Chip-type active phased array fast redistributable architecture

Abstract

The invention belongs to the technical field of antennas, and relates to a chip-type active phased array fast reconfigurable architecture, which comprises a T / R chip, a coaxial layer, a resonance layer, a variable layer and a radiation layer, the coaxial layer and the resonance layer are in welding-free connection with the variable layer and the radiation layer; the coaxial layer and the resonant layer are laminated to form a first printed board; when an application scene needs to be replaced, the antenna pattern, the polarization characteristic and the scanning characteristic of the current application scene are extracted, the second printed board is replaced, and the antenna basic units and the unit spacing of the replaced second printed board are different: on the premise that a rear-end module is not changed, the antenna array surface basic unit form and the unit spacing can be freely configured, and the antenna array surface basic unit form and the unit spacing can be freely configured. And the antenna development efficiency is greatly improved. The method has high universality and reusability, and has excellent economical efficiency. Contact type mode conversion is adopted, welding-free rapid interconnection is achieved, high tolerance is achieved for air gaps and alignment errors of interconnection end faces, and maintainability is high.

Description

Technical Field

[0001] The present application belongs to the field of antenna technology, and in particular relates to a chip-based active phased array fast re-routable architecture. Background Art

[0002] At present, as wireless communication and radar detection systems have more and more functions and adapt to more and more complex environments, the requirements for antenna RF are developing towards high customization and characterization. Among them, chip-based active phased array antenna is a technology that integrates antenna and chip in the package based on packaging materials and processes to realize system-level active phased array. This technology conforms to the trend of increasing integration of silicon-based semiconductor processes, provides a good antenna solution for system-level wireless chips, and takes into account antenna performance, cost and volume, representing an important achievement in recent antenna technology.

[0003] However, on the other hand, the integration of antenna and chip limits the form and performance indicators of the antenna. In the chip-based active phased array antenna, the signal interconnection from the T / R chip RF port to the antenna radiation end is generally achieved through the transmission of RF signals through printed circuit board interconnection. However, this method rigidly connects the chip RF port and the antenna port. For the chip-based active phased array antenna that has been designed and manufactured, it is impossible to replace the antenna for different application scenarios. Instead, the antenna carrier can only be redesigned and the chip can be mounted. The project iteration cycle is lengthy, and the design and manufacturing costs are increased. In order to solve the above problems, reconfigurable technology came into being. Reconfigurable technology aims to build a reconfigurable or partially configurable architecture to realize the many functional requirements of the system, improve the versatility and reusability between microwave devices, so as to achieve the purpose of low-cost and rapid system construction and iterative upgrades.

[0004] At present, the reconfigurable technology of active phased array antennas mainly includes functional-level reconfiguration and module-level reconfiguration. Functional-level reconfiguration includes real-time control of antenna frequency, beam shape, pointing, and power distribution, while module-level reconfiguration includes antenna shape reconfiguration based on subarray architecture, antenna unit pattern / bandwidth, and back-end transceiver circuit reconfiguration.

[0005] The basic unit form and unit spacing of the active phased array antenna determine the boundaries of the system performance. The above reconstruction methods are all implemented at the functional layer and module layer. Although the antenna unit reconfiguration technology has achieved changes in the performance of the basic antenna units to a certain extent, the degree of change is limited. Therefore, the above reconstruction methods cannot achieve significant changes in the basic unit form and unit spacing of the antenna, and cannot expand the system performance boundaries. Summary of the invention

[0006] The purpose of this application is to provide a chip-based active phased array fast re-routable architecture to solve the problem that the existing antenna unit reconfiguration technology is difficult to significantly change the antenna basic unit form and unit spacing.

[0007] The technical solution of the present application is: a chip-type active phased array fast re-route architecture, including a T / R chip, a coaxial layer, a resonant layer, a variable layer and a radiating layer; the T / R chip is welded to the coaxial layer and the resonant layer, and the coaxial layer and the resonant layer are connected to the variable layer and the radiating layer without soldering; the coaxial layer and the resonant layer are pressed together into a first printed board, and the variable layer and the radiating layer are pressed together into a second printed board, and the second printed board is detachably connected to the first printed board; when the application scenario needs to be changed, the antenna radiation pattern, polarization characteristics and scanning characteristics of the current application scenario are extracted, and the second printed board is replaced, and the antenna basic unit and unit spacing of the replaced second printed board are different; a non-rigid signal transmission structure is adopted between the coaxial layer and the resonant layer and the variable layer and the radiating layer.

[0008] Preferably, the coaxial layer and the resonant layer are connected to the T / R chip through metallized vias, and the resonant layer converts the signal into the TE / TM mode of the waveguide; a shielding structure is provided in the variable layer and the radiation layer, and the shielding structure is non-contact grounded; a first metal layer is provided at the bottom of the resonant layer, and a first coupling gap is opened in the first metal layer.

[0009] Preferably, the upper surface and surroundings of the resonance layer are metal structures, and the first metal layer and the metal structure on the resonance layer are integrally processed and formed.

[0010] Preferably, the coaxial layer, the resonant layer, the variable layer and the radiation layer are provided with interconnected mounting holes, and bolts are passed through the mounting holes; when the second printed board needs to be replaced, the bolts are taken out and the first printed board and the second printed board can be separated.

[0011] Preferably, the resonant layer and the variable layer are attached to each other.

[0012] Preferably, an air gap is provided between the resonant layer and the variable layer.

[0013] Preferably, the non-contact grounding adopts an EBG structure, and the EBG structure is located in the variable layer; the EBG structure is arranged along the signal transmission path; and the EBG structure surrounds the signal transmission path.

[0014] Preferably, the radiation layer comprises a radiator, a lower dielectric plate and a second metal plate, wherein a second coupling gap is provided in the second metal plate; and the lower dielectric plate is provided between the radiator and the second metal plate.

[0015] The chip-based active phased array fast re-routable architecture of the present application has the following advantages:

[0016] The basic unit form and unit spacing of the antenna array can be freely configured without changing the back-end module, which greatly improves the efficiency of antenna development.

[0017] It has high versatility and reusability and excellent economy.

[0018] The contact mode conversion is adopted to realize solder-free fast interconnection, and has high tolerance for air gap and alignment error of the interconnection end face, and high maintainability. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solution provided by the present application, the following is a brief introduction to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the present application.

[0020] Figure 1 This is a schematic diagram of the overall structure of this application;

[0021] Figure 2 This is an exploded view of the overall structure of this application;

[0022] Figure 3 This is a schematic diagram of the EBG structure of this application;

[0023] Figure 4 This is a partial cross-sectional view of the coaxial layer and the variable layer of the present application when they are connected in coordination.

[0024] 1. T / R chip; 2. Coaxial layer; 3. Resonant layer; 4. Variable layer; 5. Radiation layer; 6. First metal layer; 7. First coupling gap; 8. Mounting hole; 9. EBG structure; 10. Radiator; 11. Lower dielectric plate; 12. Second metal plate; 13. Second coupling gap. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] A fast re-routable architecture of a chip-based active phased array, such as Figure 1-Figure 2As shown, it includes a T / R chip 1, a coaxial layer 2, a resonant layer 3, a variable layer 4 and a radiation layer 5; the T / R chip 1 is welded to the coaxial layer 2 and the resonant layer 3, and the coaxial layer 2 and the resonant layer 3 are connected to the variable layer 4 and the radiation layer 5 without soldering; the coaxial layer 2 and the resonant layer 3 are pressed into a first printed board, the variable layer 4 and the radiation layer 5 are pressed into a second printed board, and the second printed board is detachably connected to the first printed board; when the application scenario needs to be changed, the antenna radiation pattern, polarization characteristics and scanning characteristics of the current application scenario are extracted, and the second printed board is replaced, and the antenna basic unit and unit spacing of the replaced second printed board are different; a non-rigid signal transmission structure is adopted between the coaxial layer 2 and the resonant layer 3 and the variable layer 4 and the radiation layer 5.

[0027] Modular assembly between the chip and the antenna unit is achieved. The antenna unit is the coaxial layer 2, the resonant layer 3, the variable layer 4 and the radiation layer 5. By adopting a separable architecture of the first printed circuit board and the second printed circuit board, the second printed circuit board can be flexibly configured. The basic unit form and unit spacing of the antenna array can be freely configured without changing the back-end module, which greatly improves the antenna development efficiency.

[0028] Preferably, the coaxial layer 2 and the resonant layer 3 are connected to the T / R chip 1 through metallized vias, and the resonant layer 3 converts the signal into the TE / TM mode of the waveguide; a shielding structure is provided in the variable layer 4 and the radiation layer 5, and the shielding structure is non-contact grounded; a first metal layer 6 is provided at the bottom of the resonant layer 3, and a first coupling gap 7 is provided in the first metal layer 6. By realizing signal transmission through the TE / TM mode, there is no need to set an internal conductor, the structural complexity is greatly reduced, and the space occupied by the structure is greatly reduced. By setting the first coupling gap 7, stable signal transmission can be achieved without contact.

[0029] Preferably, the upper surface and surrounding of the resonance layer 3 are metal structures, and the first metal layer 6 and the metal structure on the resonance layer 3 are integrally processed and formed, so as to simplify the structure.

[0030] Preferably, the coaxial layer 2, the resonant layer 3, the variable layer 4 and the radiation layer 5 are provided with interconnected mounting holes 8, and bolts are passed through the mounting holes 8 to realize microwave signal transmission; when the second printed circuit board needs to be replaced, the bolts are taken out and the first printed circuit board and the second printed circuit board can be separated.

[0031] Preferably, the resonant layer 3 and the variable layer 4 are attached to each other, and an air gap may be provided between the resonant layer 3 and the variable layer 4, so that the assembly is more flexible, the versatility and reusability are high, and the economy is excellent.

[0032] Preferably, the non-contact grounding adopts the EBG structure 9, combined with Figure 3, the EBG structure 9 is located in the variable layer 4; the EBG structure 9 is arranged along the path of signal transmission; the EBG structure 9 surrounds the signal transmission path. The layout of the EBG structure 9 is arranged according to the relative positions of the radiator 10 port and the T / R chip 1 interface. The radiator 10 port can be set at any position of the antenna basic unit. The relative positions of the radiator 10 port of the EBG structure 9 and the T / R chip 1 interface are arranged in a surrounding manner to form a channel connecting the two, such as Figure 4 shown.

[0033] Preferably, the radiation layer 5 includes a radiator 10, a lower dielectric plate 11 and a second metal plate 12, wherein a second coupling gap 13 is provided in the second metal plate 12; and the lower dielectric plate 11 is provided between the radiator 10 and the second metal plate 12. Further, contactless signal transmission is realized, contact mode conversion is adopted, solder-free fast interconnection is realized, and the air gap and alignment error of the interconnection end face are highly tolerant, and the maintainability is high.

[0034] In a specific embodiment, semiconductors are disposed in the first coupling slot 7 and the second coupling slot 13 to form a physical structure.

[0035] In summary, this application has the following advantages:

[0036] The basic unit form and unit spacing of the antenna array can be freely configured without changing the back-end module, which greatly improves the efficiency of antenna development.

[0037] It has high versatility and reusability and excellent economy.

[0038] The contact mode conversion is adopted to realize solder-free fast interconnection, and has high tolerance for air gap and alignment error of the interconnection end face, and high maintainability.

[0039] Finally, it should be noted that: the drawings of the embodiments disclosed in the present invention only involve structures related to the embodiments disclosed in the present invention, and other structures can refer to common designs. In the absence of conflicts, the same embodiment and different embodiments of the present invention can be combined with each other;

[0040] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip-based active phased array fast re-routable architecture, characterized by: The invention comprises a T / R chip (1), a coaxial layer (2), a resonant layer (3), a variable layer (4) and a radiating layer (5); the T / R chip (1) is welded to the coaxial layer (2) and the resonant layer (3); the coaxial layer (2) and the resonant layer (3) are connected to the variable layer (4) and the radiating layer (5) in a solder-free manner; the coaxial layer (2) and the resonant layer (3) are pressed together to form a first printed board; the variable layer (4) and the radiating layer (5) are pressed together to form a second printed board; the second printed board is detachably connected to the first printed board; when it is necessary to change the application scenario, the antenna directional pattern, polarization characteristics and scanning characteristics of the current application scenario are extracted, and the second printed board is replaced, and the antenna basic unit and unit spacing of the replaced second printed board are different; a non-rigid signal transmission structure is adopted between the coaxial layer (2) and the resonant layer (3) and the variable layer (4) and the radiating layer (5).

2. The chip-based active phased array fast re-routable architecture according to claim 1, characterized in that: The coaxial layer (2) and the resonant layer (3) are connected to the T / R chip (1) through metallized vias, and the resonant layer (3) converts the signal into a TE / TM mode of a waveguide; a shielding structure is provided in the variable layer (4) and the radiation layer (5), and the shielding structure is non-contact grounded; a first metal layer (6) is provided at the bottom of the resonant layer (3), and a first coupling gap (7) is provided in the first metal layer (6).

3. The chip-based active phased array fast re-routable architecture as claimed in claim 2, characterized in that: The upper surface and surrounding areas of the resonance layer (3) are both metal structures, and the first metal layer (6) and the metal structure on the resonance layer (3) are integrally processed and formed.

4. The chip-based active phased array fast re-routable architecture as claimed in claim 1, characterized in that: The coaxial layer (2), the resonant layer (3), the variable layer (4) and the radiation layer (5) are provided with mutually communicating mounting holes (8), and bolts are passed through the mounting holes (8); when the second printed board needs to be replaced, the bolts are removed and the first printed board and the second printed board can be separated.

5. The chip-based active phased array fast re-routable architecture as claimed in claim 1, characterized in that: The resonant layer (3) and the variable layer (4) are bonded to each other.

6. The chip-based active phased array fast re-routable architecture as claimed in claim 1, characterized in that: An air gap is provided between the resonant layer (3) and the variable layer (4).

7. The chip-based active phased array fast re-routable architecture as claimed in claim 1, characterized in that: The non-contact grounding adopts an EBG structure (9), the EBG structure (9) is located in the variable layer (4); the EBG structure (9) is arranged along the signal transmission path; and the EBG structure (9) surrounds the signal transmission path.

8. The chip-based active phased array fast re-routable architecture as claimed in claim 1, characterized in that: The radiation layer (5) comprises a radiator (10), a lower dielectric plate (11) and a second metal plate (12); a second coupling gap (13) is provided in the second metal plate (12); and the lower dielectric plate (11) is provided between the radiator (10) and the second metal plate (12).

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