Insulating heat-conducting PC material and preparation method thereof

Abstract

The invention discloses an insulating heat-conducting PC material and a preparation method thereof, and belongs to the technical field of high polymer materials. The insulating and heat-conducting PC material comprises the following raw materials in parts by mass: 50-70 parts of PC resin; 25-40 parts of a heat-conducting filler; 5-10 parts of a toughening agent; 0.5 to 1 part of an interface solubilizer; 0.3 to 0.5 part of an antioxidant; 0.3 to 0.5 part of a lubricant; the PC material is prepared from universal PC, a heat-conducting filler, a flexibilizer, an interface solubilizer, a lubricant and an antioxidant, and the raw materials are easy to obtain and can be directly used for industrial production; the cantilever beam notch impact strength of the prepared insulating and heat-conducting PC material is greater than or equal to 20 KJ / m < 2 >, the melt index is greater than or equal to 20 g / 10 min, and the heat conductivity coefficient is greater than or equal to 0.6 W / (m.k), so that the injection molding requirements of large-size and thin-wall workpieces can be met.

Description

Technical Field

[0001] The invention belongs to the technical field of polymer materials, and in particular relates to an insulating thermal conductive PC material and a preparation method thereof. Background Art

[0002] With the widespread popularity of 5G business, the performance of electronic products is becoming more and more powerful, the integration and assembly density are constantly improving, and the working power consumption and heat generation are increasing sharply, which puts higher thermal conductivity requirements on polymer materials. The booming development of AI applications has also put forward higher requirements on the computing power of upstream AI chips. The heat flux of chips is also increasing, which also significantly increases the demand for thermal conductive materials. The dimensional stability and flame retardancy of thermal conductive PC materials themselves have become the focus of current research.

[0003] Polycarbonate (PC) is an amorphous thermoplastic resin with excellent comprehensive properties. It has excellent electrical insulation, elongation, dimensional stability and chemical corrosion resistance, and has high strength, heat resistance and cold resistance. It also has the advantages of self-extinguishing, flame retardant, non-toxic, and colorable. The thermal conductivity of PC material itself is as low as 0.2W / (mk). PC material itself is sensitive to notches, and the alkalinity of alkali metals and their oxides will cause PC to decompose. Currently, there is little research on thermally conductive PC.

[0004] After PC materials are molded, the residual stress is large, it is easy to crack, and it is extremely sensitive to notches. At present, most people add ABS or toughening agents to adjust the fluidity and toughness of PC materials, making them easier to process and meeting the toughness requirements of parts. However, due to the presence of benzene rings in the PC molecular chain, the melt viscosity is large and it is easy to crack during use. Especially after adding thermal conductive fillers, the toughness of the product drops sharply. Now the trend of plastic products is thin-walled, large-sized, and lightweight. The current technical level limits the expansion of the application of thermal conductive PC products. It is urgent to develop an insulating thermal conductive PC material suitable for large-sized thin-wall injection molding. Summary of the invention

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide an insulating thermally conductive PC material and a preparation method thereof, which solves the problems in the prior art.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] An insulating thermally conductive PC material, comprising the following raw materials in parts by weight:

[0008]

[0009] Furthermore, the PC resin is aromatic polycarbonate.

[0010] Furthermore, the thermally conductive filler is at least one of boron nitride, titanium dioxide, and talc.

[0011] Furthermore, the toughening agent is at least one of a terpolymer of methyl methacrylate-butadiene-styrene, an ethylene-methyl acrylate copolymer, polyethylene, and ethylene-butyl acrylate-glycidyl methacrylate.

[0012] Furthermore, the interfacial solubilizing agent is a mixed shell type polymer nanoparticle.

[0013] Furthermore, the antioxidant is at least one of a hindered phenol antioxidant, a thioester antioxidant, and a phosphite antioxidant.

[0014] Furthermore, the lubricant is at least one of polyethylene wax, silicone masterbatch, montan wax, and pentaerythritol stearate.

[0015] The above-mentioned method for preparing an insulating thermally conductive PC material comprises the following steps:

[0016] Add PC resin, toughening agent, interface solubilizer, antioxidant and lubricant into a mixer protected by nitrogen and mix them evenly to obtain a mixed material;

[0017] The mixed material is put into a parallel twin-screw extruder for melting, and a thermal conductive filler is added through a side feeding port. After extrusion and granulation, an insulating thermal conductive PC material is obtained.

[0018] Furthermore, the barrel temperature of the extruder is 240-260° C., the screw speed is 400-600 r / min, and the vacuum degree is -0.04 to -0.1 MPa.

[0019] The above-mentioned insulating thermal conductive PC material is used as a raw material in the preparation of electronic product casings.

[0020] Beneficial effects of the present invention:

[0021] 1. The insulating thermally conductive PC material prepared by the present invention is prepared by using general PC, thermally conductive filler, toughening agent, interface solubilizer, lubricant and antioxidant, and its raw materials are easily available and can be directly used in industrial production.

[0022] 2. According to conventional testing standards, the insulating thermal conductive PC material prepared by the present invention has a cantilever beam notched impact strength of ≥20KJ / m 2 , melt index ≥ 20g / 10min, thermal conductivity ≥ 0.6W / (mk), thus meeting the injection molding requirements of large-size, thin-walled parts.

[0023] 3. The insulating and thermally conductive PC material of the present invention can obtain a good high-gloss surface effect through mold injection molding, and can also be used to solve the problem of recycling and reusing waste plastic source PC. DETAILED DESCRIPTION

[0024] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solution of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] An insulating thermally conductive PC material comprises the following raw materials in parts by weight:

[0026] PC resin 50-70 parts

[0027]

[0028] The PC resin is at least one of aliphatic aromatic polycarbonates.

[0029] The thermal conductive filler is at least one of boron nitride, titanium dioxide, and talc powder with a high aspect ratio.

[0030] The toughening agent is at least one of polyethylene, terpolymer of methyl methacrylate-butadiene-styrene, ethylene-methyl acrylate copolymer, and ethylene-butyl acrylate-glycidyl methacrylate.

[0031] The interfacial solubilizer is a mixed-shell polymer nanoparticle with high interfacial activity;

[0032] The antioxidant is at least one of a hindered phenol antioxidant, a thioester antioxidant, and a phosphite antioxidant; specifically, the hindered phenol antioxidant is antioxidant 1076, the thioester antioxidant is antioxidant DLTP, and the phosphite antioxidant is antioxidant 168.

[0033] The lubricant is selected from at least one of polyethylene wax, silicone masterbatch, montan wax and pentaerythritol stearate.

[0034] The following examples are used to illustrate the preparation process of the insulating thermally conductive PC material. The parts used in the examples and comparative examples are all parts by mass, and the specific types of raw materials involved are as follows:

[0035] Aromatic polycarbonate: Teijin 1250Y:

[0036] Ethylene-methyl acrylate copolymer: DuPont Chemical EMA 1330AC

[0037] Methyl methacrylate-butadiene-styrene terpolymer: Dow Chemical MBS2690

[0038] Thermal conductive filler: Weifang Bonde boron nitride, titanium dioxide is Conos K2233, talc is Yiruishi T84;

[0039] Interfacial solubilizer: mixed shell polymer nanoparticles, the manufacturer is Mitsui Chemicals customized product CP-1;

[0040] Example 1

[0041] In this embodiment, the insulating thermally conductive PC material includes the following raw materials in parts by weight:

[0042]

[0043] In this embodiment, the aromatic polycarbonate is specifically Teijin Chemical L1250Y, and the thermal conductive filler is a blend of boron nitride, titanium dioxide, and talc;

[0044] The preparation method of the insulating thermal conductive PC material comprises the following steps:

[0045] (1) 70 parts of aromatic polycarbonate, 5 parts of methyl methacrylate-butadiene-styrene terpolymer, 0.5 parts of interfacial solubilizer, 0.1 parts of antioxidant 1076, 0.1 parts of antioxidant 168, 0.1 parts of antioxidant DLTP, and 0.3 parts of pentaerythritol stearate were added to a nitrogen-protected mixer and mixed at high speed for 6 minutes;

[0046] (2) The mixed material of step (1) is put into a parallel twin-screw extruder for melting, and 25 parts of thermal conductive filler is added through a side feeding port, and the mixture is extruded and granulated to obtain an insulating thermal conductive PC material; wherein the barrel temperature of the extruder is 240° C., the screw speed is 400 r / min, the melt pressure is 1.5 MPa, and the vacuum degree is -0.04 MPa, so that the insulating thermal conductive PC material is obtained.

[0047] Example 2

[0048] In this embodiment, the insulating thermally conductive PC material includes the following raw materials in parts by weight:

[0049]

[0050] In this embodiment, the aromatic polycarbonate is specifically Teijin's 1250Y, and the thermal conductive filler is a blend of talc, boron nitride, and titanium dioxide;

[0051] The preparation method of the insulating thermal conductive PC material comprises the following steps:

[0052] (1) 70 parts of aromatic polycarbonate, 1 part of ethylene-methyl acrylate copolymer, 4 parts of methyl methacrylate-butadiene-styrene terpolymer, 0.1 part of antioxidant 1076, 0.2 part of antioxidant 168, 0.2 part of antioxidant DLTP, 0.3 part of pentaerythritol stearate, and 0.5 part of interfacial solubilizer were added to a nitrogen-protected mixer and mixed at high speed for 6 minutes;

[0053] (2) The mixed material of step (1) is put into a parallel twin-screw extruder for melting, and 25 parts of thermal conductive filler is added at the side feeding port of the extruder through a liquid pump, and then extruded and granulated to obtain an insulating thermal conductive PC material; wherein the barrel temperature of the extruder is 280° C., the screw speed is 600 r / min, the melt pressure is 1.5 MPa, and the vacuum degree is -0.10 Pa, and the insulating thermal conductive PC material is obtained.

[0054] Example 3

[0055] In this embodiment, the insulating thermally conductive PC material includes the following raw materials in parts by weight:

[0056]

[0057] In this embodiment, the aliphatic polycarbonate is Teijin 1250Y, and the thermal conductive filler is a blend of talc and titanium dioxide;

[0058] The preparation method of the insulating thermal conductive PC material comprises the following steps:

[0059] (1) 50 parts of aromatic polycarbonate, 2 parts of polyethylene, 8 parts of methyl methacrylate-butadiene-styrene terpolymer, 0.1 parts of antioxidant 1076, 0.2 parts of antioxidant 168, 0.2 parts of antioxidant DLTP, 0.5 parts of montan wax, and 1 part of interfacial solubilizer were added to a nitrogen-protected mixer and mixed at high speed for 2 minutes;

[0060] (2) The mixed material of step (1) is put into a parallel twin-screw extruder for melting, and 40 parts of thermal conductive filler is added at the side feeding port of the extruder through a liquid pump, and the insulating thermal conductive PC material is obtained by extrusion and granulation; wherein the barrel temperature of the extruder is 260° C., the screw speed is 400 r / min, the melt pressure is 1.5 MPa, and the vacuum degree is -0.04 MPa, and the insulating thermal conductive PC material is obtained.

[0061] Example 4

[0062] In this embodiment, the insulating thermally conductive PC material includes the following raw materials in parts by weight:

[0063]

[0064] In this embodiment, the aliphatic polycarbonate is specifically Teijin L1250Y, and the thermal conductive filler is a blend of boron nitride and titanium dioxide;

[0065] The preparation method of the insulating thermal conductive PC material comprises the following steps:

[0066] (1) 65 parts of aromatic polycarbonate, 2 parts of ethylene-methyl acrylate copolymer, 6 parts of methyl methacrylate-butadiene-styrene terpolymer, 0.1 parts of antioxidant 1076, 0.2 parts of antioxidant 168, 0.2 parts of antioxidant DLTP, 0.5 parts of montan wax, and 0.5 parts of interfacial solubilizer were added to a nitrogen-protected mixer and mixed at high speed for 2 minutes;

[0067] (2) The mixed material of step (1) is put into a parallel twin-screw extruder for melting, and 28 parts of thermal conductive filler is added at the side feeding port of the extruder through a liquid pump, and the insulating thermal conductive PC material is obtained by extrusion and granulation; wherein the barrel temperature of the extruder is 260° C., the screw speed is 400 r / min, the melt pressure is 1.5 MPa, and the vacuum degree is -0.04 MPa, and the insulating thermal conductive PC material is obtained.

[0068] Comparative Example 1

[0069] The difference between Comparative Example 1 and Example 1 is that no interfacial solubilizing agent is used in the comparative example;

[0070] Experimental verification

[0071] The main physical properties of the PC materials obtained in the above Examples 1-4 and Comparative Example 1 were tested for their tensile strength, elongation at break, flexural strength, flexural modulus, cantilever beam notched impact strength, density and thermal conductivity according to relevant testing standards. The testing standards and test results are shown in Table 1 below:

[0072] Table 1 Main physical properties of PC materials of Examples 1-4 and Comparative Example 1

[0073]

[0074] From the experimental data in Table 1, we can see that:

[0075] 1) The improvement of the thermal conductivity of the product is mainly due to the formation of a thermal conductive network chain. With the addition of thermal conductive fillers to the product and the reasonable combination of different thermal conductive fillers, the thermal conductivity of the product will be significantly improved.

[0076] 2) After adding the interfacial solubilizer, the comprehensive performance and thermal conductivity of the product have been significantly improved, providing performance support for the practical application of thermal conductive products.

[0077] 3) Combining Example 1 and Comparative Example 1, it can be seen that:

[0078] After adding the interfacial solubilizer, the comprehensive performance of the product was significantly changed, especially the toughness index of the product: the notched impact and elongation at break were significantly improved;

[0079] Surprisingly, the thermal conductivity of the product also increased by about 20%, which also significantly improved the thermal conductivity of the product.

[0080] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0081] The above shows and describes the basic principle, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. For example, if functional additives such as ultraviolet light absorbers, light stabilizers, antistatic agents, colorants, etc. are added to the preparation components of the present invention, so that the composite material has corresponding characteristics, it is also protected by the present invention.

[0082] The above description of the embodiments is to facilitate the understanding and application of the present invention by those skilled in the art. It is obvious that those skilled in the art can easily make various modifications to the implementation cases and apply the general principles described herein to other embodiments without creative work. Therefore, the present invention is not limited to the implementation cases herein, and improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the present invention should be within the scope of protection of the present invention.

Claims

1. An insulating thermally conductive PC material, characterized in that: Including the following raw materials by weight:

2. The insulating thermally conductive PC material according to claim 1, characterized in that: The PC resin is aromatic polycarbonate.

3. The insulating thermally conductive PC material according to claim 1, characterized in that: The thermal conductive filler is at least one of boron nitride, titanium dioxide and talc.

4. The insulating thermally conductive PC material according to claim 1, characterized in that: The toughening agent is at least one of a terpolymer of methyl methacrylate-butadiene-styrene, an ethylene-methyl acrylate copolymer, polyethylene, and ethylene-butyl acrylate-glycidyl methacrylate.

5. The insulating thermally conductive PC material according to claim 1, characterized in that: The interfacial solubilizer is a mixed shell polymer nanoparticle.

6. The insulating thermally conductive PC material according to claim 1, characterized in that: The antioxidant is at least one of a hindered phenol antioxidant, a thioester antioxidant, and a phosphite antioxidant.

7. The insulating thermally conductive PC material according to claim 1, characterized in that: The lubricant is at least one of polyethylene wax, silicone masterbatch, montan wax and pentaerythritol stearate.

8. A method for preparing an insulating thermally conductive PC material according to any one of claims 1 to 7, characterized in that: The following steps are involved: Add PC resin, toughening agent, interface solubilizer, antioxidant and lubricant into a mixer protected by nitrogen and mix them evenly to obtain a mixed material; The mixed material is put into a parallel twin-screw extruder for melting, and a thermal conductive filler is added through a side feeding port. After extrusion and granulation, an insulating thermal conductive PC material is obtained.

9. The method for preparing an insulating thermally conductive PC material according to claim 8, characterized in that: The barrel temperature of the extruder is 240-260° C., the screw speed is 400-600 r / min, and the vacuum degree is -0.04 to -0.1 MPa.

10. Use of the insulating thermal conductive PC material according to any one of claims 1 to 7 as a raw material in the preparation of electronic product housings.

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