Radiator assembly and electronic device

Abstract

The invention discloses a radiator assembly and an electronic device. The electronic device comprises a mounting base, a heat source and the radiator assembly. The mounting seat is provided with at least one first positioning part; the heat source is arranged on the mounting base. The radiator assembly comprises a radiator body and at least one positioning piece. The radiator body is thermally coupled to a heat source, the at least one positioning piece is movably arranged on the radiator body in a penetrating mode and detachably connected to the at least one first positioning part, and the radiator assembly is guided to be installed at the correct position of the installation base through connection of the positioning piece and the first positioning part. The radiator body can move in the horizontal direction through separation of the positioning piece and the first positioning part.

Description

Technical Field

[0001] The invention relates to a radiator assembly and an electronic device, in particular to a radiator assembly and an electronic device with a movable positioning member. Background Art

[0002] With the rapid development of technology, the computing performance of various electronic components has increased significantly, and a large amount of heat will be generated at the same time. When the heat generated by electronic components during operation is too high, it is easy to cause damage to the electronic components, thereby affecting the reliability of the electronic components.

[0003] Generally speaking, manufacturers will install the heat sink on the motherboard to dissipate the heat of electronic components, and use positioning pins and positioning holes to position the heat sink for easy assembly. In addition, thermal paste or thermal patches will be applied between the electronic components and the heat sink to reduce the contact thermal resistance. When the heat sink is thermally coupled to the electronic components, the electronic components and the heat sink will fit more closely due to atmospheric pressure and the adhesion of the thermal paste or thermal patch. However, the positioning pins of a general heat sink are fixedly located in the positioning holes to limit the horizontal movement direction of the heat sink. When the user wants to remove the heat sink from the motherboard, the heat sink that fits tightly to the electronic components can only be removed in the vertical direction. In addition to the difficulty for the user to apply force, the electronic components and the heat sink are also easily damaged by the force applied by the user. Therefore, how to remove the heat sink more labor-savingly and not easily cause damage to the electronic components and the heat sink is one of the problems that R&D personnel should solve. Summary of the invention

[0004] The present invention provides a radiator assembly and an electronic device, so as to save effort in disassembling the radiator and avoid damaging the electronic components and the radiator.

[0005] A heat sink assembly disclosed in an embodiment of the present invention is suitable for being installed on a mounting base provided with at least one first positioning portion and a heat source. The heat sink assembly includes a heat sink body and at least one positioning member. The heat sink body is used for thermal coupling to the heat source and has at least one first assembly hole. At least one positioning member is movably inserted into the heat sink body and detachably connected to the at least one first positioning portion, wherein the heat sink assembly is guided to be installed in the correct position of the mounting base by connecting the positioning member to the first positioning portion, and the heat sink body is movable in the horizontal direction by disengaging the positioning member from the first positioning portion.

[0006] The above-mentioned radiator assembly, wherein the radiator body has at least one first assembly hole; the at least one positioning member has at least one second positioning portion, and the at least one positioning member can be movably located in the at least one first assembly hole to position or release the at least one second positioning portion from the at least one first positioning portion.

[0007] The above-mentioned radiator assembly, wherein the at least one positioning member includes a head and an assembling portion, the assembling portion connects the head and the second positioning portion, and the diameter of the assembling portion is between the diameter of the head and the diameter of the second positioning portion, and the assembling portion is detachably mounted on the at least one first assembling hole so that the assembling portion or the second positioning portion can be selected to be located in the at least one first assembling hole to adjust the distance from the at least one positioning member to the mounting seat.

[0008] In the above-mentioned radiator assembly, the at least one first assembly hole and the assembly portion are matching screw holes and studs, and the assembly portion is screwed into the at least one first assembly hole.

[0009] In the above-mentioned heat sink assembly, the at least one first positioning portion and the at least one second positioning portion are matching positioning columns and positioning grooves.

[0010] The above-mentioned radiator assembly further comprises a plurality of fasteners, and the radiator body further comprises a plurality of second assembly holes. The fasteners are respectively arranged in the second assembly holes of the radiator body and are used to be detachably combined with the mounting seat.

[0011] Another embodiment of the present invention discloses an electronic device, comprising a mounting seat, a heat source and a radiator assembly. The mounting seat has at least one first positioning portion. The heat source is mounted on the mounting seat. The radiator assembly comprises a radiator body and at least one positioning member. The radiator body is thermally coupled to the heat source and has at least one first assembly hole. At least one positioning member is movably inserted into the radiator body and detachably connected to the at least one first positioning portion, wherein the radiator assembly is guided to be installed in the correct position of the mounting seat by connecting the positioning member to the first positioning portion, and the radiator body is movable in the horizontal direction by disengaging the positioning member from the first positioning portion.

[0012] The above-mentioned electronic device, wherein the radiator body has at least one first assembly hole; the at least one positioning member has at least one second positioning portion, and the at least one positioning member can be movably located in the at least one first assembly hole to position or release the at least one second positioning portion from the at least one first positioning portion.

[0013] The above-mentioned electronic device, wherein the at least one positioning member includes a head and an assembling portion, the assembling portion connects the head and the second positioning portion, and the diameter of the assembling portion is between the diameter of the head and the diameter of the second positioning portion, and the assembling portion is detachably mounted on the at least one first assembling hole so that the assembling portion or the second positioning portion can be selectively located in the at least one first assembling hole to adjust the distance from the at least one positioning member to the mounting seat.

[0014] In the above-mentioned electronic device, the at least one first assembly hole and the assembly portion are matching screw holes and studs, and the assembly portion is screwed into the at least one first assembly hole.

[0015] In the above-mentioned electronic device, the at least one first positioning portion and the at least one second positioning portion are matching positioning columns and positioning grooves.

[0016] In the electronic device, the heat sink assembly further comprises a plurality of fasteners, the heat sink body further comprises a plurality of second assembly holes, the fasteners are respectively disposed in the second assembly holes of the heat sink body and are used to be detachably combined with the mounting seat.

[0017] According to the heat sink assembly and the electronic device of the above embodiment, since the positioning member can be movably positioned in the first assembly hole, the second positioning portion can be moved relative to the first assembly hole when it is positioned in the first positioning portion to release the positioning relationship between the first positioning portion and the second positioning portion without limiting the horizontal movement direction of the heat sink body. Therefore, when the user wants to remove the heat sink assembly from the mounting seat, by releasing the positioning of the second positioning portion of the positioning member and the first positioning portion of the mounting seat, the horizontal movement direction of the heat sink body relative to the mounting seat is not limited by the positioning of the first positioning portion and the second positioning portion, and the user can first slightly move the heat sink body in the horizontal direction to reduce the atmospheric pressure between the heat source and the heat sink body and destroy the bonding structure between the heat source and the heat sink body caused by applying thermal paste or attaching thermal conductive patches. Therefore, the user can remove the heat sink assembly with less effort and it is not easy to cause damage to the heat source and the heat sink assembly.

[0018] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 FIG. 4 is a schematic three-dimensional diagram of an electronic device according to a first embodiment of the present invention.

[0020] Figure 2 for Figure 1 A partial cross-sectional schematic diagram of an electronic device.

[0021] Figure 3 for Figure 1 A partial cross-sectional schematic diagram of an electronic device in which a first positioning portion and a second positioning portion are positioned and a fastener is removed from a mounting seat.

[0022] Figure 4 for Figure 1 A partial cross-sectional schematic diagram of an electronic device in which a first positioning portion and a second positioning portion are positioned and a fastener is installed on a mounting seat.

[0023] Figure 5 for Figure 1 A partial cross-sectional schematic diagram of the electronic device in which the first positioning portion and the second positioning portion are released from the positioning and the fastener is removed from the mounting seat.

[0024] Figure 6 FIG. 4 is a schematic three-dimensional diagram of an electronic device according to a second embodiment of the present invention.

[0025] Wherein, the reference numerals are:

[0026] 10,10A:Electronic devices

[0027] 11: Mounting seat

[0028] 111: first positioning portion

[0029] 12: Heat Source

[0030] 13: Radiator assembly

[0031] 131: Radiator body

[0032] 1311: First assembly hole

[0033] 1312: Second assembly hole

[0034] 132: Positioning piece

[0035] 1321: Second positioning portion

[0036] 1322: Head

[0037] 1323: Assembly Department

[0038] 133: Fasteners

[0039] 134: Reset

[0040] 135: Heat pipe

[0041] 136: Cooling fins

[0042] A~F: Direction

[0043] D1~D3: diameter DETAILED DESCRIPTION

[0044] See also Figure 1 and Figure 2 . Figure 1 FIG. 4 is a schematic three-dimensional diagram of an electronic device according to a first embodiment of the present invention. Figure 2 for Figure 1 A partial cross-sectional schematic diagram of an electronic device.

[0045] The electronic device 10 of this embodiment includes a mounting seat 11, a heat source 12, and a heat sink assembly 13. The mounting seat 11 is, for example, a motherboard, and has a plurality of first positioning portions 111. These first positioning portions 111 are, for example, positioning grooves. The heat source 12 is, for example, a CPU chip or an image processor chip, and is mounted on the mounting seat 11.

[0046] The heat sink assembly 13 includes a heat sink body 131, a plurality of positioning members 132, a plurality of fasteners 133 and a plurality of reset members 134. The heat sink body 131 is thermally coupled to the heat source 12 and has a plurality of first assembly holes 1311 and a plurality of second assembly holes 1312. The so-called thermal coupling refers to thermal contact or connection through other heat-conducting media. These positioning members 132 are, for example, floating screws, and each positioning member 132 has a second positioning portion 1321. The second positioning portion 1321 is, for example, a positioning column, and the first positioning portion 111 matches the second positioning portion 1321. The positioning member 132 can be movably located in the first assembly hole 1311 to position or release the second positioning portion 1321 from the first positioning portion 111. In this way, the heat sink assembly 13 can be guided to be installed in the correct position of the mounting seat 11 through the first positioning portion 111 and the second positioning portion 1321.

[0047] Specifically, in this embodiment, each positioning member 132 can be movably disposed on the radiator body 131 and can be detachably connected to the at least one first positioning portion 111. When the positioning member 132 is connected to the first positioning portion 111, the radiator assembly 13 can be guided to be installed in the correct position of the mounting seat 11. When the positioning member 132 is separated from the first positioning portion 111, the radiator body 131 can be moved in the horizontal direction, wherein the horizontal direction is Figure 5 Direction E or direction F.

[0048] In detail, each positioning member 132 may further include a head 1322 and an assembly portion 1323. The assembly portion 1323 connects the head 1322 and the second positioning portion 1321, and the diameter D1 of the assembly portion 1323 is between the diameter D2 of the head 1322 and the diameter D3 of the second positioning portion 1321. In other words, the width of the positioning member 132 decreases from the head 1322 to the second positioning portion 1321. The first assembly hole 1311 and the assembly portion 1323 are, for example, matching screw holes and studs, and the assembly portion 1323 is detachably screwed into the first assembly hole 1311, so that the assembly portion 1323 or the second positioning portion 1321 is selected to be located in the first assembly hole 1311 to adjust the distance between the positioning member 132 and the mounting seat 11. In other words, if the heat sink assembly 13 is installed on the mounting seat 11, and when the assembly portion 1323 is screwed into the first assembly hole 1311, the positioning member 132 is relatively close to the mounting seat 11. If the heat sink assembly 13 is installed on the mounting base 11 , and when the screwing of the assembling portion 1323 and the first assembling hole 1311 is released so that the second positioning portion 1321 is located in the first assembling hole 1311 , the positioning member 132 is relatively away from the mounting base 11 .

[0049] These fasteners 133 are, for example, fixing screws, and these reset members 134 are, for example, compression springs. These fasteners 133 are respectively disposed in these second assembly holes 1312, and each reset member 134 is respectively clamped between the fasteners 133 and the radiator body 131. These fasteners 133 are detachably screwed to the mounting seat 11. When these fasteners 133 are locked to the mounting seat 11, the radiator assembly 13 is fixed to the mounting seat 11, and these reset members 134 are compressed by these fasteners 133 and the radiator body 131 to store elastic force. When these fasteners 133 are removed from the mounting seat 11, these reset members 134 release the elastic force to reset these fasteners 133, so that the radiator assembly 13 is removed from the mounting seat 11.

[0050] In this embodiment, the radiator assembly 13 may further include a heat pipe 135 and a heat dissipation fin 136. The heat pipe 135 connects the radiator body 131 and the heat dissipation fin 136. The heat dissipation fin 136 is, for example, a liquid cooling heat dissipation fin 136 or an air cooling heat dissipation fin 136. By providing the heat pipe 135 and the heat dissipation fin 136, the heat source 12 can be further cooled.

[0051] In this embodiment, the positioning member 132 can be movably located in the first assembly hole 1311. In addition to achieving the positioning function of the first positioning portion and the second positioning portion, the positioning relationship between the first positioning portion and the second positioning portion can be released by the second positioning portion being movable relative to the first assembly hole when the second positioning portion is located in the first positioning portion, without limiting the horizontal movement direction of the heat sink body 131. When the user wants to remove the heat sink assembly 13 from the mounting seat 11, by releasing the positioning of the second positioning portion 1321 of the positioning member 132 and the first positioning portion 111 of the mounting seat 11, the user can first slightly move the heat sink body 131 in the horizontal direction to reduce the atmospheric pressure between the heat source 12 and the heat sink body 131 and destroy the bonding structure between the heat source 12 and the heat sink body 131 caused by applying thermal paste or attaching thermal conductive patches, so that the user can remove the heat sink assembly 13 with less effort and it is not easy to cause damage to the heat source 12 and the heat sink assembly 13.

[0052] In this embodiment, the number of the first positioning portions 111, the number of the positioning members 132, and the number of the first assembly holes 1311 are, for example, two each, but are not limited thereto. In other embodiments, the number of the first positioning portions, the number of the positioning members, and the number of the first assembly holes may also be only one or more than three each.

[0053] In this embodiment, the number of fasteners 133, the number of reset members 134, and the number of second assembly holes 1312 are, for example, four each, but are not limited thereto. In other embodiments, the number of fasteners, the number of reset members, and the number of second assembly holes may also be less than three or more than five each.

[0054] See also Figures 3 to 5 . Figure 3 for Figure 1 A partial cross-sectional schematic diagram of an electronic device in which a first positioning portion and a second positioning portion are positioned and a fastener is removed from a mounting seat. Figure 4 for Figure 1 A partial cross-sectional schematic diagram of an electronic device in which a first positioning portion and a second positioning portion are positioned and a fastener is installed on a mounting seat. Figure 5 for Figure 1 A partial cross-sectional schematic diagram of the electronic device in which the first positioning portion and the second positioning portion are released from the positioning and the fastener is removed from the mounting seat.

[0055] like Figure 3 and Figure 4As shown, when the user wants to install the heat sink assembly 13 on the mounting seat 11, first, the assembly parts 1323 of the positioning members 132 are screwed into the first assembly holes 1311 of the heat sink body 131, and the heat sink body 131 is placed on the mounting seat 11 along direction A. At this time, the positioning members 132 are relatively close to the mounting seat 11. Then, the second positioning parts 1321 of the positioning members 132 are positioned with the first positioning parts 111 of the mounting seat 11 along direction B to guide the heat sink assembly 13 to the correct assembly position of the mounting seat 11. Finally, the fasteners 133 are locked to the mounting seat 11 along direction C, and the heat sink assembly 13 can be installed on the mounting seat 11.

[0056] In this embodiment, the second positioning portions 1321 of the positioning members 132 are first positioned with the first positioning portions 111 of the mounting seat 11, and then the fasteners 133 are locked to the mounting seat 11, but the present invention is not limited thereto. In other embodiments, the fasteners 133 may be first locked to the mounting seat 11, and then the second positioning portions 1321 of the positioning members 132 are positioned with the first positioning portions 111 of the mounting seat 11.

[0057] like Figure 5 As shown, when the user wants to disassemble the heat sink assembly 13 from the mounting seat 11, first, the screwing of the assembly parts 1323 of the positioning members 132 and the first assembly holes 1311 of the heat sink body 131 and the fasteners 133 and the mounting seat 11 is released. Then, the positioning members 132 are moved along the direction D to release the positioning of the second positioning parts 1321 and the first positioning parts 111, and the fasteners 133 are moved along the direction D to release the fixing of the heat sink assembly 13 from the mounting seat 11. At this time, the positioning members 132 are relatively far away from the mounting seat 11, and the horizontal movement direction of the heat sink body 131 relative to the mounting seat 11 is no longer restricted by the positioning of the first positioning parts 111 and the second positioning parts 1321. After moving the positioning members 132 and the fasteners 133, although the heat source 12 and the heat sink body 131 are still attached due to atmospheric pressure and thermal conductive paste or thermal conductive patch, the positioning and locking between the heat source 12 and the heat sink body 131 have been released. Finally, the user can horizontally move the heat sink body 131, for example, along direction E and direction F to reduce the atmospheric pressure between the heat source 12 and the heat sink body 131 and destroy the adhesive structure between the heat source 12 and the heat sink body 131 caused by applying thermal paste or attaching thermal conductive patches, and then the heat sink assembly 13 can be removed from the mounting base 11.

[0058] In the first embodiment, the first positioning portion 111 is a positioning groove, the second positioning portion 1321 is a positioning column, and the first positioning portion 111 matches the second positioning portion 1321, but the present invention is not limited thereto. Figure 6 . Figure 6The electronic device 10A of this embodiment is similar to the electronic device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated.

[0059] In the electronic device 10A of the present embodiment, the first positioning portion 111 may be, for example, a positioning column, and the second positioning portion 1321 may be, for example, a positioning groove, and the first positioning portion 111 matches the second positioning portion 1321 so that the second positioning portion 1321 is positioned or released from the first positioning portion 111. In this way, the heat sink assembly 13 may be installed in the correct position of the mounting base 11 by guiding the first positioning portion 111 and the second positioning portion 1321.

[0060] According to the heat sink assembly and the electronic device of the above embodiment, since the positioning member can be movably positioned in the first assembly hole, the second positioning portion can be moved relative to the first assembly hole when it is positioned in the first positioning portion to release the positioning relationship between the first positioning portion and the second positioning portion without limiting the horizontal movement direction of the heat sink body. Therefore, when the user wants to remove the heat sink assembly from the mounting seat, by releasing the positioning of the second positioning portion of the positioning member and the first positioning portion of the mounting seat, the horizontal movement direction of the heat sink body relative to the mounting seat is not limited by the positioning of the first positioning portion and the second positioning portion, and the user can first slightly move the heat sink body in the horizontal direction to reduce the atmospheric pressure between the heat source and the heat sink body and destroy the bonding structure between the heat source and the heat sink body caused by applying thermal paste or attaching thermal conductive patches. Therefore, the user can remove the heat sink assembly with less effort and it is not easy to cause damage to the heat source and the heat sink assembly.

[0061] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be determined by the protection scope of the claims attached to this specification.

Claims

1. A radiator assembly, characterized in that: Suitable for being mounted on a mounting base having at least one first positioning portion and a heat source, the heat sink assembly comprises: a heat sink body for thermally coupling to the heat source; and At least one positioning member is movably inserted into the radiator body and detachably connected to the at least one first positioning portion, wherein the radiator assembly is guided to be installed in the correct position of the mounting base through the connection between the positioning member and the first positioning portion, and the radiator body can be moved in the horizontal direction through the separation of the positioning member from the first positioning portion.

2. The heat sink assembly according to claim 1, wherein: The heat sink body has at least one first assembly hole; the at least one positioning member has at least one second positioning portion, and the at least one positioning member can be movably located in the at least one first assembly hole to position or release the at least one second positioning portion from the at least one first positioning portion.

3. The heat sink assembly according to claim 2, wherein: The at least one positioning member includes a head and an assembling portion, the assembling portion connects the head and the second positioning portion, and the diameter of the assembling portion is between the diameter of the head and the diameter of the second positioning portion. The assembling portion is detachably mounted on the at least one first assembling hole so that the assembling portion or the second positioning portion can be selectively located in the at least one first assembling hole to adjust the distance from the at least one positioning member to the mounting seat.

4. The heat sink assembly according to claim 3, wherein: The at least one first assembly hole and the assembly portion are matched screw holes and studs, and the assembly portion is screwed into the at least one first assembly hole.

5. The heat sink assembly according to claim 2, wherein: The at least one first positioning portion and the at least one second positioning portion are matching positioning columns and positioning grooves.

6. The heat sink assembly according to claim 2, wherein: It further comprises a plurality of fasteners. The radiator body further comprises a plurality of second assembly holes. The fasteners are respectively arranged in the second assembly holes of the radiator body and are used for being detachably combined with the mounting seat.

7. An electronic device, characterized in that: Include: A mounting seat having at least a first positioning portion; a heat source mounted on the mounting base; and A radiator assembly comprising: a heat sink body thermally coupled to the heat source; and At least one positioning member is movably inserted into the radiator body and detachably connected to the at least one first positioning portion, wherein the radiator assembly is guided to be installed in the correct position of the mounting base through the connection between the positioning member and the first positioning portion, and the radiator body can be moved in the horizontal direction through the separation of the positioning member from the first positioning portion.

8. The electronic device as claimed in claim 7, characterized in that: The heat sink body has at least one first assembly hole; the at least one positioning member has at least one second positioning portion, and the at least one positioning member can be movably located in the at least one first assembly hole to position or release the at least one second positioning portion from the at least one first positioning portion.

9. The electronic device as claimed in claim 7, characterized in that: The at least one positioning member includes a head and an assembling portion, the assembling portion connects the head and the second positioning portion, and the diameter of the assembling portion is between the diameter of the head and the diameter of the second positioning portion. The assembling portion is detachably mounted on the at least one first assembling hole so that the assembling portion or the second positioning portion can be selectively located in the at least one first assembling hole to adjust the distance from the at least one positioning member to the mounting seat.

10. The electronic device as claimed in claim 8, characterized in that The at least one first assembly hole and the assembly portion are matched screw holes and studs, and the assembly portion is screwed into the at least one first assembly hole.

11. The electronic device according to claim 7, wherein: The at least one first positioning portion and the at least one second positioning portion are matching positioning columns and positioning grooves.

12. The electronic device according to claim 7, wherein: The radiator assembly further comprises a plurality of fasteners, and the radiator body further comprises a plurality of second assembly holes. The fasteners are respectively arranged in the second assembly holes of the radiator body and are used for being detachably combined with the mounting seat.

Images