Intelligent glasses

Abstract

The invention relates to the technical field of intelligent glasses, and provides intelligent glasses, the intelligent glasses comprise a glasses main body, a flexible circuit board and a first heat dissipation layer, a cavity is formed in the glasses main body, the flexible circuit board is arranged in the cavity of the glasses main body, and the first heat dissipation layer is arranged on the outer surface of the flexible circuit board. The first heat dissipation layer is arranged on the outer surface of the flexible circuit board, so that the heat conduction capability and the temperature equalization capability of the flexible circuit board can be improved, the flexible circuit board can flexibly adapt to various bends and shapes of the glasses, heat is conducted to all positions of the glasses main body to facilitate heat dissipation, and the service life of the glasses is prolonged. Therefore, the heat dissipation capability and the heat dissipation effect of the intelligent glasses are improved.

Description

Technical Field

[0001] The present application belongs to the technical field of smart glasses, and in particular, relates to a kind of smart glasses. Background Art

[0002] With the development of XR smart glasses and the emergence of more and more ecological applications, it is urgent to solve the temperature rise problem caused by high-power applications on XR glasses. The contradiction of poor heat dissipation leading to poor wearer experience has gradually become prominent. At the same time, the light and integrated design requirements of XR glasses limit their size design and material use. How to achieve the best heat dissipation design in a limited space so that the wearer has a comfortable use experience is an urgent problem to be solved. Summary of the invention

[0003] The embodiment of the present application provides a pair of smart glasses to solve the problem of poor heat dissipation of existing smart glasses.

[0004] In a first aspect, an embodiment of the present application provides a pair of smart glasses, including:

[0005] The main body of the glasses has a cavity formed therein;

[0006] A flexible circuit board is arranged in the cavity of the eyeglass body;

[0007] The first heat dissipation layer is arranged on the outer surface of the flexible circuit board.

[0008] In some embodiments of the present application, the first heat dissipation layer is formed by a heat dissipation material sprayed on the outer surface of the flexible circuit board;

[0009] And / or, the first heat dissipation layer and the flexible circuit board are an integrated structure.

[0010] In some embodiments of the present application, the first heat dissipation layer is disposed on the outer surface of the flexible circuit board on a side away from the human body.

[0011] In some embodiments of the present application, the smart glasses also include a main board, the glasses body includes a frame and a temple assembly connected to the frame, the main board is arranged on the frame or the temple assembly, and the main board is connected to the flexible circuit board.

[0012] In some embodiments of the present application, the mainboard is provided with a shielding cover, the flexible circuit board includes an extension portion, and the outer surface of the extension portion is provided with a second heat dissipation layer. When the flexible circuit board is connected to the mainboard, the second heat dissipation layer is attached to the shielding cover.

[0013] In some embodiments of the present application, the shape and size of the extension portion are adapted to the shape and size of the shielding cover.

[0014] In some embodiments of the present application, the first heat dissipation layer is a graphite layer or a carbon nanotube layer; and / or, the second heat dissipation layer is a graphite layer or a carbon nanotube layer.

[0015] In some embodiments of the present application, the thickness of the first heat dissipation layer is 0.1-1 mm; and / or the thickness of the second heat dissipation layer is 0.1-1 mm.

[0016] In some embodiments of the present application, the mainboard is provided with a first buckling portion, and the flexible circuit board is provided with a second buckling portion. When the flexible circuit board is connected to the mainboard, the first buckling portion and the second buckling portion are buckled and connected.

[0017] In some embodiments of the present application, the temple assembly includes a first temple and a second temple respectively connected to both sides of the frame, the flexible circuit board is an integral structure, and the flexible circuit board is sequentially passed through the first temple, the frame and the second temple and extends along their length direction.

[0018] In some embodiments of the present application, the main board is located in the middle of the temple assembly, and the flexible circuit board includes a first circuit board and a second circuit board, and the first circuit board and the second circuit board are respectively connected to two ends of the main board;

[0019] And / or, mounting holes are provided at both ends of the main board, and the main board is mounted on the temple assembly through the mounting holes;

[0020] And / or, the mainboard is provided with a first buckling portion, and the flexible circuit board is provided with a second buckling portion, and when the flexible circuit board is connected to the mainboard, the first buckling portion and the second buckling portion are buckled and connected.

[0021] The smart glasses provided in the embodiment of the present application include a glasses body, a flexible circuit board and a first heat dissipation layer, wherein a cavity is formed inside the glasses body, the flexible circuit board is arranged in the cavity of the glasses body, and the first heat dissipation layer is arranged on the outer surface of the flexible circuit board. By arranging a first heat dissipation layer on the outer surface of the flexible circuit board, the thermal conductivity and temperature uniformity of the flexible circuit board can be improved, and the flexible circuit board can flexibly adapt to various bends and shapes of the glasses, and conduct heat to various parts of the glasses body to facilitate heat dissipation, thereby improving the heat dissipation capacity and heat dissipation effect of the smart glasses.

[0022] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0024] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.

[0025] Figure 1 A schematic diagram of the structure of the smart glasses provided in an embodiment of the present application.

[0026] Figure 2 A schematic diagram of the structure of the flexible circuit board provided in the embodiment of the present application Figure 1 .

[0027] Figure 3 A schematic diagram of the structure of the flexible circuit board provided in the embodiment of the present application Figure 2 .

[0028] Figure 4 A schematic diagram of the structure of the mainboard provided in an embodiment of the present application.

[0029] Figure 5 A schematic diagram of the installation of a mainboard and a flexible circuit board provided in an embodiment of the present application.

[0030] Reference numerals:

[0031] 100, 100, glasses body; 110, glasses frame; 120, temple assembly; 121, first temple; 122, second temple;

[0032] 200, main board; 210, shielding cover; 220, first buckling portion; 230, mounting hole;

[0033] 300, flexible circuit board; 301, first heat dissipation layer; 302, second heat dissipation layer; 310, extension part; 320, second buckling part; 311, first circuit board; 312, second circuit board. DETAILED DESCRIPTION

[0034] The following is a further detailed description of the implementation of the present application in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0035] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0036] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0037] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0038] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0039] With the development of smart glasses and the emergence of more and more ecological applications, smart glasses urgently need to solve the temperature rise problem caused by high power consumption applications. The contradiction of poor heat dissipation leading to poor wearer experience has gradually become prominent. At the same time, the thin and integrated design requirements of smart glasses limit their size design and material usage. How to achieve the best heat dissipation design in a limited space so that the wearer has a comfortable experience is a topic worth studying.

[0040] The most widely used heat dissipation design scheme for current XR glasses is to conduct heat normally from the heat source (chip) through heat dissipation gel or heat dissipation silicone pads, and then expand the heat through a temperature-equalizing material (such as graphite), making fuller use of the heat dissipation area, thereby enhancing the heat dissipation efficiency and reducing the temperature of the surface that can be contacted by the human body. The heat source is generally placed in the area of ​​the XR glasses' temple assembly, but due to the requirements of a thin and light integrated design, the space of the temple assembly is small, so the effective heat dissipation area that can be covered by the temperature-equalizing material is relatively limited, and the heat dissipation effect is limited. When the power of the heat source exceeds a certain threshold, the temperature of the glasses shell is too high, resulting in a poor user experience, and in severe cases even low-temperature burns may occur. Therefore, finding a lightweight and enhanced heat dissipation method is crucial to the development of XR smart glasses.

[0041] The present application provides a smart glasses. The smart glasses referred to in the present application are electronic devices that can be worn on the human eye, including but not limited to AI glasses, camera glasses, XR glasses, audio glasses, Bluetooth glasses, etc. that are commonly seen on the market. Smart glasses can be AR glasses, VR glasses, or MR glasses in XR glasses, etc., to solve the problem that existing smart glasses have poor heat dissipation and affect user experience. Figure 1-5 Provide explanation.

[0042] The smart glasses provided in the embodiments of the present application refer to Figure 1 and Figure 2 As shown, the glasses include a glasses body 100, a flexible printed circuit board 300 (Flexible Printed Circuit, FPC) and a first heat dissipation layer 301. A cavity is formed inside the glasses body 100, the flexible printed circuit board 300 is arranged inside the cavity of the glasses body 100, and the first heat dissipation layer 301 is arranged on the outer surface of the flexible printed circuit board 300.

[0043] Exemplarily, the flexible circuit board 300 can be used to carry and connect various electronic components in smart glasses, such as microprocessors, sensors, batteries, antennas, etc., to realize the intelligent functions of the glasses. Due to its flexibility and bendability, the flexible circuit board can adapt to the complex three-dimensional shape of smart glasses, so that it can be arranged in a small space without affecting the overall design of the smart glasses; it can also withstand a certain degree of bending and stretching, and is not easily damaged by external forces, thereby improving the durability and reliability of the smart glasses.

[0044] The flexible circuit board 300 is arranged inside the cavity of the glasses body 100 to prevent the flexible circuit board 300 from being damaged by the external environment (such as dust, sweat, impact, etc.). The space inside the cavity allows the electronic components to be integrated in a compact area, maximizing the use of the limited space of the glasses, so that the smart glasses can integrate more functions without increasing the size and weight, thereby realizing the versatility and portability of the smart glasses.

[0045] By providing a first heat dissipation layer 301 on the outer surface of the flexible circuit board 300, the first heat dissipation layer 301 can be made of a high thermal conductivity material such as graphene, carbon nanotubes or other thermal conductive coatings to improve the thermal conductivity efficiency of the flexible circuit board 300. By providing the first heat dissipation layer 301, the heat of the flexible circuit board 300 can be evenly distributed, the thermal conductivity and temperature equalization capabilities of the flexible circuit board 300 can be improved, and the flexible circuit board 300 can flexibly adapt to various bends and shapes of the glasses, and conduct heat to various parts of the glasses body 100 to facilitate heat dissipation, thereby improving the heat dissipation capacity and heat dissipation effect of the smart glasses.

[0046] In an optional embodiment, the smart glasses also include a main board 200, the glasses body 100 includes a frame 110 and a temple assembly 120 connected to the frame 110, the main board 200 is arranged on the frame 110 or the temple assembly 120, the flexible circuit board 300 is connected to the main board 200, and the flexible circuit board 300 is suitable for connecting to the functional module.

[0047] It can be understood that, in this embodiment, the glasses body 100 includes a frame 110 and a temple assembly 120, and the temple assembly 120 is rotatably connected to the frame 110. For example, there are two temple assemblies 120, including a first temple 121 and a second temple 122 respectively located at the left and right ends of the frame 110, to ensure stable wearing of the glasses.

[0048] The main board 200 can be installed in the frame 110 or the temple assembly 120. It is the core electronic component of the smart glasses. The main board 200 may include a processor, memory, and sensors, etc. The flexible circuit board 300 is used to connect the main board 200 and other electronic components to realize the bridging function of the circuit and ensure smooth signal transmission; the flexible circuit board 300 can also be used to provide an expansion interface to connect to other functional modules, such as cameras, sensors, displays, etc.

[0049] In order to enhance the anti-electromagnetic interference capability of the flexible circuit board 300 , the conventional flexible circuit board 300 is generally provided with a shielding structure separately, which has a complex structure and requires additional space.

[0050] In an optional embodiment, the first heat dissipation layer 301 is a graphite layer or a carbon nanotube layer. Graphite and carbon nanotubes have good thermal conductivity and can more effectively transfer heat from the flexible circuit board 300 to the frame 110, temple assembly 120 or other heat dissipation components of the glasses. Graphite and carbon nanotubes also have good electromagnetic shielding capabilities. The first heat dissipation layer 301 can form an electromagnetic shielding layer on the surface of the flexible circuit board 300, effectively blocking electromagnetic interference of other electronic components in the smart glasses to the flexible circuit board 300, ensuring signal stability and accuracy of data transmission, without the need to set up a separate shielding structure, thereby realizing a compact structural design of the smart glasses, making the smart glasses lighter and more portable.

[0051] In an alternative embodiment, reference Figure 1 and Figure 3 As shown, the first heat dissipation layer 301 is formed by the heat dissipation material sprayed on the outer surface of the flexible circuit board 300, which can ensure that the heat dissipation material can evenly cover the entire outer surface of the flexible circuit board 300 without omission, and because the flexible circuit board 300 has high flexibility, it can be conveniently and flexibly arranged in the narrow space of the glasses body 100. The first heat dissipation layer 301 formed by spraying will not affect the ductility of the flexible circuit board 300. The first heat dissipation layer 301 can follow the shape change of the flexible circuit board 300 and be arranged in various corners of the glasses body 100, including bending and turning parts, to transfer heat to various positions on the glasses body 100 to increase the heat dissipation area and heat dissipation effect, and the spraying design can also minimize the space occupancy.

[0052] In an optional embodiment, the first heat dissipation layer 301 and the flexible circuit board 300 are an integrated structure. The integrated design makes the first heat dissipation layer 301 and the flexible circuit board 300 easy to assemble and the structure is stable and reliable, which can minimize the space occupancy and facilitate the lightweight and compact design of the smart glasses.

[0053] In an optional implementation, the first heat dissipation layer 301 is disposed on the outer surface of the flexible circuit board 300 away from the human body.

[0054] In this embodiment, the first heat dissipation layer 301 is arranged on the side away from the human body. On the one hand, the heat of the first heat dissipation layer 301 is preferentially transferred to the outer side of the eyeglass body 100 away from the human body, and the outer side is in full contact with the external air. Good air circulation can accelerate the transfer of heat, thereby improving the heat dissipation efficiency. After the heat is generated in the flexible circuit board 300, it is transferred to the outer side of the eyeglass body 100 through the first heat dissipation layer 301 and dissipated into the air for heat dissipation.

[0055] On the other hand, it can also avoid scalding the user and improve the wearing comfort of the user. If the first heat dissipation layer 301 is arranged on the side of the flexible circuit board 300 close to the human body, the circuit board may generate a higher temperature when working for a long time or under high load, and the heat will be preferentially transferred to the side of the eyeglass body 100 close to the user, which may cause scalding to the user's skin. However, arranging the first heat dissipation layer 301 on the side away from the human body can effectively avoid this situation.

[0056] In an alternative embodiment, in combination Figure 3 and Figure 5 As shown, the mainboard 200 is provided with a shielding cover 210 , the flexible circuit board 300 includes an extension portion 310 , and the outer surface of the extension portion 310 is provided with a second heat dissipation layer 302 . When the flexible circuit board 300 is connected to the mainboard 200 , the second heat dissipation layer 302 is attached to the shielding cover 210 .

[0057] It can be understood that the mainboard 200 of the smart glasses is generally provided with a chip and a shielding cover 210. The chip is located in the shielding cover 210. The shielding cover 210 can be used to provide electromagnetic shielding and reduce electromagnetic interference. The chip, as the main heat source of the mainboard 200, generates a large amount of heat during the operation of the smart glasses.

[0058] The flexible circuit board 300 includes an extension portion 310, which extends beyond the connection area between the flexible circuit board 300 and the main board 200, and a second heat dissipation layer 302 is provided on the extension portion 310. The second heat dissipation layer 302 can be made of a heat-conducting material (such as graphite, carbon nanotubes or other high-efficiency heat-conducting materials). The main function of the second heat dissipation layer 302 is to enhance the heat dissipation of the main board 200. By being attached to the shielding cover 210, it can effectively conduct the heat generated by the main board 200 through the second heat dissipation layer 302 and the flexible circuit board 300.

[0059] The extension portion 310 is located on a side of the flexible circuit board 300 close to the main board 200. When the flexible circuit board 300 is connected to the main board 200, the second heat dissipation layer 302 of the extension portion 310 is close to the shielding cover 210, forming a direct heat dissipation path, ensuring that the heat generated by the main board 200 can be quickly transferred to the second heat dissipation layer 302, and transferred to the flexible circuit board 300 through the second heat dissipation layer 302, and transferred to the frame 110 and the temple assemblies 120 on both sides of the frame 110 through the first heat dissipation layer 301, thereby further enhancing the heat dissipation effect of the main board 200 and improving the performance, stability and user experience of the smart glasses.

[0060] It is understandable that the material of the second heat dissipation layer 302 and the material of the first heat dissipation layer 301 may be the same or different, and this embodiment does not specifically limit this.

[0061] In an alternative embodiment, reference Figure 1 and Figure 5 As shown, the shape and size of the extension portion 310 are adapted to the shape and size of the shielding cover 210 , ensuring that the contact area between the second heat dissipation layer 302 on the extension portion 310 and the shielding cover 210 is maximized, thereby improving the heat dissipation area and heat dissipation efficiency.

[0062] In an optional implementation, the thickness of the first heat dissipation layer 301 is 0.1-1 mm; in an optional implementation, the thickness of the second heat dissipation layer 302 is 0.1-1 mm.

[0063] Optionally, the thickness of the first heat dissipation layer 301 and the second heat dissipation layer 302 can be 0.1 mm, 0.2 mm, 0.3 mm, ... or 1 mm, and the specific selection can be selected according to the heat dissipation requirements of the smart glasses, the internal space limitation, the heat dissipation material characteristics and the cost, which is not specifically limited in this embodiment. By selecting the appropriate thickness of the first heat dissipation layer 301 and the second heat dissipation layer 302, it can be ensured that the smart glasses provide sufficient heat dissipation capacity while maintaining a light and thin appearance, so as to ensure the stable operation of the smart glasses and the comfortable experience of the user.

[0064] Optionally, the thickness of the first heat dissipation layer 301 and the second heat dissipation layer 302 may be the same or different, and may be specifically designed according to heat dissipation requirements, which is not specifically limited in this embodiment.

[0065] In an alternative embodiment, reference Figure 4 and Figure 5 As shown, the main board 200 is provided with a first buckling portion 220, and the flexible circuit board 300 is provided with a second buckling portion 320. When the flexible circuit board 300 is connected to the main board 200, the first buckling portion 220 and the second buckling portion 320 are buckled and connected.

[0066] In this embodiment, the first buckling portion 220 on the main board 200 may be a protrusion or a groove structure, and is used to cooperate with the second buckling portion 320 of the flexible circuit board 300 to achieve connection and fixation. The second buckling portion 320 on the flexible circuit board 300 corresponds to the first buckling portion 220 of the main board 200, and the second buckling portion 320 may be a groove, a protrusion or other structure that can buckle with the first buckling portion 220.

[0067] When the flexible circuit board 300 is connected to the main board 200, the second snap-fitting portion 320 of the flexible circuit board 300 and the first snap-fitting portion 220 of the main board 200 are snap-fitted together through physical contact and pressure. The snap-fitting connection method can be plug-in, snap-fit, or other mechanical connection methods, which ensures the firmness and stability of the connection between the flexible circuit board 300 and the main board 200. The snap-fitting connection provides a stable mechanical structure, reduces connection problems caused by vibration or movement, and makes the installation and disassembly of the flexible circuit board 300 and the main board 200 easier, and facilitates maintenance and replacement.

[0068] After the first buckle part 220 and the second buckle part 320 are buckled and connected, the second heat dissipation layer 302 on the extension part 310 of the flexible circuit board 300 is tightly fitted with the shielding cover of the main board 200, ensuring that heat can be effectively transferred from the main board 200 to the second heat dissipation layer 302, and then dissipated through the second heat dissipation layer 302 and the first heat dissipation layer 301 of the flexible circuit board 300. Due to the tight fit between the second heat dissipation layer 302 and the shielding cover, the efficiency of the heat dissipation path is improved, which helps to quickly conduct and dissipate the heat generated by the main board 200, improve the overall heat dissipation effect of the smart glasses, and enhance the user experience.

[0069] In an optional embodiment, there are multiple first snap-fitting portions 220 and multiple second snap-fitting portions 320, and the first snap-fitting portions 220 and the second snap-fitting portions 320 are arranged one-to-one correspondingly. The snap-fitting design of multiple snap-fitting portions improves the connection stability between the flexible circuit board 300 and the circuit board.

[0070] In an alternative embodiment, reference Figure 1 and Figure 3 As shown, the temple assembly 120 includes a first temple 121 and a second temple 122 respectively connected to both sides of the frame 110, the flexible circuit board 300 is an integrated structure, and the flexible circuit board 300 is sequentially passed through the first temple 121, the frame 110 and the second temple 122 and extends along their length direction.

[0071] It is understandable that in the traditional design, the heat dissipation design at the shaft where the frame 110 and the temples are connected is a split design, and the heat transfer at the shaft connection is not smooth, and there is a heat dissipation dead angle, which leads to local overheating. In this embodiment, the flexible circuit board 300 is an uninterrupted integral structure, starting from the first temple 121, passing through the frame 110, and extending to the second temple 122, that is, at the shaft where the first temple 121 is connected to the frame 110, and at the shaft where the second temple 122 is connected to the frame 110, the flexible circuit board 300 is still continuous, and the first heat dissipation layer 301 on the outer surface of the flexible circuit board 300 is also continuous, and the heat can be evenly transferred along the length direction of the circuit board, thereby forming a continuous heat dissipation path in the entire glasses structure, thereby improving the heat dissipation efficiency.

[0072] The flexible circuit board 300 is extended along the length direction of the first temple 121, the frame 110 and the second temple 122, forming a continuous heat dissipation path, ensuring that heat can be quickly transferred from the main board 200 to the temple assembly 120 and the frame 110, and then dissipated to the external environment. Through the extension of the flexible circuit board 300 and the first heat dissipation layer 301 on the flexible circuit board 300, heat can be evenly transferred to the entire glasses, including the frame 110 and the temple assembly 120, to achieve uniform heat distribution, improve the heat dissipation effect of the whole machine, and help avoid local overheating of the smart glasses.

[0073] In an alternative embodiment, reference Figure 1 and Figure 3 As shown, the main board 200 is located in the middle of the temple assembly 120 , and the flexible circuit board 300 includes a first circuit board 311 and a second circuit board 312 , and the first circuit board 311 and the second circuit board 312 are respectively connected to two ends of the main board 200 .

[0074] It is understandable that, limited by the narrow space design of the temple assembly 120, placing the main board 200 in the middle of the temple assembly 120 can maximize the use of the space of the temple assembly 120. Especially under the design requirements of smart glasses pursuing lightness and integration, the space in the middle of the temple assembly 120 is relatively large, which can accommodate the main board 200 and related electronic components and heat dissipation structures.

[0075] Furthermore, the flexible circuit board 300 includes a first circuit board 311 and a second circuit board 312, which are respectively connected to the two ends of the main board 200. This design can ensure that the electronic components on the circuit board can be evenly distributed on both sides of the main board 200, thereby improving the balance and stability of the circuit.

[0076] In an alternative embodiment, in combination Figure 1 and Figure 4As shown, mounting holes 230 are provided at both ends of the main board 200, and the main board 200 is installed on the temple assembly 120 through the mounting holes 230, which provides a stable connection for the main board 200 and reduces looseness or displacement caused by vibration or movement. The design of the mounting holes 230 is easy for installation and disassembly, and is convenient for later maintenance and replacement.

[0077] Optionally, the number of the mounting holes 230 at both ends of the main board 200 can be multiple, so as to improve the connection stability between the main board 200 and the temple assembly 120.

[0078] In an optional embodiment, the smart glasses also include a battery, and the main board 200 and the battery are respectively installed in the left and right temple assemblies 120, for example, the main board 200 is installed on the first temple 121 on the left side of the frame 110, and the battery is installed on the second temple 122 on the right side. This helps to balance the weight of the glasses, reduce discomfort when wearing, and improve the wearing comfort of the user; it also helps to improve the stability of the glasses and reduce shaking caused by uneven weight distribution during wearing.

[0079] Optionally, it is also possible to flexibly select an ordinary flexible circuit board 300 or a flexible circuit board 300 with a first heat dissipation layer 301 for matching, depending on whether the mainboard 200 and the battery need to dissipate heat. For the connection of the mainboard 200, since the electronic components on the mainboard 200 usually generate more heat, a stronger heat dissipation capability is required. In this case, a flexible circuit board 300 with a first heat dissipation layer 301 can be selected to enhance the heat dissipation effect. The heat generated by the battery is usually relatively small, so for the battery connection, such a strong heat dissipation capability may not be required. In this case, an ordinary flexible circuit board 300 can be selected for connection without setting the first heat dissipation layer 301 to reduce unnecessary material costs and weight. Specifically, it can be achieved by spraying the first heat dissipation layer 301 at a specific position of the flexible circuit board 300, so that the smart glasses can achieve an efficient heat dissipation solution according to the heat dissipation requirements of different components while maintaining a light and thin appearance.

[0080] The smart glasses provided in the embodiment of the present application include a glasses body 100, a flexible circuit board 300 and a first heat dissipation layer 301, wherein the flexible circuit board 300 is disposed on the glasses body 100, and the first heat dissipation layer 301 is disposed on the outer surface of the flexible circuit board 300. By disposing a first heat dissipation layer 301 on the outer surface of the flexible circuit board 300, the thermal conductivity and temperature uniformity of the flexible circuit board 300 can be improved, and the flexible circuit board 300 can flexibly adapt to various bends and shapes of the glasses, and conduct heat to various parts of the glasses body 100 to facilitate heat dissipation, thereby improving the heat dissipation capacity and heat dissipation effect of the smart glasses.

[0081] For example, during the manufacturing process, the flexible circuit board 300 body can be prepared by a conventional circuit board manufacturing process to ensure that it has good electrical performance and mechanical strength, and a material with strong heat dissipation ability, such as graphite, carbon nanotubes, etc., is sprayed on the surface of the flexible circuit board 300 body to form a heat dissipation material layer. The spraying process should ensure that the heat dissipation material evenly covers the surface of the flexible circuit board 300 and has a moderate thickness to ensure good heat dissipation performance and shielding function. The flexible circuit board 300 is snap-fitted and connected to the main board 200 through a snap-fit ​​connection structure to ensure a firm and reliable connection and good electrical performance.

[0082] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features.

[0083] Finally, it should be noted that the above implementation modes are only used to illustrate the present application, rather than to limit the present application. Although the present application is described in detail with reference to the embodiments, a person skilled in the art should understand that various combinations, modifications or equivalent replacements of the technical solutions of the present application do not depart from the spirit and scope of the technical solutions of the present application, and should be included in the protection scope of the present application.

Claims

1. A pair of smart glasses, characterized in that: include: A spectacles body (100) having a cavity formed therein; A flexible circuit board (300) is arranged in the cavity of the eyeglass body (100); A first heat dissipation layer (301) is arranged on the outer surface of the flexible circuit board (300).

2. The smart glasses according to claim 1, characterized in that: The first heat dissipation layer (301) is formed by a heat dissipation material sprayed on the outer surface of the flexible circuit board (300); And / or, the first heat dissipation layer (301) and the flexible circuit board (300) are an integrated structure.

3. The smart glasses according to claim 1, characterized in that: The first heat dissipation layer (301) is arranged on the outer surface of the flexible circuit board (300) at a side away from the human body.

4. The smart glasses according to claim 1, characterized in that: The smart glasses further comprise a main board (200); the glasses main body (100) comprises a frame (110) and a temple assembly (120) connected to the frame (110); the main board (200) is arranged on the frame (110) or the temple assembly (120), and the main board (200) is connected to the flexible circuit board (300).

5. The smart glasses according to claim 4, characterized in that: The main board (200) is provided with a shielding cover (210), the flexible circuit board (300) comprises an extension portion (310), the outer surface of the extension portion (310) is provided with a second heat dissipation layer (302), and when the flexible circuit board (300) is connected to the main board (200), the second heat dissipation layer (302) is attached to the shielding cover (210).

6. The smart glasses according to claim 5, characterized in that: The shape and size of the extension portion (310) are adapted to the shape and size of the shielding cover (210).

7. The smart glasses according to claim 5, characterized in that: The first heat dissipation layer (301) is a graphite layer or a carbon nanotube layer; And / or, the second heat dissipation layer (302) is a graphite layer or a carbon nanotube layer.

8. The smart glasses according to claim 5, characterized in that: The thickness of the first heat dissipation layer (301) is 0.1-1 mm; And / or, the thickness of the second heat dissipation layer (302) is 0.1-1 mm.

9. The smart glasses according to claim 4, characterized in that: The temple assembly (120) comprises a first temple (121) and a second temple (122) respectively connected to two sides of the frame (110); the flexible circuit board (300) is an integrated structure; and the flexible circuit board (300) is sequentially inserted into the first temple (121), the frame (110) and the second temple (122) and extends along the length direction thereof.

10. The smart glasses according to claim 4, characterized in that: The main board (200) is located in the middle of the temple assembly (120); the flexible circuit board (300) comprises a first circuit board (311) and a second circuit board (312); the first circuit board (311) and the second circuit board (312) are respectively connected to two ends of the main board (200); And / or, mounting holes (230) are provided at both ends of the main board (200), and the main board (200) is mounted on the temple assembly (120) through the mounting holes (230); And / or, the main board (200) is provided with a first buckling portion (220), and the flexible circuit board (300) is provided with a second buckling portion (320), and when the flexible circuit board (300) is connected to the main board (200), the first buckling portion (220) and the second buckling portion (320) are buckled and connected.

Images