Electronic equipment

Abstract

The embodiment of the invention provides electronic equipment, and the electronic equipment comprises an equipment body which is internally provided with a complete machine rear cavity, and the equipment body is also provided with a sound outlet hole communicated with the outside; the loudspeaker module is arranged in the equipment body, the loudspeaker module is provided with a front cavity, a rear cavity and a rear cavity channel communicated with the rear cavity, the front cavity is communicated with the sound outlet hole, and the rear cavity is communicated with the complete machine rear cavity through the rear cavity channel; wherein the rear cavity channel is provided with a sound wave absorption structure, and the sound wave absorption structure is used for absorbing sound waves with specific frequency. In the electronic equipment provided by the embodiment of the invention, the loudspeaker module not only can better eliminate shell vibration, but also can give consideration to better audio output effect and working efficiency, so that the use experience of a user is greatly improved.

Description

Technical Field

[0001] The present application belongs to the field of communication technology, and specifically relates to an electronic device. Background Art

[0002] As a sound-generating device, the speaker module usually generates sound by driving the air vibrations on both sides of the diaphragm. One side of the diaphragm and the front cavity surround the front cavity space of the speaker, and the other side of the diaphragm and the rear cavity surround the rear cavity space. The air vibration on one side of the diaphragm is radiated to the outside world through the front cavity space, allowing the human ear to receive and perceive it; while the air on the other side is transmitted to the inside of the whole machine through the rear cavity space and dissipated inside the whole machine. However, the air vibration transmitted to the inside of the whole machine is easy to cause resonance of the whole machine during the dissipation process, which is called phone case vibration, and this will seriously affect the user experience.

[0003] In the existing technology, in order to eliminate shell vibration, foam is usually added to the battery cover to reduce the shell vibration. Although this method can weaken the shell vibration, when the output power of the speaker module increases, the amplitude is large at certain resonant frequency points, and the shell vibration is still obvious, affecting the user experience. Summary of the invention

[0004] The present application aims to provide an electronic device to solve the problem that the existing speaker shell vibration elimination solution is difficult to take into account the shell vibration elimination effect, audio output effect and work efficiency.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] The present application discloses an electronic device, the electronic device comprising:

[0007] The device body has a rear cavity and a sound outlet hole connected to the outside world;

[0008] and a speaker module, the speaker module being disposed in the device body, the speaker module having a front cavity, a rear cavity and a rear cavity channel communicating with the rear cavity, the front cavity being communicated with the sound outlet, and the rear cavity being communicated with the rear cavity of the whole device through the rear cavity channel;

[0009] Wherein, a sound wave absorbing structure is arranged on the rear cavity channel, and the sound wave absorbing structure is used to absorb sound waves of a specific frequency.

[0010] Optionally, the sound wave absorbing structure includes a resonant cavity structure.

[0011] Optionally, the resonance cavity structure comprises a Helmholtz resonator, wherein the Helmholtz resonator comprises at least one resonator cavity, wherein the resonator cavity has an opening, and wherein the opening is communicated with the rear cavity channel.

[0012] Optionally, when there are multiple resonator cavities, the multiple resonator cavities are sequentially arranged along the rear cavity channel; wherein,

[0013] The resonance frequency of each resonator cavity is different.

[0014] Optionally, among the multiple resonator cavities, each resonator cavity is different in volume and / or shape from the other resonator cavities.

[0015] Optionally, the sound wave absorbing structure comprises a perforated plate, on which a plurality of holes distributed in an array are arranged, and the perforated plate is used to absorb sound waves of a specific frequency.

[0016] Optionally, the size of the specific frequency is related to the distribution of the holes, and / or the depth of the holes, and / or the diameter of the holes.

[0017] Optionally, there are multiple perforated plates, and the multiple perforated plates are arranged in sequence along the rear cavity channel;

[0018] Wherein, different perforated plates absorb sound waves of different specific frequencies.

[0019] Optionally, the sound wave absorbing structure includes: a diameter-changing section arranged in the rear cavity channel; wherein the cross-sectional area of ​​the diameter-changing section is larger than the cross-sectional area of ​​the rear cavity channel.

[0020] Optionally, the speaker module further includes: a shell and a sound-emitting unit, the sound-emitting unit is arranged in the shell, the sound-emitting unit includes a first side and a second side arranged away from each other, the first side and one side of the shell are enclosed to form the front cavity, and the second side and the other side of the shell are enclosed to form the rear cavity;

[0021] The device body includes a frame, a back cover and a display screen, wherein the display screen is connected to one side of the frame, and the back cover is connected to the other side of the frame, and the frame, the display screen and the back cover together form the rear cavity of the entire device.

[0022] In the embodiment of the present application, since the rear cavity of the speaker module is connected to the rear cavity of the entire device body, it is beneficial to effectively expand the volume of the speaker rear cavity, which is beneficial for the speaker module to obtain better low-frequency response and work efficiency, and can reduce the working power consumption of the electronic device. At the same time, since a sound wave absorption structure is provided on the rear cavity channel, the sound wave absorption structure can be used to absorb sound waves of a specific frequency, so that the sound waves reaching the rear cavity of the entire device through the rear cavity channel cannot cause resonance of the entire device, thereby reducing the risk of shell vibration. That is, in the electronic device described in the embodiment of the present application, the speaker module can not only better eliminate shell vibration, but also take into account better audio output effects and work efficiency, which greatly improves the user experience.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 is a structural schematic diagram of an electronic device described in an embodiment of the present application;

[0026] Figure 2 is a schematic structural diagram of another electronic device described in an embodiment of the present application;

[0027] Figure 3 yes Figure 2 A schematic diagram of the structure of a perforated plate in an electronic device shown;

[0028] Figure 4 is a structural schematic diagram of another electronic device described in an application embodiment;

[0029] Figure 5 yes Figure 4 A schematic structural diagram of a diameter-changing section in an electronic device is shown.

[0030] Figure numerals: 1 - whole machine rear cavity, 11 - frame, 12 - rear cover, 13 - display screen, 2 - front cavity, 3 - rear cavity, 4 - rear cavity channel, 5 - sound wave absorption structure, 51 - resonator cavity, 52 - hole, 6 - shell, 7 - sound unit. DETAILED DESCRIPTION

[0031] Embodiments of the present invention will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0032] The term "first" or "second" in the specification and claims of the present application may include one or more of the features explicitly or implicitly. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0033] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0034] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] An embodiment of the present application provides an electronic device, which may include at least one of a mobile phone, a tablet computer, and a wearable device. The embodiment of the present application may not limit the specific type of the electronic device.

[0036] Reference Figure 1 , shows a schematic diagram of the structure of an electronic device according to an embodiment of the present application. Figure 1As shown, the electronic device includes: a device body, a whole machine rear cavity 1 is provided in the device body, and a sound outlet hole connected to the outside is also provided on the device body (not shown in the figure); and a speaker module, the speaker module is arranged in the device body, and the speaker module has a front cavity 2, a rear cavity 3 and a rear cavity channel 4 connected to the rear cavity 3, the front cavity 2 is connected to the sound outlet hole, and the rear cavity 3 is connected to the whole machine rear cavity 1 through the rear cavity channel 4; wherein, a sound wave absorption structure 5 is provided on the rear cavity channel 4, and the sound wave absorption structure 5 can be used to absorb sound waves of specific frequencies.

[0037] In the embodiment of the present application, since the rear cavity 3 of the speaker module is connected to the rear cavity 1 of the whole machine of the device body, it is beneficial to effectively expand the volume of the speaker rear cavity 3, which is beneficial for the speaker module to obtain better low-frequency response and work efficiency, and can reduce the working power consumption of the electronic device. At the same time, since the sound wave absorption structure 5 is provided on the rear cavity channel 4, the sound wave absorption structure 5 is used to absorb sound waves of a specific frequency, so that the sound waves reaching the rear cavity 1 of the whole machine through the rear cavity channel 4 cannot cause resonance of the whole machine, thereby reducing the risk of shell vibration. That is, in the electronic device described in the embodiment of the present application, the speaker module can not only better eliminate shell vibration, but also take into account better audio output effect and work efficiency, which greatly improves the user experience.

[0038] In practical applications, the shell vibration of the electronic device is mainly generated by the resonance of the whole machine caused by the air vibration transmitted from the speaker to the inside of the whole machine. Usually, for a certain model of electronic equipment, the resonant frequency of the shell vibration is usually fixed, and the number of its resonant frequencies is usually one or more. When the specific size of the electronic device, the material and layout of the internal components, the parameters of the speaker module, and the position of the speaker module inside the electronic device are determined, the resonant frequency of the whole machine resonance generated by the electronic device and the speaker module can be detected through experiments.

[0039] Specifically in the embodiment of the present application, after obtaining the resonant frequency at which the electronic device and the speaker module produce the resonance of the whole machine, a sound wave absorption structure 5 capable of absorbing the sound waves at the resonant frequency can be provided on the rear cavity channel 4. In this way, after the air vibration in the rear cavity 3 of the speaker module is transmitted to the rear cavity channel 4, the sound waves at the resonant frequency can be absorbed by the sound wave absorption structure 5 on the rear cavity channel 4, that is, the sound waves at the resonant frequency are completely filtered by the sound wave absorption structure 5. In this way, the sound waves transmitted to the rear cavity 1 of the whole machine through the rear cavity channel 4 will no longer contain the sound waves of the resonant frequency, and accordingly, the whole machine resonance cannot be caused, so as to achieve the purpose of eliminating the shell vibration.

[0040] It should be noted that due to factors such as the size of the electronic device, the location of the speaker module in the electronic device, and the material of the back cover of the electronic device, different models of electronic devices may easily cause the resonance frequency of the sound waves caused by the shell vibration of the electronic device to be different. Therefore, the embodiment of the present application does not specifically limit the specific frequency.

[0041] like Figure 1 As shown, the speaker module may further include: a shell 6 and a sound unit 7, and the sound unit 7 is arranged in the shell 6. The sound unit 7 may at least include a diaphragm and a driving member for driving the diaphragm to vibrate. The sound unit 7 may include a first side and a second side that are arranged away from each other, the first side and one side of the shell 6 are enclosed to form a front cavity 2, and the second side and the other side of the shell 6 are enclosed to form a rear cavity 3.

[0042] In actual applications, when the driving member drives the diaphragm to vibrate toward the first side, the air on the first side of the diaphragm vibrates and radiates to the outside of the electronic device through the front cavity 2, achieving the effect of emitting sound. When the driving member drives the diaphragm to vibrate toward the second side, the air on the second side of the diaphragm vibrates and reaches the rear cavity 1 of the whole machine through the rear cavity 3 and the rear cavity channel 4. Since the volume of the rear cavity 1 of the whole machine is relatively large, the space of the rear cavity 3 of the speaker module can be greatly expanded by connecting the rear cavity 3 of the speaker module with the rear cavity 1 of the whole machine through the rear cavity channel 4.

[0043] In practical applications, since the acoustic capacity of the speaker module is positively correlated with the spatial size of the rear cavity 3 of the speaker module, and the low-frequency response of the speaker module is positively correlated with the acoustic capacity of the speaker module, the acoustic capacity and low-frequency response of the speaker module can be increased by expanding the volume of the rear cavity 3 of the speaker module, thereby improving the low-frequency sound effect of the speaker module.

[0044] Moreover, since the radiation efficiency of the speaker module is positively correlated with the space size of the rear cavity 3 of the speaker module, and the power consumption of the speaker module is negatively correlated with the radiation efficiency of the speaker module, that is, the higher the radiation efficiency of the speaker module, the lower its power consumption. Therefore, in the electronic device described in the embodiment of the present application, by increasing the space of the rear cavity 3 of the speaker module, the radiation efficiency of the speaker module can be improved to achieve the purpose of reducing the power consumption of the speaker module. Accordingly, it is conducive to reducing the power consumption of the entire electronic device.

[0045] like Figure 1As shown, the device body as the structural body of the electronic device may specifically include a frame 11, a back cover 12 and a display screen 13. The display screen 13 is connected to one side of the frame 11, and the back cover 12 is connected to the other side of the frame 11. The frame 11, the display screen 13 and the back cover 12 enclose a rear cavity 1 of the whole machine. In practical applications, various structural parts and electronic components such as a main board, a main board bracket, and a sensor may also be arranged in the rear cavity 1 of the whole machine to reasonably utilize the internal space in the device body. After the above-mentioned structural parts or electronic components are arranged in the rear cavity 1 of the whole machine, only space for air circulation needs to be left.

[0046] like Figure 1 As shown, the sound wave absorption structure 5 may specifically include a resonant cavity structure. The resonant cavity structure has a closed or semi-closed space, and the resonant cavity structure may be a container, a pipe or other structure. When the air or other medium in the resonant cavity structure is subjected to an external vibration force, a resonance phenomenon will occur, so as to absorb the sound waves with a vibration frequency of the resonant frequency without achieving the purpose of eliminating the resonant frequency sound waves. The resonant cavity structure can be used to absorb sound waves with a wider frequency, and has a better absorption effect on the sound waves with the resonant frequency.

[0047] Optionally, the resonant cavity structure may include a Helmholtz resonator. The Helmholtz resonator is a simple acoustic resonance system with a specific resonant frequency. When sound waves enter the Helmholtz resonator, the Helmholtz resonator can absorb the sound waves with a vibration frequency of the resonant frequency through resonance, thereby achieving the purpose of eliminating the sound waves with the resonant frequency. Therefore, in a specific application, after obtaining the resonant frequency at which the electronic device and the speaker module produce a whole-machine resonance, a Helmholtz resonator with a resonant frequency consistent with the whole-machine resonant frequency can be selected, and the Helmholtz resonator is set on the rear cavity channel 4. In this way, after the air vibration in the rear cavity 3 of the speaker module is transmitted to the rear cavity channel 4, it can enter the Helmholtz resonator located in the rear cavity channel 4. The Helmholtz resonator can absorb the sound waves at the resonant frequency through resonance, so as to avoid the sound waves with a vibration frequency of the resonant frequency from being transmitted to the whole-machine rear cavity 1 to cause the whole-machine resonance, so as to achieve the purpose of eliminating shell vibration. Since the Helmholtz resonator is a basic acoustic resonance system with a simple structure and is easy to implement, when the sound wave absorbing structure 5 is the Helmholtz resonator, the sound wave absorbing structure 5 can have the advantages of being simple in structure and easy to implement, thereby greatly reducing the structural complexity and structural cost of the electronic device.

[0048] like Figure 1As shown, the Helmholtz resonator includes at least one resonator cavity 51, and the resonator cavity 51 has an opening, and the opening is connected to the rear cavity channel 4. When the sound waves in the rear cavity 3 of the speaker module reach the rear cavity channel 4, when there are sound waves of a specific frequency in the sound waves, the resonator cavity 51 can absorb the sound waves of the specific frequency through resonance, thereby preventing the sound waves of the specific frequency from flowing into the rear cavity 1 of the whole device and causing the shell vibration of the electronic device.

[0049] In some optional embodiments of the present application, when there are multiple resonator cavities 51, the multiple resonator cavities 51 are arranged in sequence along the rear cavity channel 4; wherein the resonance frequency of each resonator cavity 51 is different to absorb sound waves of different specific frequencies, thereby further improving the effect of eliminating shell vibration.

[0050] In practical applications, there may be multiple sound waves of specific frequencies that are prone to cause shell vibration. In the embodiment of the present application, by setting up multiple resonator cavities 51 along the rear cavity channel 4, each resonator cavity 51 can be used to absorb a sound wave of a specific frequency. In this way, when the sound waves in the rear cavity 3 of the speaker module flow through the rear cavity channel 4, the multiple resonator cavities 51 can absorb multiple sound waves of specific frequencies in turn, avoiding these sound waves of specific frequencies from flowing into the rear cavity 1 of the entire machine and causing the shell vibration of the electronic device.

[0051] It should be noted that Figure 1 Only the case where the number of resonator cavities 51 is two is shown. In actual applications, the number of resonator cavities 51 can also be 1, 2, 3, 4 or 5, etc. The embodiment of the present application does not specifically limit the number of resonator cavities 51.

[0052] For example, for an electronic device with only one sound wave of a specific frequency that can cause shell vibration, the number of resonator cavities 51 in the Helmholtz resonator can be only one, and the resonator cavity 51 can absorb the sound wave of the specific frequency. For another example, for an electronic device with two sound waves of a specific frequency that can cause shell vibration, the number of resonator cavities 51 in the Helmholtz resonator can be two, and each resonator cavity 51 can absorb a corresponding sound wave of the specific frequency.

[0053] In practical applications, the resonance frequency fr of a single resonator cavity 51 can be calculated by the following formula:

[0054]

[0055] Among them, M b is the acoustic mass of the short tube of the resonator cavity 51, which is related to the shape and size of the resonator cavity 51. b is the cavity acoustic capacity of the resonator cavity 51.

[0056] In a specific application, after the sound waves in the rear cavity 3 of the speaker module are transmitted to the rear cavity channel 4, they will enter the resonator cavity 51 from the opening of the resonator cavity 51 of the Helmholtz resonator located in the rear cavity channel 4. When the vibration frequency f of the sound waves in the rear cavity channel 4 is f r When the sound wave is in the resonator cavity 51, it can absorb the sound wave of the vibration frequency through resonance, so as to prevent the sound wave from flowing into the rear cavity 1 of the whole device and causing the shell vibration of the electronic device.

[0057] In practical applications, since there may be multiple sound waves of specific frequencies that cause the shell vibration of the electronic device, multiple resonator cavities 51 can be connected in parallel to absorb multiple sound waves of specific frequencies, thereby preventing these sound waves of specific frequencies from flowing into the rear cavity 1 of the entire device and causing the shell vibration of the electronic device. For different types of electronic devices, since the resonant frequencies that cause the shell vibration are also different, the sound waves of specific frequencies that need to be absorbed by the resonator cavity 51 through resonance are also different, that is, the resonant frequency fr of the resonator cavity 51 is also different.

[0058] Specifically, since the resonance frequency fr of the resonator cavity 51 is related to the cavity volume, the resonance frequency fr of the resonator cavity 51 can be determined by designing the cavity volume of the resonator cavity 51. Since the cavity volume of the resonator cavity 51 is related to the shape and size of the cavity, in a specific application, the cavity volume of the resonator cavity 51 can be designed by designing the shape and the length, width and height dimensions of the resonator cavity 51, so as to achieve the purpose of designing the resonance frequency fr of the resonator cavity 51.

[0059] According to formula (1), the resonant frequency fr of the resonator cavity 51 is inversely proportional to the cavity acoustic capacity C b , and the cavity sound capacity C b It is proportional to the volume of the cavity. Therefore, if the resonance frequency fr of the resonator cavity 51 needs to be increased, it is only necessary to reduce the volume of the resonator cavity 51.

[0060] In a specific application, among the multiple resonator cavities 51 , the volume of each resonator cavity 51 is different from that of other resonator cavities 51 , so that the multiple resonator cavities 51 have different resonance frequencies fr to absorb sound waves of different specific frequencies.

[0061] It should be noted that the resonance cavity structure may also be other structures such as a resonance box, and the embodiment of the present application may not limit the specific content of the resonance cavity structure.

[0062] Reference Figure 2 , showing a schematic diagram of the structure of another electronic device according to an embodiment of the present application, referring to Figure 3 , showing Figure 2 The schematic diagram of the structure of the perforated board in the electronic device shown in FIG. Figure 2 As shown, the sound wave absorbing structure 5 may include a perforated plate. Figure 3 As shown, the perforated plate is provided with a plurality of holes 52 distributed in an array, and the holes 52 on the perforated plate can be used to absorb sound waves of a specific frequency.

[0063] like Figure 3 As shown, a large number of holes 52 are distributed on the perforated plate. When the air vibration in the rear cavity 3 of the speaker module is transmitted to the rear cavity channel 4, it will pass through the perforated plate located in the rear cavity channel 4. When the sound wave passes through the perforated plate, the sound waves of some frequencies will propagate through the holes 52 on the perforated plate and enter the whole machine rear cavity 1 connected to the rear cavity channel 4, while the sound waves of other frequencies will be absorbed or scattered due to the obstruction of the holes 52 and cannot enter the whole machine rear cavity 1 connected to the rear cavity channel 4.

[0064] Specifically in the embodiment of the present application, if the sound wave blocked and absorbed or scattered by the holes 52 of the perforated plate is a sound wave of a specific frequency that can cause the whole machine to resonate, then the sound wave of the specific frequency can be prevented from entering the rear cavity 1 of the whole machine to cause the whole machine to resonate, thereby achieving the purpose of eliminating the shell vibration of the electronic device.

[0065] Specifically, the frequency of the sound waves that can be blocked by the holes 52 of the perforated plate is related to the distribution of the holes 52, and / or the depth of the holes 52, and / or the diameter of the holes 52. Therefore, in a specific application, the frequency of the sound waves that can be blocked by the holes 52 can be adjusted by changing the diameter, and / or the depth, and / or the distribution of the holes 52, so that the perforated plate can absorb the sound waves of a specific frequency that can resonate the entire device, thereby reducing the risk of shell vibration of the electronic device.

[0066] In practical applications, the perforated plate can be fixed to the rear cavity channel 4 by bonding, clamping, etc. The embodiment of the present application does not specifically limit the connection method of the perforated plate to the rear cavity channel 4.

[0067] In some optional embodiments of the present application, there are multiple perforated plates, and the multiple perforated plates are arranged in sequence along the rear cavity channel 4; wherein different perforated plates absorb sound waves of different specific frequencies to absorb sound waves of different specific frequencies, thereby further improving the effect of eliminating shell vibration.

[0068] In practical applications, there may be or exist multiple sound waves of specific frequencies that are prone to cause shell vibration. In the embodiment of the present application, by setting multiple perforated plates along the rear cavity channel 4, each perforated plate can be used to absorb a sound wave of a specific frequency. In this way, when the sound waves in the rear cavity 3 of the speaker module flow through the rear cavity channel 4, the multiple perforated plates can absorb multiple sound waves of specific frequencies in turn, preventing these sound waves of specific frequencies from flowing into the rear cavity 1 of the entire machine and causing the shell vibration of the electronic device.

[0069] It should be noted that Figure 1 Only the case where the number of the perforated plates is 1 is shown, but in actual applications, the number of the perforated plates can also be 2, 4 or 5, etc. The embodiment of the present application does not specifically limit the number of the perforated plates.

[0070] Reference Figure 4 , showing a structural schematic diagram of another electronic device described in an embodiment of the present application, referring to Figure 5 , showing Figure 4 The schematic diagram of the structure of the variable diameter section of the rear cavity channel in the electronic device shown in FIG. Figure 4 As shown, the sound wave absorbing structure 5 includes: a diameter-changing section arranged in the rear cavity channel 4; wherein the cross-sectional area of ​​the diameter-changing section is larger than the cross-sectional area of ​​the rear cavity channel, so as to absorb sound waves of a specific frequency through the diameter-changing section.

[0071] like Figure 5 As shown, the cross-sectional area of ​​the rear cavity channel 4 is S1, the cross-sectional area of ​​the variable diameter section is S2, and the length is D, wherein The sound intensity transmission coefficient t of the variable diameter section I The formula can be:

[0072]

[0073] Wherein, k is the wavelength, k=2π, and λ is the wavelength of the sound wave. It can be seen from Formula 2 that when the sound wave in the rear cavity channel 4 passes through the variable diameter section, When the transmission coefficient t I The minimum, at this time the sound wave transmission ability is the worst, which achieves the filtering effect on certain specific frequencies. By designing the cross-sectional area ratio of the rear cavity channel 4 and the variable diameter section The minimum transmittance can be obtained by designing the length of the variable diameter section. It can filter the sound waves of a specific frequency that causes the whole machine to resonate, thereby eliminating the vibration of the whole machine casing.

[0074] In a specific application, the length of the variable diameter section can be designed first, and then the cross-sectional area ratio of the rear cavity channel 4 and the variable diameter section can be designed, and then substituted into formula (2) to obtain the minimum transmittance, so as to filter the sound waves of a specific frequency that causes resonance of the whole machine, thereby achieving the purpose of eliminating the vibration of the whole machine casing.

[0075] In summary, the electronic device described in the embodiments of the present application may at least have the following advantages:

[0076] In the embodiment of the present application, since the rear cavity of the speaker module is connected to the rear cavity of the entire device body, it is beneficial to effectively expand the volume of the speaker rear cavity, which is beneficial for the speaker module to obtain better low-frequency response and work efficiency, and can reduce the working power consumption of the electronic device. At the same time, since a sound wave absorption structure is provided on the rear cavity channel, the sound wave absorption structure can be used to absorb sound waves of a specific frequency, so that the sound waves reaching the rear cavity of the entire device through the rear cavity channel cannot cause resonance of the entire device, thereby reducing the risk of shell vibration. That is, in the electronic device described in the embodiment of the present application, the speaker module can not only better eliminate shell vibration, but also take into account better audio output effects and work efficiency, which greatly improves the user experience.

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0078] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: The electronic device comprises: The device body has a rear cavity and a sound outlet hole connected to the outside world; and a speaker module, the speaker module being disposed in the device body, the speaker module having a front cavity, a rear cavity and a rear cavity channel communicating with the rear cavity, the front cavity being communicated with the sound outlet, and the rear cavity being communicated with the rear cavity of the whole device through the rear cavity channel; Wherein, a sound wave absorbing structure is arranged on the rear cavity channel, and the sound wave absorbing structure is used to absorb sound waves of a specific frequency.

2. The electronic device according to claim 1, characterized in that: The sound wave absorbing structure includes a resonant cavity structure.

3. The electronic device according to claim 2, characterized in that: The resonance cavity structure comprises a Helmholtz resonator, wherein the Helmholtz resonator comprises at least one resonator cavity, wherein the resonator cavity has an opening, and the opening is communicated with the rear cavity channel.

4. The electronic device according to claim 3, characterized in that: In the case where there are multiple resonator cavities, the multiple resonator cavities are arranged in sequence along the rear cavity channel; wherein, The resonance frequency of each resonator cavity is different.

5. The electronic device according to claim 4, characterized in that: Among the plurality of resonator cavities, each resonator cavity has a different volume and / or shape from the other resonator cavities.

6. The electronic device according to claim 1, characterized in that: The sound wave absorbing structure comprises a perforated plate, on which a plurality of holes distributed in an array are arranged, and the perforated plate is used to absorb sound waves of a specific frequency.

7. The electronic device according to claim 6, characterized in that: The magnitude of the specific frequency is related to the distribution of the holes, and / or the depth of the holes, and / or the diameter of the holes.

8. The electronic device according to claim 7, characterized in that: There are multiple perforated plates, and the multiple perforated plates are arranged in sequence along the rear cavity channel; Wherein, different perforated plates absorb sound waves of different specific frequencies.

9. The electronic device according to claim 1, characterized in that: The sound wave absorbing structure comprises: a diameter-changing section arranged in the rear cavity channel; wherein the cross-sectional area of ​​the diameter-changing section is larger than the cross-sectional area of ​​the rear cavity channel.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The speaker module further includes: a shell and a sound unit, wherein the sound unit is arranged in the shell, and the sound unit includes a first side and a second side which are arranged in opposite directions, wherein the first side and one side of the shell are enclosed to form the front cavity, and the second side and the other side of the shell are enclosed to form the rear cavity; The device body includes a frame, a back cover and a display screen, wherein the display screen is connected to one side of the frame, and the back cover is connected to the other side of the frame, and the frame, the display screen and the back cover together form the rear cavity of the entire device.

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