Ejector pin state detection device, film deposition detection method and semiconductor process equipment

Abstract

The invention discloses an ejector pin state detection device, a film deposition detection method and semiconductor process equipment. The detection device comprises an ejector pin which can be inserted into an ejector pin hole of a tray in a lifting manner and is used for receiving or sending out a wafer; the pressure sensors are arranged below the ejector pins respectively, and each pressure sensor comprises a plurality of pressure detection areas which correspond to a plurality of areas at the bottoms of the ejector pins respectively; and a controller configured to control each thimble to descend to a process position when the wafer is placed on the plurality of thimbles at the initial position, and perform a deposition process on the wafer, according to the pressure sensors, pressure detection values and drop point positions of a plurality of areas at the bottom of each ejector pin in the descending process are obtained; and determining the state of each thimble in the descending process based on the pressure detection values and the drop point positions of the plurality of areas. According to the invention, the back surface of the wafer can be prevented from being scratched due to the abnormal state of the ejector pin, and data support can be provided for timely cleaning of the ejector pin.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a pin state detection device, a film deposition detection method, a semiconductor process equipment, and a computer-readable storage medium. Background Art

[0002] In semiconductor process equipment, especially the reaction chamber in thin film deposition equipment, due to the particularity of some deposition processes, there is a lack of cleaning functions such as remote plasma system (RPS). As the process continues, the film will gradually accumulate on the components in the chamber, especially for key components such as lift pins and wafer trays that involve relative motion.

[0003] In the prior art, there is no detection device inside the reaction chamber to detect whether the ejector pin has fallen, and in semiconductor process equipment without a cleaning device, there is relative movement between the ejector pin and the heating plate. Once the film accumulates to a certain extent, the gap between the ejector pin and the ejector pin hole on the wafer tray will be significantly reduced, and the risk of the ejector pin being stuck is very high. The consequences of the ejector pin being stuck may not only cause problems such as debris and slides inside the equipment, but also cause abnormalities in process data, which has a serious impact on production efficiency and product quality. For the current lifting ejector pins in the reaction chamber, if the ejector pin is stuck, the machine will not receive the information immediately, and can only reversely analyze the abnormal process parameters, and the specific situation of each ejector pin can only be confirmed after the chamber is opened, which increases the complexity and time of maintenance work.

[0004] In order to solve the above-mentioned problems existing in the prior art, this field is in urgent need of a pin status detection technology, which can accurately detect the status of each pin in the tray during the lifting process, so as to effectively prevent the occurrence of pin jams and avoid the problem of scratches on the back of the wafer due to abnormal pin status. At the same time, it can also determine the film deposition conditions of each pin position, thereby providing data support for the timely cleaning of the tray and the pins. Summary of the invention

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects in the prior art, the present invention provides a pin state detection device, a film deposition detection method, a semiconductor process equipment, and a computer-readable storage medium, which can accurately detect the state of each pin in the tray during the lifting process, thereby effectively preventing the occurrence of pin jams and avoiding the problem of scratches on the back of the wafer due to abnormal pin state. At the same time, it can also determine the film deposition conditions of each pin position, thereby providing data support for timely cleaning of the tray and the pins.

[0007] Specifically, the ejector state detection device provided according to the first aspect of the present invention is arranged in a reaction chamber, and the ejector state detection device includes: an ejector pin that can be lifted and lowered and inserted into an ejector pin hole of a wafer tray to receive or deliver a wafer; a pressure sensor that is respectively arranged under each of the ejector pins, each of the pressure sensors including a plurality of pressure detection areas to respectively correspond to a plurality of areas at the bottom of each of the ejector pins; and a controller configured to: in response to a wafer delivered into the reaction chamber being placed on a plurality of ejector pins located at an initial position, control each of the ejector pins to descend to a process position to perform a deposition process on the wafer; obtain pressure detection values ​​and landing point positions of a plurality of areas at the bottom of each of the ejector pins during the descending process according to each of the pressure sensors; and determine the state of each of the ejector pins during the descending process based on the pressure detection values ​​and landing point positions of the plurality of areas at the bottom of the ejector pin.

[0008] Further, in some embodiments of the present invention, the step of determining the state of each of the ejector pins during the descent process based on the pressure detection values ​​of multiple areas at the bottom of the ejector pin and the landing point positions thereof includes: determining that the state of each of the ejector pins during the descent process is normal in response to the pressure detection values ​​of each pressure detection area in each of the pressure sensors being obtained as multiple identical fixed change values ​​that change with time during the descent process; or determining that at least one of the ejector pins is in an abnormal state of being stuck during the descent process in response to the pressure detection value of at least one pressure detection area in at least one pressure sensor being different from the fixed change values ​​of other pressure detection areas that change with time during the descent process.

[0009] Further, in some embodiments of the present invention, the step of determining the state of each of the ejector pins during the descent process based on the pressure detection values ​​of multiple areas of the bottom of the ejector pin and their landing points also includes: in response to the acquired landing points of multiple areas of the bottom of each ejector pin being evenly distributed in the corresponding pressure detection areas of the pressure sensor, determining that the state of each of the ejector pins during the descent process is normal; or in response to the landing points of multiple areas of the bottom of at least one ejector pin being skewedly distributed in the corresponding multiple pressure detection areas of the pressure sensor, determining that the at least one ejector pin has an abnormal state of eccentric falling during the descent process.

[0010] Furthermore, in some embodiments of the present invention, the controller is further configured to: in response to the wafer completing the deposition process, control each of the ejector pins to rise to the initial position to deliver the wafer; obtain, according to the multiple pressure sensors, the pressure detection values ​​corresponding to the multiple landing points at the bottom of each of the ejector pins during the rising process; and determine the state of each of the ejector pins during the rising process based on the pressure detection values ​​corresponding to the multiple landing points at the bottom.

[0011] Further, in some embodiments of the present invention, the step of determining the state of each of the ejector pins during the rising process based on the pressure detection values ​​corresponding to the multiple landing positions of the bottom includes: in response to the acquired pressure detection values ​​of the multiple landing positions of the bottom of each ejector pin being multiple identical fixed change values ​​that change with time during the rising process, determining that the state of each of the ejector pins during the rising process is normal; or in response to the fact that the pressure detection value of at least one landing position of the bottom of at least one ejector pin is different from the fixed change value of the pressure detection that changes with time at other landing positions during the rising process, determining that the at least one ejector pin is in an abnormal state of being stuck during the rising process.

[0012] Furthermore, in some embodiments of the present invention, a weight is provided at the bottom end of the ejector pin, and the ejector pin and the weight are detachably assembled and combined.

[0013] Furthermore, in some embodiments of the present invention, a limiting portion is provided on the top of the ejector pin, and the limiting portion is engaged with the ejector pin hole of the wafer tray so that the ejector pin is driven to perform a lifting movement during the lifting and lowering process of the wafer tray.

[0014] In addition, the above-mentioned film deposition detection method provided in the second aspect of the present invention is implemented by using the above-mentioned ejector pin state detection device provided in the first aspect of the present invention, and the film deposition detection method includes the following steps: in response to a wafer fed into a reaction chamber being placed on a plurality of ejector pins located at an initial position, controlling each of the ejector pins to descend to a process position to perform a deposition process on the wafer; according to each pressure sensor, respectively obtaining pressure detection values ​​and landing point positions of a plurality of regions at the bottom of each ejector pin during the descending process; determining the state of each ejector pin during the descending process based on the pressure detection values ​​and landing point positions of the plurality of regions at the bottom of the ejector pin; and determining the film deposition conditions between each ejector pin inserted in the ejector pin hole of the wafer tray and each ejector pin hole according to the state of each ejector pin during the descending process.

[0015] Furthermore, in some embodiments of the present invention, the step of determining the film deposition conditions between each ejector pin inserted in the ejector pin hole of the wafer tray and each ejector pin hole according to the state of each ejector pin during the descending process includes: in response to the presence of multiple areas of the bottom of at least one ejector pin having landing points skewedly distributed in the corresponding multiple pressure detection areas of the pressure sensor during the descending process; determining that the at least one ejector pin has an abnormal state of eccentric falling during the descending process; and determining that the film deposition between the at least one ejector pin and its corresponding ejector pin hole is uneven based on the abnormal result of the eccentric falling state of the at least one ejector pin.

[0016] Furthermore, in some embodiments of the present invention, the step of determining the film deposition conditions between each ejector pin inserted in the ejector pin hole of the wafer tray and each ejector pin hole according to the state of each ejector pin during the descending process, further includes: in response to the fact that the pressure detection value of at least one pressure detection area of ​​at least one pressure sensor during the descending process is different from the fixed change value that changes with time in other pressure detection areas during the descending process; determining that the at least one ejector pin is in an abnormal state of being stuck during the descending process; and determining, based on the abnormal result of the at least one ejector pin being stuck, that the film deposition between the at least one ejector pin and its corresponding ejector pin hole is serious, causing the ejector pin hole to be blocked.

[0017] In addition, the semiconductor process equipment provided according to the third aspect of the present invention includes: a reaction chamber, in which a wafer is placed for a deposition process; a wafer tray for holding the wafer; and the ejector pin status detection device provided by the first aspect of the present invention, which is assembled in combination with the wafer tray and is used to detect the film layer deposition conditions between each ejector pin inserted in the ejector pin hole of the wafer tray and each ejector pin hole.

[0018] In addition, according to the fourth aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the above-mentioned film deposition detection method provided by the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0020] Figure 1 A schematic structural diagram of a semiconductor process equipment provided according to some embodiments of the present invention is shown;

[0021] Figure 2A schematic diagram of the structure between the ejector pin and the wafer tray provided according to some embodiments of the present invention is shown;

[0022] Figure 3 An exploded view of an ejector pin provided according to some embodiments of the present invention is shown;

[0023] Figure 4 A schematic diagram of a top view of a pressure sensor provided according to some embodiments of the present invention is shown;

[0024] Figure 5 A flow chart of a film deposition detection method provided according to some embodiments of the present invention is shown;

[0025] Fig. 6A A schematic structural diagram showing an ejector pin in an initial position of an ejector pin state detection device provided by some embodiments of the present invention;

[0026] Figure 6B A schematic structural diagram of an ejector state detection device provided by some embodiments of the present invention when an ejector state is abnormal during the ejector lifting process is shown;

[0027] Figure 6C A schematic diagram showing a structure in which an ejector pin of an ejector pin state detection device provided by some embodiments of the present invention is located at a process position;

[0028] Fig. 7A A time-pressure curve diagram showing normal operation of the ejector during lifting and lowering provided by some embodiments of the present invention is shown;

[0029] Figure 7B A time-pressure curve diagram showing abnormal operation of the ejector during the descending process according to some embodiments of the present invention is shown;

[0030] Figure 7C A time-pressure curve diagram showing abnormal operation of the ejector during the lifting process provided by some embodiments of the present invention is shown;

[0031] Fig. 8A A schematic diagram of the structure of a ejector pin when a pin is stuck during the lifting process according to some embodiments of the present invention is shown;

[0032] Figure 8B A schematic diagram showing the structure of the ejector provided in some embodiments of the present invention when there is an eccentric drop during the descending process;

[0033] Fig. 9A A schematic diagram of a structure when a film layer is uniformly deposited between an ejector pin and its corresponding ejector pin hole according to some embodiments of the present invention is shown;

[0034] Fig. 9BA schematic diagram showing a structure in which a film layer is deposited unevenly between an ejector pin and its corresponding ejector pin hole provided in some embodiments of the present invention; and

[0035] Fig.10 A scatter diagram of the locations of the multiple landing points of the ejector pin on the pressure sensor provided in accordance with some embodiments of the present invention is shown.

[0036] Reference numerals:

[0037] 100 semiconductor process equipment;

[0038] 110 reaction chamber;

[0039] 120 wafer tray;

[0040] 121 thimble hole;

[0041] 130 sprinkler heads;

[0042] 140 padding;

[0043] 200 ejector state detection device;

[0044] 210 thimble;

[0045] 211 limiter;

[0046] 212 Heavy Hammer;

[0047] 220 pressure sensor;

[0048] 221 first pressure detection area;

[0049] 222 second pressure detection area;

[0050] 223 third pressure detection area;

[0051] 224 fourth pressure detection area;

[0052] 310 first weight housing;

[0053] 320 second weight housing;

[0054] 330 Gasket;

[0055] 340 Spring;

[0056] 350 Vacuum screw;

[0057] 360 bulge;

[0058] 371 first groove;

[0059] 372 second groove;

[0060] 400 wafers;

[0061] Steps S510 to S540;

[0062] 710 descending fixed change curve;

[0063] 711 descending abnormal change curve;

[0064] 720 rising fixed change curve;

[0065] 721 Ascending abnormal change curve;

[0066] 800 layers; and

[0067] 810 The landing point is biased towards position. DETAILED DESCRIPTION

[0068] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0069] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0070] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0071] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0072] As mentioned above, in the prior art, there is no detection device inside the reaction chamber for detecting whether the ejector pin has fallen, and in the semiconductor process equipment without a cleaning device, there is relative movement between the ejector pin and the heating plate. Once the film accumulates to a certain extent, the gap between the ejector pin and the ejector pin hole on the wafer tray will be significantly reduced, and the risk of the ejector pin being stuck is very high. The consequences of the ejector pin being stuck may not only cause problems such as debris and slides inside the equipment, but also cause abnormalities in process data, which has a serious impact on production efficiency and product quality. For the current lifting ejector pins in the reaction chamber, if the ejector pin is stuck, the machine will not receive the information immediately, and can only reversely analyze the abnormal process parameters, and the specific situation of each ejector pin can only be confirmed after the chamber is opened, which increases the complexity and time of maintenance work.

[0073] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a pin state detection device, a film deposition detection method, a semiconductor process equipment, and a computer-readable storage medium, which can accurately detect the state of each pin in the tray during the lifting process, thereby effectively preventing the occurrence of pin jams and avoiding the problem of scratches on the back of the wafer due to abnormal pin state. At the same time, it can also determine the film deposition status of each pin position, thereby providing data support for timely cleaning of the tray and the pins.

[0074] In some non-limiting embodiments, the ejector pin status detection device provided in the first aspect of the present invention may be configured in the semiconductor process equipment provided in the third aspect of the present invention, and used to implement the film deposition detection method provided in the second aspect of the present invention.

[0075] Specifically, in some non-limiting embodiments, the fourth aspect of the present invention provides the above-mentioned computer-readable storage medium, on which computer instructions are stored. When the computer instructions are executed by a processor, they can be used to implement the above-mentioned film deposition detection method provided by the second aspect of the present invention.

[0076] The working principle of the above-mentioned ejector state detection device will be described below in combination with some semiconductor process equipment and embodiments of the film deposition detection method. Those skilled in the art will understand that these semiconductor process equipment and embodiments of the film deposition detection method are only some non-restrictive implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the ejector state detection device. Similarly, the ejector state detection device is also only a non-restrictive implementation method provided by the present invention, and does not constitute a limitation on other configuration objects in these semiconductor process equipment and the implementation subjects of each step in the film deposition detection method.

[0077] Please see Figure 1 , Figure 1 A schematic structural diagram of a semiconductor process equipment provided according to some embodiments of the present invention is shown.

[0078] like Figure 1 As shown, in some embodiments of the present invention, the semiconductor process equipment 100 may mainly include a reaction chamber 110. Optionally, a sleeve structure may be provided on the inner wall of the reaction chamber 110 to provide a reaction zone for the wafer 400 therein. A wafer tray 120 may be included inside the reaction chamber 110, on which the wafer 400 is placed for performing a deposition process on the wafer 400. Further, the wafer tray 120 may include a heating component for heating the surface of the wafer 400 to provide a temperature that meets the process conditions. A shower head 130 may also be included above the reaction chamber 110, and a reaction gas is sprayed above the wafer tray 120 through the shower head 130, so that a thin film deposition process is performed on the surface of the wafer 400.

[0079] In addition, if Figure 1 As shown, the reaction chamber 110 of the semiconductor process equipment 100 may further include an ejector pin state detection device 200. The ejector pin state detection device 200 may be assembled with the wafer tray 120, and may be used to assist the robot in transferring wafers when the wafer tray 120 moves from the home position to the process position, and may also be used to detect the film deposition conditions between each ejector pin inserted in the ejector pin holes of the wafer tray 120 and each ejector pin hole.

[0080] Specifically, the ejector state detection device 200 is disposed in the reaction chamber 110 and may include: an ejector 210, a pressure sensor 220, and a controller (not shown in the drawings). Figure 1As shown, multiple ejector pins 210 in the reaction chamber 110 can be lifted and inserted into the ejector pin holes of the wafer tray 120 to receive or deliver the wafer 400. In addition, a liner 140 can be provided at the bottom of the reaction chamber 110, and the liner 140 can be provided with a number of holes corresponding to the ejector pins 210, so that when the ejector pins 210 fall to the ground, their bottoms fall into the corresponding holes below them, completing the landing positioning of the ejector pins 210 and preventing the ejector pins 210 from falling at an angle.

[0081] Further, optionally, the lifting ejector pin may include two forms, namely, a fixed ejector pin and an active ejector pin. A fixed ejector pin refers to an ejector pin without an independent driving element, and its movement depends on the lifting mechanism of the wafer tray 120, and only a set of driving devices for driving the wafer tray 120 to lift and lower is required. For a fixed ejector pin, its lifting and lowering depends on the lifting and lowering of the wafer tray 120. For example, the rising process of the fixed ejector pin is the falling process of the wafer tray 120. By the descent of the wafer tray 120, the fixed ejector pin is raised above the surface of the wafer tray 120, thereby realizing the rising of the fixed ejector pin. Similarly, the descent process of the fixed ejector pin is the rising process of the wafer tray 120. By the rise of the wafer tray 120, the upper end of the fixed ejector pin is flush with the surface of the wafer tray 120, thereby realizing the descent of the fixed ejector pin. The active ejector pin is equipped with independent driving devices such as cylinders and motors, which can realize lifting and lowering movements relatively independent of the wafer tray 120, but two sets of driving devices need to be provided separately. The active ejector pin can be independently raised and lowered by its corresponding ejector pin driving device.

[0082] In some embodiments of the present invention, in order to reduce equipment costs, a fixed ejector pin and a wafer tray 120 combination can be selected, and a set of driving devices for driving the wafer tray 120 can be used to realize the respective lifting functions of the ejector pin 210 and the wafer tray 120.

[0083] Please see Figure 2 , Figure 2 A schematic diagram of the structure between the ejector pin and the wafer tray provided according to some embodiments of the present invention is shown.

[0084] For the ejector pins, especially the fixed ejector pins, they mainly rely on their own weight to achieve relative movement with the wafer tray 120. Figure 2As shown, a weight 212 may be provided at the bottom of the ejector pin 210 to increase its own weight, and a stopper 211 may be provided at the top of the ejector pin 210. The size of the stopper 211 may be larger than the diameter of the lifting channel provided by the ejector pin hole 121 in the wafer tray 120. When the wafer tray 120 rises to a certain height, the inverted conical stopper 211 at the top of the ejector pin 210 may contact and engage with the inverted conical opening at the upper end of the ejector pin hole 121 in the wafer tray 120, and the upper end of the ejector pin 210 retracts into the ejector pin hole 121 of the wafer tray 120, so that the ejector pin 210 can be driven to rise synchronously during the subsequent rising process of the wafer tray 120, and the weight 212 is also lifted together with the ejector pin 210. Similarly, during the descent of the wafer tray 120 , before the ejector pin 210 contacts the pad 140 , the inverted conical opening of the ejector pin hole 121 always keeps in contact with the inverted conical limiting portion 211 , and the ejector pin 210 also descends synchronously with the wafer tray 120 .

[0085] It can be understood that in actual assembly, the outside of the ejector pin 210 is generally covered with a bushing (not shown in the drawings). When the ejector pin 210 is lifted and lowered in the ejector pin hole 121 of the wafer tray 120, it directly contacts and rubs against the bushing, thereby reducing the wear of the ejector pin 210.

[0086] Furthermore, preferably, the ejector pin 210 and the weight 212 at the bottom end thereof can be detachably assembled and combined, so that the ejector pin 210 can be quickly and conveniently installed or replaced without removing the wafer tray 120 .

[0087] Specifically, see Figure 3 , Figure 3 An exploded view of an ejector pin provided according to some embodiments of the present invention is shown.

[0088] like Figure 3 As shown, in some preferred embodiments, the weight 212 may include a first weight housing 310 located at the upper part and a second weight housing 320 located at the lower part, wherein the inner wall of the first weight housing 310 includes a first groove 371 and a second groove 372 arranged at intervals from each other, and the second groove 372 may be a groove structure with an upper opening. The ejector pin 210 is inserted into the first weight housing 310 and the second weight housing 320 located at the lower part, and the detachable installation and removal are realized together by the gasket 330, the spring 340 and the vacuum screw 350.

[0089] For details, please see Figure 3As shown in the partially enlarged area I in FIG. 1 , a plurality of protrusions 360 may be included on the lower side wall of the ejector pin 210. The lower surface of the protrusion 360 may contact the gasket 330 and the spring 340. During the installation of the ejector pin 210 and the weight 212, the ejector pin 210 may be pressed down so that the spring 340 is in a compressed state, thereby always providing an upward elastic force to the ejector pin 210 above it. The upward elastic force provided by the spring 340 in a compressed state may push the upper surface of the protrusion 360 on the ejector pin 210 toward the first groove 371 of the first weight housing 310, thereby pushing the protrusion 360 into the corresponding first groove 371, thereby completing the locking combination of the ejector pin 210 and the first weight housing 310.

[0090] During the disassembly of the ejector pin 210 and the weight 212, the ejector pin 210 can be pressed down and rotated again to transfer the protrusion 360 on the ejector pin 210 from the first groove 371 of the corresponding first weight housing 310 into the second groove 372. For example, in an embodiment including four protrusions and four first grooves, the protrusions 360 can be rotated 45° to allow each protrusion 360 to enter each second groove 372. Then, the upward elastic force provided by the spring 250 in the relaxed state can cause the protrusion 360 on the ejector pin 210 to pop out from the upper opening structure of the second groove 372, thereby completing the unlocking and separation of the ejector pin 210 and the first weight housing 310. Subsequently, the ejector pin 210 can be quickly replaced without removing the wafer tray 120.

[0091] In the prior art, the installation or replacement of some ejector pins 210 including the weight 212 can only be performed after the wafer tray 120 is removed, which not only increases the complexity and time of maintenance work, but also may cause damage to the heating plate during the disassembly and assembly process, thereby increasing the maintenance cost. In the above embodiment of the present invention, the matching structure of the ejector pin 210 with a self-locking function and the weight 212 allows the ejector pin 210 to be replaced without removing the wafer tray 120, which not only greatly improves the operating efficiency, but also significantly shortens the maintenance time of the ejector pin 210 in the wafer tray 120, reducing the maintenance and repair costs.

[0092] Please continue to return Figure 1 ,like Figure 1 As shown, the multiple pressure sensors 220 in the ejector state detection device 200 can be respectively arranged under each ejector 210, and each pressure sensor 220 includes a plurality of pressure detection areas, which are used to respectively correspond to the multiple areas at the bottom of each ejector 210, so that the pressure value of each area at the bottom of the ejector 210 during the lifting and lowering process can be detected in different areas.

[0093] For details, please refer to Figure 4 , Figure 4A schematic diagram of the top structure of a pressure sensor provided according to some embodiments of the present invention is shown.

[0094] like Figure 4 As shown, in some optional embodiments, the pressure sensor 220 is divided into four main pressure detection areas, namely the first pressure detection area 221, the second pressure detection area 222, the third pressure detection area 223 and the fourth pressure detection area 224. Preferably, each main pressure detection area can be further divided. For example, each main pressure detection area can include a plurality of concentric 1 / 4 rings of different diameters (such as 1 / 4 rings A1 to F1), so that each independent 1 / 4 ring can measure the partial pressure of the ejector 210 falling thereon, and then can accurately measure the pressure of the weight 212 in different states, and feedback a more real and accurate falling state of the ejector 210.

[0095] Those skilled in the art can understand that the solution that each pressure sensor 220 includes 4 main pressure detection areas is only a non-limiting implementation provided by the present invention, which is intended to clearly demonstrate the main concept of the present invention and provide a specific solution that is convenient for the public to implement, rather than to limit the scope of protection of the present invention. Optionally, in other embodiments, those skilled in the art can also divide it into more pressure detection areas based on the concept of the present invention, such as 8 areas or more areas, so as to better detect which partition the heavy hammer 212 falls on, so as to further understand the specific form of the ejector state abnormality.

[0096] Please continue to return Figure 1 ,like Figure 1 As shown, the controller included in the ejector state detection device 200 can be used to detect the state of the ejector 210 during the lifting process, and based on this, the film deposition detection method provided by the second aspect of the present invention is implemented. Next, the configuration of the controller will be further introduced through some embodiments of the film deposition detection method.

[0097] Please refer to 5. Figure 5 A flow chart of a film deposition detection method provided according to some embodiments of the present invention is shown.

[0098] like Figure 5 As shown, in some embodiments of the present invention, the film state detection method may include the following steps: Step S510: In response to a wafer introduced into a reaction chamber being placed on a plurality of ejector pins at an initial position, each ejector pin is controlled to descend to a process position to perform a deposition process on the wafer.

[0099] Specifically, please combine Fig. 6A , 6B , and a common understanding of 6C, Fig. 6AIt shows a schematic structural diagram of an ejector pin in an initial position of an ejector pin state detection device provided by some embodiments of the present invention, Figure 6B A schematic diagram of the structure of an ejector state detection device provided by some embodiments of the present invention when an ejector state is abnormal during the ejector lifting process is shown. Figure 6C A schematic structural diagram showing an ejector pin at a process position of an ejector pin status detection device provided by some embodiments of the present invention.

[0100] like Fig. 6A As shown, the plurality of ejector pins 210 in the wafer tray 120 can rise to the initial position (i.e., higher than the wafer tray 120) to receive the wafer 400 sent into the reaction chamber 110 by the robot. After the wafer 400 is placed on the plurality of ejector pins 210 located at the initial position, the controller can control each ejector pin 210 to descend to the process position (i.e., flush with the surface of the wafer tray 120), so that the wafer 400 falls to the surface of the wafer tray 120. Figure 6C As shown, if the wafer 400 lands smoothly on the surface of the wafer tray 120, a deposition process may be performed on the wafer 400 on the wafer tray 120. At this time, a reaction gas may be sprayed through the shower head 130 to deposit a thin film on the surface of the wafer 400.

[0101] During the descent of the wafer 400, step S520 may be performed: pressure detection values ​​of multiple regions of the bottom of each ejector pin and their landing positions are obtained according to multiple pressure sensors. Then, step S530 may be performed: based on the pressure detection values ​​of multiple regions of the bottom of the ejector pin and their landing positions, the state of each ejector pin during the descent process is determined.

[0102] Specifically, please see Fig. 7A When the ejector pin 210 operates normally during the descent process, the pressure change curve of each pressure detection area measured by the pressure sensor 220 below it is a descending fixed change curve 710. In order to more clearly introduce the change of the pressure value of each area at the bottom of the ejector pin 210 during the lifting process, therefore, Fig. 7A , and the pressure in the time-pressure curve diagrams shown in the following 7B and 7C can be simplified to the pressure change of the ejector pin 210, excluding the pressure of the wafer.

[0103] Can be combined Figure 4 and Fig. 7AIt is commonly understood that during the descent of the ejector pin 210, during the initial descent time period t1-t2, the ejector pin 210 passes through the limiter 211 at the top and descents synchronously with the wafer tray 120, and the weight 212 at the bottom is still in a suspended state, so the pressure detection value of each pressure detection area at this time is 0Pa. When the ejector pin 210 descends to the mid-descent time period t2-t3, the weight 212 at the bottom gradually falls to the ground and gradually contacts the pressure sensor 220 located on the pad 140, so the pressure detection value of each pressure detection area at this time shows a gradually rising trend. During the t3-t4 time period, the ejector pin 210 has completely fallen on the pressure sensor 220, so the pressure detection value of each pressure detection area at this time is the average value of the weight of the ejector pin 210 including the weight 212, for example, 2Pa.

[0104] Therefore, that is to say, when the ejector pin 210 operates normally during the descending process, that is, from FIG. 6A to FIG. 6C If the process is in a normal state, the pressure detection values ​​of each pressure detection area in the pressure sensor 220 corresponding to each ejector pin 210 in the reaction chamber 110 are multiple identical fixed change values ​​that change with time during the descending process, and it can be determined that each ejector pin 210 is in a normal state during the descending process.

[0105] However, if Figure 6B As shown, if the pressure detection value of at least one pressure detection area in response to the existence of at least one pressure sensor 220 is different from the fixed change value of other pressure detection areas that changes with time during the descent process, it can be determined that there is an abnormal stuck state of at least one ejector pin 210 during the descent process.

[0106] Specifically, if Figure 7B As shown in FIG. 7 , when the ejector pin 210 operates abnormally during the descent process, the pressure variation curve of at least one pressure detection zone measured by the pressure sensor 220 located below the ejector pin 210 over time is a descent abnormal variation curve 711. Fig. 8A and Figure 7B Common understanding, Fig. 8A The schematic diagram of the structure of the ejector 210 provided by some embodiments of the present invention when the ejector 210 is stuck during the lifting process is shown. During the process of the ejector 210 descending, during the time period t1-t2, the weight 212 at the bottom of the ejector 210 is still suspended in the air, so the pressure detection value of each pressure detection area at this time is 0Pa. When the ejector 210 descends to the time point t2, the ejector 210 may have the following Fig. 8AAs shown in the figure, a certain pressure detection area, such as the first pressure detection area 221, is used as the main deflection load-bearing area. The pressure detection value of the first pressure detection area 221 continues to increase and is much greater than the average value of the gravity of the ejector pin 210 including the normal weight 212, such as 5Pa. Therefore, it can be determined that at least one ejector pin 210 is stuck in an abnormal state during the descent process. If the ejector pin 210 is stuck during the descent process but is not discovered in time, it is easy to cause problems such as wafer slip or abnormal process parameters.

[0107] Furthermore, in some embodiments of the present invention, when the controller obtains that the landing positions of multiple areas of the bottom of each ejector pin 210 (such as the weight 212) are evenly distributed in the corresponding pressure detection areas of the pressure sensor 220, it can be determined that each ejector pin 210 is in a normal state during the descent process.

[0108] However, in response to the presence of multiple areas of the bottom of at least one ejector pin 210 (such as the weight 212) where the landing points are skewedly distributed in multiple pressure detection areas of the corresponding pressure sensor 220, it can be determined that at least one ejector pin 210 has an abnormal eccentric falling state during the descent process.

[0109] Specifically, see Figure 8B , Figure 8B A schematic diagram of the structure of a ejector provided in some embodiments of the present invention when there is an eccentric drop during the descending process is shown.

[0110] like Figure 8B As shown, on the pressure sensor 220 corresponding to a certain ejector pin 210, the landing point of the weight 212 is mainly deflected in the second pressure detection area 222. At this time, the pressure detection value measured in the second pressure detection area 222 is the largest, followed by the pressure detection values ​​measured in the first pressure detection area 221 and the third pressure detection area 223. The portion falling on the fourth pressure detection area 224 is the smallest, so the pressure detection value measured in the fourth pressure detection area 224 is the smallest. Therefore, it can be determined that at least one ejector pin 210 has an abnormal state of eccentric falling during the descent process, and the eccentricity is the second pressure detection area 222.

[0111] Furthermore, the ejector state detection device 200 provided by the present invention can perform state detection during the ejector's ascending process in addition to the state detection during the ejector's descending process.

[0112] Specifically, if Figure 6C As shown, when the wafer located at the process position (ie, located on the surface of the wafer tray 120) completes the deposition process, the controller can control each ejector pin 210 to rise to Fig. 6AThe initial position shown is used to assist the robot in wafer transfer, so as to send the wafer 400 that has completed the deposition process out of the reaction chamber 110 .

[0113] During the process of the wafer 400 rising, the controller may be configured to obtain pressure detection values ​​corresponding to multiple landing positions at the bottom of each ejector pin 210 during the rising process according to each pressure sensor 220. Then, the controller may determine the state of each ejector pin 210 during the rising process based on the pressure detection values ​​corresponding to the multiple landing positions at the bottom.

[0114] Specifically, please return to Fig. 7A When the ejector pin 210 operates normally during the ascending process, the pressure variation curve of each pressure detection area measured by the pressure sensor 220 located below it over time is an ascending fixed variation curve 720. Figure 4 and Fig. 7A It is commonly understood that during the process of the ejector pin 210 rising, in the initial period t1-t2 of the rising, since the ejector pin 210 including the weight 212 has its own gravity pressure value, and the stopper 211 at the top of the ejector pin 210 has not yet contacted the inverted conical conical surface in the ejector pin hole 121 on the wafer tray 120, the weight 212 at the bottom of the ejector pin 210 is still in a completely grounded state, therefore, the pressure detection value of each pressure detection area at this time is the average value of the gravity of the ejector pin 210 including the weight 212, for example, 2 Pa. When the ejector pin 210 rises to the middle period t2-t3 of the rising, the stopper 211 at the top gradually contacts the inverted conical conical surface in the ejector pin hole 121 on the wafer tray 120 and engages with it, and the weight 212 gradually pulls away from the pressure sensor 220 located on the pad 140, therefore, the pressure detection value of each pressure detection area at this time shows a trend of gradually decreasing. In the time period t3-t4, the ejector pin 210 has completely separated from the pressure sensor 220, so the pressure detection values ​​of each pressure detection area at this time are all 0Pa.

[0115] Therefore, that is to say, when the ejector pin 210 operates normally during the ascending process, that is, from FIG. 6C to FIG. 6A If the process is in a normal state, the pressure detection values ​​at the multiple landing points at the bottom of each ejector pin 210 in the reaction chamber 110 are multiple identical fixed change values ​​that change with time during the ascending process, and it can be determined that the state of each ejector pin 210 is normal during the ascending process.

[0116] However, if Figure 6BAs shown, if the pressure detection value in response to at least one landing point at the bottom of at least one ejector pin 210 is different from the fixed change value of the pressure detection that changes fixedly with time at other landing points during the rising process, it can be determined that there is an abnormal stuck state of at least one ejector pin 210 during the rising process.

[0117] Specifically, if Figure 7C As shown in FIG. 7 , when the ejector pin 210 operates abnormally during the ascending process, the pressure variation curve of at least one pressure detection zone measured by the pressure sensor 220 located below the ejector pin 210 over time is an ascending abnormal variation curve 721. Fig. 8A and Figure 7C It is commonly understood that during the rise of ejector pin 210, during the time period t1-t1.5, the weight 212 at the bottom of ejector pin 210 is still in a completely landed state, so the pressure detection value of each pressure detection area at this time is 2Pa. When ejector pin 210 rises to the time point t1.5, ejector pin 210 may have the following Fig. 8A As shown in the figure, when the pin is stuck, the ejector 210 has been driven up by the wafer tray 120 because the ejector 210 where the pin is stuck has not yet reached the position of contact with the inverted conical surface in the ejector hole 121 on the wafer tray 120, that is, it has not yet engaged with the inverted conical surface. Therefore, the pressure will suddenly decrease, that is, at time t1.5 earlier than t2, the detection pressure value of a certain area at the bottom of the ejector 210 suddenly drops. Therefore, it can be determined that at least one ejector 210 is stuck in an abnormal state during the ascent. If the ejector 210 is stuck during the ascent process but is not discovered in time, it is easy for the ejector 210 to break at a weak point, which will lead to problems such as wafer fragments.

[0118] In the above-mentioned embodiment shown in the present invention, the ejector state detection device 200 detects whether there is an abnormal state of the ejector pin 210 during the lifting and lowering process. By accurately detecting whether each ejector pin 210 has completed the action of completely falling or completely rising, it can be determined whether the wafer is in full contact with each ejector pin 210, thereby avoiding the risk of scratches on the back of the wafer and fragments caused by the tilt displacement of the wafer due to the stuck pin. For example, when the pressure detection value of the pressure sensor 220 is abnormal, the pressure sensor 220 can transmit an alarm signal to the controller, and the controller can allow the wafer conveying robot to suspend the wafer conveying, thereby preventing a series of problems that may occur later, including reducing product quality, increasing production costs, reducing production efficiency, affecting the packaging process, etc.

[0119] Next, please return to Figure 5The above-mentioned film deposition detection method provided by the present invention may further include step S540: determining the film deposition conditions between each ejector pin inserted into the ejector pin hole of the wafer tray and each ejector pin hole according to the state of each ejector pin during the descending process.

[0120] Specifically, when the film in the reaction chamber 110 is deposited to a certain extent, the film may be deposited between the ejector pin 210 and the ejector pin hole 121 of the wafer tray 120, affecting the falling height of the ejector pin 210, thereby affecting the output value of the corresponding bottom pressure sensor 220.

[0121] Please see first Fig. 9A , Fig. 9A A schematic diagram of a structure in which a film layer is uniformly deposited between an ejector pin and its corresponding ejector pin hole provided in some embodiments of the present invention is shown. Fig. 9A As shown, when the film layer 800 is evenly deposited between the ejector pin 210 and the ejector pin hole 121 on the corresponding wafer tray 120 , the deposited film layer 800 is evenly distributed on the periphery of the ejector pin 210 , and the thickness of the film layer 800 between the ejector pin 210 and the ejector pin hole 121 is substantially the same.

[0122] When the pressure sensor 220 detects that the landing points of multiple areas of the bottom of at least one ejector pin 210 are skewedly distributed in multiple pressure detection areas of the corresponding pressure sensor 220 during the descent process, it can be determined that at least one ejector pin 210 has an abnormal state of eccentric falling during the descent process. The controller can determine that the film layer 800 is unevenly deposited between the at least one ejector pin 210 and the corresponding ejector pin hole 121 based on the abnormal result of the eccentric falling state of at least one ejector pin 210.

[0123] Please see Fig. 9B , Fig. 9B A schematic diagram of a structure in which a film layer is deposited unevenly between an ejector pin and its corresponding ejector pin hole provided in some embodiments of the present invention is shown. Fig. 9B As shown, when the film layer 800 is deposited unevenly between the ejector pin 210 and the ejector pin hole 121 on the corresponding wafer tray 120, for example, the film layer 800 is deposited entirely on one side, the landing point of the ejector pin 210 will be abnormal, resulting in an abnormal eccentric falling state.

[0124] Further, in some embodiments, when during the descent of the ejector pin 210, the pressure sensor 220 detects that the pressure detection value of at least one pressure detection zone in at least one pressure sensor 220 is different from the fixed change value of other pressure detection zones that changes with time during the descent, it can be determined that at least one ejector pin 210 is stuck in an abnormal state during the descent. Based on the abnormal result of the stuck state of at least one ejector pin 210, the controller can determine that the film layer 800 is seriously deposited between at least one ejector pin 210 and its corresponding ejector hole 121, resulting in the blockage of the ejector hole 121.

[0125] Preferably, see Fig.10 , Fig.10 A scatter diagram of the locations of the multiple landing points of the ejector pin on the pressure sensor provided in accordance with some embodiments of the present invention is shown.

[0126] like Fig.10 As shown, in some preferred embodiments, on the same pressure sensor 220, the corresponding ejector pin 210 can be raised and lowered multiple times, and the controller can obtain the landing position and detection pressure value after the ejector pin 210 is raised and lowered multiple times, thereby determining multiple landing weight positions 810. Compared with the prior art that cannot detect the landing position of the ejector pin, in this embodiment, the film deposition between the ejector pin hole 121 on the wafer tray 120 and the ejector pin 210 can be accurately determined based on the multiple landing positions of each ejector pin 210, providing accurate data support for the timely cleaning of the wafer tray 120 and the ejector pin 210. Preferably, it can be adopted Figure 3 The detachable matching structure of the ejector pin 210 with a self-locking function and the weight 212 in the illustrated embodiment enables quick and convenient replacement and cleaning of the ejector pin 210 during the cleaning process without removing the wafer tray 120 .

[0127] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0128] In summary, the present invention provides a pin state detection device, a film deposition detection method, a semiconductor process equipment, and a computer-readable storage medium, which can accurately detect the state of each pin in a tray during the lifting process, thereby effectively preventing the occurrence of pin jams and avoiding the problem of scratches on the back of the wafer due to abnormal pin state. At the same time, it can also determine the film deposition conditions of each pin position, thereby providing data support for timely cleaning of the tray and the pins.

[0129] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A device for detecting the state of an ejector pin, arranged in a reaction chamber, characterized in that: The ejector state detection device comprises: The ejector pin can be lifted and inserted into the ejector pin hole of the wafer tray to receive or send out the wafer; A pressure sensor is disposed below each of the ejector pins, each of the pressure sensors includes a plurality of pressure detection areas corresponding to a plurality of areas at the bottom of each of the ejector pins; and The controller is configured to: in response to a wafer delivered into the reaction chamber being placed on a plurality of ejector pins located at an initial position, control each of the ejector pins to descend to a process position so as to perform a deposition process on the wafer; obtain, according to each of the pressure sensors, pressure detection values ​​of a plurality of regions at the bottom of each of the ejector pins during their descent and their landing positions; and determine the state of each of the ejector pins during their descent based on the pressure detection values ​​of the plurality of regions at the bottom of the ejector pins and their landing positions.

2. The ejector state detection device according to claim 1, characterized in that: The step of determining the state of each ejector during the descending process based on the pressure detection values ​​of multiple areas at the bottom of the ejector and the landing point positions thereof comprises: In response to the pressure detection values ​​of each pressure detection area in each pressure sensor being a plurality of identical fixed change values ​​that change with time during the descent process, it is determined that each ejector pin is in a normal state during the descent process; or In response to the fact that the pressure detection value of at least one pressure detection area in at least one pressure sensor is different from the fixed change value of other pressure detection areas that changes with time during the descent process, it is determined that the at least one ejector pin is in an abnormal stuck state during the descent process.

3. The ejector state detection device according to claim 1, characterized in that: The step of determining the state of each ejector during the descent process based on the pressure detection values ​​of multiple areas at the bottom of the ejector and the landing point positions thereof, further includes: In response to the acquired landing point positions of the multiple areas of the bottom of each ejector being evenly distributed in the corresponding pressure detection areas of the pressure sensor, it is determined that each ejector is in a normal state during the descending process; or In response to the fact that the landing points of multiple areas of the bottom of at least one ejector are skewedly distributed in the corresponding multiple pressure detection areas of the pressure sensor, it is determined that the at least one ejector has an abnormal state of eccentric falling during the descending process.

4. The ejector state detection device according to claim 1, characterized in that: The controller is further configured to: In response to the wafer completing the deposition process, controlling each of the ejector pins to rise to the initial position to send out the wafer; According to each of the pressure sensors, pressure detection values ​​corresponding to a plurality of landing points of the bottom during the ascending process of each of the ejector pins are respectively obtained; as well as Based on the pressure detection values ​​corresponding to the multiple landing points of the bottom, the state of each ejector pin during the ascending process is determined.

5. The ejector state detection device according to claim 4, characterized in that: The step of determining the state of each ejector pin during the ascending process based on the pressure detection values ​​corresponding to the multiple landing points of the bottom comprises: In response to the pressure detection values ​​of the multiple landing points at the bottom of each ejector being a plurality of identical fixed change values ​​that change with time during the ascending process, it is determined that each ejector is in a normal state during the ascending process; or In response to the fact that the pressure detection value of at least one landing point at the bottom of at least one ejector pin is different from the fixed change value of the pressure detection that changes with time at other landing points during the rising process, it is determined that the at least one ejector pin is in an abnormal stuck state during the rising process.

6. The ejector state detection device according to claim 1, characterized in that: A weight is provided at the bottom end of the ejector pin, and the ejector pin and the weight are detachably assembled and combined.

7. The ejector state detection device according to claim 1, characterized in that: A limiting portion is provided on the top of the ejector pin, and the limiting portion is engaged with the ejector pin hole so that the ejector pin is driven to perform a lifting movement during the lifting process of the wafer tray.

8. A film deposition detection method, characterized in that: The film deposition detection method is implemented by using the ejector state detection device according to any one of claims 1 to 7, and comprises the following steps: In response to a wafer delivered into the reaction chamber being placed on a plurality of ejector pins located at an initial position, each of the ejector pins is controlled to descend to a process position to perform a deposition process on the wafer; According to the multiple pressure sensors, respectively obtain the pressure detection values ​​and the landing positions of the multiple areas at the bottom of each ejector pin during the descending process of each ejector pin; Determining the state of each ejector during its descent based on the pressure detection values ​​of multiple areas at the bottom of the ejector and the landing positions thereof; and According to the state of each ejector pin during the descending process, the film layer deposition conditions between each ejector pin inserted into the ejector pin hole of the wafer tray and each ejector pin hole are determined.

9. The film deposition detection method according to claim 8, characterized in that: The step of determining the film deposition conditions between each ejector pin inserted into the ejector pin hole of the wafer tray and each ejector pin hole according to the state of each ejector pin during the descending process comprises: In response to the presence of multiple areas of the bottom of at least one ejector pin in the descending process, the landing points are skewedly distributed in multiple pressure detection areas of the corresponding pressure sensor; Determining that the at least one ejector pin has an abnormal eccentric falling state during the descending process; and Based on the abnormal result that the at least one ejector pin has an eccentric falling state, it is determined that the film layer deposition between the at least one ejector pin and the ejector pin hole corresponding to the at least one ejector pin is uneven.

10. The film deposition detection method according to claim 8, characterized in that: The step of determining the film deposition conditions between each ejector pin inserted into the ejector pin hole of the wafer tray and each ejector pin hole according to the state of each ejector pin during the descending process, further includes: In response to the presence of a pressure detection value of at least one pressure detection zone in at least one pressure sensor during the descent being different from a fixed change value that changes with time in other pressure detection zones during the descent; Determining that the at least one ejector pin is in an abnormal state of being stuck during the descending process; and Based on the abnormal result that the at least one ejector pin is stuck, it is determined that the ejector pin hole is blocked due to severe film deposition between the at least one ejector pin and the ejector pin hole corresponding to the at least one ejector pin.

11. A semiconductor process equipment, characterized in that: include: A reaction chamber, in which a wafer is placed for a deposition process; A wafer tray, used for holding the wafer; as well as The ejector pin state detection device according to claims 1 to 7 is assembled in combination with the wafer tray to detect the film deposition conditions between each ejector pin inserted into the ejector pin holes of the wafer tray and each of the ejector pin holes.

12. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by the processor, the film deposition detection method according to any one of claims 8 to 10 is implemented.

Images