Thermal measurement device

Abstract

The invention discloses a thermal measurement device which comprises a substrate, a first supporting beam, a second supporting beam, a heating assembly and a calorimetric assembly. The base is provided with a cavity with an opening in the upper end, a first supporting beam and a second supporting beam are arranged at the opening of the base, the first supporting beam and the second supporting beam are arranged in a suspended mode relative to the bottom wall of the cavity, and the first supporting beam and the second supporting beam are arranged in a spaced mode in the first horizontal direction. The first support beam and the second support beam have the same thermal conductivity; the heating assembly is suitable for being in thermal connection with a to-be-tested sample and arranged on the first supporting beam, the heating assembly is configured to generate heat after being electrified, and the heating assembly is further configured to change the resistance value when being heated; the calorimetric assembly is suitable for being in thermal connection with a to-be-measured sample and arranged on the second supporting beam, and the calorimetric assembly is configured to have a resistance value changing when heated. The thermal measurement device provided by the invention can improve the accuracy of thermal measurement of the to-be-measured sample under the macroscale.

Description

Technical Field

[0001] The invention relates to the technical field of thermal measurement equipment, and in particular to a thermal measurement device. Background Art

[0002] Accurate thermal measurements at the macroscopic scale (at least one scale is on the millimeter level or above) are crucial for evaluating the thermal properties of materials, developing functional materials, and studying thermal physical mechanisms. For example, in thermal theory, this includes the divergence of thermal conductivity from microscopic to macroscopic, the study of heat transport phenomena involving surface waves, and the study of hydraulic transport phenomena of phonons. On the other hand, accurate measurements of the thermal properties of metal wires, carbon fibers, polymer fibers, and films at the macroscopic scale are also of great significance for their applications in the fields of electronic devices, aerospace, and equipment manufacturing.

[0003] Therefore, improving the accuracy of thermal measurements of objects at the macroscopic scale is an important research direction. Summary of the invention

[0004] The object of the present invention is to at least solve the problem of improving the accuracy of thermal measurement of objects at a macroscopic scale. This object is achieved by:

[0005] The present invention proposes a thermal measurement device, comprising a substrate, a first support beam, a second support beam, a heating component and a calorimetric component. The substrate is provided with a cavity with an upper opening, the first support beam and the second support beam are both arranged at the opening of the substrate, the first support beam and the second support beam are both suspended relative to the bottom wall of the cavity, the first support beam and the second support beam are arranged at intervals in the first horizontal direction, and the first support beam and the second support beam have the same thermal conductivity; the heating component is suitable for thermal connection with a sample to be measured and is arranged on the first support beam, the heating component is configured to generate heat when powered on, and the heating component is also configured to change resistance when heated; the calorimetric component is suitable for thermal connection with a sample to be measured and is arranged on the second support beam, and the calorimetric component is configured to change resistance when heated.

[0006] The thermal measurement device of the present invention can heat the sample to be measured through the heating component, and a part of the heat generated by the heating component enters the first support beam and the second support beam with the same thermal conductivity. The temperature rise of the first support beam and the second support beam can be calculated through the change of the resistance value of the heating component and the calorimetric component, thereby obtaining the thermal conductivity of the first support beam and the second support beam. The heat passing through the sample to be measured is approximately the same as the heat passing through the calorimetric component, so the heat passing through the sample to be measured can be obtained through the thermal conductivity of the second support beam and the temperature rise of the calorimetric component, and the thermal conductivity of the sample to be measured can be obtained based on the heat passing through the sample to be measured, the temperature rise of the first support beam and the temperature rise of the second support beam. Therefore, through the thermal measurement device of the embodiment of the present invention, the accuracy of thermal measurement of objects at a macroscopic scale can be improved. In addition, the first support beam and the second support beam are both beam structures with a large calorimetric resolution, which can further improve the measurement accuracy of the thermal measurement device of the embodiment of the present invention.

[0007] According to some embodiments of the present invention, the heating component includes a first resistor provided on the first support beam, the first resistor is configured to generate heat when powered on, and is configured to change its resistance value when heated, and the calorimetric component includes a second resistor provided on the second support beam, the second resistor is configured to change its resistance value when heated; the first resistor and the second resistor each include: at least three first main body segments and at least two first connecting segments. The at least three first main body segments are arranged at intervals from each other, and the at least three first main body segments have a first side and a second side that are arranged oppositely in the length direction of the first main body segment; the at least two first connecting segments are alternately arranged on the first side and the second side, and each of the first connecting segments is electrically connected to two adjacent first main body segments.

[0008] According to some embodiments of the present invention, the first resistor and the second resistor each include: at least three second main body segments and at least two second connecting segments, the at least three second main body segments are spaced apart from each other, the at least three second main body segments have a third side and a fourth side relatively arranged in the length direction of the second main body segments, at least one second main body segment is electrically connected to at least one first main body segment; the at least two second connecting segments are alternately arranged on the third side and the fourth side, each second connecting segment is electrically connected to two adjacent second main body segments; the first support beam and the second support beam are both provided with a placement area suitable for placing the sample to be tested, the placement area is located between the at least three first main body segments and the at least three second main body segments, wherein at least one of at least one first main body segment, at least one first connecting segment, at least one second main body segment and at least one second connecting segment is suitable for thermal connection with the sample to be tested.

[0009] According to some embodiments of the present invention, the heating component also includes a first electrode, which is arranged in the placement area of ​​the first support beam, and the first electrode is suitable for thermal connection with the sample to be tested, wherein at least one of the at least one first main body segment, at least one first connecting segment, at least one second main body segment and at least one second connecting segment of the first resistor is suitable for direct thermal connection with the sample to be tested, and is suitable for indirect thermal connection with the sample to be tested through the first electrode.

[0010] According to some embodiments of the present invention, the calorimetric component also includes a second electrode, which is arranged in the placement area of ​​the second support beam, and the second electrode is suitable for thermal connection with the sample to be tested, wherein at least one of at least one first main body segment, at least one first connecting segment, at least one second main body segment and at least one second connecting segment of the second resistor is suitable for direct thermal connection with the sample to be tested, and is suitable for indirect thermal connection with the sample to be tested through the first electrode.

[0011] According to some embodiments of the present invention, a first insulating layer is provided on a side of the heating component vertically away from the first support beam; and / or a second insulating layer is provided on a side of the calorimetric component vertically away from the second support beam.

[0012] According to some embodiments of the present invention, the length of each of the first main body segments is greater than or equal to 20 microns, and the interval between at least two of the first main body segments is greater than or equal to 20 microns; and / or, the length of each of the second main body segments is greater than or equal to 20 microns, and the interval between at least two of the second main body segments is greater than or equal to 20 microns.

[0013] According to some embodiments of the present invention, the resistance value of the first resistor is greater than or equal to 1 kilo-ohm, and the resistance value of the first resistor is less than or equal to 40 kilo-ohm; and / or, the resistance value of the first resistor is greater than or equal to 10 kilo-ohm, and the resistance value of the first resistor is less than or equal to 15 kilo-ohm; and / or, the resistance value of the second resistor is greater than or equal to 1 kilo-ohm, and the resistance value of the second resistor is less than or equal to 40 kilo-ohm; and / or, the resistance value of the second resistor is greater than or equal to 10 kilo-ohm, and the resistance value of the second resistor is less than or equal to 15 kilo-ohm.

[0014] According to some embodiments of the present invention, the first support beam and the second support beam are made of silicon nitride or silicon; and / or, the interval between the first support beam and the second support beam is greater than or equal to 100 microns and less than or equal to 10 millimeters; and / or, the interval between the first support beam and the second support beam is greater than or equal to 500 microns and less than or equal to 5 millimeters.

[0015] According to some embodiments of the present invention, the width of the first support beam is greater than or equal to 5 microns, and the width of the first support beam is less than or equal to 50 microns; the width of the second support beam is greater than or equal to 5 microns, and the width of the second support beam is less than or equal to 50 microns. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. Among them:

[0017] Figure 1 A schematic diagram of a thermal measurement device according to an embodiment of the present invention measuring a sample to be measured;

[0018] Figure 2 is a schematic diagram of a thermal measurement device according to an embodiment of the present invention;

[0019] Figure 3 for Figure 2 The enlarged view of point A in the middle;

[0020] Figure 4 for Figure 2 Enlarged view of point B in the middle.

[0021] The reference numerals in the accompanying drawings represent the following:

[0022] 100. Thermal measuring device; 200. Sample to be tested;

[0023] 1. base; 11. cavity;

[0024] 2. The first support beam;

[0025] 3. The second support beam;

[0026] 4. Heating assembly; 41. First resistor; 411. First main body section; 412. First connecting section; 413. Second main body section; 414. Second connecting section; 42. First electrode;

[0027] 5. Calorimetric component; 51. Second resistor; 52. Second electrode;

[0028] a, first horizontal direction; b, second horizontal direction; c, third horizontal direction; d, vertical direction. DETAILED DESCRIPTION

[0029] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0030] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0031] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically limited.

[0032] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is rotated, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both above and below orientations.

[0033] In the description of the embodiments of the present invention, the orientations or positional relationships indicated by technical terms such as "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "circumferential", "height direction", "first direction", and "second direction" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed, operated or used in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0034] In the description of the embodiments of the present invention, the orientations or positional relationships indicated by technical terms such as "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "circumferential", "height direction", "first direction", and "second direction" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed, operated or used in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0035] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, they can be fixedly connected, detachably connected, or integrated; they can be mechanically connected, electrically connected, or able to communicate with each other; they can be directly connected, or indirectly connected through an intermediate medium, and they can be internally connected between two elements or an interactive relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the embodiments of the present invention, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects before and after are in an "or" relationship.

[0037] In the relevant technologies, accurate thermal measurements at the macroscopic scale (at least one scale is in the millimeter level or above) are crucial for the evaluation of thermal properties of materials, the development of functional materials, and the study of thermal physical mechanisms. For example, in thermal theory, it includes the problem of thermal conductivity divergence from microscopic to macroscopic, the study of heat transport phenomena involving surface waves, and the study of hydraulic transport phenomena of phonons. On the other hand, accurate measurements of the thermal properties of metal wires, carbon fibers, polymer fibers, and films at the macroscopic scale are also of great significance for their applications in the fields of electronic devices, aerospace, and equipment manufacturing.

[0038] Therefore, improving the accuracy of thermal measurements of objects at the macroscopic scale is an important research direction.

[0039] In order to at least solve the problem of improving the accuracy of thermal measurement of an object at a macroscopic scale, an embodiment of the present invention provides a thermal measurement device 100 that can improve the accuracy of thermal measurement of a sample 200 to be measured at a macroscopic scale.

[0040] The thermal measurement device 100 according to the embodiment of the present invention will be described below with reference to the accompanying drawings.

[0041] Combination Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the thermal measurement device 100 of the embodiment of the present invention comprises: a base 1, a first support beam 2, a second support beam 3, a heating assembly 4 and a calorimetric assembly 5. The base 1 is provided with a wall 11 with an upper opening, the first support beam 2 and the second support beam 3 are both arranged at the opening of the base 1, the first support beam 2 and the second support beam 3 are both suspended relative to the bottom wall of the cavity 11, the first support beam 2 and the second support beam 3 are arranged at intervals in the first horizontal direction a, and the first support beam 2 and the second support beam 3 have the same thermal conductivity; the heating assembly 4 is suitable for thermal connection with the sample 200 to be measured and is arranged on the first support beam 2, the heating assembly 4 is configured to generate heat when powered on, and the heating assembly 4 is also configured to change the resistance value when heated; the calorimetric assembly 5 is suitable for thermal connection with the sample 200 to be measured and is arranged on the second support beam 3, and the calorimetric assembly 5 is configured to change the resistance value when heated.

[0042] The beam structure is a structure whose length is much greater than its width. Since the width of the beam structure is relatively small, the beam structure has a larger calorimetric resolution.

[0043] Calorimetric resolution refers to the smallest energy change that a device can detect during calorimetric analysis. The higher the calorimetric resolution, the higher the accuracy of the device.

[0044] The heating component 4 is suitable for thermal connection with the sample 200 to be tested, which means that after the heating component 4 is connected to the sample 200 to be tested, the heating component 4 and the sample 200 to be tested can conduct heat to each other. The calorimetric component 5 is suitable for thermal connection with the sample 200 to be tested, which means that after the calorimetric component 5 is connected to the sample 200 to be tested, the calorimetric component 5 and the sample 200 to be tested can conduct heat to each other.

[0045] like Figure 2 As shown, when measuring the sample 200, the sample 200 is placed on the first support beam 2 and the second support beam 3, and the calorimetric component 5 and the heating component 4 are both thermally connected to the sample 200. When heated by the heating component 4, part of the heat Q generated by the heating component 4 flows into the first support beam 2, and the other part of the heat Q generated by the heating component 4 flows into the second support beam 3 through the sample 200 and the calorimetric component 5. The temperature rise ΔT generated on the first support beam 2 h The temperature rise ΔT generated on the second support beam 3 is obtained from the change in the resistance value of the heating component 4. s The resistance value of the calorimetric component 5 is changed, and thus, the thermal conductivity G of the second support beam 3 is b and the thermal conductivity G of the first support beam 2 b Both are:

[0046] G b =Q / (ΔT h +ΔT s ),

[0047] The amount of heat passing through the sample 200 to be tested is approximately the same as the amount of heat passing through the calorimetric assembly 5 . Therefore, the thermal conductivity G passing through the second support beam 3 is b The heat Q passing through the sample 200 can be obtained by measuring the temperature rise of the calorimetric component 5. s :

[0048] Q s =ΔT s ·G b ,

[0049] The thermal conductivity of the sample 200 to be tested is G S :

[0050] G s =Q s / (ΔT h -ΔT s ).

[0051] In addition, according to the thermal conductivity of the sample 200 to be tested and the size information of the sample 200 to be tested, the thermal conductivity property of the sample 200 to be tested can be further obtained.

[0052] The thermal measurement device 100 of the embodiment of the present invention can heat the sample 200 to be measured through the heating component 4, and a part of the heat generated by the heating component 4 enters the first support beam 2 and the second support beam 3 with the same thermal conductivity. The temperature rise of the first support beam 2 and the second support beam 3 can be calculated through the resistance value change of the heating component 4 and the calorimetric component 5, thereby obtaining the thermal conductivity of the first support beam 2 and the second support beam 3. The heat passing through the sample 200 to be measured is approximately the same as the heat passing through the calorimetric component 5, so the heat passing through the sample 200 to be measured can be obtained through the thermal conductivity of the second support beam 3 and the temperature rise of the calorimetric component 5, and the thermal conductivity of the sample 200 to be measured can be obtained based on the heat passing through the sample 200 to be measured, the temperature rise of the first support beam 2 and the temperature rise of the second support beam 3. Therefore, the thermal measurement device 100 of the embodiment of the present invention can improve the accuracy of thermal measurement of objects at a macroscopic scale. In addition, the first support beam 2 and the second support beam 3 are both beam structures with a large calorimetric resolution, which can further improve the measurement accuracy of the thermal measurement device 100 of the embodiment of the present invention.

[0053] Combination Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments, the heating component 4 includes a first resistor 41 disposed on the first support beam 2, the first resistor 41 is configured to generate heat when energized, and is configured to change its resistance value when heated, and the calorimetric component 5 includes a second resistor 51 disposed on the second support beam 3, and the second resistor 51 is configured to change its resistance value when heated.

[0054] The first resistor 41 and the second resistor 51 each include: at least three first main body segments 411 and at least two first connecting segments 412. The at least three first main body segments 411 are arranged at intervals from each other, and the at least three first main body segments 411 have a first side and a second side that are arranged oppositely in the length direction of the first main body segment 411; the at least two first connecting segments 412 are alternately arranged on the first side and the second side, and each first connecting segment 412 is electrically connected to two adjacent first main body segments 411.

[0055] The at least three first main body sections 411 are arranged at intervals from each other, which means that all the first main body sections 411 are arranged at intervals from each other. The at least three first main body sections 411 have a first side and a second side arranged oppositely in the length direction of the first main body section 411, which means that all the first main body sections 411 have a first side and a second side arranged oppositely in the length direction of the first main body section 411. The at least two first connecting sections 412 are alternately arranged on the first side and the second side, which means that all the first connecting sections 412 are alternately arranged on the first side and the second side.

[0056] All the first connecting segments 412 are alternately arranged on the first side and the second side, for example, the first first connecting segment 412 is arranged on the first side, the second second connecting segment 412 is arranged on the second side, the third first connecting segment 412 is arranged on the first side, the fourth first connecting segment 412 is arranged on the second side, and so on.

[0057] The first main section 411 and the first connecting section 412 can improve the space utilization of the first resistor 41 and the second resistor 51, so that the first resistor 41 and the second resistor 51 have a larger length while occupying a smaller space, thereby making the first resistor 41 and the second resistor 51 have a larger resistance value.

[0058] By making the first resistor 41 and the second resistor 51 have larger resistance values, the measurement accuracy of the macro-scale sample 200 can be increased.

[0059] The directions in which the first main body segments 411 of the first resistor 41 and the second resistor 51 are spaced from each other can be the same or different. For example, the first main body segments 411 of the first resistor 41 are spaced from each other in the second horizontal direction, and the first main body segments 411 of the second resistor 51 are spaced from each other in the third horizontal direction. The first horizontal direction a can be parallel to or intersect with the second horizontal direction b, the second horizontal direction b can be parallel to or intersect with the third horizontal direction c, and the first horizontal direction a can be parallel to or intersect with the third horizontal direction c. As an example, the second horizontal direction b is as follows: Figure 1 As shown by the arrow at b, the third horizontal direction c is as follows Figure 1 As indicated by the arrow at c.

[0060] Combination Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, in some embodiments, the first resistor 41 and the second resistor 51 each include: at least three second main body segments 413 and at least two second connecting segments 414. The at least three second main body segments 413 are arranged at intervals from each other, and the at least three second main body segments 413 have a third side and a fourth side arranged oppositely in the length direction of the second main body segment 413, and at least one second main body segment 413 is electrically connected to at least one first main body segment 411; at least two second connecting segments 414 are alternately arranged on the third side and the fourth side, and each second connecting segment 414 is electrically connected to two adjacent second main body segments 413; the first support beam 2 and the second support beam 3 are both provided with a placement area suitable for placing the sample 200 to be tested, and the placement area is located between the at least three first main body segments 411 and the at least three second main body segments 413, wherein at least one of the at least one first main body segment 411, the at least one first connecting segment 412, the at least one second main body segment 413 and the at least one second connecting segment 414 is suitable for thermal connection with the sample 200 to be tested.

[0061] Thermal connection with the sample 200 includes direct thermal connection with the sample 200 and indirect thermal connection with the sample 200. Direct thermal connection with the sample 200 means direct contact with the sample 200 and mutual thermal conduction with the sample 200. Indirect connection with the sample 200 means indirect contact with the sample 200 through a connection medium and mutual thermal conduction with the sample 200 through the connection medium.

[0062] Through the first main body section 411 , the first connecting section 412 , the second main body section 413 and the second connecting section 414 , a placement area can be defined while increasing space utilization, so that the structure of the thermal measurement device 100 according to the embodiment of the present invention is more reasonable.

[0063] Optionally, four lead wires are led out from the first resistor 41 so that the resistance value of the first resistor 41 can be measured by a four-wire method.

[0064] Optionally, four lead wires are led out from the second resistor 51 so that the resistance value of the second resistor 51 can be measured by a four-wire method.

[0065] Combination Figure 1 and Figure 2 As shown, in some embodiments, the heating component 4 also includes a first electrode 42, which is arranged in the placement area of ​​the first support beam 2, and the first electrode 42 is suitable for thermal connection with the sample to be tested 200, wherein at least one of the at least one first main section 411, at least one first connecting section 412, at least one second main section 413 and at least one second connecting section 414 of the first resistor 41 is suitable for direct thermal connection with the sample to be tested 200, and is suitable for indirect thermal connection with the sample to be tested 200 through the first electrode 42.

[0066] The first resistor 41 can be in thermal contact with the sample 200 to be tested indirectly through the first electrode 42 , or can be in thermal contact with the first electrode 42 directly, which can improve the compatibility with the shape and size of the sample 200 to be tested.

[0067] Optionally, a lead wire is led out from the first electrode 42 so that the first electrode 42 can be tested.

[0068] Combination Figure 1 and Figure 2 As shown, in some embodiments, the calorimetric component 5 also includes a second electrode 52, which is arranged in the placement area of ​​the second support beam 3, and the second electrode 52 is suitable for thermal connection with the sample to be tested 200, wherein at least one of the at least one first main section 411, at least one first connecting section 412, at least one second main section 413 and at least one second connecting section 414 of the second resistor 51 is suitable for direct thermal connection with the sample to be tested 200, and is suitable for indirect thermal connection with the sample to be tested 200 through the second electrode 52.

[0069] The second resistor 51 can be in thermal contact with the sample 200 to be tested indirectly through the second electrode 52 , or can be in thermal contact with the second electrode 52 directly, which can improve the compatibility with the shape and size of the sample 200 to be tested.

[0070] Optionally, a lead wire is led out from the second electrode 52 so that the second electrode 52 can be tested.

[0071] In some embodiments, a first insulating layer is provided on a side of the heating assembly 4 facing away from the first support beam 2 in the vertical direction d.

[0072] The first insulating layer can insulate the heating component, thereby preventing the heating component 4 from short-circuiting when the conductive sample 200 to be tested contacts the heating component 4 .

[0073] Optionally, a first insulating layer is provided on a side of the first electrode 42 facing away from the first support beam 2 in the vertical direction d.

[0074] The first insulating layer can protect the first electrode 42 , thereby preventing the first electrode 42 from being short-circuited when the conductive sample 200 to be tested contacts the first electrode 42 .

[0075] Preferably, the first insulating layer is a silicon dioxide layer.

[0076] Preferably, the thickness of the first insulating layer is 400 nanometers.

[0077] In some embodiments, a second insulating layer is provided on a side of the calorimetric component 5 facing away from the second support beam 3 in the vertical direction d.

[0078] The second insulating layer can insulate the heating component, thereby preventing the calorimetric component 5 from short-circuiting when the conductive sample 200 to be tested contacts the calorimetric component 5 .

[0079] Optionally, a second insulating layer is provided on a side of the second electrode 52 facing away from the second support beam 3 in the vertical direction d.

[0080] The second insulating layer can protect the second electrode 52 , thereby preventing the second electrode 52 from being short-circuited when the conductive sample 200 to be tested contacts the second electrode 52 .

[0081] Preferably, the second insulating layer is a silicon dioxide layer.

[0082] Preferably, the thickness of the second insulating layer is 400 nanometers.

[0083] In some embodiments, the length of each first main body segment 411 is greater than or equal to 20 micrometers, and the interval between at least two first main body segments 411 is greater than or equal to 20 micrometers.

[0084] That is to say, the footprint of all the first main body segments 411 is at least greater than or equal to 20 micrometers×20 micrometers, so as to have good thermal contact capability and testing capability for the macroscopic sample 200 to be tested.

[0085] In some embodiments, the length of each second main body segment 413 is greater than or equal to 20 micrometers, and the interval between at least two second main body segments 413 is greater than or equal to 20 micrometers.

[0086] That is to say, the footprint of all the second main body segments 413 is at least greater than or equal to 20 micrometers×20 micrometers, so as to have good thermal contact capability and testing capability for the macroscopic sample 200 to be tested.

[0087] In some embodiments, the resistance value of the first resistor 41 is greater than or equal to 1 kilo-ohm, and the resistance value of the first resistor 41 is less than or equal to 40 kilo-ohm, so that the thermal measurement device of the embodiment of the present invention has higher measurement accuracy for the macroscopic sample 200 to be measured.

[0088] In some preferred embodiments, the resistance value of the first resistor 41 is greater than or equal to 10 kilo-ohms, and the resistance value of the first resistor 41 is less than or equal to 15 kilo-ohms, so as to further enable the thermal measurement device of the embodiment of the present invention to have higher measurement accuracy for the macroscopic sample 200 to be measured.

[0089] In some embodiments, the resistance value of the second resistor 51 is greater than or equal to 1 kilo-ohm, and the resistance value of the second resistor 51 is less than or equal to 40 kilo-ohm, so that the thermal measurement device of the embodiment of the present invention has higher measurement accuracy for the macroscopic sample 200 to be measured.

[0090] In some preferred embodiments, the resistance value of the second resistor 51 is greater than or equal to 10 kilo-ohms, and the resistance value of the second resistor 51 is less than or equal to 15 kilo-ohms, so as to further enable the thermal measurement device of the embodiment of the present invention to have higher measurement accuracy for the macroscopic sample 200 to be measured.

[0091] In some embodiments, the first support beam 2 and the second support beam 3 are made of silicon nitride or silicon.

[0092] In some embodiments, the interval between the first support beam 2 and the second support beam 3 is greater than or equal to 100 microns and less than or equal to 10 millimeters, so that the interval between the first support beam 2 and the second support beam 3 is reasonable, so that the first support beam 2 and the second support beam 3 can carry the macroscopic sample 200 to be tested, and can avoid excessive heat loss of the sample 200 to be tested due to the large distance between the first support beam 2 and the second support beam 3, thereby improving the measurement accuracy of the thermal measurement device 100 of the embodiment of the present invention.

[0093] In some preferred embodiments, the interval between the first support beam 2 and the second support beam 3 is greater than or equal to 500 microns and less than or equal to 5 millimeters, so as to further make the interval between the first support beam 2 and the second support beam 3 reasonable, thereby further enabling the first support beam 2 and the second support beam 3 to carry the macroscopic sample 200 to be tested, and further avoiding excessive heat loss of the sample 200 to be tested due to excessive distance between the first support beam 2 and the second support beam 3, thereby improving the measurement accuracy of the thermal measurement device 100 of the embodiment of the present invention.

[0094] In some embodiments, the width of the first support beam 2 is greater than or equal to 5 microns, the width of the first support beam 2 is less than or equal to 50 microns, the width of the second support beam 3 is greater than or equal to 5 microns, and the width of the second support beam 3 is less than or equal to 50 microns, so that the strength of the first support beam 2 and the strength of the second support beam 3 can support the macroscopic sample 200 to be tested, and can enable the first support beam 2 and the second support beam 3 to have a higher calorimetric resolution.

[0095] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A thermal measurement device, characterized in that: include: A base having a cavity with an upper opening; A first support beam and a second support beam are both arranged at the opening of the base, the first support beam and the second support beam are both suspended relative to the bottom wall of the cavity, the first support beam and the second support beam are spaced apart in a first horizontal direction, and the first support beam and the second support beam have the same thermal conductivity; A heating component, adapted to be thermally connected to the sample to be tested and disposed on the first support beam, the heating component being configured to generate heat when powered on, and the heating component being further configured to change resistance when heated; The calorimetric component is suitable for being thermally connected to the sample to be measured and is arranged on the second support beam. The calorimetric component is configured to change its resistance value when heated.

2. The thermal measurement device according to claim 1, characterized in that: The heating component comprises a first resistor disposed on the first support beam, the first resistor is configured to generate heat when powered on, and is configured to change its resistance value when heated; the calorimetric component comprises a second resistor disposed on the second support beam, and the second resistor is configured to change its resistance value when heated; The first resistor and the second resistor both include: At least three first main body segments, the at least three first main body segments are spaced apart from each other, and the at least three first main body segments have a first side and a second side that are oppositely disposed in a length direction of the first main body segment; At least two first connecting segments are alternately arranged on the first side and the second side, and each of the first connecting segments is electrically connected to two adjacent first main body segments.

3. The thermal measurement device according to claim 2, characterized in that: The first resistor and the second resistor both include: at least three second main body segments, the at least three second main body segments are arranged at intervals from each other, the at least three second main body segments have a third side and a fourth side arranged opposite to each other in the length direction of the second main body segment, and at least one of the second main body segments is electrically connected to at least one of the first main body segments; at least two second connecting segments, the at least two second connecting segments are alternately arranged on the third side and the fourth side, and each second connecting segment is electrically connected to two adjacent second main body segments; The first support beam and the second support beam are both provided with a placement area suitable for placing the sample to be tested, and the placement area is located between the at least three first main body sections and the at least three second main body sections. Wherein, at least one of at least one of the first main body segment, at least one of the first connecting segment, at least one of the second main body segment and at least one of the second connecting segment is suitable for thermal connection with the sample to be tested.

4. The thermal measurement device according to claim 3, characterized in that: The heating assembly also includes a first electrode, which is arranged in the placement area of ​​the first support beam, and the first electrode is suitable for thermal connection with the sample to be tested, wherein at least one of at least one of the first main body segments, at least one of the first connecting segments, at least one of the second main body segments and at least one of the second connecting segments of the first resistor is suitable for direct thermal connection with the sample to be tested, and is suitable for indirect thermal connection with the sample to be tested through the first electrode.

5. The thermal measurement device according to claim 3 or 4, characterized in that: The calorimetric component also includes a second electrode, which is arranged in the placement area of ​​the second support beam, and the second electrode is suitable for thermal connection with the sample to be tested, wherein at least one of at least one first main body segment, at least one first connecting segment, at least one second main body segment and at least one second connecting segment of the second resistor is suitable for direct thermal connection with the sample to be tested, and is suitable for indirect thermal connection with the sample to be tested through the second electrode.

6. The thermal measurement device according to any one of claims 1 to 4, characterized in that: A first insulating layer is provided on a side of the heating assembly facing away from the first support beam in the vertical direction; and / or, A second insulating layer is provided on a side of the calorimetric component facing away from the second support beam in the vertical direction.

7. The thermal measurement device according to claim 3 or 4, characterized in that: The length of each of the first main body segments is greater than or equal to 20 microns, and the interval between at least two of the first main body segments is greater than or equal to 20 microns; and / or, The length of each of the second main body segments is greater than or equal to 20 microns, and the interval between at least two of the second main body segments is greater than or equal to 20 microns.

8. The thermal measurement device according to any one of claims 2 to 4, characterized in that: The resistance value of the first resistor is greater than or equal to 1 kilo-ohm, and the resistance value of the first resistor is less than or equal to 40 kilo-ohm; and / or, The resistance value of the second resistor is greater than or equal to 1 kilo-ohm, and the resistance value of the second resistor is less than or equal to 40 kilo-ohm.

9. The thermal measurement device according to any one of claims 1 to 4, characterized in that: The first support beam and the second support beam are made of silicon nitride or silicon; and / or, A spacing between the first support beam and the second support beam is greater than or equal to 100 micrometers and less than or equal to 10 millimeters.

10. The thermal measurement device according to any one of claims 1 to 4, characterized in that: The width of the first support beam is greater than or equal to 5 microns, and the width of the first support beam is less than or equal to 50 microns; The width of the second support beam is greater than or equal to 5 microns, and the width of the second support beam is less than or equal to 50 microns.

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