Heat dissipation PCB and semiconductor device
By designing a multi-layer heat dissipation PCB board in semiconductor devices, using the combined structure of vias and empty slots and electroplating layer, the heat conduction efficiency is improved, and the stability caused by low heat conduction efficiency and inconsistent material shrinkage in the prior art is solved. The problem is to achieve more efficient heat dissipation and stability.
Patent Information
- Application Number
- CN202411445287.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-01-07
AI Technical Summary
The heat dissipation methods of existing semiconductor devices have risks of displacement and shedding caused by low thermal conduction efficiency and inconsistent material expansion and shrinkage, which affect structural stability and wiring density.
Design a heat dissipation PCB board, including the top, bottom and middle substrate, the middle substrate is connected to the top substrate through the via hole, and the bottom substrate is equipped with a heat dissipation structure, and the via hole is connected to the empty slot, which increases the heat dissipation area and passes through the electroplating layer Enhance thermal conductivity and reduce the risks caused by material expansion and shrinkage.
It improves heat dissipation efficiency and structural stability, reduces the risk of dissipation and shedding of the mosaic block, enhances the heat dissipation ability of semiconductor devices, and avoids working abnormalities caused by heat accumulation.
Smart Images
Figure CN119277634A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor technology, and in particular to a heat dissipation PCB board and a semiconductor device. Background Art
[0002] With the development of data centers and wireless access networks, high-speed optical modules are being used more and more widely. As the integration of modules increases, the demand for heat dissipation is also increasing. Therefore, it is of great significance to study the internal thermal field distribution of the module when it is working under high-speed data stream transmission, as well as to conduct thermal design and thermal management of optical module packaging components and component layout. The rapid development of modern electronic technology is closely related to the continuous advancement of thermal control technology. Thermal design has become an important part of the design of optoelectronic components, devices and modules. The choice of thermal control scheme has a profound impact on its performance, reliability and cost.
[0003] At present, the chip heat dissipation method in semiconductor devices is to design mechanical or laser vias inside the PCB below the chip (such as Figure 1 ), conduct the heat to the back of the PCB through vias, or embed a copper block or ceramic inside the PCB under the chip (such as Figure 2 As shown), the heat is conducted to the back of the PCB through a copper block or ceramic.
[0004] However, PCBs are often made of multi-layer structures made of materials such as copper-clad resin and glass fiber. The thermal resistance of multi-layer resin and glass fiber is very large. Heat is only conducted through vias. The heat conduction efficiency is limited by the density of vias and the thickness of via copper plating. Bare chips are prone to heat accumulation and abnormal operation. In order to achieve efficient heat conduction by embedding copper blocks or ceramics and other high thermal conductivity materials, the PCB under the chip needs to be hollowed out to embed heat dissipation materials. However, due to the inconsistent expansion and contraction of different materials, the reliability of the solution is poor. Long-term use is prone to the risk of displacement or even falling of embedded blocks. At the same time, the hollowed-out area cannot be used to lay lines, reducing the wiring density. Summary of the invention
[0005] In view of this, an object of the present invention is to provide a heat dissipation PCB board and a semiconductor device.
[0006] In the first aspect, an embodiment of the present invention provides a heat dissipation PCB board, which includes: a top substrate, a bottom substrate and a middle substrate; the middle substrate is arranged between the top substrate and the bottom substrate; the middle substrate includes a first substrate group and a second substrate group, the first substrate group is arranged on the second substrate group, and the top substrate and the first substrate group are connected through vias; empty grooves are opened on the bottom substrate and the second substrate group, the empty grooves are connected to the vias, and a heat dissipation structure is installed in the empty grooves.
[0007] In combination with the first aspect, a forward or reverse chip is mounted on the heat dissipation PCB board, and the heat dissipation structure is connected to the packaging shell of the chip.
[0008] In combination with the first aspect, an electroplating layer is arranged circumferentially around the outer side of the empty slot in the heat dissipation PCB board.
[0009] In combination with the first aspect, the bottom surface of the heat dissipation structure extends outwardly to the outside of the bottom substrate until it contacts the packaging shell of the chip.
[0010] In combination with the first aspect, the heat dissipation structure is made of metal or rubber material.
[0011] In combination with the first aspect, there are at least two via holes, and the at least two via holes are arranged at intervals.
[0012] In combination with the first aspect, the heat dissipation structure and the empty slot are interference fit.
[0013] In combination with the first aspect, the packaging shell is made of metal.
[0014] In combination with the first aspect, a spacer layer is arranged between two adjacent substrates in the middle substrate.
[0015] In a second aspect, the present application provides a semiconductor device, comprising the heat dissipation PCB board as described above.
[0016] The embodiments of the present invention bring the following beneficial effects: the heat dissipation PCB board and semiconductor device provided by the present application, the heat dissipation PCB board includes: a top substrate, a bottom substrate and a middle substrate; the middle substrate is arranged between the top substrate and the bottom substrate; the top substrate and part or all of the middle substrate are connected through vias; empty grooves are opened on the bottom substrate and part or all of the middle substrate, and the heat dissipation structure is installed in the empty grooves.
[0017] In the present application, the heat dissipation PCB board is a multi-layer structure. The heat of the electronic components above the heat dissipation PCB board is dissipated to the external environment through the holes and heat conduction of the heat dissipation structure. Compared with the traditional method of embedding copper blocks or ceramics in the PCB board, hollow grooves are dug in the heat dissipation PCB. This can reduce the risks of block displacement and falling off caused by differences in material expansion and contraction, thereby improving structural stability and improving heat dissipation efficiency.
[0018] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.
[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.
[0021] Figure 1 A cross-sectional schematic diagram of a heat dissipation PCB board provided in the prior art;
[0022] Figure 2 It is a cross-sectional schematic diagram of another heat dissipation PCB board provided in the prior art;
[0023] Figure 3 A cross-sectional schematic diagram of a heat dissipation PCB board provided in an embodiment of the present invention.
[0024] Reference numerals:
[0025] 1-top substrate, 2-bottom substrate, 3-middle substrate, 31-first substrate group, 32-second substrate group, 4-via, 5-empty groove, 6-heat dissipation structure, 7-electroplating layer, 8-isolation layer. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.
[0027] In order to facilitate the understanding of this embodiment, the technical terms designed in this application are briefly introduced below.
[0028] PCB (Printed Circuit Board), also known as printed circuit board, printed circuit board, etc., is divided into three major categories according to the number of layers: single-sided board, double-sided board and multi-layer circuit board. A chopped board refers to a printed circuit board with more than three layers of conductive graphic layers and insulating materials laminated in between, and the conductive graphics of the devices are interconnected as required. Multi-layer circuit board is the product of the development of electronic information technology towards high speed, multi-function, large capacity, small size, thinness and lightweight.
[0029] After introducing the technical terms involved in this application, the application scenarios and design concepts of the embodiments of this application are briefly introduced.
[0030] In the prior art, such as Figure 1 The heat dissipation PCB shown in the figure comprises a top substrate 1, a bottom substrate 2 and a middle substrate 3. A via 4 penetrating the heat dissipation PCB is provided on the heat dissipation PCB to conduct heat. Since the PCB is often a multi-layer structure made of materials such as copper foil-clad resin and glass fiber, the thermal resistance of the multi-layer resin and glass fiber is very large. Figure 1 The heat dissipation PCB shown in FIG. 1 is affected by the density of vias 4 and the thickness of via copper plating, and the heat conduction efficiency is limited; Figure 2 The heat dissipation PCB board shown has heat dissipation structures embedded in corresponding areas of the top substrate 1, the bottom substrate 2 and the middle substrate 3. Due to the inconsistent expansion and contraction of different materials, efficient heat conduction is achieved only by embedding copper blocks or ceramics and other high thermal conductivity materials. There is a risk of displacement or even falling off of the embedded blocks, and the hollowed-out areas cannot be used to lay lines, which reduces the wiring density.
[0031] Based on this, an embodiment of the present application provides a heat dissipation PCB board and a semiconductor device.
[0032] Example 1
[0033] The present application provides a heat dissipation PCB board, combined with Figure 3 As shown, the heat dissipation PCB board includes: a top substrate 1, a bottom substrate 2 and a middle substrate 3; the middle substrate 3 is arranged between the top substrate 1 and the bottom substrate 2; the middle substrate 3 includes a first substrate group 31 and a second substrate group 32, the first substrate group 31 is arranged on the second substrate group 32, and the top substrate 1 is connected to the first substrate group 31 through a via 4; an empty groove 5 is opened on the bottom substrate 2 and the second substrate group 32, the empty groove 5 is connected to the via 4, and a heat dissipation structure 6 is installed in the empty groove 5.
[0034] In this embodiment, the heat dissipation PCB board is a multi-layer structure. The heat of the electronic components above the heat dissipation PCB board is dissipated to the external environment through the heat conduction of the hole 4 and the heat dissipation structure 6. Compared with the traditional method of embedding copper blocks or ceramics in the PCB board, the empty groove 5 is dug in the heat dissipation PCB board. It can reduce the risk of block displacement and falling off caused by the difference in material expansion and contraction, thereby improving the structural stability and improving the heat dissipation efficiency.
[0035] It can be understood that the first substrate group 31 includes at least two substrates, and the first substrate group 31 is connected to the top substrate 1 through the via 4; the second substrate group 32 includes at least two substrates, and the bottom substrate and the second substrate group 32 have empty grooves 5, and the heat dissipation structure 6 is installed in the empty grooves 5. The heat is conducted from the vias 4 on the top substrate 1 and the vias 4 opened in the first substrate group 31 to the empty grooves 5, and the heat is dissipated and conducted through the heat dissipation structure 6.
[0036] In combination with the first aspect, a forward or reverse chip is mounted on the heat dissipation PCB board, and the heat dissipation structure 6 is connected to the packaging shell of the chip.
[0037] The other end of the heat dissipation structure 6 is connected to the chip packaging shell, so that the heat is transferred to the packaging shell, and then the packaging shell exchanges heat with the external environment to achieve heat dissipation.
[0038] In combination with the first aspect, an electroplating layer 7 is circumferentially arranged around the outer side of the hollow slot 5 in the heat dissipation PCB board.
[0039] In this way, the heat dissipation area can be increased to further reduce the thermal resistance.
[0040] In combination with the first aspect, the bottom surface of the heat dissipation structure 6 extends outwardly to the outside of the bottom substrate 2 until it contacts the packaging shell of the chip.
[0041] In combination with the first aspect, the heat dissipation structure 6 is made of metal or rubber.
[0042] It can be understood that the heat dissipation structure 6 is made of metal or rubber material, which is flexible in selection and easy to assemble. In practical applications, a heat dissipation structure 6 of appropriate thickness is selected to contact the packaging component of the chip packaging material, which has higher thermal conductivity efficiency.
[0043] In combination with the first aspect, there are at least two via holes 4 , and at least two via holes 4 are arranged at intervals.
[0044] like Figure 1 It can be seen from the cross-sectional view of the heat dissipation PCB board that at least two vias 4 are arranged at intervals along the top surface of the empty slot 5. As the number of vias 4 increases, the heat dissipation effect is improved. It can be understood that the heat dissipation PCB board has a width, and a plurality of evenly distributed vias 4 are connected above the empty slot 5. That is, a plurality of vias 4 are evenly arranged in the area corresponding to the empty slot 5 on the first substrate group 31. The plurality of vias 4 can be arranged in a matrix, or can be diffused outwardly in a circumferential direction with the center of the area as the base point, which is not limited here.
[0045] In combination with the first aspect, the heat dissipation structure 6 and the empty slot 5 are interference fit.
[0046] The heat dissipation structure 6 is stably and firmly assembled in the empty slot 5 through interference fit.
[0047] In combination with the first aspect, the packaging shell is made of metal.
[0048] In combination with the first aspect, the middle substrate 3 further includes an isolation layer 8, and the isolation layer 8 is arranged between two adjacent substrates.
[0049] The heat of the chip is dissipated to the external environment through the hole 4, the empty slot 5, the heat dissipation structure 6 and the chip packaging shell. In this process, the heat passing through the via 4 is also conducted through the isolation layer 8, and the heat passing through the heat dissipation structure 6 is also conducted outward through the electroplating layer 7 and the isolation layer 8.
[0050] In combination with the first aspect, the substrate includes an intermediate substrate layer, epoxy glass fiber layers are provided on both sides of the intermediate substrate layer, a copper layer is applied to the outer surface of the epoxy glass fiber layer, and a solder resist layer is applied to the outer surface of the copper layer. This is a common structure of the substrate and is not limited here.
[0051] In a second aspect, the present application provides a semiconductor device, including the above-mentioned heat dissipation PCB board. The heat dissipation PCB board based on this structure has good, stable and reliable heat dissipation capability, and the chip is not prone to overheating, which is conducive to the stable operation of the semiconductor device.
[0052] It can be understood that there can be many types of semiconductor devices, including but not limited to light emitters, amplifiers, rectifiers, oscillators, meters, and the like.
[0053] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system and device described above can refer to the corresponding process in the aforementioned heat dissipation PCB board embodiment, and will not be repeated here.
[0054] In addition, in the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0055] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the heat dissipation PCB board described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.
[0056] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0057] Finally, it should be noted that the above embodiments are only specific implementations of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The protection scope of the present invention is not limited thereto. Although the present invention is described in detail with reference to the above embodiments, those skilled in the art should understand that any person skilled in the art can still modify the technical solutions recorded in the above embodiments within the technical scope disclosed by the present invention, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.
Claims
1. A heat dissipation PCB board, characterized in that: The heat dissipation PCB board includes: a top substrate, a bottom substrate and a middle substrate; the middle substrate is arranged between the top substrate and the bottom substrate; the middle substrate includes a first substrate group and a second substrate group, the first substrate group is arranged on the second substrate group, and the top substrate and the first substrate group are connected through vias; empty grooves are opened on the bottom substrate and the second substrate group, the empty grooves are connected to the vias, and a heat dissipation structure is installed in the empty grooves.
2. The heat dissipation PCB board according to claim 1, characterized in that: A forward or reverse chip is mounted on the heat dissipation PCB board, and the heat dissipation structure is connected to the packaging shell of the chip.
3. The heat dissipation PCB board according to claim 1, characterized in that: An electroplating layer is arranged around the outer side of the empty slot in the heat dissipation PCB board.
4. The heat dissipation PCB board according to claim 1, characterized in that: The bottom surface of the heat dissipation structure extends outward to the outside of the bottom substrate until it contacts the packaging shell of the chip.
5. The heat dissipation PCB board according to claim 1, characterized in that: The heat dissipation structure is made of metal or rubber.
6. The heat dissipation PCB board according to claim 1, characterized in that: There are at least two via holes, and at least two of the via holes are arranged at intervals.
7. The heat dissipation PCB board according to claim 1, characterized in that: The heat dissipation structure is interference fit with the empty slot.
8. The heat dissipation PCB board according to claim 2, characterized in that: The packaging shell is made of metal.
9. The heat dissipation PCB board according to claim 1, characterized in that: An isolation layer is arranged between two adjacent substrates in the middle substrate.
10. A semiconductor device, characterized in that: It comprises a heat dissipation PCB board as described in any one of claims 1 to 9.