Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The problem that in the prior art, a hole digging screen is low in reliability is solved. The display panel is provided with a display area, a hole area and a transition area located between the display area and the hole area. The display panel includes: a substrate; the dam is located on the base plate and located in the transition area, and the dam surrounds the hole area; the dam comprises a first metal part and a first organic part which are in contact. The first organic part is located on the side, away from the substrate, of the first metal part. And the first inorganic packaging layer is at least partially stacked on the side, away from the substrate, of the dam, and the first inorganic packaging layer is in contact with the first organic part.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] With the rise of under-screen camera technology, punch-hole screens are now the mainstream technology. However, the reliability of punch-hole screens has always been one of the problems that technicians in this field need to solve urgently. Summary of the invention

[0003] In view of this, the embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, which solve the problem of low reliability of the hole-punch screen in the prior art.

[0004] In a first aspect, the present application provides a display panel having a display area, a hole area, and a transition area between the display area and the hole area; the display panel comprises: a substrate; a dam located on the substrate and in the transition area, the dam surrounding the hole area; the dam comprises a first metal part and a first organic part arranged in contact, the first organic part being located on a side of the first metal part away from the substrate; and a first inorganic encapsulation layer at least partially overlapped on a side of the dam away from the substrate, the first inorganic encapsulation layer being in contact with the first organic part.

[0005] In combination with the first aspect, in some possible implementations, the first metal part includes a first sub-part and a second sub-part, the first sub-part is located on the side of the second sub-part facing away from the substrate, and the orthographic projection of the second sub-part on the substrate is located within the orthographic projection range of the first sub-part on the substrate; the first metal part also includes a third sub-part, the third sub-part is located on the side of the second sub-part facing the substrate, and the orthographic projection of the second sub-part on the substrate is located within the orthographic projection range of the third sub-part on the substrate; preferably, the material of the first sub-part and the third sub-part is titanium, and the material of the second sub-part is aluminum.

[0006] In combination with the first aspect, in some possible implementations, the orthographic projection of the first organic part on the substrate coincides with the orthographic projection of the first metal part on the substrate; preferably, the orthographic projection of the first surface of the first organic part away from the substrate on the substrate is located within the range of the orthographic projection of the second surface of the first organic part close to the substrate on the substrate; preferably, there is a gap between the boundary of the orthographic projection of the first surface on the substrate and the boundary of the orthographic projection of the second surface on the substrate; preferably, on a plane perpendicular to the surface of the substrate provided with a dam, the cross-section of the first organic part is a trapezoid; preferably, the display panel also includes a first planarization layer, the first planarization layer is located in the display area, and the first planarization layer and the first organic part are arranged on the same layer.

[0007] In combination with the first aspect, in some possible implementations, the dam also includes a second organic part, which is superimposed on the side of the first metal part facing the substrate; preferably, the orthographic projection of the first metal part on the substrate is located within the orthographic projection range of the second organic part on the substrate; preferably, the orthographic projection of the third surface of the second organic part away from the substrate on the substrate is located within the orthographic projection range of the fourth surface of the second organic part close to the substrate on the substrate; preferably, there is a gap between the boundary of the orthographic projection of the third surface on the substrate and the boundary of the orthographic projection of the fourth surface on the substrate; preferably, on a plane perpendicular to the surface of the substrate on which the dam is provided, the cross-section of the second organic part is trapezoidal; preferably, the display panel also includes a second planarization layer, the second planarization layer is located in the display area, and the second planarization layer and the second organic part are provided on the same layer.

[0008] In combination with the first aspect, in some possible implementations, the dam also includes at least one second metal part, which is stacked on the side of the second organic part close to the substrate, and the second organic part covers the surface and side wall of at least one second metal part facing away from the substrate; preferably, the number of the second metal parts is multiple; the dam also includes at least one inorganic insulating part, which is located between adjacent second metal parts; preferably, the number of the second metal parts is 2.

[0009] In combination with the first aspect, in some possible implementations, the display panel also includes a second inorganic encapsulation layer, which is stacked on the side of the first inorganic encapsulation layer facing away from the substrate, and the orthographic projection of the second inorganic encapsulation layer on the substrate covers the orthographic projection of the first inorganic encapsulation layer on the substrate; or the second inorganic encapsulation layer is stacked on the side of the first inorganic encapsulation layer close to the substrate, and the second inorganic encapsulation layer includes a plurality of inorganic encapsulation parts; the display panel also includes a plurality of light-emitting devices, the light-emitting devices are located in the display area, the light-emitting devices and the inorganic encapsulation parts correspond one-to-one, and the inorganic encapsulation parts cover the surface of the light-emitting devices facing away from the substrate.

[0010] The second aspect of the present application provides a method for preparing a display panel, which has a display area, a hole area, and a transition area between the display area and the hole area; the preparation method comprises: preparing a pixel circuit and a dam on a substrate, wherein the pixel circuit is located in the display area and the dam is located in the transition area; the dam comprises a first metal part and a first organic part which are arranged in contact, and the first organic part is located on the side of the first metal part away from the substrate; a light-emitting device is prepared on the side of the pixel circuit away from the substrate, and the light-emitting device is connected to the pixel circuit; a packaging structure is prepared on the side of the light-emitting device away from the substrate to obtain a display panel; wherein the packaging structure comprises a first inorganic packaging layer, and the first inorganic packaging layer is in contact with the first organic part.

[0011] In combination with the second aspect, in some possible implementations, preparing a pixel circuit and a dam on a substrate includes: preparing a pixel circuit on a substrate; preparing a first metal layer on a side of the pixel circuit facing away from the substrate, the first metal layer including an electrode connecting line and a first metal part, and the electrode connecting line is located in a display area; preparing a first organic layer on a side of the first metal layer facing away from the substrate, the first organic layer including a first planarization layer and a first organic part, and the first planarization layer is located in the display area.

[0012] In combination with the second aspect, in some possible implementations, the dam also includes a second organic part stacked on the side of the first metal part facing the substrate; after the step of preparing the pixel circuit on the substrate, before preparing the first metal layer on the side of the pixel circuit away from the substrate, it also includes: preparing a second organic layer on the side of the pixel circuit away from the substrate, the second organic layer includes a second planarization layer and a second organic part, and the second planarization layer is located in the display area; preferably, the dam also includes at least one second metal part stacked on the side of the second organic part close to the substrate, the second organic part covers the surface and side wall of at least one second metal part away from the substrate; the step of preparing the pixel circuit on the substrate includes: preparing multiple metal layers and multiple insulating layers on the substrate, and insulating layers are arranged between adjacent metal layers to obtain the pixel circuit and at least one second metal part; preferably, preparing the first metal layer on the side of the pixel circuit away from the substrate includes: preparing a composite metal material layer on the side of the pixel circuit away from the substrate, the composite metal material layer includes a first metal material layer, a second metal material layer and a third metal material layer stacked in sequence in a direction away from the substrate; the composite metal material layer is patterned to obtain an electrode connecting line and a first metal part.

[0013] A third aspect of the present application provides a display device, comprising a display panel provided by any of the above embodiments.

[0014] According to the display panel, preparation method thereof, and display device provided by the embodiments of the present application, by setting a first organic part between the first metal part of the dam and the first inorganic packaging layer, the first organic part can be used to buffer stress, thereby reducing the probability of problems such as breakage of the packaging film layer at the dam and falling off of the first sub-part of the dam, thereby improving the reliability of the display product. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1a A schematic diagram of the cross-sectional structure of a display panel provided in the first embodiment of the present application.

[0016] Figure 1b for Figure 1a A zoomed-in view of a detail of the levee in the display panel is shown.

[0017] Figure 2a A schematic diagram of the cross-sectional structure of a display panel provided in the second embodiment of the present application.

[0018] Figure 2b for Figure 2a A zoomed-in view of a detail of the levee in the display panel is shown.

[0019] Figure 3a A schematic diagram of the cross-sectional structure of a display panel provided in the third embodiment of the present application.

[0020] Figure 3b for Figure 3a A zoomed-in view of a detail of the levee in the display panel is shown.

[0021] Figure 4 A schematic diagram of the cross-sectional structure of a display panel provided in the fourth embodiment of the present application.

[0022] Figure 5 A schematic diagram of the cross-sectional structure of a display panel provided in the fourth embodiment of the present application.

[0023] Figure 6 A schematic flow chart of a method for manufacturing a display panel provided in the first embodiment of the present application.

[0024] Figure 7 A schematic flow chart of a method for manufacturing a display panel provided in the second embodiment of the present application.

[0025] Figure 8 A schematic flow chart of a method for manufacturing a display panel provided in the third embodiment of the present application.

[0026] Fig. 9 A schematic diagram of the structure of a display device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0027] With the rise of under-screen camera technology, punch-hole screens are now the mainstream technology. In order to ensure the packaging effect of the punch-hole area, multiple circular dams are usually set between the punch-hole area and the display area, and the dams surround the punch-hole area.

[0028] In the related technology, a circular dam can be formed by digging grooves. Recently, the industry has begun to study the solution of digging grooves in the Ti / Al / Ti metal layer to form an undercut structure, but due to problems such as wet etching uniformity, top titanium peeling, and packaging film layer fracture at the dam due to stress problems, the reliability of the hole-punch screen is low.

[0029] In view of this, the embodiments of the present application provide a display panel and a method for preparing the same, and a display device. By arranging an organic film layer between the metal layer of the dam, such as the Ti / Al / Ti metal layer and the encapsulation film layer to buffer the stress, the probability of problems such as breakage of the encapsulation film layer and breakage of the top titanium edge is reduced, thereby improving the reliability of the display product.

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is understood that when a structure is referred to as being "on or under" another structure, the structure may be directly on or under the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. The structures mentioned herein include any of a film layer, an element, a device, a component, and an assembly.

[0032] When a structure is referred to as being “connected” to another structure, the structure may be directly connected to the other structure or indirectly connected to the other structure with one or more intervening structures interposed therebetween.

[0033] Figure 1a A schematic diagram of the cross-sectional structure of a display panel provided in the first embodiment of the present application. Figure 1b for Figure 1a The panel shown shows a partial enlarged view of the dam. Figure 1a and Figure 1b As shown, the display panel has a display area AA, a hole area HA, and a transition area SA between the display area AA and the hole area HA. ​​The hole area HA refers to a through hole opened on the display panel, and the through hole penetrates the display panel along the thickness direction.

[0034] The display panel includes: a substrate 11, a dam 12 and a first inorganic encapsulation layer 131. The dam 12 is located on one side of the substrate 11 and is located in the transition area SA. The dam 12 surrounds the hole area HA. ​​The dam 12 includes a first metal part 121 and a first organic part 122 that are arranged in contact. The first organic part 122 is located on the side of the first metal part 121 away from the substrate 11. The first inorganic encapsulation layer 131 is at least partially overlapped on the side of the dam 12 away from the substrate 11, and the first inorganic encapsulation layer 131 is in contact with the first metal part 121, and the first inorganic encapsulation layer 131 is in contact with the first organic part 122.

[0035] The substrate may be a substrate substrate. In some embodiments, the substrate substrate includes a glass-based substrate. In some embodiments, the substrate substrate may include an organic resin material such as epoxy resin, triazine, silicone resin or polyimide. For example, the substrate substrate may be an FR4 type printed circuit board PCB, or may be a flexible PCB that is easily deformed. In some embodiments, the substrate substrate may include a ceramic material such as silicon nitride, aluminum nitride or aluminum oxide, or may include a metal or a metal compound. For example, the substrate substrate may be a metal core printed circuit board (MCPCB) or a metal copper clad laminate (MCCL).

[0036] In one embodiment, the first metal portion 121 includes a first sub-portion B1 and a second sub-portion B2, the first sub-portion B1 is located on the side of the second sub-portion B2 away from the substrate 11, and the orthographic projection of the second sub-portion B2 on the substrate 11 is located within the orthographic projection range of the first sub-portion B1 on the substrate 11. That is, the sidewall of the first metal portion 121 has an undercut structure.

[0037] In one embodiment, the first metal portion 121 further includes a third sub-portion B3, the third sub-portion B3 is located on the side of the second sub-portion B2 facing the substrate 11, and the orthographic projection of the second sub-portion B2 on the substrate 11 is located within the orthographic projection range of the third sub-portion B3 on the substrate 11. Exemplarily, the materials of the first sub-portion B1 and the third sub-portion B3 are both titanium, and the material of the second sub-portion B2 is aluminum.

[0038] In one embodiment, the display panel further includes a first planarization layer P1, which is located in the display area AA. The first planarization layer P1 and the first organic part 122 are disposed in the same layer, that is, the first planarization layer P1 and the first organic part 122 are located in the same film layer and are prepared in the same process.

[0039] According to the display panel provided in this embodiment, by setting the first organic part 122 between the first metal part 121 of the dam 12 and the first inorganic packaging layer 131, the first organic part 122 can be used to buffer the stress, thereby reducing the probability of problems such as breakage of the packaging film layer at the dam 12 and falling off of the first metal part 121 of the dam 12, thereby improving the reliability of the display product.

[0040] In one embodiment, see Figure 1a and Figure 1b , the orthographic projection of the first organic part 122 on the substrate 11 coincides with the orthographic projection of the first metal part 121 on the substrate 11. In this way, on the one hand, any position of the first metal part 121 away from the substrate 11 is provided with the first organic part 122 to provide protection; on the other hand, the first metal part 121 can provide good support for the first organic part 122, and the structure is more stable.

[0041] In one embodiment, the orthographic projection of the first surface S1 of the first organic part 122 away from the substrate 11 is located within the range of the orthographic projection of the second surface S2 of the first organic part 122 close to the substrate 11 on the substrate 11. Exemplarily, there is a gap between the boundary of the orthographic projection of the first surface S1 on the substrate 11 and the boundary of the orthographic projection of the second surface S2 on the substrate 11. For example, on a plane perpendicular to the surface of the substrate 11 provided with a dam, the cross-section of the first organic part 122 is a trapezoid. In this case, the area where the first sub-part B1 is not in contact with the second sub-part B2 bears less weight from the first organic part 122 than the area where the first sub-part B1 is in contact with the second sub-part B2, thereby further reducing the risk of edge breakage of the first sub-part B1 and improving the reliability of the display panel.

[0042] Figure 2a A schematic diagram of the cross-sectional structure of a display panel provided in the second embodiment of the present application. Figure 2b for Figure 2a The panel shown shows a partial enlargement of the dam. Figure 2a , Figure 2b and Figure 1a , Figure 1b The display panel shown in the figure is different in that, in this embodiment, the dam 12 further includes a second organic portion 123 stacked on the side of the first metal portion 121 facing the substrate 11 .

[0043] In one embodiment, the display panel further includes a second planarization layer P2, which is located in the display area AA. The second planarization layer P2 and the second organic part 123 are disposed in the same layer, that is, the second planarization layer P2 and the second organic part 123 are located in the same film layer and are prepared in the same process.

[0044] In one embodiment, the orthographic projection of the first metal portion 121 on the substrate 11 is located within the orthographic projection range of the second organic portion 123 on the substrate 11 .

[0045] In one embodiment, the orthographic projection of the third surface S3 of the second organic part 123 away from the substrate 11 on the substrate 11 is located within the orthographic projection range of the fourth surface S4 of the second organic part 123 close to the substrate 11 on the substrate 11. Exemplarily, there is a gap between the boundary of the orthographic projection of the third surface S3 on the substrate 11 and the boundary of the orthographic projection of the fourth surface S4 on the substrate 11. For example, on a plane perpendicular to the surface of the substrate 11 on which the dam is provided, the cross section of the second organic part 123 is a trapezoid. In this way, the second organic part 123 can provide good support for the first metal part 121, further improving the structural stability of the dam 12.

[0046] Figure 3a A schematic diagram of the cross-sectional structure of a display panel provided in the third embodiment of the present application. Figure 3b for Figure 3a The panel shown shows a partial enlargement of the dam. Figure 3a , Figure 3b and Figure 2a , Figure 2b The display panel shown is different in that, in this embodiment, the dam 12 also includes at least one second metal part 124, which is stacked on the side of the second organic part 123 close to the substrate 11, and the second organic part 123 covers the surface and side wall of at least one second metal part 124 away from the substrate 11.

[0047] In one embodiment, the number of the second metal parts 124 is multiple. The dam 12 further includes at least one inorganic insulating part 125, and the inorganic insulating part 125 is located between adjacent second metal parts 124. At least one inorganic insulating part 125 can be disposed between adjacent second metal parts 124. For example, Figure 3b As shown, in this embodiment, the number of the second metal parts 124 is two, and an inorganic insulating part 125 is disposed between the two second metal parts 124 .

[0048] Figure 4 This is a schematic diagram of the cross-sectional structure of a display panel provided in the fourth embodiment of the present application. Figure 4 and the display panel provided by any of the above embodiments, Figure 1a Taking the display panel shown as an example, the difference is that, in this embodiment, the second inorganic encapsulation layer 132 of the display panel is superimposed on the side of the first inorganic encapsulation layer 131 facing away from the substrate 11, and the orthographic projection of the second inorganic encapsulation layer 132 on the substrate 11 covers the orthographic projection of the first inorganic encapsulation layer 131 on the substrate 11.

[0049] like Figure 4 As shown, the display panel may further include an organic encapsulation layer 133 located between the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 132. The organic encapsulation layer 133 is located in the display area AA and terminates at a side of the dam 12 close to the display area AA.

[0050] Figure 5 This is a schematic diagram of the cross-sectional structure of a display panel provided in the fourth embodiment of the present application. Figure 5 and Figure 4The display panel shown in the figure is different in that, in the present embodiment, the second inorganic encapsulation layer 132 is stacked on the side of the first inorganic encapsulation layer 131 close to the substrate 11, and the second inorganic encapsulation layer 131 includes a plurality of inorganic encapsulation parts 1320. The display panel also includes a plurality of light-emitting devices 14, and the light-emitting devices 14 are located in the display area AA. The light-emitting devices 14 correspond to the inorganic encapsulation parts 1320 one by one, and the inorganic encapsulation parts 1320 cover the surface of the light-emitting devices 14 away from the substrate 11. The display panel may also include an organic encapsulation layer 133, which is located between the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 132.

[0051] The light-emitting device 14 may be an organic light-emitting diode, or a quantum dot light-emitting diode, etc. Taking an organic light-emitting diode as an example, from the perspective of the film structure, the light-emitting device 14 includes a first electrode and a second electrode stacked on the substrate 11 in sequence, and at least one light-emitting functional layer located between the first electrode and the second electrode. Among them, the first electrode may be an anode, and the second electrode may be a cathode; or, the first electrode is a cathode, and the second electrode is an anode. At least one light-emitting functional layer includes a light-emitting layer, and may also include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron blocking layer (EBL) located between the anode and the light-emitting layer, and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole blocking layer (HBL) located between the cathode and the light-emitting layer. Exemplarily, one or more of the hole injection layer, hole transport layer, electron blocking layer, hole blocking layer, electron transport layer, and electron injection layer of all light-emitting devices 14 may be a common layer connected together, and the light-emitting layers of adjacent light-emitting devices 14 may overlap slightly, or may be isolated from each other.

[0052] In one embodiment, the display panel further includes a pixel circuit 15 , which is connected to the light emitting device 14 and is used to drive the light emitting device 14 to emit light according to a predetermined gray scale.

[0053] In one embodiment, the display panel further includes an isolation structure 16, which is located on the side of the pixel definition layer PDL away from the substrate 11. The isolation structure 16 encloses an isolation opening, and the light-emitting device 14 is located in the isolation opening. The isolation structure 16 includes a stacked crown and a support portion, the support portion is located on the side of the crown close to the substrate 11, and the orthographic projection of the support portion on the substrate 11 is located within the orthographic projection range of the crown on the substrate 11. That is, the side wall of the isolation structure 16 has an undercut structure, so that the film layers evaporated on the isolation structure 16, such as the light-emitting layer and the second electrode, can be disconnected at the isolation structure 16.

[0054] The present application also provides a method for preparing a display panel. Figure 6 This is a schematic diagram of a process for manufacturing a display panel according to a first embodiment of the present application. Figure 5A display panel provided in any one of the embodiments, the display panel comprises a display area AA, a hole area HA, and a transition area SA located between the display area AA and the hole area HA. Figure 6 As shown, the preparation method 600 includes:

[0055] Step S610, see FIG. 1- Figure 5 The display panel provided by the illustrated embodiment has a pixel circuit 15 and a dam 12 prepared on a substrate 11 .

[0056] The pixel circuit 15 is located in the display area AA, and the dam 12 is located in the transition area SA. Figure 1b , Figure 2b and Figure 3b In the display panel shown, the dam 12 includes a first metal portion 121 and a first organic portion 122 which are arranged in contact with each other. The first organic portion 122 is located on a side of the first metal portion 121 which is away from the substrate 11 .

[0057] In one embodiment, step S610 further includes preparing a first electrode and a pixel definition layer PDL on the side of the pixel circuit 15 facing away from the substrate 11. The pixel definition layer PDL encloses a pixel opening, and the pixel opening exposes at least a portion of the first electrode.

[0058] In one embodiment, after step S610, the method further includes: preparing an isolation structure 16 on the side of the pixel definition layer PDL facing away from the substrate 11. The isolation structure 16 encloses an isolation opening, and the orthographic projection of the isolation opening on the substrate 11 covers the orthographic projection of the pixel opening on the substrate 11.

[0059] Step S620 , preparing a light-emitting device 14 on the side of the pixel circuit 15 facing away from the substrate 11 , and connecting the light-emitting device 14 and the pixel circuit 15 .

[0060] Step S630 , preparing a packaging structure on the side of the light emitting device 14 facing away from the substrate 11 to obtain a display panel.

[0061] The encapsulation structure includes a first inorganic encapsulation layer 131 , and the first inorganic encapsulation layer 131 is in contact with the first organic part 122 .

[0062] In one embodiment, the encapsulation structure further includes a second inorganic encapsulation layer 132, which is stacked on a side of the first inorganic encapsulation layer 131 away from the substrate 11. Figure 4 The encapsulation structure may further include an organic encapsulation layer 133 located between the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 132 .

[0063] In one embodiment, the encapsulation structure further includes a second inorganic encapsulation layer 132, which is located on a side of the first inorganic encapsulation layer 131 close to the substrate 11. Figure 5The second inorganic encapsulation layer 132 includes a plurality of inorganic encapsulation parts 1320 . The inorganic encapsulation parts 1320 correspond to the light emitting devices 14 one by one. The inorganic encapsulation parts 1320 cover the surface of the light emitting devices 14 away from the substrate 11 .

[0064] Figure 7 This is a flow chart of a method for manufacturing a display panel according to a second embodiment of the present application. In the manufacturing method 700 provided in this embodiment, step S610 includes:

[0065] Step S710, see FIG. 1- Figure 5 In the display panel shown, a pixel circuit 15 is prepared on a substrate 11 .

[0066] Step S720 , preparing a first metal layer M1 on the side of the pixel circuit 15 away from the substrate 11 , the first metal layer M1 including an electrode connection line 18 and a first metal portion 121 , the electrode connection line 18 is located in the display area AA, and the electrode connection line 18 connects the first electrode of the light-emitting device 14 and the pixel circuit 15 .

[0067] In one embodiment, step S720 includes: first, preparing a composite metal material layer on the side of the pixel circuit 15 away from the substrate 11, the composite metal material layer including a first metal material layer, a second metal material layer and a third metal material layer stacked in sequence in a direction away from the substrate 11. Secondly, the composite metal material layer is patterned to obtain the electrode connection line 18 and the first metal part 121. In this case, the first metal part 121 includes a third sub-part B3, a second sub-part B2 and a first sub-part B1 stacked in sequence in a direction away from the substrate 11. The orthographic projection of the second sub-part B2 on the substrate 11 is located within the orthographic projection range of the first sub-part B1 on the substrate 11. The orthographic projection of the second sub-part B2 on the substrate 11 is located within the orthographic projection range of the third sub-part B3 on the substrate 11. Exemplarily, the materials of the first sub-part B1 and the third sub-part B3 are both titanium, and the material of the second sub-part B2 is aluminum.

[0068] In step S730 , a first organic layer is formed on the side of the first metal layer M1 facing away from the substrate 11 . The first organic layer includes a first planarization layer P1 and a first organic portion 122 . The first planarization layer P1 is located in the display area AA.

[0069] Figure 8 A schematic flow chart of a method for manufacturing a display panel provided in the third embodiment of the present application. In this embodiment, the dam further includes a second organic portion stacked on the side of the first metal portion facing the substrate. According to the manufacturing method 800 provided in this embodiment, before step S720, it further includes:

[0070] Step S810, see FIG. 1- Figure 5In the display panel shown, a second organic layer is prepared on the side of the pixel circuit 15 facing away from the substrate 11 . The second organic layer includes a second planarization layer P2 and a second organic portion 123 . The second planarization layer P2 is located in the display area AA.

[0071] In one embodiment, see Figure 3b , the dam 12 further includes at least one second metal portion 124 stacked on a side of the second organic portion 123 close to the substrate 11, and the second organic portion 123 covers a surface and a side wall of the at least one second metal portion 124 facing away from the substrate 11. In this case, step S710 includes:

[0072] Step S820, prepare multiple metal layers and multiple insulating layers on the substrate 11, and an insulating layer is provided between adjacent metal layers to obtain the pixel circuit 15 and at least one second metal portion 124. Exemplarily, the multiple metal layers include two metal layers, and the two metal layers may be a second metal layer M2 and a third metal layer M3. The second metal layer M2 is located between the first metal layer M1 and the third metal layer M3.

[0073] In one embodiment, Figure 5 As shown, the display panel may further include a fourth metal layer M4 located between the first metal layer M1 and the second metal layer M2.

[0074] The present application also provides a display device. Fig. 9 This is a schematic diagram of the structure of a display device provided in one embodiment of the present application. Fig. 9 As shown, the display device includes the display panel 90 provided by any of the above embodiments.

[0075] The display device is a product with an image display function. For example, the display device can be used to display static images, such as pictures or photos. The display device can also be used to display dynamic images, such as videos.

[0076] The display device can be a laptop computer, a mobile phone, a handheld or portable computer, a camera, a camcorder, a vehicle-mounted intelligent central control screen, a calculator, a smart watch, a GPS navigator, an electronic photo, an electronic billboard or sign, a projector, etc.

[0077] In addition, the display device may also have functions such as taking photos, recording videos, fingerprint recognition, and face recognition. Accordingly, the display device also includes at least one functional module for realizing the above functions, such as an under-screen camera, an under-screen fingerprint recognition sensor, and the like.

[0078] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0079] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display panel, characterized in that: The display panel has a display area, a hole area, and a transition area between the display area and the hole area; the display panel includes: substrate; a dam located on the substrate and in the transition region, the dam surrounding the hole region; the dam comprising a first metal portion and a first organic portion arranged in contact with each other, the first organic portion being located on a side of the first metal portion away from the substrate; and The first inorganic encapsulation layer is at least partially overlapped on a side of the dam facing away from the substrate, and the first inorganic encapsulation layer is in contact with the first organic part.

2. The display panel according to claim 1, characterized in that: The first metal portion includes a first sub-portion and a second sub-portion, the first sub-portion is located on a side of the second sub-portion away from the substrate, and the orthographic projection of the second sub-portion on the substrate is within the orthographic projection range of the first sub-portion on the substrate; Preferably, the first metal portion further includes a third sub-portion, the third sub-portion is located on the side of the second sub-portion facing the substrate, and the orthographic projection of the second sub-portion on the substrate is located within the orthographic projection range of the third sub-portion on the substrate; Preferably, the materials of the first sub-section and the third sub-section are both titanium, and the material of the second sub-section is aluminum.

3. The display panel according to claim 1, characterized in that: The orthographic projection of the first organic part on the substrate coincides with the orthographic projection of the first metal part on the substrate; Preferably, the orthographic projection of a first surface of the first organic part away from the substrate on the substrate is located within the orthographic projection range of a second surface of the first organic part close to the substrate on the substrate; Preferably, there is a gap between a boundary of an orthographic projection of the first surface on the substrate and a boundary of an orthographic projection of the second surface on the substrate; Preferably, on a plane perpendicular to the surface of the substrate on which the dam is provided, the cross section of the first organic part is a trapezoid; Preferably, the display panel further includes a first planarization layer, the first planarization layer is located in the display area, and the first planarization layer and the first organic part are arranged in the same layer.

4. The display panel according to claim 1, characterized in that: The dam further includes a second organic portion stacked on a side of the first metal portion facing the substrate; Preferably, the orthographic projection of the first metal part on the substrate is located within the orthographic projection range of the second organic part on the substrate; Preferably, the orthographic projection of the third surface of the second organic part away from the substrate on the substrate is located within the orthographic projection range of the fourth surface of the second organic part close to the substrate on the substrate; Preferably, there is a gap between a boundary of an orthographic projection of the third surface on the substrate and a boundary of an orthographic projection of the fourth surface on the substrate; Preferably, in a plane perpendicular to the surface of the substrate provided with the dam, the cross section of the second organic part is a trapezoid; Preferably, the display panel further includes a second planarization layer, the second planarization layer is located in the display area, and the second planarization layer and the second organic part are arranged in the same layer.

5. The display panel according to claim 4, characterized in that: The dam further comprises at least one second metal portion, which is stacked on a side of the second organic portion close to the substrate, and the second organic portion covers a surface and a side wall of the at least one second metal portion which is away from the substrate; Preferably, the number of the second metal parts is plural; the dam further comprises at least one inorganic insulating part, and the inorganic insulating part is located between adjacent second metal parts; Preferably, the number of the second metal parts is 2.

6. The display panel according to claim 1, characterized in that: It also includes a second inorganic encapsulation layer, which is stacked on a side of the first inorganic encapsulation layer away from the substrate, and the orthographic projection of the second inorganic encapsulation layer on the substrate covers the orthographic projection of the first inorganic encapsulation layer on the substrate; or The second inorganic encapsulation layer is stacked on the side of the first inorganic encapsulation layer close to the substrate, and the second inorganic encapsulation layer includes a plurality of inorganic encapsulation parts; the display panel also includes a plurality of light-emitting devices, and the light-emitting devices are located in the display area. The light-emitting devices correspond to the inorganic encapsulation parts one by one, and the inorganic encapsulation parts cover the surface of the light-emitting device away from the substrate.

7. A method for preparing a display panel, characterized in that: The display panel has a display area, a hole area, and a transition area between the display area and the hole area; the preparation method comprises: A pixel circuit and a dam are prepared on a substrate, wherein the pixel circuit is located in the display area, and the dam is located in the transition area; the dam includes a first metal portion and a first organic portion that are arranged in contact with each other, and the first organic portion is located on a side of the first metal portion that is away from the substrate; A light-emitting device is prepared on a side of the pixel circuit away from the substrate, wherein the light-emitting device is connected to the pixel circuit; A packaging structure is prepared on the side of the light-emitting device away from the substrate to obtain the display panel; wherein the packaging structure includes a first inorganic packaging layer, and the first inorganic packaging layer is in contact with the first organic part.

8. The preparation method according to claim 7, characterized in that: Preparing pixel circuits and dams on a substrate includes: preparing a pixel circuit on a substrate; A first metal layer is prepared on a side of the pixel circuit away from the substrate, wherein the first metal layer includes an electrode connection line and the first metal portion, and the electrode connection line is located in the display area; A first organic layer is prepared on a side of the first metal layer facing away from the substrate, the first organic layer includes a first planarization layer and the first organic part, and the first planarization layer is located in the display area.

9. The preparation method according to claim 8, characterized in that: The dam further includes a second organic portion stacked on the first metal portion facing the substrate; after the step of preparing the pixel circuit on the substrate and before the step of preparing the first metal layer on the side of the pixel circuit away from the substrate, the method further includes: preparing a second organic layer on a side of the pixel circuit away from the substrate, the second organic layer comprising a second planarization layer and a second organic portion, and the second planarization layer is located in the display area; Preferably, the dam further comprises at least one second metal portion stacked on a side of the second organic portion close to the substrate, and the second organic portion covers a surface and a side wall of the at least one second metal portion facing away from the substrate; and the step of preparing the pixel circuit on the substrate comprises: Preparing a plurality of metal layers and a plurality of insulating layers on a substrate, wherein the insulating layers are disposed between adjacent metal layers, to obtain the pixel circuit and the at least one second metal portion; Preferably, the step of preparing a first metal layer on a side of the pixel circuit facing away from the substrate comprises: Prepare a composite metal material layer on the side of the pixel circuit away from the substrate, the composite metal material layer comprising a first metal material layer, a second metal material layer and a third metal material layer stacked in sequence in a direction away from the substrate; The composite metal material layer is patterned to obtain the electrode connecting line and the first metal part.

10. A display device, characterized in that: A display panel comprising any one of claims 1-6.

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