the second sliding seat (55) are perpendicular.

7. A wafer backside tinning device and method according to claim 1, characterized in that: The following steps are involved: S1, first pre-placing the wafers on each wafer carrier (3), and then accurately placing the wafer carriers (3) in the placement slots (21) on the processing table (2) in sequence by using a transport clamp and a robotic arm; S2, pushing the clamping parts (3112) in four directions by means of the hydraulic cylinder (3111) to clamp the wafer; S3, adjusting the horizontal position of the electroplating part (59) by driving the first sliding seat (44) on the first driving motor and the second sliding seat (55) on the second driving motor (52), and then adjusting the vertical position of the electroplating part (59) by raising or lowering the first lifting motor (45) to perform electroplating treatment on each wafer; S4, the tinning current of the electroplated part (59) is in the range of 0 to 10A; the tinning time is in the range of 30s to 10m; the rotation speed of the rotating drum (57) is in the range of 1 to 10 rpm; and the temperature is in the range of 25 to 70°C; S5, after electroplating, spraying the back of the wafer through a spray head (74), and performing cleaning and drainage treatment; S6, taking out the wafer carrier (3) and the wafer.

Images