Manufacturing method of high-reliability thick copper circuit board and circuit board

Abstract

The invention provides a high-reliability thick copper circuit board manufacturing method and a circuit board. The method comprises the following steps: carrying out etching operation on an inner-layer core plate so as to respectively form a first copper-free region and a second copper-free region on two sides of the inner-layer core plate; carrying out browning operation on the inner-layer core board; the first copper-free area is filled with a first filling PP layer, the first filling PP layer protrudes out of the surface of the inner-layer core board, the second copper-free area is filled with a second filling PP layer, and the second filling PP layer protrudes out of the surface of the inner-layer core board; respectively covering the first filling PP layer and the second filling PP layer with a first copper foil layer and a second copper foil layer to form a covering plate; performing pressing operation on the covering plate; removing the first copper foil layer and the second copper foil layer to form a core plate to be browned; and carrying out browning treatment on the to-be-browned core plate to obtain a to-be-laminated core plate. Therefore, the problem that the thicknesses of the circuit boards are not uniform is solved, and the lamination reliability of the circuit boards is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit boards, and in particular to a method for manufacturing a high-reliability thick copper circuit board and the circuit board. Background Art

[0002] With the rapid development of electronic products, printed circuit boards are rapidly developing towards the direction of being thinner, lighter and smaller. The trend of surface mounting and miniaturization of components is becoming more and more obvious. The density of products is also increasing, and products are developing towards high density and interconnection. In order to make the wiring space between layers wider and more free, the PCB layout side will consider increasing the number of layers to meet the wiring space requirements.

[0003] In addition, with the fast-paced market demand for improved efficiency of electronic products and increased power of electronic equipment, a larger current capacity is required to pass through the circuit board. The circuit board design will also consider increasing the thickness of copper and the number of layers to achieve sufficient heat dissipation performance and high mechanical strength.

[0004] Since the wiring of the circuit board is affected by the safety spacing, a large area of ​​copper-free area has to be designed. As the number of layers increases and the copper thickness increases, the thickness of the circuit board after pressing is unevenly distributed, causing the outer layer circuit film in the later process to be unable to proceed normally, resulting in quality problems such as dry film bubbles and incomplete etching, and also seriously reducing production efficiency. What's more, because the force is uneven when the copper-free area is pressed with the copper surface, the inner layer of the circuit board is fluffy and has bubbles. It cannot be inspected on the surface. When the circuit board is assembled to the base station, it can only be detected after a long period of work. The resulting circuit board quality problems may cause the entire base station to be paralyzed.

[0005] Therefore, there is an urgent need to suppress the problem of uneven thickness of circuit boards. Summary of the invention

[0006] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a method for manufacturing a high-reliability thick copper circuit board and a circuit board that suppresses the problem of uneven board thickness.

[0007] The purpose of this disclosure is achieved through the following technical solutions:

[0008] A method for manufacturing a high-reliability thick copper circuit board, comprising:

[0009] Performing an etching operation on the inner core board to form a first copper-free area and a second copper-free area on both sides of the inner core board respectively;

[0010] Performing browning operation on the inner core board;

[0011] Filling a first filled PP layer in the first copper-free area, and the first filled PP layer protrudes from the surface of the inner core board, and filling a second filled PP layer in the second copper-free area, and the second filled PP layer protrudes from the surface of the inner core board;

[0012] Covering the first filled PP layer and the second filled PP layer with a first copper foil layer and a second copper foil layer respectively to form a cover plate;

[0013] Performing a pressing operation on the cover plate;

[0014] The first copper foil layer and the second copper foil layer are cleaned to form a core board to be browned;

[0015] The core board to be browned is subjected to browning treatment to obtain a core board to be laminated.

[0016] In some embodiments, the step of removing the first copper foil layer and the second copper foil layer to form a core board to be browned includes:

[0017] The first copper foil layer and the second copper foil layer are etched.

[0018] In some embodiments, after the step of performing a cleaning treatment on the first copper foil layer and the second copper foil layer and before the step of performing a browning treatment on the core board to be browned, the method for manufacturing a high-reliability thick copper circuit board further includes:

[0019] The copper surface of the browning core board is subjected to a degumming treatment.

[0020] In some embodiments, the step of removing glue from the copper surface of the browning core board includes:

[0021] The copper surface of the core board to be browned is ground flat by a ceramic grinding plate.

[0022] In some embodiments, the step of removing glue from the copper surface of the browning core board includes:

[0023] Grinding the copper surface of the core plate to be browned by a ceramic grinding plate;

[0024] The core board to be browned is cleaned.

[0025] In some embodiments, the step of removing glue from the copper surface of the browning core board includes:

[0026] Grinding the copper surface of the core plate to be browned by a ceramic grinding plate;

[0027] Cleaning the core board to be browned;

[0028] The core board to be browned is subjected to a drying process.

[0029] In some of the embodiments, in the step of grinding the copper surface of the core board to be browned by a ceramic grinding plate, the core board to be browned is also subjected to dust removal.

[0030] In some embodiments, after the step of browning the core board to be browned, the method for manufacturing the high-reliability thick copper circuit board further includes:

[0031] The plurality of core panels to be laminated and the plurality of pressed PP layers are laminated to form a stacked panel.

[0032] In some embodiments, after the step of laminating the stacked boards, the method for manufacturing the high-reliability thick copper circuit board further includes:

[0033] The stacked sheets are subjected to a lamination operation.

[0034] A circuit board is prepared by using the method for preparing a high-reliability thick copper circuit board described in any of the above embodiments.

[0035] Compared with the prior art, the present invention has at least the following advantages:

[0036] The first filling PP layer is filled in the first copper-free area, and the first filling PP layer protrudes from the surface of the inner core board, and the second filling PP layer is filled in the second copper-free area, and the second filling PP layer protrudes from the surface of the inner core board; the first copper foil layer and the second copper foil layer are respectively covered on the first filling PP layer and the second filling PP layer to form a cover board; the cover board is pressed so that the first filling PP layer and the second filling PP layer are respectively pressed in the first copper-free area and the second copper-free area. Since the first filling PP layer and the second filling PP layer are respectively pressed in the first copper-free area and the second copper-free area, the forces on each core board to be pressed are relatively uniform during the lamination operation, which suppresses the problem of uneven thickness of the circuit board, thereby ensuring that the outer layer circuit can be normally pasted in the manufacturing process, thereby avoiding the problems of dry film bubbles and incomplete etching, and at the same time avoiding the problem of fluffy and bubbles in the inner layer of the circuit board, and avoiding the problem that the circuit board cannot be inspected from the appearance, thereby improving the lamination reliability of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 The present invention is a flowchart of the steps of a method for manufacturing a high-reliability thick copper circuit board according to an embodiment. DETAILED DESCRIPTION

[0039] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0040] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0042] The present invention provides a method for manufacturing a high-reliability thick copper circuit board, comprising: etching an inner core board to form a first copper-free area and a second copper-free area on both sides of the inner core board; browning the inner core board; filling a first filling PP layer in the first copper-free area, and the first filling PP layer protrudes from the surface of the inner core board, and filling a second filling PP layer in the second copper-free area, and the second filling PP layer protrudes from the surface of the inner core board; covering the first filling PP layer and the second filling PP layer with a first copper foil layer and a second copper foil layer, respectively, to form a covering board; pressing the covering board; removing the first copper foil layer and the second copper foil layer to form a core board to be browned; browning the core board to be browned to obtain a core board to be laminated.

[0043] The present disclosure also provides a circuit board, which is prepared by using the above-mentioned method for preparing the high-reliability thick copper circuit board.

[0044] The manufacturing method and circuit board of the high-reliability thick copper circuit board are as follows: the first filling PP layer is filled in the first copper-free area, and the first filling PP layer protrudes from the surface of the inner core board; the second filling PP layer is filled in the second copper-free area, and the second filling PP layer protrudes from the surface of the inner core board; the first copper foil layer and the second copper foil layer are respectively covered on the first filling PP layer and the second filling PP layer to form a covering board; the covering board is pressed so that the first filling PP layer and the second filling PP layer are respectively pressed in the first copper-free area and the second copper-free area. Since the first filling PP layer and the second filling PP layer are respectively pressed in the first copper-free area and the second copper-free area, the force on each core board to be pressed is relatively uniform during the lamination operation, which suppresses the problem of uneven thickness of the circuit board, thereby ensuring that the outer layer circuit can be normally pasted in the manufacturing process, thereby avoiding the problem of dry film bubbles and incomplete etching, and at the same time avoiding the problem of fluffy and bubbles in the inner layer of the circuit board, and avoiding the problem that the circuit board cannot be inspected from the appearance, thereby improving the lamination reliability of the circuit board.

[0045] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0046] As shown in Figure 1 to Figure 2, a method for manufacturing a high-reliability thick copper circuit board according to an embodiment includes:

[0047] S110, performing an etching operation on the inner core board to form a first copper-free area and a second copper-free area on both sides of the inner core board respectively.

[0048] In this embodiment, the inner core board is placed in an etching tank for etching to form a first copper-free area and a second copper-free area on both sides of the inner core board. After the etching is completed, the inner core board is taken out and rinsed with clean water to remove residual etching solution and impurities.

[0049] S130, browning the inner core board.

[0050] In this embodiment, the inner core board is allowed to react with the browning liquid through browning, and a dense organic browning film is generated in the copper-free area of ​​the inner core board. This film can significantly improve the bonding strength between the inner core board and the semi-cured sheet, ensuring that delamination or peeling is not easy to occur during the subsequent pressing process. The browning process helps to remove pollutants such as grease and debris on the surface of the copper-free area, improve the cleanliness of the copper-free area, and provide a good foundation for subsequent process steps. After browning, a uniform layer of fluff will be formed in the copper-free area of ​​the inner core board, which further increases the contact area and friction between the inner core board and the semi-cured sheet, thereby enhancing the bonding force between them. It can be understood that the first copper-free area and the second copper-free area are both copper-free areas.

[0051] S150, filling the first filled PP layer in the first copper-free area, and the first filled PP layer protrudes from the surface of the inner core board, and filling the second filled PP layer in the second copper-free area, and the second filled PP layer protrudes from the surface of the inner core board.

[0052] In this embodiment, the first filling PP layer is filled in the first copper-free area, and the thickness of the first filling PP layer is greater than the depth of the first copper-free area, so that the first filling PP layer protrudes from the surface of the inner core board after filling the first copper-free area, so that the first copper-free area can be completely filled by the first filling PP layer during lamination, thereby avoiding the formation of voids or bubbles in the first copper-free area. The second filling PP layer is also filled in the second copper-free area, and the thickness of the second filling PP layer is greater than the depth of the second copper-free area, so that the second filling PP layer protrudes from the surface of the inner core board after filling the second copper-free area, so that the second copper-free area can be completely filled by the second filling PP layer during lamination, thereby avoiding the formation of voids or bubbles in the second copper-free area. It can be understood that the first filling PP layer and the second filling PP layer are both prepregs.

[0053] S170, covering the first filling PP layer and the second filling PP layer with the first copper foil layer and the second copper foil layer respectively to form a covering plate.

[0054] In this embodiment, the first copper foil layer is covered on the side of the first filling PP layer away from the first copper-free area, so that the first copper foil layer can block the first filling PP layer during lamination, so as to compact the first filling PP layer into the first copper-free area. The second copper foil layer is covered on the side of the second filling PP layer away from the second copper-free area, so that the second copper foil layer can block the second filling PP layer during lamination, so as to compact the second filling PP layer into the second copper-free area.

[0055] S190, performing a pressing operation on the cover plate.

[0056] In this embodiment, the cover plate is pressed so that the first copper-free area is filled with the first filling PP layer, thereby avoiding the problem of pores in the first copper-free area, and the second copper-free area is filled with the second filling PP layer, thereby avoiding the problem of pores in the second copper-free area.

[0057] S210, performing a cleaning process on the first copper foil layer and the second copper foil layer to form a core board to be browned.

[0058] In this embodiment, the first copper foil layer and the second copper foil layer will hinder the lamination of the multi-layer core boards to be browned, specifically reducing the bonding effect between the core boards to be browned. Therefore, the first copper foil layer and the second copper foil layer need to be removed to ensure that the subsequent lamination operation can proceed normally.

[0059] S230, performing browning treatment on the core board to be browned to obtain the core board to be laminated.

[0060] In this embodiment, the core board to be browned is allowed to react with the browning liquid through browning, and a dense organic browning film is generated on the copper surface of the core board to be browned. This film can significantly improve the bonding strength between the core board to be browned and the semi-cured sheet, ensuring that delamination or peeling is not easy to occur during the subsequent lamination process. The browning process helps to remove pollutants such as grease and debris on the surface of the core board to be browned, improve the cleanliness of the board surface, and provide a good foundation for subsequent process steps. After browning, a uniform layer of fluff will form on the copper surface of the core board to be browned, which further increases the contact area and friction between the core board to be browned and the semi-cured sheet, thereby enhancing the bonding force between them.

[0061] The above-mentioned method for making a high-reliability thick copper circuit board includes: filling the first filling PP layer in the first copper-free area, and the first filling PP layer protrudes from the surface of the inner core board; filling the second filling PP layer in the second copper-free area, and the second filling PP layer protrudes from the surface of the inner core board; covering the first copper foil layer and the second copper foil layer on the first filling PP layer and the second filling PP layer respectively to form a cover board; and performing a laminating operation on the cover board so that the first filling PP layer and the second filling PP layer are respectively pressed in the first copper-free area and the second copper-free area. Since the first filling PP layer and the second filling PP layer are respectively pressed in the first copper-free area and the second copper-free area, the forces on each core board to be pressed are relatively uniform during the lamination operation, which suppresses the problem of uneven thickness of the circuit board, thereby ensuring that the outer layer circuit can be normally pasted in the manufacturing process, thereby avoiding the problems of dry film bubbles and incomplete etching, and at the same time avoiding the problem of fluffy and bubbles in the inner layer of the circuit board, and avoiding the problem that the circuit board cannot be inspected from the appearance, thereby improving the lamination reliability of the circuit board.

[0062] In some embodiments, the steps of removing the first copper foil layer and the second copper foil layer to form a core board to be browned include:

[0063] The first copper foil layer and the second copper foil layer are etched.

[0064] In this embodiment, the first copper foil layer and the second copper foil layer are removed by etching to prevent the first copper foil layer and the second copper foil layer from affecting the subsequent lamination operation. Since the etching operation has a strong copper removal effect, it ensures that the first copper foil layer and the second copper foil layer can be completely removed.

[0065] In some embodiments, after the step of performing a cleaning treatment on the first copper foil layer and the second copper foil layer and before the step of performing a browning treatment on the browning core board, the method for manufacturing a high-reliability thick copper circuit board further includes:

[0066] Remove glue from the copper surface of the brown core board.

[0067] In this embodiment, during the pressing operation, the first filled PP layer and the second filled PP layer will overflow to the outside, resulting in residual glue on the board surface. These residual glue will affect the uneven force in the subsequent lamination operation. Therefore, de-glueing treatment is required to ensure that the core board to be laminated is subjected to uniform force during the subsequent lamination operation.

[0068] In some embodiments, the step of removing glue from the copper surface of the browning core board includes:

[0069] The copper surface of the brown core board is ground flat using a ceramic grinding plate.

[0070] In this embodiment, the ceramic grinding plate has a strong grinding effect. The copper surface of the browning core board is ground by the ceramic grinding plate, which improves the grinding efficiency and further improves the production efficiency of the circuit board.

[0071] In some embodiments, the step of removing glue from the copper surface of the browning core board includes:

[0072] The copper surface of the browned core board is ground flat using a ceramic grinding plate;

[0073] The brown core board is to be cleaned.

[0074] In this embodiment, debris is generated during the grinding process, resulting in debris on the surface of the core board to be browned, so the core board to be browned is cleaned to remove the debris on the surface of the core board to be browned.

[0075] In some embodiments, the step of removing glue from the copper surface of the browning core board includes:

[0076] The copper surface of the browned core board is ground flat using a ceramic grinding plate;

[0077] Clean the brown core board;

[0078] The brown core board is dried.

[0079] In this embodiment, after cleaning, there is moisture on the surface of the core board to be browned. The water surface on the core board to be browned is removed by drying to avoid water diluting the solution required for browning, thereby avoiding the problem that the cleaning process reduces the effect of browning.

[0080] In some of the embodiments, in the step of grinding the copper surface of the core board to be browned by a ceramic grinding plate, the core board to be browned is also subjected to dust removal.

[0081] In this embodiment, debris is generated during the grinding process and the debris will be suspended in the air, causing air pollution. The dust collection process can reduce the debris in the air, reduce the pollution of the debris to the environment, and reduce the impact of the debris on the health of workers.

[0082] In some embodiments, after the step of browning the core board to be browned, the method for manufacturing a high-reliability thick copper circuit board further includes:

[0083] A plurality of core panels to be laminated and a plurality of pressed PP layers are laminated to form a stacked panel.

[0084] In this embodiment, at least one laminated PP layer is provided between two adjacent layers of core panels to be laminated, so that the multiple layers of core panels to be laminated are laminated together.

[0085] In some embodiments, after the step of laminating the stacked boards, the method for manufacturing a high-reliability thick copper circuit board further includes:

[0086] The stacked panels are subjected to a lamination operation.

[0087] In this embodiment, a lamination operation is performed on the stacked boards so that multiple layers of core boards to be laminated are bonded together to form a circuit board with a multi-layer structure.

[0088] It can be understood that, since the first filling PP layer protrudes from the surface of the inner core board, when the thickness of the first filling PP layer is large, the first filling PP layer will still protrude from the surface of the inner core board after lamination, but when the thickness of the first filling PP layer is small, the first copper-free area will not be able to be filled tightly, resulting in defects such as pores in the first copper-free area. Similarly, since the second filling PP layer protrudes from the surface of the inner core board, when the thickness of the second filling PP layer is large, the second filling PP layer will still protrude from the surface of the inner core board after lamination, but when the thickness of the second filling PP layer is small, the second copper-free area will not be able to be filled tightly, resulting in defects such as pores in the second copper-free area.

[0089] In order to avoid the above technical problems, in some embodiments, the thickness of the first filling PP layer protruding from the inner core board is 0.10 mm to 0.15 mm, and the thickness of the second filling PP layer protruding from the inner core board is 0.10 mm to 0.15 mm. Further, after the step of removing the first copper foil layer and the second copper foil layer, and before the step of browning the core board to be browned, the method for manufacturing a high-reliability thick copper circuit board also includes: ablating the protruding portion of the first filling PP layer and the protruding portion of the second filling PP layer by laser.

[0090] In this embodiment, the protruding portion of the first filling PP layer and the protruding portion of the second filling PP layer are ablated by laser, so that the thickness of the core board to be laminated is uniform, and thus the thickness distribution of the laminated circuit board is uniform. In addition, laser ablation can also roughen the surface of the first filling PP layer and the surface of the second filling PP layer, which is beneficial to the combination of the core board to be pressed and the pressed PP layer, thereby improving the pressing effect.

[0091] In some embodiments, the step of laser ablating the protruding portion of the first filled PP layer and the protruding portion of the second filled PP layer comprises:

[0092] Place the core board to be browned in the processing position, with the first filling PP layer facing upwards;

[0093] Acquire an image of the upper side of the core board to be browned to obtain a first image;

[0094] Performing feature extraction processing on the first image to obtain a first processing contour;

[0095] Output a first path instruction according to the first machining profile;

[0096] Control the movement of the laser head according to the first path instruction to ablate the protruding portion of the first filled PP layer of the core board to be browned;

[0097] Turn over the core board to be browned so that the second filling PP layer is placed upwards;

[0098] Acquire an image of the upper side of the core board to be browned to obtain a second image;

[0099] Performing feature extraction processing on the second image to obtain a second processing contour;

[0100] Outputting a second path instruction according to the second machining contour;

[0101] The laser head is controlled to move according to the second path instruction to ablate the protruding portion of the second filled PP layer of the core board to be browned.

[0102] In this embodiment, the placement position of the board to be browned is prone to deviation from the predetermined position. Once the position of the board to be browned deviates, the laser head will ablate the circuit of the core board to be browned, causing the core board to be scrapped. Therefore, first, the core board to be browned is placed in the processing position so that the first filling PP layer is set upward; then, an image of the upper side of the core board to be browned is obtained to obtain a first image; then, feature extraction processing is performed on the first image to obtain a first processing contour; then, a first path instruction is output according to the first processing contour; then, the laser head is controlled to move according to the first path instruction to ablate the protruding part of the first filling PP layer of the core board to be browned; then, the core board to be browned is turned over so that the second filling PP layer is set upward; then, an image of the upper side of the core board to be browned is obtained to obtain a second image; then, feature extraction processing is performed on the second image to obtain a second processing contour; then, a second path instruction is output according to the second processing contour; then, the laser head is controlled to move according to the second path instruction to ablate the protruding part of the second filling PP layer of the core board to be browned. In this way, the laser head can adjust the processing profile according to different situations to ensure that the laser head remains in the predetermined position for ablation, thereby avoiding the problem of the laser head ablating the circuit of the core board to be browned.

[0103] The present disclosure also provides a circuit board, which is prepared by the method for preparing a high-reliability thick copper circuit board according to any of the above embodiments.

[0104] In the above-mentioned circuit board, the first filling PP layer is filled in the first copper-free area, and the first filling PP layer protrudes from the surface of the inner core board, and the second filling PP layer is filled in the second copper-free area, and the second filling PP layer protrudes from the surface of the inner core board; the first copper foil layer and the second copper foil layer are respectively covered on the first filling PP layer and the second filling PP layer to form a covering board; the covering board is pressed so that the first filling PP layer and the second filling PP layer are respectively pressed in the first copper-free area and the second copper-free area. Since the first filling PP layer and the second filling PP layer are respectively pressed in the first copper-free area and the second copper-free area, the forces on each core board to be pressed are relatively uniform during the lamination operation, which suppresses the problem of uneven thickness of the circuit board, thereby ensuring that the outer layer circuit can be normally pasted in the manufacturing process, thereby avoiding the problems of dry film bubbles and incomplete etching, and at the same time avoiding the problem of fluffy and bubbles in the inner layer of the circuit board, and avoiding the problem that the circuit board cannot be inspected from the appearance, thereby improving the lamination reliability of the circuit board.

[0105] Compared with the prior art, the present invention has at least the following advantages:

[0106] The first filling PP layer is filled in the first copper-free area, and the first filling PP layer protrudes from the surface of the inner core board, and the second filling PP layer is filled in the second copper-free area, and the second filling PP layer protrudes from the surface of the inner core board; the first copper foil layer and the second copper foil layer are respectively covered on the first filling PP layer and the second filling PP layer to form a cover board; the cover board is pressed so that the first filling PP layer and the second filling PP layer are respectively pressed in the first copper-free area and the second copper-free area. Since the first filling PP layer and the second filling PP layer are respectively pressed in the first copper-free area and the second copper-free area, the forces on each core board to be pressed are relatively uniform during the lamination operation, which suppresses the problem of uneven thickness of the circuit board, thereby ensuring that the outer layer circuit can be normally pasted in the manufacturing process, thereby avoiding the problems of dry film bubbles and incomplete etching, and at the same time avoiding the problem of fluffy and bubbles in the inner layer of the circuit board, and avoiding the problem that the circuit board cannot be inspected from the appearance, thereby improving the lamination reliability of the circuit board.

[0107] The above embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the disclosed patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the disclosed patent shall be subject to the attached claims.

Claims

1. A method for manufacturing a high-reliability thick copper circuit board, characterized in that: include: Performing an etching operation on the inner core board to form a first copper-free area and a second copper-free area on both sides of the inner core board respectively; Performing browning operation on the inner core board; Filling a first filled PP layer in the first copper-free area, and the first filled PP layer protrudes from the surface of the inner core board, and filling a second filled PP layer in the second copper-free area, and the second filled PP layer protrudes from the surface of the inner core board; Covering the first filled PP layer and the second filled PP layer with a first copper foil layer and a second copper foil layer respectively to form a cover plate; Performing a pressing operation on the cover plate; The first copper foil layer and the second copper foil layer are cleaned to form a core board to be browned; The core board to be browned is subjected to browning treatment to obtain a core board to be laminated.

2. The method for manufacturing a high-reliability thick copper circuit board according to claim 1, characterized in that: The step of removing the first copper foil layer and the second copper foil layer to form a core board to be browned includes: The first copper foil layer and the second copper foil layer are etched.

3. The method for manufacturing a high-reliability thick copper circuit board according to claim 2, characterized in that: After the step of performing a cleaning treatment on the first copper foil layer and the second copper foil layer and before the step of performing a browning treatment on the core board to be browned, the method for manufacturing the high-reliability thick copper circuit board further includes: The copper surface of the browning core board is subjected to a degumming treatment.

4. The method for manufacturing a high-reliability thick copper circuit board according to claim 3, characterized in that: The step of performing a degumming treatment on the copper surface of the browning core board comprises: The copper surface of the core board to be browned is ground flat by a ceramic grinding plate.

5. The method for manufacturing a high-reliability thick copper circuit board according to claim 3, characterized in that: The step of performing a degumming treatment on the copper surface of the browning core board comprises: Grinding the copper surface of the core plate to be browned by a ceramic grinding plate; The core board to be browned is cleaned.

6. The method for manufacturing a high-reliability thick copper circuit board according to claim 3, characterized in that: The step of performing a degumming treatment on the copper surface of the browning core board comprises: Grinding the copper surface of the core plate to be browned by a ceramic grinding plate; Cleaning the core board to be browned; The core board to be browned is dried.

7. The method for manufacturing a high-reliability thick copper circuit board according to any one of claims 4 to 6, characterized in that: In the step of grinding the copper surface of the core board to be browned by means of a ceramic grinding plate, the core board to be browned is also subjected to dust removal.

8. The method for manufacturing a high-reliability thick copper circuit board according to claim 1, characterized in that: After the step of performing browning treatment on the core board to be browned, the method for manufacturing the high-reliability thick copper circuit board further comprises: The plurality of core panels to be laminated and the plurality of pressed PP layers are laminated to form a stacked panel.

9. The method for manufacturing a high-reliability thick copper circuit board according to claim 8, characterized in that: After the step of laminating the stacked boards, the method for manufacturing the high-reliability thick copper circuit board further comprises: The stacked sheets are subjected to a lamination operation.

10. A circuit board, characterized in that: The high-reliability thick copper circuit board is prepared by the manufacturing method of any one of claims 1 to 9.

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