Carrier copper foil surface treatment machine and treatment process

Abstract

The invention provides a carrier copper foil surface treatment machine and process, the carrier copper foil surface treatment machine comprises an unwinding roller, a chemical plating tank, a cleaning pool, an electroplating tank, an anti-oxidation tank and a winding roller, the unwinding roller is wound with a plastic film, and the plastic film sequentially passes through the chemical plating tank, the cleaning pool, the electroplating tank, the cleaning pool, the anti-oxidation tank and the cleaning pool; the plastic film is wound on the winding roller; the chemical plating tank is used for generating a stripping layer on the plastic film, the electroplating tank is used for generating a thickened copper layer on the stripping layer, and the anti-oxidation tank is used for generating an anti-oxidation layer on the thickened copper layer. The cleaning pool comprises a first cleaning pool, a second cleaning pool and a third cleaning pool, the carrier copper foil located between the chemical plating tank and the electroplating tank passes through the first cleaning pool, the carrier copper foil located between the electroplating tank and the anti-oxidation tank passes through the second cleaning pool, and the carrier copper foil located between the anti-oxidation tank and the winding roller passes through the third cleaning pool. The carrier attached to the copper foil can be improved, and the production cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of copper foil production, and in particular to a carrier copper foil surface treatment machine and treatment process. Background Art

[0002] Copper foil surface treatment machine is an industrial equipment, mainly used for surface treatment of copper foil. Copper foil has low surface oxygen characteristics, can be attached to a variety of different substrates, such as metal or insulating materials, and has a wide temperature range. It is mainly used for electromagnetic shielding and antistatic. The conductive copper foil is placed on the substrate surface and combined with the metal substrate. It has excellent conductivity and provides electromagnetic shielding effect. In today's rapid development of the electronic information industry, the use of copper foil is also increasing, for example, it is used in the manufacture of printed circuit boards (PCBs) and lithium batteries and other products.

[0003] At present, copper foil surface treatment machines usually use metal foil as a carrier. Although these materials have certain stability and carrying capacity, they also have problems such as heavy weight and high cost. Therefore, the copper foil surface treatment machine in the related art needs to be improved. Summary of the invention

[0004] In order to improve the carrier to which the copper foil is attached, design a matching copper foil surface treatment machine, and reduce production costs, the present application provides a carrier copper foil surface treatment machine and a treatment process.

[0005] In a first aspect, the present application provides a carrier copper foil surface treatment machine, which adopts the following technical solution: A carrier copper foil surface treatment machine comprises an unwinding roller, a chemical plating tank, a cleaning tank, an electroplating tank, an anti-oxidation tank and a winding roller, wherein the unwinding roller is wound with a plastic film, the plastic film passes through the chemical plating tank, the cleaning tank, the electroplating tank, the cleaning tank, the anti-oxidation tank and the cleaning tank in sequence, and the plastic film is wound on the winding roller; the chemical plating tank is used to generate a peeling layer on the plastic film, the electroplating tank is used to generate a thickened copper layer on the peeling layer, and the anti-oxidation tank is used to generate an anti-oxidation layer on the thickened copper layer.

[0006] By adopting the above technical solution, the unwinding roller unwinds the plastic film, and the plastic film first enters the chemical plating tank, and the chemical plating tank generates a peeling layer on the plastic film, and then the plastic film enters the cleaning tank for cleaning. Then the plastic film enters the electroplating tank, and the electroplating tank generates a thickened copper layer on the peeling layer, and then the plastic film enters the cleaning tank for cleaning. Then the plastic film enters the anti-oxidation tank, and the anti-oxidation tank generates an anti-oxidation layer on the thickened copper layer, and then the plastic film enters the cleaning tank for cleaning, and finally the winding roller winds up the carrier copper foil. The present application uses plastic film as a carrier, which can reduce weight and reduce costs.

[0007] Optionally, the cleaning pool includes a first cleaning pool, a second cleaning pool and a third cleaning pool, the carrier copper foil located between the chemical plating pool and the electroplating pool passes through the first cleaning pool, the carrier copper foil located between the electroplating pool and the anti-oxidation pool passes through the second cleaning pool, and the carrier copper foil located between the anti-oxidation pool and the winding roller passes through the third cleaning pool.

[0008] By adopting the above technical solution, the first cleaning tank cleans the carrier copper foil that has passed through the chemical plating tank, reducing the carrier copper foil from transferring the solution in the chemical plating tank to the electroplating tank. The second cleaning tank cleans the carrier copper foil that has passed through the electroplating tank, reducing the carrier copper foil from transferring the solution in the electroplating tank to the anti-oxidation tank. The third cleaning tank cleans the carrier copper foil that has passed through the anti-oxidation tank, which is conducive to winding the carrier copper foil on the winding roller. The first cleaning tank, the second cleaning tank and the third cleaning tank of the present application are independent of each other, reducing the influence between each other, and can clean the carrier copper foil more fully.

[0009] Optionally, the chemical plating tank, the electroplating tank and the anti-oxidation tank are all provided with rotating rollers and adjusting rollers, and the plastic film passes around the rotating rollers and the adjusting rollers; The chemical plating tank, the electroplating tank and the anti-oxidation tank are all provided with lifting components, and the lifting components are used to drive the adjusting roller to move.

[0010] By adopting the above technical solution, when the lifting assembly drives the adjusting roller to move, the tensioning force of the carrier copper foil can be adjusted.

[0011] Optionally, the lifting assembly includes: A guide track, wherein the guide track is arranged in the chemical plating tank, the electroplating tank and the anti-oxidation tank; A supporting slider, wherein the supporting slider is slidably connected to the guide rail, and the adjusting roller is rotatably connected to the supporting slider; A driving source is provided, wherein the driving source is used to drive the supporting sliding block to slide along the guide track.

[0012] By adopting the above technical solution, the driving source is started, the driving source drives the supporting slider to move, and the supporting slider slides along the guide track, thereby changing the position of the adjusting roller, and the tension of the carrier copper foil can be adjusted.

[0013] Optionally, the lifting assembly and the adjusting roller are both provided in plurality, and the lifting assembly can drive the adjusting roller to be immersed in or away from the solution in the chemical plating tank, the electroplating tank and the anti-oxidation tank.

[0014] By adopting the above technical solution, for the production of carrier copper foils of different specifications, the immersion time of the carrier copper foil in the chemical plating tank, the electroplating tank and the anti-oxidation tank is different. The lifting component drives the adjustment roller to immerse in or away from the solution in the chemical plating tank, the electroplating tank and the anti-oxidation tank, so that the immersion time of the carrier copper foil in the solution can be adjusted as needed to produce copper foils of different thicknesses.

[0015] Optionally, the adjusting roller and the lifting assembly are also arranged in the cleaning tank, and the lifting assembly can drive the adjusting roller to immerse into or move away from the cleaning tank.

[0016] By adopting the above technical solution, the lifting component drives the adjustment roller to immerse in or away from the cleaning tank, and the cleaning time of the carrier copper foil can be adjusted. When the immersion time of the carrier copper foil in the chemical plating tank, the electroplating tank and the anti-oxidation tank is different, the corresponding cleaning time of the carrier copper foil is also different. If the cleaning time is too long, it is easy to affect the stability of the peeling layer, the thickened copper layer and the anti-oxidation layer on the surface of the carrier copper foil; if the cleaning time is too short, it is easy to make the carrier copper foil not cleaned, so that the surface of the carrier copper foil will adhere to the solution of the previous step, thereby affecting the next step.

[0017] Optionally, a drying component is provided between the third cleaning tank and the winding roller, and the drying component is used to dry the moisture on the surface of the carrier copper foil.

[0018] By adopting the above technical solution, the drying component dries the moisture on the surface of the carrier copper foil before the carrier copper foil is rolled up, which is beneficial to the storage of the carrier copper foil after rolling up.

[0019] Optionally, a plurality of drying components are provided, and the drying components are also provided between the first cleaning tank and the electroplating tank, and between the second cleaning tank and the anti-oxidation tank.

[0020] By adopting the above technical solution, after the carrier copper foil is cleaned in the first cleaning tank and the second cleaning tank, moisture will adhere to the surface of the carrier copper foil. The moisture attached to the surface of the carrier copper foil will affect the electroplating effect, thereby affecting the formation of the peeling layer, thickened copper layer and anti-oxidation layer of the carrier copper foil.

[0021] Optionally, the drying component includes a drying chamber, a wiping roller, a water absorption roller and a hot air blower, the wiping roller and the water absorption roller are both rotatably connected in the drying chamber, the wiping roller is in contact with the carrier copper foil, and the water absorption roller is in contact with the wiping roller; the air outlet of the hot air blower faces the carrier copper foil, the wiping roller and the water absorption roller.

[0022] By adopting the above technical solution, the carrier copper foil drives the wiping roller to rotate, the wiping roller absorbs the moisture on the surface of the carrier copper foil, the wiping roller drives the water absorbing roller to rotate, and the water absorbing roller absorbs the moisture of the wiping roller. The hot air blower blows hot air to the carrier copper foil, the wiping roller and the water absorbing roller, which can dry the moisture of the carrier copper foil, the wiping roller and the water absorbing roller.

[0023] In a second aspect, the present application also provides a carrier copper foil surface treatment process, using the above-mentioned carrier copper foil surface treatment machine, comprising the following steps: S1: unwinding roller unwinds the plastic film; S2: The chemical plating tank generates a peeling layer on the plastic film. S3: The first cleaning tank cleans the carrier copper foil, and then the drying component dries the carrier copper foil; S4: The electroplating tank generates a thickened copper layer on the stripped layer. S5: The second cleaning tank cleans the carrier copper foil, and then the drying component dries the carrier copper foil; S6: The anti-oxidation tank forms an anti-oxidation layer on the thickened copper layer; S7: The third cleaning tank cleans the carrier copper foil, and then the drying component dries the carrier copper foil; S8: The winding roller winds up the carrier copper foil.

[0024] In summary, the present application includes at least one of the following beneficial effects: 1. The chemical plating tank generates a peeling layer on the plastic film, the electroplating tank generates a thickened copper layer on the peeling layer, and the anti-oxidation tank generates an anti-oxidation layer on the thickened copper layer, thereby forming a carrier copper foil with the plastic film as a carrier, which can reduce weight and cost; 2. The driving source is pushed to drive the support slider to move, and the support slider slides along the guide track, thereby changing the position of the adjustment roller, and adjusting the tension of the carrier copper foil; 3. The lifting component drives the adjusting roller to immerse in or away from the solution in the chemical plating tank, electroplating tank and anti-oxidation tank, so that the immersion time of the carrier copper foil in the solution can be adjusted as needed to produce copper foils of different thicknesses; and the lifting component drives the adjusting roller to immerse in or away from the cleaning tank, so as to adjust the cleaning time of the carrier copper foil. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the overall structure of the carrier copper foil surface treatment machine of Example 1 of the present application; Figure 2 It is a schematic diagram of the structure of the chemical plating tank, the first cleaning tank and the drying component in Example 1 of the present application; Figure 3 This is a schematic diagram of the structure of the lifting assembly and the adjusting roller of Example 1 of the present application; Figure 4is a schematic diagram of the structure of the drying component of Example 1 of the present application; Figure 5 This is a schematic diagram of the overall structure of a carrier copper foil surface treatment machine according to Example 3 of the present application; Figure 6 is a schematic diagram of the lifting assembly of Example 3 of the present application driving the adjusting roller away from the liquid surface; Figure 7 It is a schematic diagram of the structure of the chemical plating tank, the first cleaning tank and the drying component in Example 3 of the present application.

[0026] Explanation of the reference numerals: 1. unwinding roller; 2. chemical plating tank; 3. cleaning tank; 31. first cleaning tank; 32. second cleaning tank; 33. third cleaning tank; 4. electroplating tank; 5. anti-oxidation tank; 6. winding roller; 7. lifting assembly; 71. guide rail; 72. supporting slider; 73. driving source; 8. adjusting roller; 9. rotating roller; 10. drying assembly; 101. drying chamber; 102. wiping roller; 103. water absorption roller; 104. hot air blower. DETAILED DESCRIPTION

[0027] The following is combined with Figure 1-7 This application is described in further detail.

[0028] Embodiment 1: Embodiment 1 of the present application provides a carrier copper foil surface treatment machine.

[0029] refer to Figure 1 and Figure 2 , the carrier copper foil surface treatment machine includes an unwinding roller 1, a rotating roller 9, a chemical plating tank 2, an electroplating tank 4, an anti-oxidation tank 5 and a winding roller 6. The unwinding roller 1 is wound with a strip of plastic film, and a plurality of rotating rollers 9 are provided, and the rotating rollers 9 are respectively connected to the chemical plating tank 2, the electroplating tank 4 and the anti-oxidation tank 5. The plastic film bypasses the rotating roller 9, and the rotating roller 9 is immersed in the solution of the chemical plating tank 2, the electroplating tank 4 and the anti-oxidation tank 5, and the plastic film passes through the chemical plating tank 2, the electroplating tank 4 and the anti-oxidation tank 5 in sequence. The chemical plating tank 2 can generate a peeling layer on the surface of the plastic film, the electroplating tank 4 can form a thickened copper layer on the surface of the peeling layer, and the anti-oxidation tank 5 can form an anti-oxidation layer on the surface of the thickened copper layer. In this embodiment, for the convenience of description, the plastic film is called a carrier copper foil after passing through the chemical plating tank 2, the electroplating tank 4 and the anti-oxidation tank 5 respectively. Finally, the carrier copper foil is wound on the winding roller 6, and the winding roller 6 winds up the carrier copper foil. Since the peeling layer can facilitate the separation of the plastic film from the thickened copper layer, when the carrier copper foil is put into use, the plastic film must be separated from the thickened copper layer first, and the thickened copper layer and the anti-oxidation layer can be used as copper foil.

[0030] refer to Figure 2 and Figure 3, the carrier copper foil surface treatment machine also includes a lifting assembly 7 and an adjusting roller 8, and the lifting assembly 7 includes a guide rail 71, a support slider 72 and a driving source 73. The chemical plating tank 2, the electroplating tank 4 and the anti-oxidation tank 5 are all provided with a lifting assembly 7 and an adjusting roller 8. This embodiment takes the lifting assembly 7 and the adjusting roller 8 in the chemical plating tank 2 as an example for introduction. The guide rail 71 is fixedly connected to the inner wall of the chemical plating tank 2, and the guide rail 71 is vertically arranged. The supporting slider 72 is slidably connected to the guide rail 71, and the adjusting roller 8 is rotatably connected to the supporting slider 72, and the plastic film bypasses the adjusting roller 8. In this embodiment, the driving source 73 specifically adopts an electric push rod, the body of the driving source 73 is fixedly connected to the guide rail 71, and the output end of the driving source 73 is fixedly connected to the supporting slider 72. When the driving source 73 is started, the driving source 73 can drive the supporting slider 72 to slide along the guide rail 71, thereby adjusting the tension of the plastic film.

[0031] refer to Figure 1 and Figure 2 The carrier copper foil surface treatment machine also includes a cleaning tank 3, which includes a first cleaning tank 31, a second cleaning tank 32 and a third cleaning tank 33. The first cleaning tank 31 is located between the chemical plating tank 2 and the electroplating tank 4. A rotating roller 9 is rotatably connected in the first cleaning tank 31. After the carrier copper foil passes through the chemical plating tank 2, it bypasses the rotating roller 9 in the first cleaning tank 31. The first cleaning tank 31 cleans the carrier copper foil that has passed through the chemical plating tank 2. The second cleaning tank 32 is located between the electroplating tank 4 and the anti-oxidation tank 5. A rotating roller 9 is also rotatably connected in the second cleaning tank 32. After the carrier copper foil passes through the electroplating tank 4, it bypasses the rotating roller 9 in the second cleaning tank 32. The second cleaning tank 32 cleans the carrier copper foil that has passed through the electroplating tank 4. The third cleaning tank 33 is located between the anti-oxidation tank 5 and the winding roller 6. A rotating roller 9 is also rotatably connected in the third cleaning tank 33. After the carrier copper foil passes through the anti-oxidation tank 5, it bypasses the rotating roller 9 in the third cleaning tank 33. The third cleaning tank 33 cleans the carrier copper foil that has passed through the anti-oxidation tank 5.

[0032] refer to Figure 1 and Figure 2 The carrier copper foil surface treatment machine also includes a drying component 10. In the present embodiment, the drying component 10 is provided in three groups. The first group of drying components 10 is located between the first cleaning tank 31 and the electroplating tank 4, the second group of drying components 10 is located between the second cleaning tank 32 and the anti-oxidation tank 5, and the third group of drying components 10 is located between the third cleaning tank 33 and the winding roller 6. The drying components 10 can dry the moisture attached to the surface of the carrier copper foil.

[0033] refer to Figure 1 and Figure 4The drying assembly 10 includes a drying chamber 101, a wiping roller 102, a water-absorbing roller 103 and a hot air blower 104. The wiping roller 102 and the water-absorbing roller 103 are both rotatably connected to the inner wall of the drying chamber 101, the wiping roller 102 abuts against the carrier copper foil, and the water-absorbing roller 103 abuts against the wiping roller 102. When the carrier copper foil moves, the carrier copper foil drives the wiping roller 102 to rotate, and the wiping roller 102 drives the water-absorbing roller 103 to rotate, the wiping roller 102 absorbs the moisture on the surface of the carrier copper foil, and the water-absorbing roller 103 absorbs the moisture of the wiping roller 102. The hot air blower 104 is fixedly connected to the inner wall of the drying chamber 101, and the air outlet of the hot air blower 104 faces the wiping roller 102, the water-absorbing roller 103 and the carrier copper foil, so as to dry the moisture on the surfaces of the wiping roller 102, the water-absorbing roller 103 and the carrier copper foil.

[0034] The implementation principle of the carrier copper foil surface treatment machine in Example 1 of the present application is as follows: the unwinding roller 1 unwinds the plastic film, and the plastic film passes through the chemical plating tank 2, the first cleaning tank 31, the drying component 10, the electroplating tank 4, the second cleaning tank 32, the drying component 10, the anti-oxidation tank 5, the third cleaning tank 33 and the drying component 10 in sequence, the chemical plating tank 2 forms a peeling layer on the surface of the plastic film, the electroplating tank 4 forms a thickened copper layer on the surface of the peeling layer, and the anti-oxidation tank 5 forms an anti-oxidation layer on the surface of the thickened copper layer. The first cleaning tank 31, the second cleaning tank 32 and the third cleaning tank 33 can clean the carrier copper foil, the drying component 10 can dry the moisture on the surface of the carrier copper foil, and the finally formed carrier copper foil is rolled up on the winding roller 6, thereby realizing the surface treatment of the carrier copper foil.

[0035] Embodiment 2: Embodiment 2 of the present application provides a carrier copper foil surface treatment process, using the carrier copper foil surface treatment machine in Embodiment 1, including the following steps: S1: unwinding roller 1 unwinds the plastic film; S2: The plastic film passes around the rotating roller 9 in the chemical plating tank 2, and the chemical plating tank 2 generates a peeling layer on the plastic film; S3: The carrier copper foil passes through the first cleaning tank 31 and the drying assembly 10, the first cleaning tank 31 cleans the carrier copper foil, and then the drying assembly 10 dries the carrier copper foil; S4: the carrier copper foil passes around the rotating roller 9 in the electroplating tank 4, and the electroplating tank 4 generates a thickened copper layer on the peeling layer; S5: The carrier copper foil passes through the second cleaning tank 32 and the drying assembly 10, the second cleaning tank 32 cleans the carrier copper foil, and then the drying assembly 10 dries the carrier copper foil; S6: the carrier copper foil passes around the rotating roller 9 in the anti-oxidation tank 5, and the anti-oxidation tank 5 forms an anti-oxidation layer on the thickened copper layer; S7: The carrier copper foil passes through the third cleaning tank 33 and the drying assembly 10, the third cleaning tank 33 cleans the carrier copper foil, and then the drying assembly 10 dries the carrier copper foil; S8: The winding roller 6 winds up the carrier copper foil.

[0036] Embodiment 3: Embodiment 3 of the present application provides a carrier copper foil surface treatment machine.

[0037] refer to Figure 5 and Figure 6 , the difference between Example 3 of the present application and Example 1 is that: there are multiple lifting components 7 and adjusting rollers 8, the guide track 71 has a long length, and the driving source 73 can drive the adjusting rollers 8 to move up and down, so that the adjusting rollers 8 can be immersed in or away from the solutions in the chemical plating tank 2, the electroplating tank 4 and the anti-oxidation tank 5. Since the time for the carrier copper foil to be immersed in the chemical plating tank 2, the electroplating tank 4 and the anti-oxidation tank 5 is different, the thickness of the generated peeling layer, the thickened copper layer and the anti-oxidation layer is different, and the generated thickness can be adjusted according to the needs, thereby improving the applicability of the carrier copper foil surface treatment machine.

[0038] refer to Figure 5 and Figure 7 A plurality of lifting components 7 and adjusting rollers 8 are provided in the first cleaning pool 31, the second cleaning pool 32 and the third cleaning pool 33. The lifting components 7 can drive the adjusting rollers 8 to move up and down, so that the adjusting rollers 8 can be immersed in or away from the first cleaning pool 31, the second cleaning pool 32 and the third cleaning pool 33, thereby controlling the cleaning time.

[0039] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A carrier copper foil surface treatment machine, characterized in that: The invention comprises an unwinding roller (1), a chemical plating tank (2), a cleaning tank (3), an electroplating tank (4), an anti-oxidation tank (5) and a winding roller (6); the unwinding roller (1) is wound with a plastic film, the plastic film passes through the chemical plating tank (2), the cleaning tank (3), the electroplating tank (4), the cleaning tank (3), the anti-oxidation tank (5) and the cleaning tank (3) in sequence, and the plastic film is wound on the winding roller (6); the chemical plating tank (2) is used to generate a peeling layer on the plastic film, the electroplating tank (4) is used to generate a thickened copper layer on the peeling layer, and the anti-oxidation tank (5) is used to generate an anti-oxidation layer on the thickened copper layer.

2. A carrier copper foil surface treatment machine according to claim 1, characterized in that: The cleaning tank (3) comprises a first cleaning tank (31), a second cleaning tank (32) and a third cleaning tank (33); the carrier copper foil located between the chemical plating tank (2) and the electroplating tank (4) passes through the first cleaning tank (31); the carrier copper foil located between the electroplating tank (4) and the anti-oxidation tank (5) passes through the second cleaning tank (32); and the carrier copper foil located between the anti-oxidation tank (5) and the winding roller (6) passes through the third cleaning tank (33).

3. A carrier copper foil surface treatment machine according to claim 1, characterized in that: The chemical plating tank (2), the electroplating tank (4) and the anti-oxidation tank (5) are all provided with rotating rollers (9) and adjusting rollers (8) for rotation, and the plastic film passes around the rotating rollers (9) and the adjusting rollers (8); The chemical plating tank (2), the electroplating tank (4) and the anti-oxidation tank (5) are all provided with a lifting component (7), and the lifting component (7) is used to drive the adjusting roller (8) to move.

4. A carrier copper foil surface treatment machine according to claim 3, characterized in that: The lifting assembly (7) comprises: A guide track (71), wherein the guide track (71) is arranged in the chemical plating tank (2), the electroplating tank (4) and the anti-oxidation tank (5); A supporting slider (72), the supporting slider (72) being slidably connected to the guide rail (71), and the adjusting roller (8) being rotationally connected to the supporting slider (72); A driving source (73) is used to drive the supporting slider (72) to slide along the guide track (71).

5. A carrier copper foil surface treatment machine according to claim 3, characterized in that: The lifting components (7) and the adjusting rollers (8) are both provided in plurality, and the lifting components (7) can drive the adjusting rollers (8) to be immersed in or away from the solutions in the chemical plating tank (2), the electroplating tank (4) and the anti-oxidation tank (5).

6. A carrier copper foil surface treatment machine according to claim 3, characterized in that: The regulating roller (8) and the lifting assembly (7) are also arranged in the cleaning pool (3); the lifting assembly (7) can drive the regulating roller (8) to immerse into or move away from the cleaning pool (3).

7. A carrier copper foil surface treatment machine according to claim 2, characterized in that: A drying component (10) is provided between the third cleaning tank (33) and the winding roller (6), and the drying component (10) is used to dry the moisture on the surface of the carrier copper foil.

8. A carrier copper foil surface treatment machine according to claim 7, characterized in that: A plurality of drying components (10) are provided, and the drying components (10) are also provided between the first cleaning tank (31) and the electroplating tank (4), and between the second cleaning tank (32) and the anti-oxidation tank (5).

9. A carrier copper foil surface treatment machine according to claim 7, characterized in that: The drying assembly (10) comprises a drying chamber (101), a wiping roller (102), a water absorbing roller (103) and a hot air blower (104); the wiping roller (102) and the water absorbing roller (103) are both rotatably connected in the drying chamber (101); the wiping roller (102) is in contact with a carrier copper foil, and the water absorbing roller (103) is in contact with the wiping roller (102); and an air outlet of the hot air blower (104) faces the carrier copper foil, the wiping roller (102) and the water absorbing roller (103).

10. A surface treatment process for a carrier copper foil, characterized in that: Using the carrier copper foil surface treatment machine as described in any one of claims 1 to 9 comprises the following steps: S1: unwinding roller (1) unwinds the plastic film; S2: chemical plating tank (2) generates a release layer on the plastic film; S3: the first cleaning tank (31) cleans the carrier copper foil, and then the drying component (10) dries the carrier copper foil; S4: the electroplating tank (4) generates a thickened copper layer on the stripped layer; S5: the second cleaning tank (32) cleans the carrier copper foil, and then the drying component (10) dries the carrier copper foil; S6: the anti-oxidation tank (5) forms an anti-oxidation layer on the thickened copper layer; S7: the third cleaning tank (33) cleans the carrier copper foil, and then the drying component (10) dries the carrier copper foil; S8: The winding roller (6) winds up the carrier copper foil.

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