Display device
By setting a cover plate and a light-shielding pattern on the side of the display panel, combining the adhesive member and the cover window, the problem of light leakage of the organic light-emitting diode is solved, effective light closure is achieved, and cost and number of components are reduced.
Patent Information
- Application Number
- CN202410913550.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-07-07
- Filing Date
- 2024-07-08
- Publication Date
- 2025-01-07
AI Technical Summary
The light generated by the organic light emitting diode leaks through the side of the rigid substrate, causing light leakage, affecting the performance and cost of the display device.
By providing a cover plate and a light-shielding pattern on the sides of the display panel, light leakage is prevented, and by combining the adhesive member with the cover window, light leakage through the space between the side surface and the display panel is reduced, while light leakage is provided on the edge part. The member is to absorb and reflect leaked light.
It effectively prevents light leakage, reduces material costs, and simplifies the components of the display device, avoiding the need to install an additional shell on the outside of the display panel.
Smart Images

Figure CN119277909A_ABST
Abstract
Description
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] This application claims priority to Korean Patent Application No. 10-2023-0088158, filed on Jul. 7, 2023, which is hereby incorporated by reference in its entirety for all purposes. Technical Field
[0003] The present disclosure relates to a display device. Background Art
[0004] With the development of information society, various demands for display devices that display images have been increasing, and various types of display devices, such as liquid crystal display devices and organic light emitting display devices, have been used.
[0005] The display device includes a display panel, and the display panel may include a liquid crystal display panel or an organic light emitting display panel, etc., depending on the type of the display device.
[0006] Meanwhile, the organic light emitting display panel includes a substrate and an organic light emitting diode disposed on the substrate, and if the substrate is formed as a rigid substrate made of glass or quartz, light generated from the organic light emitting diode may leak through the side of the rigid substrate (side light leakage). Summary of the invention
[0007] An object of the present disclosure is to provide a display device capable of improving leakage of light generated from an organic light emitting diode through a side surface of a rigid substrate (side light leakage).
[0008] The problems of the present disclosure are not limited to the above-mentioned problems, and other technical problems can be inferred from the embodiments disclosed below.
[0009] One embodiment is a display device including: a display panel; and a board including a lower surface portion disposed on a lower surface of the display panel and a side portion connected to the lower surface portion and disposed on a side of the display panel, and the side portion can be disposed on at least three sides of the display panel.
[0010] Another embodiment is a display device, comprising: an organic light-emitting display panel, including a rigid substrate and a light-emitting diode layer located on the rigid substrate; and a board, including a lower surface portion arranged on the lower surface of the organic light-emitting display panel and a side portion connected to the lower surface portion and arranged on a side of the display panel, and light generated from the light-emitting diode layer may leak through the side of the rigid substrate, and the side portion can be configured to cover the side of the rigid substrate.
[0011] Additional details of the embodiments are included in the detailed description and accompanying drawings.
[0012] According to the embodiment, a light leakage phenomenon of a rigid substrate of a display device can be prevented.
[0013] In addition, since the display device can prevent light leakage by extending a plate used for heat dissipation or strength enhancement in the related art to the side of the display panel without providing a separate housing outside the display panel, component parts and material costs can be reduced.
[0014] In addition, by using a rigid substrate as the lower substrate of the display panel, it is helpful to reduce material costs.
[0015] Furthermore, a light leakage phenomenon in a display panel in which a side portion of a plate configured to support a lower portion of the display panel is not provided can be prevented by separately providing a light leakage preventing member at an edge portion.
[0016] Furthermore, since the light leakage preventing member includes a material having a high thermal expansion coefficient compared with that of the board, wrinkling of the board can be prevented by buffering thermal deformation of the board.
[0017] Furthermore, light may be prevented from leaking through a spacing space between the display panel and the second portion of the side part by applying the first light shielding pattern in the non-display region of the cover window.
[0018] In addition, light leaking from the side surface of the display panel may be absorbed by providing a second light shielding pattern on the inner side surface of the side surface portion.
[0019] In addition, light may be prevented from leaking through a spacing space between the second portion of the side part and the display panel by a third light shielding pattern between a third adhesive member configured to couple the cover window and the display panel to each other and the side part.
[0020] Furthermore, since the second side surface portion of the side surface located at the upper side of the display panel extends more toward the side surface portions located at the left and right sides, light leakage at the edge portion can be prevented.
[0021] In addition, since a side surface portion is provided on one side of the display panel to which the flexible circuit film is attached and is provided between the flexible circuit films, light leakage at the side surface can be prevented and physical interference with the flexible circuit film can be minimized.
[0022] The effects of the present disclosure are not limited to the above-mentioned effects, and those skilled in the art may derive other effects not described herein from the following description of the embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 is a perspective view of a display device according to an embodiment.
[0024] Figure 2 It is a schematic diagram showing the Figure 1 Figure 2 is a diagram of the manufacturing process of the board.
[0025] Figure 3 is based on Figure 1 A plan view of a display device.
[0026] Figure 4 is along Figure 3 A cross-sectional view taken along line AA' in FIG.
[0027] Figure 5 is along Figure 3 A cross-sectional view taken along line BB' in FIG.
[0028] Figure 6 is along Figure 3 A cross-sectional view taken along line CC'.
[0029] Figure 7 is a cross-sectional view of a display panel according to an embodiment.
[0030] Figure 8 yes Figure 4 Magnified cross-sectional view of the Q1 region in FIG.
[0031] Fig. 9 is a cross-sectional view of a display device according to a comparative example.
[0032] Fig.10 is a perspective view of a display device according to another embodiment.
[0033] Fig.11 is based on Fig.10 A perspective view of a panel and a light leakage preventing member of a display device.
[0034] Fig.12 is based on Fig.10 A cross-sectional view of a display device.
[0035] Fig.13 is a cross-sectional view of a display device according to yet another embodiment.
[0036] Fig.14 is a cross-sectional view of a display device according to yet another embodiment.
[0037] Fig.15 yes Fig.13 Magnified cross-sectional view of the Q2 region in FIG.
[0038] Fig.16 is a cross-sectional view of a display device according to yet another embodiment.
[0039] Fig.17 is a cross-sectional view of a display device according to yet another embodiment.
[0040] Fig.18 yes Fig.16 Magnified cross-sectional view of the Q3 region in FIG.
[0041] Fig.19 is a cross-sectional view of a display device according to yet another embodiment.
[0042] Fig. 20 is a perspective view of a panel according to yet another embodiment.
[0043] Fig.21 yes Fig. 20 A magnified perspective view of the Q4 region in FIG.
[0044] Fig. 22 is a plan view of a display device according to still another embodiment.
[0045] Fig.23 is along Fig. 22 A cross-sectional view taken along line D-D' in FIG. DETAILED DESCRIPTION
[0046] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In this specification, when a component (or region, layer, part, etc.) is referred to as being "on", "connected to" or "coupled to" another component, this means that the component may be directly on, connected to or coupled to another component, or a third component may exist therebetween.
[0047] The same reference numerals refer to the same elements. In addition, in the drawings, the thickness, proportion and size of the components are exaggerated for effective description. "And / or" includes all of one or more combinations defined by the relevant components.
[0048] It should be understood that the terms "first" and "second" are used herein to describe various components, but these components should not be limited by these terms. The above terms are only used to distinguish one component from another component. For example, a first component can be called a second component, and vice versa, without departing from the scope of the present disclosure. Unless the context clearly dictates otherwise, a singular expression includes a plural expression.
[0049] In addition, terms such as "below", "lower side", "upper", and "upper side" are used to describe the relationship between the configurations shown in the drawings. These terms are described as relative concepts based on the directions shown in the drawings.
[0050] In various embodiments of the present invention, the terms "includes", "comprising", "containing" or "having" specify characteristics, fixed numbers, steps, processes, elements and / or parts or combinations thereof, but do not exclude the existence or addition of other characteristics, fixed numbers, steps, process elements and / or parts or combinations thereof.
[0051] Figure 1 is a perspective view of a display device according to an embodiment.
[0052] Reference Figure 1 , the display device 1 may include a display panel 100, a board 200 located below the display panel 100, and a cover window 300 located above the display panel 100. The display panel 100 may be an organic light-emitting panel. In an embodiment, the first direction DR1 and the second direction DR2 are different directions and intersect each other. For example, the first direction DR1 and the second direction DR2 refer to directions that intersect perpendicularly in a plan view. The third direction DR3 is a direction that intersects with the plane where the first direction DR1 and the second direction DR2 are located. For example, the third direction DR3 is a direction that intersects perpendicularly with both the first direction DR1 and the second direction DR2. Figure 1 , the first direction DR1 indicates a direction in which the long side of the display panel 100 extends, the second direction DR2 indicates a direction in which the short side of the display panel 100 extends, and the third direction DR3 indicates a stacking direction of the board 200, the display panel 100, and the cover window 300. However, the directions mentioned in the exemplary embodiment should be understood as relative directions, and the exemplary embodiment is not limited to the mentioned directions.
[0053] For example, the display panel 100 may be in the form of a rectangle including long sides extending in the first direction DR1 and short sides extending in the second direction DR2. However, the shape of the display panel 100 is not limited thereto and may be a quadrilateral, a circle, an ellipse, or other polygons. Hereinafter, for ease of description, it will be assumed that the display panel 100 is in the form of a rectangle for description. The edges of the display panel 100 may include an angle or a circle.
[0054] A printed circuit film COF may be attached to the end of the other side of the display panel 100 in the second direction DR2. The end of the printed circuit film COF on one side in the second direction DR2 may be attached to the display panel 100. A data controller DIC may be mounted on the printed circuit film COF. The data controller DIC may be implemented in the form of a chip, but is not limited thereto, and may be formed on the printed circuit film COF in the form of a circuit. A source printed circuit board CPCB may be attached to the end of the other side of the printed circuit film COF in the second direction DR2. A plurality of printed circuit films COF may be provided, and the plurality of printed circuit films COF may be spaced apart from each other in the first direction DR1.
[0055] The plate 200 may be disposed below the display panel 100. The plate 200 may be disposed below the display panel 100 and support the display panel 100. The plate 200 may be used to dissipate the heat generated by the display panel 100 to the outside. Therefore, the plate 200 may include a metal material having excellent thermal conductivity. For example, the metal material may include aluminum, but is not limited thereto. In one embodiment, the plate 200 may be disposed not only below the display panel 100, but also on the side of the display panel 100, thereby preventing the light leakage from the side of the display panel 100 from leaking to the outside. The plate 200 may be disposed on at least three sides of the display panel 100. For example, the plate 200 may be disposed on the side of the long side of the display panel 100 in the second direction DR2 and on the side of one side and the other side of the short side in the first direction DR1. The anti-light leakage function of the plate 200 will be described in detail below.
[0056] The cover window 300 may be disposed on the display panel 100. The cover window 300 is disposed on the display panel 100 to protect the display panel 100. The cover window 300 may be made of a rigid material including glass or quartz or a plastic material. The cover window 300 may extend further outward than the side of the display panel 100. That is, the cover window 300 may completely cover the display panel 100.
[0057] The cover window 300 may be disposed on the display panel 100 by a third adhesive member AM3 disposed between the display panel 100 and the cover window 300. The third adhesive member AM3 may include an optically transparent resin (OCR) or an optically transparent adhesive (OCA). When light generated from the display panel 100 is displayed outside through the cover window 300, the third adhesive member AM3 does not deteriorate light transmittance because the third adhesive member AM3 includes a transparent resin (OCR) or an optically transparent adhesive (OCA).
[0058] Figure 2 It is a schematic diagram showing the Figure 1 Figure 2 is a diagram of the manufacturing process of the board.
[0059] Reference Figure 1 and Figure 2, the board 200 may include a lower surface portion 210 overlapping the display panel 100 and side portions 220, 230, and 240 extending from the lower surface portion 210. The lower surface portion 210 may be disposed on the lower surface of the display panel 100 and may cover the lower surface of the display panel 100, and each of the side portions 220, 230, and 240 may be disposed on a side of the display panel 100 and may cover a side of the display panel 100. In an embodiment, each of the side portions 220, 230, and 240 may be formed to surround a side of the display panel 100. The side portions 220, 230, and 240 may include: a first side portion 220 extending toward the other side of the lower surface portion 210 in the first direction DR1; a second side portion 230 extending toward one side of the lower surface portion 210 in the first direction DR1; and a third side portion 240 extending toward one side of the lower surface portion 210 in the second direction DR2. Each of the side portions 220, 230, and 240 may have a curved shape as described below. In an embodiment, the first side portion 220, the second side portion 230 and the third side portion 240 may be integrally formed with the lower surface portion 210 by bending a single plate (i.e., the plate 200). At the same time, the adjacent side portions 220, 230 and 240 may not be connected to each other and may be separated from each other. That is, each side portion 220, 230 and 240 may be connected to the lower surface portion 210, and the adjacent side portions 220, 230 and 240 may not be physically connected to each other. Since the adjacent side portions 220, 230 and 240 are not physically connected to each other, an empty space may be formed in the edge portion (the edge portion on the other side in the first direction DR1 and the edge portion on one side in the second direction DR2, the edge portion on one side in the first direction DR1 and the edge portion on one side in the second direction DR2). As in an embodiment, the adjacent side portions 220, 230 and 240 are not physically connected to each other, so the side portions 220, 230 and 240 can be easily formed. In more detail, as Figure 2As shown, each side portion 220, 230 and 240 may be bent into a U-shape from the unfolded state (see 2201, 2301, 2401). If an empty space is not formed in the edge portion of the lower surface portion 210 (the edge portion of the other side in the first direction DR1 and the edge portion of one side in the second direction DR2, the edge portion of one side in the first direction DR1 and the edge portion of one side in the second direction DR2) as in the embodiment, when each side portion 220, 230 and 240 is bent into a U-shape from the unfolded state (2201, 2301, 2401), the edge portion may be wrinkled and it may not be easy to manufacture the side portion. However, as in this embodiment, since adjacent side portions 220, 230 and 240 are not physically connected to each other, empty spaces are formed in edge portions of the lower surface portion 210 (edge portions on the other side in the first direction DR1, edge portions on one side in the second direction DR2, edge portions on one side in the first direction DR1, and edge portions on one side in the second direction DR2), and therefore, it is easier to manufacture the side portions 220, 230 and 240 bent into a U-shape.
[0060] Figure 3 is based on Figure 1 A plan view of a display device. Figure 4 is along Figure 3 A cross-sectional view taken along line AA' in FIG. Figure 5 is along Figure 3 A cross-sectional view taken along line BB' in FIG. Figure 6 is along Figure 3 A cross-sectional view taken along line CC'.
[0061] Reference Figure 1 and Figures 3 to 6, the display panel 100 may include side surfaces 100S3 and 100S4 located at the long sides and side surfaces 100S1 and 100S2 located at the short sides. The board 200 may include side surfaces 200S1, 200S2, 200S3, and 200S4 disposed adjacent to the side surfaces 100S3 and 100S4 located at the long sides of the display panel and the side surfaces 100S1 and 100S2 located at the short sides of the display panel, respectively. The side surfaces 100S1 and 100S2 located at the short sides of the display panel 100 may include a first panel side surface 100S1 disposed at one side in the first direction DR1 and a second panel side surface 100S2 disposed at the other side in the first direction DR1, and the side surfaces 100S3 and 100S4 located at the long sides of the display panel 100 may include a third panel side surface 100S3 disposed at one side in the second direction DR2 and a fourth panel side surface 100S4 disposed at the other side in the second direction DR2. The board 200 includes a lower surface portion 210 overlapping the display panel 100 and side portions 220, 230, and 240 extending outward from the lower surface portion 210, respectively. The side 200S1 of the first side portion 220 may be adjacent to the first panel side 100S1, the side 200S2 of the second side portion 230 may be adjacent to the second panel side 100S2, and the side 200S3 of the third side portion 240 may be adjacent to the third panel side 100S3. Each of the side 200S1 of the first side portion 220, the side 200S2 of the second side portion 230, and the side 200S3 of the third side portion 240 may extend outward more than the adjacent panel sides 100S1, 100S2, and 100S3. Therefore, the respective side surface parts 220 , 230 , and 240 may be disposed outside the panel side surfaces 100S1 , 100S2 , and 100S3 of the display panel 100 , and may cover the panel side surfaces 100S1 , 100S2 , and 100S3 , respectively.
[0062] like Figures 3 to 5As shown, the display device 1 may further include a polarization member POL disposed on the display panel 100, a first adhesive member AM1 disposed between the display panel 100 and the polarization member POL, and a second adhesive member AM2 disposed between the display panel 100 and the lower surface portion 210. The lower surface portion 210 may overlap with the first adhesive member AM1, the second adhesive member AM2, the polarization member POL, the third adhesive member AM3, and the cover window 300. The lower surface portion 210 may overlap with a portion of the first light shielding pattern BM. In addition, the side portions 220, 230, and 240 may overlap with the third adhesive member AM3, other portions of the first light shielding pattern BM, and the cover window 300. The first adhesive member AM1 may bond the display panel 100 and the polarization member POL to each other. The first adhesive member AM1 may include one of the above-mentioned materials of the third adhesive member AM3. The polarization member POL may be disposed above the display panel 100 and may reduce external light reflection. The polarization member POL is widely known in the art, and therefore, a detailed description thereof will be omitted.
[0063] The third bonding member AM3 between the polarization member POL and the cover window 300 may be used to bond the polarization member POL and the cover window 300 to each other. The first bonding member AM1 may be disposed in the display area DA and the non-display area NA, and on the other hand, the third bonding member AM3 may extend outward more than the first bonding member AM1. The cover window 300 may extend outward more than the sides 100S1, 100S2, 100S3, and 100S4 of the display panel 100. The first light shielding pattern BM may be disposed below the cover window 300. The first light shielding pattern BM may be directly printed on the bottom surface of the cover window 300. The first light shielding pattern BM may include a light shielding material. For example, the light shielding material may include a light absorbing material. The light absorbing material may include a black pigment or a black dye, but is not limited thereto.
[0064] The first light blocking pattern BM may be disposed on a portion of the non-display area NA and the cover window 300 that extends more outward than the side surfaces 100S1, 100S2, 100S3, and 100S4 of the display panel 100. In the portion that extends more outward than the side surfaces 100S1, 100S2, 100S3, and 100S4 of the display panel 100, the third adhesive member AM3 may be disposed between the first light blocking member BM and each of the side portions 220, 230, and 240 to bond the third adhesive member AM3 to the side portions 220, 230, and 240, respectively, and in the display area DA, the third adhesive member AM3 may bond the cover window 300 and the polarization member POL to each other. As described below, the side portions 220 to 240 may include a second portion (see 220b of the first side portion 220), and the second portion may be bonded to the third adhesive member AM3.
[0065] The first light blocking pattern BM may overlap the lower surface part 210, the side parts 220, 230 and 240, the adhesive members AM1, AM2 and AM3, the non-display area NA of the display panel 100, the cover window 300 and the polarization member POL. In addition, the first light blocking pattern BM may overlap the printed circuit film COF and the data controller DIC.
[0066] The second adhesive member AM2 may be disposed in the display area DA, and may bond the display panel 100 and the lower surface part 210 to each other.
[0067] like Figure 2 , Figure 3 and Figure 6 As shown, an empty space may be formed in edge portions of the lower surface portion 210 (edge portions on the other side in the first direction DR1 and on one side in the second direction DR2, edge portions on one side in the first direction DR1 and on one side in the second direction DR2). Therefore, in edge portions of the lower surface portion 210 (edge portions on the other side in the first direction DR1 and on one side in the second direction DR2, edge portions on one side in the first direction DR1 and on one side in the second direction DR2), the side (or edge portion) of the display panel 100 may be exposed to the outside. Figure 4 and Figure 5 Provided Figure 6 The description of the components (210, AM2, AM1, POL, AM3 and 300) of the display device 1 is not described, so their detailed description will be omitted.
[0068] Figure 7 is a cross-sectional view of a display panel according to an embodiment.
[0069] Reference Figure 7 , a thin film transistor TFT configured to drive the light emitting diode OLED may be provided in the display area AA on the substrate 101. The substrate 101 may be a rigid substrate including a rigid material. The rigid material may include glass or quartz. That is, the substrate 101 may be a transparent substrate. The refractive index of the substrate 101 may be about 1.5, but is not limited thereto. The transmittance of the substrate 101 including the rigid material may be higher than the transmittance of the substrate including the flexible material. The thickness of the substrate 101 including the rigid material may be greater than the thickness of the substrate including the flexible material. In one embodiment, the substrate 101 includes a rigid substrate having higher strength, so that compared with the above-mentioned substrate including the flexible material, the components provided on the upper portion may be better supported, and the material cost may be reduced.
[0070] A circuit layer CEL may be disposed on the substrate 101. The circuit layer CEL may include a buffer layer 105, a first insulating layer 110, a thin film transistor TFT, a gate driver GD, a low potential driving power line VSS, a second insulating layer 120, a touch electrode 105, a third insulating layer 135, a fourth insulating layer 145, a first intermediate layer 150, a connecting electrode 155, and a second intermediate layer 160.
[0071] The thin film transistor TFT may include a semiconductor layer 115, a gate 125, and a source and a drain 140. The thin film transistor TFT may be a driving transistor. For ease of description, among the various thin film transistors that may be included in the display device, only the driving transistor is shown, however, other types of thin film transistors, such as a switching transistor, etc., may be included in the display device. In addition, in the present disclosure, it is described that the thin film transistor TFT has a coplanar structure, but the thin film transistor TFT may be implemented as having other structures such as a staggered structure, but is not limited thereto.
[0072] like Figure 7 As shown, the thin film transistor TFT may include a semiconductor layer 115 disposed on a first insulating layer 110 , a gate electrode 125 overlapping the semiconductor layer 115 (with a second insulating layer 120 interposed therebetween), and a source electrode and a drain electrode 140 formed on a third insulating layer 135 and in contact with the semiconductor layer 115 .
[0073] The semiconductor layer 115 can be used as a region for forming a channel during the operation of the thin film transistor TFT, and the semiconductor layer 115 can be made of an oxide semiconductor, amorphous silicon (a-Si) or polycrystalline silicon (poly-Si), or can be made of various organic semiconductors such as pentacene. The present disclosure is not limited thereto. The semiconductor layer 115 can be formed on the first insulating layer 110. The semiconductor layer 115 may include a channel region, a source region, and a drain region. The channel region may overlap with the gate 125 (the first insulating layer 110 is interposed between the two), and may be formed between the source and drain 140. The source region may be electrically connected to the source 140 through a contact hole that penetrates the second insulating layer 120 and the third insulating layer 135. The drain region may be electrically connected to the drain 140 through a contact hole that penetrates the second insulating layer 120 and the third insulating layer 135. The buffer layer 105 and the first insulating layer 110 may be disposed between the semiconductor layer 115 and the substrate 101. The buffer layer 105 may delay diffusion of moisture and / or oxygen intruding into the substrate 101. The first insulating layer 110 may protect the semiconductor layer 115, and may block various types of defects introduced from the substrate 101.
[0074] The uppermost layer of the buffer layer 105 in contact with the first insulating layer 110 may be made of a material having an etching characteristic different from that of each of the remaining buffer layer 105, the first insulating layer 110, the second insulating layer, and the third insulating layer 135. The uppermost layer of the buffer layer 105 in contact with the first insulating layer 110 may be made of silicon nitride (SiN x ) and silicon oxide (SiO x ). Each of the remaining buffer layer 105, the first insulating layer 110, the second insulating layer 120 and the third insulating layer 135 may be made of silicon nitride (SiN x ) and silicon oxide (SiO x ) or the other of the two. For example, the uppermost layer of the buffer layer 105 in contact with the first insulating layer 110 may be made of silicon nitride (SiN x ), and each of the remaining buffer layer 105, the first insulating layer 110, the second insulating layer 120, and the third insulating layer 135 may be made of silicon oxide (SiO x ), but this embodiment is not limited to this.
[0075] The gate 125 may be formed on the second insulating layer 120 and may overlap with the channel region of the semiconductor layer 115 (with the second insulating layer 120 interposed therebetween). The gate 125 may be made of a first conductive material implemented as a single layer or multiple layers made of magnesium (Mg), molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of the foregoing metals, but the present disclosure is not limited thereto.
[0076] The source electrode 140 may be connected to a source region of the semiconductor layer 115 exposed through a contact hole penetrating the second insulating layer 120 and the third insulating layer 135. The drain electrode 140 may be opposite to the source electrode 140 and may be connected to a drain region of the semiconductor layer 115 through a contact hole penetrating the second insulating layer 120 and the third insulating layer 135. Each of the source and drain electrodes 140 may be made of a second conductive material implemented as a single layer or multiple layers made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or an alloy of the foregoing metals, but the present disclosure is not limited thereto.
[0077] The connection electrode 155 may be disposed between the first intermediate layer 150 and the second intermediate layer 160. The connection electrode 155 may be connected to the drain electrode 140 through a connection electrode contact hole 156 penetrating the protective layer 145 and the first intermediate layer 150. The connection electrode 155 may be made of a material having low resistivity and being the same as or similar to the drain electrode 140, but is not limited thereto.
[0078] A light emitting diode layer EL may be disposed on the circuit layer CEL. The light emitting diode layer EL may include an organic light emitting diode OLED. The light emitting diode layer EL may include the organic light emitting diode OLED and a bank layer 165.
[0079] An organic light emitting diode OLED including a light emitting layer 172 may be disposed over the second intermediate layer 160 and the bank layer 165. The organic light emitting diode OLED may include an anode 171, at least one light emitting layer 172 formed on the anode 171, and a cathode 173 formed on the light emitting layer 172.
[0080] The anode 171 may be disposed over the first intermediate layer 150 through a contact hole penetrating the second intermediate layer 160 , and may be electrically connected to the connection electrode 155 exposed to an upper portion of the second intermediate layer 160 .
[0081] The anode 171 of each pixel is not covered by the bank layer 165. The bank layer 165 may be made of an opaque material (e.g., black) to prevent light interference between adjacent pixels. In this case, the bank layer 165 may include a light shielding material including at least one of a colored pigment, organic black, and carbon black. The present disclosure is not limited thereto.
[0082] At least one light-emitting layer 172 may be formed on the anode 171 corresponding to the light-emitting region defined by the bank layer 165. At least one light-emitting layer 172 may include a hole transport layer, a hole injection layer, a hole blocking layer, a light-emitting layer 172, an electron injection layer, an electron blocking layer, and an electron transport layer on the anode 171, and these layers may be stacked in this order or in the opposite order according to the light-emitting direction. In addition, the light-emitting layer 172 may include a first light-emitting stack and a second light-emitting stack opposite to each other (with a charge generation layer interposed between the two). In this case, the light-emitting layer 172 of any one of the first light-emitting stack and the second light-emitting stack generates blue light, and the light-emitting layer 172 of the other of the first light-emitting stack and the second light-emitting stack generates yellow-green light, so that white light can be generated by the first light-emitting stack and the second light-emitting stack. The white light generated in the light-emitting stack is incident on a color filter located above or below the light-emitting layer 172 to realize a color image. As another example, the light-emitting layer 172 can generate light of a color corresponding to a single pixel without requiring a separate color filter to realize a color image. For example, the light emitting layer 172 of a red pixel may generate red light, the light emitting layer 172 of a green pixel may generate green light, and the light emitting layer 172 of a blue pixel may generate blue light.
[0083] The cathode 173 may be formed to be opposite to the anode 171 with the light emitting layer 172 interposed therebetween, and a high potential driving voltage EVDD may be applied thereto.
[0084] The encapsulation layer 180 prevents moisture or oxygen from invading the light emitting diode OLED which is susceptible to moisture or oxygen from the outside. To this end, the encapsulation layer 180 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer, but is not limited thereto. In the present disclosure, the structure of the encapsulation layer 180 in which the first encapsulation layer 181, the second encapsulation layer 182, and the third encapsulation layer 183 are sequentially stacked will be described as an example.
[0085] The first encapsulation layer 181 is formed above the substrate 101 on which the cathode 173 is formed. The third encapsulation layer 183 is formed above the substrate 101 on which the second encapsulation layer 182 is formed, and surrounds the top surface, the bottom surface, and the side surface of the second encapsulation layer 182 together with the first encapsulation layer 181. The first encapsulation layer 181 and the third encapsulation layer 183 can minimize or prevent external moisture or oxygen from intruding into the organic light emitting diode OLED. The first encapsulation layer 181 and the third encapsulation layer 183 are formed of an inorganic insulating material capable of low temperature deposition, such as silicon nitride SiN x 、Silicon Oxide SiO x The first encapsulation layer 181 and the third encapsulation layer 183 are deposited in a low temperature environment, thereby preventing the organic light emitting diode OLED, which is susceptible to a high temperature environment, from being damaged during the deposition process of the first encapsulation layer 181 and the third encapsulation layer 183 .
[0086] The second encapsulation layer 182 is used as a buffer layer, which reduces the stress between the layers caused by the bending of the display device and flattens the steps between the layers. The second encapsulation layer 182 can be formed on the substrate 101 on which the first encapsulation layer 181 is formed by acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin and polyethylene or non-photosensitive organic insulating material (such as silicon oxycarbide SiOC) or photosensitive organic insulating material (such as photopropylene), but is not limited thereto. When the second encapsulation layer 182 is formed using an inkjet method, a dam DAM can be set to prevent the liquefied second encapsulation layer 182 from diffusing to the edge of the substrate 101. The dam DAM can be set closer to the edge of the substrate 101 than the second encapsulation layer 182. The dam DAM can prevent the second encapsulation layer 182 from diffusing into the pad area where the conductive pad is set at the outermost periphery of the substrate 101.
[0087] The dam DAM is provided to prevent diffusion of the second encapsulation layer 182. However, when the second encapsulation layer 182 is formed to extend beyond the height of the dam DAM during the process, the second encapsulation layer 182 as an organic layer may be exposed to the outside, so that moisture and the like may easily intrude into the light emitting diode. Therefore, in order to prevent the intrusion of moisture and the like, at least ten or more dams DAM may be repeatedly formed.
[0088] The dam DAM may be disposed on the protective layer 145 of the non-display area NA.
[0089] In addition, the dam DAM may be formed simultaneously with the first intermediate layer 150 and the second intermediate layer 160. When the first intermediate layer 150 is formed, the lower layer of the dam DAM is formed together, and when the second intermediate layer 160 is formed, the upper layer of the dam DAM is formed together, so that the dam DAM may be stacked to have a double-layer structure.
[0090] Therefore, the dam DAM may be configured of the same material as the first and second intermediate layers 150 and 160 , but is not limited thereto.
[0091] The dam DAM may be formed to overlap the low potential driving power line VSS. For example, the low potential driving power line VSS may be formed on a lower layer of a region of the non-display area NA where the dam DAM is located.
[0092] The low potential drive power line VSS and the gate driver GD in the form of a gate in panel (GIP) can surround the periphery of the display panel. The low potential drive power line VSS can be located outside the gate driver GD. In addition, the low potential drive power line VSS can be connected to the anode 171 to apply a common voltage thereto. The gate driver GD is only shown in the plan view and the cross-sectional view. However, the gate driver GD can be configured using a thin film transistor TFT having the same structure as the thin film transistor TFT of the display area AA.
[0093] The low potential driving power line VSS is disposed outside the gate driver GD. The low potential driving power line VSS is disposed outside the gate driver GD and surrounds the display area DA. The low potential driving power line VSS may be made of the same material as the source and drain electrodes 140 of the thin film transistor TFT, but is not limited thereto. For example, the low potential driving power line VSS may be made of the same material as the gate electrode 125.
[0094] In addition, a low potential driving power line VSS may be electrically connected to the anode 171. The low potential driving power line VSS may supply a low potential driving voltage EVSS to a plurality of pixels in the display area AA.
[0095] The touch layer 190 may be disposed on the encapsulation layer 180. On the touch layer 190, a touch buffer layer 191 may be located between a touch sensor metal including touch electrode connection lines 192 and 194 and touch electrodes 195 and 196 and a cathode 173 of the organic light emitting diode OLED.
[0096] The touch buffer layer 191 can prevent chemical solutions (developers, etchants, etc.) used in the manufacturing process of the touch sensor metal arranged on the touch buffer layer 191 or external moisture from penetrating into the light emitting layer 172 including an organic material. Therefore, the touch buffer layer 191 can prevent the light emitting layer 172, which is susceptible to chemical solutions or moisture, from being damaged.
[0097] The touch buffer layer 191 is formed of an organic insulating material that can be formed at a low temperature below a predetermined temperature (e.g., 100 degrees Celsius) and has a low dielectric constant of 1 to 3 to prevent damage to the light emitting layer 172 including an organic material susceptible to high temperatures. For example, the touch buffer layer 191 may be formed of an acrylic-based, epoxy-based, or siloxane-based material. The touch buffer layer 191 made of an organic insulating material and having a planarization property may prevent damage to the encapsulation layer 180 due to warping of the organic light emitting display device and cracking of a touch sensor metal formed on the touch buffer layer 191.
[0098] According to a touch sensor structure based on mutual capacitance, the touch electrodes 195 and 196 may be disposed on the touch buffer layer 191 , and the touch electrodes 195 and 196 may be arranged to cross each other.
[0099] The touch electrode connection lines 192 and 194 may electrically connect the touch electrodes 195 and 196 to each other. The touch electrode connection lines 192 and 194 and the touch electrodes 195 and 196 may be located in different layers with the touch insulating layer 193 interposed therebetween.
[0100] The touch electrode connection lines 192 and 194 are disposed to overlap the bank layer 165 to prevent the aperture ratio from being reduced.
[0101] Meanwhile, since a portion of the touch electrode connection line 192 passes through the upper and side surfaces of the encapsulation layer 180 and the upper and side surfaces of the dam DAM, the touch electrodes 195 and 196 may be electrically connected to a touch driving circuit (not shown) through the touch pad 198 .
[0102] A portion of the touch electrode connection line 192 may receive a touch driving signal from a touch driving circuit and transmit it to the touch electrodes 195 and 196 , or may transmit a touch sensing signal from the touch electrodes 195 and 196 to the touch driving circuit.
[0103] A touch protection layer 197 may be provided on the touch electrodes 195 and 196. In the drawings, the touch protection layer 197 is shown to be arranged only on the touch electrodes 195 and 196, but is not limited thereto, and the touch protection layer 197 may extend to the front or back of the dam DAM, thereby being arranged on the touch electrode connection line 192.
[0104] In addition, a color filter (not shown) may be further disposed on the encapsulation layer 180 , and the color filter may be located on the touch layer 190 or between the encapsulation layer 180 and the touch layer 190 .
[0105] As reference Figures 3 to 5 As described above, the lower surface portion 210 may overlap with the display panel 100. Figure 7 Multiple components of the display panel 100 (all components stacked from the substrate 101 to the touch electrode 195) overlap.
[0106] Figure 8 yes Figure 4 An enlarged cross-sectional view of the Q1 region in FIG. Figure 8 , a substrate 101, a circuit layer CEL and a light emitting diode layer EL of a display panel 100 are shown. Figure 8 As shown, light L1a, L1b and L2a can be emitted from the light emitting layer of the organic light emitting diode OLED of the light emitting diode layer EL (see Figure 7 172). The first light L1a and L1b and the second light L2a of each pixel may include red light, green light or blue light. The first light L1a and L1b are lights configured to be emitted upward from the light emitting layer 172, and the second light L2a may be configured to be emitted downward. The first light L1a is emitted upward from the display area DA, and thus the first light L1a may travel to the outside through the polarization member POL and the cover window 300. The first light L1b is emitted upward from the non-display area NA, and thus the first light L1b may be absorbed by the first light shielding pattern BM located in the non-display area NA and may not propagate to the outside.
[0107] like Figure 8 As shown, a portion of the second light L2a may leak through the side of the substrate 101 (eg, the first panel side 100S1 of the display panel 100). Figure 8 Only the first panel side 100S1 and the first side portion 220 covering the first panel side 100S1 are shown, but it is obvious that the functions and structures of the second side portion 230 and the third side portion 240 covering the second panel side 100S2 and the third panel side 100S3 respectively are the same as those of the first side portion 220, which will be described below.
[0108] As described above, the substrate 101 is a rigid substrate including glass or quartz, and thus the light transmittance of the substrate 101 may be higher than that of a substrate including a flexible material. The thickness of the substrate 101 including a rigid material may be greater than that of a substrate including a flexible material. Therefore, compared with a flexible substrate, the ratio of the second light L2a leaking through the side of the substrate 101 may be very high. Hereinafter, the light of the second light L2a leaking through the side of the substrate 101 is referred to as third light L3a and L3b. The phenomenon of light leaking through the side of the substrate 101 may be referred to as light leakage.
[0109] The side surface portion 220 may be U-shaped. The first side surface portion 220 may include a first portion 220a connected to the lower surface portion 210, a second portion 220b opposite to the first portion 220a, and a third portion 220c connecting the first portion 220a and the second portion 220b to each other. Each of the first portion 220a and the second portion 220b may extend along the first direction DR1, and the third portion 220c may extend along the third direction DR3. In an embodiment, the first portion 220a, the second portion 220b, and the third portion 220c may be formed by bending the edge portion of the plate 200. More specifically, the angle between the first portion 220a and the second portion 220b and the angle between the second portion 220b and the third portion 220c may be 90°.
[0110] The first side surface portion 220 is disposed on the outer side of the first panel side surface 100S1 and covers the first panel side surface 100S1 on the side surface, and a portion L3a of the third light L3a and L3b leaking from the first panel side surface 100S1 (or the side surface of the first substrate 101) may be shielded by the first side surface portion 220 and may not leak to the outside of the display device 1. In the embodiment, "shielding" may be a concept including reflection or absorption.
[0111] In addition, another portion L3 b of the third light L3 a and L3 b may be shielded by the first light shielding pattern BM when traveling to the spacing space SR1 between the second portion 220 b and the first side surface part 100S1 of the display panel 100 .
[0112] As described above, according to one embodiment, the first side surface portion 220 is disposed outside the first panel side surface 100S1 and covers the first panel side surface 100S1 on the side surface, so a portion L3a of the third light L3a and L3b leaking from the first panel side surface 100S1 (or the side surface of the first substrate 101) is shielded by the first side surface portion 220 and does not leak to the outside of the display device 1. As described above, the panel (see Figure 4The board 200 is disposed below the display panel 100 and can be used to support the display panel 100 and dissipate the heat generated by the display panel 100 to the outside. In addition, the board 200 also includes a first side surface portion 220 extending outward from the side of the display panel 100 and formed integrally with the lower surface portion 210, so it is beneficial to prevent light leakage without adding any member for preventing light from leaking from the side of the first substrate 101, such as an additional housing. In addition, since no other member for preventing light leakage, such as an additional housing, is required, it has the effect of simplifying the components of the display device 1 and reducing the material cost.
[0113] Fig. 9 is a cross-sectional view of a display device according to a comparative example. Fig. 9 The board 200 and according to Figure 2 and Figure 8 The board 200 is different. Because according to Fig. 9 The board does not include Figure 2 and Figure 8 Sides 210 to 230 .
[0114] Reference Figure 8 and Fig. 9 ,according to Fig. 9 The plate includes only the lower surface portion 210, so there may be no component configured to cover the first panel side 100S1. Fig. 9 As shown, the third light L3 ′ leaking from the first panel side 100S1 (or the side of the first substrate 101 ) may leak to the outside of the display device 1 , causing a light leakage phenomenon.
[0115] However, according to the display device 1 of the embodiment, the first side portion 220 of the plate 200 is arranged on the outside of the first panel side 100S1 and covers the first panel side 100S1 on the side, and a portion L3a of the third light L3a and L3b leaked from the first panel side 100S1 (or the side of the first substrate 101) is shielded by the first side portion 220 and will not leak to the outside of the display device 1, thereby preventing light leakage from occurring.
[0116] Hereinafter, a display device according to another embodiment will be described. The same components as those of the above-described embodiment are referred to by the same reference numerals, and description thereof will be omitted or simplified.
[0117] Fig.10 is a perspective view of a display device according to another embodiment. Fig.11 is based on Fig.10 A perspective view of a panel and a light leakage preventing member of a display device. Fig.12 is based on Fig.10 A cross-sectional view of a display device.
[0118] Reference Figures 10 to 12 The display device 2 according to this embodiment is different from the display device 2 according to Figure 1 , Figure 2 and Figure 4 The display device 1 is different from the display device 1 in that the display device 2 according to the present embodiment may include a board 2001.
[0119] The board 2001 may further include a light leakage preventing member 250 disposed between the first side surface portion 220 and the third side surface portion 240 and between the second side surface portion 230 and the third side surface portion 240. That is, an empty space may be formed at a corner between the first side surface portion 220 and the third side surface portion 240 and between the second side surface portion 230 and the third side surface portion 240. The light leakage preventing member 250 may be disposed in an empty space formed in an edge portion (an edge portion at the other side in the first direction DR1 and one side in the second direction DR2, an edge portion at one side in the first direction DR1 and one side in the second direction DR2) of the lower surface portion 210. The light leakage preventing member 250 may be in direct contact with the adjacent side surfaces 220, 230, and 240.
[0120] Since the light leakage prevention member 250 is disposed in an empty space formed in an edge portion (an edge portion on the other side in the first direction DR1 and one side in the second direction DR2, an edge portion on one side in the first direction DR1 and one side in the second direction DR2) of the lower surface portion 210, the light leakage prevention member 250 can prevent leakage of light leaked from an edge portion (an edge portion on the other side in the first direction DR1 and one side in the second direction DR2, an edge portion on one side in the first direction DR1 and one side in the second direction DR2) of the display panel 100. To this end, the light leakage prevention member 250 may include a light shielding material. The light shielding material may include a light absorbing material.
[0121] Meanwhile, the thermal expansion coefficient of the light leakage preventing member 250 may be lower than each of the thermal expansion coefficients of the adjacent side portions 220, 230, and 240. For example, the thermal expansion coefficients of the adjacent side portions 220, 230, and 240 may be about 30 ppm / °C (parts per million). In the present disclosure, the unit of ppm / °C may represent a length (μm) that changes whenever the temperature increases by 1°C from 20°C.
[0122] The light leakage preventing member 250 may include a material having a thermal expansion coefficient lower than about 30 ppm / ° C. For example, the light leakage preventing member 250 may include rubber or resin, but is not limited thereto.
[0123] The thermal expansion coefficient of the light leakage preventing member 250 according to the present embodiment is lower than the thermal expansion coefficients of the adjacent side surface parts 220, 230 and 240. Fig.11As shown. Therefore, if the side parts 220, 230 and 240 are thermally expanded due to the heat from the display panel 100 and their lengths are changed, the light leakage prevention member 250 can slow down the length change. If the side parts 220, 230 and 240 are thermally expanded due to the heat from the display panel 100 and their lengths are changed, physical interference may occur between adjacent side parts 220, 230 and 240. However, the light leakage prevention member 250 is disposed between adjacent side parts 220, 230 and 240, and slows down the length change of the side parts 220, 230 and 240, thereby preventing physical interference between adjacent side parts 220, 230 and 240.
[0124] like Fig.12 As shown, the light leakage prevention member 250 may be in direct contact with the adhesive members AM1, AM2, and AM3, the lower surface part 210, the display panel 100, and the polarization member POL, but is not limited thereto.
[0125] Already referred to Figures 1 to 8 Descriptions about other components are provided, so their detailed descriptions will be omitted.
[0126] Fig.13 is a cross-sectional view of a display device according to yet another embodiment. Fig.14 is a cross-sectional view of a display device according to yet another embodiment. Fig.15 yes Fig.13 Enlarged cross-sectional view of the Q2 region.
[0127] Reference Figures 13 to 15 The display device 12 according to this embodiment is different from the display device 12 according to Figure 4 and Figure 5 The display device 1 is different from the display device 1 of the present embodiment because the display device 12 according to the present embodiment further includes a panel (see Figure 3 The upper surface of the first part 220a of the first side portion 220 of the optical fiber 200, the lower surface of the second part 220b, and the second light shielding pattern 260 arranged on the inner side surface of the third part 220c.
[0128] The second light shielding pattern 260 may be disposed on the inner side surface of the first side surface portion 220, the inner side surface of the second side surface portion 230, and the inner side surface of the third side surface portion 240. The side surface portions 220, 230, and 240 have the same shape, and the arrangement between the portions 220a, 220b, and 220c of the first side surface portion 220 and the second light shielding pattern 260 may be applied in the same manner to the arrangement between the second side surface portion 230 and the third side surface portion 240 and the light shielding pattern. Hereinafter, for ease of description, only the arrangement relationship between the first side surface portion 220 and the second light shielding pattern 260 will be described.
[0129] The second light-shielding pattern 260 may include at least one of the materials exemplified as the material of the first light-shielding pattern BM, but is not limited thereto if including a light-shielding material.
[0130] like Fig.15 As shown, a portion L3 a of the third light L3 a and L3 b leaking from the first panel side 100S1 (or the side of the first substrate 101 ) is shielded and absorbed by the second light shielding pattern 260 and does not leak to the outside of the display device 12 .
[0131] Already referred to Figure 4 and Figure 5 Descriptions of other components are provided, and detailed descriptions thereof will be omitted.
[0132] Fig.16 is a cross-sectional view of a display device according to yet another embodiment. Fig.17 is a cross-sectional view of a display device according to yet another embodiment. Fig.18 yes Fig.16 Magnified cross-sectional view of the Q3 region in FIG.
[0133] Reference Figures 16 to 18 The display device 13 according to this embodiment is different from the display device 13 according to Figures 13 to 15 The display device 12 of the present embodiment is different because the display device 13 according to the present embodiment further includes a third light blocking member 270 disposed between the side surface parts 220, 230, 240 and the third bonding member AM3.
[0134] The third light blocking member 270 may be disposed between each of the side surface parts 220, 230, and 240 and the third adhesive member AM3. The third light blocking member 270 may include one of the materials exemplified as the material of the first light blocking pattern BM, but is not limited thereto if including the light blocking material.
[0135] The third light blocking member 270 may also cover the spacing space SR1 between the second portion of each side surface part 220 , 230 , 240 (see the second portion 220 b of the first side surface part 220 ) and the panel side surfaces 100S1 , 100S2 , 100S4 of the display panel 100 .
[0136] like Fig.18 As shown, a portion L3a of the third light L3a and L3b leaking from the first panel side 100S1 (or the side of the first substrate 101) is shielded and absorbed by the third light blocking member 270 in the spacing space SR1 and does not leak to the outside of the display device 13.
[0137] Already referred to Figures 13 to 15 Descriptions of other components are provided, and detailed descriptions thereof will be omitted.
[0138] Fig.19 is a cross-sectional view of a display device according to yet another embodiment.
[0139] Reference Fig.19 The display device 14 according to this embodiment is different from the display device 14 according to Figure 4 and Figure 5 The display device 1 is different from the display device 1 of the present embodiment because the panel of the display device 14 according to the present embodiment (see Figure 3 The side surface of the cover window 200 is bonded to the cover window 300 by a double-sided tape DT.
[0140] Already referred to Figures 1 to 4 Descriptions of other components are provided, and detailed descriptions thereof will be omitted.
[0141] Fig. 20 is a perspective view of a panel according to yet another embodiment. Fig.21 yes Fig. 20 A magnified perspective view of the Q4 region in FIG.
[0142] Reference Fig. 20 and Fig.21 According to the present embodiment, the board 2002 is different from the board 2002 according to the embodiment. Figure 2 The board 200 of the embodiment is different in that the third side surface portion 2402 of the board 2002 according to the present embodiment extends more toward the adjacent first side surface portion 2202 and second side surface portion 2302 in the first direction DR1.
[0143] More specifically, the third side surface portion 2402 includes not only Figure 2 The third side surface portion 240 (hereinafter referred to as the third main side surface portion 240) described above may further include a fourth portion 241 and a fifth portion 242. The third main side surface portion 240 may have the same Figure 2 The fourth portion 241 and the fifth portion 242 may be portions of the third side portion 240 extending in one direction and another direction of the first direction DR1. That is, the number of each of the fourth portion 241 and the fifth portion 242 may be set to two. Each fourth portion 241 extends toward the first side portion 2202 and the second side portion 2302, respectively, and may overlap with the first side portion 2202 and the second side portion 2302, respectively. The fourth portion 241 may be in a strip shape, but is not limited thereto, and may be in a curved U shape identical to the third main side portion 240. The fifth portion 242 may connect the fourth portion 241 and the third main side portion 242 to each other. The width of the fourth portion 241 in the third direction DR3 may be less than the width of each of the third main side portion 240 and the fourth portion 241 in the third direction DR3. In a space where the fifth portion 242 is not provided, the fourth portion 241 and the third main side portion 240 may be spaced apart from each other in the first direction DR1 (see Fig.21 243).
[0144] At the same time, Figure 2 Each of the first side surface portion 2202 and the second side surface portion 2302 may extend more toward one side in the second direction DR2 than the first side surface portion 220 and the second side surface portion 230. Each of the ends of the first side surface portion 2202 and the second side surface portion 2302 extending more toward one side in the second direction DR2 may be spaced apart from the fourth portion 241 (with the second spacing space SR2 interposed therebetween).
[0145] The advantage of the board 2002 of the display device according to the present disclosure is that by forming the fourth portion 241 in the edge portion of the lower surface portion 210 (the edge portion on the other side in the first direction DR1 and the one side in the second direction DR2, the edge portion on one side in the first direction DR1 and the one side in the second direction DR2), and making each of the first side portion 2202 and the second side portion 2302 extend more toward the side in the second direction DR2, the light leakage phenomenon generated in the edge portion of the lower surface portion 210 (the edge portion on the other side in the first direction DR1 and the one side in the second direction DR2, the edge portion on one side in the first direction DR1 and the one side in the second direction DR2) is minimized.
[0146] Already referred to Figure 2 Descriptions about other components are provided, so their detailed descriptions will be omitted.
[0147] Fig. 22 is a plan view of a display device according to still another embodiment. Fig.23 is along Fig. 22 A cross-sectional view taken along line DD′.
[0148] Reference Fig. 22 and Fig.23 The display device 15 according to this embodiment is different from the display device 15 according to Figure 3 The display device 1 according to the present embodiment is different from the display device 1 in that the panel of the display device 15 according to the present embodiment further includes a protrusion PT on the long side of the lower surface part 210 at the other side in the second direction DR2.
[0149] The shape (U-shape) and arrangement of the protrusion PT are the same as those of the side parts 220 , 230 , and 240 , except that the protrusion PT is located on the other long side in the second direction DR2 , and therefore, a detailed description thereof will be omitted.
[0150] The protrusion PT may be disposed between adjacent printed circuit films COF. In addition, a plurality of protrusions PT may be provided. The printed circuit film COF may be disposed between adjacent protrusions PT.
[0151] The side surface 200S31 of the protrusion PT may be disposed outside in the first direction DR1 than the side surface of the other long side in the second direction DR2 of the lower surface portion of the protrusion PT where the protrusion PT is not formed. The side surface 200S31 of the protrusion PT may be disposed outside than the third panel side surface 100S3 of the display panel 100, and the protrusion PT may cover the third panel side surface 100S3 of the display panel 100.
[0152] According to this embodiment, by setting the protrusion PT between adjacent printed circuit films COF, no physical interference occurs with the printed circuit film COF, and since the protrusion PT on the other side in the second direction DR2 covers the third panel side 100S3 located on the long side of the lower surface portion 210, the light leakage phenomenon can be improved.
[0153] Already referred to Figure 3 Descriptions about other components are provided, so their detailed descriptions will be omitted.
[0154] From the above description of the embodiments with reference to the accompanying drawings, it can be understood by those skilled in the art to which the present invention belongs that the present invention can be implemented in other specific forms without changing the technical concept or basic features of the present invention. In this regard, the above embodiments should be understood as exemplary rather than limiting in all aspects. The scope of the present disclosure is indicated by the attached claims rather than the above detailed description. In addition, all changes or modifications derived from the meaning and scope of the attached claims and their equivalents are included in the scope of the present disclosure.
[0155] Reference numerals
[0156] 1: Display device
[0157] 100: Display panel
[0158] 200, 2001, 2002: Plate
[0159] 300: Cover window
[0160] AM1, AM2, AM3: Bonded components
[0161] COF: printed circuit film
[0162] CPCB: Source Printed Circuit Board
[0163] DIC: Data Driver
[0164] 210: Lower surface
[0165] 220, 2201, 2202: first side surface
[0166] 230, 2301, 2302: Second side surface
[0167] 240, 2401, 2402: third side face
[0168] 250: Anti-light leakage component
[0169] BM: First shading pattern
[0170] 260: Second shading pattern
[0171] 270: The third shading pattern
[0172] SR1: First Interval Space
[0173] SR2: Second space
Claims
1. A display device, comprising: Display panel; as well as a panel including a lower surface portion provided on a lower surface of the display panel and a side surface portion connected to the lower surface portion and provided on a side surface of the display panel, Wherein, the side surface portion is arranged on at least three side surfaces of the display panel.
2. The display device according to claim 1, wherein: The side surface portion includes a first portion extending from the lower surface portion, a second portion opposite to the first portion, and a third portion configured to connect the first portion and the second portion.
3. The display device according to claim 2, wherein: The second portion is spaced apart from the side of the display panel when viewed in a plan view.
4. The display device according to claim 3, further comprising a cover window, the cover window being disposed on the upper surface of the display panel and extending outward more than the side surface of the display panel, in, The second portion is attached to the cover window.
5. The display device according to claim 4, wherein: The display panel further includes: A display area, wherein a plurality of pixels are arranged in the display area; a non-display area located outside the display area; and The first light shielding pattern is configured to overlap the non-display area on the lower surface of the cover window.
6. The display device according to claim 5, further comprising an adhesive member disposed between the display panel and the cover window, in, The bonding member is configured to bond the second portion and the first light shielding pattern to each other. 7 . The display device according to claim 6 , further comprising a second light shielding pattern, the second light shielding pattern being disposed on an upper surface of the first portion, a lower surface of the second portion, and an inner side surface of the third portion.
8. The display device according to claim 7, further comprising a third light shielding pattern disposed between the second portion and the adhesive member, in, The third light shielding pattern is configured to overlap a spacing space between the second portion and the side surface of the display panel.
9. The display device according to claim 4, further comprising a double-sided tape between the second portion and the cover window, in, The second portion is attached to the cover window by the double-sided tape.
10. The display device according to claim 2, wherein: The side surface portion comprises: A first side surface portion, disposed on a first side surface of the display panel; and a second side surface portion, disposed on a second side surface of the display panel adjacent to the first side surface, and The side surface portion further includes a light leakage preventing member configured to contact each of the first side surface and the second side surface.
11. The display device according to claim 10, wherein: The light leakage preventing member has a thermal expansion coefficient lower than that of the board.
12. The display device according to claim 11, wherein: The light leakage preventing member includes rubber or resin.
13. The display device according to claim 10, wherein: The second side surface portion further includes a fourth portion provided on the first side surface portion and a fifth portion configured to connect the third portion and the fourth portion to each other, and Wherein, a second spacing space is formed between the fourth part and the third part.
14. The display device according to claim 13, wherein: A third spacing space is formed between the fourth portion and the first side portion.
15. The display device according to claim 1, further comprising a flexible circuit film attached to one side of the display panel, in, The side surface portion is provided on a side surface of the display panel other than the one side surface.
16. The display device according to claim 1, further comprising a flexible circuit film attached to one side of the display panel, in, The side surface portion is disposed on a side surface of the display panel including the one side surface.
17. The display device according to claim 16, wherein: A plurality of the flexible circuit films are provided, and The side surface portion disposed on the one side surface is disposed between a plurality of the flexible circuit films adjacent to each other.
18. The display device according to claim 17, wherein: The side surface portion provided on the one side surface is not configured to overlap with the flexible circuit film.
19. A display device comprising: An organic light emitting display panel comprises a rigid substrate and a light emitting diode layer located on the rigid substrate; as well as a board including a lower surface portion disposed on a lower surface of the organic light emitting display panel and a side surface portion connected to the lower surface portion and disposed on a side surface of the display panel, and Wherein, the side surface portion is configured to cover a side surface of the rigid substrate.
20. The display device according to claim 19, wherein: The rigid substrate comprises glass or quartz.
21. A display device, comprising: The display panel comprises a transparent substrate and a light emitting diode layer located on the transparent substrate; as well as a panel disposed below the display panel and including a lower surface portion disposed on a lower surface of the display panel and side surface portions extending from the lower surface portion and respectively surrounding side surfaces of the display panel, Wherein, the side surface portion surrounds at least three side surfaces of the display panel.
22. The display device according to claim 21, wherein: The side surface part is formed by bending an edge portion of the plate into a U-shape surrounding a side surface of the display panel.
23. The display device according to claim 22, wherein: Each of the side surface portions includes a first portion extending from the lower surface portion, a second portion opposite to the first portion, and a third portion configured to connect the first portion and the second portion.
24. The display device according to claim 23, wherein: The second portion is spaced apart from the side surface of the display panel.
25. The display device according to claim 21, wherein: The side surface portion comprises: A first side surface portion, disposed on a first side surface of the display panel; and a second side surface portion, disposed on a second side surface of the display panel adjacent to the first side surface, and Wherein, the side surface portion further includes a light leakage prevention member disposed at a corner portion between the first side surface and the second side surface.
26. The display device according to claim 21, wherein: The transparent substrate includes glass or quartz.
Citation Information
Patent Citations
Grain processing food of jelly type and manufacturing method thereof
KR1020230088158A