IC carrier plate detection equipment

Abstract

The invention relates to the technical field of IC carrier plate detection, in particular to IC carrier plate detection equipment. Comprising a feeding mechanism, a detection mechanism, a discharging mechanism and a suction cup mechanism, each of the feeding mechanism and the discharging mechanism comprises a plurality of stacked feeding structures, each stacked feeding structure comprises a bearing plate, a short-edge datum plate and a long-edge datum plate are arranged on the two adjacent sides of each bearing plate, and each bearing plate is slidably connected with a short-edge moving structure and a long-edge moving structure; the long-edge moving structure slides perpendicular to the long-edge datum plate, the short-edge moving structure slides perpendicular to the short-edge datum plate, the short-edge moving structure comprises a short-edge moving rod and a first sensor, the long-edge moving structure comprises a long-edge moving rod and a second sensor, and the upper end of the short-edge moving rod and the upper end of the long-edge moving rod both penetrate through the bearing plate and are in sliding connection relative to the bearing plate. The bearing plate is in sliding connection with the long-side datum plate in the Z direction through a Z-direction structure; the equipment can be compatible with various specifications of carrier plates for detection, adapts to various feeding modes, and improves the production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of IC carrier board detection, and in particular to an IC carrier board detection device. Background Art

[0002] Before packaging the chip, the solder balls on the IC substrate need to be inspected. Generally, the height, diameter, position and other information of the solder balls are inspected to see if they meet the requirements. The sizes of IC substrates for different chips are different, and the existing inspection equipment cannot be adjusted accordingly according to the size of the IC substrate. Therefore, a kind of inspection equipment is needed that can be compatible with a variety of IC substrates of different specifications for inspection. Summary of the invention

[0003] The problem to be solved by the present invention is to provide a detection device which can be compatible with a variety of IC carriers of different specifications for detection.

[0004] In view of the deficiencies in the prior art, the present invention adopts the following technical solution to solve the technical problems: an IC carrier board detection device, comprising a loading mechanism, a detection mechanism and a unloading mechanism, wherein the loading mechanism and the detection mechanism, as well as the detection mechanism and the unloading mechanism are connected via a suction cup mechanism, the loading mechanism comprises a plurality of stacked feeding structures, the stacked feeding structure comprises a carrying plate, a short side reference plate and a long side reference plate are arranged on adjacent two sides of the carrying plate, the carrying plate is slidably connected with a short side moving structure and a long side moving structure, the long side moving structure slides perpendicularly to the long side reference plate, the short side moving structure slides perpendicularly to the short side reference plate, the short side moving structure comprises a short side moving rod and a sensor 1, the long side moving structure comprises a long side moving rod and a sensor 2, the upper ends of the short side moving rod and the long side moving rod both penetrate the carrying plate and are slidably connected relative to the carrying plate, and the carrying plate is slidably connected to the long side reference plate in the Z direction via a Z direction structure; the unloading mechanism comprises a plurality of stacked unloading structures, and the stacked unloading structure has the same structure as the stacked feeding structure.

[0005] Preferably, the suction cup mechanism includes an X module group 1, a Y module group 1 and a suction cup, the Y module group 1 is vertically connected to the X module group 1 through a movable frame, the suction cup is slidably connected to the Y module group 1 through a Z-direction cylinder group, the suction cup includes a suction cup body, a fixed side nozzle group and a movable side nozzle group, and the fixed side nozzle group and the movable side nozzle group are slidably connected.

[0006] Preferably, the detection mechanism includes a detection platform, a code scanning structure and a spectrometer. The detection platform slides along the Y module 2, the code scanning structure realizes X-direction movement through the X module 2, and the X module 2 is connected to the Z-direction adjustment rod; the spectrometer is connected to the gantry mechanism through the Z-axis module and slides in the X direction relative to the gantry mechanism.

[0007] Preferably, the feeding mechanism also includes an automatic feeding structure of a clip, which includes a clip jaw 1, a lifting and transplanting structure 1 and a material pulling track, and the material pulling track includes a material pulling jaw, a synchronous belt and a width adjustment structure; the lifting and transplanting structure 1 includes an X-module 3 and a connecting plate on the X-module 3, and the clip jaw 1 is slidably connected to the connecting plate through a Z-axis linear module.

[0008] Preferably, the magazine automatic feeding structure also includes belt line 1 and belt line 2, belt line 1 is located on one side of the material pulling track, and belt line 2 is located on one side of the X module 3.

[0009] Preferably, the unloading mechanism also includes an automatic unloading structure of a clip, which includes a second clip jaw, a second lifting and transplanting structure and a pushing track. The second clip jaw has the same structure as the first clip jaw, the second lifting and transplanting structure has the same structure as the first lifting and transplanting structure, and the pushing track includes a pushing plate, which is slidably connected in the length direction of the pushing track.

[0010] Preferably, the bottom end of the long side moving rod is connected to a slide plate, and the slide plate slides along the second slide rail; the bottom end of the short side moving rod is located on a connecting slide block, and the connecting slide block slides on the first slide rail through a Y-axis screw rod.

[0011] Preferably, the Z-direction structure includes a Z-direction slide rail, a Z-direction slider, a Z-direction motor and a Z-direction screw rod, and one side of the Z-direction slider is connected to the bearing plate and the other side slides along the Z-direction slide rail.

[0012] The beneficial effects of the present invention are as follows: the feeding mechanism, the detection mechanism and the unloading mechanism of the present invention can be adjusted in the X direction, the Y direction and the Z direction to adapt to IC carriers of different specifications; the Z-direction adjustment structure of the carrier plate ensures that the material height is at the same position during the loading and receiving operations, thereby avoiding problems such as inaccurate clamping of the loading material or damage caused by the falling of the unloading material; the suction cup mechanism can not only move in the X\Y direction, but the suction cup itself can also be adjusted in the three directions of X\Y\Z according to the material specifications; the present invention also combines the automatic feeding structure and the automatic receiving structure of the clip to adapt to different material supply methods; in short, the equipment of the present invention can be compatible with various specifications of carriers for detection, adapt to various material supply methods, improve production efficiency, and ensure production quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the feeding side of the equipment of the present invention;

[0014] Figure 2 It is a structural schematic diagram of the other side of the device of the present invention;

[0015] Figure 3 It is a schematic diagram of a feeding mechanism involved in the present invention;

[0016] Figure 4 It is a schematic diagram of a stacking feeding structure involved in the present invention;

[0017] Figure 5 It is a schematic elevation diagram of a stacking feeding structure involved in the present invention;

[0018] Figure 6 It is a schematic diagram of the short side moving structure involved in the present invention;

[0019] Figure 7 It is a schematic diagram of the long side moving structure involved in the present invention;

[0020] Figure 8 It is a schematic diagram of a suction cup mechanism involved in the present invention;

[0021] Fig. 9 is a schematic diagram of a suction cup involved in the present invention;

[0022] Fig.10 It is a schematic diagram of the automatic feeding structure of the magazine involved in the present invention;

[0023] Fig.11 It is a schematic diagram of the automatic unloading structure of the magazine involved in the present invention;

[0024] Fig.12 It is a schematic diagram of a detection platform involved in the present invention;

[0025] Fig.13 It is a schematic diagram of the code scanning structure involved in the present invention;

[0026] Description of reference numerals: 1. feeding mechanism; 11. stacking feeding structure; 12. bearing plate; 121. slide hole 1; 122. slide hole 2; 13. short side reference plate; 131. optical fiber sensor; 14. long side reference plate; 15. short side moving structure; 151. short side moving rod; 152. sensor 1; 153. connecting slider; 154. transmission motor 1; 155. Y-axis screw rod; 156. slide rail 1; 15 7. Screw bearing; 16. Long side moving structure; 161. Long side moving rod; 162. Sensor 2; 163. Transmission motor 2; 164. Slide plate; 165. Slide rail 2; 166. X-axis screw; 17. Z-axis structure; 171. Z-axis slide rail; 172. Z-axis slider; 173. Z-axis motor; 174. Z-axis screw; 2. Detection mechanism; 21. Detection platform; 22. Code scanning structure; 23. Spectrometer ; 24, Y module 2; 25, X module 2; 26, Z-direction adjustment rod; 3, unloading mechanism; 31, stacking unloading structure; 4, suction cup mechanism; 41, X module 1; 42, Y module 1; 43, suction cup; 431, suction cup body; 432, fixed side suction nozzle group; 433, movable side suction nozzle group; 44, Z-direction cylinder group; 45, moving frame; 46, suction cup guide rail; 47, transmission group; 6, gantry mechanism; 7 , automatic feeding structure of the clip; 71, clip claw one; 72, lifting and transplanting structure one; 721, X module three; 722, connecting plate; 73, pulling track; 731, pulling claw; 732, synchronous belt; 733, width adjustment structure; 74, belt line one; 75, belt line two; 8, automatic unloading structure of the clip; 81, clip claw two; 82, lifting and transplanting structure two; 83, pushing track; 831, pushing plate. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0028] As mentioned in the background technology, the existing detection equipment cannot adapt to various specifications of carriers. The IC carrier detection equipment proposed in the present invention can better solve the above problem. The equipment of the present invention includes a feeding mechanism 1, a detection mechanism 2 and a feeding mechanism 3. The feeding mechanism 1 and the detection mechanism 2 are connected by a suction cup mechanism 4. The suction cup mechanism 4 sucks the material on the feeding mechanism 1 and puts it into the detection mechanism 2. Another suction cup mechanism 4 sucks the material detected by the detection mechanism 2 and puts it into the feeding mechanism 3. The feeding mechanism 1 includes a plurality of stacking feeding structures 11, such as Figure 1 There are three stacking feeding structures 11 shown, and the stacking feeding structure 11 includes a carrier plate 12, and a short side reference plate 13 and a long side reference plate 14 are provided on the adjacent two sides of the carrier plate 12. An optical fiber sensor 131 is provided on the short side reference plate 13, and the optical fiber sensor 131 detects the height of the uppermost carrier plate. The carrier plate 12 is slidably connected with a short side moving structure 15 and a long side moving structure 16, and the long side moving structure 16 slides perpendicularly to the long side reference plate 14, and the long side moving structure 16 moves in the X-axis direction, and the short side moving structure 15 slides perpendicularly to the short side reference plate 13, and the short side moving structure 15 moves in the Y-axis direction.

[0029] The short side moving structure 15 includes a short side moving rod 151 and a sensor 152. The sensor 152 feeds back the displacement of the short side moving rod 151. The movement of the short side moving rod 151 in the Y-axis direction is completed by the following structure: the bottom of the short side moving rod 151 is located on the connecting slider 153, the connecting slider 153 is sleeved on the Y-axis lead screw 155 and slides along the slide rail 156, the transmission motor 154 drives the Y-axis lead screw 155 through the transmission belt, and the other end of the Y-axis lead screw 155 is sleeved on the lead screw bearing 15 7 is used to limit the connecting slider 153; the long side moving structure 16 includes a long side moving rod 161 and a second sensor 162, the second sensor 162 feeds back the displacement of the long side moving rod 161, and the movement of the long side moving rod 161 in the X-axis direction is completed by the following structure: the bottom of the long side moving rod 161 is located on the slide plate 164, the slide plate 164 is sleeved on the X-axis lead screw 166, the transmission motor 163 drives the X-axis lead screw 166 and then the slide plate 164 brings the long side moving rod 161 to slide on the second slide rail 165. The upper ends of the short side moving rod 151 and the long side moving rod 161 both penetrate the bearing plate 12 and are slidably connected relative to the bearing plate 12. Correspondingly, a sliding hole 121 and a sliding hole 122 are provided on the bearing plate 12. The sliding hole 121 is for the long side moving rod 161 to slide, and the sliding hole 122 is for the short side moving rod 151 to slide. The bearing plate 12 extends toward the long side reference plate 14 and is connected to the Z-direction structure 17, so that the bearing plate 12 can slide relative to the long side reference plate 14 in the Z direction. The Z-direction structure 17 7 includes a Z-direction slide rail 171, a Z-direction slider 172, a Z-direction motor 173 and a Z-direction screw rod 174. One side of the Z-direction slider 172 is connected to the carrier plate 12 and the other side slides along the Z-direction slide rail 171. When the Z-direction motor 173 is in operation, the Z-direction slider 172 drives the carrier plate 12 to slide along the Z-direction slide rail 171. The most important function of the Z-direction structure 17 is to ensure that the position of the suction cup mechanism 4 to take materials is always at the same height. When the material is gradually reduced, the carrier plate 12 rises synchronously to achieve a constant material taking height. The unloading mechanism 3 includes a plurality of stacking unloading structures 31. The stacking unloading structure 31 has the same structure as the stacking feeding structure 11, which will not be repeated here. The stacking unloading structure 31 ensures that it decreases as the material increases during the material collection process to ensure the constant material collection height.

[0030] The suction cup mechanism 4 can also be adjusted in three directions of X, Y and Z according to the specifications of the carrier board, and specifically includes an X module 41, a Y module 42 and a suction cup 43. The Y module 42 is vertically connected to the X module 41 through a moving frame 45 so that the movement of the suction cup 43 in the X and Y directions does not interfere with each other. The suction cup 43 is slidably connected to the Y module 42 through a Z-direction cylinder group 44. The Z-direction cylinder group 44 controls the height of the suction cup 43, and the adjustment of the suction cup 43 in the three directions of X, Y and Z does not interfere with each other. The suction cup 43 can also be finely adjusted in size. Specifically, the suction cup 43 includes a suction cup body 431, a fixed edge suction nozzle group 432 and a movable edge suction nozzle group 433. The movable edge suction nozzle group 433 slides along the suction cup guide rail 46 relative to the fixed edge suction nozzle group 432. The sliding method of the movable edge suction nozzle group 433 is that the transmission group 47 drives the screw rod. The distance between the movable edge suction nozzle group 433 and the fixed edge suction nozzle group 432 is adjusted according to the specifications of the incoming materials. The movable edge suction nozzle group 433 and the fixed edge suction nozzle group 432 are magnetically connected to the suction cup body 431 to achieve fine adjustment in the Y direction.

[0031] The detection mechanism 2 includes a detection platform 21, a code scanning structure 22 and a spectrometer 23. The detection platform 21 slides along the Y module 24. After the suction cup 43 absorbs the material, the carrier is placed on the detection platform 21 and slides along the Y module 24 to the code scanning structure 22 for identification. Since the position of the two-dimensional code on the carrier is not fixed, it is necessary to adjust the position of the code scanning structure 22 according to each batch of materials. The code scanning structure 22 realizes X-direction movement through the X module 25 to adapt to the width of the carrier. The X module 25 can be a motor-driven screw rod, and the screw rod drives the slider to slide along the track; one end of the X module 25 is connected to the Z-direction adjustment rod 26, and the Z-direction adjustment rod 26 is less frequently used and can be set to a manual adjustment mode; the spectrometer 23 is connected to the gantry mechanism 6 through the Z-axis module to realize the adjustment of the spectrometer 23 in the Z direction, and the sliding of the spectrometer 23 in the X direction is realized by the X-axis linear module, so that the detection mechanism 2 can also be adjusted according to the specifications of the carrier.

[0032] In actual production, the material feeding method is not only stacking, but also magazine feeding. In order to adapt to various material feeding methods, the feeding mechanism 1 is also provided with a magazine automatic feeding structure 7, which includes a magazine clamping claw 71, a lifting and transplanting structure 72 and a material pulling track 73. The magazine clamping claw 71 can be adjusted according to the size of the magazine. The specific method is a cylinder plus a clamping claw, which will not be repeated here; the lifting and transplanting structure 72 clamps the magazine clamping claw 71 to the position of the material pulling track 73, and the material pulling track 73 is provided with a material pulling claw 731, a synchronous belt 732 and a width adjustment Structure 733, the material pulling claw 731 pulls the carrier plate in the clip out to the synchronous belt 732, the suction cup 43 sucks the carrier plate from the synchronous belt 732 and transfers it to the detection platform 21, and the width adjustment structure 733 adjusts the width of the material pulling track 73 to an appropriate size; the lifting and transplanting structure 1 72 includes an X-module 3 721 and a connecting plate 722, the connecting plate 722 is slidably connected to the X-module 3 721, the clip claw 1 71 is slidably connected to the connecting plate 722 through the Z-axis linear module, and the lifting and transplanting structure 1 72 realizes the movement of the clip claw 1 71 in the X and Z directions. The automatic magazine feeding structure 7 may further include a belt line 1 74 and a belt line 2 75. The belt line 1 74 is located on one side of the material pulling track 73 and is used to place magazines containing carrier plates. The belt line 2 75 is located on one side of the X module 3 721 and is used to transport empty magazines. The magazine clamp 1 71 clamps a fully loaded magazine from the belt line 1 74. After the fully loaded magazine is emptied by the material pulling clamp 731, the magazine clamp 1 71 transfers the empty magazine to the belt line 2 75 for recycling. Corresponding to the automatic feeding structure 7 of the magazine, the unloading mechanism 3 also includes an automatic unloading structure 8 of the magazine, and the automatic unloading structure 8 of the magazine includes a second magazine jaw 81, a second lifting and transplanting structure 82 and a pushing track 83. The second magazine jaw 81 has the same structure as the first magazine jaw 71, and the second lifting and transplanting structure 82 has the same structure as the first lifting and transplanting structure 72, which will not be repeated here. The pushing track 83 includes a pushing plate 831, and the pushing plate 831 is slidably connected on the pushing track 83. After the suction cup 43 places the carrier plate that has completed the inspection on the pushing track 83, the pushing plate 831 slides along the pushing track 83 to push the carrier plate into the magazine.

[0033] When in use, the short side moving structure 15 and the long side moving structure 16 are adjusted according to the specifications of the carrier plate, so that the area surrounded by the short side moving rod 151, the long side moving rod 161, the short side reference plate 13, the long side reference plate 14 and the carrier plate 12 forms a stacking feeding trough, and the Z-direction structure 17 works to adjust the carrier plate 12 to a suitable height, and the suction cup mechanism 4 adjusts the suction cup 43 to be just above the stacking feeding trough, and adjusts the suction cup 43 into place according to the specifications of the carrier plate before taking the material. One suction cup mechanism 4 can be responsible for the material taking work of two detection platforms 21 through the sliding of the suction cup 43 on the X module 1 41, and the other detection platform 21 corresponds to the automatic feeding structure 7 of the magazine, and the magazine claw 1 71 clamps the magazine from the belt line 1 74 The pulling clamp 731 pulls the carrier plate out onto the synchronous belt 732, and the suction cup 43 moves into position to absorb it and then places it on the detection platform 21; at this time, the detection platform 21 carries the carrier plate and moves along the Y module 24, firstly passes through the code scanning structure 22 for identification, and then passes through the spectrometer 23 for detection, and the spectrometer 23 moves between the two detection platforms 21 through the gantry mechanism 6; the carrier plate that has completed the detection is brought to the unloading area by the detection platform 21, and the suction cup mechanism 4 in the unloading area works, and the suction cup 43 absorbs the carrier plate and puts it into the receiving trough. According to different material incoming methods, the stacking feeding structure 11 corresponds to the stacking unloading structure 31, and the automatic feeding structure 7 of the magazine corresponds to the automatic unloading structure 8 of the magazine. The unloading method is similar to the loading method and will not be repeated.

[0034] The design of the present invention takes into account the different ways of product delivery, so two different loading mechanisms and unloading mechanisms are designed. Due to the differences in the specifications of the carrier boards, the loading mechanism and the unloading mechanism are designed to be automatically adjustable structures so as to be compatible with products of various specifications. The upper and lower material arms adopt a suction cup mechanism 4, and the suction cup mechanism 4 takes and discharges materials by vacuum adsorption. At the same time, the suction cup spacing is designed to be automatically adjustable so as to correspond to the size of the carrier board. The detection platform automatically fixes the product by vacuum adsorption. Each detection platform corresponds to a set of code scanning structures. The height of the code scanning structure is designed to be manually adjusted, and the left and right positions are designed to be automatically adjusted to ensure that the platform is compatible with carrier boards of various specifications. The two platforms operate alternately to improve the utilization rate of the spectrometer.

Claims

1. An IC substrate detection device, comprising a loading mechanism (1), a detection mechanism (2) and a unloading mechanism (3), wherein the loading mechanism (1) and the detection mechanism (2), and the detection mechanism (2) and the unloading mechanism (3) are connected via a suction cup mechanism (4), characterized in that: The feeding mechanism (1) comprises a plurality of stacking feeding structures (11), wherein the stacking feeding structure (11) comprises a carrying plate (12), wherein two adjacent sides of the carrying plate (12) are provided with a short side reference plate (13) and a long side reference plate (14), wherein the carrying plate (12) is slidably connected with a short side moving structure (15) and a long side moving structure (16), wherein the long side moving structure (16) slides perpendicularly to the long side reference plate (14), and the short side moving structure (15) slides perpendicularly to the short side reference plate (13), and the short side moving structure (15) comprises a short side moving rod (15 1) and sensor one (152), the long side moving structure (16) includes a long side moving rod (161) and a sensor two (162), the upper ends of the short side moving rod (151) and the long side moving rod (161) both penetrate the supporting plate (12) and are slidably connected relative to the supporting plate (12), and the supporting plate (12) is slidably connected to the long side reference plate (14) in the Z direction through the Z direction structure (17); the unloading mechanism (3) includes a plurality of stacked unloading structures (31), and the stacked unloading structures (31) have the same structure as the stacked feeding structure (11).

2. The IC substrate detection device according to claim 1, characterized in that: The suction cup mechanism (4) comprises an X-module group (41), a Y-module group (42) and a suction cup (43); the Y-module group (42) is vertically connected to the X-module group (41) through a movable frame (45); the suction cup (43) is slidably connected to the Y-module group (42) through a Z-direction cylinder group (44); the suction cup (43) comprises a suction cup body (431), a fixed side suction nozzle group (432) and a movable side suction nozzle group (433); the fixed side suction nozzle group (432) and the movable side suction nozzle group (433) are slidably connected.

3. The IC substrate detection device according to claim 2, characterized in that: The detection mechanism (2) comprises a detection platform (21), a code scanning structure (22) and a spectrometer (23); the detection platform (21) slides along a second Y-module (24); the code scanning structure (22) moves in the X direction via a second X-module (25); the second X-module (25) is connected to a Z-adjusting rod (26); and the spectrometer (23) is connected to a gantry mechanism (6) via a Z-axis module and slides in the X direction relative to the gantry mechanism (6).

4. The IC substrate testing device according to claim 1, characterized in that: The feeding mechanism (1) also includes an automatic feeding structure (7) for a magazine clip, wherein the automatic feeding structure (7) includes a magazine clip jaw 1 (71), a lifting and transplanting structure 1 (72) and a material pulling track (73), wherein the material pulling track (73) includes a material pulling jaw (731), a synchronous belt (732) and a width adjustment structure (733); the lifting and transplanting structure 1 (72) includes an X-module 3 (721) and a connecting plate (722) on the X-module 3 (721), and the magazine clip jaw 1 (71) is slidably connected to the connecting plate (722) via a Z-axis linear module.

5. The IC substrate detection device according to claim 4, characterized in that: The magazine automatic feeding structure (7) also includes a belt line 1 (74) and a belt line 2 (75), wherein the belt line 1 (74) is located on one side of the material pulling track (73), and the belt line 2 (75) is located on one side of the X-module 3 (721).

6. The IC substrate detection device according to claim 5, characterized in that: The material unloading mechanism (3) further comprises an automatic material unloading structure (8) for a magazine, wherein the automatic material unloading structure (8) comprises a second magazine clamping jaw (81), a second lifting and transplanting structure (82) and a material pushing track (83), wherein the second magazine clamping jaw (81) has the same structure as the first magazine clamping jaw (71), the second lifting and transplanting structure (82) has the same structure as the first lifting and transplanting structure (72), and the material pushing track (83) comprises a material pushing plate (831), and the material pushing plate (831) is slidably connected to the material pushing track (83) in the length direction thereof.

7. The IC substrate testing device according to claim 1, characterized in that: The bottom end of the long side moving rod (161) is connected to the slide plate (164), and the slide plate (164) slides along the second slide rail (165); the bottom end of the short side moving rod (151) is located on the connecting slide block (153), and the connecting slide block (153) slides on the first slide rail (156) through the Y-direction screw rod (155).

8. The IC substrate testing device according to claim 1, characterized in that: The Z-direction structure (17) comprises a Z-direction slide rail (171), a Z-direction slider (172), a Z-direction motor (173) and a Z-direction screw rod (174); one side of the Z-direction slider (172) is connected to the bearing plate (12) and the other side slides along the Z-direction slide rail (171).

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