Chip carrier switching device

Abstract

The invention relates to a chip carrier switching device, and belongs to the technical field of semiconductor packaging equipment. The device comprises a platform and a switching structure, the platform is provided with at least one first carrying disc and an actuating channel, the first carrying disc is erected above the platform, a gap is reserved between the first carrying disc and the platform in the vertical direction, and the actuating channel penetrates through the platform; the switching structure is arranged at the bottom of the platform and close to the actuating channel, the switching structure comprises a carrying table and a moving mechanism, a second carrying disc and a lifting carrying disc which are adjacent in position are arranged on the carrying table, the second carrying disc is erected above the platform and is as high as the first carrying disc, the lifting carrying disc is connected with a linkage mechanism, and the linkage mechanism moves in the actuating channel; and the moving mechanism is used for adjusting the height of the lifting carrying disc, so that the height of the lifting carrying disc is equal to or lower than that of the second carrying disc, and the moving mechanism drives the carrying table to move transversely. The machine table has the effect of improving space waste on the machine table.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging equipment, and in particular to a chip carrier switching device. Background Art

[0002] In the semiconductor manufacturing industry, packaging and testing are particularly important. Packaging is the process of assembling chips into finished products. It not only protects the chips, but also enables electrical connections, making them components that can communicate with external systems. During the testing process, the chips need to be placed on a tray, and the tray is placed on a carrier to facilitate the classification, placement and movement of the chips.

[0003] Currently, if Figure 1 As shown, a plurality of carriers 12 are arranged side by side on the machine 11, and each carrier 12 corresponds to a fixedly connected tray 20, and the tray 20 is used to place a plurality of chips. A set of pick-and-place mechanisms 15 are provided on the machine 11, and the main distribution position of the pick-and-place mechanisms 15 is parallel to the arrangement direction of the plurality of carriers 12. The pick-and-place mechanisms 15 include a movable platform 151, an extension cantilever 152, and a pick-and-place module head 153. The pick-and-place module head 153 can move on the extension cantilever 152, and can be raised and lowered in time to take out or place the chips on the tray 20. The movable platform 151 is responsible for driving the extension cantilever 152 to move between different carriers 12, so that the chips are transferred to the corresponding tray 20.

[0004] In the above structure, the multiple carriers 12 arranged on the machine 11 are necessary. For example, they can be simply divided into a good chip area, a bad chip area or a chip to be tested area according to their set functions. If more carriers 12 can be placed on the machine 11, the number of material changes can be reduced and the test efficiency can be improved. Figure 1 It can be found that a power device 154 is also provided adjacent to the mobile platform 151. The power device 154 is fixed on the machine 11 and adjacent to the side position. The power device 154 provides the power required for the mobile platform 151 to move. Due to the existence of the power device 154, the mobile platform 151 cannot move to the rightmost position in the figure, resulting in an idle area 16 adjacent to the rightmost carrier 12 on the machine 11. Since the extended cantilever 152 cannot move here, the tray 20 cannot be set. The idle area 16 is a space waste area on the machine 11, so that the space of the machine 11 is not effectively used, resulting in a space waste problem.

[0005] The above-mentioned related technologies have the defect of wasting space on the platform. Summary of the invention

[0006] In order to improve the problem of space waste on a machine platform, the present application provides a chip carrier switching device.

[0007] The chip carrier switching device provided in the present application adopts the following technical solution: A chip carrier switching device comprises: a platform, the platform is provided with a first carrier and an actuating channel, the first carrier is provided with at least one, the first carrier is mounted above the platform, so that a gap is left between the first carrier and the platform in the vertical direction, and the actuating channel runs through the platform; a switching structure, the switching structure is arranged at the bottom of the platform, and the switching structure is arranged close to the actuating channel, the switching structure comprises a carrier and a moving mechanism, the carrier is provided with a second carrier and a lifting carrier adjacent to each other, the second carrier is mounted above the platform, and the height of the second carrier is The lifting plate is connected to a linkage mechanism having the same height as the first carrier plate, and the linkage mechanism moves in the actuating channel. The linkage mechanism is used to adjust the height of the lifting plate so that the height of the lifting plate is the same as or lower than the height of the second carrier plate. The moving mechanism can drive the platform to move laterally so that the lifting plate can switch between a first state and a second state, wherein the first state is a state in which the first carrier plate and the second carrier plate are arranged side by side, and the second state is a state in which the first carrier plate, the lifting plate and the second carrier plate are arranged side by side in sequence.

[0008] By adopting the above technical scheme, on the basis of the linkage mechanism driving the lifting and lowering of the lifting carrier on the carrier, the moving mechanism is used to drive the carrier to move horizontally, and cooperate with the lifting carrier with adjustable height and the second carrier with fixed height on the carrier, so that the platform can be switched to the first state in which the first carrier and the second carrier are arranged side by side, or switched to the second state in which the first carrier, the lifting carrier and the second carrier are arranged side by side in sequence, so that the space on the platform can be fully utilized by changing the position of the lifting carrier and the second carrier, reducing the number of times the tray is changed on the carrier during the test operation, extending the test operation cycle, and improving the efficiency of the test operation; different carriers are switched to different positions in a timely manner by transfer, so as to make full use of the limited space remaining on the machine, so that the chip transfer operation can be smoothly performed on the carrier.

[0009] Optionally, a accommodating space is provided between the first carrier plate and the platform, and after the lifting carrier plate descends and the moving mechanism drives the platform to move horizontally, the lifting carrier plate is located in the accommodating space between the first carrier plate and the platform.

[0010] By adopting the above technical solution, the accommodating space provides a lateral moving space for the lifting and lowering carrier plate, so that when the moving mechanism drives the second carrier plate on the platform to move, the lifting and lowering carrier plate will not interfere with other structures.

[0011] Optionally, a support member is provided on the carrier, and the support member passes through the actuating channel to connect to the bottom of the second carrier plate, so that the height of the second carrier plate is the same as that of the first carrier plate.

[0012] By adopting the above technical solution, the support member can keep the second carrier plate at the same height as the first carrier plate, so as to facilitate the chip transfer operation.

[0013] Optionally, the linkage mechanism includes a first power mechanism and an actuating rod, the first power mechanism is arranged at the bottom of the carrier, the output end of the first power mechanism is transmission-connected to the actuating rod, and the actuating rod is connected to the lifting carrier. When the first power mechanism drives the actuating rod to extend or retract vertically, the lifting carrier is driven to lift vertically.

[0014] By adopting the above technical solution, the first power mechanism drives the actuating rod to move vertically, so that the lifting plate can move vertically relative to the platform, thereby realizing the lifting of the lifting plate.

[0015] Optionally, the linkage mechanism includes a plurality of guide columns, the upper ends of the guide columns are connected to the bottom of the lifting carrier, the guide columns pass through the carrier and slide with the carrier, and when the first power mechanism drives the actuator rod to extend or retract vertically, the guide columns slide relative to the carrier.

[0016] By adopting the above technical solution, the sliding connection between the guide column and the carrier can make the lifting carrier have better guidance when lifting, and make it easy for the lifting carrier to maintain balance when lifting, reducing the risk of deflection.

[0017] Optionally, the length of the guide column is greater than the vertical moving distance of the lifting plate, so that when the lifting plate moves vertically upward to the highest position, the guide column maintains a sliding fit with the carrier.

[0018] By adopting the above technical solution, when the lifting platform rises to the highest position, since the guide pillars still maintain sliding cooperation with the platform, the need for aligning the guide pillars when the lifting platform is lowered can be reduced, so that the entire lifting process of the lifting platform can be guided by the guide pillars, thereby improving the lifting stability and reliability.

[0019] Optionally, the moving mechanism includes a second power mechanism and a plurality of guide rods, both ends of the guide rods are fixed to the bottom surface of the platform, the guide rods are slidably connected to the axle seat on the bottom surface of the carrier, so that the carrier is slidably connected to the guide rods, and the second power mechanism is transmission-connected to the carrier, and the second power mechanism is used to drive the carrier to move laterally along the guide rods.

[0020] By adopting the above technical solution, the second power mechanism drives the carrier to move horizontally, so that the second carrier can be moved to a position close to the first carrier, so as to carry and move the chip; the sliding cooperation between the carrier and the shaft seat at the bottom of the platform can ensure the lateral movement of the carrier and improve the positioning accuracy of the second carrier after movement.

[0021] Optionally, the moving mechanism further comprises a belt, a connecting piece is provided on the bottom surface of the carrier, the connecting piece is fixedly connected to the belt, and the second power mechanism can drive the belt to rotate so that the belt pulls the carrier to move laterally.

[0022] By adopting the above technical solution, the second power mechanism drives the belt to rotate, so that the connecting piece fixedly connected to the belt can move laterally, which helps to make the movement of the carrier more stable and reduce the risk of damage to the chip.

[0023] Optionally, the second power mechanism can drive the belt to rotate in both clockwise and counterclockwise directions, so that the carrier moves back and forth in the lateral direction.

[0024] By adopting the above technical solution, the second power mechanism drives the carrier to move back and forth in the lateral direction, and the direction of the second power mechanism can be changed to assist in achieving the conversion between the first state and the second state, thereby reducing the difficulty of operation.

[0025] Optionally, the first carrier plate, the lifting carrier plate and the second carrier plate are all provided with clips, the clips are used to fix the tray, and the tray is used to carry the chip.

[0026] By adopting the above technical solution, the tray can be stably supported on the lifting plate and the second plate, thereby improving the support stability of the chip thereon and reducing damage to the chip.

[0027] In summary, the present application includes at least one of the following beneficial technical effects: 1. On the basis of the linkage mechanism driving the lifting and lowering of the lifting tray on the carrier, the moving mechanism is used to drive the carrier to move horizontally, and the lifting tray with adjustable height and the second tray with fixed height on the carrier are matched, so that the platform can be switched to the first state where the first tray and the second tray are arranged side by side, or switched to the second state where the first tray, the lifting tray and the second tray are arranged side by side in sequence, so that the space on the platform can be fully utilized by changing the position of the lifting tray and the second tray, reducing the number of times the tray is changed on the tray during the test operation, extending the test operation cycle, and improving the efficiency of the test operation; different trays are switched to different positions in a timely manner by transfer, so as to make full use of the limited space remaining on the machine, so that the chip transfer operation can be smoothly performed on the tray; 2. The accommodation space provides lateral movement space for the lifting and lowering carrier after it moves downward, so that when the moving mechanism drives the second carrier on the carrier to move, the lifting and lowering carrier will not interfere with other structures; 3. The support member can keep the second carrier at the same height as the first carrier to facilitate chip transfer operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic diagram of a chip carrier in the related art.

[0029] Figure 2 It is a three-dimensional diagram of the chip carrier switching device according to an embodiment of the present application.

[0030] Figure 3 It is a front view of the chip carrier switching device according to an embodiment of the present application.

[0031] Figure 4 It is a schematic diagram of the platform bottom structure of the chip carrier switching device of an embodiment of the present application.

[0032] Figure 5 It is a three-dimensional diagram of the actual operation of the chip carrier switching device according to an embodiment of the present application.

[0033] Figure 6 It is a three-dimensional diagram of the chip carrier switching device of the embodiment of the present application in the lowered state of the lifting carrier.

[0034] Figure 7 It is a front view of the chip carrier switching device of the embodiment of the present application in the lowered state of the lifting carrier.

[0035] Figure 8 It is a three-dimensional diagram of the chip carrier switching device of the embodiment of the present application in which the first carrier and the second carrier are arranged side by side.

[0036] Fig. 9 It is a front view of the chip carrier switching device of the embodiment of the present application, in which the first carrier and the second carrier are arranged side by side.

[0037] Description of reference numerals: 11. Machine; 12. Carrier; 15. Pick-up and placement mechanism; 151. Moving carrier; 152. Extended cantilever; 153. Pick-up and placement module head; 154. Power device; 16. Idle area; 20. Tray; 30. Platform; 31. First carrier; 32. Actuating channel; 33. Carrier; 34. Accommodating space; 40. Switching structure; 41. Carrier; 411. Axle seat; 412. Connector; 42. Moving mechanism; 43. Second carrier; 44. Lifting carrier; 45. Support member; 46. Guide column; 47. First power mechanism; 471. Actuating rod; 48. Guide rod; 49. Second power mechanism; 491. Belt. DETAILED DESCRIPTION

[0038] The following is combined with Figure 1 -Attached Fig. 9 The present application is further described in detail. In this embodiment, if not clearly specified, "connected", "connected" and "fixed" are understood in a broad sense, including fixed connection, detachable connection, connection to form an integral structure, mechanical connection, electrical connection, direct connection, indirect connection through an intermediary, internal connection and interaction between two elements, etc., which can be understood according to the specific circumstances.

[0039] In the present application, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact not directly but through another feature between them. Moreover, in the description of the present embodiment, the terms "above", "below", "right", etc., the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise specified, the orientation words used in the present application, such as "inside" and "outside", refer to the contours of the corresponding parts themselves.

[0040] like Figure 2 and Figure 3 As shown, an embodiment of the present application discloses a chip carrier switching device (hereinafter referred to as “device”), which includes a platform 30 and a switching structure 40 so as to fully utilize the space on the platform 30.

[0041] The platform 30 is provided with a first carrier plate 31 and an actuation channel 32, and the first carrier plate 31 is provided with at least one. The first carrier plate 31 is mounted above the platform 30, so that the first carrier plate 31 is elevated, and a distance is left between the first carrier plate 31 and the platform 30 in the vertical direction. The actuation channel 32 runs through the platform 30 so that the structure below the platform 30 can cooperate with the structure above it.

[0042] like Figure 2 , Figure 3 and Figure 4As shown, the switching structure 40 is arranged at the bottom of the platform 30, and the switching structure 40 is arranged close to the actuating channel 32 so as to cooperate with the structure on the platform 30. The switching structure 40 includes a carrier 41 and a moving mechanism 42, and the carrier 41 is provided with a second carrier plate 43 and a lifting carrier plate 44 which are adjacent to each other. The second carrier plate 43 is mounted above the platform 30, and the height of the second carrier plate 43 is the same as that of the first carrier plate 31. The lifting carrier plate 44 is connected with a linkage mechanism, which moves in the actuating channel 32, and the linkage mechanism is used to adjust the height of the lifting carrier plate 44 in time, so that the height of the lifting carrier plate 44 is the same as or lower than the height of the second carrier plate 43. The moving mechanism 42 can drive the carrier 41 to move horizontally, so that the lifting plate 44 can switch between the first state and the second state, wherein the first state is the state in which the first plate 31 and the second plate 43 are arranged side by side after the lifting plate 44 descends, and the second state is the state in which the first plate 31, the lifting plate 44 and the second plate 43 are arranged side by side in sequence at the same height. In this embodiment, the end of the platform 30 away from the second plate 43 is the left side, and the end of the platform 30 close to the second plate 43 is the right side. The actuating channel 32 is an open area that runs through the platform 30 in a large area. The actuating channel 32 is arranged adjacent to the first plate 31 on the far right. The actuating channel 32 is used to provide a setting position for the linkage mechanism that links the lifting plate 44, so as to drive the lifting plate 44 to descend and move horizontally in a timely manner.

[0043] like Figure 2 , Figure 3 and Figure 4 As shown, the mobile mechanism 42 is used to drive the carrier 41 to move horizontally, and the lifting carrier 44 with adjustable height and the second carrier 43 with fixed height on the carrier 41 are used to switch the platform 30 to the first state where the first carrier 31 and the second carrier 43 are arranged side by side, or to the second state where the first carrier 31, the lifting carrier 44 and the second carrier 43 are arranged side by side in sequence, so that the space on the platform 30 can be fully utilized by changing the position of the lifting carrier 44 and the second carrier 43. In the test operation, different carriers are switched to different positions in a timely manner by transfer, which can facilitate the full utilization of the limited space remaining on the machine, so that the chip transfer operation can be smoothly performed on the carrier. In addition, the number of times the tray 20 is changed on the carrier can be reduced, the cycle of the test operation can be extended, and the efficiency of the test operation can be improved. In this embodiment, the carrier refers to one or more of the lifting carrier 44, the second carrier 43 and a plurality of first carriers 31.

[0044] like Figure 2 , Figure 3 and Figure 4 As shown, the platform 30 is a part of the machine platform of the test equipment. Since the present embodiment mainly emphasizes the switching device of the carrier, Figure 2 Only this part of the structure is drawn, and the equipment installed on the platform 30 is not drawn. The relevant equipment can be used Figure 1 The pick-and-place mechanism 15 in the embodiment of the present invention is not limited thereto. Optionally, a clip is provided on each of the first carrier plate 31, the lifting carrier plate 44, and the second carrier plate 43, and the clip is used to fix the tray 20, and the tray 20 is used to carry the chip. The clip can stably carry the tray 20 on the lifting carrier plate 44 and the second carrier plate 43, thereby improving the carrying stability of the chip thereon and reducing damage to the chip. The structure of the clip can be set as required to meet the use requirements. The first carrier plate 31, the lifting carrier plate 44, and the second carrier plate 43 are all provided with a tray 20, Figure 2 Only one tray 20 is shown in the figure for reference. When transferring, the chips on the tray 20 can be timely taken and placed by other taking and placing mechanisms; the tray structure can select an existing structure as needed.

[0045] In this embodiment, a plurality of first carriers 31 are arranged on the platform 30 in an elevated manner. The plurality of first carriers 31 are fixed on the elevated carrier plate 33, so that there is a storage space 34 between the first carriers 31 and the platform 30. The storage space 34 enables the lifting carrier 44 to be hidden therein in time during subsequent actuation. After the lifting carrier 44 descends and the moving mechanism 42 drives the platform 41 to move horizontally, the lifting carrier 44 is moved to the storage space 34 between the first carrier 31 and the platform 30. The storage space 34 provides a horizontal movement space for the lifting carrier 44 after it moves downward, so that when the moving mechanism 42 drives the second carrier 43 on the platform 41 to move, the lifting carrier 44 will not interfere with other structures.

[0046] like Figure 2 , Figure 3 and Figure 4 As shown, optionally, a support member 45 is provided on the carrier 41, and the support member 45 passes through the actuating channel 32 to connect to the bottom of the second carrier 43, so that the height of the second carrier 43 is the same as that of the first carrier 31, so as to facilitate the chip transfer operation. The support member 45 provided on the carrier 41 is connected to the bottom of the second carrier 43 through the actuating channel 32, so that the height of the second carrier 43 is the same as that of the first carrier 31 and can move synchronously with the carrier 41.

[0047] Optionally, the linkage mechanism includes a first power mechanism 47 and an actuating rod 471. The first power mechanism 47 is disposed at the bottom of the platform 41, and the output end of the first power mechanism 47 is transmission-connected with the actuating rod 471, and the actuating rod 471 is connected to the lifting plate 44. When the first power mechanism 47 drives the actuating rod 471 to vertically extend or retract, the lifting plate 44 is driven to vertically lift. The first power mechanism 47 drives the actuating rod 471 to move vertically, so that the lifting plate 44 can move vertically relative to the platform 41, thereby realizing the lifting and lowering of the lifting plate 44. The first power mechanism 47 can be a telescopic structure such as a cylinder, a hydraulic cylinder or an electric telescopic rod.

[0048] like Figure 2 , Figure 3 and Figure 4 As shown, optionally, the linkage mechanism includes a plurality of guide posts 46. The upper end of the guide post 46 is connected to the bottom of the lifting plate 44, and the guide post 46 passes through the platform 41 and slides with the platform 41. When the first power mechanism 47 drives the actuating rod 471 to extend or retract vertically, the guide post 46 slides relative to the platform 41. The sliding connection between the guide post 46 and the platform 41 can make the lifting plate 44 have better guidance when it is lifted, and make it easy for the lifting plate 44 to maintain balance when it is lifted, reducing the risk of deflection. When the first power mechanism 47 drives the actuating rod 471 to extend or retract, and cooperates with the guide post 46 to pass through the platform 41 for sliding, it can smoothly drive the lifting plate 44 to rise and fall, and then control the height of the lifting plate 44 to be the same as or lower than the second plate 43.

[0049] Optionally, the length of the guide post 46 is greater than the vertical moving distance of the lifting plate 44, so that when the lifting plate 44 moves vertically upward to the highest position, the guide post 46 maintains a sliding fit with the platform 41. When the lifting plate 44 rises to the highest position, since the guide post 46 still maintains a sliding fit with the platform 41, the need for the guide post 46 to align when the lifting plate 44 descends can be reduced, so that the entire lifting process of the lifting plate 44 can be guided by the guide post 46, thereby improving the lifting stability and reliability.

[0050] like Figure 2 , Figure 3 and Figure 4 As shown, optionally, the moving mechanism 42 includes a second power mechanism 49 and a plurality of guide rods 48, the two ends of the guide rods 48 are fixed to the bottom surface of the platform 30, and the guide rods 48 are slidably connected to the shaft seat 411 protruding from the bottom surface of the carrier 41, so that the carrier 41 is slidably connected to the guide rods 48. The second power mechanism 49 is connected to the carrier 41 in a transmission manner, and the second power mechanism 49 is used to drive the carrier 41 to move laterally along the guide rods 48. The second power mechanism 49 drives the carrier 41 to move laterally, so that the second carrier 43 can move to a position close to the first carrier 31, so as to carry and move the chip. The carrier 41 and the shaft seat 411 at the bottom of the platform 30 are slidably matched, which can ensure the lateral movement of the carrier 41 and improve the positioning accuracy of the second carrier 43 after the movement. The second power mechanism 49 can be a structure such as a motor that can achieve power output.

[0051] Optionally, the moving mechanism 42 also includes a belt 491. The bottom surface of the carrier 41 is provided with a protruding connecting piece 412, and the connecting piece 412 is fixedly connected to the belt 491. The second power mechanism 49 can drive the belt 491 to rotate. Since the carrier 41 can only slide linearly on the guide rod 48, the belt 491 pulls the carrier 41 to move horizontally left and right. The second power mechanism 49 drives the belt 491 to rotate, so that the connecting piece 412 fixedly connected to the belt 491 can move horizontally, which helps to make the movement of the carrier 41 more stable and reduce the risk of damage to the chip. The belt 491 includes necessary support and transmission structures, and the relevant structure can be selected according to needs.

[0052] like Figure 2 , Figure 3 and Figure 4 As shown, optionally, the second power mechanism 49 can drive the belt 491 to rotate in both clockwise and counterclockwise directions, so that the platform 41 moves back and forth in the horizontal direction. The second power mechanism 49 drives the platform 41 to move back and forth in the horizontal direction, and can assist in realizing the conversion between the first state and the second state by changing the direction of the second power mechanism 49, thereby reducing the difficulty of operation. When the lifting plate 44 is lowered to the lowest position and the platform 41 is moved to the leftmost position, the second plate 43 can be close to the first plate 31; when the platform 41 is moved to the rightmost position and the lifting plate 44 is raised to the highest position, it can be switched to a state where the first plate 31, the lifting plate 44 and the second plate 43 are side by side.

[0053] like Figure 5 As shown, in the illustrated state, the platform 30 can be laterally distributed with the most carriers. Correspondingly, more trays 20 carrying more chips can be placed on the platform 30, which is convenient for operators to test more chips. At this time, the platform 30 is provided with four fixed first carriers 31, a lifting carrier 44 and a second carrier 43, and a tray 20 can be placed on each carrier. A set of pick-and-place mechanisms 15 is also provided on the platform 30, and the main body of the pick-and-place mechanism 15 is parallel to the arrangement direction of the multiple carriers. The pick-and-place mechanism 15 includes a moving platform 151, an extension cantilever 152 and a pick-and-place module head 153. The pick-and-place module head 153 can move on the extension cantilever 152, and can be lifted and lowered in time to take out or place the chips on the tray 20. The moving platform 151 is responsible for driving the extension cantilever 152 to move between different carriers. Among them, the pick-and-place mechanism 15 is an existing structure, so it is not described in detail. At this time, the second carrier 43 is too close to the side of the platform 30, so the extension arm 152 cannot move there. The operating area of ​​the pick-and-place module head 153 and the extension arm 152 is limited to between the plurality of first carriers 31 and the lifting carrier 44.

[0054] like Figure 4 and Figure 5As shown, the moving mechanism 42 is responsible for driving the carrier 41 to move, so as to switch to a state where the first carrier plate 31, the lifting carrier plate 44 and the second carrier plate 43 are arranged in sequence; or Figure 6 , Figure 7 and Figure 8 As shown, after the lifting tray 44 is lowered, the first tray 31 and the second tray 43 are switched to a state where they are arranged side by side, so that the operating space on the platform 30 can be more effectively utilized. It can be understood that in order to simplify the drawings and facilitate the description, Figure 6 , Figure 7 and Figure 8 The pick-and-place mechanism 15 is not shown.

[0055] like Figure 6 and Figure 7 As shown, first, the lifting plate 44 on the platform 41 is controlled to descend, so that the height of the lifting plate 44 is lower than the second plate 43, that is, the height of the lifting plate 44 is between the first plate 31 and the platform 30. Figure 8 and Fig. 9 As shown, the moving mechanism 42 drives the carrier 41 to move horizontally. Since the lifting tray 44 and the second tray 43 are fixed on the carrier 41, the two will also move synchronously, and finally the lifting tray 44 moves to the right below the first tray 31 on the far right, and the second tray 43 is adjacent to the first tray 31, that is, the second tray 43 can replace the original lifting tray 44, so that the pick-and-place mechanism 15 can perform the transfer operation, so that the space on the platform 30 can be fully utilized. The device can make the lifting tray 44 and the second tray 43 both place the tray 20 of the chip to be tested, thereby extending the time of a single test and the time interval for replacing the tray 20, reducing the frequency of replacing the tray 20, and helping to improve the test operation and transfer efficiency.

[0056] It can be understood that the device also includes necessary structures for connection, support, driving, positioning, limiting and control functions so that the device can operate normally; parameters such as the shape, size, material and setting quantity of each part of the device can be determined as needed as long as the corresponding functions can be achieved.

[0057] The implementation principle of a chip carrier switching device in an embodiment of the present application is: using a moving mechanism 42 to drive the carrier 41 to move horizontally in a timely manner, cooperating with the height-adjustable lifting carrier 44 and the height-fixed second carrier 43 on the carrier 41, so that the platform 30 is switched to a state where the first carrier 31 and the second carrier 43 are arranged side by side, or switched to a state where the first carrier 31, the lifting carrier 44 and the second carrier 43 are arranged side by side in sequence, not only can the space on the platform 30 be fully utilized, but the chip placement mechanism 15 can also operate smoothly to meet the testing requirements.

[0058] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A chip carrier switching device, characterized in that: include: A platform (30), wherein the platform (30) is provided with a first carrier (31) and an actuating channel (32), wherein the first carrier (31) is provided with at least one, and the first carrier (31) is mounted above the platform (30) so that a distance is left between the first carrier (31) and the platform (30) in a vertical direction, and the actuating channel (32) runs through the platform (30); A switching structure (40), wherein the switching structure (40) is arranged at the bottom of the platform (30), and the switching structure (40) is arranged close to the actuating channel (32), the switching structure (40) comprises a carrier (41) and a moving mechanism (42), the carrier (41) is provided with a second carrier plate (43) and a lifting carrier plate (44) which are adjacent to each other, the second carrier plate (43) is mounted above the platform (30), and the height of the second carrier plate (43) is the same as that of the first carrier plate (31), the lifting carrier plate (44) is connected with a linkage mechanism, and the linkage mechanism is arranged on the actuating channel (32). The linkage mechanism is used to adjust the height of the lifting plate (44) so ​​that the height of the lifting plate (44) is the same as or lower than the height of the second plate (43). The moving mechanism (42) can drive the platform (41) to move horizontally so that the lifting plate (44) can switch between a first state and a second state, wherein the first state is a state in which the first plate (31) and the second plate (43) are arranged side by side, and the second state is a state in which the first plate (31), the lifting plate (44) and the second plate (43) are arranged side by side in sequence.

2. The chip carrier switching device according to claim 1, characterized in that: A accommodating space (34) is provided between the first carrier plate (31) and the platform (30); when the lifting carrier plate (44) descends and the moving mechanism (42) drives the platform (41) to move horizontally, the lifting carrier plate (44) is located in the accommodating space (34) between the first carrier plate (31) and the platform (30).

3. The chip carrier switching device according to claim 1, characterized in that: A support member (45) is provided on the carrier (41), and the support member (45) passes through the actuating channel (32) and is connected to the bottom of the second carrier plate (43), so that the height of the second carrier plate (43) is the same as that of the first carrier plate (31).

4. The chip carrier switching device according to claim 1, characterized in that: The linkage mechanism comprises a first power mechanism (47) and an actuating rod (471); the first power mechanism (47) is arranged at the bottom of the carrier (41); the output end of the first power mechanism (47) is connected to the actuating rod (471) in a transmission manner; the actuating rod (471) is connected to the lifting carrier (44); when the first power mechanism (47) drives the actuating rod (471) to extend vertically or retract vertically, the lifting carrier (44) is driven to be lifted vertically.

5. The chip carrier switching device according to claim 4, characterized in that: The linkage mechanism includes a plurality of guide columns (46), the upper ends of the guide columns (46) are connected to the bottom of the lifting carrier (44), the guide columns (46) pass through the carrier (41) and are slidably matched with the carrier (41), and when the first power mechanism (47) drives the actuating rod (471) to extend vertically or retract, the guide columns (46) slide relative to the carrier (41).

6. The chip carrier switching device according to claim 5, characterized in that: The length of the guide column (46) is greater than the vertical moving distance of the lifting plate (44), so that when the lifting plate (44) moves vertically upward to the highest position, the guide column (46) maintains a sliding fit with the carrier (41).

7. The chip carrier switching device according to claim 1, characterized in that: The moving mechanism (42) comprises a second power mechanism (49) and a plurality of guide rods (48), the two ends of the guide rods (48) are fixed to the bottom surface of the platform (30), the guide rods (48) are slidably connected to the shaft seat (411) on the bottom surface of the carrier (41), so that the carrier (41) is slidably connected to the guide rods (48), the second power mechanism (49) is transmission-connected to the carrier (41), and the second power mechanism (49) is used to drive the carrier (41) to move laterally along the guide rods (48).

8. The chip carrier switching device according to claim 7, characterized in that: The moving mechanism (42) also includes a belt (491). The bottom surface of the carrier (41) is provided with a connecting piece (412), and the connecting piece (412) is fixedly connected to the belt (491). The second power mechanism (49) can drive the belt (491) to rotate, so that the belt (491) pulls the carrier (41) to move laterally.

9. The chip carrier switching device according to claim 8, characterized in that: The second power mechanism (49) can drive the belt (491) to rotate in both clockwise and counterclockwise directions, so that the carrier (41) can move back and forth in the lateral direction.

10. The chip carrier switching device according to claim 1, characterized in that: The first carrier plate (31), the lifting carrier plate (44) and the second carrier plate (43) are all provided with clips, the clips are used to fix the tray (20), and the tray (20) is used to carry chips.

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