Bidirectional uniform temperature control platform and biological 3D printer

Abstract

The invention provides a bidirectional uniform temperature control platform and a biological 3D printer, and relates to the technical field of 3D printing, the bidirectional uniform temperature control platform comprises a platform main body, a work bearing plate, a uniform temperature plate, an electric heating film, a water cooling plate and at least one semiconductor chilling plate, the work bearing plate is arranged on one side of the platform main body; the temperature uniformizing plate is arranged on one side of the working bearing plate away from the working surface; the semiconductor chilling plate is arranged on the side, away from the work bearing plate, of the temperature uniformizing plate. The electric heating film is arranged on the side, away from the work bearing plate, of the temperature uniformizing plate. The water cooling plate is arranged in the containing inner cavity and arranged on the side, away from the working bearing plate, of the semiconductor chilling plate. Compared with the prior art, by arranging the semiconductor chilling plate and the electric heating film, two-way temperature control can be achieved, switching between a refrigeration platform and a heating platform is not needed, use is convenient, meanwhile, through the additionally-designed temperature uniformizing plate, uniform distribution of heat can be achieved, and the temperature control uniformity is better.

Description

Technical Field

[0001] The present invention relates to the technical field of 3D printing, and in particular to a bidirectional uniform temperature control platform and a biological 3D printer. Background Art

[0002] With the continuous development of 3D printing technology, people are gradually paying attention to the temperature control and temperature control uniformity issues in the printing process. The basic principle of 3D printing is: in the printing process, you first need to use a computer to design the three-dimensional model of the required parts, and then discretize the model into a series of ordered units, usually discretizing it in the Z direction according to a certain thickness, turning the original three-dimensional CAD model into a series of layers. Then, according to the contour information of each layer, input the processing parameters, the system automatically generates the CNC code, and finally the printer prints and stacks a series of layers on the printing platform layer by layer, and finally obtains a three-dimensional physical entity. The printing platform is a crucial module in the 3D printing process and is the carrier of the printed object. At the same time, the temperature control function of the printing platform is also a key process control in the entire 3D printing process, which has a direct impact on the quality of the printed object.

[0003] Specifically, the printing process is a process in which the material changes from liquid to solid, or from solid-liquid to solid. The whole process involves temperature changes and phase changes many times: if the printing material is a polymer material with a high melting point, it will shrink in volume when cooled and solidified, causing stress in the printed product and causing deformation and warping, which will lead to printing failure. Therefore, the printing platform needs to provide temperature (heating) control to reduce the temperature gradient during the phase change of the material, reduce stress and deformation, and ensure the normal printing; if the printing material is a hydrogel material, the liquid in the room temperature barrel passes through the print head to the printing platform for finalization, and then is stacked layer by layer for finalization. The finalization process of the platform usually requires temperature control (refrigeration). If there is a lack of temperature control, the printing ink material will collapse, resulting in printing failure.

[0004] At present, most 3D printers on the market are divided into biological 3D printers and non-biological 3D printers. The temperature control of non-biological printers is mostly a high-temperature heating platform, and the heating method mostly adopts an embedded thermocouple heating rod method, which does not have high requirements for the heating uniformity of the platform. However, in the field of biological 3D printing, due to the particularity of the materials used, the materials are highly sensitive to temperature, and the temperature control range of the overall platform needs to be between -10 and 60°C, and at the same time, the temperature control uniformity of the platform is required to be high. On the current biological 3D printing technology platform, the heating platform and the cooling platform are mostly separated. When low-temperature printing is required, the cooling platform is installed, and when high-temperature printing is required, the heating platform is replaced and installed. It is necessary to switch back and forth, which is extremely inconvenient for users, and usually the heat source and cold source act directly on the working surface, and the temperature uniformity is poor. Summary of the invention

[0005] The objects of the present invention include, for example, providing a bidirectional uniform temperature control platform and a biological 3D printer, which can realize bidirectional temperature control without switching between refrigeration and heating platforms, are easy to use, and have better temperature control uniformity.

[0006] The embodiments of the present invention can be implemented as follows:

[0007] In a first aspect, the present invention provides a bidirectional uniform temperature control platform, comprising:

[0008] A platform body, wherein a receiving inner cavity is provided in the platform body, and a platform opening connected to the receiving inner cavity is opened on one side;

[0009] A working carrying plate, which is arranged on one side of the platform body and installed at the platform opening, and one side of the working carrying plate has a working surface for carrying printed matter, and the other side is used to be connected to the accommodating inner cavity;

[0010] A temperature-uniform plate, the temperature-uniform plate being arranged on a side of the working bearing plate away from the working surface;

[0011] At least one semiconductor refrigeration sheet, which is arranged on a side of the temperature-uniform plate away from the working bearing plate and is used to control the surface temperature of the working surface through the temperature-uniform plate;

[0012] An electric heating film, which is arranged on a side of the temperature-uniform plate away from the working bearing plate and is used to control the surface temperature of the working surface through the temperature-uniform plate;

[0013] A water cooling plate is arranged in the accommodating inner cavity and on a side of the semiconductor refrigeration plate away from the working bearing plate, and is used to achieve heat exchange with the semiconductor refrigeration plate.

[0014] In an optional embodiment, the temperature-uniform plate includes capillary channels and a temperature-uniform shell, the capillary channels are distributed in the temperature-uniform shell in a grid shape, and the temperature-uniform shell is fitted on the surface of the working bearing plate.

[0015] In an optional embodiment, the electric heating film includes a PI electric heating film, and the PI electric heating film is staggered with the semiconductor refrigeration plate and spaced apart from the water cooling plate.

[0016] In an optional embodiment, at least one avoidance opening is provided on the PI electric heating film, the shape of the avoidance opening is adapted to the shape of the semiconductor cooling plate, the semiconductor cooling plate is assembled in the avoidance opening and adheres to the surface of the temperature uniforming plate.

[0017] In an optional embodiment, the PI electric heating film includes an insulating film and a conductive heating element, wherein the insulating film is coated outside the conductive heating element and adhered to the surface of the temperature uniforming plate, and the conductive heating element is used to generate heat when power is supplied.

[0018] In an optional embodiment, the water-cooling plate includes a heat-conducting metal plate, a water-cooling pipe head and a water-cooling connecting pipe. A water-cooling channel is arranged in the heat-conducting metal plate. The water-cooling pipe head is arranged on the side of the heat-conducting metal plate away from the working bearing plate and is connected to the water-cooling channel. A water-cooling joint is also arranged on the side wall of the platform body. The water-cooling joint extends out of the platform body. One end of the water-cooling connecting pipe is connected to the water-cooling pipe head, and the other end is connected to the water-cooling joint.

[0019] In an optional embodiment, the working surface is further provided with a plurality of temperature sensors, which are evenly distributed on the working surface and are used to collect temperature information of the working surface in real time.

[0020] In an optional embodiment, the platform body includes a base, a side panel and a bearing platform, the side panel is arranged around the edge of the base, the bearing platform is arranged on the side panel, the platform opening is arranged on the bearing platform, and an accommodating groove is opened on the bearing platform, the platform opening is arranged on the bottom wall of the accommodating groove, and the working bearing plate is adapted to be accommodated in the accommodating groove.

[0021] In an optional embodiment, an installation covering plate is further provided in the accommodating inner cavity, the installation covering plate cover is provided outside the water-cooled plate, and a connecting piece is provided at the edge of the installation covering plate, and the connecting piece is detachably connected to the supporting platform and is used to fix the installation covering plate so that the installation covering plate is pressed onto the surface of the water-cooled plate.

[0022] In a second aspect, the present invention provides a biological 3D printer, comprising a printer body and a bidirectional uniform temperature control platform as described in any one of the aforementioned embodiments, wherein the printer body has a print head, which is arranged above the working surface and is used to form a printed object on the working surface.

[0023] The beneficial effects of the embodiments of the present invention include, for example:

[0024] The bidirectional uniform temperature control platform provided by the embodiment of the present invention has a containing inner cavity set in the platform body, and a platform opening is opened on one side, a working bearing plate is set at the platform opening, and a uniform temperature plate is set on the back of the working bearing plate, and a semiconductor refrigeration sheet and an electric heating film are attached to the uniform temperature plate, and cooling is achieved by using the semiconductor refrigeration sheet, and heating is achieved by using the electric heating film, so that the heating and cooling functions are integrated into one, and in order to further dissipate heat, a water cooling plate is also set on the side of the semiconductor refrigeration sheet away from the working bearing plate, and the water cooling plate can achieve heat exchange with the semiconductor refrigeration sheet to quickly take away heat. Compared with the prior art, the present invention can achieve bidirectional temperature control by setting semiconductor refrigeration sheets and electric heating films, without the need to switch between cooling and heating platforms, and is easy to use. At the same time, the uniform distribution of heat can be achieved through the additionally designed uniform temperature plate, so that the temperature control uniformity is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic diagram of the overall structure of a bidirectional uniform temperature control platform provided by an embodiment of the present invention;

[0027] Figure 2 A schematic cross-sectional structure diagram of a bidirectional uniform temperature control platform provided in an embodiment of the present invention;

[0028] Figure 3 A top view of a bidirectional uniform temperature control platform provided in an embodiment of the present invention;

[0029] Figure 4 for Figure 2 Schematic diagram of the structure of the medium temperature uniform plate;

[0030] Figure 5 for Figure 2 Schematic diagram of the position structure of the semiconductor cooling sheet and the electric heating film;

[0031] Figure 6 for Figure 2 Schematic diagram of the structure of the Zhongdian heating film;

[0032] Figure 7 for Figure 2 Schematic diagram of the water cooling plate;

[0033] Figure 8 A partial structural cross-sectional view of a bidirectional uniform temperature control platform provided in an embodiment of the present invention;

[0034] Fig. 9 Schematic diagram of the distribution of temperature sensors.

[0035] Icons: 100-bidirectional uniform temperature control platform; 110-platform body; 111-containing inner cavity; 112-platform opening; 113-base; 114-side panel; 115-bearing platform; 116-containing groove; 117-installation cladding plate; 118-connector; 120-working bearing plate; 121-working surface; 130-uniform temperature plate; 131-capillary channel; 132-uniform temperature shell; 140-electric heating film; 141-avoidance opening; 142-insulating film; 143-conductive heating element; 150-water cooling plate; 151-heat-conducting metal plate; 152-water cooling pipe head; 153-water cooling connecting pipe; 154-water cooling joint; 158-water cooling channel; 160-semiconductor refrigeration plate; 170-temperature sensor. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0039] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0040] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0041] As disclosed in the background technology, the existing biological 3D printing technology platform, the heating platform and the cooling platform are mostly separated independently. When low-temperature printing is required, the cooling platform is installed, and when high-temperature printing is required, the heating platform is replaced and installed. It is necessary to switch back and forth, which is extremely inconvenient for users. However, directly integrating the heating platform and the cooling platform into one will cause uneven temperature distribution during heating or cooling, affecting the 3D printing effect. In addition, conventional technology usually uses semiconductor cooling chips to achieve cooling, and semiconductor cooling chips also have a certain heating effect, but their heating speed is slow, the heating is uneven, and the upper limit temperature reached during heating is low (usually not exceeding room temperature), which is difficult to meet the heating temperature required for biological 3D printing.

[0042] Moreover, usually the heat source and the cold source act directly on the working surface, and the distribution of the heat source and the cold source is not uniform, resulting in poor temperature uniformity.

[0043] In order to solve the above problems, the embodiments of the present invention provide a novel bidirectional uniform temperature control platform 100 and a biological 3D printer. It should be noted that the features in the embodiments of the present invention can be combined with each other without conflict.

[0044] Please refer to Figures 1 to 3 This embodiment provides a bidirectional uniform temperature control platform 100, which can realize bidirectional temperature control without switching between cooling and heating platforms, is easy to use, and has better temperature control uniformity. At the same time, the temperature control accuracy is higher, the controllability is better, and the structural stability is better.

[0045] The bidirectional uniform temperature control platform 100 provided in this embodiment includes a platform body 110, a working carrier plate 120, a uniform temperature plate 130, an electric heating film 140, a water cooling plate 150 and at least one semiconductor refrigeration plate 160. The platform body 110 is hollow, and a receiving cavity 111 is arranged inside, and a platform opening 112 connected to the receiving cavity 111 is opened on one side; the working carrier plate 120 is arranged on one side of the platform body 110 and installed at the platform opening 112, and one side of the working carrier plate 120 has a working surface 121 for carrying printed matter, and the other side is used for connecting to the receiving cavity 111. 1; the temperature-uniform plate 130 is arranged on the side of the working carrier plate 120 away from the working surface 121; the semiconductor cooling plate 160 is arranged on the side of the temperature-uniform plate 130 away from the working carrier plate 120, and is used to control the surface temperature of the working surface 121 through the temperature-uniform plate 130; the electric heating film 140 is arranged on the side of the temperature-uniform plate 130 away from the working carrier plate 120, and is used to control the surface temperature of the working surface 121 through the temperature-uniform plate 130; the water-cooling plate 150 is arranged in the accommodating inner cavity 111, and is arranged on the side of the semiconductor cooling plate 160 away from the working carrier plate 120, and is used to achieve heat exchange with the semiconductor cooling plate 160.

[0046] In this embodiment, in actual use, the front side of the working carrier plate 120 is the working surface 121, and is set upward, the temperature uniforming plate 130 is set on the back side of the working carrier plate 120, the semiconductor refrigeration plate 160 is set on the side surface of the temperature uniforming plate 130 away from the working carrier plate 120, and the electric heating film 140 is set on the side surface of the temperature uniforming plate 130 away from the working carrier plate 120, and the water cooling plate 150 is set on the surface of the semiconductor refrigeration plate 160 away from the working carrier plate 120. Specifically, in this embodiment, a containing cavity 111 is provided in the platform body 110, and a platform opening 112 is provided on one side, and a working carrier plate 120 is provided at the platform opening 112, and a temperature-uniform plate 130 is provided on the back of the working carrier plate 120, and a semiconductor refrigeration sheet 160 and an electric heating film 140 are attached to the temperature-uniform plate 130, and cooling is achieved by using the semiconductor refrigeration sheet 160, and heating is achieved by using the electric heating film 140, so that the heating and cooling functions are integrated into one, and the setting of the temperature-uniform plate 130 enables uniform heat exchange of the working carrier plate 120 regardless of heating or cooling, and thus uniform temperature control of the working surface 121 is achieved. At the same time, in order to further dissipate heat, a water-cooling plate 150 is also provided on the side of the semiconductor refrigeration sheet 160 away from the working carrier plate 120, and the water-cooling plate 150 can achieve heat exchange with the semiconductor refrigeration sheet 160 and quickly take away the heat.

[0047] It should be noted that, by utilizing the Peltier effect of semiconductor materials, when direct current passes through a couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the couple, respectively, to achieve the purpose of refrigeration. One side of the semiconductor refrigeration sheet 160 is bonded to the uniform temperature plate 130, and the other side is bonded to the water-cooled plate 150, and a heat-conducting medium (such as thermal grease) is filled in the middle. In this embodiment, refrigeration is achieved by using the semiconductor refrigeration sheet 160, and heating is achieved by the electric heating film 140, thereby integrating the heating and refrigeration functions into one. Specifically, when the temperature of the working surface 121 needs to be controlled below room temperature, refrigeration can be performed by the semiconductor refrigeration sheet 160, and the electric heating film 140 is in a power-off state; and when the temperature of the working surface 121 needs to be controlled above room temperature, heating can be performed by the electric heating film 140, and the semiconductor refrigeration sheet 160 can be in a power-off state, or the current direction of the semiconductor refrigeration sheet 160 can be changed so that the heating surface of the semiconductor refrigeration sheet 160 is in contact with the uniform temperature plate 130 to achieve auxiliary heating.

[0048] See also Figure 4The temperature-uniform plate 130 includes a capillary 131 and a temperature-uniform shell 132. The capillary 131 is distributed in a grid shape in the temperature-uniform shell 132. The temperature-uniform shell 132 is fitted on the surface of the working carrier plate 120. Specifically, the temperature-uniform shell 132 can be a metal shell with better thermal conductivity, and is fixed to the surface of the working carrier plate 120 by bonding with thermal conductive silicone grease to achieve good heat conduction, while the capillary 131 is densely distributed in a grid shape inside the temperature-uniform shell 132, and the capillary 131 can be a crisscross copper capillary 131 structure. After receiving the cold source of the semiconductor refrigeration sheet 160 or the heat source of the electric heating film 140, since copper has good temperature conduction performance, the cold source or heat source is evenly dispersed in the dense capillary grid, and quickly homogenized in the grid, and further evenly exchanges heat with the working carrier plate 120, so that the entire working surface 121 obtains better temperature uniformity.

[0049] It should be noted that in this embodiment, the working carrier plate 120 can be made of good conductor materials such as aluminum alloy and copper. It is located at the top layer of the entire temperature control platform. Its bottom surface is in contact with the top surface of the uniform temperature plate 130, and the middle is filled with a heat-conducting medium, such as thermal grease, to achieve good heat transfer.

[0050] See also Figure 5 and Figure 6 In this embodiment, the electric heating film 140 includes a PI electric heating film, which is staggered with the semiconductor cooling sheet 160 and spaced apart from the water cooling plate 150. Specifically, there is a small gap between the PI electric heating film 140 and the semiconductor cooling sheet 160, which can prevent heat exchange between the two and prevent the temperature of the semiconductor cooling sheet 160 from being affected during heating. On the other hand, the thickness of the PI electric heating film is less than that of the semiconductor cooling sheet 160, so that the water cooling plate 150 will only contact the semiconductor cooling sheet 160 but not the electric heating film 140, thereby avoiding heat dissipation during heating.

[0051] In this embodiment, at least one avoidance opening 141 is provided on the PI electric heating film, and the shape of the avoidance opening 141 is adapted to the shape of the semiconductor cooling sheet 160. The semiconductor cooling sheet 160 is assembled in the avoidance opening 141 and is attached to the surface of the uniform temperature plate 130. Specifically, there are multiple semiconductor cooling sheets 160, and there are also multiple avoidance openings 141. The multiple avoidance openings 141 are evenly distributed on the PI electric heating film, and the multiple semiconductor cooling sheets 160 can be evenly distributed on the surface of the uniform temperature plate 130, further ensuring the uniformity of temperature transfer. The avoidance opening 141 can be rectangular, and the semiconductor cooling sheet 160 is also rectangular. There can be four semiconductor cooling sheets 160 and avoidance openings 141, and they are evenly distributed.

[0052] In the present embodiment, the PI electric heating film includes an insulating film 142 and a conductive heating element 143. The insulating film 142 is coated on the outside of the conductive heating element 143 and adhered to the surface of the uniform temperature plate 130. The conductive heating element is used to generate heat when power is turned on. Specifically, the PI electric heating film is made of a polyimide film as an outer insulator, and a metal foil or a metal wire as an inner conductive heating element 143, which are heat-sealed under high temperature and high pressure. The PI electric heating film has excellent insulation strength, excellent electrical strength, excellent thermal conductivity efficiency, and excellent resistance stability. In the present embodiment, the insulating film 142 can be bonded to the surface of the uniform temperature plate 130 by conductive silicone grease. Since it uses insulating material, the internal conductive heating element is isolated from the uniform temperature plate 130, thereby avoiding the occurrence of short circuits.

[0053] In other preferred embodiments of the present invention, in order to improve heating efficiency, the surface of the insulating film 142 facing away from the uniform temperature plate 130 may also be covered with an insulation layer, such as a calcium silicate board or an aerogel layer, which can block heat from being transferred to the water cooling plate 150 during heating.

[0054] See also Figure 7 and Figure 8 The water-cooling plate 150 includes a heat-conducting metal plate, a water-cooling pipe head 152 and a water-cooling connecting pipe 153. A water-cooling channel 158 is arranged inside the heat-conducting metal plate. The water-cooling pipe head 152 is arranged on the side of the heat-conducting metal plate 151 away from the working bearing plate 120 and is connected to the water-cooling channel 158. A water-cooling joint 154 is also arranged on the side wall of the platform body 110. The water-cooling joint 154 extends out of the platform body 110. One end of the water-cooling connecting pipe 153 is connected to the water-cooling pipe head 152, and the other end is connected to the water-cooling joint 154. Specifically, the heat-conducting metal plate can be made of good heat-conducting materials such as aluminum alloy, copper or stainless steel. The water-cooling channel 158 is designed inside to quickly perform heat exchange and take away the heat from the hot surface of the semiconductor refrigeration plate 160. The water-cooling pipe head 152 is integrally arranged on the heat-conducting metal plate and is in the shape of an elbow. The water-cooling connecting pipe 153 can be a hose or a hard pipe, which can transport the cooling water in the cooling channel to the external water-cooling joint 154 or transport the external cooling water from the water-cooling joint 154 to the cooling channel.

[0055] Furthermore, since the printing platform is cooled by the semiconductor cooling sheet 160, a large amount of heat needs to be removed in time during the cooling process. Therefore, a water cooling control system is designed in this embodiment to dissipate heat. The water cooling system also includes a water pump, a controller and a flow meter. The water pump is connected to the water cooling joint 154 on the side wall through a pipeline to form a circulating cooling channel. The flow meter can measure the flow of cooling water, and the controller can be a PLC processor, which can control the flow size and thus control the water cooling efficiency.

[0056] See also Fig. 9In this embodiment, the working surface 121 is also provided with a plurality of temperature sensors 170, which are evenly distributed on the working surface 121, and are used to collect temperature information of the working surface 121 in real time. Specifically, the temperature sensors 170 are all connected to the controller for communication, and the controller can also be connected to the electric heating film 140 for communication, so that the controller can adjust the cooling efficiency by real-time monitoring of the temperature, thereby more accurately controlling the temperature of the working surface 121. There can be 9 temperature sensors 170, and the 9 temperature sensors 170 are evenly distributed on the working surface 121, and can be fixed at 9 positions of the working surface 121 by vertically punching the holes in the longitudinal direction.

[0057] For further information, see Figure 2 , Figure 3 and Figure 8 The platform body 110 includes a base 113, a side panel 114 and a bearing platform 115. The side panel 114 is arranged around the edge of the base 113, the bearing platform 115 is arranged on the side panel 114, the platform opening 112 is arranged on the bearing platform 115, and a receiving groove 116 is opened on the bearing platform 115. The platform opening 112 is arranged on the bottom wall of the receiving groove 116, and the working bearing plate 120 is adapted to the receiving groove 116. Specifically, the side panel 114 is arranged around the base 113, and is combined with the bearing platform 115 to form a receiving inner cavity 111, and the bearing platform 115 is provided with a receiving groove 116, and the shape of the working bearing plate 120 is adapted to the receiving groove 116, and is interference-fitted in the receiving groove 116. By providing the receiving groove 116, on the one hand, the fixed installation of the working bearing plate 120 can be better realized, and on the other hand, the working bearing plate 120 can be embedded in the bearing platform 115, thereby increasing the integrity of the working surface 121. Preferably, the thickness of the working bearing plate 120 can be the same as the thickness of the receiving groove 116, so that the working surface 121 is flush with the bearing platform 115 around the receiving groove 116, so that the ductility of the working surface 121 is better.

[0058] In this embodiment, an installation covering plate 117 is further provided in the accommodating inner cavity 111. The installation covering plate 117 is covered outside the water-cooled plate 150, and a connector 118 is provided at the edge of the installation covering plate 117. The connector 118 is detachably connected to the bearing platform 115 and is used to fix the installation covering plate 117 so that the installation covering plate 117 is pressed on the surface of the water-cooled plate 150. Specifically, the installation covering plate 117 can play the role of supporting the water-cooled plate 150, and the connector 118 can be a screw. The edge of the bearing platform 115 is provided with a screw hole. By fitting the connector 118 tightly in the screw hole, the fixing of the installation covering plate 117 can be achieved, and after tightening the connector 118, the water-cooled plate 150, the semiconductor refrigeration plate and the uniform temperature plate 130 can be tightly fixed to ensure the fitting heat transfer effect.

[0059] The embodiment of the present invention further provides a biological 3D printer, including a printer body and a bidirectional uniform temperature control platform 100, the bidirectional uniform temperature control platform 100 includes a platform body 110, a working carrier plate 120, a uniform temperature plate 130, an electric heating film 140, a water cooling plate 150 and at least one semiconductor refrigeration plate 160, the platform body 110 is hollow, and an accommodating inner cavity 111 is arranged inside, and a platform opening 112 connected to the accommodating inner cavity 111 is opened on one side; the working carrier plate 120 is arranged on one side of the platform body 110, and is installed at the platform opening 112, and one side of the working carrier plate 120 has a working surface 120 for carrying printed objects 1, and the other side is used to be connected to the accommodating inner cavity 111; the temperature-uniform plate 130 is arranged on the side of the working carrier plate 120 away from the working surface 121; the semiconductor cooling sheet 160 is arranged on the side of the temperature-uniform plate 130 away from the working carrier plate 120, and is used to control the surface temperature of the working surface 121 through the temperature-uniform plate 130; the electric heating film 140 is arranged on the side of the temperature-uniform plate 130 away from the working carrier plate 120, and is used to control the surface temperature of the working surface 121 through the temperature-uniform plate 130; the water-cooling plate 150 is arranged in the accommodating inner cavity 111, and is arranged on the side of the semiconductor cooling sheet 160 away from the working carrier plate 120, and is used to achieve heat exchange with the semiconductor cooling sheet 160. The printer body has a print head, which is arranged above the working surface 121 and is used to form a printed object on the working surface 121.

[0060] Specifically, the printer body also includes a platform and a frame. The platform body 110 is detachably fixed on the platform, and the working surface 121 is arranged upward, while the frame is arranged at the edge of the platform, and the print head is arranged on the frame. Its specific structure can refer to the existing biological 3D printers, and will not be introduced in detail here.

[0061] In summary, the bidirectional uniform temperature control platform 100 provided by the embodiment of the present invention has an accommodating inner cavity 111 set in the platform body 110, and a platform opening 112 is opened on one side, the working carrier plate 120 is set at the platform opening 112, and a uniform temperature plate 130 is set on the back side of the working carrier plate 120, and a semiconductor refrigeration sheet 160 and an electric heating film 140 are attached to the uniform temperature plate 130. Refrigeration is achieved by using the semiconductor refrigeration sheet 160, and heating is achieved by using the electric heating film 140, thereby integrating the heating and cooling functions into one, and in order to further dissipate heat, a water cooling plate 150 is also provided on the side of the semiconductor refrigeration sheet 160 away from the working carrier plate 120, and the water cooling plate 150 can achieve heat exchange with the semiconductor refrigeration sheet 160 to quickly take away the heat. Compared with the prior art, this embodiment can achieve two-way temperature control by setting up a semiconductor cooling plate 160 and an electric heating film 140, without the need to switch between the cooling and heating platforms, and is easy to use. At the same time, through the additionally designed uniform temperature plate 130, uniform heat distribution can be achieved, thereby achieving better temperature control uniformity.

[0062] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A two-way uniform temperature control platform, characterized in that: include: A platform body (110), wherein a receiving inner cavity (111) is provided in the platform body (110), and a platform opening (112) connected to the receiving inner cavity (111) is opened on one side; A working carrying plate (120), the working carrying plate (120) being arranged on one side of the platform body (110) and installed at the platform opening (112), and one side of the working carrying plate (120) having a working surface (121) for carrying printed matter, and the other side being used for joining to the accommodating inner cavity (111); a temperature-uniform plate (130), the temperature-uniform plate (130) being arranged on a side of the working bearing plate (120) away from the working surface (121); at least one semiconductor refrigeration sheet (160), the semiconductor refrigeration sheet (160) being arranged on a side of the temperature-uniform plate (130) away from the working carrier plate (120) and being used for cooling the working surface (121) through the temperature-uniform plate (130); An electric heating film (140), the electric heating film (140) being arranged on a side of the temperature-uniform plate (130) away from the working bearing plate (120), and being used for heating the working surface (121) through the temperature-uniform plate (130); A water cooling plate (150), the water cooling plate (150) being arranged in the accommodating inner cavity (111) and being arranged on a side of the semiconductor cooling plate (160) away from the working bearing plate (120), and being used for achieving heat exchange with the semiconductor cooling plate (160).

2. The bidirectional uniform temperature control platform according to claim 1, characterized in that: The temperature-uniform plate (130) comprises capillary channels (131) and a temperature-uniform shell (132); the capillary channels (131) are distributed in a grid-like manner inside the temperature-uniform shell (132); and the temperature-uniform shell (132) is arranged in close contact with the surface of the working bearing plate (120).

3. The bidirectional uniform temperature control platform according to claim 1 or 2, characterized in that: The electric heating film (140) comprises a PI electric heating film, the PI electric heating film is arranged in a staggered manner with the semiconductor refrigeration sheet (160), and is spaced apart from the water cooling plate (150).

4. The bidirectional uniform temperature control platform according to claim 3, characterized in that: At least one avoidance opening (141) is provided on the PI electric heating film, the shape of the avoidance opening (141) is adapted to the shape of the semiconductor cooling plate (160), and the semiconductor cooling plate (160) is assembled in the avoidance opening (141) and adhered to the surface of the uniform temperature plate (130).

5. The bidirectional uniform temperature control platform according to claim 3, characterized in that: The PI electric heating film comprises an insulating film (142) and a conductive heating element (143); the insulating film (142) is coated on the outside of the conductive heating element (143) and adhered to the surface of the temperature-uniform plate (130); and the conductive heating element (143) is used to generate heat when electricity is turned on.

6. The bidirectional uniform temperature control platform according to claim 1, characterized in that: The water cooling plate (150) comprises a heat-conducting metal plate (151), a water cooling pipe head (152) and a water cooling connecting pipe (153); a water cooling channel (158) is arranged in the heat-conducting metal plate; the water cooling pipe head (152) is arranged on a side of the heat-conducting metal plate (151) away from the working bearing plate (120) and is connected to the water cooling channel (158); a water cooling joint (154) is also arranged on the side wall of the platform body (110); the water cooling joint (154) extends out of the platform body (110); one end of the water cooling connecting pipe (153) is connected to the water cooling pipe head (152), and the other end is connected to the water cooling joint (154).

7. The bidirectional uniform temperature control platform according to claim 1, characterized in that: The working surface (121) is also provided with a plurality of temperature sensors (170), which are evenly distributed on the working surface (121) and are used to collect temperature information of the working surface (121) in real time.

8. The bidirectional uniform temperature control platform according to claim 7, characterized in that: The platform body (110) includes a base (113), a side panel (114) and a bearing platform (115), wherein the side panel (114) is arranged around the edge of the base (113), the bearing platform (115) is arranged on the side panel (114), the platform opening (112) is arranged on the bearing platform (115), and an accommodating groove (116) is opened on the bearing platform (115), the platform opening (112) is arranged on the bottom wall of the accommodating groove (116), and the working bearing plate (120) is adapted to be accommodated in the accommodating groove (116).

9. The bidirectional uniform temperature control platform according to claim 8, characterized in that: The accommodating inner cavity (111) is also provided with an installation covering plate (117), and the installation covering plate (117) is covered outside the water-cooling plate (150), and a connecting piece (118) is provided on the edge of the installation covering plate (117), and the connecting piece (118) is detachably connected to the supporting platform (115) and is used to fix the installation covering plate (117) so that the installation covering plate (117) is pressed onto the surface of the water-cooling plate (150).

10. A biological 3D printer, characterized in that: It comprises a printer body and a bidirectional uniform temperature control platform as claimed in any one of claims 1 to 9, wherein the printer body has a print head, and the print head is arranged above the working surface (121) and is used to form a printed object on the working surface (121).

Images