Piezoelectric injection valve

Abstract

The piezoelectric injection valve comprises a valve body and a fluid seat, a firing pin is arranged in the valve body, a fluid cavity and a flow channel connected with the fluid cavity are formed in the fluid seat, and the firing pin is suitable for impacting a nozzle installed on the fluid seat so that solder paste stored in the fluid cavity can be sprayed out of the nozzle; the firing pin comprises an impacting part and a connecting part, the connecting part is connected with the valve body to drive the impacting part to move relative to the nozzle, and the impacting part is suitable for making contact with the nozzle; when the impact part impacts the nozzle, the solder paste is sprayed out through the nozzle, and when the impact part is far away from the nozzle, the solder beads deposited in the nozzle are driven and dispersed into the solder paste. Solder paste flowing through the fluid seat can be disturbed through the disturbing part, so that tin beads contained in the solder paste in the fluid seat can be dispersed, the fluidity of the solder paste in the fluid seat is guaranteed, in addition, the tin beads deposited at the bottom of the fluid cavity can be mixed with the solder paste again through the impacting part of the firing pin, and the solder paste in the fluid seat can be uniformly mixed. Therefore, the uniformity of tin beads in the sprayed solder paste is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of piezoelectric valves, and in particular to a piezoelectric injection valve. Background Art

[0002] At present, Chinese invention patent application CN210357848U discloses a piezoelectric injection valve body flow channel module, including a piezoelectric valve body, a flow channel module, a positioning auxiliary block and a vertical striker, wherein the positioning auxiliary block and the vertical striker are fixed at the bottom of the piezoelectric valve body, the positioning auxiliary block is cylindrical in shape, a through hole is provided in the center of the positioning auxiliary block, and the vertical striker passes through the through hole in the center of the positioning auxiliary block. According to the above description of the vertical striker in the piezoelectric injection valve and referring to its attached drawings, it can be seen that since the vertical striker is inserted into the through hole in the center of the positioning auxiliary block, when the glue is applied through the vertical striker, the gap between the vertical striker and the through hole is too small, and when solder paste is injected and work is carried out, it is easy to cause undesirable conditions such as pulling tips and glue hanging when applying the material.

[0003] Moreover, when spraying solder paste, the striker (optical axis) of the above-mentioned existing piezoelectric injection valve will have the problem of deposition of tin beads in the solder paste, so the proportion of tin beads contained in the sprayed solder paste will be different, affecting the subsequent welding quality; in addition, when the tin beads are deposited in the nozzle, a large number of tin beads will be deformed when the striker hits the nozzle, thereby causing the nozzle micropores to be blocked.

[0004] In view of this, it is necessary to design a piezoelectric injection valve to solve the above problems. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0006] To this end, the present invention provides a piezoelectric injection valve that can achieve smooth glue supply and glue spraying of solder paste.

[0007] According to a first aspect of the present invention, a piezoelectric injection valve is provided, comprising a valve body and a fluid seat, wherein a striker is arranged in the valve body, a fluid cavity and a flow channel connected to the fluid cavity are opened in the fluid seat, and the striker is adapted to strike a nozzle mounted on the fluid seat, so that solder paste stored in the fluid cavity is ejected from the nozzle; The striker includes a striker portion and a connecting portion, wherein the connecting portion is connected to the valve body to drive the striker portion to move relative to the nozzle, and the striker portion is suitable for contacting the nozzle; When the impact part impacts the nozzle, the solder paste is ejected through the nozzle. When the impact part moves away from the nozzle, the solder beads deposited in the nozzle are driven and dispersed into the solder paste.

[0008] The beneficial effects of the present invention are as follows: the disturbing part of the striker can disturb the solder paste flowing through the fluid seat, so that the solder paste in the fluid seat and the solder beads contained therein can be dispersed into the fluid cavity, thereby ensuring the fluidity of the solder paste in the fluid seat; in addition, the up and down movement of the impact part of the striker can drive the solder beads deposited at the bottom of the fluid cavity to move synchronously, so that the solder beads deposited at the bottom of the fluid cavity are mixed with the solder paste again, thereby ensuring the uniformity of the solder beads in the sprayed solder paste.

[0009] Preferably, the striker further comprises a disturbing portion, wherein the disturbing portion is located between the impact portion and the connecting portion, and the disturbing portion is suitable for disturbing the solder paste stored in the fluid cavity.

[0010] Further preferably, the disturbance part comprises a first stirring part close to the connecting part and a second stirring part close to the impact part, and the first stirring part and the second stirring part are both arranged in the fluid cavity. And within the set distance H1, the distance L1 between the first stirring part and the cavity wall of the fluid cavity remains unchanged; Within the set distance H2 , the distance L2 between the second agitating portion and the cavity wall of the fluid cavity is less than L1 , and L2 gradually decreases toward the nozzle 21 .

[0011] Preferably, the disturbance part further comprises a third stirring part, and the third stirring part is arranged in the fluid cavity and located between the first stirring part and the second stirring part. Within the set distance H3, as the third agitating portion extends toward the nozzle, a distance L3 between the third agitating portion and the cavity wall of the fluid cavity gradually decreases, and L2<L3<L1.

[0012] Preferably, the disturbance portion includes a cylindrical body and a plurality of raised portions annularly distributed on the outer periphery of the cylindrical body, and the plurality of raised portions are arranged along the axial direction of the striker.

[0013] Further preferably, each layer of the raised portion includes a plurality of bumps, and the plurality of bumps are arranged at intervals.

[0014] Preferably, the plurality of bumps in two adjacent layers are arranged in a staggered manner or in an array.

[0015] Further preferably, each layer of the protrusions is in the form of annular steps arranged horizontally in an annular shape, and two adjacent layers of the annular steps are arranged at intervals.

[0016] Preferably, the plurality of raised portions are arranged in a spiral pattern.

[0017] Further preferably, the impact surface of the impact portion is planar.

[0018] Preferably, the nozzle is provided with a funnel-shaped storage groove, the funnel-shaped storage groove is communicated with the fluid cavity, and the impact end of the impact part is in a rounded shape and can contact the groove wall of the funnel-shaped storage groove.

[0019] Further preferably, a jet channel is provided in the nozzle, an inlet end of the jet channel is connected to the funnel-shaped storage tank, and an outlet end of the jet channel is suitable for spraying solder paste.

[0020] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0023] Figure 1 It is an overall assembly diagram of the piezoelectric injection valve of the present invention; Figure 2 is an overall cross-sectional view of the piezoelectric injection valve of the present invention; Figure 3 The first structural form of the disturbance part of the piezoelectric injection valve of the present invention; Figure 4 The second structural form of the disturbance part of the piezoelectric injection valve of the present invention; Figure 5 The third structural form of the disturbance part of the piezoelectric injection valve of the present invention; Figure 6 The fourth structural form of the disturbance part of the piezoelectric injection valve of the present invention; Figure 7 For the present invention Figure 2 A magnified view of point A; Figure 8 It is a cross-sectional view of the nozzle of the present invention.

[0024] Description of reference numerals: 1. valve body; 11. actuator; 111. actuating assembly; 112. lever; 113. swing member; 114. elastic member; 2. Fluid seat; 21. Nozzle; 211. Injection channel; 212. Groove wall; 213. Funnel-shaped storage groove; 22. Fluid cavity; 23. Sealing seat; 24. Screw sleeve; 3. striker; 31. connecting part; 32. disturbing part; 321. raised part; 3211. bump; 322. annular step; 323. first stirring part; 324. second stirring part; 325. third stirring part; 33. impact part; 331. rounded shape. DETAILED DESCRIPTION

[0025] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention. In the description of the present invention, it should be understood that, unless otherwise specified, the meaning of "multiple" is two or more.

[0026] See also Figure 1 to Figure 2 The present invention discloses a piezoelectric injection valve, which includes a valve body 1 and a fluid seat 2, wherein a fluid cavity 22 and a flow channel connected to the fluid cavity 22 are provided in the fluid seat 2, and a sealing member is provided between the fluid cavity 22 and the valve body 1, wherein a striker 3 is provided in the valve body 1, and the striker 3 can pass through the sealing member and extend into a nozzle 21 provided on the fluid seat 2, so that the solder paste stored in the fluid cavity 22 is ejected from the nozzle 21.

[0027] The valve body 1 is also provided with an actuator 11, which includes an actuator assembly 111, a lever 112 and a swinging member 113. The lower part of one end of the lever 112 is connected to the swinging member 113, and the upper part of one end of the lever 112 abuts against the actuator assembly 111. Meanwhile, the other end of the lever 112 abuts against the upper end surface of the striker 3, and an elastic member 114 is also sleeved at the abutment between the striker 3 and the lever 112. Therefore, the actuator assembly 111 applies pressure to the right end of the lever 112, and the pressure application point is on the left side of the swinging member 113. Thus, the movable displacement of the right end of the lever 112 caused by the force applied by the actuator assembly 111 to the right end of the lever 112 can be amplified at the left end of the lever 112, and at the same time, with the elastic reset of the elastic member 114, the striker 3 can be driven to move synchronously, and then the up and down displacement of the striker 3 can be conveniently adjusted by making a small displacement adjustment at the right end of the lever 112.

[0028] Specifically, the impact pin 3 includes an impact portion 33, a disturbance portion 32 and a connecting portion 31. The connecting portion 31 abuts against the lever 112 arranged in the valve body 1. The impact portion 33 is suitable for contacting the nozzle 21. The disturbance portion 32 is suitable for disturbing the solder paste stored in the fluid cavity 22. The impact portion 33 is suitable for driving the solder beads deposited at the bottom to be redispersed into the solder paste during the lifting process, and the solder paste is sprayed out through the nozzle 21 when the impact portion 33 collides with the groove wall 212 of the nozzle 21.

[0029] See also Figure 7In order to adapt the impact part 33 to the size of the nozzle 21, the diameter of the impact part 33 is set to be smaller than the diameter of the connecting part 31, and the nozzle 21 is provided with a funnel-shaped storage groove 213, and the angle of the funnel-shaped storage groove 213 is N° (N>0). The funnel-shaped storage groove 213 is connected to the fluid cavity 22, and the groove wall 212 of the funnel-shaped storage groove 213 is suitable for contacting the impact part 33. The impact end of the impact part 33 and the nozzle 21 is set to a rounded shape 331. The impact end of the impact part 33 is set by the rounded shape 331, so that after the impact part 33 contacts the nozzle 21, the rounded shape 331 of the impact part 33 can better contact the funnel-shaped nozzle 21 to form a closed surface, so as to ensure that the solder paste in the fluid cavity 22 will not leak into the nozzle 21. Due to the formation of the closed surface, a sealed compression cavity is formed between the impact part 33 and the nozzle 21, so as to achieve a better effect of spraying solder paste.

[0030] The impact surface of the impact part 33 is set to be a plane, and the solder paste can be better sprayed out from the nozzle 21 through the plane of the impact part 33 when it impacts the nozzle 21. At the same time, the plane setting allows a larger closed space between the impact part 33 and the nozzle 21. When the impact part 33 is lifted, a negative pressure can be generated between the plane impact surface and the nozzle 21. The negative pressure generated between the two can better drive the solder beads deposited in the nozzle 21 so that the solder beads are dispersed in the solder paste.

[0031] As the solder paste is injected, the pressure on the solder paste at the bottom of the fluid cavity 22 increases, and the inner diameter of the fluid cavity 22 at the nozzle 21 is smaller, and the shape of the fluid cavity 22 further increases the pressure on the solder paste between the nozzle 21 and the fluid cavity 22. When the striker 3 is lifted, the solder paste between the nozzle 21 and the fluid cavity 22 is quickly filled into the nozzle 21 under the pressure, and then moves toward the nozzle 21 with the striker 3 until the striker 3 contacts the inner cavity of the nozzle 21 again, and the solder paste flowing into the nozzle 21 is sprayed out from the nozzle 21 under the action of the striker 3. Therefore, the distance between the inner cavity of the fluid cavity 22 and the impact part 33 of the striker 3 is set larger, so that more solder paste flows into the fluid cavity 22, and more solder paste can exert a greater force on the solder paste at the bottom of the fluid cavity 22, so that the solder paste at the bottom of the fluid cavity 22 can quickly fill the internal flow channel of the nozzle 21 when the striker 3 is lifted, ensuring that the solder paste can quickly fill the nozzle 21 every time the striker 3 operates, so that the amount and uniformity of the sprayed solder paste remain stable.

[0032] In addition, since the density of solder paste is relatively large and it has a certain degree of ductility, when the disturbance part 32 moves up and down, it can drive the solder paste in the fluid cavity 22 to move synchronously in the vertical direction, thereby enabling the solder beads in the solder paste in the fluid cavity 22 to be dispersed to various places, and combined with the large-capacity fluid cavity 22 to improve the fluidity of the solder paste stored therein, so as to avoid the interval between the fluid cavity 22 and the disturbance part 32 being too small, resulting in the occurrence of undesirable conditions such as pulling tips and glue hanging on the ejected solder paste during the upward and downward movement of the striker 3.

[0033] Furthermore, a sealing seat 23 and a screw sleeve 24 are provided at the nozzle 21. The nozzle 21 is first installed into the sealing seat 23, and then screwed into the screw sleeve 24 and tightened to reach a fastened state with the screw sleeve 24. Then, the screw sleeve 24 is screwed into the locking thread opened on the fluid seat 2, so that the groove wall 212 (funnel-shaped) of the nozzle 21 can be in close contact with the impact end of the impact portion 33 of the striker 3, and at the same time, it is closely fitted with the inner cavity of the fluid cavity 22 of the fluid seat 2, so as to achieve the effect of sealing installation with the fluid cavity 22.

[0034] See also Figure 8 An injection channel 211 is also provided in the nozzle 21 , the inlet end of the injection channel 211 is connected to the funnel-shaped groove wall 212 , and the outlet end of the injection channel 211 is suitable for spraying solder paste.

[0035] See also Figure 7 The disturbance part 32 includes a first agitating part 323 near the connecting part 31 and a second agitating part 324 near the impact part 33. The first agitating part 323 and the second agitating part 324 are both arranged in the fluid cavity 22, and within the set distance H1, the distance L1 between the first agitating part 323 and the cavity wall of the fluid cavity 22 remains unchanged; within the set distance H2, the distance L2 between the second agitating part 324 and the cavity wall of the fluid cavity 22 is less than L1, and L2 gradually decreases toward the nozzle 21. The disturbance part 32 also includes a third agitating part 325, which is arranged in the fluid cavity 22 and located between the first agitating part 323 and the second agitating part 324. Within the set distance H3, as the third agitating part 325 extends toward the nozzle 21, the distance L3 between the third agitating part 325 and the cavity wall of the fluid cavity 22 gradually decreases, and L2<L3<L1.

[0036] See also Figures 3 to 6The disturbance part 32 has at least the following four structural forms: the disturbance part 32 includes a column and a multi-layer protrusion 321 annularly distributed on the outer periphery of the column; the first stirring part 323, the second stirring part 324 and the third stirring part 325 together constitute the multi-layer protrusion 321 on the disturbance part 32; the multi-layer protrusion 321 is arranged along the axial direction of the striker 3. Therefore, it should be noted that the structural setting of the disturbance part 32 is not limited to the following four structural forms, and other structural forms or combinations that can achieve the same effect may also be applicable.

[0037] See also Figure 3 Each layer of raised portion 321 includes a plurality of protrusions 3211, and the plurality of protrusions 3211 are all in a trapezoidal structure, with one end with a larger area being arranged on the cylinder, and the other end with a smaller area protruding radially along the cylinder. The plurality of protrusions 3211 in each layer of raised portion 321 are arranged at intervals, and the two adjacent layers of raised portions 321 are arranged in a staggered manner, so that the solder paste can flow along the gaps between the layers of raised portions 321. The plurality of protrusions 3211 in each layer are all arranged horizontally, and the plurality of protrusions 3211 arranged on the same layer are arranged at equal intervals, and of course, they can also be arranged at non-equal intervals. When the solder paste flows through the disturbance portion 32, a portion of the solder paste flows directly into the bottom of the fluid cavity 22 from the gap between the disturbance portion 32 and the fluid cavity 22, and the other portion of the solder paste flows from the top of the multi-layer protrusions 3211 along the axial direction of the connecting portion 31 and toward the nozzle 21. When flowing, the solder paste first flows downward from the gaps between the multiple bumps 3211 of the first-layer protrusion 321, and then flows into the gaps between the multiple bumps 3211 of the second-layer protrusion 321. The multiple bumps 3211 in the second-layer protrusion 321 correspond to the gaps between the multiple bumps 3211 in the first-layer protrusion 321. Therefore, as the solder paste flows downward to the second-layer protrusion 321, it is blocked, and then the solder paste is diverted by the multiple bumps 3211 in the second-layer protrusion 321. The diverted solder paste flows into the third-layer protrusion 321, and then is diverted by the multiple bumps 3211 in the third-layer protrusion 321, and so on, until the solder paste flows into the bottom of the fluid cavity 22. Furthermore, through the multi-layer staggered arrangement of the protrusions 321, the solder paste flowing through the disturbance portion 32 and the solder beads contained therein can be broken up, and as the striker 3 moves up and down, the solder paste in the fluid cavity 22 can be driven to move synchronously, thereby improving the fluidity of the solder paste, and the fast-flowing solder paste can quickly fill the nozzle 21 when the striker 3 is lifted, thereby realizing rapid feeding to the nozzle 21.

[0038] See also Figure 4The difference between the second disturbance part 32 and the first disturbance part 32 is that the plurality of bumps 3211 included in two adjacent layers of protrusions 321 are arranged in an array. It should be noted that the structure of the second disturbance part 32 has a reduced diversion effect on the solder paste between the layers of protrusions 321 compared to the structure of the first disturbance part 32, but increases the speed at which the solder paste flows therein.

[0039] See also Figure 5 The third disturbance part 32 includes multiple layers of horizontally arranged annular steps 322, which are arranged along the axial direction of the striker 3, and the solder paste can flow between each layer of the annular steps 322. That is, when the solder paste flows through the disturbance part 32, the solder paste first flows into the first layer of the annular step 322, and then flows along the outer circumference of the first layer of the annular step 322 to the second layer of the annular step 322, until the solder paste flows into the second layer of the annular step 322, and then flows from the inner surface of the second layer of the annular step 322 to the outer circumference of the second layer of the annular step 322, and then the solder paste flows along the outer circumference of the second layer of the annular step 322 into the third layer of the annular step 322, and so on, until the solder paste flows into the impact part 33 of the striker 3. At the same time, during the up and down movement of the striker 3, the multi-layer annular step 322 can drive the solder paste in the fluid cavity 22 to move up and down synchronously. Since the contact area between the annular step 322 and the solder paste is larger, it can drive more solder paste when moving up and down, thereby making the fusion of the solder paste and the solder beads in the fluid cavity 22 more uniform, and can better improve the fluidity of the solder paste in the fluid cavity 22.

[0040] See also Figure 6 The fourth type of disturbance part 32 includes a multi-layered protrusion 321 arranged in a spiral shape. In this type of disturbance part, the solder paste first enters the uppermost entrance of the multi-layered protrusion 321 arranged in a spiral shape, and then flows along the spiral gap formed between the multi-layered protrusions 321 until it flows into the bottom of the fluid cavity 22 and contacts the impact part 33 of the striker 3.

[0041] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0042] The above description is based on the ideal embodiment of the present invention. Through the above description, relevant personnel can make various changes and modifications without departing from the technical concept of the present invention. The technical scope of the present invention is not limited to the content of the specification, and its technical scope must be determined by the scope of the claims.

Claims

1. A piezoelectric injection valve, characterized in that: The invention comprises a valve body (1) and a fluid seat (2), wherein a striker (3) is arranged in the valve body (1), a fluid cavity (22) and a flow channel connected to the fluid cavity (22) are provided in the fluid seat (2), and the striker (3) is suitable for striking a nozzle (21) mounted on the fluid seat (2) so that the solder paste stored in the fluid cavity (22) is ejected from the nozzle (21); The striker (3) comprises a striker portion (33) and a connecting portion (31), wherein the connecting portion (31) is connected to the valve body (1) to drive the striker portion (33) to move relative to the nozzle (21), and the striker portion (33) is suitable for contacting the nozzle (21); When the impact portion (33) impacts the nozzle (21), the solder paste is ejected through the nozzle (21); when the impact portion (33) moves away from the nozzle (21), the solder beads deposited in the nozzle (21) are driven and dispersed into the solder paste.

2. The piezoelectric injection valve according to claim 1, characterized in that The striker (3) further comprises a disturbance portion (32), wherein the disturbance portion (32) is located between the impact portion (33) and the connecting portion (31), and the disturbance portion (32) is suitable for disturbing the solder paste stored in the fluid cavity (22).

3. The piezoelectric injection valve according to claim 2, characterized in that The disturbance portion (32) comprises a first stirring portion (323) close to the connecting portion (31) and a second stirring portion (324) close to the impact portion (33); the first stirring portion (323) and the second stirring portion (324) are both arranged in the fluid chamber (22). And within the set distance H1, the distance L1 between the first stirring portion (323) and the cavity wall of the fluid cavity (22) remains unchanged; Within the set distance H2, the distance L2 between the second stirring portion (324) and the cavity wall of the fluid cavity (22) is less than L1, and L2 gradually decreases in the direction toward the nozzle (21).

4. The piezoelectric injection valve according to claim 3, characterized in that The disturbance portion (32) further comprises a third stirring portion (325), wherein the third stirring portion (325) is disposed in the fluid chamber (22) and is located between the first stirring portion (323) and the second stirring portion (324). Within the set distance H3, as the third agitating portion (325) extends toward the nozzle (21), the distance L3 between the third agitating portion (325) and the cavity wall of the fluid cavity (22) gradually decreases, and L2<L3<L1.

5. The piezoelectric injection valve according to claim 2, characterized in that The disturbance portion (32) comprises a column and multiple layers of protrusions (321) distributed in an annular manner on the outer periphery of the column, and the multiple layers of protrusions (321) are arranged along the axial direction of the striker (3).

6. The piezoelectric injection valve according to claim 5, characterized in that Each layer of the raised portion (321) comprises a plurality of protrusions (3211), and the plurality of protrusions (3211) are arranged at intervals.

7. The piezoelectric injection valve according to claim 6, characterized in that The plurality of protrusions (3211) in the protruding portions (321) of two adjacent layers are arranged in a staggered arrangement or in an array.

8. The piezoelectric injection valve according to claim 5, characterized in that Each layer of the protrusions (321) is in the form of an annular step (322) arranged horizontally in an annular shape, and the annular steps (322) of two adjacent layers are arranged at intervals.

9. The piezoelectric injection valve according to claim 5, characterized in that The multiple layers of raised portions (321) are arranged in a spiral.

10. The piezoelectric injection valve according to claim 1, characterized in that The impact surface of the impact portion (33) is flat.

11. The piezoelectric injection valve according to claim 10, characterized in that The nozzle (21) is provided with a funnel-shaped storage groove (213), the funnel-shaped storage groove (213) being in communication with the fluid cavity (22), and the impact end of the impact portion (33) being in a rounded shape (331) and being capable of contacting a groove wall (212) of the funnel-shaped storage groove (213).

12. The piezoelectric injection valve according to claim 11, characterized in that The nozzle (21) is also provided with an injection channel (211), the inlet end of the injection channel (211) is connected to the funnel-shaped storage tank (213), and the outlet end of the injection channel (211) is suitable for spraying solder paste.

Images