Alloy resistor and packaging process including the alloy resistor

Abstract

The present invention discloses an alloy resistor and a packaging process including the alloy resistor. The packaging process is used to process a rough alloy resistor, and the rough alloy resistor is packaged based on a packaging jig. The packaging jig includes: a fixed substrate, a bottom support plate, a padding auxiliary plate, an upper cover plate and a scraping assembly, the fixed substrate is located between the bottom support plate and the padding auxiliary plate, and the upper cover plate is located above the padding auxiliary plate. The packaging process can quickly and batch-package a plurality of rough alloy resistors, improve work efficiency and standardization, and avoid damage to the electrodes. The alloy resistor is obtained by the above-mentioned packaging process.

Description

Technical Field

[0001] The present invention relates to the technical field of alloy resistor packaging, and in particular to an alloy resistor and a packaging process including the alloy resistor. Background Art

[0002] Alloy resistors are resistors that use alloys as current media. They are often used to sample current in a circuit or to feedback the changing current in a circuit in order to further control or influence the change in current. They are widely used in electronic devices such as battery protection boards, power supplies, inverters, lamps, motors, etc.

[0003] The alloy resistor rough blank is packaged to obtain the alloy resistor finished product. The structure of one alloy resistor rough blank 10 is as follows Figure 1 As shown, the alloy resistor rough blank 10 includes an electrode 11 and a resistor body 12, and the electrode 11 is arranged at both ends of the resistor body 12. During packaging, it is necessary to use insulating glue paint to coat part of the resistor body 12, and after the insulating glue paint is dried, an insulating layer wrapping the resistor body 12 can be formed. It is worth noting that the electrode 11 needs to be welded to the circuit later, so the end face of the electrode 11 should not be covered by the insulating glue paint. Since the alloy resistor rough blank 10 is small in size, the traditional water immersion or spraying operation cannot only coat the resistor body 12 part. Therefore, the existing packaging method is to first coat the alloy resistor rough blank 10 with insulating glue paint as a whole, and then scrape off the insulating layer on the end face of the electrode 11 after the insulating glue paint is dried.

[0004] However, the existing packaging method is difficult to coat multiple surfaces of the resistor 12 in a single operation, especially the bottom surface of the resistor 12 usually needs to be coated separately, which has low work efficiency. Moreover, this existing method is easy to scratch the electrode 11, causing damage to the alloy resistor, and the degree of standardization is also low, resulting in uneven quality.

[0005] Therefore, how to design an alloy resistor and a packaging process including the alloy resistor so that it can quickly and batch-package multiple alloy resistor rough blanks 10, improve work efficiency and standardization, and avoid damage to the electrode 11, is a technical problem that technicians in this field need to solve. Summary of the invention

[0006] The purpose of the present invention is to overcome the shortcomings of the prior art and provide an alloy resistor and a packaging process including the alloy resistor, so that a plurality of alloy resistor rough blanks can be packaged quickly and in batches, thereby improving work efficiency and standardization while avoiding damage to the electrodes.

[0007] The objective of the present invention is achieved through the following technical solutions:

[0008] A packaging process for alloy resistors, used for processing alloy resistor rough blanks, and packaging the alloy resistor rough blanks based on a packaging jig;

[0009] The packaging fixture comprises: a fixed substrate, a bottom supporting plate, a heightening auxiliary plate, an upper cover plate and a scraping assembly, wherein the fixed substrate is located between the bottom supporting plate and the heightening auxiliary plate, and the upper cover plate is located above the heightening auxiliary plate;

[0010] The packaging process comprises:

[0011] Step 1, obtaining the fixed substrate and the bottom supporting plate, and moving the bottom supporting plate upward to fit with the fixed substrate;

[0012] Step 2: Apply the insulating paint to the leftmost side of the fixed substrate, and then use the scraper assembly to push the insulating paint to the rightmost side of the fixed substrate to achieve the first packaging operation;

[0013] Step 3, placing a plurality of the alloy resistor blanks one by one on the fixed substrate;

[0014] Step 4, moving the auxiliary plate downward until it is in contact with the fixed base plate;

[0015] Step 5, pressing the upper cover plate downward until the upper cover plate is completely in contact with the auxiliary plate;

[0016] Step 6, separating the upper cover plate from the auxiliary plate for raising the height, then applying insulating paint on the top surface of the auxiliary plate for raising the height, and using the scraping assembly again to scrape the insulating paint over the entire auxiliary plate for raising the height, to achieve a second packaging operation;

[0017] Step 7, drying the insulating paint, wherein the insulating paint solidifies to form an insulating layer wrapped around the alloy resistor rough blank;

[0018] Step eight, the auxiliary plate for raising the height is separated from the fixed base plate, and the bottom supporting plate is moved up again to fit with the fixed base plate, so as to eject the rough alloy resistor.

[0019] In one embodiment, the fixed substrate is provided with: a guide column, a glue-receiving groove and a scraping plane, the glue-receiving groove is adapted to the alloy resistor rough blank, and a through hole adapted to the electrode of the alloy resistor rough blank is opened in the glue-receiving groove;

[0020] The bottom supporting plate is slidably arranged on the guide column, and a plurality of bottom supporting columns are arranged on the bottom supporting plate, the bottom supporting columns are adapted to the through holes, and the top surface size of the bottom supporting columns is the same as the end surface size of the electrode; when the bottom supporting plate is attached to the fixed substrate, the bottom supporting columns will fill in the through holes, and the top surfaces of the bottom supporting columns will be flush with the scraping plane;

[0021] The padding auxiliary plate is slidably arranged on the guide column, and a plurality of avoidance grooves are provided on the padding auxiliary plate. When the padding auxiliary plate is attached to the fixed base plate, the avoidance grooves correspond to the glue storage grooves.

[0022] The upper cover plate is slidably arranged on the guide column, and the upper cover plate is provided with a plurality of protrusions, and the protrusions correspond to the avoidance grooves one by one. When the upper cover plate is pressed onto the auxiliary plate for raising, the protrusions sink into the avoidance grooves.

[0023] In one embodiment, the packaging fixture includes a driving component, and the driving component is used to drive the bottom support plate, the auxiliary plate for raising, and the upper cover plate to slide along the guide column.

[0024] In one embodiment, in step 4, there is a gap between the inner wall of the avoidance groove and the rough alloy resistor, and the distance of the gap is L1;

[0025] In step five, a height difference is formed between the top surface of the alloy resistor rough blank and the top surface of the auxiliary plate for raising the height, and the distance of the height difference is D1; ​​and L1 = D1.

[0026] In one embodiment, the height of the electrode of the alloy resistor rough blank is D2; the height of the protrusion of the upper cover plate is D3; and D3≥D2.

[0027] In one embodiment, an oleophobic layer is provided on the inner wall of the through hole.

[0028] An alloy resistor is obtained by the above packaging process.

[0029] In summary, the alloy resistor and the packaging process including the alloy resistor of the present invention can quickly and batch-wise package a plurality of alloy resistor rough blanks, thereby improving work efficiency and standardization, while avoiding damage to the electrodes. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 It is a schematic structural diagram of the alloy resistor rough blank involved in the present invention;

[0032] Figure 2 It is a schematic structural diagram of the packaging fixture involved in the present invention;

[0033] Figure 3 for Figure 2 A schematic diagram of the structure of the fixed substrate shown;

[0034] Figure 4 for Figure 3 A top view of the fixed base plate shown;

[0035] Figure 5 for Figure 2 The structural schematic diagram of the bottom support plate shown;

[0036] Figure 6 It is a structural schematic diagram of the fixed base plate, the auxiliary plate for raising the height, and the upper cover plate;

[0037] Figure 7 This is a schematic diagram of the matching relationship between the fixed base plate and the bottom support plate in step 1;

[0038] Figure 8 This is a schematic diagram of the matching relationship between the alloy resistor rough blank and the packaging fixture in step 4;

[0039] Fig. 9 This is a schematic diagram of the state of the alloy resistor rough blank in the rubber groove in step 4;

[0040] Fig.10 It is a top view of the alloy resistor rough blank in the rubber storage groove in step 4;

[0041] Fig.11 This is a schematic diagram of the matching relationship between the upper cover plate and the alloy resistor rough blank in step five;

[0042] Fig.12 This is a schematic diagram of the matching relationship between the alloy resistor rough blank and the rubber groove during the second packaging. DETAILED DESCRIPTION

[0043] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0044] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0046] The present invention provides a packaging process for alloy resistors, aiming to quickly and batch-package a plurality of alloy resistor rough blanks 10 to improve work efficiency and standardization.

[0047] The present invention also relates to an alloy resistor blank 10 (not yet wrapped with an insulating layer), and a packaging fixture 20. The structure of the alloy resistor blank 10 is as follows: Figure 1 As shown, it mainly includes an electrode 11 and a resistor 12. The electrode 11 is arranged at both ends of the resistor 12, and the whole presents a "concave" shape structure.

[0048] The structure of the packaging fixture 20 is as follows Figure 2 As shown, it is used to realize the rapid and batch packaging operation of multiple alloy resistor blanks 10, that is, to apply insulating glue paint on the resistor body 12 of the alloy resistor blank 10. The main structure of the packaging jig 20 is described below:

[0049] like Figure 2 As shown, the packaging fixture 20 includes: a fixed substrate 100, a bottom support plate 200, a padding auxiliary plate 300 and an upper cover plate 400. The fixed substrate 100 is located between the bottom support plate 200 and the padding auxiliary plate 300, and the upper cover plate 400 is located above the padding auxiliary plate 300;

[0050] like Figure 3 and Figure 4As shown, the fixed substrate 100 is provided with: a guide column 110, a glue-receiving groove 120 and a scraping plane 101, the glue-receiving groove 120 is adapted to the alloy resistor rough blank 10, and a through hole 121 adapted to the electrode 11 of the alloy resistor rough blank 10 is opened in the glue-receiving groove 120;

[0051] like Figure 2 and Figure 5 As shown, the bottom support plate 200 is slidably disposed on the guide column 110, and a plurality of bottom support columns 201 are disposed on the bottom support plate 200, the bottom support columns 201 are adapted to the through holes 121, and the top surface size of the bottom support columns 201 is the same as the end surface size of the electrode 11. When the bottom support plate 200 is attached to the fixed substrate 100, the bottom support columns 201 will fill in the through holes 121, and the top surface of the bottom support columns 201 will be flush with the scraping plane 101;

[0052] like Figure 2 and Figure 6 As shown, the auxiliary plate 300 is also slidably disposed on the guide column 110, and a plurality of avoidance slots 301 are provided on the auxiliary plate 300. When the auxiliary plate 300 is attached to the fixed base plate 100, the avoidance slots 301 correspond to the glue storage grooves 120;

[0053] like Figure 2 and Figure 6 As shown, the upper cover plate 400 is also slidably disposed on the guide column 110 , and the upper cover plate 400 is provided with a plurality of protrusions 401 , which correspond one-to-one to the avoidance grooves 301 . When the upper cover plate 400 is pressed onto the auxiliary plate 300 , the protrusions 401 will sink into the avoidance grooves 301 .

[0054] At this point, the main structure of the packaging jig 20 has been described. It should be noted that the above only introduces the main structure of the packaging jig 20, and the packaging jig 20 also includes a driving component and a corresponding scraping component (not shown in the figure), the driving component is used to drive the bottom support plate 200, the padding auxiliary plate 300 and the upper cover plate 400 to slide along the guide column 110, and the scraping component is used to fill the insulating glue paint into the glue storage groove 120 and the avoidance groove 301 (the specific working principle will be described below).

[0055] The packaging process of the present invention is implemented based on the packaging jig 20. Next, the operation steps and specific working principle of the packaging process are described in combination with the structure of the packaging jig 20.

[0056] Step 1: Get the fixed substrate 100 and the bottom supporting plate 200, and move the bottom supporting plate 200 upward to fit with the fixed substrate 100 (such as Figure 7 as shown).

[0057] In this case, the bottom supporting column 201 of the bottom support plate 200 is inserted into the through hole 121 of the rubber groove 120 (it can be seen from the structure of the alloy resistor rough blank 10 and the rubber groove 120 that two adjacent bottom supporting columns 201 are located in the same rubber groove 120), and the top surface of the bottom supporting column 201 is flush with the scraping plane 101 of the fixed substrate 100 (at the same height).

[0058] Step 2: first apply the insulating paint to the leftmost side of the scraping plane 101 of the fixed substrate 100, and then use the scraping assembly to push the insulating paint to the rightmost side of the scraping plane 101 to achieve the first packaging operation.

[0059] During the process, the scraping assembly will pass through the glue groove 120, and the insulating glue paint will be filled into the glue groove 120. In this way, the plurality of glue grooves 120 will be filled with insulating glue paint, and since the bottom support column 201 is plugged into the through hole 121, the insulating glue paint will not flow into the through hole 121; and since the top surface of the bottom support column 201 is flush with the scraping plane 101, the insulating glue paint will not remain on the top surface of the bottom support column 201 after the scraping assembly passes.

[0060] Step 3: Place multiple alloy resistor blanks 10 one by one in the glue storage groove 120 of the fixed substrate 100. When placed, the electrode 11 of the alloy resistor blank 10 contacts the bottom support column 201 of the bottom support plate 200, and the end surface of the electrode 11 is tightly fitted with the top surface of the bottom support column 201. The matching relationship between the alloy resistor blank 10 and the bottom support plate 200, the heightening auxiliary plate 300 and the fixed substrate 100 is as shown in FIG. Figure 8 It should be noted that the placement of the alloy resistor blank 10 can be operated by existing patch equipment, thereby ensuring that the alloy resistor blank 10 can be quickly and accurately placed in place before the insulating glue paint is dried.

[0061] Step 4: Figure 8 As shown, the padding auxiliary plate 300 is moved down to fit the scraping plane 101 of the fixed substrate 100. At this time, the avoidance groove 301 of the padding auxiliary plate 300 corresponds to the glue storage groove 120, and the avoidance groove 301 sets the alloy resistor rough blank 10 therein (as shown in FIG. Fig. 9 and Fig.10 There is a gap between the inner wall of the avoidance slot 301 and the alloy resistor rough blank 10, and the distance of the gap is L1.

[0062] Step 5: Press the upper cover plate 400 downward along the guide column 110 until the upper cover plate 400 is completely in contact with the auxiliary plate 300 (eg, Fig.11 as shown).

[0063] When pressing down, the protrusion 401 of the upper cover plate 400 will be pressed on the alloy resistor rough blank 10, and as the upper cover plate 400 is pressed into place, the protrusion 401 will be completely sunk into the avoidance groove 301. During this period, the pressed upper cover plate 400 will push the alloy resistor rough blank 10 and the bottom support plate 200 to move downward together, so that the bottom support column 201 partially withdraws from the through hole 121, and the electrode 11 of the alloy resistor rough blank 10 sinks into the through hole 121. At this time, since the end face of the electrode 11 is tightly fitted with the top surface of the bottom support column 201, the end face of the electrode 11 will not contact the insulating paint. During the sinking of the alloy resistor rough blank 10, the water level of the insulating paint increases, and the surrounding and bottom surface of the resistor body 12 will contact the insulating paint. A height difference is formed between the top surface of the alloy resistor rough blank 10 and the top surface of the auxiliary pad 300, and the distance of the height difference is D1 (such as Fig.12 as shown).

[0064] Step 6: Separate the upper cover plate 400 from the auxiliary plate 300, and then apply insulating paint on the top surface of the auxiliary plate 300, and use the scraping assembly to scrape the insulating paint across the entire auxiliary plate 300 to achieve the second packaging operation. In this way, the insulating paint will fill the avoidance groove 301, and the top surface of the alloy resistor blank 10 will be coated with insulating paint, and the thickness of the insulating paint is D1.

[0065] Step seven, drying the insulating paint, and solidifying the insulating paint to form an insulating layer that wraps around the resistor body 12 of the alloy resistor blank 10.

[0066] Step 8: The auxiliary plate 300 is separated from the fixed substrate 100, and the bottom support plate 200 is moved up again to fit the fixed substrate 100. At this time, the rising bottom support column 201 will push the electrode 11 out of the through hole 121, and then the packaged alloy resistor blank 10 can be taken out of the glue storage groove 120.

[0067] Compared with the prior art, the packaging process of the present invention can complete the packaging of the alloy resistor blank 10 through two packaging operations (i.e., the insulating glue paint fills the glue storage groove 120 and avoids the through groove 301), so that the insulating glue paint wraps the resistor body 12 of the alloy resistor blank 10. In this way, multiple alloy resistor blanks 10 can be packaged at the same time, thereby realizing rapid and batch processing, improving work efficiency and standardization, and ensuring packaging quality.

[0068] It is worth noting that in order to ensure that the bottom surface of the resistor 12 can also be coated with insulating paint and that the insulating layer formed subsequently is free of bubbles, the packaging process of the present invention is specially designed with two packaging operations (i.e., step 2 and step 6) and a pressing operation of the upper cover plate 400 (step 5). The design principle and the beneficial effects achieved are as follows:

[0069] Two packaging operations can ensure that the bottom surface of the resistor body 12 is in contact with the insulating glue. Assuming that the packaging process is designed as a single operation, if the alloy resistor rough blank 10 is preferentially inserted into the glue groove 120 before packaging, the top surface of the resistor body 12 is lower than the scraping plane 101 of the fixed substrate 100; in this way, when the scraping component passes by, the insulating glue fills into the glue groove 120, but because the air between the glue groove 120 and the bottom surface of the resistor body 12 is not discharged in time, the bottom surface of the resistor body 12 is not completely in contact with the insulating glue. If the insulating glue is filled into the glue groove 120 first, and then the alloy resistor rough blank 10 is inserted, the top surface of the resistor body 12 cannot be completely in contact with the insulating glue;

[0070] In contrast, the two-time packaging operation has the following advantages: in the first packaging operation, the insulating paint is first filled into the glue storage groove 120, and then the alloy resistor blank 10 is inserted, and the bottom surface of the resistor body 12 can be completely in contact with the insulating paint; in the second packaging operation, the insulating paint is filled into the avoidance groove 301, and the top surface of the resistor body 12 can also be completely in contact with the insulating paint. In this way, it is ensured that the surroundings, top surface and bottom surface of the resistor body 12 can be fully coated with insulating paint;

[0071] The pressing down operation of the upper cover plate 400 can ensure that the insulating layer formed subsequently is free of bubbles. Specifically, the pressing down operation of the upper cover plate 400 will press the alloy resistor rough blank 10 into the glue-hiding groove 120, which will squeeze the insulating glue paint, thereby expelling the bubbles in the insulating glue paint as much as possible, so as to ensure that the insulating layer formed subsequently will not have bubbles and holes;

[0072] Furthermore, the pressing operation of the upper cover plate 400 makes the end surface of the electrode 11 fit tightly, thereby ensuring that the insulating paint does not contact the end surface of the electrode 11. In step five, the electrode 11 will be partially pressed into the through hole 121, so after packaging, the electrode 11 is not easily wrapped with an insulating layer, which helps the solder to better contact the electrode 11 during subsequent welding.

[0073] Preferably, in step 5, the depth of the electrode 11 sunk into the through hole 121 is determined by the height of the bump 401. Therefore, in order to prevent the electrode 11 from being coated with an insulating layer as much as possible, the height of the bump 401 should be greater than or equal to the height of the electrode 11. In other words, if the height of the electrode 11 is D2 and the height of the bump 401 is D3, then D3≥D2.

[0074] Preferably, in step 4 and step 5, the gap distance L1 is equal to the height difference distance D1 (L1=D1), so that the thickness of the insulating layer wrapped around the resistor 12 can be as consistent as possible.

[0075] In other embodiments, an oleophobic layer is provided on the inner wall of the through hole 121. The oleophobic layer can prevent the insulating paint from entering the gap between the electrode 11 and the through hole 121, thereby further preventing the surrounding of the electrode 11 from being coated with an insulating layer.

[0076] In summary, the packaging process of the alloy resistor of the present invention can quickly and batch-wise package a plurality of alloy resistor rough blanks 10 , thereby improving work efficiency and standardization, while avoiding damage to the electrodes 11 .

[0077] The present invention also provides an alloy resistor, which is obtained by the above packaging process, and its structure includes the above alloy resistor blank 10 and an insulating layer wrapped on the resistor body 12. The provision of the insulating layer can make the alloy resistor have better anti-interference ability.

[0078] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A packaging process for alloy resistors, used for processing alloy resistor rough blanks, characterized in that: Perform packaging operations on alloy resistor rough blanks based on packaging jigs; The alloy resistor blank includes electrodes and a resistor body; the packaging fixture includes: a fixed substrate, a bottom support plate, a padding auxiliary plate, an upper cover plate and a scraper assembly, the fixed substrate is located between the bottom support plate and the padding auxiliary plate, and the upper cover plate is located above the padding auxiliary plate; The steps include: Step 1, obtaining the fixed substrate and the bottom supporting plate, and moving the bottom supporting plate upward to fit with the fixed substrate; Step 2: Apply the insulating paint to the leftmost side of the fixed substrate, and then use the scraper assembly to push the insulating paint to the rightmost side of the fixed substrate to achieve the first packaging operation; Step 3, placing a plurality of the alloy resistor blanks one by one on the fixed substrate; Step 4, moving the auxiliary plate downward to fit the fixed base plate; Step 5, pressing the upper cover plate downward until the upper cover plate is completely in contact with the auxiliary plate; Step 6, separating the upper cover plate from the auxiliary plate for raising the height, then applying insulating paint on the top surface of the auxiliary plate for raising the height, and using the scraping assembly again to scrape the insulating paint over the entire auxiliary plate for raising the height, to achieve a second packaging operation; Step 7, drying the insulating paint, wherein the insulating paint solidifies to form an insulating layer wrapped around the alloy resistor rough blank; Step eight, the auxiliary plate is separated from the fixed base plate, and the bottom support plate is moved up again to fit with the fixed base plate, thereby ejecting the alloy resistor rough blank; The fixed substrate is provided with: a guide column, a glue-receiving groove and a scraping plane, the glue-receiving groove is adapted to the rough alloy resistor, and a through hole adapted to the electrode of the rough alloy resistor is opened in the glue-receiving groove; The bottom supporting plate is slidably arranged on the guide column, and a plurality of bottom supporting columns are arranged on the bottom supporting plate, the bottom supporting columns are adapted to the through holes, and the top surface size of the bottom supporting columns is the same as the end surface size of the electrode; when the bottom supporting plate is attached to the fixed substrate, the bottom supporting columns will fill in the through holes, and the top surfaces of the bottom supporting columns will be flush with the scraping plane; The padding auxiliary plate is slidably arranged on the guide column, and a plurality of avoidance grooves are provided on the padding auxiliary plate. When the padding auxiliary plate is attached to the fixed base plate, the avoidance grooves correspond to the glue storage grooves. The upper cover plate is slidably arranged on the guide column, and the upper cover plate is provided with a plurality of protrusions, and the protrusions correspond to the avoidance grooves one by one. When the upper cover plate is pressed onto the auxiliary plate for raising, the protrusions sink into the avoidance grooves.

2. The packaging process of the alloy resistor according to claim 1, characterized in that: The packaging fixture includes a driving component, and the driving component is used to drive the bottom support plate, the auxiliary plate for raising the height, and the upper cover plate to slide along the guide column.

3. The packaging process of the alloy resistor according to claim 1, characterized in that: In step 4, there is a gap between the inner wall of the avoidance groove and the rough alloy resistor, and the distance of the gap is L1; In step five, a height difference is formed between the top surface of the alloy resistor rough blank and the top surface of the auxiliary plate for raising the height, and the distance of the height difference is D1; ​​and L1 = D1.

4. The packaging process of the alloy resistor according to claim 1, characterized in that: The height of the electrode of the alloy resistor rough blank is D2; the height of the protrusion of the upper cover plate is D3; and D3≥D2.

5. The packaging process of the alloy resistor according to claim 1, characterized in that: An oleophobic layer is provided on the inner wall of the through hole.

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