Substrate inspection apparatus and substrate inspection method

Abstract

Provided are an apparatus and a method for monitoring a substrate to determine a state of a processed substrate and check whether there is an abnormality in the processed substrate. The apparatus for inspecting a substrate includes a substrate mounting portion that moves with respect to a substrate and is for mounting the substrate, a measuring portion for monitoring the substrate, a control portion configured to control a movement path of the measuring portion such that at least some areas are monitored from different positions with respect to a plurality of substrates, and an analysis portion, and an abnormality determination unit configured to determine the presence of an abnormality from monitoring information about the plurality of substrates.

Description

[0001] This application is a divisional application of patent application No. 201880082146.1, whose application date is December 27, 2018 and whose invention name is “Substrate inspection equipment and substrate inspection method”. Technical Field

[0002] The present invention relates to an apparatus and method for inspecting a substrate, and more particularly, to an apparatus and method for monitoring a substrate to determine a processing state of the substrate and inspecting whether an abnormality exists in the processed substrate. Background Art

[0003] Semiconductor devices are manufactured by forming pattern layers of various shapes on a substrate such as a chip, and in order to form such pattern layers, generally, predetermined pattern layers are stacked by using chemical vapor deposition (CVD) or physical vapor deposition (PVD).

[0004] Furthermore, even after the process of stacking the pattern layers, in order to pattern the stacked pattern layers into a desired shape, a process of etching the pattern layers using a photoresist as a mask and a process of stripping the photoresist are subsequently performed.

[0005] At the same time, semiconductor manufacturing processes may be required to operate closer to process performance limits based on the reduction in design rules. In addition, in the case of some smaller design rules, the processes that lead to failures tend to be systematic. That is, the processes that lead to failures tend to lead to failures in predetermined design patterns that are repeated many times in the above design. It is important to detect and remove spatially systematic and electrically related defects because removing these defects will affect yield very comprehensively.

[0006] Therefore, due to the rapidly developing production technology of semiconductor devices and the increase in demand for high-density integration and semiconductor devices, there is an urgent need to speed up substrate inspection to determine the state of a processed substrate corresponding to technological advancement.

[0007] [Related technical literature]

[0008] Korean Patent Application Publication No. 10-2017-0068419. Summary of the invention

[0009] Technical issues

[0010] The present invention provides a substrate inspection apparatus and a substrate inspection method capable of monitoring a substrate and inspecting a processing state and the presence or absence of an abnormality at high speed.

[0011] Technical Solution

[0012] According to an exemplary embodiment, an apparatus for inspecting a substrate includes: a substrate mounting portion for mounting a substrate; a measuring portion that moves relative to the substrate and is used to monitor the substrate; a control portion for controlling a moving path of the measuring portion so that at least some areas of a plurality of substrates are monitored at positions different from each other; and an analyzing portion for determining the presence of an abnormality from monitoring information related to the plurality of substrates.

[0013] The plurality of substrates are selected from substrates on which the same predetermined process has been performed.

[0014] The apparatus for inspecting a substrate may further include: a support portion mounted on the substrate mounting portion, wherein the measuring portion may be mounted under the support portion to be movable in one direction.

[0015] At least one of the substrate mounting portion and the support portion may be mounted to be rotatable around a central axis of the substrate.

[0016] The control section may perform control so that the measuring section has a linear movement path.

[0017] The control section may perform control so that the measuring section has a moving path passing through a center portion of the substrate.

[0018] The control section may perform control so that the measuring section has a movement path bent at the center portion of the substrate.

[0019] The control section may perform control such that a length of the moving path of the measuring section is not greater than a diameter of the substrate.

[0020] The substrate mounting portion can be installed in: a loadlock chamber, which is used to store the multiple substrates transferred from the processing chamber and the multiple substrates have been subjected to predetermined processing in the processing chamber; or a front end module (EFEM), which is connected to the loadlock chamber and is configured to unload the multiple substrates.

[0021] According to another exemplary embodiment, a method for inspecting a substrate includes: selecting a first substrate and a second substrate from a plurality of substrates; monitoring some areas of the first substrate; monitoring some areas of the second substrate; and determining the presence of an abnormality from monitoring information about the first substrate and the second substrate.

[0022] In the step of selecting the first substrate and the second substrate, the first substrate and the second substrate may be selected from a plurality of substrates belonging to one lot.

[0023] In the step of selecting the first substrate and the second substrate, the first substrate and the second substrate may be selected from a plurality of substrates on which a predetermined process has been performed in the same chamber.

[0024] In the step of monitoring the some areas of the second substrate, at least some areas of the monitored area of ​​the second substrate and at least some areas of the monitored area of ​​the first substrate are different from each other.

[0025] The step of monitoring the some areas of the first substrate may be performed by moving a measuring portion for monitoring the first substrate in the first direction relative to the first substrate and passing through a central portion of the substrate.

[0026] The step of monitoring the some areas of the second substrate may be performed by moving a measuring portion for monitoring the second substrate relative to the second substrate in a second direction different from the first direction and passing through a central portion of the substrate.

[0027] In the step of determining the presence of abnormality, when both the monitoring information about the first substrate and the monitoring information about the second substrate fall within an error range, it may be determined that the processed state is good.

[0028] In the step of determining the presence of an abnormality, when the monitoring area of ​​the first substrate and the monitoring area of ​​the second substrate partially overlap, the error range is corrected using a deviation in monitoring information about the overlapping area.

[0029] Beneficial Effects

[0030] According to the apparatus and method for inspecting substrates of the exemplary embodiment, at least some areas of a plurality of substrates are monitored at positions different from each other, and thus the processed states of the substrates may be determined in a short time and time consumed for inspection may be reduced.

[0031] Therefore, instantaneous feedback can be provided in response to a processed state, and pre-execution such as operation stop, improvement, or maintenance can be taken due to equipment abnormality, thereby minimizing the defect rate during substrate manufacturing and improving equipment capacity utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a schematic diagram illustrating an apparatus for inspecting a substrate according to an exemplary embodiment.

[0033] Figures 2 to 5 2 is a view illustrating a state of a monitoring substrate according to an exemplary embodiment.

[0034] Figure 6is a view for describing a state in which it is determined that an abnormality exists according to an exemplary embodiment.

[0035] Figure 7 is a view illustrating a state in which an apparatus for inspecting a substrate is installed according to an exemplary embodiment.

[0036] Figure 8 is a schematic diagram illustrating a method for inspecting a substrate according to an exemplary embodiment. DETAILED DESCRIPTION

[0037] Exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided to make the present invention thorough and complete and to fully convey the scope of the present invention to those skilled in the art. In the accompanying drawings, the same reference numerals always represent the same components.

[0038] Figure 1 is a schematic diagram illustrating an apparatus for inspecting a substrate according to an exemplary embodiment, Figures 2 to 5 is a view showing a state of a monitoring substrate according to an exemplary embodiment. In addition, Figure 6 is a view for describing a state in which it is determined that an abnormality exists according to an exemplary embodiment.

[0039] See also Figures 1 to 6 According to an exemplary embodiment, an apparatus 10 for inspecting a substrate includes: a substrate mounting portion 100 for mounting a substrate S; a measuring portion 200 that is movable relative to the substrate S to monitor the substrate S; a control portion 300 that controls a moving path of the measuring portion 200 so that at least some areas at different positions relative to a plurality of substrates are monitored; and an analysis portion 400 that determines the presence of an abnormality from monitoring information of the substrates.

[0040] The substrate mounting part 100 mounts the substrate S for monitoring. Here, the apparatus 10 for inspecting a substrate according to an exemplary embodiment monitors the substrate S on which a predetermined process (e.g., a lamination process) has been performed, and determines the processed state to check for the presence of an abnormality. The substrate S may include a dummy substrate that is not manufactured for actual use but is only used for monitoring, and a thin film without pattern formation may be deposited on the dummy substrate. Of course, after the monitoring is completed, such a dummy substrate may be reused in a later monitoring process.

[0041] In addition, the apparatus 10 for inspecting a substrate according to an exemplary embodiment may also monitor a substrate S on which processes such as an etching process and a stripping process have been performed, and at this time, the substrate S patterned by the above processes may be mounted on the substrate mounting part 100 .

[0042] The substrate mounting portion 100 may be provided to a load chamber to store a plurality of substrates transferred from a processing chamber, wherein the processing chamber performs the predetermined processing described above. Alternatively, the substrate mounting portion 100 may be provided to an equipment front end module (EFEM) connected to the load chamber to release the substrates stored in the load chamber. Here, when the substrate mounting portion 100 is provided to the load chamber, the substrate mounting portion 100 may include at least one of a plurality of slots installed in the load chamber. In addition, when the substrate mounting portion 100 is provided to the front end module, the substrate mounting portion 100 may be provided to a portion of the space inside the front end module. Referring to Figure 7 An exemplary embodiment is described in which the substrate mounting portion 100 is provided to a load chamber or a front end module.

[0043] The measuring part 200 is mounted on the substrate mounting part 100 and monitors the substrate S. Here, the measuring part 200 moves relative to the substrate S. That is, the measuring part 200 is movably mounted on the substrate mounting part 100, and the position of the substrate mounting part 100 is fixed, not only the measuring part 200 can be moved relative to the substrate S, but also the position of the measuring part 200 can be fixed. In some embodiments, the substrate mounting part 100 is movably mounted, and the position of the measuring part 200 can be fixed, in which case the measuring part 200 can also be moved relative to the substrate S. Hereinafter, the case where the measuring part 200 is movably mounted on the substrate mounting part 100 will be described as an example, and the case where the measuring part 200 is movable relative to the substrate S through the movement of the substrate mounting part 100 will also be described, and of course, the exemplary embodiments can be equally applicable.

[0044] Here, the measuring unit 200 monitors the thickness, reflectivity, presence and distribution range of particles of the substrate S. To this end, the measuring unit 200 may be composed of various units for measuring the distance to the substrate S, the image, spectrum and resistance value of the substrate S, and the specific aspects of the units for measuring the thickness, reflectivity and presence and distribution range of particles of the substrate S are well known, and a detailed description thereof will be omitted.

[0045] The measuring part 200 may be installed under the supporting part 500 so as to be movable in one direction. That is, the apparatus 10 for inspecting a substrate according to an exemplary embodiment may further include a supporting part 500 installed at a position at a predetermined distance above the substrate mounting part 100, and the measuring part 200 may be movably installed under the supporting part 500, for example, on a lower surface so as to be movable in one direction. Figures 2 to 5 A configuration is described in which various movement paths are formed by the measuring section 200 moving in one direction below the supporting section 500 .

[0046] The control part 300 controls the moving path of the measuring part 200 so that at least some areas at different positions with respect to a plurality of substrates on which predetermined processes such as lamination process, etching process, and stripping process have been performed are monitored.

[0047] Here, the apparatus 10 for inspecting substrates according to the exemplary embodiment monitors each substrate, and the substrates are selected from a plurality of substrates that have been subjected to the same predetermined process. Monitoring information obtained from the first substrate among the selected plurality of substrates can be directly applied to the second substrate among the selected plurality of substrates, and vice versa, monitoring information obtained from the second substrate among the selected plurality of substrates can be applied to the first substrate among the selected plurality of substrates. Here, the substrates are selected from substrates that have been subjected to the same predetermined process, and the selected substrates may be all substrates that have been subjected to the predetermined process, and may also be a part of all substrates that have been subjected to the predetermined process.

[0048] Therefore, the control unit 300 controls the moving path of the measuring unit 200 so that at least some areas at different positions relative to a plurality of such substrates are monitored. Here, the control unit 300 may control the moving path of the measuring unit 200 so that at least some areas at different positions relative to the notch formed on the edge of each of these substrates are monitored. Here, the notch N is generally used to distinguish between the upper and lower surfaces of the substrate to determine whether the substrate has been rotated and to determine the angle or direction of rotation. Figure 6 As shown, the different positions in the aforementioned plurality of substrates means that when each notch N is located at the same position and overlaps with respect to these substrates, the positions are different from each other.

[0049] In addition, the control section 300 can also control the moving path of the measuring section 200 so that the substrates are monitored at different positions from each other, but some areas can be monitored at overlapping positions, and other areas can be monitored at different positions from each other. In this way, when the monitored areas overlap with respect to these substrates, the processed state of each substrate can be compared by using the monitoring information of the overlapping area, and as described later, the error range can be corrected by using the deviation in the monitoring information of the overlapping area to determine the presence of abnormality.

[0050] Reference below Figures 2 to 5 , exemplary embodiments will be described in detail, in each exemplary embodiment, the control part 300 controls the moving path of the measuring part 200 and monitors each substrate. Figures 2 to 5 In FIG. 1 , the dotted arrow indicates the moving path of the measuring unit 200 .

[0051] like Figure 2As shown, the control part 300 moves the measuring part 200 in different directions relative to the first substrate and the second substrate included in the plurality of substrates, thereby allowing at least some areas at different positions from each other to be monitored. Here, different directions means that, for example, when each substrate is arranged so that the notch N is located at the upper part, the moving directions of the measuring part 200 are different from each other.

[0052] That is, the control part 300 may move the measuring part 200 from the upper edge of the first substrate S1 to the lower edge of the first substrate S1 relative to the first substrate S1 to form the first monitoring area M1. In addition, the control part 300 may move the measuring part 200 from the left edge of the second substrate S2 to the right edge of the second substrate S2 relative to the second substrate S2 to form the second monitoring area M2. In this way, in order to move the measuring part 200 in directions different from each other, at least one of the substrate mounting part 100 and the supporting part 500 may be installed to be rotatable around the central axis of the substrate. That is, the control part 300 moves the measuring part 200 from the upper edge of the first substrate to the lower edge in one direction to form the first monitoring area M1. Subsequently, at least one of the substrate mounting part 100 and the supporting part 500 rotates 90°, and the measuring part 200 moves in one direction from the left edge to the right edge of the second substrate to form the second monitoring area M2. In this case, the length of the moving path of the measuring part 200 relative to the first substrate and the second substrate may be the same as the diameter of the first substrate and the second substrate.

[0053] In addition, if Figure 3 As shown, the control unit 300 can move the measuring unit 200 from the upper edge of the first substrate S1 to the central portion of the first substrate S1 relative to the first substrate S1 to form a first monitoring area M1. In addition, the control unit 300 can move the measuring unit 200 from the central portion of the second substrate S2 to the lower edge of the second substrate S2 relative to the second substrate S2 to form a second monitoring area M2. In this case, the substrate mounting unit 100 and the supporting unit 500 do not need to be able to rotate, and the control unit 300 only needs to adjust the length of the moving path of the measuring unit 200, and the moving path of the measuring unit 200 relative to the first substrate and the second substrate has the same length as the radius of the first substrate and the second substrate, and the moving path is smaller than the diameter of the first substrate and the second substrate.

[0054] In addition, if Figure 4As shown, the control part 300 can move the measuring part 200 from the upper edge of the first substrate S1 to the central part of the first substrate relative to the first substrate S1, and move the measuring part 200 from the central part of the first substrate S1 to the right edge of the first substrate S1 again to form the first monitoring area M1. In addition, the control part 300 can move the measuring part 200 from the edge between the upper part and the right part of the second substrate S2 to the central part of the substrate S2 relative to the second substrate S2, and move the measuring part 200 from the central part of the second substrate S2 to the lower part of the second substrate S2 again to form the second monitoring area M2. That is, the measuring part 200 can have a moving path that bends at the central part of the substrate. To this end, the control part 300 can move the measuring part 200 from the upper edge of the first substrate S1 to the central part of the first substrate S1, partially rotate at least one of the substrate mounting part 100 and the supporting part 500, and then move the measuring part 200 from the central part of the first substrate S1 to the right edge of the first substrate S1. Subsequently, the control part 300 may partially rotate the substrate mounting part 100 to move the measuring part 200 from the edge between the upper part and the right part to the central part of the second substrate S2, and then rotate the substrate mounting part 100 again to move the measuring part 200 from the central part of the second substrate S2 to the lower part of the second substrate S2. In this case, the length of the moving path of the measuring part 200 relative to the first substrate and the second substrate may be the same as the diameter of the first substrate and the second substrate.

[0055] In addition, the measuring unit 200 may be configured not to monitor the entire area but to monitor only specific positions when moving along the moving path. That is, the measuring unit 200 may monitor specific positions within the first substrate S1 and the second substrate S2, in which case the specific positions may be one or more positions of the central portion of the substrate located outside the central portion.

[0056] like Figure 5 As shown, when the measuring unit 200 monitors multiple positions, the measuring unit 200, for example, Figure 2 The measuring unit 200 moves along the moving path of the first substrate S1 and the second substrate S2, and specifies a position or an interval position on the moving path, so that monitoring can be performed only at a specific position of the first monitoring area M1 and the second monitoring area M2. That is, the measuring unit 200 can intermittently monitor each substrate on the moving path of the first substrate S1 and the second substrate S2. Here, Figure 5It is shown that each substrate includes a first monitoring area M1 having five specific positions and a second monitoring area M2 having five specific positions, but the number of monitoring positions is not limited thereto. However, it can also be configured to monitor three specific positions including the center portion on the first substrate S1, and different movement paths of the measuring unit 200 are set to monitor three specific positions including the center position on the second substrate S2, and in this case, when the first substrate S1 and the second substrate S2 overlap, a total of five specific positions can be monitored along the cross-shaped intersection of the center portion.

[0057] The first monitoring area M1 of the first substrate S1 and the second monitoring area M2 of the second substrate S1 are Figures 2 to 5 , and each monitoring area can of course be variously configured so that at least some areas at different positions from each other can be monitored. However, in order to minimize the time consumed by monitoring, the control part 300 can control the measuring part 200 to have a linear moving path whose length is not greater than the diameter of the substrate, such as Figures 2 to 5 As shown, each substrate has a symmetrical feature about its central portion, and therefore, the control part can control the measuring part 200 to have a moving path passing through the central portion of the substrate.

[0058] In addition, Figures 2 to 5 In the embodiment, the configuration in which the measuring unit 200 sequentially monitors the first substrate S1 and the second substrate S2 is exemplarily described, but a plurality of measuring units 200 according to the exemplary embodiment may be provided. Of course, a plurality of measuring units 200 may be configured, one of which monitors the first substrate S1 and another of which monitors the second substrate S2.

[0059] The analysis unit 400 determines the presence of an abnormality through monitoring information about the plurality of substrates. That is, when the monitoring information about the first substrate and the monitoring information about the second substrate both fall within the error range, the analysis unit 400 determines the processed processing state as a good state, and when at least one of the monitoring information about the first substrate and the monitoring information about the second substrate does not fall within the error range, the analysis unit determines the processed processing state as a defective state.

[0060] Figure 6 Shows Figure 2 The first substrate S1 and the second substrate S2 overlap with respect to the notch N at the same position. Figure 6As shown, on the virtual substrate S0 where the first substrate S1 and the second substrate S2 overlap, a first monitoring area M1 is formed from the upper edge to the lower edge of the virtual substrate S0, and a second monitoring area M2 is formed from the left edge to the right edge. As described above, the apparatus 10 for inspecting substrates according to the exemplary embodiment monitors each substrate selected from the substrates that have been subjected to the same predetermined process, so that the monitoring information obtained from the first substrate can be directly applied to the second substrate among these substrates, and vice versa, the monitoring information obtained from the second substrate among these substrates can also be directly applied to the first substrate among these substrates. Therefore, the substrates that have been subjected to the same predetermined process can be identified as having the same Figure 6 The virtual substrate S0 shown in FIG. 1 is in the same processed state, and the analyzing unit 400 determines Figure 6 There is an abnormality in the processed state of the virtual substrate S0 shown in FIG.

[0061] That is, in the first monitoring area M1 excluding the area MC where the first monitoring area M1 and the second monitoring area M2 overlap, the analysis unit 400 determines whether the first monitoring information measured by the first monitoring falls within the error range of the result value of the predetermined process. In addition, in the second monitoring area M2 excluding the area MC where the first monitoring area M1 and the second monitoring area M2 overlap, the analysis unit 400 determines whether the second monitoring information measured by the second monitoring falls within the error range of the result value of the predetermined process. Here, for the area MC where the first monitoring area M1 and the second monitoring area M2 overlap, the analysis unit 400 determines the processed state as a good state when both the first monitoring information and the second monitoring information belong to a good state. When at least one of the first monitoring information and the second monitoring information falls outside the error range, it is determined to be a defective state.

[0062] In addition, the analysis unit 400 can adjust the error range of the result value of the predetermined process by using the deviation in the first monitoring information and the second monitoring information in the area MC, where the first monitoring area M1 and the second monitoring area M2 overlap. Here, the area MC where the first monitoring area M1 and the second monitoring area M2 overlap may include the central part of the substrate. The predetermined process is mostly performed well in the central part of the substrate, but the closer to the edge of the substrate, the higher the probability of being determined as a defect. Therefore, the error range of the first monitoring area M1 is set for the monitoring information of the central part of the first substrate on which the first monitoring has been performed, and the error range of the second monitoring area M2 is set for the monitoring information of the central part of the second substrate on which the second monitoring has been performed. At this time, the monitoring information about the central parts of the first substrate and the second substrate may be different from each other, so in this case, the error range of the result value can be corrected by adding or subtracting the deviation from the monitoring information about the central parts of the first substrate and the second substrate or the monitoring information measured from any one substrate.

[0063] Figure 7 is a view illustrating a state in which an apparatus for inspecting a substrate according to an exemplary embodiment is installed. Figure 7 A case where the apparatus 10 for inspecting a substrate according to an exemplary embodiment is installed in a load chamber is shown as an example, but the entire process may also be applied in the same manner in a case where the apparatus 10 for inspecting a substrate is installed in a front end module.

[0064] As described above, the substrate mounting part 100 according to the exemplary embodiment may be transported from the process chambers P1 and P2, in which predetermined processes have been performed, and provided to the load lock chamber L storing a plurality of substrates or the front end module E (EFEM) connected to the load lock chamber L to discharge the substrate stored in the load lock chamber L. Here, when the substrate mounting part 100 is provided to the load lock chamber L, the substrate mounting part 100 may include at least one of the plurality of slots installed in the load lock chamber L. Here, the measurement part 200 may also be installed inside the load lock chamber L, but may be configured to be installed outside the load lock chamber L and to monitor with respect to the substrate on the uppermost slot of the plurality of slots installed in the load lock chamber L through a viewport installed in the load lock chamber. Conversely, when the substrate mounting part 100 is provided to the front end module E, the substrate mounting part 100 may be provided to a portion of the space inside the front end module E or to one side of the front end module E.

[0065] In the apparatus for inspecting substrates, the substrates are loaded on the corresponding boxes C1 and C2 and provided to the front-end module E. Generally, in the apparatus for inspecting substrates, each processing process collects a certain number of substrates and performs the corresponding processing in batch units. In addition, in the case of a sheet-fed process, the actual processing is performed in units of one substrate, but its management is performed in batch units. Therefore, for example, the number of substrates in a batch unit may be about 25, and 25 substrates may be loaded on one box.

[0066] The substrate is provided from the front end module E to the load chamber L and stored therein. The load chamber L stores a part of the substrate loaded in each of the cassettes C1 and C2, and when the substrate mounting part 100 of the apparatus 10 for inspecting the substrate is mounted in the load chamber L, monitoring for measuring the initial state with respect to the substrate provided to the load chamber L may be performed. In this case, the analysis part 400 may of course compare monitoring information of the initial state before performing a predetermined process in the process chambers P1 and P2 and monitoring information after performing the predetermined process, and set an error range for determining whether the processed state is a good state or a defective state.

[0067] The substrates stored in the loadlock chamber L are transported from the transport chamber T to the corresponding processing chambers P1 and P2. Here, the processing chambers may be provided in plural, and a plurality of substrates may be processed simultaneously in the processing chambers P1 and P2. The substrates on which the predetermined processing has been performed are stored again in the loadlock chamber L. At this time, the measurement section 200 monitors the substrates, and the control section 300 controls the moving path of the measurement section 200 so that at least some areas at different positions relative to these substrates are monitored, and these substrates are stored in the loadlock chamber L sequentially or simultaneously. Here, these substrates may be the entirety of the substrates stored in the loadlock chamber L, but may also be these substrates selected from the substrates included in the above-mentioned one batch. In addition, these substrates may be selected from the substrates on which the predetermined processing has been performed in the same processing chamber. When these substrates are selected from the substrates including one batch, it is possible to determine whether there is an abnormality in the entirety of the apparatus for inspecting the substrates, and in particular, when these substrates are selected from the substrates on which the predetermined processing has been performed in the same processing chamber, it is possible to easily determine the presence of an abnormality in the corresponding processing chamber.

[0068] Here, as an example, Figure 7 A configuration is shown in which the apparatus 10 for inspecting a substrate having one measurement part 200 is installed in the loadlock chamber L, but a plurality of apparatuses 10 for inspecting a substrate may of course be installed in the loadlock chamber L so that a plurality of measurement parts 200 simultaneously inspect a plurality of substrates.

[0069] In addition, the analysis part 400 determines the presence of abnormality in the processed states in the processing chambers P1 and P2 from the monitoring information on the substrates, which are sequentially or simultaneously stored in the load lock chamber L. That is, when it is determined from the monitoring information on the substrates that the processed states are good, the processes in the processing chambers P1 and P2 are continuously performed, and when the processed states are determined as defective by the monitoring information on the substrates, it is determined that a problem occurs in the substrate processing apparatus, so that the process of the substrate processing apparatus may be temporarily stopped, and a warning may be issued by an alarm or the like so that the corresponding chambers can be repaired and maintained.

[0070] Thus, when the substrate mounting part 100 includes at least one of the plurality of slots mounted in the load carrier chamber L, the process of inspecting the substrate can be performed without changing the transport path of the substrate, and there is no need to adjust the order of the transport robots included in the transport chamber T. In addition, when the substrate mounting part 100 is provided to a part of the space inside the front-end module E or one side of the front-end module, an arbitrary substrate is selected without restriction from the substrates that have completed the predetermined process, and a space for installing the apparatus 10 for inspecting the substrate can be easily secured. Thus, when the substrate mounting part 100 is provided to the load carrier chamber L or the front-end module E, in a substrate processing apparatus composed of a conveying chamber T connected to a plurality of process chambers P1 and process chambers P2 and a load carrier chamber L for inputting or outputting a substrate, monitoring of the processed state of the substrate can be performed while the predetermined process of the substrate in the process chambers P1 and process chambers P2 is being performed, and the influence on the movement of the substrate is minimized. In addition, according to the monitoring result, the process of a specific process chamber or process of the entire substrate processing apparatus can be stopped, or the change of the process can be easily performed.

[0071] Hereinafter, a method for inspecting a substrate according to an exemplary embodiment will be described in detail. Here, in the method for inspecting a substrate according to an exemplary embodiment, description on contents overlapping with contents of an apparatus for inspecting a substrate will be omitted.

[0072] Figure 8 is a schematic diagram illustrating a method for inspecting a substrate according to an exemplary embodiment.

[0073] Reference Figure 8 , a method for inspecting a substrate according to an exemplary embodiment includes: selecting a first substrate and a second substrate from a plurality of substrates (S100); monitoring some areas of the first substrate (S200); monitoring some areas of the second substrate (S300); and determining the presence of an abnormality from monitoring information about the first substrate and the second substrate (S400).

[0074] When selecting the first substrate and the second substrate from a plurality of substrates (S100), first, the first substrate and the second substrate to be monitored are selected from a plurality of substrates on which a predetermined process has been performed. Here, the first substrate and the second substrate can be selected from a box loaded with a plurality of substrates, and in this case, the first substrate and the second substrate can be selected from these substrates contained in a batch, and therefore, the presence of an abnormality can be determined as a whole of the substrate processing device. In addition, the first substrate and the second substrate can also be selected from a plurality of substrates on which a predetermined process has been performed in the same processing chamber. That is, when three to six substrates are processed simultaneously in the same processing chamber, the first substrate and the second substrate can be selected from all or part of the three to six substrates, and therefore, the presence of an abnormality in the corresponding processing chamber can be easily determined.

[0075] When monitoring some areas of the first substrate (S200), the thickness, reflectivity, abnormal presence, and distribution range of particles are monitored from the area portion of the measuring unit 200 relative to the first substrate. In addition, when monitoring some areas of the second substrate (S300), the thickness, reflectivity, abnormal presence, and distribution range of particles are monitored from the area portion of the measuring unit 200 relative to multiple areas of the second substrate.

[0076] Here, the control unit 300 can control the moving path of the measuring unit 200 so that at least partial areas at different positions relative to the first substrate and the second substrate are monitored. Therefore, when monitoring a portion of the second substrate (S300), the monitored area of ​​the first substrate and at least some monitored areas of the second substrate are different from each other.

[0077] In addition, the monitoring of the first substrate can be performed by moving the measuring part 200 to monitor the first substrate in a first direction through the central part of the first substrate, and it can also be performed so that when the measuring part 200 moves in the first direction through the central part of the first substrate, the first substrate is intermittently monitored on the moving path of the measuring part 200. In addition, the monitoring of some areas of the second substrate can be performed by moving the measuring part 200 to monitor the second substrate in a second direction different from the first direction through the central part of the second substrate, and it can also be performed so that when the measuring part 200 moves in the second direction through the central part of the second substrate, the second substrate is intermittently monitored on the moving path of the measuring part 200. To this end, as described above, at least one of the substrate mounting part 100 and the supporting part 500 is rotatably mounted around the central axis of the substrate. That is, the control part 300 can form a first monitoring area including the central part on the first substrate by moving the measuring part 200 in the first direction, and the control part 300 can form a second monitoring area including the central part on the second substrate by rotating at least one of the substrate mounting part 100 and the supporting part 500 to move the measuring part 200 in the second direction different from the first direction.

[0078] Reference above Figures 2 to 5 The description can be applied in the same manner to monitoring some areas of the first substrate (S200) and monitoring some areas of the second substrate (S300). The monitoring area of ​​the first substrate and the monitoring area of ​​the second substrate are shown exemplarily, and as described above, each monitoring area can be configured differently so that at least some areas can be monitored from different positions from each other.

[0079] The determination of the presence of an abnormality from the monitoring information of the first substrate and the second substrate (S400) is performed by the analysis unit 400. That is, the analysis unit 400 determines whether the monitoring information about some areas of the first substrate falls within the error range relative to the result value of the predetermined processing. In addition, the analysis unit 400 determines whether the monitoring information about some areas of the second substrate falls within the error range relative to the result value of the predetermined processing. Therefore, when determining the presence of an abnormality from the monitoring information of the first substrate and the second substrate (S400), when any one of the monitoring information about the first substrate and the monitoring information about the second substrate falls outside the error range, the processed state is determined to be defective, and the substrate processing equipment is notified of the abnormality, and when both the monitoring information of the first substrate and the monitoring information of the second substrate are within the error range, the processed state is determined to be good, and the processing is continuously performed.

[0080] In addition, when determining the presence of an abnormality from the monitoring information of the first substrate and the second substrate (S400), when the monitoring area of ​​the first substrate partially overlaps with the monitoring area of ​​the second substrate, the error range can be corrected by using a deviation in the monitoring information about the overlapping area. That is, the analysis unit 400 can correct the error range of the result value of the predetermined processing by using the deviation of the area (e.g., the central part of the substrate) overlapping with the first monitoring area in the first monitoring information and the second monitoring information. This is because the predetermined processing is mostly performed well in the central part of the substrate, but the closer to the edge of the substrate, the higher the probability of being determined as a defect, and since the result value of the predetermined processing is set relative to the monitoring information about the central part of the substrate, in this case, as described above, the error range of the result value can be adjusted by adding the value of the deviation in the first monitoring information and the second information.

[0081] In this way, according to the apparatus and method for inspecting substrates of the exemplary embodiment, at least some areas of mutually different positions are monitored with respect to a plurality of substrates, and thus the processed states of the substrates can be determined in a short time and the time consumed for inspection can be reduced.

[0082] Therefore, instantaneous feedback can be provided in response to a processed state, and pre-execution such as operation stop, improvement, or maintenance can be taken due to equipment abnormality, thereby minimizing the defect rate during substrate manufacturing and improving the capacity utilization of the equipment.

[0083] Although preferred exemplary embodiments have been described and illustrated by using specific terms, these terms are only used to clearly explain the present invention, and various modifications may be made to the embodiments and terms used without departing from the spirit and scope of the present invention. These modified embodiments should not be understood separately from the spirit and scope of the present invention, and will be interpreted as being included in the scope of the present invention.

Claims

1. An apparatus for inspecting a substrate, the apparatus comprising: A substrate mounting portion, used for mounting a substrate; a measuring part, moving relative to the substrate and used to monitor the substrate; A control unit, configured to control a moving path of the measuring unit so as to monitor at least some areas of a plurality of substrates at positions different from each other, wherein the plurality of substrates include a first substrate and a second substrate; as well as an analyzing unit, configured to determine the presence of abnormalities of the plurality of substrates by determining whether the monitoring information of the first substrate falls within an error range set based on the first substrate and determining whether the monitoring information of the second substrate falls within an error range set based on the second substrate, The analyzing section corrects the error range set with respect to at least one of the first substrate or the second substrate by using a difference in monitoring information about an area where a monitoring area of ​​the first substrate and a monitoring area of ​​the second substrate overlap with each other.

2. The apparatus of claim 1, wherein the plurality of substrates are selected from substrates on which the same predetermined process has been performed.

3. The apparatus of claim 1, further comprising: The support part is mounted on the substrate mounting part, wherein the measuring part is mounted under the support part so as to be movable in one direction. 4 . The apparatus of claim 3 , wherein at least one of the substrate mounting portion and the support portion is mounted to be rotatable around a central axis of the substrate. 5 . The apparatus according to claim 1 , wherein the control section controls the measuring section so that the measuring section has a linear moving path. 6 . The apparatus according to claim 1 , wherein the control section performs control so that the measuring section has a moving path passing through a center portion of the substrate. 7 . The apparatus according to claim 1 , wherein the control section performs control so that the measuring section has a moving path bent at the center portion of the substrate. 8 . The apparatus according to claim 1 , wherein the control section performs control so that a length of the moving path of the measuring section is not greater than a diameter of the substrate.

9. The apparatus of claim 1, wherein the measuring portion intermittently monitors the substrate on the moving path.

10. The device as claimed in claim 1, wherein the substrate mounting portion is installed in: a carrying chamber, the carrying chamber is used to store the multiple substrates transferred from the processing chamber, and the multiple substrates have been subjected to predetermined processing in the processing chamber; or a front-end module, the front-end module is connected to the carrying chamber and is configured to unload the multiple substrates.

11. A method for inspecting a substrate, comprising: selecting a first substrate and a second substrate from a plurality of substrates; monitoring some areas of the first substrate; monitoring some areas of the second substrate, the monitored areas among the plurality of areas of the second substrate being different from the monitored areas among the plurality of areas of the first substrate; as well as determining the presence of abnormalities of the plurality of substrates by determining whether the monitoring information of the first substrate falls within an error range set based on the first substrate and determining whether the monitoring information of the second substrate falls within an error range set based on the second substrate, Wherein in the step of determining the presence of an abnormality, the error range set relative to at least one of the first substrate or the second substrate is corrected by utilizing the difference in monitoring information about an area where a monitoring area of ​​the first substrate and a monitoring area of ​​the second substrate overlap with each other. 12 . The method of claim 11 , wherein in the step of selecting the first substrate and the second substrate, the first substrate and the second substrate are selected from a plurality of substrates belonging to one lot. 13 . The method of claim 11 , wherein in the step of selecting the first substrate and the second substrate, the first substrate and the second substrate are selected from a plurality of substrates on which a predetermined process has been performed in the same chamber. 14 . The method of claim 11 , wherein the step of monitoring the some areas of the first substrate is performed by causing a measuring portion for monitoring the first substrate to move relative to the first substrate along a first direction and pass through a central portion of the first substrate. 15 . The method of claim 14 , wherein the step of monitoring the some areas of the second substrate is performed by causing a measuring portion for monitoring the second substrate to move relative to the second substrate in a second direction different from the first direction and pass through a central portion of the second substrate.

16. The method of claim 14, wherein the step of monitoring the some areas of the first substrate is performed by intermittently monitoring the first substrate while the measuring portion for monitoring the first substrate is moved, and the step of monitoring the some areas of the second substrate is performed by intermittently monitoring the second substrate while the measuring portion for monitoring the second substrate is moved. 17 . The method of claim 11 , wherein in the step of determining the presence of the abnormality, when both the monitoring information about the first substrate and the monitoring information about the second substrate fall within an error range, the process status is determined to be good.

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