Package structure and manufacturing method thereof
By using a combination of heat dissipation substrate and heat-conducting components in the packaging structure, and combining different thermal conductivity materials in hot and non-hot areas, the problems of packaging structure cost and manufacturing difficulty are solved, and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202411391514.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-08
- Publication Date
- 2025-01-10
AI Technical Summary
How to achieve optimal heat dissipation while reducing the cost and manufacturing difficulty of the packaging structure, especially under conditions of uneven heat flux density distribution on the chip surface.
The system employs a combination structure of a heat dissipation substrate and a heat-conducting component. The heat-conducting component is covered with a high thermal conductivity material in the hot spot area and a low thermal conductivity material in the non-hot spot area. By setting grooves on the heat dissipation substrate and embedding the heat-conducting component, a heat conduction zone and a heat transfer zone are formed, thereby achieving rapid heat transfer and uniform diffusion.
While reducing costs and manufacturing difficulty, it achieves efficient heat dissipation on the chip surface, especially rapid heat transfer in hot areas and material savings in non-hot areas, thus improving the heat dissipation performance of the packaging structure.
Smart Images
Figure CN119297162A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor packaging, and in particular to a packaging structure and a manufacturing method thereof. Background Art
[0002] In the packaging structure, in order to avoid heat accumulation inside the chip, a metal frame is usually used as a heat dissipation structure to achieve heat dissipation. For example, for a packaging structure with a flip chip, heat is diffused through the metal frame above the silicon substrate of the chip to achieve heat dissipation. As the power consumption of the chip increases, more efficient heat dissipation technology is needed. The design of a composite heat dissipation structure composed of a metal frame and a material with high thermal conductivity has begun to be studied. The cost of materials with high thermal conductivity is high, and the manufacturing difficulty of the composite heat dissipation structure increases with the increase in the area occupied by the material with high thermal conductivity, which greatly increases the cost and manufacturing difficulty of the packaging structure.
[0003] Therefore, how to achieve the best heat dissipation effect while reducing the cost and manufacturing difficulty of the packaging structure becomes a technical problem that needs to be solved. Summary of the invention
[0004] The technical problem to be solved by the present invention is to provide a packaging structure and a manufacturing method thereof, which can achieve the best heat dissipation effect while reducing the cost and manufacturing difficulty of the packaging structure.
[0005] In order to solve the above problems, an embodiment of the present invention provides a packaging structure, including a component that needs to dissipate heat and a heat dissipation structure covering the surface of the component that needs to dissipate heat, the surface of the component that needs to dissipate heat includes a hot spot area and a non-hot spot area, and the heat dissipation structure includes: a heat dissipation substrate, covering the surface of the component that needs to dissipate heat, the heat dissipation substrate has a first thermal conductivity; a heat conductive member, located in the heat dissipation substrate, the heat conductive member includes a heat conductive area and a heat transfer area, the heat conductive area covers the entire surface of the hot spot area, the heat transfer area extends outward from the heat conductive area, and the heat transfer area covers a portion of the surface of the non-hot spot area, and another portion of the surface of the non-hot spot area is not covered by the heat conductive member, wherein the heat conductive member has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity.
[0006] In one embodiment, the projection range of the heat conduction zone on the surface of the component requiring heat dissipation completely overlaps with the range of the hot spot area.
[0007] In one embodiment, the projection range of the heat conduction zone on the surface of the component requiring heat dissipation is larger than the range of the hot spot area.
[0008] In one embodiment, the heat conducting element includes a plurality of the heat transfer areas, and the plurality of the heat transfer areas radiate outwards starting from the heat conducting area.
[0009] In one embodiment, the plurality of heat transfer regions are centered on the heat conduction region and are distributed at the same or different angles.
[0010] In one embodiment, the heat conducting member includes a plurality of heat conducting strips, the intersections of the plurality of heat conducting strips serve as the heat conducting area, and the non-intersections serve as the heat transfer area.
[0011] In one embodiment, the surface of the heat dissipation substrate facing the component requiring heat dissipation has a groove, the heat conductive element is disposed in the groove, and the heat conductive element contacts the surface of the component requiring heat dissipation.
[0012] In one embodiment, the heat dissipation substrate is a metal substrate, and the thermal conductive element is a diamond thermal conductive element.
[0013] In one embodiment, the surface of the component requiring heat dissipation is a silicon surface.
[0014] In one embodiment, the surface of the component requiring heat dissipation includes multiple hot spot areas, the heat conductive member includes multiple heat conduction zones, the heat conduction zones correspond one to one with the hot spot areas, and the heat transfer zone connects adjacent heat conduction zones, or is only connected to one heat conduction zone.
[0015] In one embodiment, the component requiring heat dissipation includes a chip, a substrate and a plastic package, the chip is flip-mounted on the substrate, the plastic package covers the chip, and a surface of the chip away from the substrate is exposed to the plastic package.
[0016] The embodiment of the present invention also provides a method for manufacturing the above-mentioned packaging structure, comprising: obtaining a hot spot area on the surface of a component that needs heat dissipation, the surface being a surface on which a heat dissipation structure needs to be set; manufacturing a heat dissipation structure, the manufacturing step of the heat dissipation structure comprising: providing a heat dissipation substrate, and determining a preset area on the heat dissipation substrate, the preset area being an area corresponding to the hot spot area, and the heat dissipation substrate having a first thermal conductivity; forming a groove on a surface of the heat dissipation substrate, the groove passing through the preset area; forming a heat conductive member in the groove, the portion of the heat conductive member located in the preset area serving as a heat conduction zone, and the portion of the heat conductive member located outside the preset area serving as a heat transfer zone, the heat transfer zone extending outward from the heat conduction zone as a starting point, the heat conductive member having a second thermal conductivity, the second thermal conductivity being greater than the first thermal conductivity; setting the heat dissipation structure on the surface of the component that needs heat dissipation, wherein the heat dissipation substrate covers the surface of the component that needs heat dissipation, the heat conduction zone covers the entire surface of the hot spot area, the heat transfer zone covers a portion of the surface of the non-hot spot area, and another portion of the surface of the non-hot spot area is not covered by the heat conductive member.
[0017] In one embodiment, the step of forming a groove on a surface of the heat dissipation substrate includes: forming a plurality of sub-grooves on a surface of the heat dissipation substrate, and the intersection of the sub-grooves passes through the preset area; the step of forming a heat conductive member in the groove includes: forming a heat conductive strip in the sub-groove, and the intersection of the plurality of heat conductive strips serves as the heat conduction zone, and the non-intersection serves as the heat transfer zone.
[0018] In one embodiment, the initial depth of the groove is greater than the initial thickness of the heat conductor, and the step of forming the heat conductor in the groove includes: forming a heat conductor at the bottom of the groove, and the surface of the heat conductor facing away from the bottom of the groove is located in the groove; flattening the heat dissipation substrate so that the surface of the heat conductor is flush with the surface of the heat dissipation substrate.
[0019] In the packaging structure and manufacturing method provided by the embodiment of the present invention, the hot spot area on the surface of the component that needs heat dissipation has a large heat flux density and is a heat concentration area. The heat conductive member (i.e., heat conductive zone) with high thermal conductivity is covered in all the hot spot areas, so that the heat of the hot spot area on the surface of the component that needs heat dissipation can be quickly transferred, and the local hot spots on the surface of the component that needs heat dissipation can be effectively eliminated, achieving a better heat dissipation effect; the non-hot spot area on the surface of the component that needs heat dissipation has a small heat flux density and does not need to be fully covered with the heat conductive member for heat conduction. The heat conductive member (i.e., heat transfer zone) is covered in part of the non-hot spot area, and the other part of the surface of the non-hot spot area is not covered by the heat conductive member, so that the heat dissipation of the non-hot spot area can be achieved, which greatly saves the area of the heat conductive member and reduces the cost and manufacturing difficulty of the packaging structure. The packaging structure provided by the embodiment of the present invention can obtain the best heat dissipation effect while reducing the cost and manufacturing difficulty of the packaging structure, which is conducive to the promotion and application of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0021] Figure 1 is a schematic top view of a packaging structure provided by a first embodiment of the present invention;
[0022] Figure 2 is a bottom view of the heat dissipation structure in the packaging structure provided by the first embodiment of the present invention;
[0023] Figure 3 is along Figure 1 Cross-sectional view along the A-A1 direction;
[0024] Figure 4 is along Figure 1 Cross-sectional view along the B-B1 direction;
[0025] Figure 5 is a bottom view schematic diagram of a heat dissipation structure in a packaging structure provided by a second embodiment of the present invention;
[0026] Figure 6 is a bottom view schematic diagram of a heat dissipation structure in a packaging structure provided in a third embodiment of the present invention;
[0027] Figure 7 is a schematic top view of a packaging structure provided by a fourth embodiment of the present invention;
[0028] Figure 8 is a schematic diagram of the steps of a method for manufacturing a packaging structure provided by a fifth embodiment of the present invention;
[0029] Figures 9A to 9J It is a process flow chart of a method for manufacturing a packaging structure provided in a fifth embodiment of the present invention. DETAILED DESCRIPTION
[0030] The inventor has conducted in-depth research on the technical problem of how to obtain the best heat dissipation effect while reducing the cost and manufacturing difficulty of the packaging structure as described in the background art. The inventor has found that in the packaging structure, on the surface of the component that needs to dissipate heat (such as a chip), the hot spot area (i.e., the heat source) is not evenly distributed. Some areas have a large heat flux density, while some areas have a small heat flux density. The area with a large heat flux density is the hot spot area, and the area with a small heat flux density is the non-hot spot area. The hot spot area is the main area that causes the chip to fail due to overheating.
[0031] In view of this, an embodiment of the present invention provides a packaging structure, which can selectively set a material with high thermal conductivity according to the location of the hot spot area on the surface of the component that needs to dissipate heat, thereby achieving the best heat dissipation effect while reducing the cost and manufacturing difficulty of the packaging structure.
[0032] The specific implementation manner of the packaging structure and the manufacturing method thereof provided by the present invention is described in detail below with reference to the accompanying drawings.
[0033] Figure 1 is a top view schematic diagram of a packaging structure provided by a first embodiment of the present invention, Figure 3 is along Figure 1 The cross-sectional view along the A-A1 direction, Figure 4 is along Figure 1 For the cross-sectional view in the B-B1 direction, please refer to Figure 1 , Figure 3 and Figure 4The packaging structure includes a component 100 that needs heat dissipation and a heat dissipation structure 200 covering the surface of the component 100 that needs heat dissipation. The surface of the component 100 that needs heat dissipation includes a hot spot area 100A and a non-hot spot area 100B. The heat dissipation structure 200 includes: a heat dissipation substrate 210, covering the surface of the component 100 that needs heat dissipation, and the heat dissipation substrate 210 has a first thermal conductivity; a heat conductive member 220, located in the heat dissipation substrate 210, and the heat conductive member 220 includes a heat conductive area 220A and a heat transfer area 220B. The heat conductive area 220A covers the entire surface of the hot spot area 100A, and the heat transfer area 220B extends outward from the heat conductive area 220A as a starting point, and the heat transfer area 220B covers a portion of the surface of the non-hot spot area 100B, and another portion of the surface of the non-hot spot area 100B is not covered by the heat conductive member 220, wherein the heat conductive member 220 has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity. exist Figure 1 In the following top views, the heat conducting member 220 is blocked by the heat dissipation substrate 210, and the heat conducting member 220 is shown by a dotted line. The heat conducting area 220A and the heat transfer area 220B of the heat conducting member 220 are only used to distinguish different areas of the heat conducting member 220, and there is no substantial dividing line, so the dividing line between the two is shown by a dotted line in the figure.
[0034] In the packaging structure provided by the embodiment of the present invention, the hot spot area 100A on the surface of the component 100 that needs heat dissipation has a large heat flux density and is a heat concentration area. Therefore, the heat conductor 220 with higher thermal conductivity (i.e., the heat conduction zone 220A) is covered in the entire hot spot area 100A, so that the heat of the hot spot area 100A on the surface of the component 100 that needs heat dissipation can be quickly transferred, and the local hot spots on the surface of the component 100 that needs heat dissipation can be effectively eliminated, thereby achieving a better heat dissipation effect; the non-hot spot area 100B on the surface of the component 100 that needs heat dissipation has a small heat flux density and does not need to be completely covered with the heat conductor 220 for heat conduction. Therefore, the heat conductor 220 (i.e., the heat transfer zone 220B) is covered in part of the non-hot spot area 100B, and another part of the surface of the non-hot spot area 100B is not covered by the heat conductor 220, so that the heat dissipation of the non-hot spot area 100B can be achieved, which greatly saves the area of the heat conductor 220 and reduces the cost and manufacturing difficulty of the packaging structure. The packaging structure provided by the embodiment of the present invention can achieve the best heat dissipation effect while reducing the cost and manufacturing difficulty of the packaging structure, which is conducive to the promotion and application of the packaging structure.
[0035] The components 100 that need to dissipate heat include but are not limited to bare chips 310, chips 310 covered with a plastic package 300, etc. In some embodiments, the surface of the components 100 that need to dissipate heat is a silicon surface, and uneven heat flux density distribution is likely to occur on the silicon surface. In this embodiment, the components 100 that need to dissipate heat are chips 310 covered with a plastic package 300. Specifically, Figure 1 to Figure 4 As shown, the chip 310 is flipped on the substrate 320, the plastic package 300 covers the chip 310, the surface of the substrate 311 of the chip 310 is exposed to the plastic package 300, and the heat dissipation structure 200 covers the surface of the plastic package 300 and the surface of the substrate 311 of the chip 310. The heat inside the chip 310 is conducted upward to the substrate 311, and then dissipated through the heat dissipation structure 200. In some embodiments, the substrate 311 of the chip 310 is a silicon substrate. On the surface of the substrate 311, some areas have a large heat flux density (hot spot area 100A), and some areas have a small heat flux density (non-hot spot area 100B). The area with a large heat flux density has concentrated heat, which is the main area causing the over-temperature failure of the chip 310. The entire hot spot area 100A on the surface of the substrate 311 is covered with the heat conductive member 220 with high thermal conductivity, which can achieve effective heat dissipation of the hot spot area 100A, and the non-hot spot area 100B on the surface of the substrate 311 is partially covered with the heat conductive member 220 with high thermal conductivity, which can achieve effective heat dissipation of the non-hot spot area 100B and reduce the cost and manufacturing difficulty of the heat conductive member 220. It can be understood that the other areas outside the hot spot area 100A on the surface of the component 100 that needs heat dissipation are the non-hot spot areas 100B.
[0036] The heat dissipation structure 200 covers the surface of the component 100 that needs heat dissipation, and is used to achieve heat dissipation of the component 100 that needs heat dissipation. For example, in this embodiment, the heat dissipation structure 200 covers the top surface of the plastic package 300 and the surface of the substrate 311 of the chip 310 that is not covered by the plastic package 300.
[0037] The heat dissipation structure 200 includes a heat dissipation substrate 210 and a heat conductor 220. The heat dissipation substrate 210 covers the surface of the component 100 that needs heat dissipation, and the heat conductor 220 is located in the heat dissipation substrate 210. The heat dissipation substrate 210 has a first thermal conductivity, and the heat conductor 220 has a second thermal conductivity, which is greater than the first thermal conductivity. The heat dissipation structure 200 improves the heat dissipation performance by arranging a heat conductor 220 with higher thermal conductivity in the heat dissipation substrate 210. In some embodiments, the heat dissipation substrate 210 is a metal substrate, and the heat conductor 220 is a diamond heat conductor. For example, in this embodiment, the heat dissipation substrate 210 is a copper substrate, and the heat conductor 220 is a diamond heat conductor. The thermal conductivity of diamond is about 5 times that of copper, which greatly improves the heat dissipation performance of the heat dissipation structure 200 provided with a diamond heat conductor. However, the material cost of the diamond heat conductor is high, and if the diamond heat conductor is to be manufactured on a large area, its manufacturing difficulty is relatively large.
[0038] In order to take into account the heat dissipation performance, material cost and manufacturing difficulty, in the packaging structure provided in the embodiment of the present invention, the design of the heat conductive component 220 greatly reduces the area ratio occupied by the heat conductive component 220 in the heat dissipation structure 200, thereby reducing the cost and manufacturing difficulty while ensuring the heat dissipation effect.
[0039] The heat conducting member 220 includes a heat conducting area 220A, and the heat conducting area 220A covers the entire surface of the hot spot area 100A, and is used to achieve heat dissipation of the hot spot area 100A. In some embodiments, the range of the projection of the heat conducting area 220A on the surface of the component 100 that needs heat dissipation completely overlaps with the range of the hot spot area 100A, so that accurate heat dissipation of the hot spot area 100A can be achieved, and costs can be further saved. In other embodiments, the range of the projection of the heat conducting area 220A on the surface of the component 100 that needs heat dissipation is greater than the range of the hot spot area 100A, which can further ensure that the heat of the hot spot area 100A is conducted to the heat dissipation substrate 210 through the heat conducting member 220, thereby improving the heat dissipation performance of the packaging structure.
[0040] The heat conducting member 220 further includes a heat transfer area 220B, which extends outward from the heat dissipation base 210 starting from the heat conducting area 220A. The heat transfer area 220B covers a partial area of the non-hot spot area 100B on the surface of the component 100 that needs to dissipate heat, and can achieve heat dissipation of the non-hot spot area 100B; at the same time, the heat transfer area 220B can also increase the contact area between the heat conducting member 220 and the heat dissipation base 210, and the heat of the heat conducting area 220A is further transferred to other areas of the heat dissipation base 210 through the heat transfer area 220B, which speeds up the heat dissipation rate of the heat conducting area 220A and further improves the heat dissipation performance of the packaging structure.
[0041] In some embodiments, the heat conducting member 220 includes a plurality of heat transfer regions 220B, and the plurality of heat transfer regions 220B radiate outward from the heat conducting region 220A. Figure 1 As shown, in this embodiment, the heat conducting member 220 includes four heat transfer areas 220B, and the four heat transfer areas 220B all radiate outwards from the heat conducting area 220A as a starting point.
[0042] In some embodiments, the plurality of heat transfer areas 220B are distributed at the same angle intervals with the heat conduction area 220A as the center, that is, the heat transfer areas 220B are evenly distributed at the same angle in the heat dissipation substrate 210, which can increase the uniformity of heat dissipation and heat conduction and improve the heat dissipation performance of the packaging structure. Figure 1 As shown, the four heat transfer areas 220B are centered on the heat conduction area 220A and are distributed at the same angle interval, and the interval angle is 90 degrees.
[0043] In other embodiments, the plurality of heat transfer areas 220B are distributed at different angles with the heat conduction area 220A as the center, that is, the heat transfer areas 220B are distributed at different angles in the heat dissipation substrate 210, and the heat transfer areas 220B can be set according to the heat flux density on the surface of the component 100 that needs to dissipate heat, further increasing the heat dissipation in the area with large heat flux density, and improving the heat dissipation performance of the packaging structure. Figure 5 As shown, it is a bottom view schematic diagram of the heat dissipation structure in the packaging structure provided by the second embodiment of the present invention. In this embodiment, the four heat transfer areas 220B are distributed at different angles.
[0044] In some embodiments, the heat conducting member 220 includes a plurality of heat conducting strips 221, the intersection of the plurality of heat conducting strips 221 serves as the heat conducting area 220A, and the non-intersection serves as the heat transfer area 220B. Compared with manufacturing the heat conducting member 220 over a large area, the difficulty of manufacturing the heat conducting strips 221 is lower, which can reduce the difficulty of manufacturing the packaging structure, and the heat conducting strips 221 have a smaller area, which can further save costs. Figure 2 As shown, it is a bottom view of the heat dissipation structure in the packaging structure provided by the first embodiment of the present invention. In this embodiment, the heat conducting member 220 includes two heat conducting strips 221, and the intersection of the two heat conducting strips 221 is used as the heat conducting area 220A, and the non-intersection is used as the heat transfer area 220B. In other embodiments, such as Figure 6 As shown, it is a top view schematic diagram of the packaging structure provided by the third embodiment of the present invention, the heat conducting member 220 includes three heat conducting strips 221, and the three heat conducting strips 221 intersect at one point, the intersection serves as the heat conducting area 220A, and the non-intersection serves as the heat transfer area 220B. It can be understood that the width of the heat conducting strip 221 can be set according to actual needs, and the setting of the heat conducting strip 221 needs to satisfy that the area of the intersection of the heat conducting strip 221 is greater than or equal to the area of the hot spot area 100A.
[0045] In some embodiments, the surface of the heat dissipation substrate 210 facing the component 100 that needs to dissipate heat has a groove 911 (such as Fig.9D As shown in the figure, the heat conductive member 220 is arranged in the groove, and the groove is used to accommodate the heat conductive member 220. The heat conductive member 220 contacts the surface of the component 100 that needs to dissipate heat. For example, the surface of the heat conductive member 220 facing away from the bottom of the groove contacts the surface of the substrate 311 of the chip 310 and the surface of the plastic package 300 to improve heat conduction and further improve the heat dissipation performance of the heat dissipation structure 200.
[0046] In the above embodiment, the surface of the component 100 requiring heat dissipation has one hot spot area 100A. In other embodiments, the surface of the component 100 requiring heat dissipation has multiple hot spot areas 100A, and other areas of the surface of the component 100 requiring heat dissipation outside the hot spot area 100A are the non-hot spot areas 100B.
[0047] The surface of the component 100 that needs heat dissipation includes multiple hot spot areas 100A, and the heat conductive member 220 includes multiple heat conductive areas 220A, and the heat conductive areas 220A correspond to the hot spot areas 100A one by one. The heat transfer area 220B is connected to adjacent heat conductive areas 220A, or is only connected to one heat conductive area 220A, so as to obtain the best heat dissipation effect while reducing the cost of the packaging structure and the difficulty of manufacturing.
[0048] For example, Figure 7 As shown, it is a top view schematic diagram of the packaging structure provided by the fourth embodiment of the present invention. In the fourth embodiment, the surface of the component 100 that needs to dissipate heat includes a plurality of hot spot areas 100A, and the heat conductive member 220 includes a plurality of heat conductive zones 220A, and the heat conductive zones 220A correspond one to one with the hot spot areas 100A. A portion of the heat transfer zones 220B are connected to adjacent heat transfer zones 220A, and another portion of the heat transfer zones 220B are only connected to one heat conductive zone 220A.
[0049] The packaging structure provided in the embodiment of the present invention accurately arranges the heat conduction area 220A on the heat dissipation base 210 in combination with the hot spot area 100A on the surface of the component 100 that needs heat dissipation to help quickly diffuse the heat to the entire heat dissipation base 210, thereby achieving the best heat dissipation effect while reducing the cost and manufacturing difficulty of the packaging structure.
[0050] Based on the same inventive concept, the present invention also provides a method for manufacturing the above packaging structure. Figure 8 , which is a schematic diagram of the steps of a manufacturing method of a packaging structure provided by a fifth embodiment of the present invention, the manufacturing method comprising: step S80, obtaining a hot spot area on the surface of a component that needs to dissipate heat, the surface being a surface on which a heat dissipation structure needs to be set; step S81, manufacturing a heat dissipation structure, the manufacturing steps of the heat dissipation structure comprising: step S810, providing a heat dissipation substrate, and determining a preset area on the heat dissipation substrate, the preset area being an area corresponding to the hot spot area, the heat dissipation substrate having a first thermal conductivity; step S811, forming a groove on a surface of the heat dissipation substrate, the groove passing through the preset area; step S812, A heat conducting member is formed inside the preset area, the portion of the heat conducting member located in the preset area is used as a heat conducting zone, the portion of the heat conducting member located outside the preset area is used as a heat transfer zone, the heat transfer zone extends outward from the heat conducting zone, the heat conducting member has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity; step S82, setting the heat dissipation structure on the surface of the component that needs heat dissipation, wherein the heat dissipation substrate covers the surface of the component that needs heat dissipation, the heat conducting zone covers the entire surface of the hot spot area, the heat transfer zone covers part of the surface of the non-hot spot area, and another part of the surface of the non-hot spot area is not covered by the heat conducting member.
[0051] The manufacturing method of the packaging structure provided in the embodiment of the present invention accurately arranges the heat conduction area on the heat dissipation substrate in combination with the hot spot area position on the surface of the component that needs heat dissipation to help quickly diffuse the heat to the entire heat dissipation substrate, thereby achieving the best heat dissipation effect while reducing the cost and manufacturing difficulty of the packaging structure.
[0052] Figures 9A to 9JIt is a process flow chart of a method for manufacturing a packaging structure provided in a fifth embodiment of the present invention.
[0053] Please refer to Figure 8 as well as Fig. 9A ,in, Fig. 9A The schematic top view of the surface of the component 800 that needs heat dissipation, step S80, obtains the hot spot area 800A on the surface of the component 800 that needs heat dissipation, and the surface is the surface where the heat dissipation structure needs to be set. The hot spot area 800A on the surface of the component 800 that needs heat dissipation can be obtained by a thermodynamic detection method, or by a thermodynamic simulation method. The other areas outside the hot spot area 800A on the surface of the component 800 that needs heat dissipation are non-hot spot areas 800B.
[0054] See also Figure 8 , Figure 9B to Figure 9H , step S81, manufacturing a heat dissipation structure. Specifically, the steps of manufacturing the heat dissipation structure include:
[0055] See also Fig. 9B ,in, Fig. 9B is a schematic top view of a heat dissipation substrate 910, step S810, providing a heat dissipation substrate 910, and determining a preset area 910A on the heat dissipation substrate 910, the preset area 910A being an area corresponding to the hot spot area 800A, and the heat dissipation substrate 910 having a first thermal conductivity. In this step, the preset area 910A can be determined according to the hot spot area 800A on the surface of the component 800 requiring heat dissipation obtained in step S80, and the positional relationship between the heat dissipation substrate 910 and the surface of the component 800 requiring heat dissipation.
[0056] See also Fig. 9C and Fig.9D ,in, Fig. 9C is a bottom view of the heat dissipation substrate 910, Fig.9D For along Fig. 9C In the cross-sectional view along the A-A1 direction, step S811, a groove 911 is formed on a surface of the heat dissipation substrate 910, and the groove 911 passes through the preset area 910A. In this step, the groove 911 is formed on the surface of the heat dissipation substrate 910 that needs to contact the component. For example, in this embodiment, the surface of the heat dissipation substrate 910 that needs to contact the component is the lower surface, and the groove 911 is formed on the lower surface of the heat dissipation substrate 910. The groove 911 extends toward the inside of the heat dissipation substrate 910.
[0057] In some embodiments, the step of forming the groove 911 on a surface of the heat dissipation substrate 910 includes: forming a plurality of sub-grooves on a surface of the heat dissipation substrate 910, wherein the intersection of the sub-grooves passes through the preset area 910A. Fig. 9C As shown, two intersecting sub-grooves are formed on the lower surface of the heat dissipation substrate 910 , and the intersection of the sub-grooves passes through the preset area 910A.
[0058] See also Figure 9G and Figure 9H ,in, Figure 9G is a bottom view of the heat dissipation substrate 910, Figure 9H For along Figure 9G In the cross-sectional view along the A-A1 direction, step S812, a heat conducting member 920 is formed in the groove 911, and the portion of the heat conducting member 920 located in the preset area 910A is used as a heat conducting zone 920A, and the portion of the heat conducting member 920 located outside the preset area 910A is used as a heat transfer zone 920B, and the heat transfer zone 920B extends outward from the heat conducting zone 920A, and the heat conducting member 920 has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity.
[0059] In some embodiments, the step of forming the heat conducting member 920 in the groove 911 includes: forming a heat conducting strip 921 in the sub-groove 911, the intersection of a plurality of the heat conducting strips 921 serves as the heat conducting area 920A, and the non-intersection serves as the heat transfer area 920B.
[0060] In some embodiments, the initial depth of the groove 911 is greater than the initial thickness of the heat conducting member 920, and the steps of forming the heat conducting member 920 in the groove 911 include: Fig.9E and Fig.9F ,in, Fig.9E is a bottom view of the heat dissipation substrate 910, Fig.9F For along Fig.9E In the cross-sectional view along the A-A1 direction, a heat conducting member 920 is formed at the bottom of the groove 911, and the surface of the heat conducting member 920 facing away from the bottom of the groove 911 is located in the groove 911; please refer to Figure 9G and Figure 9H, flatten the heat dissipation substrate 910 so that the surface of the heat conductor 920 is flush with the surface of the heat dissipation substrate 910. The flattening process includes but is not limited to chemical mechanical grinding. In this step, the initial depth of the groove 911 is greater than the initial thickness of the heat conductor 920 to ensure that the heat conductor 920 can be completely embedded in the groove 911; the area of the heat dissipation substrate 910 that is higher than the heat conductor 920 is removed by the flattening process, and the surface of the heat dissipation substrate 910 facing the component 800 that needs heat dissipation is flattened, thereby improving the fit between the heat dissipation substrate 910 and the surface of the component 800 that needs heat dissipation, which is beneficial to the transfer of heat. In some embodiments, in the step of flattening the heat dissipation substrate 910, the heat conductor 920 is also flattened to further flatten the lower surface of the heat dissipation structure, improve the fit between the heat dissipation structure and the surface of the component 800 that needs heat dissipation, and is beneficial to the transfer of heat.
[0061] See also Figure 8 , Fig.9I and Figure 9J ,in, Fig.9I is a schematic top view of the packaging structure, Figure 9J For along Fig.9I In the cross-sectional view along the A-A1 direction, step S82, the heat dissipation structure is arranged on the surface of the component 800 that needs heat dissipation, wherein the heat dissipation substrate 910 covers the surface of the component 800 that needs heat dissipation, the heat conduction area 920A covers the entire surface of the hot spot area 800A, the heat transfer area 920B covers part of the surface of the non-hot spot area 800B, and another part of the surface of the non-hot spot area 800B is not covered by the heat conduction member 920. In this step, the heat dissipation structure is buckled on the surface of the component 800 that needs heat dissipation.
[0062] The manufacturing method of the packaging structure provided in the embodiment of the present invention can form a heat-conducting member composed of a heat-conducting area and a heat-transfer area, so as to realize the rapid transfer of heat in the hot spot area on the surface of the component that needs heat dissipation, effectively eliminate the local hot spots on the surface of the component that needs heat dissipation, and achieve a better heat dissipation effect; and, the heat-conducting member (i.e., the heat-transfer area) is covered in part of the non-hot spot area, and another part of the surface of the non-hot spot area is not covered by the heat-conducting member, which greatly saves the area of the heat-conducting member, reduces the cost and manufacturing difficulty of the packaging structure, and is conducive to the promotion and application of the packaging structure.
[0063] It should be noted that the terms "including" and "having" and their variations involved in the document of the present invention are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, unless the context clearly indicates, and it should be understood that the data used in this way can be interchanged under appropriate circumstances. The term "one or more" depends at least in part on the context, and can be used to describe features, structures or characteristics in a singular sense, or can be used to describe features, structures or combinations of features in a plural sense. The term "based on" can be understood as not necessarily intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow the presence of other factors that are not necessarily explicitly described. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concept of the present invention. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.
[0064] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.
Claims
1. A packaging structure, comprising a component requiring heat dissipation and a heat dissipation structure covering the surface of the component requiring heat dissipation, wherein the surface of the component requiring heat dissipation comprises a hot spot area and a non-hot spot area, characterized in that: The heat dissipation structure comprises: A heat dissipation substrate, covering the surface of the component requiring heat dissipation, wherein the heat dissipation substrate has a first thermal conductivity; A heat conductor is located in the heat dissipation substrate, the heat conductor includes a heat conduction area and a heat transfer area, the heat conduction area covers the entire surface of the hot spot area, the heat transfer area extends outward from the heat conduction area, and the heat transfer area covers a portion of the surface of the non-hot spot area, and another portion of the surface of the non-hot spot area is not covered by the heat conductor, wherein the heat conductor has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity.
2. The packaging structure according to claim 1, characterized in that: The projection range of the heat conduction zone on the surface of the component requiring heat dissipation completely overlaps with the range of the hot spot area.
3. The packaging structure according to claim 1, characterized in that: The projection range of the heat conduction zone on the surface of the component requiring heat dissipation is larger than the range of the hot spot area.
4. The packaging structure according to claim 1, characterized in that: The heat conducting member includes a plurality of heat transfer areas, and the plurality of heat transfer areas radiate outwards starting from the heat conducting area.
5. The packaging structure according to claim 4, characterized in that: The plurality of heat transfer areas are centered on the heat conduction area and are distributed at the same or different angles.
6. The packaging structure according to claim 1, characterized in that: The heat conducting member includes a plurality of heat conducting strips, the intersections of the plurality of heat conducting strips serve as the heat conducting area, and the non-intersections serve as the heat transfer area.
7. The packaging structure according to claim 1, characterized in that: The surface of the heat dissipation substrate facing the component requiring heat dissipation has a groove, the heat conductive member is arranged in the groove, and the heat conductive member contacts the surface of the component requiring heat dissipation.
8. The packaging structure according to claim 1, characterized in that: The heat dissipation substrate is a metal substrate, and the heat conducting member is a diamond heat conducting member.
9. The packaging structure according to claim 1, characterized in that: The surface of the component requiring heat dissipation is a silicon surface.
10. The packaging structure according to claim 1, characterized in that: The surface of the component requiring heat dissipation includes a plurality of hot spot areas, the heat conducting member includes a plurality of heat conducting zones, the heat conducting zones correspond to the hot spot areas one by one, and the heat transfer zone connects the adjacent heat conducting zones, or is connected to only one of the heat conducting zones.
11. The packaging structure according to claim 1, characterized in that: The components requiring heat dissipation include a chip, a substrate and a plastic package. The chip is flip-mounted on the substrate, the plastic package covers the chip, and the surface of the chip away from the substrate is exposed to the plastic package.
12. A method for manufacturing a packaging structure according to any one of claims 1 to 11, characterized in that: include: Obtaining a hot spot area on the surface of a component that needs heat dissipation, where the surface is the surface on which a heat dissipation structure needs to be set; Manufacturing a heat dissipation structure, the manufacturing steps of the heat dissipation structure comprising: Providing a heat dissipation substrate, and determining a preset area on the heat dissipation substrate, wherein the preset area is an area corresponding to the hot spot area, and the heat dissipation substrate has a first thermal conductivity; forming a groove on a surface of the heat dissipation substrate, wherein the groove passes through the preset area; A heat conducting member is formed in the groove, the portion of the heat conducting member located in the preset area is used as a heat conducting zone, the portion of the heat conducting member located outside the preset area is used as a heat transfer zone, the heat transfer zone extends outward from the heat conducting zone as a starting point, the heat conducting member has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity; The heat dissipation structure is arranged on the surface of the component that needs heat dissipation, wherein the heat dissipation substrate covers the surface of the component that needs heat dissipation, the heat conduction area covers the entire surface of the hot spot area, the heat transfer area covers a part of the surface of the non-hot spot area, and another part of the surface of the non-hot spot area is not covered by the heat conduction member.
13. The method for manufacturing a packaging structure according to claim 12, characterized in that: The step of forming a groove on a surface of the heat dissipation substrate includes: forming a plurality of sub-grooves on a surface of the heat dissipation substrate, and the intersection of the sub-grooves passes through the preset area; the step of forming a heat conductive member in the groove includes: forming a heat conductive strip in the sub-groove, and the intersection of the plurality of heat conductive strips serves as the heat conduction area, and the non-intersection serves as the heat transfer area.
14. The method for manufacturing a packaging structure according to claim 12, characterized in that: The initial depth of the groove is greater than the initial thickness of the heat conductive member, and the step of forming the heat conductive member in the groove comprises: forming the heat conductive member at the bottom of the groove, wherein the surface of the heat conductive member facing away from the bottom of the groove is located in the groove; The heat dissipation substrate is planarized so that the surface of the heat conduction member is flush with the surface of the heat dissipation substrate.