Optical proximity correction method and device, computer readable storage medium and electronic equipment

Abstract

The invention discloses an optical proximity correction method and device, a computer readable storage medium and electronic equipment. The optical proximity correction method comprises the following steps: acquiring a to-be-corrected layout; correcting the to-be-corrected layout to obtain a preliminary corrected layout; obtaining a hot spot to be repaired according to the preliminary correction layout; dividing a first area, wherein the hot spot to be repaired is located in the first area; according to the first area, repairing the to-be-repaired hot spot to obtain a to-be-checked layout; checking the to-be-checked layout after the to-be-checked layout is corrected; and obtaining the tape-out layout according to the corrected checking result. After obtaining the preliminary correction layout and the hot spot to be repaired, dividing a first region; and repairing the hot spot to be repaired according to the first area. Only the layout of the first region with the to-be-repaired hot spot is repaired, so that the repair of patterns in other regions in the layout is avoided, and the repair efficiency and the repair speed can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to an optical proximity correction method and device, a computer-readable storage medium and an electronic device. Background Art

[0002] In the semiconductor manufacturing process, in order to transfer the circuit pattern of an integrated circuit (IC) to a semiconductor chip, the circuit pattern of the integrated circuit needs to be designed as a mask pattern, and then the mask pattern is transferred from the mask surface to the semiconductor chip.

[0003] As the critical dimension (CD) of integrated circuits shrinks and is affected by the resolution limit of the optical exposure tool (OET), the optical proximity effect (OPE) is easily generated when the high-density mask pattern is exposed for pattern transfer, causing defects in the mask pattern transfer. To address the problem of optical proximity effect, a method currently commonly used in the industry is optical proximity correction (OPC), which reduces the deviation of the lithography pattern obtained by exposure by changing the shape of the original layout pattern.

[0004] However, the existing methods for optical proximity correction have low correction efficiency and slow correction speed. Summary of the invention

[0005] The problem solved by the present invention is how to improve the efficiency and speed of optical proximity correction.

[0006] To solve the above problems, the present invention provides an optical proximity correction method, comprising:

[0007] Acquire a layout to be corrected; correct the layout to be corrected to obtain a preliminary corrected layout; obtain a hotspot to be repaired based on the preliminary corrected layout; divide a first area, wherein the hotspot to be repaired is located in the first area; according to the first area, repair the hotspot to be repaired to obtain a layout to be checked; perform a post-correction check on the layout to be checked; and obtain a tape-out layout based on the result of the post-correction check.

[0008] Optionally, the step of performing a correction check on the layout to be checked includes: dividing the layout to be checked into a second area, wherein the second area surrounds the first area; and performing a correction check on the layout to be checked in the second area.

[0009] Optionally, in at least one of the step of dividing the first area and the step of dividing the second area in the layout to be inspected, the areas are divided according to optical diameters.

[0010] Optionally, in the step of dividing the first area, the maximum size of the first area is not less than 10 times the optical diameter.

[0011] Optionally, in the step of dividing the first area, the first area is circular, and the diameter of the first area is not less than 10 times the optical diameter; in the step of dividing the first area, the first area is square, and the side length of the first area is not less than 10 times the optical diameter.

[0012] Optionally, in the step of dividing the second area in the layout to be inspected, the maximum size of the second area is not less than 14 times the optical diameter.

[0013] Optionally, in the step of dividing the second area in the layout to be inspected, the second area is circular, and the diameter of the second area is not less than 14 times the optical diameter; in the step of dividing the second area in the layout to be inspected, the second area is square, and the side length of the second area is not less than 14 times the optical diameter.

[0014] Optionally, in at least one of the step of dividing the first area and the step of dividing the second area in the layout to be checked, the hotspot to be repaired is located at the geometric center of the area.

[0015] Optionally, the step of obtaining the tape-out layout includes: when the layout to be inspected passes the post-correction inspection, obtaining the tape-out layout based on the layout to be inspected; when the layout to be inspected fails to pass the post-correction inspection, based on the layout to be inspected, again executing the steps of dividing the first area, repairing the points to be repaired and performing the post-correction inspection, until the layout to be inspected passes the post-correction inspection to obtain the tape-out layout.

[0016] Optionally, the step of repairing the hotspot to be repaired to obtain a layout to be inspected includes: modifying the process recipe to repair the hotspot to be repaired according to the layout of the first area; correcting the layout of the first area after the recipe modification to obtain a repaired layout of the first area; replacing the layout of the first area with the repaired layout of the first area to obtain a layout to be inspected.

[0017] Optionally, the step of obtaining the hotspot to be repaired includes: performing a post-correction check on the preliminary revised layout to obtain a hotspot; determining whether the hotspot can be ignored; when the hotspot cannot be ignored, the hotspot is a hotspot to be repaired.

[0018] Optionally, the method further includes: when the hotspot can be ignored, obtaining a tape-out layout according to the preliminary revised layout.

[0019] Optionally, in the step of obtaining a hotspot, the hotspot includes: at least one of a pinch-off point or a bridging point.

[0020] Optionally, in the step of obtaining hotspots to be repaired, at least two hotspots to be repaired of the same type are obtained; in the step of dividing the first area, at least two of the first areas are divided, and one hotspot to be repaired is located within one of the first areas; in the step of repairing the hotspots to be repaired to obtain a layout to be inspected, at least two of the hotspots to be repaired are repaired at the same time to obtain the layout to be inspected.

[0021] Accordingly, the present invention also provides an optical proximity correction device, comprising:

[0022] An acquisition unit, wherein the acquisition unit is suitable for acquiring a layout to be corrected; a correction unit, wherein the correction unit is suitable for correcting the layout to be corrected to obtain a preliminary corrected layout; an inspection unit, wherein the inspection unit is suitable for obtaining a hotspot to be repaired based on the preliminary corrected layout; a division unit, wherein the division unit is suitable for dividing a first area, wherein the hotspot to be repaired is located within the first area; a repair unit, wherein the repair unit is suitable for repairing the hotspot to be repaired based on the first area to obtain a layout to be checked; the inspection unit is also suitable for checking the layout to be checked after correction; an output unit, wherein the output unit is suitable for obtaining a tape-out layout based on a result of the correction check.

[0023] Optionally, the division unit is also suitable for dividing the layout to be inspected into a second area, wherein the second area surrounds the first area; the inspection unit performs a modified inspection on the layout to be inspected in the second area; when the layout to be inspected in the second area passes the modified inspection of the inspection unit, the output unit obtains the wafer layout based on the layout to be inspected.

[0024] Optionally, the inspection unit performs a post-correction inspection on the preliminary correction layout to obtain a hotspot; the optical proximity correction device also includes: a judgment unit, which is suitable for judging whether the hotspot can be ignored; the inspection unit obtains the hotspot to be repaired based on the judgment result of the judgment unit.

[0025] In addition, the present invention also provides a computer-readable storage medium on which a computer program is stored. The computer program is executed by a processor to implement the steps of the method of the present invention.

[0026] In addition, the present invention also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program that can be run on the processor, and is characterized in that the processor executes the steps of the method of the present invention when running the computer program.

[0027] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0028] In the technical solution of the present invention, after obtaining the preliminary revised layout and the hot spots to be repaired, the first area is divided; according to the first area, the hot spots to be repaired are repaired. Only the layout of the first area with the hot spots to be repaired is repaired, avoiding the repair of graphics in other areas of the layout, which can effectively improve the repair efficiency and repair speed.

[0029] In an optional solution of the present invention, after the hotspot to be repaired and the layout to be inspected is obtained, a second area is divided according to the layout to be inspected; the layout to be inspected in the second area is corrected and inspected, wherein the second area surrounds the first area. Only the layout to be inspected in the second area with a larger range is inspected after repair, which can not only realize the inspection between the first area and other surrounding areas, avoiding the repair area from causing new defects in the surrounding layout, but also avoid the inspection of the entire layout, which can effectively improve the inspection efficiency and speed, and is conducive to improving the repair efficiency and speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a schematic flow chart of an embodiment of an optical proximity correction method of the present invention;

[0031] Figure 2 yes Figure 1 A schematic diagram of a preliminary corrected layout obtained by an embodiment of the optical proximity correction method of the present invention is shown;

[0032] Figure 3 yes Figure 2 An enlarged schematic diagram of a hot spot in a preliminary correction layout obtained by an embodiment of the optical proximity correction method of the present invention is shown;

[0033] Figure 4 yes Figure 1 The schematic flow chart of the step of obtaining the hotspot to be repaired in the embodiment of the optical proximity correction method of the present invention is shown;

[0034] Figure 5 yes Figure 1 A schematic flow chart of the steps of repairing the hotspot to be repaired to obtain a layout to be checked in an embodiment of the optical proximity correction method of the present invention;

[0035] Figure 6 yes Figure 1 The schematic flow chart of the inspection step after the correction of the to-be-inspected layout in the embodiment of the optical proximity correction method of the present invention is shown;

[0036] Figure 7 It is a functional block diagram of an embodiment of the optical proximity correction device of the present invention. DETAILED DESCRIPTION

[0037] As can be seen from the background art, the conventional optical proximity correction method has the problems of low correction efficiency and slow correction speed.

[0038] The layout after optical proximity correction needs to be checked to ensure that there are no design rule check (DRC) violation areas or hot spots (pinch or bridge) in the corrected layout. For the hot spots in the corrected layout, repair is required to complete the optical proximity correction.

[0039] When checking the corrected layout and finding hot spots, we first need to determine whether they can be ignored. For hot spots that cannot be ignored, we need to repair them by modifying the support formula and re-perform optical proximity correction on the entire layout until the goal is achieved.

[0040] In the existing hot spot area repair method, after the hot spot area is repaired, the entire layout needs to be re-corrected with optical proximity. This correction method will correct other areas without hot spots again, which greatly increases the correction time and affects the correction speed.

[0041] In order to solve the technical problem, the present invention provides an optical proximity correction method, comprising:

[0042] Acquire a layout to be corrected; perform optical proximity correction on the layout to be corrected to obtain a preliminary corrected layout; obtain a hotspot to be repaired based on the preliminary corrected layout; divide a first area, wherein the hotspot to be repaired is located in the first area; based on the first area, repair the hotspot to be repaired to obtain a layout to be checked; perform a post-correction check on the layout to be checked; and obtain a tape-out layout based on the result of the post-correction check.

[0043] The technical solution of the present invention, after obtaining the preliminary revised layout and the hot spots to be repaired, divides the first area; according to the first area, the hot spots to be repaired are repaired. Only the layout of the first area with the hot spots to be repaired is repaired, avoiding the repair of graphics in other areas of the layout, which can effectively improve the repair efficiency and repair speed.

[0044] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0045] refer to Figure 1 , shows a flow chart of an embodiment of the optical proximity correction method of the present invention.

[0046] The optical proximity correction method comprises:

[0047] Step S110, obtaining a layout to be corrected; Step S120, performing optical proximity correction on the layout to be corrected to obtain a preliminary corrected layout; Step S130, obtaining a hotspot to be repaired based on the preliminary corrected layout; Step S140, dividing a first area, wherein the hotspot to be repaired is located within the first area; Step S150, repairing the hotspot to be repaired based on the first area to obtain a layout to be checked; Step S160, performing a post-correction check on the layout to be checked; Step S171, obtaining a tape-out layout based on the result of the post-correction check.

[0048] The technical solution of the optical proximity correction method embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0049] In the optical proximity correction method, step S110 is first performed to obtain a layout to be corrected.

[0050] Specifically, step S110, the step of obtaining the layout to be corrected includes: obtaining a GDS (Geometry Summary Data) file of the layout to be corrected. The GDS file is used to define the three-dimensional structure and electrical characteristics of the chip, and the GDS file contains geometric data about the chip structure, shape and hierarchy.

[0051] Combined with reference Figure 2 , then executing step S120, correcting the layout to be corrected to obtain a preliminary corrected layout 200.

[0052] Specifically, step S120, the step of correcting the layout to be corrected is to pre-compensate the pattern of the layout to be corrected, at least partially correct the optical proximity effect in the layout to be corrected, and obtain a preliminary corrected layout 200, so that the pattern formed by the final exposure can meet the requirements of the design specifications as much as possible.

[0053] Continue to refer Figure 1 , combined with reference Figure 2 and Figure 3 After obtaining the preliminary revised layout 200 , step S130 is executed to obtain the hotspot 201 to be repaired according to the preliminary revised layout 200 .

[0054] like Figure 4 As shown, in some embodiments of the present invention, step S130, the step of obtaining the hotspot 201 to be repaired includes: step S131, performing a post-correction check on the preliminary revised layout 200 to obtain a hotspot; step S132, determining whether the hotspot can be ignored (waive); when the hotspot cannot be ignored, executing step S133, and the hotspot is the hotspot 201 to be repaired.

[0055] In some embodiments, in step S131, the preliminary revised layout 200 is checked after correction, and in the step of obtaining hotspots, the hotspots include: at least one of a pinch point and a bridge node; in some embodiments, in step S131, the preliminary revised layout 200 is checked after correction, and in the step of obtaining hotspots, the hotspots also include: graphics that violate design rules.

[0056] After obtaining the hotspot, step S132 is executed to determine whether the hotspot can be ignored; if it is determined that the hotspot cannot be ignored, step S133 is executed, and the hotspot is the hotspot to be repaired 201. Specifically, in step S132, in the step of determining whether the hotspot can be ignored, it can be determined based on experience whether the hotspot can be ignored.

[0057] It should be noted that if Figure 4 As shown, in some embodiments, the optical proximity correction method further includes: when the hot spot can be ignored, executing step S172, obtaining a tape-out layout according to the preliminary correction layout 200. Specifically, when it is determined that the hot spot can be ignored, the preliminary correction layout 200 is used as the tape-out layout, that is, the hot spot is directly ignored, and the initial correction layout is used as the tape-out layout for tape-out.

[0058] Continue to refer Figure 1 , combined with reference Figure 2 After obtaining the hotspot 201 to be repaired, step S140 is executed to divide the first area 210, and the hotspot 201 to be repaired is located in the first area 210.

[0059] The first region 210 represents the influence range of the hot spot 201 to be repaired, that is, during the photolithography process, the layout in the first region 210 will interact with the hot spot 201 to be repaired.

[0060] Specifically, in the step of executing step S140 and dividing the first area 210, after obtaining the hotspot 201 to be repaired, the first area 210 is divided around the hotspot 201 to be repaired according to the position of the hotspot 201 to be repaired, thereby obtaining the first area 210 having the hotspot 201 to be repaired inside.

[0061] In some embodiments of the present invention, in the step of dividing the first region 210, the first region 210 is divided according to the optical diameter (OD). The influence range of the hot spot 201 to be repaired is related to the optical diameter of the light used in the photolithography process. The first region 210 is divided based on the optical diameter, and the area of ​​the first region 210 obtained is appropriate, which can fully consider the influence range of the graphics around the hot spot 201 to be repaired, and control the area to reduce the calculation load of subsequent corrections. For example, in the step of dividing the first region 210, the maximum size of the first region 210 is not less than 10 times the optical diameter.

[0062] In some embodiments, in the step of dividing the first area 210, the first area 210 is a square, and the side length of the first area 210 is not less than 10 times the optical diameter. In other embodiments of the present invention, in the step of dividing the first area, the first area is a circle, and the diameter of the first area is not less than 10 times the optical diameter.

[0063] In some embodiments of the present invention, in the step of dividing the first area 210, the hotspot 201 to be repaired is located at the geometric center of the area. Figure 2 As shown, the first area 210 is a square, and the hotspot to be repaired 201 is located at the intersection of the diagonals of the square first area 210. In other embodiments, the first area is a circle, and the hotspot to be repaired is located at the center of the first circle.

[0064] Continue to refer Figure 1 , combined with reference Figure 2 After obtaining the first region 210, step S150 is executed to repair the hotspot 201 to be repaired according to the first region 210 to obtain a layout to be inspected.

[0065] In the step of repairing the hotspot 201 to be repaired, the repair is performed based on the layout of the first region 210. The layout area involved in the repair is relatively small, which can effectively reduce the calculation load involved in the repair and is conducive to improving the repair efficiency.

[0066] Combined with reference Figure 5 In some embodiments of the present invention, step S150, the step of repairing the hotspot to be repaired to obtain a layout to be checked includes: step S151, modifying the process recipe to repair the hotspot to be repaired according to the layout of the first area 210; step S152, correcting the layout of the first area 210 after the recipe is modified to obtain a repaired first area layout; step S153, replacing the layout of the first area 210 with the repaired first area layout to obtain a layout to be checked.

[0067] Specifically, in step S152, the layout of the first area 210 after the formula is modified is corrected, and in the step of obtaining the layout of the first area after repair, step S120 is adopted to correct the layout to be corrected, and the layout of the first area 210 after the formula is modified is corrected in the same way as the step of obtaining the preliminary corrected layout 200, to obtain the layout of the first area after repair.

[0068] Continue to refer Figure 1 The optical proximity correction method further includes: after obtaining the layout to be inspected, executing step S160 to perform a post-correction inspection on the layout to be inspected.

[0069] like Figure 6 As shown, combined with reference Figure 2 In some embodiments of the present invention, step S160, the step of performing a correction check on the layout to be checked includes: step S161, dividing the second area 220 according to the layout to be checked, and the second area 220 surrounds the first area 210; step S162, performing a correction check on the layout to be checked in the second area 220.

[0070] In step S160, in the step of performing correction inspection on the layout to be inspected, only the layout to be inspected in the larger second area 220 is inspected after repair. This can not only check the association between the first area 210 and the surrounding graphics, and avoid the repair area causing new defects to the surrounding layout, but also avoid inspecting the entire layout, which can effectively improve the inspection efficiency and speed, and is conducive to improving the repair efficiency and speed.

[0071] In some embodiments of the present invention, in the step of dividing the second area 220 in the layout to be inspected, the shape of the second area 220 is the same as the shape of the first area 220. Dividing the second area 220 with the same shape as the first area 210 can make the shape of the layout range involved in the inspection after repair match the shape of the layout range involved in the repair, and can simplify the calculation and reduce the calculation load while ensuring the repair accuracy and inspection progress.

[0072] In some embodiments of the present invention, in the step of dividing the second area 220 in the layout to be inspected, the area is divided according to the optical diameter. The association between the layout of the second area 220 and the surrounding layout is related to the optical diameter of the light used in the photolithography process. The second area 220 is divided based on the optical diameter for post-correction inspection. The area of ​​the obtained second area 220 is appropriate, which can fully consider the scope of the impact of the repair area on the surrounding graphics, and control the area to reduce the calculation load of the post-correction inspection. For example, in the step of dividing the second area 220 in the layout to be inspected, the maximum size of the second area 220 is not less than 14 times the optical diameter.

[0073] In some embodiments, in the step of dividing the second area 220 in the to-be-checked layout, the second area 220 is a square, and the side length of the second area 220 is not less than 14 times the optical diameter. In other embodiments, in the step of dividing the second area in the to-be-checked layout, the second area is a circle, and the diameter of the second area is not less than 14 times the optical diameter.

[0074] In some embodiments of the present invention, in the step of dividing the second area in the to-be-checked layout, the hotspot to be repaired is located at the geometric center of the area, that is, in the to-be-checked layout, the position corresponding to the hotspot to be repaired is located at the geometric center of the second area. Figure 2 As shown, the second area 220 is a square, and the position corresponding to the hotspot to be repaired 201 is located at the intersection of the diagonal lines of the square second area 220. In other embodiments, the second area is a circle, and the position corresponding to the hotspot to be repaired is located at the center of the first area of ​​the circle.

[0075] Continue to refer Figure 1 The optical proximity correction method further includes: obtaining a wafer layout according to the result of the post-correction inspection.

[0076] like Figure 1 As shown, the step of obtaining the tape-out layout includes: when the layout to be checked passes the post-correction inspection, executing step S171, and obtaining the tape-out layout according to the layout to be checked; when the layout to be checked does not pass the post-correction inspection, according to the layout to be checked, executing the steps of dividing the first area, repairing the points to be repaired, and performing the post-correction inspection again, until the layout to be checked passes the post-correction inspection to obtain the tape-out layout.

[0077] In some embodiments, in the step of performing a correction inspection on the layout to be inspected, a correction inspection is performed on the layout to be inspected in the second area; the layout to be inspected passes the correction inspection, that is, the layout to be inspected in the second area passes the correction inspection; the layout to be inspected fails the correction inspection, that is, the layout to be inspected in the second area fails the correction inspection.

[0078] It should be noted that, in the aforementioned embodiment, in the step of obtaining the hotspot to be repaired, only one hotspot to be repaired is obtained. In other embodiments of the present invention, in the step of obtaining the hotspot to be repaired, at least two hotspots to be repaired of the same type may be obtained; in the step of dividing the first area, at least two first areas are divided, and one hotspot to be repaired is located in one of the first areas; in the step of repairing the hotspot to be repaired to obtain the layout to be checked, at least two hotspots to be repaired are repaired at the same time to obtain the layout to be checked. Repairing at least two hotspots to be repaired of the same type in parallel can effectively improve the repair efficiency.

[0079] Correspondingly, the present invention also provides an optical proximity correction device.

[0080] refer to Figure 7 , showing a functional block diagram of an embodiment of the optical proximity correction device of the present invention.

[0081] The optical proximity correction device includes: an acquisition unit 310, wherein the acquisition unit 310 is suitable for acquiring a layout to be corrected; a correction unit 320, wherein the correction unit 320 is suitable for correcting the layout to be corrected to obtain a preliminary corrected layout; an inspection unit 330, wherein the inspection unit 330 is suitable for obtaining a hotspot to be repaired based on the preliminary corrected layout; a division unit 340, wherein the division unit 340 is suitable for dividing a first area, wherein the hotspot to be repaired is located within the first area; a repair unit 350, wherein the repair unit 350 is suitable for repairing the hotspot to be repaired based on the first area to obtain a layout to be checked; the inspection unit 330 is also suitable for performing a post-correction check on the layout to be checked; and an output unit 360, wherein the output unit 360 is suitable for obtaining a tape-out layout based on the result of the post-correction check.

[0082] The technical solution of an embodiment of the optical proximity correction device of the present invention will be described in detail below with reference to the accompanying drawings.

[0083] It should be noted that, in some embodiments of the present invention, the optical proximity correction device is suitable for executing each step of the optical proximity correction method of the present invention. The detailed technical scheme of the optical proximity correction device can also refer to the embodiments of the aforementioned optical proximity correction method.

[0084] The acquisition unit 310 acquires the layout to be corrected.

[0085] Specifically, the acquisition unit 310 acquires a GDS (Geometry Summary Data) file of the layout to be modified. The GDS file is used to define the three-dimensional structure and electrical characteristics of the chip, and the GDS file contains geometric data related to the chip structure, shape and hierarchical structure.

[0086] The correction unit 320 corrects the layout to be corrected to obtain a preliminary corrected layout 200 .

[0087] Specifically, combined with reference Figure 2 The correction unit 320 pre-compensates the layout to be corrected, at least partially corrects the optical proximity effect in the layout to be corrected, and obtains a preliminary corrected layout 200, so that the pattern formed by the final exposure meets the requirements of the design specifications as much as possible.

[0088] The checking unit 330 obtains the hotspot 201 to be repaired according to the preliminary revised layout 200 .

[0089] In some embodiments of the present invention, the inspection unit 330 performs a post-correction inspection on the preliminary correction layout to obtain a hotspot; the optical proximity correction device also includes: a judgment unit 370, and the judgment unit 370 is suitable for judging whether the hotspot can be ignored; the inspection unit 330 obtains the hotspot to be repaired according to the judgment result of the judgment unit 370; illustratively, when the judgment unit 370 judges that the hotspot cannot be ignored, the inspection unit 330 uses the hotspot as the hotspot 201 to be repaired.

[0090] In some embodiments, the inspection unit 330 performs a post-correction inspection on the preliminary revised layout, and the obtained hot spots include: at least one of a pinch-off point and a bridge node; in some embodiments, the hot spots obtained by the inspection unit 330 also include: graphics that violate design rules.

[0091] After the inspection unit 330 obtains the hotspot, the judgment unit 370 judges whether the hotspot can be ignored: when the judgment unit 370 judges that the hotspot cannot be ignored, the inspection unit 330 uses the hotspot as the hotspot to be repaired 201. For example, the judgment unit 370 pre-stores an experience database, and the judgment unit uses the experience database to judge whether the hotspot can be ignored.

[0092] It should be noted that, in some embodiments, the judgment unit 370 is also connected to the output unit 360 . When the judgment unit 370 judges that the hotspot can be ignored, the output unit 360 obtains a tape-out layout based on the preliminary revised layout 200 .

[0093] Specifically, when it is determined that the hotspot can be ignored, the output device 360 ​​uses the preliminary revised layout 200 as the tape-out layout, that is, directly ignores the hotspot, and the output device 360 ​​uses the initial revised layout as the tape-out layout for tapeout.

[0094] Continue to refer Figure 7 , combined with reference Figure 2 The optical proximity correction device further includes: a dividing unit 340 for dividing a first area 210 , and the hotspot 201 to be repaired is located in the first area 210 .

[0095] The first region 210 represents the influence range of the hot spot 201 to be repaired, that is, during the photolithography process, the pattern of the layout in the first region 210 will interact with the hot spot 201 to be repaired.

[0096] Specifically, the dividing unit 340 divides the first region 210 around the hotspot 201 to be repaired according to the position of the hotspot 201 to be repaired, so as to obtain the first region 210 having the hotspot 201 to be repaired therein.

[0097] In some embodiments of the present invention, the division unit 340 divides the first region 210 according to the optical diameter (OD) to fully consider the range of influence of the graphics around the hotspot 201 to be repaired, while controlling the area to reduce the calculation load of subsequent corrections. For example, the maximum size of the first region 210 divided by the division unit 340 is not less than 10 times the optical diameter.

[0098] In some embodiments, the first area 210 divided by the dividing unit 340 is a square, and the side length of the first area 210 is not less than 10 times the optical diameter. In other embodiments of the present invention, the first area divided by the dividing unit is a circle, and the diameter of the first area is not less than 10 times the optical diameter.

[0099] In some embodiments of the present invention, the division unit 340 divides the first area 210 with the hot spot 201 to be repaired as the geometric center. Figure 2 As shown, the division unit 340 divides the square first area 210 with the hot spot 201 to be repaired as the intersection of diagonal lines. In other embodiments, the division unit divides the circular first area with the hot spot to be repaired as the center.

[0100] Combined with reference Figure 2 The repair unit 350 repairs the hotspot 201 to be repaired according to the first region 210 to obtain a layout to be checked. The repair unit 350 repairs the layout based on the first region 210, and the repaired layout area is small, which can effectively reduce the calculation load involved in the repair, and is conducive to improving the repair efficiency.

[0101] In some embodiments of the present invention, the repair unit 350 modifies the process recipe to repair the hotspot to be repaired according to the layout of the first area 210; the repair unit 350 is connected to the correction unit 320, and the correction unit 320 corrects the layout of the first area 210 after the recipe modification to obtain the repaired first area layout; the repair unit 350 replaces the layout of the first area 210 with the repaired first area layout to obtain the layout to be inspected.

[0102] The inspection unit 330 also performs a post-correction inspection on the layout to be inspected;

[0103] In some embodiments of the present invention, the dividing unit 340 is further adapted to divide the second area 220 according to the layout to be checked, wherein the second area 220 surrounds the first area 210; and the checking unit 330 performs a correction check on the layout to be checked of the second area 220.

[0104] The inspection unit 330 only performs post-repair inspection on the layout to be inspected in the larger second area 220, which can not only check the relationship between the first area 210 and the surrounding graphics to avoid the repair area causing new defects in the surrounding layout, but also avoid inspecting the entire layout, which can effectively improve the inspection efficiency and speed, and is conducive to improving the repair efficiency and speed.

[0105] In some embodiments of the present invention, the division unit 340 divides the second area 220 into the same shape as the first area 220, so that the shape of the layout range involved in the inspection after repair is compatible with the shape of the layout range involved in the repair, thereby simplifying the calculation and reducing the calculation load while ensuring the repair accuracy and inspection progress.

[0106] In some embodiments of the present invention, the division unit 340 divides the second area 220 according to the optical diameter. The second area 220 is divided based on the optical diameter for post-correction inspection, and the area of ​​the obtained second area 220 is appropriate, which can fully consider the scope of the impact of the repair area on the surrounding graphics, and control the area to reduce the calculation load of the post-correction inspection. For example, the maximum size of the second area 220 divided by the division unit 340 is not less than 14 times the optical diameter.

[0107] In some embodiments, the second area 220 divided by the dividing unit 340 is a square, and the side length of the second area 220 is not less than 14 times the optical diameter. In other embodiments, the second area divided by the dividing unit is a circle, and the diameter of the second area is not less than 14 times the optical diameter.

[0108] In some embodiments of the present invention, the division unit 340 divides the second area with the hotspot to be repaired as the geometric center, that is, in the layout to be checked, the position corresponding to the hotspot to be repaired is located at the geometric center of the second area. Figure 2 As shown, the second area 220 is a square, and the position corresponding to the hotspot to be repaired 201 is located at the intersection of the diagonal lines of the square second area 220. In other embodiments, the second area is a circle, and the position corresponding to the hotspot to be repaired is located at the center of the first area of ​​the circle.

[0109] The output unit 360 obtains the tape-out layout according to the result of the corrected inspection.

[0110] When the layout to be checked passes the post-correction inspection of the inspection unit 330, the output unit 360 obtains the tape-out layout according to the layout to be checked; when the layout to be checked fails to pass the post-correction inspection of the inspection unit 330, according to the layout to be checked, the dividing unit 340 divides the first area again, the repairing unit 350 repairs the points to be repaired again, and the inspection unit 330 performs the post-correction inspection again, until the layout to be checked passes the post-correction inspection of the inspection unit 330, and the output unit 360 obtains the tape-out layout.

[0111] In some embodiments, the inspection unit 330 performs a revised inspection on the layout to be inspected in the second area; the layout to be inspected passes the revised inspection of the inspection unit 330, that is, the layout to be inspected in the second area passes the revised inspection of the inspection unit 330; the layout to be inspected fails to pass the revised inspection of the inspection unit 330, that is, the layout to be inspected in the second area fails to pass the revised inspection of the inspection unit 330.

[0112] It should be noted that, in the aforementioned embodiment, the inspection unit 330 only obtains one hotspot to be repaired, and the division unit 340 and the repair unit 350 only repair one hotspot to be repaired. In other embodiments of the present invention, the inspection unit may also obtain at least two hotspots to be repaired of the same type; the division unit divides at least two first regions, and one hotspot to be repaired is located in one first region; and the repair unit repairs at least two hotspots to be repaired at the same time to obtain a layout to be inspected. Repairing at least two hotspots to be repaired of the same type in parallel can effectively improve the repair efficiency.

[0113] In addition, the present invention further provides a computer-readable storage medium on which a computer program is stored. The computer program is executed by a processor to implement the steps of the optical proximity correction method of the present invention.

[0114] The computer program stored in the computer readable storage medium is executed by the processor to implement the steps of the optical proximity correction method of the present invention. The specific technical solution of the computer readable storage medium can refer to the embodiment of the optical proximity correction method mentioned above, and the present invention will not repeat it here.

[0115] In addition, the present invention also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program that can be run on the processor, and the processor executes the steps of the optical proximity correction method of the present invention when running the computer program.

[0116] The electronic device includes a memory and a processor, the memory stores a computer program that can be run on the processor, and the processor executes the steps of the optical proximity correction method of the present invention when running the computer program. The specific technical solution of the electronic device can refer to the embodiment of the optical proximity correction method mentioned above, and the present invention will not be repeated here.

[0117] In summary, after obtaining the preliminary revised layout and the hot spots to be repaired, the first area is divided; according to the first area, the hot spots to be repaired are repaired. Only the layout of the first area with the hot spots to be repaired is repaired, avoiding the repair of graphics in other areas of the layout, which can effectively improve the repair efficiency and speed.

[0118] Moreover, after repairing the hotspot to be repaired and obtaining the layout to be inspected, the second area is divided according to the layout to be inspected; the layout to be inspected in the second area is corrected and inspected, wherein the second area surrounds the first area. Only the layout to be inspected in the second area with a larger range is inspected after repair, which can not only realize the inspection between the first area and other surrounding areas, avoiding the repair area from causing new defects in the surrounding layout, but also avoid the inspection of the entire layout, which can effectively improve the inspection efficiency and speed, and is conducive to improving the repair efficiency and speed.

[0119] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. An optical proximity correction method, characterized in that: include: Get the layout to be revised; Modifying the to-be-modified layout to obtain a preliminary modified layout; According to the preliminary revised layout, a hot spot to be repaired is obtained; Dividing a first area, wherein the hotspot to be repaired is located in the first area; According to the first area, repairing the hotspot to be repaired to obtain a layout to be checked; Performing a correction check on the layout to be checked; Based on the results of the corrected inspection, the tape-out layout is obtained.

2. The optical proximity correction method according to claim 1, wherein: The step of performing post-correction inspection on the layout to be inspected comprises: Divide a second area according to the to-be-checked layout, wherein the second area surrounds the first area; The layout to be inspected in the second area is corrected and inspected.

3. The optical proximity correction method according to claim 2, wherein: In at least one of the step of dividing the first area and the step of dividing the second area in the layout to be inspected, the areas are divided according to optical diameters.

4. The optical proximity correction method according to claim 3, wherein: In the step of dividing the first area, the maximum size of the first area is not less than 10 times the optical diameter.

5. The optical proximity correction method according to claim 4, wherein: In the step of dividing the first area, the first area is circular, and the diameter of the first area is not less than 10 times the optical diameter; In the step of dividing the first area, the first area is a square, and the side length of the first area is not less than 10 times the optical diameter.

6. The optical proximity correction method according to claim 3, wherein: In the step of dividing the second area in the layout to be inspected, the maximum size of the second area is not less than 14 times the optical diameter.

7. The optical proximity correction method according to claim 6, wherein: In the step of dividing the second area in the to-be-checked layout, the second area is circular, and the diameter of the second area is not less than 14 times the optical diameter; In the step of dividing the to-be-inspected layout into a second area, the second area is a square, and the side length of the second area is not less than 14 times the optical diameter.

8. The optical proximity correction method according to claim 2, wherein: In at least one of the step of dividing the first area and the step of dividing the second area in the layout to be checked, the hotspot to be repaired is located at the geometric center of the area.

9. The optical proximity correction method according to claim 1, wherein: The steps to obtain a tape-out layout include: When the layout to be checked passes the post-correction check, a tape-out layout is obtained according to the layout to be checked; When the layout to be inspected fails the post-correction inspection, the steps of dividing the first area, repairing the points to be repaired and performing the post-correction inspection are performed again according to the layout to be inspected, until the layout to be inspected passes the post-correction inspection to obtain a tape-out layout.

10. The optical proximity correction method according to claim 1, wherein: The step of repairing the hotspot to be repaired to obtain a layout to be checked includes: According to the layout of the first area, modify the process recipe to repair the hot spot to be repaired; Correcting the layout of the first region after the recipe is modified to obtain a repaired layout of the first region; The layout of the first area is replaced with the repaired layout of the first area to obtain the layout to be checked.

11. The optical proximity correction method according to claim 1, wherein: The steps to obtain the hotspot to be repaired include: Performing a post-correction check on the preliminary revised layout to obtain hot spots; Determine whether the hotspot can be ignored; When the hotspot cannot be ignored, the hotspot is a hotspot to be repaired.

12. The optical proximity correction method according to claim 11, wherein: Also includes: When the hot spots can be ignored, a tape-out layout is obtained according to the preliminary revised layout.

13. The optical proximity correction method according to claim 11, wherein: In the step of obtaining a hot spot, the hot spot includes: at least one of a pinch-off point or a bridge point.

14. The optical proximity correction method according to claim 1, wherein: In the step of obtaining the hotspots to be repaired, at least two hotspots to be repaired of the same type are obtained; In the step of dividing the first area, at least two of the first areas are divided, and one of the hot spots to be repaired is located in one of the first areas; In the step of repairing the hot spots to be repaired to obtain the layout to be checked, at least two hot spots to be repaired are repaired at the same time to obtain the layout to be checked.

15. An optical proximity correction device, characterized in that: include: An acquisition unit, wherein the acquisition unit is suitable for acquiring a layout to be corrected; A correction unit, wherein the correction unit is adapted to correct the layout to be corrected to obtain a preliminary corrected layout; An inspection unit, wherein the inspection unit is adapted to obtain a hot spot to be repaired according to the preliminary revised layout; A dividing unit, wherein the dividing unit is adapted to divide a first area, wherein the hot spot to be repaired is located in the first area; A repair unit, wherein the repair unit is adapted to repair the hot spot to be repaired according to the first area to obtain a layout to be inspected; The inspection unit is also suitable for performing a post-correction inspection on the layout to be inspected; The output unit is suitable for obtaining a tape-out layout according to the result of the corrected inspection.

16. The optical proximity correction device according to claim 15, characterized in that: The division unit is further adapted to divide the second area according to the to-be-checked layout, wherein the second area surrounds the first area; The inspection unit inspects the layout to be inspected in the second area after correction; When the layout to be inspected in the second area passes the corrected inspection of the inspection unit, the output unit obtains a tape-out layout according to the layout to be inspected.

17. The optical proximity correction device according to claim 15, characterized in that: The inspection unit performs a post-correction inspection on the preliminary revised layout to obtain hot spots; The optical proximity correction device further comprises: a judgment unit, the judgment unit being adapted to judge whether the hot spot can be ignored; The checking unit obtains the hot spot to be repaired according to the judgment result of the judging unit.

18. A computer-readable storage medium having a computer program stored thereon, characterized in that: The computer program is executed by a processor to implement the steps of the method according to any one of claims 1 to 14.

19. An electronic device comprising a memory and a processor, wherein the memory stores a computer program that can be run on the processor, wherein: When the processor runs the computer program, the steps of the method according to any one of claims 1 to 14 are performed.

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