Unsaturated acrylate resin containing bridge alicyclic structure for low-temperature transparent support column and resin composition

Abstract

The invention discloses unsaturated acrylate resin containing a bridge type alicyclic structure and used for a low-temperature transparent supporting column. The general formula of the chemical structure of the resin is # imgabs0. The invention also discloses a resin composition composed of the unsaturated acrylate resin. The liquid crystal display device can effectively solve the problem that due to the fact that a supporting column is low in hardness, insufficient in supporting force and poor in recovery rate, liquid crystals are distributed unevenly after being extruded, and products are poor, and the requirements of terminal products are met.

Description

Technical Field

[0001] The invention relates to the field of low-temperature curing transparent materials, and in particular to an unsaturated acrylic resin containing a bridged alicyclic structure and a resin composition for a low-temperature transparent support column. Background Art

[0002] In recent years, light curtain technology (LC) has further enhanced the user experience of products based on technical advantages such as second-level response, natural gray-black, privacy anti-glare, heat insulation protection and safe low voltage. At present, smart light curtains are used in the rear seat side windows of the car, supporting dimming of the entire glass or partitions, and can achieve free control of light. At the same time, smart window solutions are also applied to aircraft, ship windows, car sunroofs and side windows, etc., to bring people a better experience of smart travel. This type of smart light curtain product needs to form multiple support columns on the base to prevent the liquid crystal from being squeezed when the liquid crystal is subsequently poured in, so as to protect the liquid crystal and make the liquid crystal evenly distributed.

[0003] With the vigorous development of new energy vehicles in recent years, creating a high-end panoramic skylight for cars has become the main theme. For smart light curtains, it is necessary to transform from rigid glass to flexible products. Due to the limitation of flexible substrates that are not resistant to high temperatures, higher requirements are placed on the support column materials on the substrate. The materials currently used for support columns cannot be completely cured at low temperatures (150°C), and thus cannot form a dense cross-linked network, resulting in low hardness, insufficient supporting force, and poor recovery rate of the support columns. They cannot withstand the pressure applied during assembly, resulting in uneven distribution of liquid crystals after being squeezed, resulting in mura problems. Summary of the invention

[0004] The object of the present invention is to provide an unsaturated acrylic resin containing a bridged alicyclic structure for a low-temperature transparent support column.

[0005] The invention also provides a resin composition containing unsaturated acrylic ester resin.

[0006] The innovation of the present invention is that this patent can effectively solve the problem of uneven distribution of liquid crystal after being squeezed and resulting in defective products due to low hardness of the support column, insufficient supporting force and poor recovery rate, thereby meeting the needs of terminal products.

[0007] In order to achieve the above-mentioned object of the invention, the technical solution of the present invention is:

[0008] An unsaturated acrylic resin containing a bridged alicyclic structure for a low-temperature transparent support column, wherein the general chemical structure formula of the resin is:

[0009]

[0010] Wherein, m, n, and o are integers from 1 to 100 respectively;

[0011] R1, R2, R3, and R4 are each a hydrogen atom or a methyl group;

[0012] R5 is a C1-C20 straight or branched alkyl group, or at least one -CH2- in the C1-C20 alkyl group is replaced by any one or more of -O-, -CO-, -COO-, and -OCO- groups;

[0013] R6 is

[0014] R7 is a C1-C20 straight or branched oxacycloalkyl group, or at least one -CH2- in the C1-C20 oxacycloalkyl group is replaced by any one or more of -O-, -CO-, -COO-, and -OCO- groups;

[0015] R8 is a C1-C20 straight chain or branched alkyl group, or at least one -CH2- in the C1-C20 alkyl group is replaced by any one or more of -O-, -CO-, -COO-, and -OCO- groups;

[0016] R9 is a hydrogen atom or a methyl group;

[0017] R10 is a hydrogen atom or a C1-C10 alkyl group;

[0018] R11 is a hydrogen atom or a C1-C10 alkyl group.

[0019] Furthermore, the resin is copolymerized by the following monomers: a bridged alicyclic structure monomer, an oxygen-containing heterocycloalkyl monomer, a hydroxyl-containing monomer, a carboxyl-containing monomer and an auxiliary monomer; the molar percentage of the bridged alicyclic structure monomer in the monomer is 20-40%, the molar percentage of the oxygen-containing heterocycloalkyl monomer is 10-20%, the molar percentage of the hydroxyl-containing monomer is 10-30%, the molar percentage of the carboxyl-containing monomer is 10-20%, and the molar percentage of the auxiliary monomer is 10-20%.

[0020] Furthermore, the bridge-containing alicyclic structure monomer includes one or more of isobornyl acrylate, isobornyl methacrylate, dicyclopentyl acrylate, dicyclopentyl methacrylate, and dihydroxymethyldicyclopentane diacrylate.

[0021] Furthermore, the oxygen-containing heterocycloalkane monomer includes one or more of glycidyl acrylate, glycidyl methacrylate, 3,4-epoxycyclohexyl methyl acrylate, 3,4-epoxycyclohexyl methyl methacrylate, and oxetane methacrylate.

[0022] Furthermore, the hydroxyl-containing monomer includes one of acrylic acid or methacrylic acid.

[0023] Further, the auxiliary monomer includes any one or more of butyl acrylate, butyl methacrylate, n-octyl acrylate, n-octyl methacrylate, isooctyl acrylate, isooctyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-decyl acrylate, n-decyl methacrylate, isodecyl acrylate, isodecyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, benzyl acrylate, or benzyl methacrylate.

[0024] Furthermore, the weight average molecular weight of the resin is 1,000 to 20,000.

[0025] A resin composition composed of unsaturated acrylic resin, characterized in that it comprises the following components in percentage by mass:

[0026]

[0027] Further, the photopolymerizable monomer is methyl acrylate, methyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-1,2-ethylenediyl acrylate, ethylene glycol methacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, propylene glycol diacrylate, propylene glycol dimethacrylate, trimethylolpropane triacrylate, One or more of tetrakis(trimethylolpropane)tetraacrylate, tetrakis(trimethylolpropane)tetramethacrylate, pentaerythritol monoacrylate, pentaerythritol monomethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, polydipentaerythritol pentaacrylate, polydipentaerythritol pentamethacrylate, polydipentaerythritol hexaacrylate, polydipentaerythritol hexamethacrylate, and 1,6-hexanediol diacrylate; the photoinitiator is an oxime ester, and the general formula is: Where R12 is R13 is phenyl, C1-C20 alkyl, -CN, -NO2 or C1-C4 halogenated alkyl, R14 is C2-C12 alkyl or C4-C8 acyl, R15 to R19 are H, halogen atom, C1-C12 alkyl, phenyl or C6H5S-, R20 and R21 are H, halogen atom, C1-C12 alkyl or phenyl.

[0028] Further, the curing agent is one or more of dimethylaminopropylamine, diethylaminopropylamine, trimethylhexamethylenediamine, diaminomethylcyclohexane, menthanediamine, diaminocyclohexane, diaminocyclohexylmethane, diaminomethylcyclohexylmethane, m-phenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, benzophenonetetracarboxylic acid dianhydride, methyltetrahydrophthalic anhydride, dichloromaleic anhydride, methylhexahydrophthalic anhydride, ethylene glycol ditrimellitate, trimellitic anhydride, benzyldimethylamine, triethanolamine, 2-methylimidazole, 2-ethylimidazole, 2,4-dimethylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, and benzylimidazole;

[0029] The surfactant is a silicon-based surfactant; one or more of DC3PA, DC7PA, SH11PA from Dow Corning Toray Silicone Co., TSF 4440, TSF 4300, TSF 4445 from GE Toshiba Silicones Co., BYK310, BYK333, BYK-307, BYK-346 from BYK.

[0030] The ether ester solvent is one or more of propylene glycol monomethyl ether, propylene glycol methyl ether acetate, 3-methoxypropionic acid methyl ester, 3-ethoxypropionic acid ethyl ester, diethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, 3-methoxybutyl acetate, and cyclohexanone.

[0031] The beneficial effects of the present invention are:

[0032] 1. The support column formed by the unsaturated acrylic resin containing a bridged alicyclic structure and the resin composition thereof in the present invention can be cured at low temperature to form a dense cross-linked network, and due to its special spatial structure, it has high hardness, good recovery rate, good adhesion and other characteristics. It can effectively solve the problem of uneven distribution of liquid crystal after being squeezed and poor product due to low hardness, insufficient supporting force and poor recovery rate of the support column, and meet the needs of terminal products. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be described clearly and completely below.

[0034] Example 1: An unsaturated acrylic resin containing a bridged alicyclic structure for a low-temperature transparent support column, the general chemical structure of the resin is:

[0035]

[0036] Wherein, m, n, o are integers of 1 to 100 respectively; R1, R2, R3, R4 are hydrogen atoms; R5 is a C1 to C20 straight chain; R6 is R7 is a C1-C20 straight-chain oxacycloalkyl group; R8 is a C1-C20 straight-chain group; R9 is a hydrogen atom; R10 is a hydrogen atom; and R11 is a hydrogen atom.

[0037] The resin is copolymerized by the following monomers: alicyclic monomers containing bridges, monomers containing oxygen heterocycloalkyl, monomers containing hydroxyl, monomers containing carboxyl and auxiliary monomers; the molar percentage of alicyclic monomers containing bridges is 20%, the molar percentage of monomers containing oxygen heterocycloalkyl is 20%, the molar percentage of monomers containing hydroxyl is 20%, the molar percentage of monomers containing carboxyl is 20%, and the molar percentage of auxiliary monomers is 20%. The alicyclic monomer containing bridges is isobornyl acrylate, the monomer containing oxygen heterocycloalkyl is glycidyl acrylate, the monomer containing hydroxyl is acrylic acid, and the auxiliary monomer is butyl acrylate. The weight average molecular weight of the resin is 1000-20000.

[0038] Example 2: An unsaturated acrylic resin with a bridged alicyclic structure for a low-temperature transparent support column, the general chemical structure of the resin is:

[0039]

[0040] Wherein, m, n, and o are integers from 1 to 100 respectively;

[0041] R1, R2, R3, and R4 are methyl groups;

[0042] R5 is a C1-C20 branched alkyl group; R6 is R7 is a C1-C20 branched oxacycloalkyl group; R8 is a C1-C20 branched alkyl group; R9 is a methyl group; R10 is a C1-C10 alkyl group; and R11 is a C1-C10 alkyl group.

[0043] The resin is copolymerized by the following monomers: alicyclic monomers containing bridges, monomers containing oxygen heterocycloalkyl, monomers containing hydroxyl, monomers containing carboxyl and auxiliary monomers; the molar percentage of the alicyclic monomers containing bridges is 40%, the molar percentage of the monomers containing oxygen heterocycloalkyl is 10%, the molar percentage of the monomers containing hydroxyl is 30%, the molar percentage of the monomers containing carboxyl is 10%, and the molar percentage of the auxiliary monomer is 10%. The alicyclic monomer containing bridges is isobornyl methacrylate; the monomer containing oxygen heterocycloalkyl is glycidyl methacrylate; the monomer containing hydroxyl is methacrylic acid; and the auxiliary monomer is butyl methacrylate. The weight average molecular weight of the resin is 1000-20000.

[0044] Example 3: An unsaturated acrylic resin containing a bridged alicyclic structure for a low-temperature transparent support column, the general chemical structure of the resin is:

[0045]

[0046] Wherein, m, n, and o are integers from 1 to 100 respectively;

[0047] R1, R2, R3, and R4 are hydrogen atoms;

[0048] R5 is a C1-C20 straight chain, in which one -CH2- in the C1-C20 alkyl group is replaced by -O-; R6 is R7 is a C1-C20 straight-chain oxacycloalkyl group in which one -CH2- is replaced by -O-; R8 is a C1-C20 straight-chain alkyl group in which one -CH2- is replaced by -O-; R9 is a hydrogen atom; R10 is a hydrogen atom; R11 is a hydrogen atom.

[0049] The resin is copolymerized by the following monomers: alicyclic monomers containing bridges, oxygen-containing heterocycloalkyl monomers, hydroxyl-containing monomers, carboxyl-containing monomers and auxiliary monomers; the molar percentage of the alicyclic monomers containing bridges in the monomers is 36%, the molar percentage of the oxygen-containing heterocycloalkyl monomers is 18%, the molar percentage of the hydroxyl-containing monomers is 10%, the molar percentage of the carboxyl-containing monomers is 18%, and the molar percentage of the auxiliary monomers is 18%.

[0050] The bridge-containing alicyclic structure monomer is dicyclopentyl acrylate; the oxygen-containing heterocyclic monomer is 3,4-epoxycyclohexyl methyl acrylate; the hydroxyl-containing monomer is acrylic acid; the auxiliary monomer is n-octyl acrylate. The weight average molecular weight of the resin is 1000-20000.

[0051] Example 4: Referring to Examples 1, 2, and 3,

[0052] R1, R2, R3, and R4 are hydrogen atoms or methyl groups;

[0053] R5 is a C1-C20 straight or branched alkyl group, or at least one -CH2- in the C1-C20 alkyl group is replaced by any one or more of -O-, -CO-, -COO-, and -OCO- groups;

[0054] R7 is a C1-C20 straight or branched oxacycloalkyl group, or at least one -CH2- in the C1-C20 oxacycloalkyl group is replaced by any one or more of -O-, -CO-, -COO-, and -OCO- groups; R8 is a C1-C20 straight or branched alkyl group, or at least one -CH2- in the C1-C20 alkyl group is replaced by any one or more of -O-, -CO-, -COO-, and -OCO- groups;

[0055] The bridge-containing alicyclic structure monomer includes one or more of isobornyl acrylate, isobornyl methacrylate, dicyclopentyl acrylate, dicyclopentyl methacrylate, and dihydroxymethyldicyclopentane diacrylate.

[0056] The oxygen-containing heterocycloalkane monomer includes one or more of glycidyl acrylate, glycidyl methacrylate, 3,4-epoxycyclohexyl methyl acrylate, 3,4-epoxycyclohexyl methyl methacrylate, and oxetane methacrylate.

[0057] The hydroxyl-containing monomer includes one of acrylic acid or methacrylic acid.

[0058] The auxiliary monomers include any one or more of butyl acrylate, butyl methacrylate, n-octyl acrylate, n-octyl methacrylate, isooctyl acrylate, isooctyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-decyl acrylate, n-decyl methacrylate, isodecyl acrylate, isodecyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, benzyl acrylate, or benzyl methacrylate.

[0059] The weight average molecular weight of the resin is 1,000 to 20,000.

[0060] Embodiment 5: A resin composition composed of an unsaturated acrylic resin, comprising the following components in percentage by mass:

[0061]

[0062] The photopolymerization monomer is methyl acrylate; the photoinitiator is an oxime ester, and the general formula is: Where R12 is R13 is phenyl, R14 is C2-C12 alkyl, R15-R19 are H, and R20 and R21 are H.

[0063] The curing agent is dimethylaminopropylamine;

[0064] The surfactant is a silicon-based surfactant, DC3PA from Dow Corning Toray Silicone Co., Ltd.

[0065] The ether ester solvent is propylene glycol monomethyl ether.

[0066] Embodiment 6: A resin composition composed of an unsaturated acrylic resin, comprising the following components in percentage by mass:

[0067]

[0068] The photopolymerization monomer is methyl methacrylate; the photoinitiator is an oxime ester, and the general formula is: Where R12 is R13 is a C1-C20 alkyl group, R14 is a C4-C8 acyl group, R15 to R19 are halogen atoms, and R20 and R21 are halogen atoms.

[0069] The curing agent is diethylaminopropylamine;

[0070] The surfactant is a silicon-based surfactant.

[0071] Dow Corning Toray Silicones DC7PA,

[0072] The ether ester solvent is propylene glycol methyl ether acetate.

[0073] Embodiment 7: A resin composition composed of an unsaturated acrylic resin, comprising the following components in percentage by mass:

[0074]

[0075] The photopolymerizable monomer is 2-hydroxyethyl acrylate;

[0076] The photoinitiator is an oxime ester or a phosphine oxide, and the general formula is: Where R12 is R13 is -CN, R14 is a C4-C8 acyl group, R15 to R19 are C1-C12 alkyl groups, and R20 and R21 are C1-C12 alkyl groups.

[0077] The curing agent is trimethylhexamethylenediamine;

[0078] The surfactant is a silicon-based surfactant, SH11PA from Dow Corning Toray Silicone Co., Ltd.

[0079] The ether ester solvent is methyl 3-methoxypropionate.

[0080] Embodiment 8: A resin composition composed of unsaturated acrylic resin, comprising the following components in percentage by mass:

[0081]

[0082] The photopolymerizable monomer is 2-hydroxyethyl methacrylate;

[0083] The photoinitiator is an oxime ester with the general formula: Where R12 is R13 is -NO2, R14 is a C2-C12 alkyl group, R15 to R19 are phenyl groups, and R20 and R21 are phenyl groups.

[0084] The curing agent is diaminomethylcyclohexane;

[0085] The surfactant was a silicon-based surfactant, TSF 4440 from GE Toshiba Silicones Co.

[0086] The ether ester solvent is ethyl 3-ethoxypropionate.

[0087] Example 9: Refer to Examples 5, 6, 7, and 8.

[0088] The photopolymerizable monomer is one or more of methyl acrylate, methyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-1,2-ethylenediyl acrylate, ethylene glycol methacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate, triethylene glycol dimethacrylate, propylene glycol diacrylate, propylene glycol dimethacrylate, trimethylolpropane triacrylate, tetra(trimethylolpropane)tetraacrylate, tetra(trimethylolpropane)tetramethacrylate, pentaerythritol monoacrylate, pentaerythritol monomethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, polydipentaerythritol pentaacrylate, polydipentaerythritol pentamethacrylate, polydipentaerythritol hexaacrylate, polydipentaerythritol hexamethacrylate, and 1,6-hexanediol diacrylate; the photoinitiator is an oxime ester, and the general formula is: Where R12 is R13 is phenyl, C1-C20 alkyl, -CN, -NO2 or C1-C4 halogenated alkyl, R14 is C2-C12 alkyl or C4-C8 acyl, R15 to R19 are H, halogen atom, C1-C12 alkyl, phenyl or C6H5S-, R20 and R21 are H, halogen atom, C1-C12 alkyl or phenyl.

[0089] The curing agent is one or more of dimethylaminopropylamine, diethylaminopropylamine, trimethylhexamethylenediamine, diaminomethylcyclohexane, menthanediamine, diaminocyclohexane, diaminocyclohexylmethane, diaminomethylcyclohexylmethane, m-phenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, benzophenonetetracarboxylic dianhydride, methyltetrahydrophthalic anhydride, dichloromaleic anhydride, methylhexahydrophthalic anhydride, ethylene glycol ditrimellitate, trimellitic anhydride, benzyldimethylamine, triethanolamine, 2-methylimidazole, 2-ethylimidazole, 2,4-dimethylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, and benzylimidazole;

[0090] The surfactant is a commercially available silicon-based surfactant, one or more of DC3PA, DC7PA, SH11PA from Dow Corning Toray Silicone Co., TSF 4440, TSF 4300, TSF 4445 from GE Toshiba Silicones Co., BYK310, BYK333, BYK-307, BYK-346 from BYK.

[0091] The ether ester solvent is one or more of propylene glycol monomethyl ether, propylene glycol methyl ether acetate, 3-methoxypropionic acid methyl ester, 3-ethoxypropionic acid ethyl ester, diethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, 3-methoxybutyl acetate, and cyclohexanone.

[0092] Comparative Example 1: Referring to Example 7, the unsaturated acrylic resin containing a bridged alicyclic structure in Example 2 was replaced with a linear acrylic resin.

[0093] <Elastic recovery rate evaluation>

[0094] The products of Examples 5 to 8 and Comparative Example 1 were coated on a glass substrate using a spin coater (1H-36S: produced by Mikasa), dried on a baking sheet at 90°C for 4 min, and exposed with a mask using a scanning mercury lamp exposure machine (MPA-400: produced by Canon, Japan). The mask had a circular light leakage area with an aperture of 20 μm and a circular interval of 200 μm, thereby forming a circle of corresponding diameter on the substrate. The exposure energy was 100 mj / cm 2 After exposure, the surface was developed by spraying a 0.04% KOH (potassium hydroxide) developer for 100 seconds, and then baked in an oven at 150°C for 20 minutes to form a cured film with a thickness of 18um.

[0095] Using a micro-nano hardness tester (Fisher HM2000), the total displacement (um) and elastic displacement (um) were measured under the following test conditions, and the elastic recovery rate (%) was calculated using the measured values ​​as shown in Mathematical Formula 1. If the recovery rate is large, it is judged to be hard.

[0096]

Mathematical formula 1

[0097] Recovery rate (%) = [elastic displacement (um)] / [total displacement (um)] × 100

[0098]

Test conditions

[0099] Pressurization conditions: 0mN→50mN (pressurization time: 20sec);

[0100] Hold time: 5 seconds;

[0101] Pressure release condition: 50 mN → 0 mN (pressure release time: 20 sec).

[0102] <High temperature and high pressure deformation evaluation>

[0103] The above-mentioned unsaturated acrylic resin compositions containing bridged alicyclic structures of Examples 5 to 8 and Comparative Example 1 were coated on a glass substrate using a spin coater (1H-36S: produced by Mikasa), dried on a 90°C baking plate for 4 minutes, and exposed with a mask plate using a scanning mercury lamp exposure machine (MPA-400: produced by Canon, Japan). The mask plate had a circular light leakage area with an aperture of 20um and a circular interval of 200um, thereby forming a circle of corresponding diameter on the substrate. The exposure was performed with an exposure energy of 100mj / cm2. After exposure, the developer was developed by spraying a KOH (potassium hydroxide) developer with a concentration of 0.04% for 100 seconds, and then baked in a 150°C oven for 20 minutes to form a cured film with a film thickness of 18um. The spacer substrate was placed in a 150°C / 15atm oven for 1 hour and then taken out.

[0104] The substrate cylindrical region was observed using an optical microscope (BX51TRF: manufactured by Olympus), and the film thickness before and after high temperature and high pressure was measured. The measured values ​​were used to calculate the deformation amount (%) as shown in Mathematical Formula 2. If the deformation amount is large, it is judged that the support force is poor.

[0105]

Mathematical formula 2

[0106] Deformation (%) = [film thickness after high temperature and high pressure (um)] / [film thickness before high temperature and high pressure (um)] × 100

[0107] The test results are shown in Table 1

[0108]

[0109] The described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

Claims

1. An unsaturated acrylic resin containing a bridged alicyclic structure for a low-temperature transparent support column, characterized in that: The general chemical structure formula of the resin is: Wherein, m, n, and o are integers from 1 to 100 respectively; R1, R2, R3, and R4 are each a hydrogen atom or a methyl group; R5 is a C1-C20 straight chain or branched alkyl group, or at least one -CH2- in the C1-C20 alkyl group is replaced by any one or more of -O-, -CO-, -COO-, and -OCO- groups; R6 is R7 is a C1-C20 straight or branched oxacycloalkyl group, or at least one -CH2- in the C1-C20 oxacycloalkyl group is replaced by any one or more of -O-, -CO-, -COO-, and -OCO- groups; R8 is a C1-C20 straight or branched alkyl group, or at least one -CH2- in the C1-C20 alkyl group is replaced by any one or more of -O-, -CO-, -COO-, and -OCO- groups; R9 is a hydrogen atom or a methyl group; R10 is a hydrogen atom or a C1-C10 alkyl group; R11 is a hydrogen atom or a C1-C10 alkyl group.

2. The unsaturated acrylic resin containing a bridged alicyclic structure for a low-temperature transparent support column according to claim 1, characterized in that: The resin is copolymerized by the following monomers: alicyclic monomers containing bridges, monomers containing oxygen heterocycloalkyl groups, monomers containing hydroxyl groups, monomers containing carboxyl groups and auxiliary monomers; the molar percentage of the alicyclic monomers containing bridges in the monomers is 20-40%, the molar percentage of the monomers containing oxygen heterocycloalkyl groups is 10-20%, the molar percentage of the monomers containing hydroxyl groups is 10-30%, the molar percentage of the monomers containing carboxyl groups is 10-20%, and the molar percentage of the auxiliary monomers is 10-20%.

3. The unsaturated acrylic resin containing a bridged alicyclic structure for a low-temperature transparent support column according to claim 2, characterized in that: The bridge-containing alicyclic structure monomer includes one or more of isobornyl acrylate, isobornyl methacrylate, dicyclopentyl acrylate, dicyclopentyl methacrylate, and dihydroxymethyldicyclopentane diacrylate.

4. The unsaturated acrylic resin containing a bridged alicyclic structure for a low-temperature transparent support column according to claim 2, characterized in that: The oxygen-containing heterocycloalkane monomer includes one or more of glycidyl acrylate, glycidyl methacrylate, 3,4-epoxycyclohexyl methyl acrylate, 3,4-epoxycyclohexyl methyl methacrylate, and oxetane methacrylate.

5. The unsaturated acrylic resin containing a bridged alicyclic structure for a low-temperature transparent support column according to claim 2, characterized in that: The hydroxyl-containing monomer includes one of acrylic acid or methacrylic acid.

6. The unsaturated acrylic resin containing a bridged alicyclic structure for a low-temperature transparent support column according to claim 2, characterized in that: The auxiliary monomers include any one or more of butyl acrylate, butyl methacrylate, n-octyl acrylate, n-octyl methacrylate, isooctyl acrylate, isooctyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-decyl acrylate, n-decyl methacrylate, isodecyl acrylate, isodecyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, benzyl acrylate, or benzyl methacrylate.

7. The unsaturated acrylic resin containing a bridged alicyclic structure for a low-temperature transparent support column according to claim 1, characterized in that: The weight average molecular weight of the resin is 1,000 to 20,000.

8. A resin composition comprising the unsaturated acrylic resin according to any one of claims 1 to 7, characterized in that: The following components are included in mass percentage:

9. The resin composition composed of unsaturated acrylic resin according to claim 8, characterized in that: The photopolymerizable monomer is one or more of methyl acrylate, methyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-1,2-ethylenediyl acrylate, ethylene glycol methacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate, triethylene glycol dimethacrylate, propylene glycol diacrylate, propylene glycol dimethacrylate, trimethylolpropane triacrylate, tetra(trimethylolpropane)tetraacrylate, tetra(trimethylolpropane)tetramethacrylate, pentaerythritol monoacrylate, pentaerythritol monomethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, polydipentaerythritol pentaacrylate, polydipentaerythritol pentamethacrylate, polydipentaerythritol hexaacrylate, polydipentaerythritol hexamethacrylate, and 1,6-hexanediol diacrylate; the photoinitiator is an oxime ester, and the general formula is: Where R12 is R13 is phenyl, C1-C20 alkyl, -CN, -NO2 or C1-C4 halogenated alkyl, R14 is C2-C12 alkyl or C4-C8 acyl, R15 to R19 are H, halogen atom, C1-C12 alkyl, phenyl or C6H5S-, R20 and R21 are H, halogen atom, C1-C12 alkyl or phenyl.

10. The resin composition composed of unsaturated acrylic resin according to claim 8, characterized in that: The curing agent is one or more of dimethylaminopropylamine, diethylaminopropylamine, trimethylhexamethylenediamine, diaminomethylcyclohexane, menthanediamine, diaminocyclohexane, diaminocyclohexylmethane, diaminomethylcyclohexylmethane, m-phenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, benzophenonetetracarboxylic acid dianhydride, methyltetrahydrophthalic anhydride, dichloromaleic anhydride, methylhexahydrophthalic anhydride, ethylene glycol ditrimellitate, trimellitic anhydride, benzyldimethylamine, triethanolamine, 2-methylimidazole, 2-ethylimidazole, 2,4-dimethylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, and benzylimidazole; The surfactant is a silicon-based surfactant; one or more of DC3PA, DC7PA, SH11PA from Dow Corning Toray Silicone Co., TSF 4440, TSF 4300, TSF 4445 from GE Toshiba Silicones Co., BYK310, BYK333, BYK-307, BYK-346 from BYK. The ether ester solvent is one or more of propylene glycol monomethyl ether, propylene glycol methyl ether acetate, 3-methoxypropionic acid methyl ester, 3-ethoxypropionic acid ethyl ester, diethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, 3-methoxybutyl acetate, and cyclohexanone.

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