Composite printed circuit board and method of manufacturing the same

Abstract

The application provides a composite printed circuit board and a manufacturing method thereof, and relates to the field of printed circuits.The composite printed circuit board comprises a board body supporting mechanism, the board body supporting mechanism comprises a top plate, the bottom end of the top plate is fixedly connected with a heat-permeable layer, the bottom end of the heat-permeable layer is fixedly connected with a heat-conducting layer, the outer side wall of the top plate is fixedly connected with a plurality of first fixing rods and second fixing rods through bolts, and the first fixing rods and the second fixing rods are fixedly connected with supporting rods on one side.The application can realize electrical connection between electronic components, can be electrically connected through electronic components, can be used through components when circuit patterns are damaged, can dissipate heat generated by the operation of the circuit board, solves the problem that the printed circuit board is easily damaged and affects use, and better dissipates heat generated by the operation of the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of printed circuit, in particular to a composite printed circuit board and a manufacturing method thereof. BACKGROUND

[0002] Printed circuit board (PCB) is an electronic component for supporting and electrically connecting electronic components. PCB, full name Printed Circuit Board, is an indispensable basic element in the electronic industry. It forms a circuit pattern by etching or coating conductive material on an insulating substrate according to a predetermined design, thereby realizing the electrical connection between electronic components. Such design not only makes the circuit more miniaturized and intuitive, but also greatly promotes mass production and optimization of electrical layout. PCB can be divided into single-sided board, double-sided board and multi-layer circuit board, and is widely used in various electronic devices from electronic watches to giant computers according to its different structures and functions.

[0003] Most of the existing printed circuit boards are directly etched or coated with conductive material to form a circuit pattern, thereby realizing the electrical connection between electronic components. When used for a long time or water vapor corrosion occurs, the printed circuit board is often damaged. Moreover, most of the existing printed circuit boards cannot well dissipate the temperature generated during operation, and long-term use can easily cause the printed circuit board to be damaged. SUMMARY

[0004] In view of the deficiencies of the prior art, the present application provides a composite printed circuit board and a manufacturing method thereof. The present application can realize the electrical connection between electronic components and can be electrically connected by electronic components. When the circuit pattern is damaged, the electronic components can be simply connected for use, and

[0005] It also has the function of dissipating the heat generated by the operation of the circuit board, solves the problem of easy damage of the printed circuit board affecting use, and better dissipates the heat generated by the operation of the circuit board.

[0006] To achieve the above purpose, the present application is realized by the following technical scheme:

[0007] The utility model provides a kind of composite printed circuit board, including plate body support mechanism, the plate body support mechanism includes top plate, the bottom end of the top plate is fixedly connected with heat-permeable layer, the bottom end of the heat-permeable layer is fixedly connected with heat-conducting layer, the outer lateral wall of the top plate is fixedly connected with multiple first fixed rods and second fixed rods by bolt, and one support rod is fixedly connected between each first fixed rod and second fixed rod at the four corners of the top plate, the top end of the top plate is fixedly connected with electronic component mechanism, and the side of the top end of the top plate away from electronic component mechanism is provided with conduction mechanism, the side of the top end of the top plate away from conduction mechanism is provided with circuit fixed mechanism, and the outer lateral wall of the top plate is provided with temperature detection mechanism, and the bottom end of the top plate is provided with heat dissipation mechanism;

[0008] S1: the top plate, heat-permeable layer and heat-conducting layer are cut into production size, the surfaces of the top plate, heat-permeable layer and heat-conducting layer are cleaned using a brush respectively, surface contaminants are removed, the heat-permeable layer and heat-conducting layer are glued on the top plate in turn, a dry film is pasted on the surface of the top plate to prepare for subsequent image transfer, the top plate is exposed using ultraviolet light by an exposure device, so that the image of the top plate is transferred to the dry film, the top plate after exposure is subjected to development, etching and film removal, and thus the production of the inner layer plate is completed;

[0009] Through the above technical scheme, the printed circuit board can be more stably supported.

[0010] Further, the electronic component mechanism includes voltage stabilizers, a plurality of voltage stabilizer terminals are fixedly connected to the top ends of the two voltage stabilizers, conductors are fixedly arranged on the two sides of the top end of the top plate, two connection ports are fixedly arranged on one side of the two conductors, connection terminals are fixedly connected to the upper end faces of the connection ports, and secondary circuit control chips are arranged on one side of the connection ports

[0011] A plurality of circuit control chips are arranged on one side of the secondary circuit control chips, and a plurality of transmission circuit lines are fixedly connected to the outer walls of the circuit control chips and the secondary circuit control chips.

[0012] S2: check the pads on the top plate to ensure that they are not damaged, determine the correct position and direction according to the circuit diagram or layout diagram, place the voltage stabilizers, conductors, circuit control chips, secondary circuit control chips and connection ports on the top plate in turn using tweezers or a solder sucker, ensure that the components are aligned with the pads, heat the soldering station to a suitable working temperature, heat the pads using soldering tin to fully melt them, apply an appropriate amount of soldering wire to the pads to fully cover them, wait for the soldering points to cool down and form a firm soldering connection, so that the electronic component mechanism can be fixed to the top plate.

[0013] Through the technical scheme, when the circuit pattern of the printed circuit board is corroded, the electronic components can be operated to prevent the printed circuit board from being damaged and the equipment from being unable to operate.

[0014] Further, the conducting mechanism comprises transmission terminals, one side of a plurality of the transmission terminals is fixedly connected with transmission rods, one side of a plurality of the transmission rods is fixedly connected with a transmission block, both sides of the top end of the transmission block are fixedly connected with second transmission lines, and the center positions of the transmission block are fixedly connected with a plurality of first transmission lines, one end of a plurality of the second transmission lines away from the transmission block is fixedly connected with an analyzer, and one end of a plurality of the first transmission lines away from the transmission block is fixedly connected with fixed terminals.

[0015] S3: The transmission terminals and the transmission block are welded on the top plate, and then the first transmission lines and the second transmission lines are welded on the transmission block, the analyzer and the fixed terminals in sequence, so that the current information can be transmitted, the first transmission lines are connected with the fixed terminals at the other end, and the second transmission lines are connected with the analyzer at one end, so that the transmission block and the analyzer and the fixed terminals exchange information and realize the transmission function.

[0016] Through the technical scheme, the current information can be transmitted.

[0017] Further, the line fixing mechanism comprises third fixing rods, one side of two third fixing rods is fixedly connected with extension blocks, and a connecting rod is fixedly connected between two extension blocks and two third fixing rods, a buckle is penetrated in one side of the connecting rod, and a second transmission line is clamped on the inner wall of a plurality of the buckles.

[0018] S4: The two third fixing rods are fixed on the top plate by bolts, the two connecting rods are fixed on the extension blocks and the third fixing rods by welding, and the second transmission lines are fixed by the buckles on the connecting rods, so that the device can stabilize the lines.

[0019] Through the technical scheme, the lines can be fixed and will not be scattered.

[0020] Further, the temperature detection mechanism comprises a probe fixing frame, one side of the probe fixing frame is fixedly connected with a horizontal rod, a plurality of temperature probes are fixedly connected at the bottom end of the horizontal rod, and an analysis transmitter is fixedly connected at the bottom end of the probe fixing frame.

[0021] S5: The probe fixing frame is installed on the analysis transmitter, and a plurality of temperature probes are installed on the probe fixing frame in sequence, when the running temperature of the circuit board is detected by the temperature probes, the information is transmitted to the analysis transmitter through the connecting lines of the analysis transmitter for analysis and judgment.

[0022] Through the technical scheme, the device can detect the running temperature of the circuit board.

[0023] Further, the heat dissipation mechanism comprises a bottom plate, a plurality of fan openings are fixedly connected to the bottom end of the bottom plate, heat dissipation fans are rotatably connected to the inner side walls of the plurality of fan openings, a plurality of heat conduction terminals are fixedly connected to the inner top end face of the bottom plate, and heat conduction coils are fixedly connected to the bottom ends of the plurality of heat conduction terminals.

[0024] S6: The bottom plate is fixed to the heat conduction layer by welding, the inside of the fan opening connected to the bottom plate is connected to a power line, a plurality of power lines are electrically connected to the heat dissipation fans respectively, and the heat conduction coils and the heat conduction terminals are bolted to the bottom plate and the heat conduction layer respectively, so that heat can be conducted.

[0025] Through the technical scheme, the device can dissipate the temperature of the circuit board.

[0026] Working principle: The device can transfer the heat of the circuit board through the heat-permeable layer and the heat conduction layer by setting the top plate, the heat-permeable layer and the heat conduction layer, check the solder pads and pins on the top plate to ensure that they are not damaged or bent, determine the correct position and direction according to the circuit diagram or layout diagram, place the voltage stabilizer, the conductor, the circuit control chip, the secondary circuit control chip and the connection port on the top plate in turn using tweezers or a solder sucker, fix the electronic component mechanism to the top plate, make the circuit board transmit information through the electronic component mechanism, weld the transmission terminal and the transmission block on the top plate, and then weld the first transmission line and the second transmission line on the transmission block, the analyzer and the fixed terminal, so that the current information can be transmitted, fix the two third fixed rods on the top plate, fix the two connecting rods on the extension block and the third fixed rod respectively by welding, fix the second transmission line through the buckle on the connecting rod,

[0027] The device can stabilize the circuit, the probe fixing frame is installed on the analysis transmitter, a plurality of temperature probes are installed on the probe fixing frame in turn, when the running temperature of the circuit board is detected by the temperature probes, the information is transmitted to the analysis transmitter through the connecting line of the analysis transmitter, is analyzed and judged, the bottom plate is fixed to the heat conduction layer by welding, the inside of the fan opening connected to the bottom plate is connected to a power line, a plurality of power lines are electrically connected to the heat dissipation fans respectively, and the heat conduction coils and the heat conduction terminals are bolted to the bottom plate and the heat conduction layer respectively, so that heat can be conducted.

[0028] The application provides a composite printed circuit board and a manufacturing method thereof.

[0029] 1. The application provides a composite printed circuit board and a manufacturing method thereof, which can be used by simple lapping of components when the circuit board is corroded and damaged, thereby preventing the machine from being unable to operate and affecting work.

[0030] 2. The application provides a composite printed circuit board and a manufacturing method thereof, which can fix the internal circuit of the circuit board,

[0031] and prevent the circuit board from being affected by the disorder of the circuit.

[0032] 3. The application provides a composite printed circuit board and a manufacturing method thereof, which can detect the heat generated by the circuit board and dissipate the heat in time. BRIEF DESCRIPTION OF DRAWINGS

[0033] Fig. 1 is a perspective structural schematic of the composite printed circuit board of the application;

[0034] Fig. 2 is a multi-angle perspective structural schematic of the composite printed circuit board of the application;

[0035] Fig. 3 is a structural schematic of the conduction mechanism and the circuit fixing mechanism of the composite printed circuit board of the application;

[0036] Fig. 4 is a structural schematic of the bottom of the composite printed circuit board of the application;

[0037] Fig. 5 is a structural schematic of the heat dissipation mechanism of the composite printed circuit board of the application;

[0038] Fig. 6 is a structural schematic of the top plate of the composite printed circuit board of the application.

[0039] In the drawings:

[0040] 1, board body supporting mechanism; 101, top plate; 102, heat-permeable layer; 103, heat-conducting layer; 104, first fixing rod; 105, supporting rod; 106, second fixing rod; 2, electronic component mechanism; 201, voltage stabilizer;

[0041] 202, voltage stabilizer terminal; 203, conductor; 204, circuit control chip; 205, secondary circuit control chip;

[0042] 206, connection port; 207, connection terminal; 208, transmission circuit line; 3, transmission mechanism; 301, transmission terminal; 302, transmission rod; 303, transmission block; 304, first transmission line; 305, fixed terminal; 306, second transmission line; 307, analyzer; 4, line fixing mechanism; 401, third fixing rod; 402, extension block; 403, connecting rod; 404, buckle; 5, temperature detection mechanism; 501, probe fixing frame; 502, cross rod; 503, temperature probe; 504, analysis transmitter; 6, heat dissipation mechanism; 601, bottom plate; 602, fan opening; 603, heat dissipation fan; 604, heat conduction terminal; 605, heat conduction coil. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without any creative work fall within the protection scope of the present application. In the description of the present application, it should be noted that the terms used herein are only used to describe the specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. In order to facilitate the description, the sizes of the parts shown in the drawings are not drawn according to the actual proportional relationship. The known technologies, methods and devices for those of ordinary skill in the related art can not be discussed in detail, but should be considered as part of the authorized description. In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, and not as a limitation. Therefore, other examples of the exemplary embodiments can have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0044] Embodiment 1

[0045] As shown in Figures 1-6, the embodiment of the present application provides a composite printed circuit board and a manufacturing method thereof, comprising a board body supporting mechanism 1, the board body supporting mechanism 1 comprises a top plate 101, the bottom end of the top plate 101 is fixedly connected with a heat-permeable layer 102, the bottom end of the heat-permeable layer 102 is fixedly connected with a heat-conducting layer 103, the outer side wall of the top plate 101 is fixedly connected with a plurality of first fixing rods 104 and second fixing rods 106 through bolts, a support rod 105 is fixedly connected between each first fixing rod 104 and second fixing rod 106 at the four corners of the top plate 101, an electronic component mechanism 2 is fixedly connected to the top end of the top plate 101, a conduction mechanism 3 is arranged on the side of the top end of the top plate 101 away from the electronic component mechanism 2, a circuit fixing mechanism 4 is arranged on the side of the top end of the top plate 101 away from the conduction mechanism 3, a temperature detection mechanism 5 is arranged on the outer side wall of the top plate 101, and a heat dissipation mechanism 6 is arranged on the bottom end of the top plate 101.

[0046] The manufacturing step S1: the top plate 101, the heat-permeable layer 102 and the heat-conducting layer 103 are cut into production sizes, the surfaces of the top plate 101, the heat-permeable layer 102 and the heat-conducting layer 103 are cleaned respectively using a brush to remove surface contaminants, the heat-permeable layer 102 and the heat-conducting layer 103 are glued in turn on the top plate 101, a dry film is pasted on the surface of the top plate 101 to prepare for subsequent image transfer, and the top plate 101 is exposed to ultraviolet light using an exposure device,

[0047] so as to transfer the image of the top plate 101 to the dry film, and the top plate 101 after exposure is subjected to development, etching and film removal, thereby completing the manufacturing of the inner layer board.

[0048] Embodiment 2:

[0049] As shown in Figures 1-6, the electronic component mechanism 2 comprises a voltage stabilizer 201, a plurality of voltage stabilizer terminals 202 are fixedly connected to the top end of the two voltage stabilizers 201, a plurality of conductors 203 are arranged on the side of the top end of the top plate 101 away from the voltage stabilizer 201, the conductors 203 are fixedly arranged on the two sides of the top end of the top plate 101, two connection ports 206 are fixedly arranged on one side of the two conductors 203 on the two sides, and a secondary circuit control chip 205 is arranged on one side of each connection port 206, a circuit control chip 204 is arranged on one side of a plurality of secondary circuit control chips 205, and a plurality of transmission circuit lines 208 are fixedly connected to the outer walls of the circuit control chip 204 and the secondary circuit control chip 205.

[0050]

[0051] ​The manufacturing step S2 is to check the pads on the top plate 101 to ensure that they are not damaged or bent, determine the correct position and direction according to the circuit diagram or layout, and place the voltage stabilizer 201, the conductor 203, the circuit control chip 204, the secondary circuit control chip 205 and the connection port 206 on the top plate 101 in sequence using tweezers or a solder sucker, ensure that the components are aligned with the pads, heat the soldering table to the appropriate working temperature, use soldering tin to heat the pads to fully melt, apply an appropriate amount of soldering wire on the pads and pins to fully cover the pads and pins, wait for the soldering points to cool down and form a solid soldering connection, so that the electronic component mechanism 2 is fixed with the top plate 101.

[0052] Embodiment 3:

[0053] As shown in FIGS. 1-6, the transmission mechanism 3 includes a plurality of transmission terminals 301, one side of the plurality of transmission terminals 301 is fixedly connected with a transmission rod 302, one side of the plurality of transmission rods 302 is fixedly connected with a transmission block 303, both sides of the top end of the transmission block 303 are fixedly connected with a second transmission line 306, and the center position of the transmission block 303 is fixedly connected with a plurality of first transmission lines 304, one end of the plurality of second transmission lines 306 away from the transmission block 303 is fixedly connected with an analyzer 307, and one end of the plurality of first transmission lines 304 away from the transmission block 303 is fixedly connected with a fixed terminal 305.

[0054] The manufacturing step 3 is to heat the pads and pins with soldering tin to fully melt, apply an appropriate amount of soldering wire on the pads and pins to fully cover the pads and pins, wait for the soldering points to cool down and form a solid soldering connection, weld the transmission terminals 301 and the transmission block 303 on the top plate 101, and then weld the first transmission lines 304 and the second transmission lines 306 on the transmission block 303, the analyzer 307 and the fixed terminal 305 in sequence, so that the current information can be transmitted, the first transmission lines 304 are connected with the fixed terminal 305 at the other end by connecting the first transmission lines 304 and the second transmission lines 306 at the top end of the transmission block 303, and the second transmission lines 306 are connected with the analyzer 307 at one end, so that the information exchange between the transmission block 303 and the analyzer 307 and the fixed terminal 305 realizes the transmission function.

[0055] The second transmission lines 306 are connected with the analyzer 307 at one end.

[0056]

[0057] Embodiment

[0058] ​​As shown in Figures 1-6, the line fixing mechanism 4 includes a third fixing rod 401, one side of each of the two third fixing rods 401 is fixedly connected with an extension block 402, a connecting rod 403 is fixedly connected between each of the two extension blocks 402 and the two third fixing rods 401, a buckle 404 penetrates through one side of the connecting rod 403, and the inner wall of each of the plurality of buckles 404 is clamped with a second transmission line 306;

[0059] Step 4: Fix the two third fixing rods 401 on the top plate 101 by bolts, and fix the two connecting rods 403 on the extension block 402 and the third fixing rod 401 by welding, and fix the second transmission line 306 through the buckle 404 on the connecting rod 403, so that the device can be fixed to the line; Embodiment

[0060] As shown in Figures 1-6, the temperature detection mechanism 5 includes a probe fixing frame 501, one side of the probe fixing frame 501 is fixedly connected with a cross bar 502, the bottom end of the cross bar 502 is fixedly connected with a plurality of temperature probes 503, and the bottom end of the probe fixing frame 501 is fixedly connected with an analysis transmitter 504;

[0061] Step 5: Install the probe fixing frame 501 on the analysis transmitter 504, and install the plurality of temperature probes 503 on the probe fixing frame 501 in sequence, when detecting the operating temperature of the circuit board through the temperature probe 503, the information is transmitted to the analysis transmitter 504 through the connecting line of the analysis transmitter 504, and is analyzed and judged.

[0062] Embodiment 6:

[0063] As shown in Figures 1-6, the heat dissipation mechanism 6 includes a bottom plate 601, the bottom end of the bottom plate 601 is fixedly connected with a plurality of fan openings 602, the inner side wall of each of the plurality of fan openings 602 is rotatably connected with a heat dissipation fan 603, the inner top end face of the bottom plate 601 is fixedly connected with a plurality of heat dissipation terminals 604, and the bottom end of each of the plurality of heat dissipation terminals 604 is fixedly connected with a heat dissipation coil pipe 605;

[0064] Step 6: Fix the bottom plate 601 on the heat dissipation layer 103 by welding, connect the power lines inside the fan openings 602 on the bottom plate 601, electrically connect the plurality of power lines with the heat dissipation fans 603 respectively, and bolt the heat dissipation coil pipes 605 and the heat dissipation terminals 604 to the bottom plate 601 and the heat dissipation layer 103 respectively,

[0065] so that heat can be conducted.

[0066] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary and that changes in form and detail can be made without departing from the principles and spirit of the application. The scope of the application is therefore defined by the following claims in addition to their equivalents.

Claims

1. A composite printed circuit board, comprising a board support mechanism (1), characterized in that: The plate support mechanism (1) comprises a top plate (101), the bottom end of the top plate (101) is fixedly connected to a heat-transmitting layer (102), the bottom end of the heat-transmitting layer (102) is fixedly connected to a heat-conducting layer (103), and the outer wall of the top plate (101) is fixedly connected to a plurality of first fixing rods (104) and second fixing rods (106) by bolts. A support rod (105) is fixedly connected between each first fixing rod (104) and the second fixing rod (106) at the four corners of the top plate (101), the top of the top plate (101) is fixedly connected to an electronic component mechanism (2), and a conduction mechanism (3) is provided on the side of the top of the top plate (101) away from the electronic component mechanism (2), a line fixing mechanism (4) is provided on the side of the top of the top plate (101) away from the conduction mechanism (3), a temperature detection mechanism (5) is provided on the outer wall of the top plate (101), and a heat dissipation mechanism (6) is provided on the bottom of the top plate (101), the electronic component mechanism (2) includes a voltage stabilizer (201), the tops of two voltage stabilizers (201) are fixedly connected to a plurality of voltage stabilizing terminals (202), and the top plate (101) The top of the two voltage regulators (201) is located on both sides of which conductors (203) are fixedly provided. Two connection ports (206) are fixedly provided on one side of the two conductors (203) on both sides. The upper end surfaces of the connection ports (206) are fixedly connected to connection terminals (207). A sub-circuit control chip (205) is provided on one side of the connection ports (206). A circuit control chip (204) is provided on one side of the plurality of sub-circuit control chips (205). The circuit control chip (204) and the sub-circuit control chip (205) are fixedly provided on one side of the two voltage regulators (201). The outer wall is fixedly connected with a plurality of transmission circuit lines (208), the conduction mechanism (3) includes a transmission terminal (301), one side of the plurality of transmission terminals (301) is fixedly connected with a transmission rod (302), one side of the plurality of transmission rods (302) is fixedly connected with a transmission block (303), both sides of the top of the transmission block (303) are fixedly connected with a second transmission line (306), and the center position of the transmission block (303) is fixedly connected with a plurality of first transmission lines (304), one end of the plurality of second transmission lines (306) away from the transmission block (303) is fixedly connected with an analyzer (307), and one end of the plurality of first transmission lines (304) away from the transmission block (303) is fixedly connected with a fixed terminal (305).

2. The composite printed circuit board according to claim 1, characterized in that: The line fixing mechanism (4) comprises a third fixing rod (401), one side of each of the two third fixing rods (401) is fixedly connected to an extension block (402), a connecting rod (403) is fixedly connected between the two extension blocks (402) and the two third fixing rods (401), one side of each of the connecting rods (403) is penetrated by a buckle (404), and the inner walls of the plurality of buckles (404) are clamped with a second transmission line (306).

3. The composite printed circuit board according to claim 1, characterized in that: The temperature detection mechanism (5) comprises a probe fixing frame (501), one side of the probe fixing frame (501) is fixedly connected to a cross bar (502), the bottom end of the cross bar (502) is fixedly connected to a plurality of temperature probes (503), and the bottom end of the probe fixing frame (501) is fixedly connected to an analysis transmitter (504).

4. The composite printed circuit board according to claim 1, characterized in that: The heat dissipation mechanism (6) comprises a base plate (601), the bottom end of the base plate (601) is fixedly connected to a plurality of fan ports (602), the inner side walls of the plurality of fan ports (602) are rotatably connected to heat dissipation fans (603), and the inner top surface of the base plate (601) is fixedly connected to a plurality of heat-conducting terminals (604), and the bottom ends of the plurality of heat-conducting terminals (604) are fixedly connected to heat-conducting coils (605).

5. A method for manufacturing a composite printed circuit board, characterized in that: The manufacturing method of the composite printed circuit board is implemented by the composite printed circuit board according to claim 1, and the manufacturing method steps are: S1: cutting the top plate (101), the heat-transmitting layer (102) and the heat-conducting layer (103) into production sizes, cleaning the surfaces of the top plate (101), the heat-transmitting layer (102) and the heat-conducting layer (103) with brushes to remove surface contaminants, gluing the heat-transmitting layer (102) and the heat-conducting layer (103) to the top plate (101) in sequence, and then attaching a dry film to the surface of the top plate (101) in preparation for subsequent image transfer, using an exposure device to expose the top plate (101) with ultraviolet light, thereby transferring the image of the top plate (101) to the dry film, developing, etching, and removing the film on the exposed top plate (101), and thus completing the production of the inner layer board; S2: Check the pads on the top plate (101) to ensure that they are not damaged, determine the correct position and direction according to the circuit diagram or layout diagram, and place the regulator (201), the conductor (203), the circuit control chip (204), the sub-circuit control chip (205) and the connection port (206) on the top plate (101) in sequence using tweezers or a solder sucker, ensuring that the components are aligned with the pads, heat the soldering station to reach the appropriate working temperature, use solder to heat the pads to fully melt them, apply an appropriate amount of solder wire on the pads to fully cover the pads, wait for the soldering points to cool, and form a solid solder connection so that the electronic component mechanism (2) can be fixed to the top plate (101); S3: Welding the transmission terminal (301) and the transmission block (303) to the top plate (101), and then sequentially welding the first transmission line (304) and the second transmission line (306) to the transmission block (303), the analyzer (307) and the fixed terminal (305), so that current information can be transmitted. By connecting the first transmission line (304) and the second transmission line (306) at the top of the transmission block (303), the other end of the first transmission line (304) is connected to the fixed terminal (305), and one end of the second transmission line (306) is connected to the analyzer (307), so that the information exchange between the transmission block (303), the analyzer (307) and the fixed terminal (305) can realize the transmission function; S4: Fix the two third fixing rods (401) to the top plate (101) by bolts, fix the two connecting rods (403) to the extension block (402) and the third fixing rod (401) respectively by welding, and fix the second transmission line (306) by the buckle (404) on the connecting rod (403), so that the device can stabilize the line; S5: Installing the probe holder (501) on the analysis transmitter (504), and sequentially installing a plurality of temperature probes (503) on the probe holder (501), and detecting the operating temperature of the circuit board through the temperature probe (503), transmitting the information to the analysis transmitter (504) through the connection line of the analysis transmitter (504) for analysis and evaluation; S6: Fix the bottom plate (601) to the heat conducting layer (103) by welding, connect the fan port (602) connected to the bottom plate (601) to the inside of the power line, and connect multiple power lines to the cooling fan (603) respectively. Electrical connection is performed, and the heat-conducting coil (605) and the heat-conducting terminal (604) are bolted to the bottom plate (601) and the heat-conducting layer (103) respectively, so that heat can be conducted.

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