Wafer spin-coating device and spin-coating method

Abstract

The invention belongs to the technical field of wafer processing, and particularly relates to a wafer spin-coating device and a spin-coating method. The wafer spin-coating device comprises a supporting structure, a rotation driving structure, a wafer fixing structure arranged on the supporting structure, a mounting seat arranged above the supporting structure, a movement driving mechanism for driving the mounting seat to move, a glue conveying structure and a solvent conveying structure, and a glue pipe of the glue conveying structure and a solvent pipe of the solvent conveying structure are respectively fixed on the mounting seat. The wafer spin-coating method comprises the following steps: carrying a wafer to a supporting structure; the glue conveying structure sprays glue to the middle part of the wafer, and rotary gluing is carried out; and the solvent conveying structure sprays a solvent to the edge part of the wafer to dissolve the glue on the edge part of the wafer. And after rotary gluing, the solvent conveying structure sprays the solvent to dissolve the glue at the edge part of the wafer, so that the problem that the two-dimensional code of the existing wafer is difficult to read due to the shielding of the glue is solved, the productivity can be improved, and the wafer is prevented from being damaged.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer processing, and in particular relates to a wafer spin coating device and a spin coating method. Background Art

[0002] Currently, a QR code is set on the surface of the wafer to record the relevant information of the wafer. In the subsequent coating, marking, cutting and other processes, the relevant information of the wafer can be obtained by scanning the code. Since the QR code is set directly on the surface of the wafer, and glue needs to be applied on the surface of the wafer before subsequent processing, it is easy for the QR code to be partially or completely blocked, making it difficult to read the QR code. In this way, manual cleaning is required, resulting in reduced production capacity and easy damage to the wafer. Summary of the invention

[0003] The object of the present invention is to provide a wafer spin coating device and a spin coating method, aiming to solve the problem that the two-dimensional code of the existing wafer is difficult to read due to glue blocking, which can improve the production capacity and avoid damage to the wafer.

[0004] The present invention discloses a wafer spin coating device, which includes a supporting structure, a rotating driving structure for driving the supporting structure to rotate, a wafer fixing structure arranged on the supporting structure, a mounting seat arranged above the supporting structure, and a moving driving mechanism for driving the mounting seat to move. The device also includes a glue delivery structure and a solvent delivery structure, wherein the glue hose of the glue delivery structure and the solvent hose of the solvent delivery structure are respectively fixed to the mounting seat.

[0005] As an improvement, the glue delivery structure includes a glue hose fixed to the mounting seat, a glue tank and a glue suction pump, and the glue hose is connected to the outlet of the glue suction pump.

[0006] As an improvement, the rubber hose is arranged vertically.

[0007] As an improvement, the solvent delivery structure includes a solvent tube fixed to the mounting seat, a solvent box and a solvent suction pump, and the solvent tube is connected to the outlet of the solvent suction pump.

[0008] As an improvement, the solvent tube includes a main tube body arranged vertically and an inclined tube connected to the lower end of the main tube body, and the inclined tube extends obliquely toward the outer peripheral side of the support structure.

[0009] As an improvement, the support structure is configured as a circular disk body, the circular disk body is provided with a closed air cavity, and a plurality of suction holes connected to the closed air cavity are provided on the upper side of the circular disk body, and the plurality of suction holes form the wafer fixing structure.

[0010] As an improvement, the mobile drive mechanism includes a spray translation drive mechanism and a spray lifting drive mechanism fixedly mounted on the output part of the spray translation drive mechanism, and the mounting seat is fixed on the output part of the spray lifting drive mechanism; or, the mobile drive mechanism is configured as a manipulator, and the mounting seat is fixed on the manipulator.

[0011] The present invention also discloses a wafer spin coating method, based on the wafer spin coating device, comprising the following steps:

[0012] Step 1. Moving the wafer to the support structure, and fixing the wafer to the support structure by the wafer fixing structure;

[0013] Step 2. The glue delivery structure moves to the middle of the wafer, sprays glue to the middle of the wafer, and the rotation drive structure drives the support structure and the wafer fixed to the support structure to rotate, and the glue is evenly dispersed on the surface of the wafer under the action of centrifugal force;

[0014] Step 3. The solvent delivery structure moves to the edge of the wafer, sprays the solvent to the edge of the wafer, and evenly disperses the solvent to the edge of the wafer under the action of centrifugal force to dissolve the glue on the edge of the wafer.

[0015] As an improvement, for step two, when spraying glue, the support structure and the wafer fixed to the support structure are in a stationary state, or the support structure and the wafer fixed to the support structure have a low initial rotation speed; after the glue delivery structure finishes spraying the glue, the rotating drive structure accelerates the support structure and the wafer fixed to the support structure to a high-speed glue spreading speed.

[0016] As an improvement, for step three, after the glue is evenly applied, the rotation speed of the support structure and the wafer fixed to the support structure is reduced, and the solvent is sprayed toward the edge of the wafer; after the solvent is sprayed, the support structure and the wafer fixed to the support structure are driven by the rotating drive structure to accelerate the rotation, and are accelerated to a volatilization speed to volatilize the solvent.

[0017] Due to the adoption of the above-mentioned technical scheme, the wafer spin coating device of the present invention includes a supporting structure, a rotating driving structure for driving the supporting structure to rotate, a wafer fixing structure arranged on the supporting structure, a mounting seat arranged above the supporting structure, and a moving driving mechanism for driving the mounting seat to move. It also includes a glue delivery structure and a solvent delivery structure. The glue hose of the glue delivery structure and the solvent hose of the solvent delivery structure are respectively fixed to the mounting seat.

[0018] The wafer spin coating method of the present invention comprises the following steps:

[0019] Step 1. The wafer is transported to the support structure, and the wafer fixing structure fixes the wafer to the support structure;

[0020] Step 2. The glue hose of the glue delivery structure moves to the middle of the wafer, sprays glue to the middle of the wafer, and the rotation drive structure drives the support structure and the wafer fixed to the support structure to rotate, and the glue is evenly dispersed on the surface of the wafer under the action of centrifugal force;

[0021] Step 3. The solvent pipe of the solvent delivery structure moves to the edge of the wafer, sprays the solvent to the edge of the wafer, and evenly disperses the solvent to the edge of the wafer under the action of centrifugal force to dissolve the glue on the edge of the wafer.

[0022] Since the QR code is set at the edge of the wafer, when applying glue, the glue will spread to the edge of the wafer and block the QR code; after applying glue, the solvent tube of the solvent delivery structure moves to the edge of the wafer to spray solvent, and under the action of centrifugal force, the solvent is evenly dispersed to the edge of the wafer to dissolve the glue at the edge of the wafer, thereby avoiding glue blocking the QR code, facilitating reading of the QR code, and eliminating the need to manually remove the wafer for manual cleaning. This solves the problem of the existing wafer's QR code being difficult to read due to glue blocking, thereby improving production capacity and avoiding damage to the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 2 is a schematic structural diagram of a wafer spin coating device in a glue coating state according to an embodiment of the present invention;

[0024] Figure 2 is a structural schematic diagram of a spraying solvent state of a wafer spin coating device according to an embodiment of the present invention;

[0025] Among them, 10, support structure; 20, rotating shaft; 30, mounting seat; 40, hose; 50, solvent tube; 51, tilt tube; 60, wafer; 70, QR code. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0027] Figure 1 and Figure 2 is a schematic structural diagram of a wafer spin coating device according to an embodiment of the present invention, wherein: Figure 1 A schematic structural diagram showing the coating state of a wafer spin coating device according to an embodiment of the present invention is shown. Figure 2 The schematic diagram of the structure of the wafer spin coating device in the embodiment of the present invention shows the spraying solvent state. For the convenience of description, only the part related to the present invention is shown in the figure.

[0028] It should be noted that, if the present invention involves directional indications (such as up, down, front, back, left, right, etc.), such directional indications are only used to explain the relative positional relationship between the components under a certain specific posture. If the specific posture changes, the directional indication will also change accordingly; if the present invention involves descriptions of "first", "second", etc., such descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features.

[0029] Depend on Figure 1 and Figure 2 It can be seen that the wafer spin coating device of the embodiment of the present invention includes a support structure 10, a rotating driving structure for driving the support structure 10 to rotate, a wafer fixing structure arranged on the support structure 10, a mounting seat 30 arranged above the support structure 10, and a moving driving mechanism (not shown in the figure) for driving the mounting seat 30 to move, and also includes a glue delivery structure and a solvent delivery structure. The glue hose 40 of the glue delivery structure and the solvent hose 50 of the solvent delivery structure are respectively fixedly installed on the mounting seat 30.

[0030] During operation, the wafer 60 is transported to the support structure 10, and the wafer fixing structure fixes the wafer 60 to the support structure 10, and then the glue conveying structure sprays glue to the middle of the wafer 60, and the rotation driving structure drives the support structure 10 and the wafer 60 fixed to the support structure 10 to rotate, and the glue is evenly dispersed on the surface of the wafer 60 under the action of centrifugal force. Since the two-dimensional code 70 is set at the edge of the wafer 60, when applying the glue, the glue will be dispersed to the edge of the wafer 60 to block the two-dimensional code 70; after applying the glue, the solvent conveying structure moves to the edge of the wafer 60 to spray the solvent, and under the action of centrifugal force, the solvent is evenly dispersed to the edge of the wafer 60 to dissolve the glue on the edge of the wafer 60, so as to avoid the glue blocking the two-dimensional code 70, and facilitate the reading of the two-dimensional code 70. There is no need to manually take out the wafer 60 for manual cleaning, which solves the problem that the two-dimensional code of the existing wafer is difficult to read due to the blocking of glue, can improve production capacity, and avoid damage to the wafer 60.

[0031] In the embodiment of the present invention, in order to facilitate spraying the glue to the middle of the wafer 60 , the glue hose 40 is arranged vertically.

[0032] Specifically, the glue delivery structure further includes a glue box and a glue suction pump for sucking glue from the glue box, and the glue hose 40 is connected to the outlet of the glue suction pump.

[0033] The solvent delivery structure also includes a solvent box and a solvent suction pump for sucking the solvent in the solvent box, and the solvent pipe 50 is connected to the outlet of the solvent suction pump. Usually, the solvent pipe 50 includes a main body arranged vertically and an inclined pipe 51 connected to the lower end of the main body, and the inclined pipe 51 extends obliquely toward the outer peripheral side of the support structure 10. When the solvent is sprayed, since the inclined pipe 51 is arranged obliquely, it is convenient for the sprayed solvent to flow to the edge of the wafer 60, and the glue at the edge of the wafer 60 corresponding to the two-dimensional code can be accurately dissolved, and the glue outside the edge of the wafer 60 will not be dissolved, so as to avoid adverse effects on the subsequent processing of the wafer 60.

[0034] Usually, solenoid valves are connected in series to the rubber hose 40 and the solvent hose 50 respectively, for controlling the on-off and outflow amount.

[0035] The mobile drive mechanism includes a spray translation drive mechanism and a spray lifting drive mechanism fixedly installed on the output part of the spray translation drive mechanism. The mounting seat 30 is fixed on the output part of the spray lifting drive mechanism. The spray translation drive mechanism and the spray lifting drive mechanism are electric cylinders. Of course, the mobile drive mechanism can also be set as a manipulator.

[0036] In some other embodiments, a mobile driving structure is provided corresponding to the glue delivery structure and the solvent delivery structure respectively, and the glue delivery structure and the solvent delivery structure can move freely without interfering with each other.

[0037] In an embodiment of the present invention, the support structure 10 is configured as a circular disk body, the circular disk body is provided with a closed air cavity, and a plurality of suction holes connected to the closed air cavity are provided on the upper side of the circular disk body, and the plurality of suction holes form a wafer fixing structure; after the wafer 60 is placed on the circular disk body, the plurality of suction holes can adsorb the wafer 60 to the circular disk body to prevent the position of the wafer 60 from changing during rotation.

[0038] Specifically, the circular disk body includes a lower plate body, on the upper side of which a lower plate body groove is provided; an upper plate body that is buckled on the upper side of the lower plate body, on the lower side of the upper plate body a upper plate body groove corresponding to the lower plate body groove is provided, a closed air cavity is formed between the lower plate body groove and the upper plate body groove, a connecting hole that is connected to the lower plate body groove is provided on one side edge of the lower plate body, and the connecting hole is connected to an air pump; and a sealing ring body is arranged between the upper plate body and the lower plate body to prevent air leakage in the closed air cavity.

[0039] In some other embodiments, the wafer fixing structure includes at least two groups of clamping mechanisms arranged at intervals along the circumferential direction, each group of clamping mechanisms includes a clamping drive mechanism, a clamping block fixedly mounted on the output of the clamping drive mechanism, and a contoured clamping surface is provided on the clamping block to facilitate matching with the wafer 60. Usually, the clamping drive mechanism is configured as a cylinder, and there are two groups of clamping mechanisms, which are arranged opposite to each other.

[0040] In the embodiment of the present invention, the rotation driving structure includes a rotating shaft 20 and a rotation power mechanism for driving the rotating shaft 20 to rotate, such as a motor, a hydraulic motor, etc.; the support structure 10 is fixed to the upper end of the rotating shaft 20 .

[0041] In an embodiment of the present invention, the wafer spin coating device further includes an electric control module, and the rotation drive structure, the glue delivery structure, and the solvent delivery structure are electrically connected to the electric control module respectively. Of course, if the wafer spin coating device of the embodiment of the present invention is applied to an automated production line, the electric control module of the wafer spin coating device is the electric control module of the automated production line.

[0042] Specifically, the electric control module is a well-known structure in the field of automation equipment, and its specific structure will not be described in detail here.

[0043] The present invention also discloses a wafer spin coating method, comprising the following steps:

[0044] Step 1. The wafer 60 is transported to the support structure 10, and the wafer fixing structure fixes the wafer 60 to the support structure 10;

[0045] Step 2. The glue hose 40 of the glue delivery structure moves to the middle of the wafer 60, sprays glue to the middle of the wafer 60, and the support structure 10 and the wafer 60 fixed to the support structure 10 are driven by the rotation drive structure to rotate, and the glue is evenly dispersed on the surface of the wafer 60 under the action of centrifugal force;

[0046] Step 3. The solvent pipe 50 of the solvent delivery structure moves to the edge of the wafer 60 and sprays the solvent to the edge of the wafer 60 . Under the action of centrifugal force, the solvent is evenly dispersed to the edge of the wafer 60 to dissolve the glue at the edge of the wafer 60 .

[0047] During operation, the wafer 60 is transported to the support structure 10, the wafer 60 is fixed by the wafer fixing structure, the glue hose 40 of the glue conveying structure sprays glue to the middle of the wafer 60, and the support structure 10 and the wafer 60 fixed to the support structure 10 are driven by the rotation driving structure to rotate, and the glue is evenly dispersed on the surface of the wafer 60 under the action of centrifugal force. During glue coating, the glue will be dispersed to the edge of the wafer 60 to block the two-dimensional code 70 located at the edge of the wafer 60; after glue coating, the solvent tube 50 of the solvent conveying structure moves to the edge of the wafer 60 to spray solvent, and under the action of centrifugal force, the solvent is evenly dispersed to the edge of the wafer 60 to dissolve the glue at the edge of the wafer 60, so as to avoid the glue blocking the two-dimensional code 70, and facilitate the reading of the two-dimensional code 70. There is no need to manually take out the wafer 60 for manual cleaning, which solves the problem that the two-dimensional code of the existing wafer is difficult to read due to the blocking of glue, can improve production capacity, and avoid damage to the wafer 60.

[0048] In an embodiment of the present invention, the transportation of the wafer 60 in step one is mainly achieved through a transportation structure, which is electrically connected to the electric control module and includes a transportation translation drive mechanism, a transportation lifting drive mechanism fixedly installed on the output part of the transportation translation drive mechanism, and a picking structure fixedly installed on the output part of the transportation lifting drive mechanism. Specifically, the picking structure is a suction structure, including at least one suction nozzle for sucking the wafer 60. Usually, the transportation translation drive mechanism and the transportation lifting drive mechanism are configured as electric cylinders.

[0049] Of course, the picking structure can also be fixed to the output part of the robot.

[0050] In an embodiment of the present invention, for step two, since the glue has viscosity, in order to be able to apply the glue more evenly to the surface of the wafer 60, when spraying the glue, the support structure 10 and the wafer 60 fixed to the support structure 10 are in a stationary state. After the glue conveying structure sprays the glue, the support structure 10 and the wafer 60 fixed to the support structure 10 are driven by the rotating drive structure to rotate, and accelerated to a high-speed glue spreading speed. Rotating at the glue spreading speed can evenly disperse the glue on the surface of the wafer 60.

[0051] Specifically, different glues have different viscosities, and their glue-spinning speeds are also different. Usually, the glue-spinning speed is between 1000r / min and 3000r / min.

[0052] For glue with relatively low viscosity, when the glue delivery structure sprays glue, the support structure 10 and the wafer 60 fixed to the support structure 10 have a low initial rotation speed, which can reduce the acceleration time and thus improve the glue coating efficiency. Usually, the initial rotation speed is between 50r / min-200r / min. After spraying the glue, the support structure 10 and the wafer 60 fixed to the support structure 10 are driven by the rotation drive structure to accelerate the rotation, which can improve the efficiency.

[0053] For step three, after the glue is evenly applied, the rotation speed of the support structure 10 and the wafer 60 fixed to the support structure 10 is reduced, and the solvent delivery structure moves to the edge of the wafer 60 to spray the solvent to the edge of the wafer 60; after the solvent is sprayed, the support structure 10 and the wafer 60 fixed to the support structure 10 are driven by the rotation drive structure to accelerate the rotation, and accelerate to a volatilization speed that evaporates the solvent. Usually, the volatilization speed is between 2000r / min-4000r / min. After the glue on the edge of the wafer 60 is dissolved, the solvent is evaporated by rotating the support structure 10 and the wafer 60 fixed to the support structure 10 to prevent residues from blocking the QR code 70.

[0054] The above descriptions are only some embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer spin coating device, characterized in that: It includes a supporting structure, a rotating driving structure for driving the supporting structure to rotate, a wafer fixing structure arranged on the supporting structure, a mounting seat arranged above the supporting structure, and a moving driving mechanism for driving the mounting seat to move. It also includes a glue delivery structure and a solvent delivery structure. The glue hose of the glue delivery structure and the solvent hose of the solvent delivery structure are respectively fixed to the mounting seat.

2. The wafer spin coating device according to claim 1, characterized in that: The glue conveying structure also includes a glue box and a glue suction pump, and the glue hose is connected to the outlet of the glue suction pump.

3. The wafer spin coating device according to claim 2, characterized in that: The rubber hose is arranged vertically.

4. The wafer spin coating device according to claim 1, characterized in that: The solvent delivery structure also includes a solvent box and a solvent suction pump, and the solvent pipe is connected to the outlet of the solvent suction pump.

5. The wafer spin coating device according to claim 4, characterized in that: The solvent pipe includes a main pipe body arranged in a vertical direction and an inclined pipe connected to a lower end of the main pipe body, and the inclined pipe extends obliquely toward the outer peripheral side of the supporting structure.

6. The wafer spin coating device according to any one of claims 1 to 5, characterized in that: The supporting structure is configured as a circular disk body, the circular disk body is provided with a closed air cavity, and a plurality of air suction holes communicating with the closed air cavity are provided on the upper side of the circular disk body, and the plurality of air suction holes form the wafer fixing structure.

7. The wafer spin coating device according to claim 1, characterized in that: The mobile drive mechanism includes a spray translation drive mechanism, a spray lifting drive mechanism fixedly mounted on the output part of the spray translation drive mechanism, and the mounting seat is fixed on the output part of the spray lifting drive mechanism; or, the mobile drive mechanism is configured as a manipulator, and the mounting seat is fixed on the manipulator.

8. A wafer spin coating method, characterized in that: The following steps are involved: Step 1. Moving the wafer to the support structure, and fixing the wafer to the support structure by the wafer fixing structure; Step 2. The glue hose of the glue delivery structure moves to the middle of the wafer, sprays glue to the middle of the wafer, and the support structure and the wafer fixed to the support structure are driven by the rotation drive structure to rotate, and the glue is evenly dispersed on the surface of the wafer under the action of centrifugal force; Step 3. The solvent pipe of the solvent delivery structure moves to the edge of the wafer, sprays the solvent to the edge of the wafer, and evenly disperses the solvent to the edge of the wafer under the action of centrifugal force to dissolve the glue on the edge of the wafer.

9. The wafer spin coating method according to claim 8, characterized in that: For step two, when spraying glue, the support structure and the wafer fixed to the support structure are in a stationary state, or the support structure and the wafer fixed to the support structure have a low initial rotation speed; after the glue delivery structure finishes spraying the glue, the support structure and the wafer fixed to the support structure are accelerated to a high-speed glue spreading speed by the rotating drive structure.

10. The wafer spin coating method according to claim 8, characterized in that: Regarding step three, after the coating is applied, the rotation speed of the support structure and the wafer fixed to the support structure is reduced, and then the solvent is sprayed toward the edge of the wafer; After the solvent is sprayed, the support structure and the wafer fixed to the support structure are driven by the rotation drive structure to accelerate the rotation and accelerate to a volatilization rotation speed for volatilizing the solvent.

Images