Pressure maintaining equipment
By using a double pressure-retaining mechanism after the circuit board is filmed, the pressure is applied to the center and edge areas of the circuit board, the problem of untight edge bonding is solved, the production pass rate and protection effect are improved, and the cost is reduced.
Patent Information
- Application Number
- CN202411501311.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2044-10-25
AI Technical Summary
In the prior art, during the pressure-keeping process of circuit board filming, the edge area is not tightly bonded, resulting in problems such as curling edges and falling off, affecting the protective effect and production pass rate, and increasing costs.
A pressure holding device is designed, and a double pressure holding mechanism is used to tighten the central area of the circuit board through the first pressure holding mechanism, and a second pressure holding mechanism with grooves is used to apply pressure to the edge area in a targeted manner to ensure that The edge area is closely fitted with the protective film.
It effectively solves the problem of untightly bonding of edges, significantly improves production pass rate, reduces costs, and ensures the overall protection effect of the circuit board.
Smart Images

Figure CN119300257A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of circuit board film pasting, and in particular to a pressure maintaining device. Background Art
[0002] In the manufacturing process of electronic products, circuit boards are core components, and their surfaces often need to be treated with film to protect the circuits from environmental factors such as dust and moisture, while improving the insulation and durability of the circuit boards. After the filming operation is completed, in order to ensure that the protective film fits tightly with the circuit board without bubbles remaining, it is also necessary to perform a pressure-maintaining treatment, that is, to maintain a certain pressure for a period of time so that the protective film is fully in contact with the circuit board surface and solidifies.
[0003] At present, the existing technical solution is to use automated equipment to perform a pressure holding operation after film application to physically fit the protective film tightly to the surface of the circuit board. This pressure holding is usually performed immediately after film application, using pressure to expel the air in the protective film and preliminarily fix the position of the protective film.
[0004] However, this pressure-maintaining technical solution is not effective in dealing with the edge processing of the film. Since the edge area is subjected to dispersed forces and a small gap is easily generated due to the elastic retraction of the protective film, the edge position is not tightly bonded, resulting in warping and falling off. This not only affects the overall protection effect of the circuit board, but also directly reduces the production qualification rate and increases the cost of rework and repair in the later stage. Summary of the invention
[0005] The main purpose of the present invention is to provide a pressure-maintaining device and a processing system, aiming to solve the problem that the edge of the protective film is not tightly bonded, so as to improve the production qualification rate and reduce the cost.
[0006] To achieve the above object, the present invention provides a pressure-maintaining device for pressing a protective film against a circuit board, wherein the circuit board has an edge region and a central region protruding from the circuit board, and the protective film is attached to both the edge region and the central region. The pressure-maintaining device comprises:
[0007] abutment;
[0008] A transmission mechanism, the transmission mechanism is arranged on the base, the transmission mechanism forms a transmission channel extending along a first direction, the transmission channel is used to transport the circuit board, and the transmission channel has a first pressure holding position and a second pressure holding position arranged along the first direction;
[0009] a first pressure-keeping mechanism, wherein the first pressure-keeping mechanism is disposed on the base and corresponds to the first pressure-keeping position, the first pressure-keeping mechanism is provided with a first pressure-keeping area, and the first pressure-keeping mechanism pressurizes the central area through the first pressure-keeping area so that the first pressure-keeping area fits the central area; and
[0010] The second pressure-holding mechanism is arranged on the base and corresponds to the second pressure-holding position. The second pressure-holding mechanism is provided with a second pressure-holding area and a groove opened in the second pressure-holding area. The second pressure-holding mechanism holds pressure on the edge area through the second pressure-holding area so that the second pressure-holding area fits with the edge area and the center area enters the groove.
[0011] In one embodiment, the first pressure maintaining mechanism includes:
[0012] A first base, which is disposed on the base and corresponds to the first pressure-maintaining position;
[0013] a first driving module, the first driving module being disposed on the first base; and
[0014] A first pressure-maintaining plate, wherein the first pressure-maintaining plate is disposed at the output end of the first driving module, a side of the first pressure-maintaining plate facing the transmission channel is a pressure-maintaining surface, and the pressure-maintaining surface forms the first pressure-maintaining area;
[0015] The first driving module drives the first pressure-maintaining plate to approach or move away from the transmission channel so that the pressure-maintaining surface fits the central area.
[0016] In one embodiment, the first base includes a first pillar and a first support plate, the first pillar is arranged on the base, the first support plate is movably connected to the first pillar, and the first driving module is arranged on the first support plate;
[0017] The first pressure-maintaining mechanism further includes a first adjusting module, which is disposed on the first support column and connected to the first supporting plate;
[0018] The first adjustment module drives the first support plate to move along the extension direction of the first support column to adjust the distance between the first pressure maintaining plate and the transmission channel.
[0019] In one embodiment, the central area is provided with an element, and the pressure maintaining surface is also provided with an avoidance groove, and the avoidance groove cooperates with the element in the central area so that when the pressure maintaining surface is in contact with the central area, the element enters the avoidance groove.
[0020] In one embodiment, the second pressure maintaining mechanism includes:
[0021] a second base, the second base being disposed on the base and corresponding to the second pressure-maintaining position;
[0022] a second driving module, the second driving module being disposed on the second base; and
[0023] A second pressure-maintaining plate, the second pressure-maintaining plate is arranged at the output end of the second driving module, a pressure-maintaining block is arranged at an edge of a side of the second pressure-maintaining plate close to the circuit board, the pressure-maintaining block forms the second pressure-maintaining area, and the pressure-maintaining block is arranged to form the groove;
[0024] The second driving module drives the second pressure maintaining plate so that the pressure maintaining block fits the edge area and the center area enters the groove.
[0025] In one embodiment, the second base includes a second pillar and a second support plate, the second pillar is arranged on the base, the second support plate is movably connected to the second pillar, and the second driving module is arranged on the second support plate;
[0026] The second pressure-maintaining mechanism further includes a second adjusting module, the second adjusting module is disposed on the second support column, and the second adjusting module is connected to the second supporting plate;
[0027] The second adjustment module drives the second support plate to move along the extension direction of the second support column to adjust the distance between the second pressure maintaining plate and the transmission channel.
[0028] In one embodiment, the transmission mechanism comprises:
[0029] A frame, the frame is arranged on the base, and the frame is provided with the transmission channel;
[0030] Two lifting assemblies, which are spaced apart from each other on the base and correspond to the first pressure-maintaining position and the second pressure-maintaining position respectively, and each of the lifting assemblies is provided with a lifting surface located in the transmission channel; and
[0031] A limiter, the limiter is arranged on the base and spaced apart from the lifting assembly, and two limiters are provided, the two limiters correspond to the first pressure-maintaining position and the second pressure-maintaining position respectively, and the limiter is provided with a limiter plate that moves relative to the transmission channel;
[0032] The limiting member drives the limiting plate to extend into the transmission channel to prevent the movement of the circuit board, and the lifting assembly drives the lifting surface to approach the transmission channel to make the circuit board detach from the transmission channel.
[0033] In one embodiment, the lifting assembly comprises:
[0034] A lifting driving member, the lifting driving member is arranged on the base, corresponding to the first pressure-keeping position or the second pressure-keeping position; and
[0035] A lifting seat, the lifting seat is arranged at the output end of the lifting driving member, and the lifting surface is arranged on a side of the lifting seat facing the transmission flow channel;
[0036] The lifting drive member drives the lifting seat to drive the circuit board to move in a vertical direction.
[0037] In one embodiment, the transmission mechanism is provided with two transmission channels, both of which extend along the first direction, and each of the transmission channels is provided with a first pressure-maintaining position and a second pressure-maintaining position;
[0038] The pressure-maintaining device includes two of the first pressure-maintaining mechanisms and two of the second pressure-maintaining mechanisms. Each of the first pressure-maintaining mechanisms corresponds to a first pressure-maintaining position, and each of the second pressure-maintaining mechanisms corresponds to a second pressure-maintaining position.
[0039] In one embodiment, the pressure-maintaining device further comprises a feeding mechanism movably disposed on the base, the feeding mechanism being provided with a feeding space, the feeding mechanism being located at one end of the transmission flow channel and moving along the second direction so that the feeding space is correspondingly connected to any of the transmission flow channels;
[0040] And / or, the pressure-maintaining device also includes a material unloading mechanism movably arranged on the base, the material unloading mechanism is provided with a material unloading space, the material unloading mechanism is located at the other end of the transmission channel, and moves along the second direction so that the material unloading space is correspondingly connected with any of the transmission channels.
[0041] The technical solution of the present invention can respectively press the center area and edge area of the circuit board through the dual pressure-holding mechanism of the first pressure-holding mechanism and the second pressure-holding mechanism. The first pressure-holding mechanism ensures that the protective film in the center area is tightly attached to the circuit board, and the second pressure-holding mechanism uses the second pressure-holding area with a groove, so that during the pressure-holding process of the second pressure-holding mechanism, the center area enters the groove to avoid being subjected to pressure, and pressure is applied to the edge area in a targeted manner, thereby effectively solving the problem of loose bonding at the edge position, significantly improving the production qualification rate, and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0042] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0043] Figure 1 A schematic structural diagram of an embodiment of a pressure-maintaining device provided by the present invention;
[0044] Figure 2 for Figure 1 A schematic structural diagram of the first pressure-maintaining mechanism;
[0045] Figure 3 for Figure 2 A structural schematic diagram of a part of the structure of the first pressure-maintaining mechanism;
[0046] Figure 4 for Figure 1 A schematic structural diagram of the second pressure-maintaining mechanism;
[0047] Figure 5 for Figure 4 A structural schematic diagram of a partial structure of the second pressure-maintaining mechanism;
[0048] Figure 6 for Figure 1 A schematic diagram of the structure of the transmission mechanism in FIG.
[0049] Figure 7 for Figure 6 A schematic diagram of the structure of the rack in FIG.
[0050] Figure 8 for Figure 6 A schematic diagram of the structure of the limiting member in FIG.
[0051] Fig. 9 for Figure 6 A schematic diagram of the structure of the lifting assembly in FIG.
[0052] Fig.10 for Figure 1 Schematic diagram of the structure of the feeding mechanism.
[0053] Description of Figure Numbers:
[0054] 100, pressure-maintaining device; 1, base; 11, adjustment foot; 2, transmission mechanism; 21, frame; 211, transmission channel; 212, bracket; 2121, detection sensor; 213, transmission belt; 214, transmission drive; 22, lifting assembly; 221, lifting seat; 2211, limit block; 222, lifting drive; 23, limit member; 231, limit plate; 232, limit drive; 3, first pressure-maintaining mechanism; 31, first base; 311, first pillar; 312, first support plate; 32, first drive module; 33, first Pressure-maintaining plate; 331, pressure-maintaining surface; 332, avoidance groove; 34, first adjusting module; 341, connecting piece; 35, first pressure-maintaining area; 4, second pressure-maintaining mechanism; 41, second base; 411, second pillar; 412, second support plate; 42, second driving module; 43, second pressure-maintaining plate; 431, pressure-maintaining block; 432, groove; 44, second adjusting module; 45, second pressure-maintaining area; 5, feeding mechanism; 51, slide rail; 52, slide seat; 53, transmission belt; 54, feeding drive; 55, position sensor; 6, unloading mechanism.
[0055] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0056] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0057] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.
[0058] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.
[0059] In the manufacturing process of electronic products, circuit boards are core components, and their surfaces often need to be treated with film to protect the circuits from environmental factors such as dust and moisture, while improving the insulation and durability of the circuit boards. After the filming operation is completed, in order to ensure that the protective film fits tightly with the circuit board without bubbles remaining, it is also necessary to perform a pressure-maintaining treatment, that is, to maintain a certain pressure for a period of time so that the protective film is fully in contact with the circuit board surface and solidifies.
[0060] At present, the existing technical solution is to perform a one-time pressure holding operation through automated equipment after film application to physically fit the protective film tightly to the surface of the circuit board. This pressure holding is usually performed immediately after film application, using pressure to expel the air in the protective film and preliminarily fix the position of the protective film.
[0061] However, this technical solution of only maintaining pressure once is not enough to deal with the edge processing of the film. Since the edge area is more dispersed in force and a small gap is easily generated due to the elastic retraction of the protective film, the edge position is not tightly bonded, and problems such as warping and falling off occur. This not only affects the overall protection effect of the circuit board, but also directly reduces the production qualification rate and increases the cost of later rework and maintenance.
[0062] The present invention provides a pressure-maintaining device 100, which aims to solve the problem that the edge of the protective film is not tightly bonded, so as to improve the production qualification rate and reduce the cost.
[0063] See also Figures 1 to 10In one embodiment of the present invention, a pressure-holding device 100 is used to press a protective film against a circuit board. The circuit board has an edge area and a central area protruding from the circuit board. The edge area and the central area are both affixed with a protective film. The pressure-holding device 100 includes a base 1, a transmission mechanism 2, a first pressure-holding mechanism 3, and a second pressure-holding mechanism 4. The transmission mechanism 2 is disposed on the base 1. The transmission mechanism 2 is formed with a transmission channel 211 extending along a first direction. The transmission channel 211 is used to transport the circuit board. The transmission channel 211 has a first pressure-holding position and a second pressure-holding position arranged along the first direction. The first pressure-holding mechanism 3 is disposed on the base 1 and corresponds to the first pressure-holding position. The first pressure-holding mechanism 3 is provided with a first pressure-holding area 35. The first pressure-holding mechanism 3 pressurizes the central area through the first pressure-holding area 35 so that the first pressure-holding area 35 fits the central area. The second pressure-holding mechanism 4 is arranged on the base 1 and corresponds to the second pressure-holding position. The second pressure-holding mechanism 4 is provided with a second pressure-holding area 45 and a groove 432 opened in the second pressure-holding area 45. The second pressure-holding mechanism 4 holds pressure on the edge area through the second pressure-holding area 45 so that the second pressure-holding area 45 is fitted with the edge area, and the center area enters the groove 432.
[0064] In this embodiment, the pressure-maintaining device 100 can respectively press the central area and the edge area of the circuit board through the dual pressure-maintaining mechanism of the first pressure-maintaining mechanism 3 and the second pressure-maintaining mechanism 4. The first pressure-maintaining mechanism 3 ensures that the protective film in the central area is tightly attached to the circuit board, and the second pressure-maintaining mechanism 4 uses the second pressure-maintaining area 45 with the groove 432, so that during the pressure-maintaining process of the second pressure-maintaining mechanism 4, the central area enters the groove 432 to avoid being subjected to pressure, and pressure is applied to the edge area in a targeted manner, thereby effectively solving the problem of loose bonding at the edge position, significantly improving the production qualification rate, and reducing costs.
[0065] In one embodiment, the first pressure-maintaining mechanism 3 includes a first base 31, a first driving module 32 and a first pressure-maintaining plate 33. The first base 31 is disposed on the base 1 and corresponds to the first pressure-maintaining position. The first driving module 32 is disposed on the first base 31. The first pressure-maintaining plate 33 is disposed at the output end of the first driving module 32, and the side of the first pressure-maintaining plate 33 facing the transmission channel 211 is a pressure-maintaining surface 331, and the pressure-maintaining surface 331 forms a first pressure-maintaining area 35. The first driving module 32 drives the first pressure-maintaining plate 33 to approach or move away from the transmission channel 211 so that the pressure-maintaining surface 331 fits the central area.
[0066] Understandable, see Figure 2 and Figure 3 The first driving module 32 drives the first pressure-maintaining plate 33 to move so that the pressure-maintaining surface 331 abuts against the circuit board, thereby pressing the protective film in the central area against the circuit board.
[0067] In this embodiment, the circuit boards are loaded in a tray, and the tray is transported to various locations. Each tray is loaded with two circuit boards. In order to ensure that the protective film on each circuit board can be firmly pressed during the pressure holding process, four groups of first drive modules 32 are arranged in parallel, and two adjacent first drive modules 32 drive the corresponding two first pressure holding plates 33 to press a circuit board. Of course, the number of circuit boards loaded on each tray is different, and different numbers of first drive modules 32 and first pressure holding plates 33 can also be set accordingly, which is not limited here.
[0068] In one embodiment, the first base 31 includes a first pillar 311 and a first support plate 312, the first pillar 311 is disposed on the base 1, the first support plate 312 is movably connected to the first pillar 311, the first driving module 32 is disposed on the first support plate 312, and the first pressure-maintaining mechanism 3 also includes a first adjustment module 34, the first adjustment module 34 is disposed on the first pillar 311, and the first adjustment module 34 is connected to the first support plate 312. The first adjustment module 34 drives the first support plate 312 to move in the vertical direction to adjust the distance between the first pressure-maintaining plate 33 and the circuit board.
[0069] Understandable, see Figure 2 and Figure 3 The output end of the first adjustment module 34 is connected to the first support plate 312 through the connector 341. The first adjustment module 34 can drive the first support plate 312 to move in the vertical direction, thereby driving the first driving module 32 and the first pressure-maintaining plate 33 to move closer to or away from the circuit board, and changing the distance between the first pressure-maintaining plate 33 and the circuit board. In this way, the pressure-maintaining device 100 is applicable to circuit boards of different thicknesses, thereby improving the versatility and flexibility of the pressure-maintaining device 100.
[0070] In one embodiment, the central area is provided with an element, and the pressure maintaining surface 331 is also provided with an avoidance groove 332 , which cooperates with the element in the central area so that when the pressure maintaining surface 331 is in contact with the central area, the element enters the avoidance groove 332 .
[0071] In this embodiment, please refer to Figure 3 There are also some components in the central area of the circuit board, and there is no protective film on the surface of these components, or these components are relatively fragile and cannot be pressed. Therefore, an avoidance groove 332 is also provided on the pressure holding surface 331, so that the components can enter the avoidance groove 332 during the pressure holding process, thereby avoiding being pressed.
[0072] In one embodiment, the second pressure-maintaining mechanism 4 includes a second base 41, a second driving module 42 and a second pressure-maintaining plate 43. The second base 41 is arranged on the base 1 and corresponds to the second pressure-maintaining position. The second driving module 42 is arranged on the second base 41. The second pressure-maintaining plate 43 is arranged at the output end of the second driving module 42, and a pressure-maintaining block 431 is arranged on the edge of one side of the second pressure-maintaining plate 43 close to the circuit board, and the pressure-maintaining block 431 forms a second pressure-maintaining area 45, and the pressure-maintaining block 431 is surrounded to form a groove 432. Among them, the second driving module 42 drives the second pressure-maintaining plate 43 so that the pressure-maintaining block 431 fits the edge area and the center area enters the groove 432.
[0073] In this embodiment, please refer to Figure 4 and Figure 5 The second pressure-maintaining mechanism 4 has a similar structure to the first pressure-maintaining mechanism 3, and will not be described in detail here. However, it should be noted that a pressure-maintaining block 431 is provided at the edge of the second pressure-maintaining plate 43 close to the circuit board, and the pressure-maintaining block 431 is used to maintain the pressure of the edge area, wherein the pressure-maintaining block 431 is surrounded by a groove 432, and when the second driving module 42 drives the second pressure-maintaining plate 43 close to the circuit board, the central area enters the groove 432 to avoid being subjected to pressure, thereby applying pressure to the edge area in a targeted manner.
[0074] In one embodiment, the second base 41 includes a second pillar 411 and a second support plate 412, the second pillar 411 is arranged on the base 1, the second support plate 412 is movably connected to the second pillar 411, and the second driving module 42 is arranged on the second support plate 412. The second pressure-maintaining mechanism 4 also includes a second adjustment module 44, the second adjustment module 44 is arranged on the second pillar 411, and the second adjustment module 44 is connected to the second support plate 412. The second adjustment module 44 drives the second support plate 412 to move in the vertical direction to adjust the distance between the second pressure-maintaining plate 43 and the circuit board.
[0075] Understandable, see Figure 4 and Figure 5 The second pressure-maintaining mechanism 4 includes a second adjusting module 44. Since the second adjusting module 44 has the same structure as the first adjusting module 34, and the second adjusting module 44 can also change the distance between the circuit board and the second pressure-maintaining plate 43 to adapt to circuit boards of different thicknesses, the effects of the two are also the same, so the structure of the second adjusting module 44 is not described in detail.
[0076] In one embodiment, the transmission mechanism 2 includes a frame 21, a lifting assembly 22 and a limiter 23. The frame 21 is arranged on the base 1, and the frame 21 is provided with a transmission channel 211. Two lifting assemblies 22 are arranged on the base 1 at intervals, and correspond to the first pressure-keeping position and the second pressure-keeping position respectively, and each lifting assembly is provided with a lifting surface located in the transmission channel 211. The limiter 23 is arranged on the base 1, and is arranged at intervals with the lifting assembly 22, and there are two limiters 23, and the two limiters 23 correspond to the first pressure-keeping position and the second pressure-keeping position respectively, and the limiter 23 is provided with a limiter plate 231 that moves relative to the transmission channel 211. Among them, the limiter 23 drives the limiter plate 231 to extend into the transmission channel 211 to prevent the movement of the circuit board, and the lifting assembly 22 drives the lifting surface to approach the transmission channel 211 to make the circuit board detach from the transmission channel 211.
[0077] In this embodiment, please refer to Figure 6 and Figure 7 The frame 21 includes a bracket 212, a transmission belt 213 and a transmission drive 214. The brackets 212 are in two groups, and the brackets 212 are arranged on the base 1 relatively, and the extension direction of the brackets 212 is the first direction. The transmission belt 213 is arranged on each group of brackets 212 along the first direction, and a transmission channel 211 is formed between the transmission belt 213 and the brackets 212. The transmission drive 214 is arranged on the base 1 and is arranged adjacent to the bracket 212. The transmission belt 213 is arranged at the output end of the transmission drive 214. Among them, the transmission drive 214 drives the transmission belt 213 to drive the material tray to move along the first direction.
[0078] Optionally, detection sensors 2121 are provided on both sides of the bracket 212 along the first direction, and the detection sensors 2121 are used to detect the loading and unloading of the material tray. When a material tray is loaded, the detection sensor 2121 can quickly capture this information and start the corresponding operation process of the pressure-holding device 100; similarly, when the material tray completes all the pressure-holding processes, the detection sensor 2121 will also respond in time to ensure that the next mechanism can receive the circuit board that has completed the pressure-holding in time, thereby ensuring the continuity and stability of the entire production process, making the pressure-holding device 100 more intelligent.
[0079] Understandable, see Figure 6 and Figure 8 The limiting member 23 and the lifting assembly 22 are arranged at intervals along the first direction, and each lifting assembly 22 corresponds to a limiting member 23. The limiting member 23 is used to prevent the material tray from moving along the first direction so that the lifting assembly 22 can lift the material tray. The limiting member 23 includes a limiting driving member 232 and a limiting plate 231. The limiting driving member 232 is arranged on the base 1 and corresponds to the first pressure holding position or the second pressure holding position. The limiting plate 231 is arranged at the output end of the limiting driving member 232. Among them, the limiting driving member 232 drives the limiting plate 231 to move in the vertical direction.
[0080] In one embodiment, the lifting assembly 22 includes a lifting drive 222 and a lifting seat 221. The lifting drive 222 is disposed on the base 1, corresponding to the first pressure holding position or the second pressure holding position. The lifting seat 221 is disposed at the output end of the lifting drive 222, and a lifting surface is disposed on the side of the lifting seat 221 facing the transmission channel 211. The lifting drive 222 drives the lifting seat 221 to drive the circuit board to move in the vertical direction.
[0081] In this embodiment, please refer to Figure 6 and Fig. 9 , the lifting drive member 222 drives the lifting seat 221 to move in the vertical direction to drive the material tray to contact or detach from the transmission belt 213. When the first pressure-maintaining mechanism 3 needs to maintain pressure, the lifting seat 221 rises to make the material tray detach from the transmission belt 213 and stop moving in the first direction to ensure stability during the pressure-maintaining process. When the first pressure-maintaining mechanism 3 finishes maintaining pressure, the lifting seat 221 descends to make the material tray contact the transmission belt 213 again, and the transmission belt 213 drives the material tray to continue to move in the first direction.
[0082] Optionally, the lifting seat 221 is further provided with a limit block 2211, which cooperates with the material tray to ensure the stability of the material tray during movement. The limit block 2211 cooperates with the bottom surface of the material tray to ensure that the material tray remains stable during the vertical movement, reduce shaking, and improve the accuracy of the pressure-maintaining operation.
[0083] In one embodiment, the transmission mechanism 2 is provided with two transmission channels 211, both of which extend along the first direction, and each transmission channel 211 is provided with a first pressure-maintaining position and a second pressure-maintaining position. The pressure-maintaining device 100 includes two first pressure-maintaining mechanisms 3 and two second pressure-maintaining mechanisms 4, each first pressure-maintaining mechanism 3 corresponds to a first pressure-maintaining position, and each second pressure-maintaining mechanism 4 corresponds to a second pressure-maintaining position.
[0084] In this embodiment, please refer to Figure 1 In order to improve production efficiency, two transmission channels 211 are provided. Through parallel processing, the pressure-maintaining operation of the circuit board can be completed faster. Of course, more transmission channels 211 can be provided for the pressure-maintaining operation. There is no limit on the number of transmission channels 211, but it is necessary to ensure that each transmission channel 211 is provided with a first pressure-maintaining position and a second pressure-maintaining position, each first pressure-maintaining position corresponds to a first pressure-maintaining mechanism 3, and each second pressure-maintaining position corresponds to a second pressure-maintaining mechanism 4.
[0085] In one embodiment, the pressure-maintaining device 100 further includes a loading mechanism 5 movably disposed on the base 1, the loading mechanism 5 is provided with a loading space, the loading mechanism 5 is located at one end of the transmission channel 211, and moves along the second direction so that the loading space is correspondingly connected to any transmission channel 211. And / or, the pressure-maintaining device 100 further includes a unloading mechanism 6 movably disposed on the base 1, the unloading mechanism 6 is provided with a unloading space, the unloading mechanism 6 is located at the other end of the transmission channel 211, and moves along the second direction so that the unloading space is correspondingly connected to any transmission channel 211.
[0086] In this embodiment, please refer to Figure 1 and Fig.10 The feeding mechanism 5 includes a slide rail 51, a slide seat 52, a transmission belt 53 and a feeding drive 54. The slide rail 51 is arranged on the base 1, and the slide seat 52 is slidably arranged on the slide rail 51 and can move along the extension direction of the slide rail 51, that is, the second direction, to form a first position and a second position. The first position and the second position correspond to two transmission channels 211 respectively. When the slide seat 52 moves to the corresponding position, the corresponding transmission channel 211 can be fed. The transmission belt 53 is arranged on the slide seat 52, and the feeding drive 54 is arranged on the slide seat 52. The transmission belt 53 is arranged at the output end of the feeding drive 54. The feeding drive 54 drives the transmission belt 53 to rotate to drive the material tray to be transported to the transmission channel 211. The surface of the transmission belt 53 forms the feeding space. When the feeding space is connected to the transmission channel 211, the transmission belt 53 is aligned with the transmission belt 213, so that the material tray can be transported from the surface of the transmission belt 53 to the surface of the transmission belt 213. It should be noted that, in this embodiment, the second direction is perpendicular to the first direction in the horizontal plane.
[0087] Optionally, the loading structure can also load the material through a robotic arm, and the robotic arm corresponds to any transmission channel 211 to clamp the material tray and transport it to the transmission belt 213.
[0088] Optionally, the feeding mechanism 5 is further provided with a position sensor 55, which is arranged on the base 1. The position sensor 55 is used to detect the position of the slide 52 to ensure that the slide 52 can be exactly in the first position or the second position, thereby reducing the error during feeding.
[0089] The structure of the loading mechanism 5 is similar to that of the unloading mechanism 6 , and the structure of the above embodiment is also applicable to the unloading mechanism 6 , so the structure of the unloading mechanism 6 is not described in detail.
[0090] In one embodiment, the base 1 is further provided with an adjusting foot 11 , and the adjusting foot 11 is used to adjust the levelness of the base 1 .
[0091] In this embodiment, please refer to Figure 1The bottom of the base 1 is also provided with an adjusting foot 11. By adjusting the adjusting foot 11, the surface of the base 1 can be kept in a horizontal state, thereby reducing the problem of uneven pressing that may occur during the pressing process and improving the pressing effect.
[0092] In the embodiment of the present invention, the feeding mechanism 5 transports the material tray to the transmission belt 213, and the material tray moves under the drive of the transmission belt 213, and the first limiter 23 corresponding to the first pressure-maintaining position rises to block the material tray at the first pressure-maintaining position, and at the same time, the first lifting assembly 22 corresponding to the first pressure-maintaining position rises to make the material tray separate from the transmission belt 213, and the first pressure-maintaining mechanism 3 approaches the lifting assembly 22, thereby pressing the protective film in the central area of the circuit board. The first pressure-maintaining mechanism 3 returns to its position, and the first lifting assembly 22 descends to make the material tray contact the transmission belt 213 again, and the first limiter 23 descends, and the material tray continues to move, and at the same time, the second limiter 23 corresponding to the second pressure-maintaining position rises, and the material tray is blocked at the second pressure-maintaining position. The second lifting assembly 22 corresponding to the second pressure-maintaining position rises to make the material tray separate from the transmission belt 213, and the second pressure-maintaining mechanism 4 approaches the second lifting assembly 22, thereby pressing the protective film in the edge area of the circuit board. The second pressure-maintaining mechanism 4 returns to its position, the second lifting assembly 22 descends, so that the material tray contacts the transmission belt 213 again, the second limiter 23 descends, the material tray continues to move, leaves the transmission belt 213, and moves to the unloading mechanism 6.
[0093] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A pressure-maintaining device, used for pressing a protective film against a circuit board, wherein the circuit board has an edge region and a central region protruding from the circuit board, and the protective film is attached to both the edge region and the central region, characterized in that: The pressure maintaining equipment comprises: abutment; A transmission mechanism, the transmission mechanism is arranged on the base, the transmission mechanism forms a transmission channel extending along a first direction, the transmission channel is used to transport the circuit board, and the transmission channel has a first pressure holding position and a second pressure holding position arranged along the first direction; a first pressure-keeping mechanism, wherein the first pressure-keeping mechanism is disposed on the base and corresponds to the first pressure-keeping position, the first pressure-keeping mechanism is provided with a first pressure-keeping area, and the first pressure-keeping mechanism pressurizes the central area through the first pressure-keeping area so that the first pressure-keeping area fits the central area; and The second pressure-holding mechanism is arranged on the base and corresponds to the second pressure-holding position. The second pressure-holding mechanism is provided with a second pressure-holding area and a groove opened in the second pressure-holding area. The second pressure-holding mechanism holds pressure on the edge area through the second pressure-holding area so that the second pressure-holding area fits with the edge area and the center area enters the groove.
2. The pressure-maintaining device according to claim 1, characterized in that: The first pressure maintaining mechanism comprises: A first base, which is disposed on the base and corresponds to the first pressure-maintaining position; a first driving module, the first driving module being disposed on the first base; and A first pressure-maintaining plate, wherein the first pressure-maintaining plate is disposed at the output end of the first driving module, a side of the first pressure-maintaining plate facing the transmission channel is a pressure-maintaining surface, and the pressure-maintaining surface forms the first pressure-maintaining area; The first driving module drives the first pressure-maintaining plate to approach or move away from the transmission channel so that the pressure-maintaining surface fits the central area.
3. The pressure-maintaining device according to claim 2, characterized in that: The first base includes a first pillar and a first support plate, the first pillar is arranged on the base, the first support plate is movably connected to the first pillar, and the first driving module is arranged on the first support plate; The first pressure-maintaining mechanism further includes a first adjusting module, which is disposed on the first support column and connected to the first supporting plate; The first adjustment module drives the first support plate to move along the extension direction of the first support column to adjust the distance between the first pressure maintaining plate and the transmission channel.
4. The pressure-maintaining device according to claim 2, characterized in that: The central area is provided with an element, and the pressure-maintaining surface is also provided with an avoidance groove, which cooperates with the element so that when the pressure-maintaining surface is in contact with the central area, the element enters the avoidance groove.
5. The pressure-maintaining device according to claim 1, characterized in that: The second pressure maintaining mechanism comprises: a second base, the second base being disposed on the base and corresponding to the second pressure-maintaining position; a second driving module, the second driving module being disposed on the second base; and A second pressure-maintaining plate, the second pressure-maintaining plate is arranged at the output end of the second driving module, a pressure-maintaining block is arranged at an edge of a side of the second pressure-maintaining plate close to the circuit board, the pressure-maintaining block forms the second pressure-maintaining area, and the pressure-maintaining block is arranged to form the groove; The second driving module drives the second pressure maintaining plate so that the pressure maintaining block fits the edge area and the center area enters the groove.
6. The pressure-maintaining device according to claim 5, characterized in that: The second base comprises a second pillar and a second support plate, the second pillar is arranged on the base, the second support plate is movably connected to the second pillar, and the second driving module is arranged on the second support plate; The second pressure-maintaining mechanism further includes a second adjusting module, the second adjusting module is disposed on the second support column, and the second adjusting module is connected to the second supporting plate; The second adjustment module drives the second support plate to move along the extension direction of the second support column to adjust the distance between the second pressure maintaining plate and the transmission channel.
7. The pressure-maintaining device according to claim 1, characterized in that: The transmission mechanism comprises: A frame, the frame is arranged on the base, and the frame is provided with the transmission channel; Two lifting assemblies, which are spaced apart from each other on the base and correspond to the first pressure-maintaining position and the second pressure-maintaining position respectively, and each of the lifting assemblies is provided with a lifting surface located in the transmission channel; and A limiter, the limiter is arranged on the base and spaced apart from the lifting assembly, and two limiters are provided, the two limiters correspond to the first pressure-maintaining position and the second pressure-maintaining position respectively, and the limiter is provided with a limiter plate that moves relative to the transmission channel; The limiting member drives the limiting plate to extend into the transmission channel to prevent the movement of the circuit board, and the lifting assembly drives the lifting surface to approach the transmission channel to make the circuit board detach from the transmission channel.
8. The pressure-maintaining device according to claim 7, characterized in that: The lifting assembly comprises: A lifting driving member, the lifting driving member is arranged on the base, corresponding to the first pressure-keeping position or the second pressure-keeping position; and A lifting seat, the lifting seat is arranged at the output end of the lifting driving member, and the lifting surface is arranged on a side of the lifting seat facing the transmission flow channel; The lifting drive member drives the lifting seat to drive the circuit board to move in a vertical direction.
9. The pressure maintaining device according to any one of claims 1 to 8, characterized in that: The transmission mechanism is provided with two transmission channels, both of which extend along the first direction, and each of which is provided with a first pressure-maintaining position and a second pressure-maintaining position; The pressure-maintaining device includes two of the first pressure-maintaining mechanisms and two of the second pressure-maintaining mechanisms. Each of the first pressure-maintaining mechanisms corresponds to a first pressure-maintaining position, and each of the second pressure-maintaining mechanisms corresponds to a second pressure-maintaining position.
10. The pressure-maintaining device according to claim 9, characterized in that: The pressure-maintaining device further comprises a feeding mechanism movably arranged on the base, the feeding mechanism being provided with a feeding space, the feeding mechanism being located at one end of the transmission flow channel and moving along the second direction so that the feeding space is correspondingly connected with any of the transmission flow channels; And / or, the pressure-maintaining device also includes a material unloading mechanism movably arranged on the base, the material unloading mechanism is provided with a material unloading space, the material unloading mechanism is located at the other end of the transmission channel, and moves along the second direction so that the material unloading space is correspondingly connected with any of the transmission channels.
Citation Information
Patent Citations
Automatic pressure maintaining mechanism
CN111958521A
Feeding and pressure maintaining integrated assembly line
CN112657866A
Pressure maintaining device
CN220065637U
Platen assembly, wafer polishing apparatus having thesame, and wafer polishing method
KR100685744B1
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