Vertical power supply device and process method of connecting plate

Abstract

The invention provides a vertical power supply device and a process method of a connecting plate. The vertical power supply device comprises a system board, a substrate, a chip unit, a plurality of first capacitors, a plurality of second capacitors, a plurality of conductive parts and a power supply module, the system board comprises a first surface and a second surface, the first surface and the second surface are oppositely arranged, the substrate comprises a third surface and a fourth surface, and the third surface and the fourth surface are oppositely arranged. The third surface of the substrate is located between the fourth surface and the second surface of the system board, the chip unit is arranged on the first surface, the plurality of first capacitors are arranged on the second surface, the plurality of second capacitors are arranged on the third surface, the third surface and the second surface are electrically connected through a plurality of conductive parts, and the power supply module is arranged on the fourth surface.

Description

Technical Field

[0001] The invention relates to a power supply device, and in particular to a process method for a vertical power supply device and a connecting plate. Background Art

[0002] In recent years, with the rapid development of artificial intelligence, it has played an increasingly critical role in large data centers, smart phones, various industrial robots, and autonomous driving. The core technology of artificial intelligence is data processing, and the key to the intelligence of data processing lies in various intelligent processor chips, such as central processing units (CPU), graphics processing units (GPU), field programmable gate arrays (FPGA), and large-scale customized processors (ASIC). In order to provide a stable voltage to the processor chip to maximize its performance, the steady-state and dynamic performance of the power supply device of the processor chip is very important.

[0003] For the power supply device of the processor chip, the connection impedance between the power module in the power supply device and the processor chip is relatively large, which directly affects the power supply performance of the power module to the processor chip, causing the performance of the processor chip to decline, thereby reducing the power supply performance of the overall power supply device. At present, the power supply device can use a vertical power supply method to effectively reduce the transmission impedance from the power module to the processor chip.

[0004] In order to improve the efficiency of the vertical power supply device supplying power to the processor chip, the power module and the processor chip are located on opposite sides of the substrate. However, due to the size of the processor chip, the number of output capacitors of the power supply device arranged per unit area is limited, which is not conducive to the dynamic performance of the power supply. The following program is the calculation formula for the voltage waveform when the output voltage is transient,

[0005]

[0006] When the number of output capacitors in parallel increases, the equivalent series resistance (ESR) and equivalent series inductance (ESL) decrease. From the above calculation formula, it can be seen that when the equivalent series resistance and equivalent series inductance decrease and the output capacitance increases, the output voltage drop during the transient state can be reduced. Conversely, when the output capacitance decreases, the output voltage drop during the transient state increases. Therefore, it can be seen that the number of output capacitors directly affects the efficiency of the overall vertical power supply device.

[0007] See also Figure 1, which is a structural schematic diagram of a traditional vertical power supply device. As shown in the figure, the traditional vertical power supply device 1' includes a system board 2', a substrate 3', a power module 4' and a chip 5'. The substrate 3' is arranged on the first surface of the system board 2', and includes a plurality of output capacitors 31', which are embedded in the substrate 3'. The power module 4' is arranged on the substrate 3', and the substrate 3' is located between the power module 4' and the system board 2', wherein the substrate 3' is used to transmit signals and power between the power module 4' and the system board 2'. The chip 5' is arranged on the second surface of the system board 2'. Since the traditional vertical power supply device 1' has a large demand for output capacitors 31', the number of output capacitors 31' in the substrate 3' is large, which makes the area of ​​the substrate 3' larger and easy to warp, which has a greater impact on the process. In addition, since the output capacitor 31' needs to be embedded in the substrate 3', the performance requirements for the output capacitor 31' are high, such as the need for a capacitor that is suitable for embedding and has a high withstand voltage and capacitance. In addition, the conventional vertical power supply device 1' will inevitably experience temperature cycles and humidity during use, and the substrate 3' and the output capacitor 31' embedded therein have different thermal expansion coefficients and equivalent expansion coefficients, resulting in higher mismatch stress. In addition, due to the manufacturing process of the substrate 3', the output capacitor 31' embedded in the substrate 3' can only be arranged on a two-dimensional plane, and due to the embedded process of the circuit board, the gaps between multiple output capacitors 31' will be relatively large. Therefore, the number of output capacitors 31' that can be embedded in the substrate 3' in a limited space will be greatly affected, which is not conducive to increasing the total capacitance of the output capacitor 31'.

[0008] Therefore, how to develop a vertical power supply device and a process method for connecting plates that overcome the above-mentioned shortcomings is an urgent need at present. Summary of the invention

[0009] The purpose of the present invention is to provide a vertical power supply device, wherein a plurality of first capacitors are arranged on the second surface of the system board, a plurality of second capacitors are arranged on the third surface of the substrate, and / or a plurality of third capacitors are arranged on the side walls of the corresponding conductive parts, which means that the capacitors of the vertical power supply device of the present invention are not embedded in the substrate, but are arranged on the surface of the substrate, and in addition to the capacitors arranged on the surface of the substrate, capacitors are also arranged on the surface of the system board and / or the side walls of the conductive parts. Therefore, the first capacitors and the second capacitors of the vertical power supply device of the present invention do not need to be embedded in the substrate, so the material selection range is wide and the cost is low. Furthermore, since the first capacitors and the second capacitors are respectively arranged on the surfaces of the substrate and the system board, the capacitors of the vertical power supply device of the present invention can be arranged on a three-dimensional solid surface, thereby increasing the number of capacitors arranged and achieving the effect of increasing the total capacitance of the output capacitors, thereby providing a stable working voltage for the chip unit.

[0010] To achieve the above-mentioned purpose, one embodiment of the present invention is to provide a vertical power supply device, including a system board, a substrate, a chip unit, a plurality of first capacitors, a plurality of second capacitors, a plurality of conductive parts and a power module. The system board includes a first surface and a second surface, and the first surface and the second surface are arranged relative to each other. The substrate includes a third surface and a fourth surface, and the third surface and the fourth surface are arranged relative to each other, and the third surface of the substrate is located between the fourth surface and the second surface of the system board. The chip unit is arranged on the first surface. A plurality of first capacitors are arranged on the second surface. A plurality of second capacitors are arranged on the third surface. The third surface and the second surface are electrically connected through a plurality of conductive parts. The power module is arranged on the fourth surface.

[0011] To achieve the above-mentioned purpose, another embodiment of the present invention is to provide a vertical power supply device, including a system board, a substrate, a chip unit, a plurality of first capacitors, a plurality of connecting plates, a plurality of third capacitors and a power module. The system board includes a first surface and a second surface, and the first surface and the second surface are arranged oppositely. The substrate includes a third surface and a fourth surface, and the third surface and the fourth surface are arranged oppositely, and the third surface of the substrate is located between the fourth surface and the second surface of the system board. The chip unit is arranged on the first surface. A plurality of first capacitors are arranged on the second surface. Each connecting plate includes a first end, a second end and a side wall, and the first end and the second end are arranged oppositely, the first end is electrically connected to the second surface of the system board, and the second end is electrically connected to the third surface of the substrate, and the side wall is arranged around and located between the first end and the second end. A plurality of third capacitors are arranged on the side wall of the connecting plate. The power module is arranged on the fourth surface.

[0012] To achieve the above-mentioned purpose, another embodiment of the present invention is to provide a process method for a connecting plate, which is applied to a vertical power supply device, wherein the process method includes the following steps. First, a circuit board is provided, and the upper and lower surfaces of the circuit board are covered with a metal layer. Then, holes are drilled on the circuit board to form a plurality of through holes. Then, electroplating is performed on the circuit board, and a first electroplating layer is formed on an upper surface, a lower surface and a plurality of through holes of the circuit board. Then, a graphic layer is formed on the upper and lower surfaces of the circuit board, wherein the graphic layer located on the upper surface and the graphic layer located on the lower surface are connected through a plurality of through holes. Then, a plurality of pads are formed on the circuit board, and a second electroplating layer is formed on the upper and lower surfaces of the circuit board, wherein a plurality of pads are located at positions corresponding to the graphic layer. Then, a third capacitor is set on the pads corresponding to the upper and lower surfaces of the circuit board. Then, the circuit board is cut according to the positions of the plurality of through holes to form at least one connecting plate, so that the electroplating surface in the plurality of through holes is at least partially exposed to one end of at least one connecting plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of a traditional vertical power supply device;

[0014] Figure 2 It is a schematic cross-sectional structure diagram of a vertical power supply device according to a first embodiment of the present invention;

[0015] Figure 3 for Figure 2 An exploded structural diagram of the vertical power supply device shown;

[0016] Figure 4A for Figure 2 A schematic diagram of component arrangement on a third surface of a substrate of a vertical power supply device shown;

[0017] Figure 4B for Figure 2 A schematic diagram of component arrangement of another embodiment of a vertical power supply device on a third surface of a substrate is shown;

[0018] Figure 5A is a schematic cross-sectional structural diagram of a vertical power supply device according to a second embodiment of the present invention;

[0019] Figure 5B is a schematic cross-sectional structural diagram of a vertical power supply device according to a third embodiment of the present invention;

[0020] Figure 6 is a schematic cross-sectional structural diagram of a vertical power supply device according to a fourth embodiment of the present invention;

[0021] Figure 7 is a schematic cross-sectional structural diagram of a vertical power supply device according to a fifth embodiment of the present invention;

[0022] Figure 8 for Figure 7 An exploded structural diagram of the vertical power supply device shown;

[0023] Fig. 9 is a schematic cross-sectional structural diagram of a vertical power supply device according to a sixth embodiment of the present invention; and

[0024] Figures 10 to 17B for Figure 8 The structural schematic diagram of the process method of the connecting plate and the third capacitor of the vertical power supply device is shown.

[0025] The reference numerals are as follows:

[0026] 1': Traditional vertical power supply device

[0027] 2': System board

[0028] 3': substrate

[0029] 31': Output capacitor

[0030] 4': Power module

[0031] 5': Chip

[0032] 1, 1a, 1b, 1c, 1d, 1e: Vertical power supply device

[0033] 2: System board

[0034] 21: First Surface

[0035] 22: Second Surface

[0036] 3: Substrate

[0037] 31: The third surface

[0038] 32: The Fourth Surface

[0039] 33: First pin

[0040] 34: Second pin

[0041] 35: First conductive structure

[0042] 36: Groove

[0043] 37: Second conductive structure

[0044] 38: Connect the leads

[0045] 4: Chip unit

[0046] 51: First capacitor

[0047] 52: Second capacitor

[0048] 53: The third capacitor

[0049] 6: Conductive part

[0050] 61: First End

[0051] 62: Second End

[0052] 63: Sidewall

[0053] 7: Power module

[0054] 81: Copper Clad Laminate

[0055] 82: Prepreg

[0056] 83: Circuit Board

[0057] 84: Through hole

[0058] 85: First electroplating layer

[0059] 86: Graphics layer

[0060] 87: Pad

[0061] 89: Second electroplating layer DETAILED DESCRIPTION

[0062] Some typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be varied in various ways without departing from the scope of the present invention, and the description and drawings are essentially for illustrative purposes rather than for limiting the present invention.

[0063] See also Figure 2 and Figure 3 ,in Figure 2 is a schematic cross-sectional structural diagram of a vertical power supply device according to a first embodiment of the present invention, Figure 3 for Figure 2 The exploded structural diagram of the vertical power supply device is shown in FIG. Figure 2 and Figure 3 As shown, the vertical power supply device 1 of the present embodiment includes a system board 2, a substrate 3, a chip unit 4, a plurality of first capacitors 51, a plurality of second capacitors 52, a plurality of conductive parts 6 and a power module 7. The system board 2 includes a first surface 21 and a second surface 22, and the first surface 21 and the second surface 22 are arranged opposite to each other. The substrate 3 includes a third surface 31 and a fourth surface 32, and the third surface 31 and the fourth surface 32 are arranged opposite to each other, wherein the third surface 31 of the substrate 3 is located between the fourth surface 32 and the second surface 22 of the system board 2. The chip unit 4 can be, but is not limited to, a central processing unit, a graphics processing unit, a tensor processing unit (TPU) or a neural network processing unit (NPU), and the chip unit 4 is arranged on the first surface 21 of the system board 2.

[0064] A plurality of first capacitors 51 may be output capacitors and are disposed on the second surface 22 of the system board 2, wherein the first capacitors 51 may be selected to have suitable frequency characteristics according to the operating frequency of the chip unit 4, and the first capacitors 51 have filtering and energy storage functions, and can simultaneously remove the high-frequency noise of the vertical power supply device 1 to provide clean current for the chip unit 4, wherein the first capacitors 51 can further provide supplementary current when the chip unit 4 switches between different working states to reduce voltage drop and stabilize the operation of the chip unit 4. A plurality of second capacitors 52 are disposed on the third surface 31 of the substrate 3, wherein the second capacitors 52 have filtering and energy storage functions, and can stabilize the operation of the chip unit 4. Each conductive portion 6 is a conductive column and is disposed between the second surface 22 of the system board 2 and the third surface 31 of the substrate 3, so that the second surface 22 of the system board 2 and the third surface 31 of the substrate 3 are electrically connected through the conductive portion 6. The power module 7 is disposed on the fourth surface 32 of the substrate 3.

[0065] As can be seen from the above, the present invention provides a vertical power supply device 1, wherein a plurality of first capacitors 51 of the vertical power supply device 1 are arranged on the second surface 22 of the system board 2, and a plurality of second capacitors 52 are arranged on the third surface 31 of the substrate 3, which means that the capacitors of the vertical power supply device 1 of the present invention are not embedded in the substrate 3, but are arranged on the surface of the substrate 3, and in addition to the capacitors arranged on the surface of the substrate 3, capacitors are also arranged on the surface of the system board 2. Therefore, compared with the traditional vertical power supply device in which the output capacitors are embedded in the substrate, the first capacitors 51 and the second capacitors 52 of the vertical power supply device 1 of the present invention do not need to be embedded in the substrate 3, so the material selection range is wide and the cost is low. Furthermore, since the first capacitors 51 and the second capacitors 52 are respectively arranged on the surfaces of the substrate 3 and the system board 2, the capacitors of the vertical power supply device 1 of the present invention can be arranged on a three-dimensional solid surface, thereby increasing the number of capacitors arranged, and achieving the effect of increasing the total capacitance of the output capacitors, thereby providing a stable working voltage for the chip unit 4.

[0066] Please continue reading Figure 2 In order to increase the number of capacitors set per unit area, in this embodiment, each second capacitor 52 is located between the corresponding first capacitor 51 and the third surface 31 of the substrate 3, and each first capacitor 51 is located between the corresponding second capacitor 52 and the second surface 22 of the system board 2.

[0067] Please continue reading Figure 2 The substrate 3 further includes a plurality of first pins 33, a plurality of second pins 34 and a plurality of first conductive structures 35. The plurality of first pins 33 are located on the third surface 31 of the substrate 3, wherein each second capacitor 52 and each conductive portion 6 are respectively disposed on the corresponding first pin 33 and are electrically connected to the corresponding first pin 33. The plurality of second pins 34 are located on the fourth surface 32 of the substrate 3, wherein each power module 7 is disposed on the corresponding second pin 34, and the output end of each power module 7 is electrically connected to the corresponding second pin 34. The first pin 33 is electrically connected to the corresponding second pin 34 through the first conductive structure 35, wherein the first conductive structure 35 may include a via or a blind hole, such as Figure 2 As shown, the conductive structure 35 of this embodiment is a via. In addition, in another embodiment, when the first conductive structure is a blind hole, a conductive layer (not shown) can be provided in the substrate 3, and the first pin 33 and the corresponding second pin 34 are electrically connected to the conductive layer respectively by using the first conductive structure in the form of a blind hole, so as to achieve the purpose of electrically connecting the first pin 33 and the corresponding second pin 34, so that the second capacitor 52 provided on the first pin 33 and the output end of the power module 7 provided on the corresponding second pin 34 can be electrically connected through the first conductive structure 35.

[0068] See also Figure 4A And cooperate Figure 2 and Figure 3 ,in Figure 4A for Figure 2 Schematic diagram of component arrangement on the third surface of the substrate of the vertical power supply device shown in FIG. Figure 3 As shown, a plurality of conductive parts 6 are arranged to form a plurality of first arrangement columns, a plurality of first capacitors 51 are arranged to form a plurality of second arrangement columns, and a plurality of second capacitors 52 are arranged to form a plurality of third arrangement columns, wherein each second arrangement column and each third arrangement column are arranged adjacent to each other in the height direction and are located between two first arrangement columns in the horizontal direction. Of course, in some embodiments, a plurality of second arrangement columns and a plurality of third arrangement columns may be included between two first arrangement columns, that is, the arrangement of the first arrangement columns, the second arrangement columns, and the third arrangement columns is not limited. For example Figure 4A As shown, since the conductive portion 6 is disposed on the corresponding first pin 33, Figure 3 The first pins 33 in the circuit also form a plurality of first arrangement columns, which are arranged alternately with the plurality of third arrangement columns formed by the plurality of second capacitors 52. Of course, a plurality of third arrangement columns may also be arranged between two first arrangement columns, and the arrangement of the first arrangement columns and the third arrangement columns is not limited to this. It should be noted that the conductive portion 6, the first capacitor 51 and the second capacitor 52 do not necessarily have to be arranged in a column manner, and the arrangement manner can be flexibly selected according to actual needs. For example, in some embodiments, the first pins 33 corresponding to the conductive portion 6 may also be arranged on both sides of the first capacitor 51 and the second capacitor 52, so that the conductive portion 6 is arranged on both sides of the first capacitor 51 and the second capacitor 52, such as Figure 4B As shown, one feature that needs to be met is that at least one first capacitor 51 is arranged between the first pins 33 corresponding to the two conductive parts 6, and at least one second capacitor 52 is arranged between the first pins 33 corresponding to the two conductive parts 6, that is, at least one first capacitor 51 is arranged between the two conductive parts 6, and at least one second capacitor 52 is arranged between the two conductive parts 6. Please continue to see Figure 4A , the installation direction of each second capacitor 52 can be longitudinal or transverse, and the installation direction of each first capacitor 51 is similar to that of the second capacitor 52, which is not shown in the figure. In order to arrange more first capacitors 51 and second capacitors 52 in a limited space, the installation directions of the first capacitors 51 and the second capacitors 52 can be kept consistent, that is, both are longitudinal or both are transverse, so that the first capacitors 51 and the second capacitors 52 are arranged correspondingly in the height direction. In other words, the projection of each first capacitor 51 on the second surface 22 of the system board 2 partially or completely overlaps with the projection of the second capacitor 52 on the second surface 22 of the system board 2. It can be seen from the above that the vertical power supply device 1 of this embodiment uses a two-layer stacking method to set the first capacitor 51 and the second capacitor 52, and a large number of capacitors can be set in the limited space of the substrate 3 to meet the output capacitance requirements of the vertical power supply device 1.

[0069] See also Figure 5A , which is a schematic cross-sectional view of the vertical power supply device of the second embodiment of the present invention. Figure 5A As shown, compared to Figure 2 In the vertical power supply device 1 shown, the substrate 3 of the vertical power supply device 1a of this embodiment further has a plurality of grooves 36 and a plurality of connecting leads 38. The plurality of grooves 36 are located on the third surface 31 of the substrate 3 and are formed by the concave portion of the third surface 31 of the substrate 3, wherein each groove 36 is used to accommodate a second capacitor 52, wherein the second capacitor 52 is disposed in the groove 36 by using a process such as spot soldering, patch, or reflow soldering. Each connecting lead 38 is connected between a corresponding groove 36 and a corresponding first conductive structure 35, that is, the second capacitor 52 disposed in the groove 36 is electrically connected to the first conductive structure 35 through the connecting lead 38, and the second capacitor 52 disposed in the groove 36 is electrically connected to the output end of the power module 7 disposed at the corresponding second pin 34 through the connecting lead 38 and the first conductive structure 35. Since the second capacitor 52 of the vertical power supply device 1a of this embodiment is arranged in the groove 36 of the substrate 3, the height of the second capacitor 52 on the substrate 3 is reduced, and the height of the conductive part 6 can also be reduced, and the power supply distance between the chip unit 4 and the power module 7 is shortened, so that the total loop impedance is reduced.

[0070] See also Figure 5B , which is a schematic cross-sectional view of the vertical power supply device of the third embodiment of the present invention. Figure 5B As shown, compared to Figure 2 In the vertical power supply device 1 shown, the substrate 3 of the vertical power supply device 1e of this embodiment further has a plurality of grooves 36, a plurality of second conductive structures 37 and a plurality of connecting leads 38. The plurality of grooves 36 are located on the third surface 31 of the substrate 3 and are formed by the concave portion of the third surface 31 of the substrate 3, wherein each groove 36 is used to accommodate a second capacitor 52, wherein the second capacitor 52 is disposed in the groove 36 using a process such as spot soldering, patch, or reflow soldering. Each second conductive structure 37 is connected to a corresponding groove 36 and is disposed in parallel with the first conductive structure 35. Each connecting lead 38 is connected between the corresponding second conductive structure 37 and the corresponding first conductive structure 35, and is perpendicular to the corresponding second conductive structure 37 and the corresponding first conductive structure 35, that is, the second capacitor 52 arranged in the groove 36 is electrically connected to the first conductive structure 35 through the second conductive structure 37 and the connecting lead 38, and the second capacitor 52 arranged in the groove 36 is electrically connected to the output end of the power module 7 arranged at the corresponding second pin 34 through the second conductive structure 37, the connecting lead 38 and the first conductive structure 35.

[0071] See also Figure 6 , which is a schematic cross-sectional view of the vertical power supply device of the fourth embodiment of the present invention. Figure 6 As shown, compared to Figure 5A The conductive part 6 of the vertical power supply device 1a shown is composed of a conductive column, and the conductive part 6 of the vertical power supply device 1b of this embodiment is a solder ball, which can be a ball grid array solder ball or a solder ball with a high temperature core, such as a copper core or a high melting point solder core. In one embodiment, the substrate 3 of the vertical power supply device 1a is provided with solder balls with a high temperature core on the four corners on the plane, and conventional solder balls are provided at other positions on the substrate 3 to prevent the solder balls from collapsing, thereby improving the process yield.

[0072] See also Figure 7 and Figure 8 ,in Figure 7 is a schematic cross-sectional structural diagram of a vertical power supply device according to a fifth embodiment of the present invention, Figure 8 for Figure 7 The exploded structural diagram of the vertical power supply device is shown in FIG. Figure 7 and Figure 8 As shown, compared to Figure 2 The vertical power supply device 1 shown in the figure, the conductive part 6 of the vertical power supply device 1c of this embodiment is a connecting plate, and includes a first end 61, a second end 62 and a side wall 63, the first end 61 and the second end 62 are arranged opposite to each other, the first end 61 of the conductive part 6 is electrically connected to the second surface 22 of the system board 2, the second end 62 of the conductive part 6 is electrically connected to the third surface 31 of the substrate 3, and the side wall 63 of the conductive part 6 is arranged around and located between the first end 61 and the second end 62. In this embodiment, the vertical power supply device 1c also includes a plurality of third capacitors 53, each of which is arranged on the side wall 63 of the corresponding conductive part 6, and as shown in FIG. Figure 8 As shown, there is a corresponding first capacitor 51, a corresponding second capacitor 52 and a corresponding third capacitor 53 between two adjacent conductive parts 6, so that the number of capacitors of the vertical power supply device 1c of this embodiment is further increased, and the setting position of the third capacitor 53 is closer to the chip unit 4 than the second capacitor 52, so that the filtering and energy storage functions of the third capacitor 53 are more effective, which can stabilize the operation of the chip unit 4.

[0073] See also Fig. 9 , which is a schematic cross-sectional view of the vertical power supply device of the sixth embodiment of the present invention. Figure 7 and Figure 8 As shown, compared to Figure 7 The vertical power supply device 1c shown, the vertical power supply device 1d of this embodiment only includes multiple first capacitors 51 and multiple third capacitors 53, but does not include the second capacitor. Of course, the setting positions and quantities of the first capacitors and the third capacitors can be adjusted according to needs and are not limited here.

[0074] The following will further disclose the process of forming the connecting plate of the conductive portion 6 and the third capacitor 53. Figures 10 to 17B , which is Figure 8The schematic diagram of the process method of the connecting plate and the third capacitor of the vertical power supply device shown in FIG. First, a circuit board 83 is provided, and the upper and lower surfaces of the circuit board 83 are both covered with a metal layer, wherein the material of the metal layer covered on the surface can be copper. The circuit board 83 can be directly a whole circuit board, or it can be formed as follows: Fig.10 The circuit board 83 is manufactured in the manner shown in the figure, that is, two copper clad laminates 81 and at least half of the cured sheet 82 are provided, and at least half of the cured sheet 82 is laminated between the two copper clad laminates 81 to form the circuit board 83. In this embodiment, the copper clad laminate 81 can be a single-sided copper clad laminate. Then, as Fig.11 As shown, holes are drilled on the circuit board 83 to form a plurality of through holes 84. In this embodiment, the plurality of through holes 84 are arranged in sequence in both vertical and horizontal rows. Of course, the arrangement positions of the through holes 84 can be adjusted according to needs. Fig.12 As shown, the circuit board 83 is electroplated to form a first electroplating layer 85 on the upper surface, the lower surface and the plurality of through holes 84 of the circuit board 83, wherein the material of the first electroplating layer 85 includes copper, and the upper surface and the lower surface of the circuit board 83 can be electrically connected through the first electroplating layer 85 in the through holes 84. In this embodiment, the circuit board 83 is placed in an electroplating tank (not shown) for copper plating, and the thickness of the electroplating layer 85 in the through holes 84 can be adjusted according to demand. Then, as shown in FIG. Fig.13 As shown, a pattern layer 86 is formed on the upper surface and the lower surface of the circuit board 83, wherein the pattern layer 86 located on the upper surface of the circuit board 83 and the pattern layer 86 located on the lower surface of the circuit board 83 are connected through a plurality of through holes 84. In this embodiment, the method for forming the pattern layer 86 includes exposure, development and etching. Fig.14 As shown, a plurality of pads 87 are formed on the circuit board 83, and a second electroplating layer 89 is formed on the upper surface and the lower surface of the circuit board 83, wherein the plurality of pads 87 are located at positions corresponding to the pattern layer 86. In order to clearly show the positions of the pads 87, Fig.14 Although the pattern layer 86 is not shown, it is clear that the pads 87 are located at positions corresponding to the pattern layer 86. In this embodiment, the formation method of the pads 87 includes printing, exposure and development, and the material of the second electroplating layer 89 includes nickel. In one embodiment, a third electroplating layer may be included, and the material of the third electroplating layer includes gold. Next, as shown in FIG. Fig.15 , Fig.16A and Fig. 16B As shown, the third capacitor 53 is disposed on the corresponding pads 87 on the upper and lower surfaces of the circuit board 83, as shown in FIG. Fig. 16B In this embodiment, the third capacitor 53 is provided by a surface mounting technology. Fig.17A and Fig. 17BAs shown, the circuit board 83 is cut according to the positions of the plurality of through holes 84 to form at least one connecting plate of at least one conductive part 6, so that the electroplated surfaces in the plurality of through holes 84 are at least partially exposed to one end of the connecting plate.

[0075] In summary, the present invention provides a vertical power supply device, wherein a plurality of first capacitors of the vertical power supply device are arranged on the second surface of the system board, a plurality of second capacitors are arranged on the third surface of the substrate, and / or a plurality of third capacitors are arranged on the side walls of the corresponding conductive parts, which means that the capacitors of the vertical power supply device of the present invention are not embedded in the substrate, but are arranged on the surface of the substrate, and in addition to the capacitors arranged on the surface of the substrate, capacitors are also arranged on the surface of the system board and / or the side walls of the conductive parts. Therefore, the first capacitor and the second capacitor of the vertical power supply device of the present invention do not need to be embedded in the substrate, so the material selection range is wide and the cost is low. Furthermore, since the first capacitor and the second capacitor are respectively arranged on the surfaces of the substrate and the system board, the capacitors of the vertical power supply device of the present invention can be arranged on a three-dimensional solid surface, thereby increasing the number of capacitors arranged and achieving the effect of increasing the total capacitance of the output capacitor, thereby providing a stable working voltage for the chip unit.

Claims

1. A vertical power supply device, comprising: A system board, comprising a first surface and a second surface, wherein the first surface and the second surface are arranged opposite to each other; A substrate, comprising a third surface and a fourth surface, wherein the third surface and the fourth surface are arranged opposite to each other, and the third surface of the substrate is located between the fourth surface and the second surface of the system board; A chip unit is disposed on the first surface; A plurality of first capacitors are disposed on the second surface; A plurality of second capacitors are disposed on the third surface; A plurality of conductive parts, wherein the third surface and the second surface are electrically connected through the plurality of conductive parts; as well as A power module is disposed on the fourth surface. 2 . The vertical power supply device as claimed in claim 1 , wherein at least one first capacitor among the plurality of first capacitors is disposed between two conductive portions among the plurality of conductive portions. 3 . The vertical power supply device as claimed in claim 1 , wherein at least one second capacitor among the plurality of second capacitors is disposed between two conductive portions among the plurality of conductive portions. 4 . The vertical power supply device as claimed in claim 1 , wherein a projection of at least one of the first capacitors on the second surface of the system board overlaps with a projection of at least one of the second capacitors on the second surface of the system board.

5. A vertical power supply device as described in claim 1, wherein the substrate includes a plurality of first pins and a plurality of second pins, the plurality of first pins are located on the third surface, the plurality of second pins are located on the fourth surface, the first pins are electrically connected to the second pins, the conductive portion is arranged on the corresponding first pin, and the second pin corresponding to the first pin of the conductive portion is electrically connected to an output end of the power module. 6 . The vertical power supply device as claimed in claim 5 , wherein each of the first pins is electrically connected to the corresponding second pin via a first conductive structure. 7 . The vertical power supply device as claimed in claim 6 , wherein the first conductive structure comprises a via hole or a blind hole. 8 . The vertical power supply device as claimed in claim 5 , wherein each of the second capacitors is electrically connected to the corresponding first pin. 9 . The vertical power supply device as claimed in claim 5 , wherein the third surface of the substrate has at least one groove formed by the third surface being concave to accommodate the second capacitor. 10 . The vertical power supply device as claimed in claim 9 , wherein each of the first pins is electrically connected to the corresponding second pin via a first conductive structure, and each of the second capacitors is electrically connected to the first conductive structure via a connecting lead.

11. A vertical power supply device as described in claim 9, wherein each of the first pins is electrically connected to the corresponding second pin via a first conductive structure, and each of the second capacitors is electrically connected to the first conductive structure via a connecting lead and a second conductive structure, wherein the second conductive structure is connected to the second capacitor, and the connecting lead is connected to the first conductive structure. 12 . The vertical power supply device as claimed in claim 1 , wherein the conductive portion is a conductive column or a solder ball.

13. A vertical power supply device as described in claim 1, wherein the conductive part is a connecting plate, the connecting plate includes a first end, a second end and a side wall, the first end and the second end are arranged opposite to each other, the first end is electrically connected to the second surface of the system board, the second end is electrically connected to the third surface of the substrate, the sidewall is arranged around and located between the first end and the second end, wherein the sidewall is provided with at least one third capacitor.

14. A vertical power supply device, comprising: A system board, comprising a first surface and a second surface, wherein the first surface and the second surface are arranged opposite to each other; A substrate, comprising a third surface and a fourth surface, wherein the third surface and the fourth surface are arranged opposite to each other, and the third surface of the substrate is located between the fourth surface and the second surface of the system board; A chip unit is disposed on the first surface; A plurality of first capacitors are disposed on the second surface; A plurality of connection boards, each of which comprises a first end, a second end and a side wall, the first end and the second end are arranged opposite to each other, the first end is electrically connected to the second surface of the system board, the second end is electrically connected to the third surface of the substrate, and the side wall is arranged around and located between the first end and the second end; A plurality of third capacitors are disposed on the side wall of the connecting plate; and A power module is disposed on the fourth surface. 15 . The vertical power supply device as claimed in claim 14 , wherein at least one first capacitor among the plurality of first capacitors is disposed between two connection plates among the plurality of connection plates.

16. A vertical power supply device as described in claim 14, wherein the substrate includes a plurality of first pins and a plurality of second pins, the plurality of first pins are located on the third surface, the plurality of second pins are located on the fourth surface, the first pins are electrically connected to the second pins, the connecting board is arranged on the corresponding first pin, and the second pin corresponding to the first pin of the connecting board is electrically connected to an output end of the power module. 17 . The vertical power supply device as claimed in claim 14 , wherein each of the first pins is electrically connected to the corresponding second pin via a first conductive structure. 18 . The vertical power supply device as claimed in claim 14 , wherein the vertical power supply device comprises a plurality of second capacitors disposed on the third surface. 19 . The vertical power supply device as claimed in claim 18 , wherein each of the second capacitors is electrically connected to the corresponding first pin. 20 . The vertical power supply device as claimed in claim 18 , wherein the third surface of the substrate has at least one groove formed by the third surface being concave to accommodate the second capacitor. 21 . The vertical power supply device as claimed in claim 20 , wherein each of the first pins is electrically connected to the corresponding second pin via a first conductive structure, and each of the second capacitors is electrically connected to the first conductive structure via a connecting lead.

22. A vertical power supply device as described in claim 20, wherein each of the first pins is electrically connected to the corresponding second pin via a first conductive structure, and each of the second capacitors is electrically connected to the first conductive structure via a connecting lead and a second conductive structure, wherein the second conductive structure is connected to the second capacitor, and the connecting lead is connected to the first conductive structure.

23. A process for a connecting plate, the connecting plate being applied to a vertical power supply device, wherein the process comprises: A circuit board is provided, wherein the upper surface and the lower surface of the circuit board are both covered with a metal layer; Drilling holes on the circuit board to form a plurality of through holes; Electroplating on the circuit board to form a first electroplating layer on the upper surface, the lower surface and the plurality of through holes of the circuit board; Forming a pattern layer on the upper surface and the lower surface of the circuit board, wherein the pattern layer on the upper surface and the pattern layer on the lower surface are connected through the plurality of through holes; Forming a plurality of pads on the circuit board, and forming a second electroplating layer on the upper surface and the lower surface of the circuit board, wherein the plurality of pads are located at positions corresponding to the pattern layer; Disposing a third capacitor on the pads corresponding to the upper surface and the lower surface of the circuit board; and The circuit board is cut according to the positions of the plurality of through holes to form at least one connecting plate, so that an electroplated surface in the plurality of through holes is at least partially exposed to one end of the at least one connecting plate. 24 . The process for manufacturing a connection board as claimed in claim 23 , wherein a material of the first electroplating layer comprises copper.

25. The process for forming a connection plate as claimed in claim 23, wherein a method for forming the pattern layer comprises exposure, development and etching. 26 . The process for forming a connection board as claimed in claim 23 , wherein a method for forming the plurality of pads comprises printing, exposure and development.

27. The process for forming a connection plate as claimed in claim 23, wherein the third capacitor is disposed by surface mounting technology.

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