Antenna module and electronic device including the same

Abstract

The invention relates to an antenna module and an electronic device including the same. The antenna module comprises a multi-layer substrate, and the multi-layer substrate comprises a grounding area and an antenna area; the antenna area comprises a first patch radiator, a second patch radiator, a feeder line, a first grounding via hole wall and a second grounding via hole wall; the signal via hole is connected to the second patch radiator at a connection portion offset from the center of the second patch radiator, the first ground via hole wall is disposed opposite to the second ground via hole wall with the first patch radiator as a reference, and the second patch radiator is disposed between the first patch radiator and the second ground via hole wall. The connecting part is arranged between the center of the second patch radiator and the second grounding via hole wall, and one end part of the second patch radiator is arranged opposite to the connecting part by taking the center of the second patch radiator as a reference; the ratio d / b of the length d from one end of the second patch radiator to the connection portion to the length b of the second patch radiator is set in the range of 0.5 to 1.

Description

[0001] This case is a divisional application of the invention patent application with the application date of July 29, 2021, application number 202180100835.2, and name "Antenna module and electronic device including the same". Technical Field

[0002] The present invention relates to an antenna module and an electronic device including the same. The specific implementation relates to an antenna module implemented on a multi-layer substrate and an electronic device including the same. Background Art

[0003] As the functions of electronic devices are diversified, they can be implemented as image display devices such as multimedia players with combined functions such as playing music or video files, games, and broadcast reception.

[0004] Image display devices are devices that play image content and receive and play images from a variety of sources. Image display devices are implemented by a variety of devices such as PCs (Personal Computers), smartphones, tablet PCs, laptops, and TVs (televisions). Image display devices such as smart TVs can provide applications such as web browsers for providing web content.

[0005] Such electronic devices such as image display devices may have a communication module including an antenna in order to communicate with surrounding electronic devices. On the other hand, recently, as the display area of ​​the image display device has expanded, the configuration space of the communication module including the antenna has decreased. As a result, the necessity of configuring an antenna inside a multilayer circuit substrate that implements the communication module is increasing.

[0006] On the other hand, as an interface for communication services between electronic devices, a WiFi wireless interface can be considered. In the case of using such a WiFi wireless interface, a millimeter wave band (mmWave) can be used for high-speed data transmission between electronic devices. In particular, a wireless interface such as 802.11ay can be used to achieve high-speed data transmission between electronic devices.

[0007] In this regard, an array antenna that can operate in the millimeter wave (mmWave) frequency band can be installed in an antenna module. However, the antenna configured in such an antenna module and electronic components such as a transceiver circuit are electrically connected. For this reason, the transceiver circuit is operably combined with the antenna module, and the antenna module can be composed of a multi-layer substrate.

[0008] In the antenna module of this multi-layer substrate form, when the antenna element is implemented by a single layer, there is a problem that the bandwidth of the antenna element is limited. On the other hand, when multiple antenna elements are stacked on different layers, the coupling change between the multiple antenna elements can sensitively respond to frequency changes. Summary of the invention

[0009] Problems to be solved by the invention

[0010] The purpose of this specification is to solve the above-mentioned problems and other problems. In addition, another purpose is to provide a broadband antenna module operating in the millimeter wave frequency band and an electronic device having the same.

[0011] Another object of the present specification is to increase antenna gain by improving the efficiency of an antenna element operating in a millimeter wave frequency band.

[0012] Another object of the present specification is to reduce the mutual interference level when realizing a dual-polarized antenna by reducing the current component in an undesired direction of an antenna element operating in a millimeter wave frequency band.

[0013] Another object of the present specification is to optimize antenna performance when an RFIC and an antenna element are connected via a feed line inside a PCB in the form of a multi-layer substrate.

[0014] Technical solutions to the problem

[0015] An antenna module is provided, comprising a multi-layer substrate, wherein the multi-layer substrate comprises: a grounding area, comprising a plurality of lower conductive layers electrically connected to the ground; and an antenna area; the antenna area comprises: a first patch radiator, arranged in the first area of ​​the multi-layer substrate; a second patch radiator, arranged in the second area of ​​the multi-layer substrate, and arranged at the bottom of the first patch radiator offset from the center of the first patch radiator; a feed line, connected to the second patch radiator through a signal via; and a first ground via wall and a second ground via wall, each comprising a plurality of ground via pads electrically connected to the plurality of lower conductive layers; the signal via is connected to the second patch radiator at a connection position offset from the center of the second patch radiator. The first patch radiator and the second patch radiator are connected, the first patch radiator and the second patch radiator overlap on one axis, the first ground via wall is arranged opposite to the second ground via wall with the first patch radiator as a reference, the second patch radiator is arranged between the first patch radiator and the second ground via wall, the connection part is arranged between the center of the second patch radiator and the second ground via wall, one end of the second patch radiator is arranged opposite to the connection part with the center of the second patch radiator as a reference, and the ratio d / b of the length d from the one end of the second patch radiator to the connection part to the length b of the second patch radiator is set in the range between 0.5 and 1.

[0016] An electronic device is provided, which has an antenna module, including: a transceiver circuit, configured in the antenna module composed of a multi-layer substrate; and a main PCB, configured inside the electronic device and operably combined with the multi-layer substrate; the multi-layer substrate includes: a grounding area, including a plurality of lower conductive layers electrically connected to the ground; and an antenna area; the antenna area includes: a first patch radiator, configured in the first area of ​​the multi-layer substrate; a second patch radiator, configured in the second area of ​​the multi-layer substrate, and configured at the bottom of the first patch radiator offset from the center of the first patch radiator; a feed line, connected to the second patch radiator through a signal via; and a first grounding via wall and a second grounding via wall, each including a plurality of grounding via solder joints electrically connected to the plurality of lower conductive layers disk; the signal via is connected to the second patch radiator at a connection position offset from the center of the second patch radiator, the first patch radiator and the second patch radiator overlap on one axis, the first ground via wall is arranged opposite to the second ground via wall with the first patch radiator as a reference, the second patch radiator is arranged between the first patch radiator and the second ground via wall, the connection position is arranged between the center of the second patch radiator and the second ground via wall, one end of the second patch radiator is arranged opposite to the connection position with the center of the second patch radiator as a reference, and the ratio d / b of the length d from the one end of the second patch radiator to the connection position to the length b of the second patch radiator is set in the range between 0.5 and 1.

[0017] In order to achieve the above or other purposes, an antenna module implemented by a multi-layer substrate of an embodiment is provided. The antenna module includes: a first radiator, which is arranged on an inner area or an upper area of ​​the multi-layer substrate, and is formed by a first conductive layer to radiate wireless signals; a second radiator, which is arranged in a lower area of ​​the first radiator and is offset from the center of the first radiator, and is formed by a second conductive layer to radiate wireless signals; and a feed line, which is configured to be connected to the second radiator through a signal via, the first radiator and the second radiator are overlapped on one axis, and the length of the first radiator on one axis and the length of the second radiator on one axis can be formed to be different from each other. The first radiator and the second radiator can be configured to operate in different frequency bands.

[0018] In an embodiment, the first radiator and the second radiator are implemented by a first patch antenna and a second patch antenna configured on different dielectric layers, and the second patch antenna can be connected to a feed line through a signal via. The signal via can be connected to the second patch antenna at a position offset from the center of the second patch antenna on an axis.

[0019] In an embodiment, a ratio b / a of a length b of the second patch antenna on one axis to a length a of the first patch antenna on one axis can be set to a range between 0.35 and 0.9, and a ratio c / b of an overlapping length c between the first patch antenna and the second patch antenna to a length b of the second patch antenna on one axis can be set to a range less than 0.7.

[0020] In an embodiment, the signal via may be connected to the second patch antenna at a location offset from a center of the second patch antenna on an axis.

[0021] In an embodiment, a groove area is formed in the ground layer so that the first pad of the plurality of pads of the signal via is arranged on the same layer as the ground layer, and the signal via can be vertically connected to the feeding line at the bottom of the ground layer through the groove area.

[0022] In an embodiment, the antenna module may further include a second lower conductive layer, the second lower conductive layer being spaced apart from one end and the other end of the feeder by a predetermined interval and being arranged on the same layer as the feeder. The end of the second lower conductive layer spaced apart from the one end of the feeder may be an internal portion of the lower region of the second patch antenna.

[0023] In an embodiment, the antenna module may further include a third lower conductive layer, the third lower conductive layer being arranged at the lower portion of the feed line. The third lower conductive layer may include a third slot region where the conductive layer is removed in a region corresponding to the lower region of the second patch antenna, and the length of the third slot region on one axis may be formed to be longer than the length of the plurality of pads of the signal via on one axis.

[0024] In an embodiment, the antenna module may further include a ground via wall, which is composed of a plurality of pads on the upper portion of the ground layer. The ground via wall may include a first ground via wall and a second ground via wall arranged on both sides of an axis of the multilayer substrate.

[0025] In an embodiment, the ground via wall comprises a vertical connection portion and a plurality of pads, and at least one adjacent pad among the plurality of pads of the ground via wall may be configured not to be connected by the vertical connection portion.

[0026] In an embodiment, a ratio d / b of a length d from one end of the second patch antenna to a portion connected to the feeder line to a length b of the second patch antenna on an axis may be set to a range between 0.5 and 1.

[0027] In an embodiment, a ratio e / f of a vertical distance e between the first patch antenna and the second patch antenna to a vertical distance f between the first patch antenna and a ground layer above the feeder line may be set to a range between 0.1 and 0.5.

[0028] In an embodiment, a distance g between a portion connected to the feeder line and the wall of the second ground via may be set to be less than or equal to 0.25 times a wavelength corresponding to an operating frequency of an antenna element based on the first patch antenna and the second patch antenna.

[0029] In an embodiment, the first patch antenna may be composed of a quadrilateral patch antenna having a first length and a first width, and the second patch antenna may be composed of a quadrilateral patch antenna having a second length and a second width. The first patch antenna and the second patch antenna may be configured to overlap by a third length in the length direction.

[0030] In an embodiment, the first patch antenna may be formed of a circular patch antenna having a first diameter, and the second patch antenna may be formed of a circular patch antenna having a second diameter. The first patch antenna and the second patch antenna may be configured to overlap in an arc region having a fourth length along an axial direction.

[0031] In an embodiment, the second patch antenna may be connected to the feed line through the signal via at a first position offset along a one-axis direction. The antenna module may further include a third patch antenna, which is connected to the second feed line through a second signal via at a second position offset along another axis direction orthogonal to the one-axis direction. The second patch antenna and the third patch antenna may be arranged on the same layer of the multi-layer substrate along the one-axis direction and the other axis direction.

[0032] In an embodiment, the antenna module may further include a transceiver circuit, which is arranged in the antenna module composed of a multi-layer substrate. The transceiver circuit is arranged at the lower part of the multi-layer substrate, and is electrically connected to the multi-layer substrate through a plurality of connection terminals, and one of the plurality of connection terminals can be connected to the feeder through a lower signal via. The lower signal via can be vertically connected to the other end of the feeder through a plurality of pads and a vertical connection portion.

[0033] Another aspect of the present invention provides an electronic device with an antenna module. The electronic device may include: a transceiver circuit, configured in the antenna module composed of a multi-layer substrate; a main PCB, configured inside the electronic device, and operably combined with the multi-layer substrate; and an antenna module, including a first radiator and a second radiator, the first radiator being configured on an inner region or an upper region of the multi-layer substrate, formed by a first conductive layer to radiate wireless signals, and the second radiator being configured in a lower region of the first radiator with an offset from the center of the first radiator, and formed by a second conductive layer to radiate wireless signals.

[0034] In an embodiment, the first radiator and the second radiator may be implemented by a first patch antenna and a second patch antenna configured on different dielectric layers. The second patch antenna may be connected to a feed line through a signal via. The signal via may be connected to the second patch antenna at a position offset from the center of the second patch antenna on an axis.

[0035] In an embodiment, a ratio b / a of a length b of the second patch antenna on one axis to a length a of the first patch antenna on one axis can be set to a range between 0.35 and 0.9, and a ratio c / b of an overlapping length c between the first patch antenna and the second patch antenna to a length b of the second patch antenna on one axis can be set to a range less than 0.7.

[0036] In an embodiment, the antenna module may further include the feed line, and the feed line is configured to be connected to the second patch antenna through the signal via. The first radiator and the second radiator are overlapped on one axis, and the length of the first radiator on one axis and the length of the second radiator on one axis are formed to be different from each other, so that the first radiator and the second radiator can be configured to operate in different frequency bands.

[0037] In an embodiment, a groove region may be formed in the ground layer so that the first pad of the plurality of pads of the signal via is disposed on the same layer as the ground layer. The signal via may be vertically connected to the feed line at the bottom of the ground layer through the groove region.

[0038] In an embodiment, the antenna module may further include: a second lower conductive layer, which is spaced apart from one end and the other end of the feeder by a predetermined interval and is arranged on the same layer as the feeder; and a third lower conductive layer, which is arranged at the lower portion of the feeder. The end of the second lower conductive layer spaced apart from the end of the feeder may be an internal portion of the lower region of the second patch antenna. The third lower conductive layer may include a third slot region in which the conductive layer is removed in a region corresponding to the lower region of the second patch antenna. The length of the third slot region on one axis may be formed to be longer than the length of the plurality of pads of the signal via on one axis.

[0039] In an embodiment, a groove area may be formed in the ground layer so that the first pad among the plurality of pads of the signal via is arranged on the same layer as the ground layer, and the signal via may be vertically connected to the feed line at the bottom of the ground layer through the groove area.

[0040] In an embodiment, the antenna module may further include: a second lower conductive layer spaced a predetermined distance from one end and the other end of the feeder and arranged in the same layer as the feeder; and a third lower conductive layer arranged below the feeder.

[0041] In an embodiment, the third lower conductive layer includes a third slot region where the conductive layer is removed in an area corresponding to the lower area of ​​the second patch antenna, and the length of the third slot region on one axis can be formed to be longer than the length of the plurality of pads of the signal via on one axis.

[0042] In an embodiment, the antenna module may be composed of an array antenna, which is formed by a plurality of antenna elements including the first radiator and the second radiator. A processor configured on the main PCB may control the transceiver circuit so that the array antenna radiates wireless signals to other electronic devices.

[0043] In an embodiment, the processor may control the transceiver circuit to perform wireless communication using a first wireless signal of a first frequency band radiated by the first radiator in the array antenna. If the quality of the first wireless signal is below a critical value, the transceiver circuit may be controlled to perform wireless communication using a second wireless signal of a second frequency band radiated by the second radiator in the array antenna. The transceiver circuit may apply the second wireless signal of the second frequency band to the array antenna through the feeder line.

[0044] Effects of the Invention

[0045] The technical effects of the broadband antenna module operating in the millimeter wave frequency band and the electronic device including the same as described above are described as follows.

[0046] According to the embodiment, a wideband antenna module that operates in a millimeter wave frequency band by independently operating a plurality of stacked radiators and an electronic device having the same can be provided.

[0047] According to the embodiment, an offset feeding structure is applied to the lower radiator, so that the antenna gain can be improved by improving the efficiency of the antenna element operating in the millimeter wave frequency band.

[0048] According to the embodiment, an open space such as a slot region is arranged at the lower portion of the feeder line, so that the antenna gain can be improved by improving the efficiency of the antenna element.

[0049] According to the embodiment, an offset feeding structure is applied to the lower radiator, thereby reducing the current component in an undesired direction of the antenna element operating in the millimeter wave frequency band.

[0050] According to the embodiment, by applying an offset feeding structure to the lower radiator, the mutual interference level when implementing a dual-polarization antenna can be reduced.

[0051] According to the embodiment, in the case where the RFIC and the antenna element are connected through a feeding line inside a PCB in the form of a multi-layer substrate, the antenna performance can be optimized by optimizing the shape and connection position of the feeding via structure.

[0052] The following detailed description will further clarify the scope of the additional application of this specification. However, since a person skilled in the art can clearly understand the various changes and modifications within the concept and scope of this specification, it should be understood that the specific embodiments of the preferred embodiments described in detail and this specification are only examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 This is a diagram schematically showing an example of an entire wireless AV system including an image display device according to an embodiment of the present specification.

[0054] Figure 2 This section shows the detailed configuration of a plurality of electronic devices that support the wireless interface of this specification.

[0055] Figure 3a Indicates the RTS (Request to Send) frame and CTS (Clear to Send) frame in this specification.

[0056] Figure 3b A block diagram of a communication system 400 according to an example of the present specification is illustrated.

[0057] Figure 4 An electronic device including a plurality of antenna modules and a plurality of transceiver circuit modules is shown according to an embodiment of the present invention.

[0058] Figure 5a This figure shows a structure in which a multilayer circuit substrate and an RFIC are connected and arranged with an array antenna module, which is related to this specification.

[0059] Figure 5b The diagram is a conceptual diagram showing antenna structures having different radiation directions.

[0060] Figure 5c It is a diagram showing a bonding structure of a multi-layer substrate and a main substrate according to an embodiment.

[0061] Figure 6 The present invention is a conceptual diagram of a plurality of communication modules disposed at the bottom of an image display device, the configuration of the communication modules, and communication with another communication module disposed in the front direction.

[0062] Figure 7a A side view of an antenna module having a broadband antenna according to the present specification is shown.

[0063] Figure 7b Yes means Figure 7a A diagram showing sizes and separation distances of radiators arranged on different layers and a separation distance between the radiator and the feeder in a side view of an antenna module.

[0064] Figure 8a express Figure 7a Front view of the antenna module. Figure 8b express Figure 7a A perspective view of the antenna module.

[0065] Fig. 9 This diagram shows a configuration in which a transceiver circuit is connected to a baseband processor interface when the antenna element disclosed in this specification is implemented as an array antenna.

[0066] Fig.10a and Fig.10b1 and 2 show a pattern formed according to the central connection structure and the offset connection structure and a current distribution formed in the second patch antenna.

[0067] Fig.11a and Fig.11b 2 is a diagram showing current distribution formed in the second patch antenna according to the center connection structure and the offset connection structure.

[0068] Fig.12a A multi-layer substrate structure is shown in which a via wall is formed along an outer contour area and an open space is formed in an internal ground layer according to an embodiment. Figure 12b Various embodiments of via wall forming structures are shown.

[0069] Fig.13 Shows the reflection coefficient characteristic results depending on whether an open space such as a groove area is formed in the ground layer.

[0070] Fig.14a The antenna gain at each frequency varies according to the overlap ratio between the first patch antenna and the second patch antenna.

[0071] Fig.14b The antenna gain at each frequency is represented by the offset ratio of the feeding position of the second patch antenna.

[0072] Fig.15 Another embodiment shows the configuration of a first patch antenna and a second patch antenna implemented in a circular patch shape.

[0073] Fig.16a A side view showing a multi-layer substrate formed by a dual-feed structure of the broadband antenna disclosed in this specification. Fig.16b A front view showing a multi-layer substrate in which the broadband antenna disclosed in this specification is constructed with a dual feed structure.

[0074] Fig.17a It is based on Fig.10a The center feed structure and Fig.10b The antenna gain characteristics of the offset feed structure at each frequency are shown in FIG. Fig.17b It is based on Fig.10a The center feed structure and Fig.10b Plot of the sidelobe levels when the beam is tilted for an offset feed configuration.

[0075] Fig.18a The structure of the electronic device 1000 is shown in which the antenna module 1100 is provided with a first type antenna and a second type antenna formed of an array antenna. Fig.18b This is a magnified view of a plurality of array antenna modules.

[0076] Fig.19The antenna modules are shown to be coupled to specific positions of the electronic device of the embodiment in different coupling structures. DETAILED DESCRIPTION

[0077] The embodiments disclosed in this specification are described in detail below with reference to the accompanying drawings. Here, the same or similar constituent elements are given the same figure marks regardless of the figure numbers, and repeated descriptions thereof will be omitted. The suffixes "module" and "unit" used in the following description for the constituent elements are only given or mixed for the convenience of writing the specification, and they themselves do not have mutually distinguishable meanings or functions. In addition, in the process of describing the embodiments disclosed in this specification, if it is determined that the specific description of the relevant known technology will cause confusion with the technical ideas of the embodiments disclosed in this specification, the detailed description thereof will be omitted. In addition, the attached drawings are only for the purpose of facilitating the understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification should not be limited by the attached drawings, but should be understood as covering all changes, equivalents and even substitutes included in the ideas and technical scope of this specification.

[0078] Terms including ordinal numbers such as first and second may be used to describe various components, but the components are not limited by the terms. The terms are used only to distinguish one component from other components.

[0079] If a certain component is mentioned as being "connected" or "coupled" to another component, it may be directly connected to or coupled to the other component, but it can also be understood that there are other components between them. Conversely, if a certain component is mentioned as being "directly connected" or "directly coupled" to another component, it should be understood that there are no other components between them.

[0080] Unless the context clearly indicates otherwise, expressions in the singular shall include expressions in the plural.

[0081] In the present application, terms such as "including" or "having" are only used to specify the existence of features, numbers, steps, operations, constituent elements, parts or their combinations recorded in the specification, and are not intended to exclude the possibility of the existence or addition of one or more other features or numbers, steps, operations, constituent elements, parts or their combinations.

[0082] The electronic devices described in this specification may include mobile phones, smart phones, laptop computers, digital broadcasting terminals, personal digital assistants (PDA), portable multimedia players (PMP), navigation, tablet computers (slate PC), tablet PCs, ultrabooks, wearable devices (for example, smart watches, smart glasses, head mounted displays (HMD)), etc.

[0083] However, anyone skilled in the art can easily understand that the configuration of the embodiments described in this specification is applicable not only to mobile terminals but also to fixed terminals such as digital TVs, desktop computers, digital signage, etc.

[0084] Figure 1 This is a diagram schematically showing an example of an entire wireless AV system including an image display device according to an embodiment of the present specification.

[0085] like Figure 1 As shown, the image display device 100 of another embodiment of the present invention is connected to a wireless AV system (or a broadcast network) and an Internet network. For example, the image display device 100 is a network TV, a smart TV, an HBBTV, etc.

[0086] On the other hand, the image display device 100 can be wirelessly connected to a wireless AV system (or broadcast network) through a wireless interface, or wirelessly or wiredly connected to an Internet network through an Internet interface. In this regard, the image display device 100 can be configured to be connected to a server or other electronic device through a wireless communication system. As an example, it is necessary for the image display device 100 to provide an 802.111ay communication service operating in the millimeter wave (mmWave) frequency band to send and receive large-capacity high-speed data.

[0087] The mmWave frequency band can be any frequency band from 10GHz to 300GHz. In the present application, the mmWave frequency band may include the 802.11ay frequency band of the 60GHz frequency band. In addition, the mmWave frequency band may include the 5G frequency band of the 28GHz frequency band or the 802.11ay frequency band of the 60GHz frequency band. The 5G frequency band can be set to approximately the 24-43GHz frequency band, and the 802.11ay frequency band can be set to the 57-70GHz or 57-63GHz frequency band, but is not limited thereto.

[0088] On the other hand, the image display device 100 can wirelessly transmit and receive data with electronic devices around the image display device 100, such as a set-top box or other electronic devices, through a wireless interface. As an example, the image display device 100 can transmit and receive wireless AV data with a set-top box or other electronic devices such as a mobile terminal configured on the front or bottom of the image display device.

[0089] For example, the image display device 100 includes a wireless interface 101b, a section filter 102b, an AIT (application information table) filter 103b, an application data processing unit 104b, a data processing unit 111b, a media player 106b, an Internet protocol processing unit 107b, an Internet interface 108b and a runtime module 109b.

[0090] AIT (Application Information Table) data, real-time broadcast content, application data and stream events are received through the broadcast interface 101b. On the other hand, the real-time broadcast content can also be named as linear AV content (Linear A / V Content).

[0091] The section filter 102b performs section filtering on the four types of data received through the wireless interface 101b, and transmits the AIT data to the AIT filter 103b, transmits the linear AV content to the data processing unit 111b, and transmits the stream event and application data to the application data processing unit 104b.

[0092] On the other hand, non-linear AV content (Non-Linear A / V Content) and application data are received through the Internet interface 108b. Non-linear AV content can also be, for example, COD (Content On Demand) application. Non-linear AV content is transmitted to the media player 106b, and application data is transmitted to the runtime module 109b.

[0093] Further, if Figure 1 As shown, for example, the runtime module 109b includes an application manager and a browser. For example, the application manager uses AIT data to control the life cycle of the interactive application. For example, the browser performs the function of displaying and processing the interactive application.

[0094] Hereinafter, a communication module having an antenna for providing a wireless interface in the aforementioned electronic device such as an image display device is described in detail. In this regard, the wireless interface used for communication between electronic devices may be a WiFi wireless interface, but is not limited thereto. As an example, for high-speed data transmission between electronic devices, a wireless interface supporting the 802.11ay standard may be provided.

[0095] The 802.11ay standard is a follow-up standard for increasing the throughput of the 802.11ad standard to more than 20 Gbps. Electronic devices that support the 802.11ay wireless interface can be configured to use a frequency band of approximately 57 to 64 GHz. The 802.11ay wireless interface can be configured to provide backward compatibility with the 802.11ad wireless interface. On the other hand, electronic devices that provide the 802.11ay wireless interface can be configured to provide coexistence with legacy devices that use the same frequency band.

[0096] Regarding the wireless environment of the 802.11ay standard, it can provide a coverage range of more than 10 meters in an indoor environment, and a coverage range of more than 100 meters in an outdoor environment with LOS (Line of Sight) channel conditions.

[0097] Electronic devices that support the 802.11ay wireless interface can be configured to provide VR headset connections, support server backup, and support cloud applications that require low latency speeds.

[0098] The short-range communication scenario, namely the Ultra Short Range (USR) communication scenario, which is a use case of 802.11ay, is a model for fast and large-capacity data exchange between two terminals. The USR communication scenario can be constructed as a fast link setup within 100msec, a transaction time within 1 second, and a 10Gbps data rate at an ultra-close distance of less than 10cm, requiring low power consumption of less than 400mW.

[0099] As a use case of 802.11ay, 8K UHD Wireless Transfer at Smart Home Usage Model can be considered. In order to stream 8K UHD content in the home, the smart home usage model can consider a wireless interface between the source device and the sink device. In this regard, the source device can be one of a set-top box, a Blu-ray player, a tablet computer, and a smart phone, and the sink device can be one of a smart TV and a display device, but is not limited to this. In this regard, the wireless interface can be configured so that the distance between the source device and the sink device is less than 5m. The coverage range transmits an uncompressed 8K UHD stream (60fps, 24 bits per pixel, minimum 4:2:2). To this end, a wireless interface can be constructed so that data is transmitted between electronic devices at a minimum speed of 28Gbps.

[0100] In order to provide such a wireless interface, embodiments of an array antenna operating in the mmWave frequency band and an electronic device having the same are described with reference to the accompanying drawings. It is clear to those skilled in the art that this specification can be implemented in other specific forms without departing from the spirit and essential features of this specification.

[0101] Figure 2 This section shows the detailed configuration of a plurality of electronic devices that support the wireless interface of this specification. Figure 2 A block diagram of an access point 110 (generally, a first wireless node) and an access terminal 120 (generally, a second wireless node) in a wireless communication system is illustrated. The access point 110 is a transmitting entity for a downlink and a receiving entity for an uplink. The access terminal 120 is a transmitting entity for an uplink and a receiving entity for a downlink. As described in this application, a "transmitting entity" is an independently operated device or apparatus capable of transmitting data through a wireless channel, and a "receiving entity" is an independently operated device or apparatus capable of receiving data through a wireless channel.

[0102] Reference Figure 1 and Figure 2 , Figure 1 The set-top box (STB) may be an access point 110, Figure 1 The electronic device 100 may be an access terminal 120, but is not limited thereto. Therefore, it should be understood that, alternatively, the access point 110 may be an access terminal, and alternatively, the access terminal 120 may be an access point.

[0103] To transmit data, the access point 110 includes a transmit data processor 220, a frame builder 222, a transmit processor 224, a plurality of transceivers 226-1 to 226-N, and a plurality of antennas 230-1 to 230-N. In addition, the access point 110 also includes a controller 234 for controlling the operation of the access point 110.

[0104] To transmit data, the access point 110 includes a transmit data processor 220, a frame builder 222, a transmit processor 224, a plurality of transceivers 226-1 to 226-N, and a plurality of antennas 230-1 to 230-N. In addition, the access point 110 also includes a controller 234 for controlling the operation of the access point 110.

[0105] In operation, the transmit data processor 220 receives data (e.g., a plurality of data bits) from the data source 215 and processes the data for transmission. For example, the transmit data processor 220 may encode the data (e.g., a plurality of data bits) into coded data and may modulate the coded data into a plurality of data symbols. The transmit data processor 220 may support a plurality of different MCS (modulation and coding schemes). For example, the transmit data processor 220 may encode the data at any one of a plurality of different coding rates (e.g., using LDPC (low-density parity check) coding). In addition, the transmit data processor 220 may modulate the coded data using any one of a plurality of different modulation schemes, including, but not limited to, BPSK, QPSK, 16QAM, 64QAM, 64APSK, 128APSK, 256QAM, and 256APSK.

[0106] The controller 234 may communicate specific instructions to the transmit data processor 220 regarding which MCS (modulation and coding scheme) to use (e.g., based on a plurality of channel conditions of the downlink). The transmit data processor 220 may encode and modulate the data from the data source 215 according to a particular MCS. It should be appreciated that the transmit data processor 220 may perform additional processing on the data, such as data scrambling and / or other processing. The transmit data processor 220 outputs a plurality of data symbols to the frame builder 222.

[0107] The frame builder 222 constructs a frame (also called a packet) and inserts a plurality of data symbols into the data payload of the frame. The frame may include a preamble, a header, and a data payload. To assist the access terminal 120 in receiving the frame, the preamble may include an STF (short training field) sequence and a CE (channel estimation) sequence. The header may include information related to the data in the payload, such as the length of the data and the MCS used to encode and modulate the data. This information allows the access terminal 120 to demodulate and decode the data. The data in the payload may be divided between a plurality of blocks, each block including a portion of the data and a GI (guard interval), which may assist the receiver in phase tracking. The frame builder 222 outputs the frame to the transmit processor 224.

[0108] For transmission on the downlink, the transmit processor 224 processes the frame. For example, the transmit processor 224 can support different transmission modes, such as OFDM (orthogonal frequency-division multiplexing) transmission mode and SC (single-carrier) transmission mode. In this example, the controller 234 can transmit an instruction specifying which transmission mode to use to the transmit processor 224, and the transmit processor 224 can process the frame for transmission based on the specified transmission mode. The transmit processor 224 can apply a spectrum mask to the frame so that the frequency composition of the downlink signal meets specific spectrum requirements.

[0109] The transmit processor 224 may support MIMO (multiple-input-multiple-output) transmission. In this form, the access point 110 may include a plurality of antennas 230-1 to 230-N and a plurality of transceivers 226-1 to 226-N (e.g., one for each antenna). The transmit processor 224 may perform spatial processing on a plurality of receive frames, and a plurality of transmit frame streams may be provided to the plurality of antennas. The plurality of transceivers 226-1 to 226-N receive and process (e.g., convert to analog, amplify, filter, and up-convert) the respective transmit frame streams, thereby generating transmit signals for transmission through the plurality of antennas 230-1 to 230-N, respectively.

[0110] To transmit data, the access terminal 120 includes a transmit data processor 260, a frame builder 262, a transmit processor 264, a plurality of transceivers 266-1 to 266-M, and a plurality of antennas 270-1 to 270-M (e.g., one antenna for each transceiver). The access terminal 120 may transmit data to the access point 110 on the uplink and / or may transmit data to other access terminals (e.g., for peer-to-peer communications). In addition, the access terminal 120 includes a controller 274 for controlling the operation of the access terminal 120.

[0111] In order to transmit through one or more antennas 270-1 to 270-M, a plurality of transceivers 266-1 to 266-M receive and process (e.g., convert to analog, amplify, filter, and up-convert) the output of the transmit processor 264. For example, the transceiver 266 can up-convert the output of the transmit processor 264 into a transmit signal having a frequency in the 60 GHz band. Therefore, the antenna module of the present specification can be configured to perform beamforming operations in the 60 GHz band, such as a frequency band of about 57 to 63 GHz. In addition, the antenna module can be configured to perform beamforming operations in the 60 GHz band and support MIMO transmission.

[0112] In this regard, the plurality of antennas 270-1 to 270-M and the plurality of transceivers 266-1 to 266-M may be implemented in an integrated form on a multi-layer circuit substrate. To this end, the antennas operating in vertical polarization among the plurality of antennas 270-1 to 270-M may be vertically arranged inside the multi-layer circuit substrate.

[0113] To receive data, the access point 110 includes a receive processor 242 and a receive data processor 244. In operation, the plurality of transceivers 226-1 through 226-N receive signals (e.g., from the access terminal 120) and spatially process (e.g., downconvert, amplify, filter, and convert to digital) the received signals.

[0114] The receive processor 242 receives the outputs of the plurality of transceivers 226-1 to 226-N, processes the plurality of outputs and recovers the plurality of data symbols. For example, the access point 110 may receive data (e.g., from the access terminal 120) in a frame. In this example, the receive processor 242 may use an STF sequence within a preamble of the frame to detect the start of the frame. In addition, the receive processor 242 may use the STF for adjusting AGC (automatic gain control). In addition, the receive processor 242 may perform channel estimation (e.g., using a CE sequence within a preamble of the frame) and may perform channel equalization on the received signal based on the channel estimation.

[0115] The receive data processor 244 receives the plurality of data symbols from the receive processor 242 and an indication of a corresponding MSC mode from the controller 234. The receive data processor 244 demodulates and decodes the plurality of data symbols, recovers the data according to the indicated MSC mode, and stores the recovered data (e.g., a plurality of data bits) and / or outputs it to the data sink 246 for additional processing.

[0116] The access terminal 120 may transmit data using an OFDM transmission mode or an SC transmission mode. In this case, the receive processor 242 may process the received signal according to the selected transmission mode. In addition, as previously described, the transmit processor 264 may support MIMO (multiple-input-multiple-output) transmission. In this case, the access point 110 includes a plurality of antennas 230-1 to 230-N and a plurality of transceivers 226-1 to 226-N (e.g., one for each antenna). Therefore, the antenna module of the present specification may be configured to perform beamforming operations in the 60 GHz band as an example, in the 57 to 63 GHz band. In addition, the antenna module may be configured to perform beamforming operations in the 60 GHz band and support MIMO transmission.

[0117] In this regard, the plurality of antennas 230-1 to 230-M and the plurality of transceivers 226-1 to 226-M may be implemented in an integrated form on a multi-layer circuit substrate. To this end, the antennas operating in vertical polarization among the plurality of antennas 230-1 to 230-M may be vertically arranged inside the multi-layer circuit substrate.

[0118] On the other hand, each transceiver receives and processes (eg, downconverts, amplifies, filters, and converts to digital) signals from each antenna. A receive processor 242 may perform spatial processing on the outputs of the plurality of transceivers 226-1 through 226-N to recover the plurality of data symbols.

[0119] In addition, the access point 110 includes a memory 236 coupled to the controller 234. The memory 236 may store commands that, when executed by the controller 234, cause the controller 234 to perform one or more of the plurality of operations described herein. Similarly, in addition, the access terminal 120 includes a memory 276 coupled to the controller 274. The memory 276 may store commands that, when executed by the controller 274, cause the controller 274 to perform one or more of the plurality of operations described herein.

[0120] On the other hand, an electronic device supporting the 802.11ay wireless interface of the present specification determines whether a communication medium can be used for communication with other electronic devices. To this end, the electronic device sends an RTS-TRN frame including an RTS (Request to Send) part and a first beam training sequence. In this regard, Figure 3a Represents the RTS (Request to Send) frame and CTS (Clear to Send) frame of this specification. In this regard, the sending device may use the RTA frame in order to determine whether the communication medium can be used to transmit one or more data frames to the destination device. In response to receiving the RTS frame, if the communication medium can be used, the destination device again transmits a CTS (Clear to Send) frame to the sending device. In response to receiving the CTS frame, the sending device transmits one or more data frames to the destination device. In response to successfully receiving one or more data frames, the destination device transmits one or more confirmation response ("ACK") frames to the sending device.

[0121] Reference Figure 3a (a), the frame 300 includes an RTS portion, which includes a frame control field 310, a duration field 312, a receiver address field 314, a transmitter address field 316, and a frame check sequence field 318. For the purpose of improving communication and reducing interference, the frame 300 also includes a beam training sequence field 320, which is used to configure the respective antennas of the destination device and one or more neighboring devices.

[0122] Reference Figure 3a (b), the CTS frame 350 includes a CTS portion, which includes a frame control field 360, a duration field 362, a receiver address field 364, and a frame check sequence field 366. For the purpose of improving communication and reducing interference, the frame 350 also includes a beam training sequence field 368, which is used to construct the respective antennas of the transmitting device and one or more neighboring devices.

[0123] The beam training sequence fields 320 and 368 may conform to a training (TRN) sequence based on IEEE 802.11ad or 802.11ay. The transmitting device may use the beam training sequence field 368 to configure its own antenna for directional transmission to the destination device. On the other hand, in order to reduce transmission interference at the destination device, the transmitting device may use the beam training sequence field to configure its own antenna. In this case, the beam training sequence field may be used to configure its own antenna to generate an antenna radiation pattern with multiple nulls for the destination device.

[0124] Therefore, a plurality of electronic devices supporting the 802.11ay wireless interface can form an initial beam using a beamforming pattern determined according to a beam training sequence to have a lower interference level between each other. Figure 3b 4 is a block diagram of a communication system 400 according to an example of the present specification. Figure 3b As shown, the first device 410 and the second device 420 can improve communication performance by aligning the directions of the main beams. On the other hand, in order to reduce interference with the third device 430, the first device 410 and the second device 420 can form a signal-null point with weak signal strength in a specific direction.

[0125] Regarding the formation of such a main beam and a signal null point, the plurality of electronic devices of the present specification may be configured to perform beamforming using an array antenna. Figure 3b Some of the plurality of electronic devices may also be configured to communicate with array antennas of other electronic devices through a single antenna. In this regard, when communicating through a single antenna, a beam pattern is formed as an omnidirectional pattern.

[0126] Reference Figure 3b , it is shown that the first device 410 to the third device 430 perform beamforming, and the fourth device 440 does not perform beamforming, but it is not limited thereto. Therefore, it can be configured that three devices among the first device 410 to the fourth device perform beamforming, and the other device does not perform beamforming.

[0127] As another example, only one of the first device 410 to the fourth device may perform beamforming, and the other three devices may not perform beamforming. As another example, two of the first device 410 to the fourth device may perform beamforming, and the other two devices may not perform beamforming. As another example, all of the first device 410 to the fourth device may perform beamforming.

[0128] Reference Figure 3a and Figure 3b , the first device 410 determines that it is the intended receiving device of the CTS-TRN frame 350 based on the address indicated in the receiver address field 364 of the CTS-TRN frame 350. In response to determining that it is the intended receiving device of the CTS-TRN frame 350, the first device 410 can selectively use the beam training sequence of the beam training sequence field 368 of the received CTS-TRN 350 to configure its own antenna for directional transmission substantially targeted at the second device 420. That is, the antenna of the first device 410 is configured to generate an antenna radiation pattern having a main lobe (e.g., the highest gain lobe) substantially targeted at the second device 420 and a non-main lobe targeted at other directions.

[0129] Since the second device 420 already knows the direction of the first device 410 based on the beam training sequence of the beam training sequence field 320 of the RTS-TRN frame 300 that it has previously received, the second device 420 can selectively configure its own antenna for directional reception (e.g., main antenna radiation lobe) for the first device 410. Therefore, during the period when the antenna of the first device 410 is configured to transmit directional signals to the second device 420 and the antenna of the second device 420 is configured to receive directional signals from the first device 410, the first device 410 transmits one or more data frames to the second device 420. As a result, the first device 410 and the second device 420 perform directional transmission / reception (DIR-TX / RX) of one or more data frames through the main lobe (main beam).

[0130] On the other hand, in order to reduce interference with the third device 430 caused by the antenna radiation pattern having the non-main lobe, the first device 410 and the second device 420 may partially modify the beam pattern of the third device 430 .

[0131] In this regard, the third device 430 determines that it is not the intended receiving device of the CTS-TRN frame 350 based on the address indicated by the receiver address field 364 of the CTS-TRN frame 350. In response to determining that it is not the intended receiving device of the CTS-TRN frame 350, the third device 430 uses the beam training sequence of the beam training sequence field 368 of the received CTS-TRN 350 and the sequence of the beam training sequence field 320 of the previously received RTS-TRN frame 300 to configure its own antenna to generate an antenna radiation pattern having a plurality of nulls substantially targeted at the second device 420 and the first device 410, respectively. The plurality of nulls may be based on the estimated arrival angles of the previously received RTS-TRN frame 300 and CTS-TRN frame 350. Generally speaking, the third device 430 generates antenna radiation patterns having desired signal power, loss, or gain for the first device 410 and the second device 420, respectively (e.g., to achieve a desired BER, SNR, SINR, and / or one or more other communication properties) in order to achieve that the estimated interference in such devices 410 and 420 becomes below a defined critical value).

[0132] The third device 430 estimates the antenna gain in the direction toward the first device 410 and the second device 420, and estimates the antenna reciprocity difference between the third device 430 and the first device 410 and the second device 420 (for example, transmitting antenna gain-receiving antenna gain). In order to determine the corresponding estimated interference in the first device 410 and the second device 420, it can form its own antenna transmit radiation pattern by calculating the above content separately in more than one sector.

[0133] The third device 430 transmits the RTS-TRN frame 300 intended for the fourth device 440, which is received by the fourth device 440. The third device 430 maintains the antenna configuration having a plurality of nulls intended for such devices as long as the first device 410 and the second device 420 communicate based on the duration indicated in the duration fields 312 and 362 of the RTS-TRN frame 300 and the CTS-TRN frame 350, respectively. Since the antenna configuration of the third device 430 is to generate a plurality of nulls intended for the first device 410 and the second device 420, reduced interference can be generated in the first device 410 and the second device 420, respectively, based on the RTS-TRN frame 300 transmitted by the third device 430.

[0134] Therefore, multiple electronic devices supporting the 802.11ay wireless interface disclosed in this specification can use array antennas to make the main beam directions consistent with each other and form a signal null direction along a specific direction to reduce interference. To this end, multiple electronic devices can form an initial beam direction through a beam training sequence and change the beam direction through a periodically updated beam training sequence.

[0135] As mentioned above, for high-speed data communication between electronic devices, the beam directions must be consistent with each other. In addition, for high-speed data communication, the loss of wireless signals transmitted to the antenna element must be minimized. For this reason, it is necessary to configure the array antenna inside the multi-layer substrate configured with the RFIC. In addition, for radiation efficiency, it is necessary to configure the array antenna adjacent to the side area inside the multi-layer substrate.

[0136] In addition, in order to adapt to changes in the wireless environment, it is necessary to update the beam training sequence between multiple electronic devices. In order to update the beam training sequence, the RFIC must periodically transmit and receive signals with a processor such as a modem. Therefore, in order to minimize the update delay time, the transmission and reception of control signals must be achieved between the RFIC and the modem in a short time. To this end, it is necessary to reduce the physical length of the connection path between the RFIC and the modem. To this end, the modem can be configured on a multi-layer substrate configured with an array antenna and an RFIC. Alternatively, the connection length between the RFIC and the modem can be minimized in a structure in which the array antenna and the RFIC are configured on a multi-layer substrate and the modem is configured on a main substrate. Regarding this, the detailed structure is described in detail. Figure 5c is described in.

[0137] Next, the electronic device of this specification having an array antenna capable of operating in the millimeter wave frequency band is described. Figure 4An electronic device is shown that is equipped with a plurality of antenna modules and a plurality of transceiver circuit modules according to an embodiment. Figure 4 , the home appliance equipped with a plurality of antenna modules and a plurality of transceiver circuit modules may be a television, but is not limited thereto. Therefore, in this specification, the home appliance equipped with a plurality of antenna modules and a plurality of transceiver circuit modules may include any home appliance or display device that supports communication services in the millimeter wave frequency band.

[0138] Reference Figure 4 The electronic device 1000 includes a plurality of antenna modules ANT1 to ANT4 and a plurality of transceiver circuit modules 1210a to 1210d. In this regard, the plurality of transceiver circuit modules 1210a to 1210d may correspond to the aforementioned transceiver circuit 1250. Alternatively, the plurality of transceiver circuit modules 1210a to 1210d may be a part of the transceiver circuit 1250 or a part of a front-end module disposed between the antenna module and the transceiver circuit 1250.

[0139] The plurality of antenna modules ANT1 to ANT4 can be composed of an array antenna configured with a plurality of antenna elements. The number of elements of the antenna modules ANT1 to ANT4 is not limited to 2, 3, 4, etc. as shown in the figure. For example, the number of elements of the antenna modules ANT1 to ANT4 can be increased to 2, 4, 8, 16, etc. In addition, the elements of the antenna modules ANT1 to ANT4 can be selected to be the same or different in number. The plurality of antenna modules ANT1 to ANT4 can be configured in different areas of the display or in the lower part or side of the electronic device. The plurality of antenna modules ANT1 to ANT4 can be configured at the top, left side, bottom and right side of the display, but are not limited to this configuration structure. As another example, the plurality of antenna modules ANT1 to ANT4 can also be configured at the upper left side, upper right side, lower left side and lower right side of the display.

[0140] The antenna modules ANT1 to ANT4 may be configured to transmit and receive signals in a specific direction at any frequency band. For example, the antenna modules ANT1 to ANT4 may operate at any frequency band of 28 GHz, 39 GHz, and 64 GHz.

[0141] The electronic device can maintain a connection state with different entities or perform data sending or receiving operations for this purpose through two or more modules among the antenna modules ANT1 to ANT4. In this regard, the electronic device equivalent to the display device can send and receive data with the first entity through the first antenna module ANT1. In addition, the electronic device can send and receive data with the second entity through the second antenna module ANT2. As an example, the electronic device can send and receive data with a mobile terminal (mobile terminal, UE) through the first antenna module ANT1. The electronic device can send and receive data with a control device such as a set-top box or AP (access point) through the second antenna module ANT2.

[0142] Data can be transmitted and received with other entities through other antenna modules, such as the third antenna module ANT3 and the fourth antenna module ANT4. As another example, dual connection or multiple input multiple output (MIMO) can be performed by at least one of the first entity and the second entity previously connected via the third antenna module ANT3 and the fourth antenna module ANT4.

[0143] The mobile terminals UE1 and UE2 are arranged in the front area of ​​the electronic device, and the mobile terminals UE1 and UE2 can be configured to communicate with the first antenna module ANT1. On the other hand, the set-top box (STB) or AP is arranged in the lower area of ​​the electronic device, and the set-top box (STB) or AP can be configured to communicate with the second antenna module ANT2, but is not limited thereto. As another example, the second antenna module ANT2 can have a first antenna radiating to the lower area and a second antenna radiating to the front area. Therefore, the second antenna module ANT2 can communicate with the set-top box (STB) or AP through the first antenna, and can communicate with one of the mobile terminals UE1 and UE2 through the second antenna.

[0144] On the other hand, one of the mobile terminals UE1 and UE2 can be configured to perform multiple-input multiple-output (MIMO) with an electronic device. As an example, UE1 can be configured to perform MIMO while performing beamforming with an electronic device. As mentioned above, an electronic device equivalent to an image display device can perform high-speed communication with other electronic devices or set-top boxes through a WiFi wireless interface. As an example, an electronic device can perform high-speed communication with other electronic devices or set-top boxes in the 60GHz frequency band through an 802.11ay wireless interface.

[0145] On the other hand, the transceiver circuit modules 1210a to 1210d can be operated to process transmission signals and reception signals in the RF frequency band. Here, the RF frequency band can be any frequency band of the millimeter frequency band such as the aforementioned 28GHz frequency band, 39GHz frequency band and 64GHz frequency band. On the other hand, the transceiver circuit modules 1210a to 1210d can be referred to as RF sub-modules (SUB-MODULE) 1210a to 1210d. At this time, the number of RF sub-modules 1210a to 1210d is not limited to four, and can be changed to any number of more than two according to the application.

[0146] In addition, the RF submodules 1210a to 1210d may have an up-conversion module and a down-conversion module for converting a signal in the RF frequency band into a signal in the IF frequency band or converting a signal in the IF frequency band into a signal in the RF frequency band. To this end, the up-conversion module and the down-conversion module may be provided with a local oscillator (LO) that can perform up-conversion and down-conversion.

[0147] On the other hand, in the plurality of RF submodules 1210a to 1210d, a signal can be transmitted from any one of the plurality of transceiver circuit modules to an adjacent transceiver circuit module, thereby enabling the transmitted signal to be transmitted at least once to all of the plurality of transceiver circuit modules 1210a to 1210d.

[0148] To this end, a data transfer path of a loop structure may be added. In this regard, through the transmission path P2 of the loop structure, adjacent RF sub-modules 1210b and 1210c may transmit signals in bi-direction.

[0149] Alternatively, a data transmission path of the feedback structure may be added. In this regard, through the data transmission path of the feedback structure, at least one submodule 1210c may transmit a signal to the remaining submodules 1210a, 1210b, and 1210c in a uni-direction.

[0150] The plurality of RF submodules may include first to fourth RF submodules 1210a to 1210d. In this regard, the signal from the first RF submodule 1210a may be transmitted to the adjacent RF submodules 1210b and the fourth RF submodule 1210d. In addition, the second RF submodule 1210b and the fourth RF submodule 1210d may transmit the signal to the adjacent third RF submodule 1210c. At this time, if the second RF submodule 1210b and the third RF submodule 1210c are connected as shown in FIG. Figure 4If the second RF submodule 1210b and the third RF submodule 1210c can transmit in both directions, the structure can be called a loop structure. On the contrary, if only one-way transmission is possible between the second RF submodule 1210b and the third RF submodule 1210c, it can be called a feedback structure. On the other hand, the signal transmitted to the third RF submodule 1210c in the feedback structure can be at least two or more.

[0151] However, the present invention is not limited to this structure. Depending on the application, the baseband module may be provided only in a specific module among the first RF sub-module 1210a to the fourth RF sub-module 1210d. Alternatively, depending on the application, the baseband module may not be provided in the first RF sub-module 1210a to the fourth RF sub-module 1210d, but may be formed by an additional control unit, namely the baseband processor 1400. As an example, the control signal transmission may also be performed only through the additional control unit, namely the baseband processor 1400.

[0152] On the other hand, the following Figure 1 The electronic device shown has Figure 2 The specific structure and function of the electronic device of the wireless interface shown are explained. It is necessary to use the communication service of the millimeter wave (mmWave) frequency band between electronic devices to send or receive data between electronic devices. In this regard, as a mmWave wireless interface, an 802.11ay wireless interface can be used to provide wireless AV (audio-video) services and / or high-speed data transmission. In this case, it is not limited to the 802.11ay wireless interface, and any wireless interface in the 60GHz frequency band can be applied. In this regard, in order to transmit high-speed data between electronic devices, a 5G or 6G wireless interface using a 28GHz frequency band or a 60GHz frequency band can also be used.

[0153] In order to transmit images at a resolution of 4K or higher, there is a problem that there is no specific solution for antennas and RFIC (radio frequency integrated chip) that provide wireless interfaces in electronic devices such as image display devices. In particular, considering that electronic devices such as image display devices are arranged on the wall of a building or on a desktop, it is necessary to send or receive wireless AV data with other electronic devices. For this reason, it is necessary to propose a specific composition and antenna structure in which area of ​​the image display device the antenna and RFIC are arranged.

[0154] Regarding this, Figure 5a The present invention relates to the structure of the multilayer circuit substrate and RFIC connected to configure the array antenna module. Specifically, the present invention relates to the structure of the AIP (Antenna In Package) module and the structure of the antenna module realized on a flexible substrate.

[0155] Reference Figure 5a (a), for mmWave frequency band communication, the AIP (Antenna In Package) module is constructed as an RFIC-PCB-antenna integrated type. In this regard, as shown in (a) of Figure 5, the array antenna module 1100-1 can be integrally formed with a multi-layer substrate (multi-layer PCB). Therefore, the array antenna module 1100-1 integrally formed with the multi-layer substrate can be called an AIP module. Specifically, the array antenna module 1100-1 can be configured in a side area of ​​the multi-layer substrate (multi-layer). In this regard, using the array antenna module 1100-1 configured in a side area of ​​the multi-layer substrate, a first beam B1 can be formed in the side area of ​​the multi-layer substrate.

[0156] On the other hand, referring to Figure 5a (b), the array antenna module 1100-2 can be configured on a multi-layer substrate. The configuration of the array antenna module 1100-2 is not limited to Figure 5a The structure of (b) can be configured on any layer inside the multi-layer substrate. In this regard, using the array antenna module 1100-2 configured on any layer of the multi-layer substrate, a second beam B2 can be formed in the front area of ​​the multi-layer substrate. In this regard, in order to minimize the distance between the RFIC and the antenna, the AIP module formed integrally with the array antenna module can configure the array antenna on the same PCB.

[0157] On the other hand, the antenna of the AIP module can be realized by a multi-layer PCB manufacturing process, and can radiate signals in the vertical / lateral direction of the PCB. In this regard, a patch antenna, a dipole / monopole antenna can be used to achieve dual polarization. Therefore, Figure 5a The first array antenna 1100-1 of (a) is configured to the side area of ​​the multi-layer substrate, and can Figure 5a The second array antenna 1100-2 of (b) is configured to the side area of ​​the multi-layer substrate. Thus, the first array antenna 1100-1 can generate the first beam B1, and the second array antenna 1100-2 can generate the second beam B2.

[0158] The first array antenna 1100-1 and the second array antenna 1100-2 can be configured to have the same polarization. Alternatively, the first array antenna 1100-1 and the second array antenna 1100-2 can be configured to have orthogonal polarizations. Operations can also be performed. In this regard, the first array antenna 1100-1 can be operated as a vertically polarized antenna or as a horizontally polarized antenna. As an example, the first array antenna 1100-1 can be a monopole antenna with vertical polarization, and the second array antenna can be a patch antenna with horizontal polarization.

[0159] on the other hand, Figure 5b The diagram is a conceptual diagram showing antenna structures having different radiation directions.

[0160] Reference Figure 5a (a) and Figure 5b (a), the radiation direction of the antenna module arranged in the side area of ​​the multilayer substrate is equivalent to the side direction. In this regard, the antenna implemented on the flexible substrate can be composed of a radiating element such as a dipole / monopole antenna. That is, the antenna implemented on the flexible substrate can be an end-fire antenna element.

[0161] In this regard, end-fire radiation can be achieved by an antenna that radiates in a direction parallel to the substrate. Such an end-fire antenna can be achieved by a dipole / monopole antenna, a Yagi-dipole antenna, a Vivaldi antenna, a SIW horn (substrate integrated waveguide horn) antenna, etc. In this regard, the Yagi-dipole antenna and the Vivaldi antenna have horizontal polarization characteristics. On the other hand, in the antenna module configured in the image display device proposed in this specification, one is required to be a vertically polarized antenna. Therefore, it is necessary to propose an antenna structure that operates with a vertically polarized antenna and can minimize the exposed portion of the antenna.

[0162] Reference Figure 5a (b) and Figure 5b (a), the radiation direction of the antenna module arranged in the front area of ​​the multi-layer substrate is equivalent to the front direction. In this regard, the antenna arranged in the AIP module can be composed of a radiating element such as a patch antenna. That is, the antenna arranged in the AIP module can be a broadside antenna element that radiates along the broadside direction.

[0163] On the other hand, the multilayer substrate in which the array antenna is arranged can be formed integrally with the main substrate or connected to the main substrate by a connector to form a module type. Figure 5c The combined structure of the multi-layer substrate and the main substrate of the embodiment is shown. Figure 5c (a) shows a structure in which the RFIC 1250 and the modem 1400 are integrally formed on the multi-layer substrate 1010. The modem 1400 may be referred to as a baseband processor 1400. Thus, the multi-layer substrate 1010 is integrally formed with the main substrate. This integral structure may be applicable to a structure in which only one array antenna module is configured in an electronic device.

[0164] On the other hand, the multi-layer substrate 1010 and the main substrate 1020 may be configured to be connected to form a module by a connector. Figure 5c (b), in this regard, the multi-layer substrate 1010 can be configured to be interfaced with the main substrate 1020 through a connector. In this case, the multi-layer substrate 1010 can be configured with an RFIC 1250, and the main substrate 1020 can be configured with a modem 1400. Thus, the multi-layer substrate 1010 can be formed by a substrate separate from the main substrate 1020, and configured to be connected through a connector.

[0165] This modular structure can be applied to a structure in which a plurality of array antenna modules are configured in an electronic device. Figure 5c (b), the multilayer substrate 1010 and the second multilayer substrate 1020 can be connected to the main substrate 1020 through a connector to achieve an interface connection. The modem 1400 configured on the main substrate 1020 is configured to be electrically connected to the RFIC1250, 1250b configured on the multilayer substrate 1010 and the second multilayer substrate 1020.

[0166] On the other hand, in the case where the AIP module is arranged at the lower part of the electronic device such as the image display device, it is necessary to perform communication with other communication modules arranged in the lower direction and the front direction. Figure 6 The present invention is a conceptual diagram of a plurality of communication modules disposed at the bottom of an image display device, the configuration of the communication module, and the communication performed with another communication module disposed in the front direction. Figure 6 (a), different communication modules 1100-1 and 1100-2 may be disposed at the bottom of the image display device 100. Figure 6 (b), the image display device 100 can communicate with the communication module 1100b configured at the bottom through the antenna module 1100. In addition, the image display device 100 can communicate with the second communication module 1100c configured at the front through the antenna module 1100. In addition, the image display device 100 can communicate with the third communication module 1100d configured at the side through the antenna module 1100.

[0167] In this regard, the communication module 1100b may be a set-top box or AP (Access point) that transmits AV data to the image display device 100 at high speed through an 802.11ay wireless interface, but is not limited to this. On the other hand, the second communication module 1100c may be any electronic device that transmits and receives data at high speed with the image display device 100 through an 802.11ay wireless interface. On the other hand, in order to perform wireless communication with a plurality of communication modules 1100b, 1100c, and 1100d arranged on the front, bottom, and sides, the antenna module 1100 having a plurality of array antennas forms beams in directions different from each other. Specifically, the antenna module 1100 can form beams in the front direction B1, the lower direction B2, and the side direction B3 through array antennas different from each other.

[0168] On the other hand, in Figure 5a In the AIP module structure shown in (a), the antenna height may increase depending on the RFIC drive circuit and heat dissipation structure. In addition, depending on the type of antenna used, Figure 5a The antenna height may be increased in the AIP module structure shown in (a). Figure 5a In the multi-layer substrate shown in (b), the antenna module structure implemented in the side area can implement the antenna in a low-profile shape.

[0169] On the other hand, Figure 1 to Figure 2 The electronic device shown can be configured in Figure 4 and Figure 6 The inside or side of an electronic device Figure 5a and Figure 5b The specific structure of the antenna module is described below.

[0170] Electronic devices such as image display devices may have a communication module including an antenna in order to communicate with surrounding electronic devices. On the other hand, recently, as the display area of ​​the image display device has expanded, the configuration space of the communication module including the antenna has decreased. As a result, the necessity of configuring an antenna inside a multilayer circuit substrate that implements the communication module is increasing.

[0171] On the other hand, as an interface for communication services between electronic devices, a WiFi wireless interface can be considered. In the case of using such a WiFi wireless interface, a millimeter wave band (mmWave) can be used for high-speed data transmission between electronic devices. In particular, a wireless interface such as 802.11ay can be used to achieve high-speed data transmission between electronic devices.

[0172] In this regard, an array antenna capable of operating in the millimeter wave (mmWave) frequency band can be installed in an antenna module. However, the antenna configured in such an antenna module and electronic components such as a transceiver circuit are electrically connected. For this purpose, the transceiver circuit is operably combined with the antenna module, and the antenna module can be composed of a multi-layer substrate.

[0173] In such a multi-layer substrate type antenna module, when the antenna element is implemented by a single layer, there is a problem that the bandwidth of the antenna element is limited. On the other hand, when multiple antenna elements are stacked on different layers, the coupling change between the multiple antenna elements may sensitively respond to frequency changes.

[0174] The purpose of this specification is to solve the above-mentioned problems and other problems. In addition, another purpose is to provide a broadband antenna module operating in the millimeter wave frequency band and an electronic device having the same.

[0175] Another object of the present specification is to increase antenna gain by improving the efficiency of antenna elements operating in the millimeter wave frequency band.

[0176] Another object of the present specification is to reduce the mutual interference level when implementing a dual-polarized antenna by reducing the current component in an undesired direction of an antenna element operating in a millimeter wave frequency band.

[0177] Another object of the present specification is to optimize antenna performance when an RFIC and an antenna element are connected via a feed line inside a PCB in the form of a multi-layer substrate.

[0178] The antenna module having the broadband antenna of this specification and the electronic device including the same are described. Figure 7a A side view of an antenna module including the broadband antenna of the present specification is shown. Figure 7b Yes means Figure 7a A diagram showing sizes and separation distances of radiators arranged on different layers and a separation distance between the radiator and the feeder in a side view of an antenna module.

[0179] on the other hand, Figure 8a Yes means Figure 7a Front view of the antenna module. Figure 8b express Figure 7a A perspective view of the antenna module.

[0180] Reference Figures 7a to 8bThe antenna module 1100 may be configured to include a first radiator 1111 and a second radiator 1112. The first radiator 1111 and the second radiator 1112 may be configured by a stacked structure configured in different layers from each other so that a portion of the multi-layer substrate 1010 overlaps. The first radiator 1111 and the second radiator 1112 may operate as a single antenna element 1110. Therefore, the first radiator 1111 or the second radiator 1112 may be configured to operate in different frequency bands from each other.

[0181] The first radiator 1111 is disposed on the inner region or upper region of the multi-layer substrate 1010 and may be formed of a first conductive layer to radiate a wireless signal. Figure 7a As shown, the first radiator 1111 can be disposed in the upper region of the multi-layer substrate 1010 , that is, the upper end, but is not limited thereto. A dielectric layer can also be disposed on the upper portion of the first radiator 1111 , so the first radiator 1111 can also be disposed in the inner region of the multi-layer substrate 1010 .

[0182] The second radiator 1112 may be configured to be offset from the center of the first radiator 1111 in the lower region of the first radiator 1111. Similar to the first radiator 1111, the second radiator 1112 may be formed of a second conductive layer to radiate a wireless signal. On the other hand, the first radiator 1111 and the second radiator 1112 may be configured to overlap on one axis. Thus, even if the feeder is connected to only one of the first radiator 1111 and the second radiator 1112, one of the first radiator 1111 and the second radiator 1112 may operate as an antenna.

[0183] like Figure 7a As shown, the second radiator 1112 as the lower radiator may be connected to the feeder 1120, but the present invention is not limited thereto. The first radiator 1111 as the upper radiator may also be connected to the feeder 1120, and the second radiator 1112 as the lower radiator may also operate as an antenna.

[0184] The antenna element 1100 disclosed in this specification, i.e., the first radiator 1111 and the second radiator 1112, can be configured to operate independently. Therefore, the first radiator 1111 and the second radiator 1112 can be configured so that the center of the second patch antenna as the second radiator 1112 is different from the center of the first patch antenna as the first radiator 1111. In other words, the configuration can be offset so that the center of the second patch antenna 1112 and the center of the first patch antenna 1111 are located at different positions from each other. In this regard, the first patch antenna 1111 and the second patch antenna 1112 can be configured to overlap only in a part of the outer contour.

[0185] The first patch antenna as the first radiator 1111 operates in a low frequency band (Low Frequency, Lf). The second patch antenna as the second radiator 1112 operates in a high frequency band (High Frequency, Hf). In this case, the first radiator 1111 and the second radiator 1112 can operate independently in frequency bands different from each other. Therefore, no resonance occurs between the first radiator 1111 and the second radiator 1112, so that the operating bandwidth of the antenna is not reduced.

[0186] Therefore, the first radiator 1111 and the second radiator 1112 may be arranged to overlap on one axis. In addition, the length of the first radiator 1111 on one axis and the length of the second radiator 1112 on one axis may be formed to be different from each other. Thus, the first radiator 1111 and the second radiator 1112 are configured to operate in different frequency bands. The first radiator 1111 may be configured to operate in the first frequency band B1 as a low frequency band. On the other hand, the second radiator 1111 may be configured to operate in the second frequency band B2 as a high frequency band.

[0187] In this regard, the second radiator 1112 may be configured so that the first radiator 1111 does not cover the entire area above the second radiator 1112. To this end, the center of the second radiator 1112 is configured to be offset from the center of the first radiator 1111. Thus, it is possible to prevent the antenna characteristics of the second radiator 1112 from being greatly changed by the first radiator 1111. Therefore, the antenna characteristics of the second radiator 1112 can be maintained almost independently of the first radiator 1111 configured on the upper portion.

[0188] On the other hand, in the case where the first radiator 1111 and the second radiator 1112 are configured without an overlapping area, the first radiator 1111 also needs to be electrically connected to an additional feeder. In this case, there is a problem that two feeders are required to feed one antenna. Therefore, in this specification, a broadband antenna structure that is fed by one feeder while allowing the first radiator 1111 and the second radiator 1112 to operate independently can be proposed.

[0189] The first radiator 1111 and the second radiator 1112 may be implemented by a first patch antenna 1111 and a second patch antenna 1112 disposed on different dielectric layers. The second patch antenna 1112 may be connected to a feed line 1120 through a signal via 1131. The signal via 1131 may be connected to the second patch antenna 1112 at a position offset from the center axis of the second patch antenna 1112. In other words, the signal via, i.e., the feed via 1131, is not connected to the center point of the second patch antenna 1112, and may be spaced apart in a direction away from the first patch antenna 1111.

[0190] Reference Figure 7a and Figure 7b The signal via 1131 connected to the second patch antenna 1112 of the antenna element 1110 disclosed in this specification can be arranged at the lower part of the ground layer G1. In this case, the signal via 1131 can penetrate the ground layer G1 in a state of being separated from each other to prevent the signal via 1131 from being electrically connected to the ground layer G1.

[0191] To this end, a groove region SR1 may be formed in the ground layer G1 so that the first pad VP1 of the plurality of pads of the signal via 1131 is disposed on the same layer as the ground layer. In addition, the signal via 1131 may be vertically connected to the feed line 1120 below the ground layer G1 through the groove region SR1.

[0192] The antenna module 1120 may include at least one lower conductive layer below the ground layer G1. In this regard, the antenna module 1120 may include a second lower conductive layer 1142, which is spaced apart from one end and the other end of the feed line 1120 at a predetermined interval below the ground layer G1 and is disposed on the same layer as the feed line 1120. In this case, the ground layer G1 above the second lower conductive layer 1142 may also be referred to as a first lower conductive layer. Therefore, the plurality of lower conductive layers 1140 may be configured to include a first lower conductive layer 1141 and a second lower conductive layer 1142.

[0193] On the other hand, the end of the second lower conductive layer 1142 separated from the end of the feed line 1120 may be an internal portion of the lower region of the second patch antenna 1112. In this regard, the region where the conductive layer is removed between the end of the feed line 1120 and the end of the second lower conductive layer 1142 may be referred to as a second slot region SR2.

[0194] The second lower conductive layer 1142 is electrically connected to the ground layer G1 and may also be implemented by the second ground layer. Alternatively, the second lower conductive layer 1142 may also be electrically separated from the ground layer G1 and implemented by a signal line.

[0195] On the other hand, the antenna module 1120 may further include a third lower conductive layer 1143 disposed at the lower portion of the feed line 1120. As described above, the ground layer G1 above the second lower conductive layer 1142 may also be referred to as the first lower conductive layer. The ground layer G1 above the second lower conductive layer 1142 may also be referred to as the first lower conductive layer. Therefore, the plurality of lower conductive layers 1140 may be configured to include the first lower conductive layer 1141, the second lower conductive layer 1142, and the third lower conductive layer 1143.

[0196] The third lower conductive layer 1143 may include a third slot region SR3 where the conductive layer is removed in a region corresponding to the lower region of the second patch antenna 1112. The length of the third slot region SR3 on one axis may be formed to be longer than the length of the plurality of pads of the signal via 1131 on one axis. Therefore, a slot region SR3 where the conductive layer is removed from the ground layer G3 at the lower end is formed at a location where the signal via connected to the second patch antenna 1112, i.e., the feed via 1131, is connected to the feed line 1120.

[0197] The third lower conductive layer 1143 may be implemented by a ground layer. Alternatively, depending on the application, the third lower conductive layer 1143 may also be implemented by a conductive layer in a floating state without being electrically connected to the ground layer. The third lower conductive layer 1143 may be implemented by a plurality of separate conductive layers, a portion of which may function as a ground layer, and the remaining portion may also function as a conductive layer in a floating state.

[0198] The area where the conductive layer is removed like this slot area SR3 can be called an open space. Due to the open space such as this slot area SR3, the resonant frequency of the antenna can be lowered to a low frequency band without increasing the size of the patch antenna. Therefore, as part of the ground area is removed, the overall height of the antenna is increased, thereby enabling broadband operation.

[0199] In addition, the plurality of lower conductive layers 1140 may be configured to include a first lower conductive layer 1141, a second lower conductive layer 1142, a third lower conductive layer 1143, and a fourth lower conductive layer 1144. The fourth lower conductive layer 1144 may be configured adjacent to the pad of the lower signal via 1133 to cover the lower region of the region where the second patch antenna 1112 is configured. The fourth lower conductive layer 1144 may be implemented by a ground layer. Alternatively, depending on the application, the fourth lower conductive layer 1144 may also be implemented by a conductive layer in a floating state without being electrically connected to the ground layer. The fourth lower conductive layer 1144 is implemented by a plurality of separate conductive layers, a portion of which may act as a ground layer, and the remaining portion may act as a conductive layer in a floating state.

[0200] On the other hand, the antenna module 1100 may further include a ground via wall 1150 composed of a plurality of pads on the upper portion of the ground layer G1. The ground via wall 1150 may include a first ground via wall 1151 and a second ground via wall 1152 disposed on both sides of an axis of the multilayer substrate 1010.

[0201] On the other hand, the shapes of the first patch antenna 1111 and the second patch antenna 1112 are implemented by quadrangular patches, but are not limited thereto, and can be implemented by patch antennas of any polygonal shape including triangular patches and quadrangular patches. Alternatively, the shapes of the first patch antenna 1111 and the second patch antenna 1112 can also be implemented by Fig.10b The circular patch antenna is realized.

[0202] The shapes of the first patch antenna 1111 and the second patch antenna 1112 may be implemented in the same shape, but may be implemented in different shapes from each other depending on the application. As an example, in order to miniaturize the antenna size, Fig.16a and Fig.16b The second patch antenna 1112 and the third patch antenna 1113 of the dual feed structure to be described in the embodiment can be implemented by circular patch antennas. On the other hand, the first patch antenna 1111 as the upper antenna can be implemented by a single antenna, and can also be implemented by a square patch antenna because there is no size limit for the antenna.

[0203] There are a plurality of antenna modules having the broadband antenna structure disclosed in this specification, and the plurality of antenna modules can be controlled by an additional processor. In this regard, Fig. 9 This diagram shows a configuration in which a transceiver circuit is connected to a baseband processor interface when the antenna element disclosed in this specification is implemented as an array antenna.

[0204] The antenna module 1100 may be configured to further include a transceiver circuit 1250. The transceiver circuit 1250 may be disposed on the antenna module 1100 formed of a multi-layer substrate.

[0205] As another example, the transceiver circuit 1250 may be configured separately from the multi-layer substrate 1010 formed in the antenna module 1100. Figure 5c , a part of the transceiver circuit 1250 and the baseband processor 1400 may also be configured on the main PCB 1020 . In this case, in order to minimize the signal loss in the mmWave frequency band, the RF front end is configured on the multi-layer substrate 1010 .

[0206] The array antennas 1110-1 and 1110-2 may include a plurality of antenna elements 1110a to 1110d. In this regard, each of the plurality of antenna elements 1110a to 1110d may include a first patch antenna 1111 operating in a first frequency band and a second patch antenna 1112 operating in a second frequency band.

[0207] The number of antenna elements of the array antennas 1110-1 and 1110-2 is not limited to four and can vary depending on the application. The array antennas 1110-1 and 1110-2 can be arranged with various numbers of antenna elements such as 1x2, 1x4, and 2x2 array antennas, and can also be implemented with single polarization or dual-polarization.

[0208] Each array antenna 1110-1, 1110-2 may be implemented by each antenna module 1100-1, 1100-2. Each antenna module 1100-1, 1100-2 may be configured with its own RFIC 1250, 1250b.

[0209] The transceiver circuits of the embodiment of the present specification, i.e., RFIC 1250, 1250b, can be operably combined with the baseband processor 1400 equivalent to a modem. When a plurality of antenna modules 1100-1, 1100-2 are configured in an electronic device, RFIC 1250, 1250b can be configured in each antenna module. Each antenna module 1100-1, 1100-2 can be configured as follows: Figure 5c In this way, wireless communication is performed with electronic devices different from each other or multiple input multiple output (MIMO) is performed.

[0210] On the other hand, due to the offset connection structure between the feed line 1120 and the second patch antenna 1112, the current distribution formed in the first patch antenna 1111 and the second patch antenna 1112 changes. In this regard, Fig.10a and Fig.10b represents the pattern formed by the center connection structure and the offset connection structure and the current distribution formed in the second patch antenna. On the other hand, Fig.11a and Fig.11b 2 is a diagram showing current distribution formed in the second patch antenna according to the center connection structure and the offset connection structure.

[0211] In this regard, the shapes of the first patch antenna 1111 and the second patch antenna 1112 are assumed to be circular patches, but are not limited thereto. The shapes of the first patch antenna 1111 and the second patch antenna 1112 may be configured as any polygonal patch including a triangular patch and a quadrangular patch.

[0212] Reference Fig.10a , the signal via, i.e., the feeding via 1131, is connected to the center point (centerpoint, CP) of the second patch antenna 1112. In this case, with the portion connected to the feeding via 1131 as the center, the current distribution of the area Ra1 close to the center is shown to be higher than the current distribution of the peripheral area Rb1 in the up and down directions. However, the current value of the peripheral area Rb1 in the up and down directions is not at a negligible level, so signal loss caused by this and interference with other antennas may occur. As described above, the pattern formed by the second patch antenna 1112 that forms a current distribution in the entire direction of the left and right directions and the up and down directions is TM 01 model.

[0213] Specifically, when the feed via 1131 is connected to the center of the second patch antenna 1112, the current generated in the second patch antenna 1112 spreads in both the vertical direction and the horizontal direction with the feed via 1131 as the center. 01 mode, which may result in performance degradation when using antenna polarization to distinguish MIMO channels in millimeter wave. Fig.10a and Fig.11a , due to the TM generated in the second patch antenna 1112 01 The up and down currents in the mode generate undesired up and down currents in the radiator and the ground.

[0214] Regarding this, Fig.10b As shown, when the offset portion of the second patch antenna 1112 is connected to the feeding via 1131 at the right portion, for example, the polarization of the electromagnetic wave radiated from the second patch antenna 1112 is formed only in the left and right directions. Fig.10b and Fig.11b, the signal via, i.e., the feed via 1131, is connected to a portion (offset point, OP) offset from the center point of the second patch antenna 1112 by a predetermined distance. In this case, the current distribution of the area Ra2 near the center, with the offset portion OP connected to the feed via 1131 as the center, is higher than the current distribution of the peripheral area Rb2. In addition, the current value of the peripheral area Rb2 is greater than Fig.11a The current value of the surrounding area Rb1 is much lower. As described above, the mode formed by the second patch antenna 1112 that forms the current distribution only in the left and right directions is TE 11 model.

[0215] However, if Fig.10a As shown in TM 01 In the mode, a current is formed on the second patch antenna 1112 in all directions of up and down / left and right. Therefore, in addition to the left and right directions, a polarization component caused by the current in the up and down directions is also generated. In this case, the signal transmitted by the polarization in the left and right directions is also transmitted by the polarization in the up and down directions. Therefore, interference may occur with the signal transmitted from the other antenna operating with the polarization in the up and down directions.

[0216] Regarding this, Fig.11a This indicates that the current value in the outer contour region Rc1 where the first and second patch antennas 1112 are not arranged is above the critical value. This is because the TM generated by the first and second patch antennas 1112 01 The up-and-down currents in the mode generate undesirable up-and-down currents in the antenna layer and the ground layer.

[0217] like Fig.10b As shown, the feed via 1131 can be connected to the second patch antenna 1112 in a direction away from the center of the first patch antenna 1111. Therefore, the dominant current distribution is formed in the left-right direction in the current generated by the second patch antenna 1112. 11 Thus, the antenna gain performance is improved by increasing the main polarization (co-polarization) radiation performance in the left and right directions instead of the cross-polarization (cross-polarization) components in the up and down directions.

[0218] Regarding this, Fig.11b It indicates that the current value in the outer contour area Rc2 where the first patch antenna and the second patch antenna 1112 are not configured is displayed as less than the critical value. This is because the first patch antenna and the second patch antenna 1112 are configured according to TE 11mode operation, and almost no undesirable up and down currents are generated in the antenna layer and the ground layer.

[0219] Fig.11a and Fig.11b 1 is a diagram showing the current distribution generated in the ground of the patch antenna according to the central connection structure and the offset connection structure as described above. Fig.11a , it can be confirmed that due to TM 01 mode, forming undesirable up-and-down currents in the ground. Therefore, in addition to the left-right main polarization (co-polarization) component, up-and-down cross-polarization components are also generated. As a result, antenna efficiency decreases and MIMO channel performance may deteriorate.

[0220] Reference Fig.11b , due to TE 11 mode, the current components in the up and down directions are attenuated and substantially eliminated. As a result, the main polarization radiation performance is increased and the antenna gain is improved. In addition, since the cross-polarization component is reduced, it can be expected that the data throughput performance will be improved due to the improvement of MIMO performance.

[0221] As described above, the antenna module 1100 may further include a ground via wall 1150 composed of a plurality of pads on the upper portion of the ground layer G1. The ground via wall 1150 may include a first ground via wall 1151 and a second ground via wall 1152 disposed on both sides of an axis of the multilayer substrate 1010.

[0222] Regarding this, Fig.12a A multi-layer substrate structure is shown in which a via wall is formed along the outer contour area of ​​an embodiment and an open space is formed in the internal ground layer. Figure 12b Various embodiments of via wall forming structures are shown.

[0223] Reference Fig.12a A ground via wall 1150 may be formed along the side region of the multi-layer substrate 1010. The ground via wall 1150 may include a first ground via wall 1151 formed along one side region and a second ground via wall 1152 formed along the other side region.

[0224] On the other hand, the ground via wall 1150 can be arranged at the frame of the multi-layer substrate 1010 with the first patch antenna 1111 as the center. Figure 7a , Figure 8a as well as Fig.12a, can be configured in at least one of the four surfaces of the upper, lower, left and right regions with the first patch antenna 1111 as the center. The ground via wall 1150 is connected to the ground layer G1, so that the antenna gain can be improved. Alternatively, the ground via wall 1150 can also be composed of a floating conductor wall composed only of a via pad, without the need for a vertical connection portion of the via.

[0225] The copper foil via pad VP may be arranged on the entire layer of the multilayer substrate 1010 or only on a part of the layer. Figure 12b (a) and Figure 12b (b), the ground via wall 1150 may include vertical connection portions VC1, VC2 ... VCn-1 and a plurality of via pads VP1, VP2 ... VPn-1. Figure 12b (a), adjacent pads among the plurality of pads VP1, VP2 ... VPn-1 may be connected to each other by one of the vertical connection portions VC1, VC2 ... VCn-1. Figure 12b (b) At least one adjacent pad among the plurality of pads VP1, VP2, ..., VPn-1 of the ground via wall 1150 may be configured not to be connected by a vertical connection portion.

[0226] As an example, the first pad VP1 and the second pad VP2 are configured to be coupled without a vertical connection portion, and the remaining pads can be connected by vertical connection portions VP2...VPn-1. However, this is not limited to this, and can be configured to be connected or not connected according to each layer. In this regard, in the case where a plurality of signal lines are arranged in an area adjacent to the via wall, the via wall can also be configured to be coupled without a vertical connection portion. On the other hand, when coupled without a vertical connection portion, a plurality of conductive layers can also form an EBG (electronic band gap) structure without being electrically connected to the ground layer. Thereby, mutual interference caused by adjacent radiators or signal lines can be reduced or deformation caused by pressure or heat applied to the multi-layer substrate 1010 can be prevented.

[0227] On the other hand, referring to Figure 12b (c) The plurality of pads VP1, VP2, ... VPn-1 of the ground via wall 1150 may also be configured to be coupled without a vertical connection portion.

[0228] Reference Figure 7a and Fig.12a, the position of the open space corresponding to the third slot region SR3 can be configured at the third ground G3 configured at the lower part of the feed line 1120 connected to the feed via 1131. Due to the influence of the open space corresponding to the third slot region SR3, the resonant frequency of the antenna is reduced, so that the antenna can be miniaturized without increasing the size. The size of the open space corresponding to the third slot region SR3 is smaller than the size of the second patch antenna 1122 connected to the feed via 1131.

[0229] on the other hand, Fig.13 This shows the reflection coefficient characteristic results depending on whether an open space such as a groove area is formed in the ground layer. Fig.13 It can be seen that (i) in the absence of an open space, resonance occurs at 69.5 GHz, and (ii) in the case where an open space is formed, the resonant frequency is adjusted downward to 60.5 GHz. Therefore, as an open space such as a slot area is formed in the ground layer, the resonant frequency of the antenna changes to a lower band. Since an open space such as a slot area is formed in the ground layer below the second patch antenna, which is the lower patch antenna, an effect of increasing the effective height of the antenna is produced. As a result, the advantage is that the resonant frequency can be adjusted lower or the antenna bandwidth can be increased without increasing the size of the antenna element in the antenna module. In addition, the advantage is that the antenna efficiency is increased by reducing the effective dielectric constant of the area where the antenna is configured.

[0230] On the other hand, in order to optimize the antenna performance, including Figure 7a The configuration intervals between the various conductive layers including the first patch antenna 1111 and the second patch antenna 1112 and the ground layer and the feed line can be as follows: Figure 7b In this regard, the size ratio and overlap ratio between the first patch antenna 1111 and the second patch antenna 1112 can be set as follows.

[0231] Reference Figure 7a and Figure 7b , the ratio b / a of the length b of the second patch antenna 1112 on one axis to the length a of the first patch antenna 1111 on one axis can be set to a range between 0.35 and 0.9. On the other hand, the ratio c / b of the overlapping length c between the first patch antenna 1111 and the second patch antenna 1112 to the length b of the second patch antenna 1112 on one axis can be set to a range less than 0.7.

[0232] Regarding this, Fig.14a The antenna gain at each frequency varies according to the overlap ratio between the first patch antenna and the second patch antenna. Fig.14a, represents the change in antenna radiation performance for the ratio c / b of the overlapping length between the first patch antenna and the second patch antenna. If the ratio c / b of the overlapping length is 0.25, the antenna gain shows a stable gain value of more than 6.5dBi in the entire frequency band of 57.2 to 70.2GHz. On the other hand, as the ratio c / b of the overlapping length approaches 0, the antenna gain decreases in the entire frequency band. As an example, if the ratio c / b of the overlapping length is 0, the antenna gain is less than 6.0dBi at 57.2GHz and less than 6.5dBi at 70.2GHz, thereby reducing the antenna performance.

[0233] On the other hand, if the ratio of the overlapping length c / b is close to 0.7, the antenna gain increases at 70.2 GHz, but gradually decreases at 57.2 GHz. Therefore, it can be seen that the ratio of the overlapping length c / b has an important influence on the antenna performance of the embodiments of this specification.

[0234] On the other hand, the offset ratio of the feeding position of the second patch antenna 1112 connected to the feed line 1120 can be set as follows: The ratio d / b of the length d from one end of the second patch antenna 1112 to the portion connected to the feed line 1120 and the length b of the second patch antenna 1112 on one axis can be set in the range of 0.5 to 1.

[0235] Regarding this, Fig.14b The antenna gain at each frequency is represented by the offset ratio of the feeding position of the second patch antenna. Fig.14b , which shows the change in antenna radiation performance for the offset ratio d / b to the location where the feeder is connected. If the offset ratio d / b is 0.8, the antenna gain shows a stable performance of more than 6.5dBi in the entire frequency band of 57.2 to 70.2GHz.

[0236] On the other hand, as the offset ratio d / b approaches 0.5, the antenna gain decreases over the entire frequency band. For example, if the offset ratio d / b is 0.5, the antenna gain is less than 5.5 dBi at 57.2 GHz and less than 6.5 dBi at 70.2 GHz, thereby reducing antenna performance.

[0237] On the other hand, if the offset ratio d / b is close to 1.0, the antenna gain gradually decreases over the entire frequency band. For example, if the offset ratio d / b is 1, the antenna gain is less than 6.5 dBi at 57.2 GHz, and the antenna performance is degraded. Therefore, it can be seen that the offset ratio d / b has an important impact on the antenna performance of the embodiments of this specification.

[0238] On the other hand, the position of the layer on which the second patch antenna 1112 is configured may be any layer between the first patch antenna 1111 and the ground layer G1. As shown in FIG7 , the position of the layer on which the second patch antenna 1112 is configured may be closer to the layer on which the first patch antenna 1111 is configured than the ground layer G1. As an example, the ratio e / f of the vertical distance e between the first patch antenna 1111 and the second patch antenna 1112 and the vertical distance f between the first patch antenna 1111 and the ground layer G1 above the feed line 1120 may be set to a range between 0.1 and 0.5. Therefore, the position of the layer on which the second patch antenna 1112 is configured may be closer to the layer on which the first patch antenna 1111 is configured than the ground layer G1.

[0239] like Fig.12a As shown, the ground via wall 1150 may be disposed on the side surface of the multi-layer substrate 1010 or adjacent to the side surface area. On the other hand, as shown in FIG. 7 , the ground via wall 1150 may be spaced apart from the side end of the multi-layer substrate 1010 by a predetermined interval.

[0240] In this regard, the distance g between the portion where the feeder is connected and the second ground via wall 1152 can be set to be less than 0.25 times the wavelength corresponding to the operating frequency of the antenna element based on the first patch antenna 1111 and the second patch antenna 1112. Similarly, the first ground via wall 1151 can also be configured to be separated from the end of the multilayer substrate 1010 by a predetermined interval. However, since the feeder is not arranged adjacent to the area where the first ground via wall 1151 is arranged, it can also be arranged on the side of the multilayer substrate 1010 or adjacent to the side area.

[0241] As mentioned above, regarding the Figure 7a and Figure 7b The configuration structure of the offset feeding structure and the offset overlapping structure of the broadband antenna, the design parameters can be expressed as the following mathematical formula 1.

[0242]

Mathematical formula 1

[0243]

[0244] As described above, the ratio b / a of the length b of the second patch antenna 1112 on one axis to the length a of the first patch antenna 1111 on one axis can be set to a range between 0.35 and 0.9. On the other hand, the ratio c / b of the overlapping length c between the first patch antenna 1111 and the second patch antenna 1112 to the length b of the second patch antenna 1112 on one axis can be set to a range less than 0.7.

[0245] In addition, the ratio d / b of the length d from one end of the second patch antenna 1112 to the portion connected to the feeder 1120 and the length b of the second patch antenna 1112 on one axis can be set to a range between 0.5 and 1. The ratio e / f of the vertical distance e between the first patch antenna 1111 and the second patch antenna 1112 and the vertical distance f between the first patch antenna 1111 and the ground layer G1 above the feeder 1120 can be set to a range between 0.1 and 0.5. The distance g between the portion connected to the feeder and the second ground via wall 1152 can be set to be less than 0.25 times the wavelength corresponding to the operating frequency of the antenna element based on the first patch antenna 1111 and the second patch antenna 1112.

[0246] On the other hand, the first radiator and the second radiator of the embodiment of this specification can be composed of patch antennas of various shapes. Figure 8a and Figure 8b As shown, it can be composed of a square patch antenna or a patch antenna of any polygonal shape. Figures 7a to 8b , the first patch antenna 1111 can be composed of a four-corner patch antenna having a first length L1 and a first width W1. In addition, the second patch antenna 1112 can be composed of a four-corner patch antenna having a second length L2 and a second width W2. In this case, the first patch antenna 1111 and the second patch antenna 1112 can be configured to overlap the third length L3 in the length direction. On the other hand, the first patch antenna 1111 and the second patch antenna 1112 can be configured to overlap their respective widths W1 and W2 in the width direction. Therefore, the first patch antenna 1111 and the second patch antenna 1112 can be configured to overlap in the region 1112b that overlaps in the length and width directions.

[0247] As another example, Fig.15 7 and 8 show the configuration of the first patch antenna and the second patch antenna implemented by a circular patch shape of another embodiment. Fig.15 The first patch antenna 1111 may be a circular patch antenna having a first diameter R1. The second patch antenna 1112 may be a circular patch antenna having a second diameter R2. The first patch antenna 1111 and the second patch antenna 1112 may be configured to overlap in an arc region 1112c having a fourth length L4 in a uniaxial direction.

[0248] On the other hand, the broadband antenna configuration disclosed in this specification can also be applied to a dual feed structure. Thus, the broadband antenna applied to the dual feed structure can be operated as a dual-polarization antenna.

[0249] Regarding this, Fig.16aA side view showing a multi-layer substrate formed by a dual-feed structure of the broadband antenna disclosed in this specification. Fig.16b A front view showing a multi-layer substrate in which the broadband antenna disclosed in this specification is constructed with a dual feed structure.

[0250] Reference Fig.16a and Fig.16b The second patch antenna 1112 may be configured such that a first portion offset in the uniaxial direction is connected to the feeder 1121 through a first signal via 1131. In this case, it can be considered that the second patch antenna 1112 is connected to the first feeder 1121 through the first signal via 1131 at the first portion.

[0251] On the other hand, the antenna module 1100 may further include a third patch antenna 1113, wherein a second portion of the third patch antenna 1113 offset in another axial direction orthogonal to the one axial direction is connected to the second feed line 1122 through a second signal via 1132. The first signal via 1131 and the second signal via 1132 may be included and referred to as a signal via 1130.

[0252] The second patch antenna 1112 and the third patch antenna 1113 may be arranged along one axis direction and another axis direction on the same layer of the multi-layer substrate 1010. On the other hand, in the case of a single feeding method, the feeder 1120 may refer to one of the first feeder 1121 and the second feeder 1122. On the other hand, in the case of a dual feeding method, the feeder 1120 may be configured to include the first feeder 1121 and the second feeder 1122.

[0253] Thus, the antenna element 1110 can radiate the first polarized signal in the second frequency band and the first frequency band due to the second patch antenna 1112 and the first patch antenna 1111 connected to the first feeder line 1121 in one axial direction. On the other hand, the antenna element 1110 can radiate the second polarized signal in the second frequency band and the first frequency band due to the third patch antenna 1113 and the first patch antenna 1111 connected to the second feeder line 1122 in another axial direction.

[0254] In this regard, the first polarization signal may be a horizontal polarization signal, and the second polarization signal may be a vertical polarization signal. The first patch antenna 1111 is implemented by a single element. On the other hand, the lower patch antenna connected to the signal vias, i.e., the feed vias 1121 and 1122, may be independently implemented by the second patch antenna 1112 and the third patch antenna 1113, respectively.

[0255] The second patch antenna 1112 and the third patch antenna 1113 may also be configured to be formed on the same layer or different layers in a manner that a portion of the area overlaps. However, if the second patch antenna 1112 and the third patch antenna 1113 overlap on the same layer, the interference level between the orthogonal polarizations may increase. On the other hand, if the second patch antenna 1112 and the third patch antenna 1113 partially overlap on different layers, antenna gain differences may occur between the dual polarizations. Therefore, the structure in which the second patch antenna 1112 and the third patch antenna 1113 are independently implemented on the same layer without overlapping is the optimal configuration structure.

[0256] Thus, the second patch antenna 1112 and the third patch antenna 1113 independently configured without overlapping on the same layer can realize orthogonal polarizations different from each other in a state where the interference level is reduced. For example, a horizontal polarization signal can be radiated by the first patch antenna 1111 and the second patch antenna 1112 configured in the right area thereof. In addition, a vertical polarization signal can be radiated by the first patch antenna 1111 and the third patch antenna 1113 configured in the upper area thereof. Therefore, the second patch antenna 1112 and the third patch antenna 1113 are independently realized without overlapping on the same layer, so as to operate with orthogonal polarizations different from each other, and therefore do not affect each other and can operate independently.

[0257] On the other hand, the first polarization signal and the second polarization signal are not limited thereto, and may be substantially orthogonal polarization signals. On the other hand, the first frequency band as the operating frequency band of the first patch antenna 1111 may be a low frequency band. On the other hand, the second frequency band as the operating frequency band of the second patch antenna 1112 and the third patch antenna 1113 may be a high frequency band.

[0258] The transceiver circuit 1250, i.e., RFIC 1250, of the embodiment of the present specification can be operably combined with the processor 1400, which is equivalent to a modem. When a plurality of antenna modules 1100-1 and 1100-2 are configured in an electronic device, RFIC 1250 and 1250b can be configured in each antenna module. Figure 5c As shown, each antenna module 1100-1, 1100-2 may be configured to perform wireless communication with different electronic devices or perform multiple-input multiple-output (MIMO).

[0259] Regarding this, refer to Figures 1 to 16b The transceiver circuit 1250 can be disposed at the bottom of the multi-layer substrate 1010 and electrically connected to the multi-layer substrate 1010 through a plurality of connection terminals.

[0260] One of the plurality of connection terminals of the transceiver circuit 1250 may be connected to the feeder 1120 through a lower signal via 1133. On the other hand, the signal via 1131 penetrating the ground layer G1 and connected to the second patch antenna 1112 may also be referred to as an upper signal via 1131. The lower signal via 1133 may be vertically connected to the other end of the feeder 1120 through a plurality of pads VP1, VP2, ..., VPn-1 and a vertical connection portion.

[0261] On the other hand, the antenna module disclosed in this specification may be composed of an array antenna composed of a plurality of antenna elements including a first radiator 1111 and a second radiator 1113. In this regard, refer to Figure 5c , Figure 7a , Fig. 9 , Fig.16a as well as Fig.16b The electronic device may further include a main PCB 1020, which is disposed inside the electronic device and operably combined with the multilayer substrate 1010. The processor 1400 disposed on the main PCB 1020 may control the transceiver circuit 1250 to enable the array antenna to radiate wireless signals to different electronic devices.

[0262] The array antennas 1110-1 and 1110-2 may be configured to include a plurality of antenna elements 1110a to 1110d. Each of the plurality of antenna elements 1110a to 1110d may be configured to include a first patch antenna 1111 and a second patch antenna 1112. In this case, the first patch antenna 1111 and the second patch antenna 1112 may be configured to operate in a first frequency band and a second frequency band, respectively. On the other hand, each of the plurality of antenna elements 1110a to 1110d may be configured to include a first patch antenna to a third patch antenna 1111, 1112, 1113. In this case, the first patch antenna 1111 may be configured to operate in a first frequency band, and the second patch antenna 1112 and the third patch antenna 1113 may operate in a second frequency band. The second patch antenna 1112 and the third patch antenna 1113 may operate with orthogonal polarizations.

[0263] The array antennas 1110 - 1 and 1110 - 2 may be arranged with various numbers of antenna elements, such as 1×2, 1×4, and 2×2 array antennas, and may also be implemented with single polarization or dual-polarization.

[0264] Considering the operating frequency band of the antenna, the processor 1400 may be controlled to change the frequency band of the signal applied to the array antenna through the transceiver circuit 1250. The processor 1400 may control the transceiver circuit 1250 to perform wireless communication using the first wireless signal of the first frequency band radiated by the first radiator 1111 in the array antenna. On the other hand, if the quality of the first wireless signal is below the critical value, the processor 1400 may perform wireless communication with other electronic devices through other frequency bands.

[0265] Thus, when the quality of the wireless signal decreases, wireless communication can be performed only by changing the frequency band without additionally performing the beamforming process again. Figure 6 As shown in (b), the electronic device 100 performs direct wireless communication with other electronic devices 1100b and 1100c without going through a base station or AP, so the electronic device 100 can directly change the frequency band without cooperating with the AP.

[0266] If the quality of the first wireless signal is below the critical value, the processor 1400 may control the transceiver circuit to perform wireless communication using the second wireless signal of the second frequency band radiated by the second radiator 1112 in the array antenna. Thus, the transceiver circuit 1250 may be configured to apply the second wireless signal of the second frequency band to the array antenna through the feeder 1120.

[0267] On the other hand, if the quality of the other second wireless signal is still below the critical value after the frequency band is changed, the first wireless signal or the second wireless signal is used to perform the following steps: Figure 3b That way the beam is formed so that the best beam direction can be selected.

[0268] The electronic device 100 having the antenna module 1100 implemented on the multi-layer substrate 1010 according to one aspect of the present specification has been described above. The antenna module 1100 implemented on the multi-layer substrate 1010 according to another aspect of the present specification will be described below.

[0269] Reference Figures 5a to 16b, the antenna module 1100 can be implemented by a multi-layer substrate 1010. The antenna module 1100 can be configured to include a first radiator 1111, a second radiator 1112 and a feedline 1120. The first radiator 1111 is configured on the inner area or upper area of ​​the multi-layer substrate 1010, and can be formed by a first conductive layer to radiate a first wireless signal in a first frequency band. The second radiator 1112 can be configured in a lower area of ​​the first radiator 1111 with an offset from the center of the first radiator 1111. The second radiator 1112 can be formed by a second conductive layer to radiate a second wireless signal in a second frequency band. The feedline 1120 can be configured to be connected to the second patch antenna 1112 through a signal via 1131.

[0270] The first radiator 1111 and the second radiator 1112 may be overlapped on one axis. The length of the first radiator 1111 and the length of the second radiator 1112 on one axis are different from each other, and the first radiator 1111 and the second radiator 1112 are configured to operate in different frequency bands, so that the antenna element 1110 can operate in a wideband.

[0271] The first radiator 1111 and the second radiator 1112 may be implemented by a first patch antenna 1111 and a second patch antenna 1112 disposed on different dielectric layers. The second patch antenna 1112 may be connected to the feeder 1120 through a signal via 1131. The signal vias 1131 and 1132 may be configured to connect to the second patch antenna 1112 and the third patch antenna 1113 at locations offset from the center of the second patch antenna 1112 on one axis.

[0272] A groove region SR1 may be formed in the ground layer G1 so that the first pad GP1 of the plurality of pads of the signal vias 1131 and 1132 is disposed on the same layer as the ground layer G1. The signal vias 1131 and 1132 may be vertically connected to the feed line 1120 below the ground layer G1 through the groove region SR1.

[0273] The antenna module 1100 may further include: a second lower conductive layer 1142, which is spaced apart from one end and the other end of the feed line 1120 by a predetermined interval and is arranged in the same layer as the feed line 1120; and a third lower conductive layer 1143, which is arranged in the lower part of the feed line 1120. The third lower conductive layer 1143 may include a third slot region SR3 in which the conductive layer is removed in an area corresponding to the lower area of ​​the second patch antenna 1112. The length of the third slot region SR3 on one axis may be formed to be longer than the length of the plurality of pads VP1, VP2 ... VPn-1 of the signal via 1131 on one axis. The third slot region SR3 is formed in the ground layer G3 equivalent to the third lower conductive layer 1143, so that the size of the antenna can be reduced. Considering that the ground layer G3 is open, the third slot region SR3 can be called an open space.

[0274] When the feed structure of the offset structure of the present specification is applied, the antenna gain can be increased and the side lobe level (SLL) can be reduced when the beam is tilted. Fig.17a It is based on Fig.10a The center feed structure and Fig.10b The antenna gain characteristics of the offset feed structure at each frequency are shown in FIG. Fig.17b It is based on Fig.10a The center feed structure and Fig.10b Plot of the sidelobe levels when the beam is tilted for an offset feed configuration.

[0275] Reference Fig.10b and Fig.17a , since the TE of the offset feeding structure is applied to a portion offset from the center of the second patch antenna 1122 as the lower antenna in the uniaxial direction, 11 mode, the antenna efficiency is improved. Fig.17a , an antenna gain improvement of about +0.5 dB can be obtained in the entire frequency band of about 13 GHz, which is equivalent to 57.2 to 70.2 GHz. As described above, when the antenna element 1110 with improved antenna gain is used to implement a 1x4 array antenna, a maximum array antenna gain of 13.9 dBi can be obtained.

[0276] Reference Fig.10b and Fig.17b In the case where an offset feeding structure is applied to a portion offset from the center of the second patch antenna 1122 as the lower antenna in the uniaxial direction, due to TE 11 mode, the cross-polarization level is reduced, and thus the radiation pattern efficiency is improved. Fig.17b , and TM 01 Compared with the center-fed array antenna in TE mode, 11The offset feed structure array antenna in mode operation also improves the sidelobe level.

[0277] As an example, in an array antenna with a center feed structure, the side lobe level SLL is SLL = 13.2-6.8 = 6.4 dB. On the other hand, in an array antenna with an offset structure, the side lobe level SLL is SLL = 13.5-3.9 = 9.6 dB. Therefore, without increasing the configuration interval between the antenna elements 1110 constituting the array antenna, a result of improving the side lobe level performance by about 3.2 dB can be obtained. As the side lobe level performance is improved, the interference effect caused by signals received from other directions can be reduced.

[0278] The side antenna 1100S or the lower antenna 1100L implemented by the multilayer impedance structure disclosed in this specification may be composed of an array antenna. In this regard, Fig.18a The structure of the electronic device 1000 is shown in which the antenna module 1100 is provided with a first type antenna and a second type antenna formed of an array antenna. Fig.18b This is a magnified view of a plurality of array antenna modules.

[0279] Reference Figures 1 to 18b , the array antenna may include a first array antenna module 1100-1 and a second array antenna module 1100-2 that is spaced apart from the first array antenna module 1100-1 in a first horizontal direction. On the other hand, the number of array antennas is not limited to two, such as Fig.18b As shown, it can also be implemented by more than three. Therefore, the array antenna can be configured to include a first array antenna module 1100-1 to a third array antenna module 1100-3. As an example, at least one array antenna module of the first array antenna module 1100-1 and the third array antenna module 1100-3 can be configured to be arranged on the side of the antenna module 1100 to form a beam in the side direction B3.

[0280] As another example, at least one of the first array antenna module 1100-1 and the third array antenna module 1100-3 can be configured to be arranged in front of the antenna module 1100 to form a beam in the front direction B1. In this regard, the first array antenna module 1100-1 and the second array antenna module 1100-2 can form a first beam and a second beam in the front direction B1, respectively. Figure 5cThe processor 1400 of the modem can be controlled to form a first beam and a second beam in a first direction and a second direction respectively using the first array antenna module 1100-1 and the second array antenna module 1100-2. That is, the first array antenna module 1100-1 can be used to form a first beam in a first direction in a horizontal direction. In addition, the second array antenna module 1100-2 can be used to form a second beam in a second direction in a horizontal direction. In this regard, the processor 1400 can perform multiple-input multiple-output (MIMO) using the first beam in the first direction and the second beam in the second direction.

[0281] Equivalent to Figure 5c and Fig. 9 The processor 1400 of the modem can be controlled to form a first beam and a second beam in a first direction and a second direction respectively using the first array antenna module 1100-1 and the second array antenna module 1100-2. That is, the first array antenna module 1100-1 can be used to form a first beam in a first direction in a horizontal direction. In addition, the second array antenna module 1100-2 can be used to form a second beam in a second direction in a horizontal direction. In this regard, the processor 1400 can perform multiple-input multiple-output (MIMO) using the first beam in the first direction and the second beam in the second direction.

[0282] The processor 1400 may form a third beam in a third direction using the first array antenna module 1100-1 and the second array antenna module 1100-2. In this regard, the processor 1400 may control the transceiver circuit 1250 to synthesize the signals received by the first array antenna module 1100-1 and the second array antenna module 1100-2. In addition, the processor 1400 may control the signals transmitted to the first array antenna module 1100-1 and the second array antenna module 1100-2 by the transceiver circuit 1250 to be distributed to the respective antenna elements. The processor 1400 may perform beamforming using a third beam having a narrower beam width than the first beam and the second beam.

[0283] On the other hand, the processor 1400 may perform multiple-input multiple-output (MIMO) using a first beam in a first direction and a second beam in a second direction, and may perform beamforming using a third beam having a narrower beam width than the first beam and the second beam. In this regard, if the quality of the first signal and the second signal received from other electronic devices around the electronic device is below a critical value, beamforming may be performed using the third beam.

[0284] The number of elements of the array antenna is not limited to 2, 3, 4, etc. as shown in the figure. For example, the number of elements of the array antenna can be increased to 2, 4, 8, 16, etc. Thus, the array antenna can be composed of 1x2, 1x3, 1x4, 1x5...1x8 array antennas.

[0285] on the other hand, Fig.19 The antenna modules are connected to each other in different connection structures at specific positions of the electronic device of the embodiment. Fig.19 (a), the antenna module 1100 may be disposed substantially horizontally with the display 151 in a lower region of the display 151. Thus, a beam B1 may be generated toward the lower direction of the electronic device through the monopole radiator. On the other hand, another beam B2 may be generated toward the front direction of the electronic device through the patch antenna.

[0286] Reference Fig.19 (b), the antenna module 1100 may be arranged substantially perpendicular to the display 151 in the lower area of ​​the display 151. Thus, a beam B2 may be generated toward the front direction of the electronic device through the monopole radiator. On the other hand, another beam B1 may be generated toward the lower direction of the electronic device through the patch antenna.

[0287] Reference Fig.19 (c), the antenna module 1100 may also be disposed inside the back housing 1001 equivalent to the mechanical structure. It may be disposed substantially parallel to the display 151 inside the back housing 1001. Thus, a beam B2 may be generated toward the lower part of the electronic device by the monopole radiator. On the other hand, another beam B3 may be generated toward the back of the electronic device by the patch antenna.

[0288] Reference Figures 1 to 19 , the array antenna modules 1100 - 1 to 1100 - 3 implemented on the multi-layer substrate 1010 of the embodiment of this specification are described.

[0289] The array antenna modules 1100-1 to 1100-3 can be implemented by a multi-layer substrate 1010. The antenna module 1100 can be configured to include a first radiator 1111, a second radiator 1112, and a feedline 1120. The first radiator 1111 is configured on the inner area or upper area of ​​the multi-layer substrate 1010, and can be formed by a first conductive layer to radiate a first wireless signal of a first frequency band. The second radiator 1112 can be configured in the lower area of ​​the first radiator 1111 with an offset from the center of the first radiator 1111. The second radiator 1112 can be formed by a second conductive layer to radiate a second wireless signal of a second frequency band. The feedline 1120 can be configured to be connected to the second patch antenna 1112 through a signal via 1131.

[0290] The first radiator 1111 and the second radiator 1112 may overlap on one axis. The lengths of the first radiator 1111 and the second radiator 1112 on one axis are different from each other, and the first radiator 1111 and the second radiator 1112 operate in different frequency bands, so that the antenna element 1110 can operate in a wideband.

[0291] The first radiator 1111 and the second radiator 1112 may be implemented by a first patch antenna 1111 and a second patch antenna 1112 disposed on different dielectric layers. The second patch antenna 1112 may be connected to the feeder 1120 through a signal via 1131. The signal vias 1131 and 1132 may be configured to connect to the second patch antenna 1112 and the third patch antenna 1113 at locations offset from the center of the second patch antenna 1112 on one axis.

[0292] A groove region SR1 may be formed in the ground layer G1 so that the first pad GP1 of the plurality of pads of the signal vias 1131 and 1132 is disposed on the same layer as the ground layer G1. The signal vias 1131 and 1132 may be vertically connected to the feed line 1120 below the ground layer G1 through the groove region SR1.

[0293] The array antenna modules 1100-1 to 1100-3 may further include: a second lower conductive layer 1142, which is spaced apart from one end and the other end of the feed line 1120 by a predetermined interval and is arranged in the same layer as the feed line 1120; and a third lower conductive layer 1143, which is arranged in the lower part of the feed line 1120. The third lower conductive layer 1143 may include a third slot region SR3 in which the conductive layer is removed in an area corresponding to the lower area of ​​the second patch antenna 1112. The length of the third slot region SR3 on one axis may be formed to be longer than the length of the plurality of pads VP1, VP2 ... VPn-1 of the signal via 1131 on one axis. The third slot region SR3 is formed in the ground layer G3 equivalent to the third lower conductive layer 1143, so that the antenna size can be reduced. Considering that the ground layer G3 is open, the third slot region SR3 can be called an open space.

[0294] The broadband antenna module operating in the millimeter wave frequency band and the electronic device including the same are described above. The technical effects of the broadband antenna module operating in the millimeter wave frequency band and the electronic device including the same are described as follows.

[0295] According to the embodiment, a broadband antenna module operating in a millimeter wave frequency band by causing a plurality of stacked radiators to independently operate and an electronic device having the same may be provided.

[0296] According to the embodiment, an offset feeding structure is applied to the lower radiator, so that the antenna gain can be improved by improving the efficiency of the antenna element operating in the millimeter wave frequency band.

[0297] According to the embodiment, an open space such as a slot region is arranged at the lower portion of the feeder line, so that the antenna gain can be improved by improving the efficiency of the antenna element.

[0298] According to the embodiment, an offset feeding structure is applied to the lower radiator, thereby being able to reduce a current component in an undesired direction of an antenna element operating in a millimeter wave frequency band.

[0299] According to the embodiment, by applying an offset feeding structure to the lower radiator, the mutual interference level when implementing a dual-polarization antenna can be reduced.

[0300] According to the embodiment, in the case where the RFIC and the antenna element are connected through a feeding line inside a PCB in the form of a multi-layer substrate, the antenna performance can be optimized by optimizing the shape and connection position of the feeding via structure.

[0301] The following detailed description will further clarify the scope of the additional application of this specification. However, since a person skilled in the art can clearly understand the various changes and modifications within the concept and scope of this specification, it should be understood that the specific embodiments of the preferred embodiments described in detail and this specification are only examples.

[0302] The additional scope to which this specification is applicable will become clear from the following detailed description. However, those skilled in the art can clearly understand the various changes and modifications within the concept and scope of this specification, so it should be understood that the detailed description and specific embodiments such as the preferred embodiments of this specification are only examples. In connection with the aforementioned present specification, the design of an antenna operating in a millimeter wave frequency band and an electronic device controlling the antenna and its driving can be implemented by a computer-readable code in a medium recording a program.

[0303] Computer-readable media include all types of storage devices storing data that can be read by a computer system. Examples of computer-readable media include HDD (Hard Disk Drive), solid-state drive (SolidState Disk), SDD (Silicon Disk Drive), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, etc., and can also be implemented in the form of a carrier wave (e.g., Internet-based transmission). In addition, the computer may also include a control unit of a terminal. Therefore, the detailed description described above should not be construed as restrictive in all aspects, but should be understood as exemplary. The scope of this specification should be determined by a reasonable interpretation of the attached claims, and all changes within the equivalent scope of this specification should fall within the scope of this specification.

Claims

1. An antenna module, comprising a multi-layer substrate, wherein: The multi-layer substrate comprises: a grounding region including a plurality of lower conductive layers electrically connected to the ground; and Antenna area; The antenna area includes: A first patch radiator is arranged in a first area of ​​the multi-layer substrate; A second patch radiator is arranged in a second area of ​​the multi-layer substrate and is arranged below the first patch radiator and offset from the center of the first patch radiator; a feed line connected to the second patch radiator through a signal via; and The first ground via wall and the second ground via wall each include a plurality of ground via pads electrically connected to the plurality of lower conductive layers; The signal via is connected to the second patch radiator at a connection position offset from the center of the second patch radiator, The first patch radiator and the second patch radiator overlap on one axis, The first ground via wall is arranged opposite to the second ground via wall with the first patch radiator as a reference. The second patch radiator is arranged between the first patch radiator and the second ground via wall. The connection portion is arranged between the center of the second patch radiator and the second ground via wall. One end of the second patch radiator is arranged opposite to the connection portion with the center of the second patch radiator as a reference. A ratio d / b of a length d from the one end portion of the second patch radiator to the connection portion to a length b of the second patch radiator is set in a range between 0.5 and 1.

2. The antenna module according to claim 1, wherein: The plurality of lower conductive layers of the grounding region include a first lower conductive layer and a second lower conductive layer disposed below the first lower conductive layer. The multi-layer substrate includes a groove region, the groove region being arranged between the first lower conductive layer and a first pad of a plurality of signal via pads of the signal via arranged in the same layer as the first lower conductive layer, The signal via extends through the groove region and is vertically connected to the feeding line at a lower portion of the first lower conductive layer.

3. The antenna module according to claim 2, wherein: The second lower conductive layer is separated from one end of the feeder line and is arranged on the same layer as the feeder line. One end of the second lower conductive layer, which is spaced apart from one end of the feeder line, is disposed below the second patch radiator.

4. The antenna module according to claim 2, wherein: The multi-layer substrate further includes a second groove region disposed between the second lower conductive layer and one end portion of the feed line.

5. The antenna module according to claim 2, wherein: The multi-layer substrate further includes a third groove region disposed at the lower portion of the second patch radiator. The plurality of lower conductive layers further include a third lower conductive layer disposed at a lower portion of the feed line and adjacent to the third slot region. The length of the third groove region is formed to be longer than the length of each of the plurality of signal via pads of the signal via.

6. The antenna module according to claim 2, wherein: The first ground via wall includes a plurality of first ground via pads disposed on the upper portion of the first lower conductive layer. The second ground via wall includes a plurality of second ground via pads disposed on an upper portion of the first lower conductive layer.

7. The antenna module according to claim 2, wherein: A distance g between the connection portion of the feed line and the second ground via wall is greater than 0 times a wavelength corresponding to an operating frequency of an antenna element formed by the first patch radiator and the second patch radiator, and is less than 0.25 times the wavelength.

8. An electronic device having an antenna module, wherein: include: A transceiver circuit is arranged on the antenna module formed by a multi-layer substrate; as well as A main PCB, disposed inside the electronic device and operably combined with the multi-layer substrate; The multi-layer substrate comprises: a grounding region including a plurality of lower conductive layers electrically connected to the ground; and Antenna area; The antenna area includes: A first patch radiator is arranged in a first area of ​​the multi-layer substrate; A second patch radiator is arranged in a second area of ​​the multi-layer substrate and is arranged below the first patch radiator and offset from the center of the first patch radiator; a feed line connected to the second patch radiator through a signal via; and The first ground via wall and the second ground via wall each include a plurality of ground via pads electrically connected to the plurality of lower conductive layers; The signal via is connected to the second patch radiator at a connection position offset from the center of the second patch radiator, The first patch radiator and the second patch radiator overlap on one axis, The first ground via wall is arranged opposite to the second ground via wall with the first patch radiator as a reference. The second patch radiator is arranged between the first patch radiator and the second ground via wall. The connection portion is arranged between the center of the second patch radiator and the second ground via wall. One end of the second patch radiator is arranged opposite to the connection portion with the center of the second patch radiator as a reference. A ratio d / b of a length d from the one end portion of the second patch radiator to the connection portion to a length b of the second patch radiator is set in a range between 0.5 and 1.

9. The electronic device according to claim 8, wherein: The antenna module is an array antenna among a plurality of antenna modules of the electronic device. The electronic device further includes a processor, which is configured on the main PCB and controls the transceiver circuit so that the array antenna radiates wireless signals to other electronic devices.

10. The electronic device according to claim 8, wherein: The plurality of lower conductive layers of the grounding region include a first lower conductive layer and a second lower conductive layer disposed below the first lower conductive layer. The multi-layer substrate includes a groove region, the groove region being arranged between the first lower conductive layer and a first pad of a plurality of signal via pads of the signal via arranged in the same layer as the first lower conductive layer, The signal via extends through the groove region and is vertically connected to the feeding line at a lower portion of the first lower conductive layer.

Images