PCB laminating equipment

Abstract

The invention discloses PCB (Printed Circuit Board) laminating equipment, which comprises a mounting frame, a conveying device is mounted on the mounting frame, a back plate is mounted on the conveying device, side plates are fixed on two sides of the back plate, and pressing mechanisms are mounted on the side plates; the downward pressing mechanism comprises a first synchronous roller and a second synchronous roller, the same synchronous belt is connected between the first synchronous roller and the second synchronous roller, a plurality of rubber division bars are evenly fixed to the faces, close to each other, of the two synchronous belts, and first supporting legs are fixed to the two sides of the bottom of the back plate. And the first supporting leg is fixed on the outer wall of the mounting frame. The rubber division bars on the two sides synchronously drive the PCBs to press downwards, automatic fitting and chip mounting of metal domes are completed, the driving motor stops working, the conveying device continues working, the PCBs are pushed by the push plate to move and move out of the notches, the steps are repeated till the automatic chip mounting and conveying process of the PCBs is completed, and the effect is higher.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB boards, and in particular to a PCB board laminating device. Background Art

[0002] A printed circuit board (PCB), short for printed circuit board, is an electronic component used to carry and connect electronic components. PCBs enable electrical connections between electronic components through wires and connectors, and provide mechanical support and protection, ensuring reliable operation and easy installation and maintenance. PCBs are widely used in a variety of electronic devices, including computers, mobile phones, automotive electronics, and medical devices.

[0003] Currently, most patch methods are manual bonding, which requires the use of a PCB jig. The PCB is stabilized in the jig, and then the patch is held and aligned for bonding. The process requires constant vigilance. If the patch is attached incorrectly, it needs to be torn off and re-bonded. In addition, there are many PCB boards that need to be bonded, which is more troublesome and inefficient. Summary of the Invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a PCB board bonding device.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A PCB board laminating device includes a mounting frame, a conveying device mounted on the mounting frame, a back plate mounted on the conveying device, side plates fixed on both sides of the back plate, and a pressing mechanism mounted on the side plates;

[0007] The pressing mechanism includes a first synchronous roller and a second synchronous roller. The first synchronous roller and the second synchronous roller are connected with a same synchronous belt. A plurality of rubber spacers are evenly fixed on the surfaces of the two synchronous belts that are close to each other.

[0008] As a further solution of the present invention, first supporting feet are fixed on both sides of the bottom of the back panel, and the first supporting feet are fixed to the outer wall of the mounting frame. Second supporting feet are fixed at the bottom of the side panel away from the back panel, and the second supporting feet are fixed to the outer wall of the mounting frame.

[0009] As a further solution of the present invention, a mounting groove is provided on the top of the side plate, the first synchronous roller is rotatably arranged in the mounting groove, and the second synchronous roller is rotatably arranged between the first supporting foot and the second supporting foot on the same side.

[0010] As a further solution of the present invention, the driving motor is fixed to the outer wall of the back plate, and the output shaft of the driving motor passes through the back plate and is coaxially fixed to the corresponding first synchronous roller.

[0011] As a further solution of the present invention, a plurality of electrostatic adsorption layers are evenly fixed on the conveyor belt of the conveying device, and a push plate is fixed on the conveyor belt in front of the electrostatic adsorption layer.

[0012] As a further solution of the present invention, a notch is provided at the bottom of the back plate.

[0013] As a further solution of the present invention, the inner wall of the side panel is fixed with a top plate through a top block, and the top plate is in close contact with the inner wall of the synchronous belt. By using the added top plate, the top plate can support the inner wall of the synchronous belt, so that it maintains a relatively stable state.

[0014] The beneficial effects of the present invention are:

[0015] The present invention: through the provision of a mounting frame, a conveying device, an electrostatic adsorption layer, a push plate, a back plate, a side plate and a pressing mechanism, the pressing mechanism includes a first synchronous roller, a second synchronous roller, a synchronous belt and a rubber spacer, the PCB board is inserted vertically with the rubber spacer, and multiple PCB boards can be placed at equal intervals, and then the pot piece is torn off and placed on the electrostatic adsorption layer, and the conveying device drives the pot piece located on the electrostatic adsorption layer to move, when the pot piece moves to face the bottom of the PCB board, the conveying device stops, and the drive motor works, so that the first synchronous roller, the second synchronous roller and the synchronous belt work, so that the rubber spacers on both sides synchronously drive the PCB board to press down, completing the automatic bonding of the pot piece, and after the bonding is completed, the drive motor stops working, and the conveying device continues to work, and the PCB board is pushed to move by the push plate and moves out of the slot, and the above steps are repeated until the automatic bonding and conveying process of multiple PCB boards is completed, with higher effect.

[0016] The present invention utilizes the additional top plate, which can support the inner wall of the synchronous belt to keep it in a relatively stable state. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of a PCB board bonding device proposed by the present invention;

[0018] Figure 2 This is a schematic diagram of a partially expanded three-dimensional structure of a PCB board bonding device proposed by the present invention;

[0019] Figure 3 This is a partial three-dimensional structural diagram of a PCB board bonding device proposed by the present invention;

[0020] Figure 4 This is a schematic diagram of the rear view structure of a PCB board bonding device proposed in the present invention.

[0021] In the figure: 1. Mounting frame; 2. Conveying device; 3. Electrostatic adsorption layer; 4. Push plate; 5. Back plate; 6. Side plate; 7. Pressing mechanism; 8. Driving motor; 9. First synchronous roller; 10. Second synchronous roller; 11. Synchronous belt; 12. Rubber spacer; 13. Mounting groove; 14. First supporting foot; 15. Second supporting foot; 16. Notch; 17. Top plate. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0023] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] Reference Figures 1-4 A PCB board laminating device includes a mounting frame 1, a conveying device 2 is mounted on the mounting frame 1, a back plate 5 is mounted on the conveying device 2, side plates 6 are fixed on both sides of the back plate 5, and a pressing mechanism 7 is mounted on the side plates 6;

[0025] The pressing mechanism 7 includes a first synchronous roller 9 and a second synchronous roller 10. A same synchronous belt 11 is connected between the first synchronous roller 9 and the second synchronous roller 10. A plurality of rubber spacers 12 are evenly fixed on the surfaces of the two synchronous belts 11 that are close to each other.

[0026] 2. A PCB board bonding device according to claim 1, characterized in that first support legs 14 are fixed to both sides of the bottom of the back plate 5, and the first support legs 14 are fixed to the outer wall of the mounting frame 1, and second support legs 15 are fixed to the bottom of the side plate 6 away from the back plate 5, and the second support legs 15 are fixed to the outer wall of the mounting frame 1.

[0027] In this embodiment, a mounting groove 13 is provided on the top of the side plate 6, the first synchronous roller 9 is rotatably arranged in the mounting groove 13, and the second synchronous roller 10 is rotatably arranged between the first supporting foot 14 and the second supporting foot 15 on the same side.

[0028] In this embodiment, the driving motor 8 is fixed to the outer wall of the back plate 5 , and the output shaft of the driving motor 8 passes through the back plate 5 and is coaxially fixed to the corresponding first synchronous roller 9 .

[0029] In this embodiment, a plurality of electrostatic adsorption layers 3 are evenly fixed on the conveyor belt of the conveying device 2 , and a push plate 4 is fixed in front of the electrostatic adsorption layer 3 on the conveyor belt.

[0030] In this embodiment, a notch 16 is formed at the bottom of the back plate 5 .

[0031] In this embodiment, a top plate 17 is fixed to the inner wall of the side plate 6 through a top block. The top plate 17 is in close contact with the inner wall of the synchronous belt 11. With the added top plate 17, the top plate 17 can support the inner wall of the synchronous belt 11, so that it maintains a relatively stable state.

[0032] Working principle: When in use, through the provided mounting frame 1, conveying device 2, electrostatic adsorption layer 3, push plate 4, back plate 5, side plate 6 and pressing mechanism 7, the pressing mechanism 7 includes a first synchronous roller 9, a second synchronous roller 10, a synchronous belt 11 and a rubber spacer 12. The PCB board is inserted vertically with the rubber spacer 12, and multiple PCB boards can be placed at equal distances. Then the pot piece is torn and placed on the electrostatic adsorption layer 3. The conveying device 2 drives the pot piece on the electrostatic adsorption layer 3 to move. When the pot piece moves to the bottom of the PCB board, the conveying device 2 stops and the driving motor 8 works, so that the first synchronous roller 9, the second synchronous roller 10 and the synchronous belt 11 work, so that the rubber spacers 12 on both sides synchronously drive the PCB board downward to complete the automatic bonding of the pot piece. After the bonding is completed, the driving motor 8 stops working and the conveying device 2 continues working, pushing the PCB board to move through the push plate 4 and moving it out of the slot 16. The above steps are repeated until the automatic bonding of multiple PCB boards is completed, with higher effect.

[0033] Furthermore, by utilizing the additional top plate 17 , the top plate 17 can support the inner wall of the synchronous belt 11 , so that the synchronous belt 11 maintains a relatively stable state.

[0034] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0035] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0036] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0037] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A PCB board bonding device, comprising a mounting frame (1), characterized in that: The mounting frame (1) is provided with a conveying device (2), the conveying device (2) is provided with a back plate (5), side plates (6) are fixed on both sides of the back plate (5), and a pressing mechanism (7) is provided on the side plates (6); The pressing mechanism (7) comprises a first synchronous roller (9) and a second synchronous roller (10), wherein the first synchronous roller (9) and the second synchronous roller (10) are connected by a same synchronous belt (11), and a plurality of rubber spacers (12) are evenly fixed on mutually adjacent surfaces of the two synchronous belts (11).

2. A PCB board bonding device according to claim 1, characterized in that: First supporting feet (14) are fixed to both sides of the bottom of the back plate (5), and the first supporting feet (14) are fixed to the outer wall of the mounting frame (1); second supporting feet (15) are fixed to the bottom of the side plate (6) at a position away from the back plate (5), and the second supporting feet (15) are fixed to the outer wall of the mounting frame (1).

3. A PCB board bonding device according to claim 2, characterized in that: The top of the side plate (6) is provided with a mounting groove (13), the first synchronous roller (9) is rotatably arranged in the mounting groove (13), and the second synchronous roller (10) is rotatably arranged between a first supporting foot (14) and a second supporting foot (15) located on the same side.

4. A PCB board bonding device according to claim 3, characterized in that: The drive motor (8) is fixed on the outer wall of the back plate (5), and the output shaft of the drive motor (8) passes through the back plate (5) and is coaxially fixed with the corresponding first synchronous roller (9).

5. A PCB board bonding device according to claim 4, characterized in that: A plurality of electrostatic adsorption layers (3) are evenly fixed on the conveyor belt of the conveying device (2), and a push plate (4) is fixed on the conveyor belt in front of the electrostatic adsorption layer (3).

6. A PCB board bonding device according to claim 5, characterized in that: The bottom of the back plate (5) is provided with a notch (16).

7. The PCB board bonding equipment according to claim 1, characterized in that: A top plate (17) is fixed to the inner wall of the side plate (6) via a top block, and the top plate (17) is in close contact with the inner wall of the synchronous belt (11).

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