Water-jet guided laser processing diamond blind groove process

Abstract

The invention discloses a process for processing a diamond blind groove by water-guided laser, which not only can optimize a laser incident angle, reduce a scattering effect and improve the smoothness of a groove wall through multi-angle compensation, but also can avoid periodic lines and defects caused by single-direction processing. The laser focus is always matched with the material surface through dynamic angle adjustment, the energy attenuation problem caused by depth increase is effectively relieved, and uniform machining of the bottom of the deep groove is ensured. And a complex multi-taper or gradual change structure can be realized, and the machining flexibility is obviously improved. Meanwhile, heat distribution is improved through multi-angle machining, the influence of heat accumulation on material performance is reduced, a water flow guide field is optimized, machining stability is enhanced, the limitation of the depth-diameter ratio is broken through, and the removal rate and machining precision are improved.

Description

Technical Field

[0001] The invention relates to the technical field of water-conducting laser processing, in particular to a water-conducting laser processing diamond blind groove process. Background Art

[0002] As a green and efficient precision machining technology, water-guided laser machining is gradually becoming the mainstream choice in the field of precision machining due to its environmentally friendly machining process, excellent surface quality and non-tapered hole shape accuracy. Water-guided laser machining equipment couples nanosecond pulsed lasers with micro high-speed water jets. The flushing of water jets can cool the workpiece in real time during the machining process, reduce the heat-affected zone, improve machining accuracy and quality, and reduce machining time and waste. However, for difficult-to-machine materials such as diamond and silicon carbide ceramics, the existing water-guided laser machining technology still faces great challenges.

[0003] Diamond blind grooves are widely used in high-end manufacturing, especially in semiconductor heat dissipation structures, precision optical devices, superhard tool lubrication grooves, and aerospace microchannels. The design of the blind groove can realize the functions of heat conduction, light conduction, and fluid transmission inside the material, meeting the needs of high-performance devices and complex structures. Water-guided laser processing of diamond blind grooves is a potential ideal technology. It uses water flow as a guide medium and can achieve non-contact, high-precision processing on high-hardness materials while reducing the heat-affected zone. However, diamond blind groove processing is a technical problem, mainly reflected in the difficulty in accurately controlling the length of the water jet. The water jet may diffuse after a long distance of propagation, causing the laser energy to gradually weaken and diverge during propagation. Affecting the energy transfer and action depth of the laser, resulting in uneven groove walls. The upper material is subjected to strong laser energy, and the removal efficiency of the lower material is low, thus forming a taper. In addition, the complex morphology of the bottom of the blind groove has a significant impact on the state of the water jet. The fluctuation of the water jet and the uneven distribution of laser energy may cause irregular bottom morphology, microcracks or other processing defects.

[0004] Despite this, water-guided laser processing of diamond blind grooves is of great significance: on the one hand, it can break through the limitations of traditional mechanical processing, avoid problems such as tool wear and local thermal damage, and ensure high-quality processing; on the other hand, through the optimized control of water beams and lasers, it can significantly improve the morphological accuracy and aspect ratio of the blind grooves, and promote the manufacturing capabilities of diamond microstructures.

[0005] In the prior art, for example, Chinese patent CN 118926681 A discloses a coupling component and a water-guided laser processing device containing the component. An hourglass-shaped homogenization chamber is opened inside the main body of the coupling component, and an air inlet is opened on the side wall of the main body. The air inlet passes gas into the thin waist section of the homogenization chamber from both sides. After the gas is blocked by the water jet and the cavity wall, two spindle-shaped vortices with opposite flows are formed, thereby weakening the interference of the airflow on the water jet. The upper vortex flows upward close to the water jet, inhibiting the downward transmission of the surface wave of the water jet; the lower vortex moves downward along the water jet and then swirls upward, enhancing the suppression effect on the recoil water, and can extend the stable length while improving the stability of the water jet. In the water-guided laser processing device containing the above-mentioned coupling component, the different effects generated by the two airflows are superimposed at the same time, so that the coupling component can greatly improve the processing quality and efficiency under the condition of unchanged energy consumption, so as to meet the processing requirements of workpieces with a large depth-to-diameter ratio. However, this technical solution belongs to single-axis processing. The single-axis processing structure is limited by the beam focus and energy distribution, and is prone to taper errors, which causes errors in the processed products and prevents the production efficiency from being improved.

[0006] Another example is a water-guided laser rapid drainage workpiece platform disclosed in Chinese patent CN 118492611 A, which includes a frame, a mobile system, a workpiece clamping device and a negative pressure drainage device. The mobile system is arranged on the frame, and the workpiece clamping device is arranged on the mobile system to clamp the workpiece. The workpiece is driven by the mobile system to move, and the negative pressure drainage device quickly drains the water remaining on the surface of the workpiece by negative pressure. Due to the material characteristics of the workpiece processed by water-guided laser and the fact that most of the workpieces are planar structures, water is easy to remain on the surface of the workpiece and in the prepared grooves, affecting the processing quality and destroying the stability of the water jet. The present invention uses negative pressure to assist rapid drainage, which can not only accelerate the removal of residual water by negative pressure water absorption, but also guide the discharge of slag by water. At the same time, the drainage tube and the air pipe pass through the liquid storage bottle stopper and communicate with the inner cavity, which is more convenient to connect and more convenient to disassemble and replace the liquid storage bottle. Although this technical solution can reduce the reflux of water column, the technical problems of taper control, complex shape, deep groove processing and surface quality are still unsolved. Summary of the invention

[0007] Purpose of the invention: In order to solve the shortcomings of the existing technology, the present invention provides a water-guided laser processing diamond blind groove process, which can effectively solve the technical problems of taper control, complex shape, deep groove processing and surface quality in traditional processing methods by dynamically adjusting the workpiece angle. Combined with optimized laser parameters and water-guided jet characteristics, this method can play a huge advantage in the field of diamond precision processing.

[0008] Technical solution: In order to achieve the above purpose, the present invention provides a water-conducting laser processing diamond blind groove process, which includes the following specific steps:

[0009] Step 1

[0010] Before processing diamond, the material to be processed is placed in anhydrous ethanol for ultrasonic cleaning, and then the material to be processed is cleaned again with distilled water to make its surface clean;

[0011] Step 2

[0012] The diamond is fixed to the diamond fixture with adhesive. Because the diamond is relatively small, the diamond is glued to the diamond fixture with adhesive. The diamond fixture as a whole is a combination of a round bar and a vise. By gluing the diamond to the fixture, the diamond is effectively prevented from being damaged due to stress during processing.

[0013] Step 3

[0014] A water jet device is respectively arranged on the water-guided laser processing head to set and limit water pressure parameters and laser parameters for processing diamonds, and a water jet flows out from a nozzle on the water jet device;

[0015] The stability of the length of the water jet ejected by the water jet device on the water-guided laser processing head depends on the water pressure and the micropore diameter, and the relevant water jet length directly depends on the water speed:

[0016]

[0017] Where v is the water velocity in m / s and p is the water pressure in bar;

[0018] Step 4

[0019] The material to be processed is processed according to the preset processing trajectory, and the offset cutting method is used to cut along the surface edge of the part, effectively reducing the thermal damage caused during the processing;

[0020] Step 5

[0021] After processing the material for 3 to 4 minutes, tilt the fixture holding the material by 0.05°, so that the laser processing head and the cutting seam are inclined at an angle of 0.05°, effectively reducing the cutting seam taper. Reducing the taper is to improve the performance of diamond blind groove parts, and the taper will affect the mechanical properties of diamond;

[0022] Step 6

[0023] After the fixture is tilted and clamped, the material is processed again, and the water jet is directed to the material surface using a water spray device. The relevant parameters of the water spray device are the same as those in step 3, thereby reducing the local temperature of the material surface and reducing thermal damage during processing;

[0024] Step 7

[0025] After the material processing is completed, the diamond is removed from the fixture, and then the processed material is placed in anhydrous ethanol for ultrasonic cleaning, and finally the material is cleaned again with clean water;

[0026] Step 8

[0027] Place the finished parts after cutting under an optical microscope and count the taper of the diamond cutting seam after processing.

[0028] As a further preferred embodiment of the present invention, the material to be processed is placed in anhydrous ethanol and ultrasonically cleaned for 5 to 6 minutes.

[0029] As a further preferred embodiment of the present invention, in step 2, the adhesive is a strong quick-drying repair adhesive, and the supplier of the strong quick-drying repair adhesive is Gunasson.

[0030] As a further preferred embodiment of the present invention, in step three, the water pressure of the water spraying device is set to 250 bar-350 bar, and the temperature of the water sprayed by the water jet is 20°C to 26°C.

[0031] As a further preferred embodiment of the present invention, in step 3, the single pulse energy in the laser parameters exceeds 3 mJ;

[0032] As a further preferred embodiment of the present invention, in step 4, the processing trajectory is set on the water-conducting laser processing equipment and the processing trajectory code is output on the water-conducting laser processing equipment using UG software.

[0033] As a further preferred embodiment of the present invention, in step five, the clamp is a universal bench vise.

[0034] As a further preferred embodiment of the present invention, in step seven, the processed product is ultrasonically cleaned and then cleaned again with ultrapure water for 5 minutes to 6 minutes.

[0035] Beneficial effects: Compared with the prior art, the water-conducting laser processing diamond blind groove process described in the present invention has the following advantages:

[0036] (1) Through multi-angle compensation, it can not only optimize the laser incident angle, reduce the scattering effect, and improve the smoothness of the groove wall, but also avoid the periodic texture and defects caused by single-direction processing;

[0037] (2) Dynamic angle adjustment ensures that the laser focus always matches the material surface, effectively alleviating the energy attenuation problem caused by increased depth and ensuring uniform processing at the bottom of the deep groove;

[0038] (3) Dynamic angle adjustment can realize complex multi-taper or gradient structures, and the processing flexibility is significantly improved;

[0039] (4) Multi-angle processing improves heat distribution, reduces the impact of heat accumulation on material properties, optimizes the water diversion field, enhances processing stability, breaks through the depth-to-diameter ratio limitation, and improves removal rate and processing accuracy;

[0040] (5) It optimizes economic benefits and provides reliable support for diamond blind groove processing, while complying with the development trend of green manufacturing and precision machining. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 It is a schematic diagram of the process flow of the present invention. DETAILED DESCRIPTION

[0042] The present invention is further explained below in conjunction with the accompanying drawings and specific embodiments.

[0043] Example 1

[0044] like Figure 1 As shown, the water-conducting laser processing diamond blind groove process described in the present invention has the following specific implementation steps:

[0045] Step 1: Before processing diamond, place the material to be processed in anhydrous ethanol and ultrasonically clean it for 5 minutes, then clean it again with distilled water to make its surface clean;

[0046] Step 2: Use adhesive to fix the diamond on the diamond fixture. Because the diamond is relatively small, adhesive is used to stick the diamond to the diamond fixture. The diamond fixture as a whole is a combination of a round rod and a vise. By bonding the diamond to the fixture, the diamond can be effectively prevented from being damaged due to stress during processing. The adhesive is a strong quick-drying repair glue. The supplier of the strong quick-drying repair glue is Gunason.

[0047] Step 3: Set a water spray device on the water-guided laser processing head to set the limited water pressure parameters and the laser parameters for processing diamonds. The single pulse energy in the laser parameters exceeds 3mJ. The water pressure of the water spray device is set to 250bar. The temperature of the water sprayed by the water jet is 20°C. The water jet flows out from the nozzle on the water spray device.

[0048] The stability of the length of the water jet ejected by the water jet device on the water-guided laser processing head depends on the water pressure and the micropore diameter, and the relevant water jet length directly depends on the water speed:

[0049]

[0050] Where v is the water velocity in m / s and p is the water pressure in bar;

[0051] Step 4

[0052] The material to be processed is processed according to the preset processing trajectory, and the offset cutting method is used to cut along the surface edge of the part, which effectively reduces the thermal damage generated during the processing. The processing trajectory is set on the water-guided laser processing equipment, and the processing trajectory code is output on the water-guided laser processing equipment using UG software;

[0053] Step 5

[0054] After processing the material for 3 minutes, tilt the universal bench vise holding the material by 0.05°, so that the laser processing head and the cutting seam are inclined at an angle of 0.05°, effectively reducing the taper of the cutting seam. Reducing the taper is to improve the performance of the diamond blind groove parts, and the taper will affect the mechanical properties of the diamond;

[0055] Step 6

[0056] After the fixture is tilted and clamped, the material is processed again, and the water jet is directed to the material surface using a water spray device. The relevant parameters of the water spray device are the same as those in step 3, thereby reducing the local temperature of the material surface and reducing thermal damage during processing;

[0057] Step 7

[0058] After the material processing is completed, the diamond is removed from the fixture, and then the processed material is placed in anhydrous ethanol for ultrasonic cleaning, and finally the material is cleaned again with clean water for 5 minutes;

[0059] Step 8

[0060] Place the finished parts after cutting under an optical microscope and count the taper of the diamond cutting seam after processing.

[0061] Example 2

[0062] like Figure 1 As shown, the water-conducting laser processing diamond blind groove process described in the present invention has the following specific implementation steps:

[0063] Step 1: Before processing diamond, place the material to be processed in anhydrous ethanol and ultrasonically clean it for 5.5 minutes, then clean it again with distilled water to make its surface clean;

[0064] Step 2: Use adhesive to fix the diamond on the diamond fixture. Because the diamond is relatively small, adhesive is used to stick the diamond to the diamond fixture. The diamond fixture as a whole is a combination of a round rod and a vise. By bonding the diamond to the fixture, the diamond can be effectively prevented from being damaged due to stress during processing. The adhesive is a strong quick-drying repair glue. The supplier of the strong quick-drying repair glue is Gunason.

[0065] Step 3: Set a water spray device on the water-guided laser processing head to set the limited water pressure parameters and the laser parameters for processing diamonds. The single pulse energy in the laser parameters exceeds 3mJ. The water pressure of the water spray device is set to 300bar. The temperature of the water sprayed by the water jet is 22°C. The water jet flows out from the nozzle on the water spray device.

[0066] The stability of the length of the water jet ejected by the water jet device on the water-guided laser processing head depends on the water pressure and the micropore diameter, and the relevant water jet length directly depends on the water speed:

[0067]

[0068] Where v is the water velocity in m / s and p is the water pressure in bar;

[0069] Step 4

[0070] The material to be processed is processed according to the preset processing trajectory, and the offset cutting method is used to cut along the surface edge of the part, which effectively reduces the thermal damage generated during the processing. The processing trajectory is set on the water-guided laser processing equipment, and the processing trajectory code is output on the water-guided laser processing equipment using UG software;

[0071] Step 5

[0072] After processing the material for 3.5 minutes, the universal bench vise holding the material is tilted by 0.05°, so that the laser processing head and the cutting seam are tilted by 0.05°, which effectively reduces the taper of the cutting seam. Reducing the taper is to improve the performance of the diamond blind groove parts, and the taper will affect the mechanical properties of the diamond.

[0073] Step 6

[0074] After the fixture is tilted and clamped, the material is processed again, and the water jet is directed to the material surface using a water spray device. The relevant parameters of the water spray device are the same as those in step 3, thereby reducing the local temperature of the material surface and reducing thermal damage during processing;

[0075] Step 7

[0076] After the material processing is completed, the diamond is removed from the fixture, and then the processed material is placed in anhydrous ethanol for ultrasonic cleaning, and finally the material is cleaned again with clean water for 5.6 minutes;

[0077] Step 8

[0078] Place the finished parts after cutting under an optical microscope and count the taper of the diamond cutting seam after processing.

[0079] Example 3

[0080] like Figure 1As shown, the water-conducting laser processing diamond blind groove process described in the present invention has the following specific implementation steps:

[0081] Step 1: Before processing diamond, place the material to be processed in anhydrous ethanol and ultrasonically clean it for 6 minutes, then clean it again with distilled water to make its surface clean;

[0082] Step 2: Use adhesive to fix the diamond on the diamond fixture. Because the diamond is relatively small, adhesive is used to stick the diamond to the diamond fixture. The diamond fixture as a whole is a combination of a round rod and a vise. By bonding the diamond to the fixture, the diamond can be effectively prevented from being damaged due to stress during processing. The adhesive is a strong quick-drying repair glue. The supplier of the strong quick-drying repair glue is Gunason.

[0083] Step 3: Set a water spray device on the water-guided laser processing head to set the limited water pressure parameters and the laser parameters for processing diamonds. The single pulse energy in the laser parameters exceeds 3mJ. The water pressure of the water spray device is set to 350bar. The temperature of the water sprayed by the water jet is 26°C. The water jet flows out from the nozzle on the water spray device.

[0084] The stability of the length of the water jet ejected by the water jet device on the water-guided laser processing head depends on the water pressure and the micropore diameter, and the relevant water jet length directly depends on the water speed:

[0085]

[0086] Where v is the water velocity in m / s and p is the water pressure in bar;

[0087] Step 4

[0088] The material to be processed is processed according to the preset processing trajectory, and the offset cutting method is used to cut along the surface edge of the part, which effectively reduces the thermal damage generated during the processing. The processing trajectory is set on the water-guided laser processing equipment, and the processing trajectory code is output on the water-guided laser processing equipment using UG software;

[0089] Step 5

[0090] After processing the material for 4 minutes, the universal bench vise holding the material is tilted by 0.05°, so that the laser processing head and the cutting seam are tilted by 0.05°, which effectively reduces the taper of the cutting seam. Reducing the taper is to improve the performance of the diamond blind groove parts, and the taper will affect the mechanical properties of the diamond.

[0091] Step 6

[0092] After the fixture is tilted and clamped, the material is processed again, and the water jet is directed to the material surface using a water spray device. The relevant parameters of the water spray device are the same as those in step 3, thereby reducing the local temperature of the material surface and reducing thermal damage during processing;

[0093] Step 7

[0094] After the material processing is completed, the diamond is removed from the fixture, and then the processed material is placed in anhydrous ethanol for ultrasonic cleaning, and finally the material is cleaned again with clean water for 6 minutes;

[0095] Step 8

[0096] Place the finished parts after cutting under an optical microscope and count the taper of the diamond cutting seam after processing.

[0097] Traditional single-axis machining is limited by the beam focus and energy distribution, and is prone to taper errors. Multi-angle compensation can not only optimize the laser incident angle, reduce the scattering effect, and improve the smoothness of the groove wall, but also avoid the periodic lines and defects caused by single-direction machining. Dynamic angle adjustment ensures that the laser focus always matches the material surface, effectively reducing the energy attenuation problem caused by increased depth, and ensuring uniform machining at the bottom of the deep groove. It can also achieve complex multi-taper or gradient structures, and significantly improve machining flexibility. At the same time, multi-angle machining improves heat distribution, reduces the impact of heat accumulation on material properties, optimizes the water diversion field, enhances machining stability, breaks through the depth-to-diameter ratio limitation, and improves removal rate and machining accuracy.

[0098] The present invention solves the technical problems of taper control, complex shapes, deep groove processing and surface quality in traditional processing methods. Combined with optimized laser parameters and water-jet characteristics, this method can play a huge advantage in the field of diamond precision processing.

[0099] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable technicians familiar with the technical field to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent transformation or modification made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A water-guided laser processing diamond blind groove process, characterized by: It includes the following steps: Step 1 Before processing diamond, the material to be processed is placed in anhydrous ethanol for ultrasonic cleaning, and then the material to be processed is cleaned again with distilled water to make its surface clean; Step 2 The diamond is fixed to the diamond fixture by using an adhesive; Step 3 A water jet device is respectively arranged on the water-guided laser processing head to set and limit water pressure parameters and laser parameters for processing diamonds, and a water jet flows out from a nozzle on the water jet device; The stability of the length of the water jet ejected by the water jet device on the water-guided laser processing head depends on the water pressure and the micropore diameter, and the relevant water jet length directly depends on the water speed: Where v is the water velocity in m / s and p is the water pressure in bar; Step 4 Process the material to be processed according to the preset processing trajectory, and cut along the surface edge of the part using the offset cutting method; Step 5 After processing the material for 3 to 4 minutes, tilt the fixture holding the material by 0.05°, so that the laser processing head and the cutting seam are inclined at an angle of 0.05°, effectively reducing the taper of the cutting seam; Step 6 After the fixture is tilted and clamped, the material is processed again, and the water jet is directed to the surface of the material using a water spray device. The relevant parameters of the water spray device are the same as those in step 3. Step 7 After the material processing is completed, the diamond is removed from the fixture, and then the processed material is placed in anhydrous ethanol for ultrasonic cleaning, and finally the material is cleaned again with clean water. Step 8 Place the finished parts after cutting under an optical microscope and count the taper of the diamond cutting seam after processing.

2. The water-conducting laser processing diamond blind groove process according to claim 1, characterized in that: In step 1, the material to be processed is placed in anhydrous ethanol and ultrasonically cleaned for 5 minutes to 6 minutes.

3. The water-conducting laser processing diamond blind groove process according to claim 1, characterized in that: In step 2, the adhesive is a strong quick-drying repair glue.

4. The water-conducting laser processing diamond blind groove process according to claim 1, characterized in that: In step three, the water pressure of the water spraying device is set to 250 bar-350 bar, and the temperature of the water sprayed by the water jet is 20°C to 26°C.

5. The process for machining diamond blind grooves by water-conducting laser according to claim 1, characterized in that: In step 3, the single pulse energy in the laser parameters exceeds 3 mJ.

6. The process for machining diamond blind grooves by water-conducting laser according to claim 1, characterized in that: In step 4, the processing trajectory is set on the water-conducting laser processing equipment and the processing trajectory code is output on the water-conducting laser processing equipment using UG software.

7. The process for machining diamond blind grooves by water-conducting laser according to claim 1, characterized in that: In step five, the clamp is a universal bench vise.

8. The process for machining diamond blind grooves by water-conducting laser according to claim 1, characterized in that: In step seven, the processed product is ultrasonically cleaned and then cleaned again with ultrapure water for 5 minutes to 6 minutes.

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