A SMD LED lamp bead

Abstract

The present invention discloses a patch LED lamp bead, belonging to the technical field of semiconductor light-emitting devices. The patch LED lamp bead includes a packaging block, a circuit board and a chip. The chip is built into the packaging block, and the circuit board supplies power to the chip. It also includes a shell wrapped around the outside of the packaging block, and the vertical side wall of the shell has a light outlet, the end of the shell is penetrated with an electrode port, and the middle of the shell is provided with a heat sink port. The present invention uses the design of a heat sink frame. The side-emitting LED has poor heat dissipation at the top and a large range of light dead zones at the top and bottom positions, resulting in excessive light being totally reflected in the dead zones. The heat sink frame penetrates the upper and lower dead zones of the LED lamp bead. Pads 1 and 2 reduce the dead zone range, increase the surface area, and quickly dissipate the heat in the dead zone, especially the top dead zone. The light can also be reflected out of the dead zone, reducing the heat generation of the side-emitting lamp bead.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor light emitting devices, and in particular relates to a SMD LED lamp bead. Background Art

[0002] Side-emitting LED lamp beads are specially designed LEDs whose light-emitting surface is located on the side of the lamp bead instead of the top. This design allows the light to be more evenly distributed on a plane, and is particularly suitable for applications such as backlight sources and panel lights. The main advantages of side-emitting LEDs are their light uniformity and light diffusion effect, which can better avoid the glare caused by direct light.

[0003] Existing side-emitting LED lamp beads use a patch welding method. Because the lamp beads are thinner overall, the narrow edges are welded on the circuit board, and the heat is mainly dissipated by conducting heat to the circuit board. In addition, due to the existence of dead zones at the top and bottom, the light will be fully reflected at these positions, resulting in poor heat dissipation in the height direction, especially at the top, affecting the thermal stability of the LED lamp beads when working for a long time. In view of this, a patch LED lamp bead is provided. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the disadvantages of the above-mentioned prior art and provide a SMD LED lamp bead.

[0005] The technical solution adopted to solve the above technical problems is:

[0006] A chip LED lamp bead comprises a packaging block, a circuit board and a chip, wherein the chip is built into the packaging block, the circuit board supplies power to the chip, and further comprises:

[0007] A shell wrapped around the outer side of the packaging block, wherein the vertical side wall of the shell has a light outlet, an electrode port is provided through the end of the shell, and a heat sink port is provided in the middle of the shell;

[0008] A heat sink frame in direct contact with the wafer, the heat sink frame is embedded in the heat sink opening, the heat sink frame includes a vertical plate, the vertical plate is vertically arranged on the side of the shell away from the light outlet, the wafer is fixed to the vertical side wall of the vertical plate, the vertical plate is provided with a horizontal bottom plate at the bottom end of the wafer, a liner block 2 is provided at an angle between the top surface of the bottom plate and the vertical side wall of the side of the wafer mounted on the vertical plate, the vertical plate is provided with a horizontal top plate at the top end of the wafer, a liner block 1 is provided at an angle between the bottom surface of the top plate and the vertical side wall of the side of the wafer mounted on the vertical plate, and the liner block 1 and the liner block 2 are inclined toward the end surface of one side of the wafer toward the light outlet;

[0009] An electrode holder for supplying power to the chip, a separation gap is provided between the electrode holder and the heat sink frame, the electrode holder is embedded in the electrode port, the electrode holder includes an inner plate, a gold wire is welded and installed between the inner plate and the chip, a horizontal portion is provided at the bottom end of the inner plate, a vertical outer plate is provided at one end of the horizontal portion located outside the outer shell, and a vertical portion is installed between the outer plate and the vertical side walls of the inner plate.

[0010] During welding, the two electrode holders of the LED lamp bead are welded to the supply electrode of the circuit board. The horizontal part is used for welding, and the outer plate can be used to dissipate the heat generated by the resistance at the welding point when power is turned on. The heat sink frame dissipates heat for the chip in a targeted manner. There is a gap between the inner plate and the heat sink frame, which can be used for electric heat isolation, reduce the mutual influence between electric heat and photoheat, and avoid photoheat causing desoldering of the electrode holder welding position. Because of the light output angle problem of the side-emitting lamp bead, more total reflection will occur in the dead zone positions at the top and bottom. The bottom plate of the heat sink frame can absorb the heat generated by the total reflection of the light below, while the top plate of the heat sink frame can absorb the heat generated by the total reflection of the light above, and transfer it to the outside of the shell for transmission. The bottom plate of the heat sink frame can directly contact the circuit board and disperse part of the heat into the circuit board for dissipation. Pads one and two can reflect the light in the dead zone to the light outlet, reduce the total reflection of the light, reduce photothermal phenomena, and improve light utilization.

[0011] Furthermore, a rib is fixedly installed between the bottom plate and the top plate, the rib is fixedly connected to the vertical side wall of the vertical plate, and the rib extends to the outside of the shell away from the side of the wafer.

[0012] Through the above technical solution, the setting of the ribs helps the bottom plate and the top plate to contact the air outside the shell for more efficient heat dissipation, and can improve the structural strength of the top plate position to avoid the horizontal top plate being squeezed and twisted when the patch is picked up, thereby ensuring the tightness of the package.

[0013] Furthermore, a reflective block is installed on the top surface of the base plate at one end of the backing block 2 away from the chip, the inclination direction of the side wall of the reflective block toward the chip is opposite to the inclination direction of the side wall of the backing block 2 toward the chip, and the height of the reflective block is less than half of the height of the backing block 2.

[0014] Through the above technical solution, the reflective block is set directly below the chip and arranged at the light output position below the chip, reflecting part of the light emitted downward and emitting it from the upper position, reducing the amount of light output near the lower position of the chip, reducing the brightness of the light spot near the LED lamp bead position, and avoiding local overbrightness and halo.

[0015] Furthermore, the shell is provided with a convex edge between the electrode seat and the bottom plate, and the convex edge is bent and extended toward the electrode seat to form an L-shape.

[0016] Through the above technical solution, the convex edge separates the electrode seat and the base plate to prevent the solder from connecting the electrode seat and the base plate during welding, thereby preventing a short circuit and preventing heat transfer between the electrode seat and the base plate through the solder. The L-shaped convex edge can increase the contact area with the circuit board when soldering and mounting the LED lamp beads, thereby preventing the overall narrow side-emitting LED lamp beads from tilting, ensuring a better fit, reducing uneven solder thickness caused by tilting, and avoiding abnormal heat caused by excessive resistance at the welding point.

[0017] Furthermore, the bottom surface of the bottom plate is flush with the bottom surface of the outer shell, and a grid groove is provided on the bottom surface of the bottom plate.

[0018] Through the above technical solution, after welding, the base plate will be in direct contact with the circuit board for heat conduction. The grid groove has a larger contact area, and more thermal grease can be filled between the base plate and the circuit board, thereby improving the efficiency of the heat sink frame using the circuit board to dissipate heat from the chip.

[0019] Furthermore, the circuit board includes a relay plate, and the relay plate is provided with a support plate just below the bottom plate, and grid solder is filled between the top surface of the support plate and the grid groove.

[0020] Through the above technical solution, in order to improve the auxiliary heat dissipation effect of the circuit board, a relay sheet can be added to the circuit board. The relay sheet is made of metal, which has better thermal conductivity than the plastic material of the circuit board. The support plate can transfer the heat absorbed by the heat sink to other positions using the strip-shaped relay sheet to avoid accumulation at the location where the LED lamp beads are mounted, thereby reducing the impact of light and heat on the stability of the electrode welding point.

[0021] Furthermore, the circuit board also includes a positive electrode sheet and a negative electrode sheet, and sheet solders are respectively provided between the positive electrode sheet and the negative electrode sheet and the two electrode seats. The sheet solders are located between the electrode seats and the electrode openings to form a filling portion, and a drainage groove is formed between the convex edge and the electrode seats.

[0022] Through the above technical solution, the positive electrode sheet and the negative electrode sheet are both in the shape of strips. As power supply components, they are insulated from each other and located at the welding position of the electrode holder. The sheet solder will fill the gaps between the electrode holder and the positive electrode sheet, and between the electrode holder and the negative electrode sheet. At the same time, it will fill the drainage groove, so that there is a larger contact area between the outer shell and the positive electrode sheet and the negative electrode sheet, thereby improving the welding firmness and reducing the resistance at the welding point.

[0023] Furthermore, two ears are provided on the upper part of the vertical plate, and the two ears are located on the side of the vertical plate close to the inner plate. The ears extend above the inner plate, and the top plate extends horizontally and is flush with the ears.

[0024] Through the above technical solution, the provision of the ears increases the contact area between the vertical plate and the top plate, and can increase the path for light and heat to propagate on the upper part of the shell. At the same time, the ears and the inner plate will maintain a distance to avoid excessive heat interference between the chips and the power supply lines.

[0025] Furthermore, the shell is provided with an oblique end surface on one side of the light outlet, the top of the oblique end surface is inclined toward the heat sink, and the end surface of the packaging block on the light outlet side is flush with the oblique end surface.

[0026] Through the above technical solution, the inclined end surface can reduce the upper thickness of the LED lamp bead, so that the light is less blocked when escaping from the upper part, further reducing the dead zone range, making it easier for the light to be emitted. It can also reduce the overall thickness of the upper part of the shell where heat dissipation is difficult, thereby reducing the heat accumulation in the upper inner part of the shell, avoiding deformation or even cracking caused by local overheating of the LED lamp bead.

[0027] Furthermore, a through hole is opened in the middle of the outer plate, and a limit block is provided on the shell between the outer plate and the inner plate. The outer wall of the limit block is in direct contact with the vertical part and the horizontal part, and a pin is installed at the position of the limit block corresponding to the through hole.

[0028] Through the above technical solution, the pin is inserted into the through hole and cooperates with the limit block to press against the vertical and horizontal positions, which can increase the contact stability between the outer plate and the shell and play a positioning role. When performing gold wire welding and casting and curing of the packaging block, the electrode seat can be avoided from displacement to prevent dislocation or breakage.

[0029] The beneficial effects of the present invention are as follows:

[0030] (1) The present invention adopts the design of the heat sink frame. Because the heat dissipation of the side-emitting LED is not smooth at the top, there is a large range of light dead zone at the top and bottom positions, which causes too much light to be totally reflected in the dead zone. The heat sink frame runs through the upper and lower dead zones of the LED lamp beads. The lining blocks 1 and 2 reduce the dead zone range and increase the surface area. The heat in the dead zone, especially the top dead zone, is quickly dissipated. The light can also be reflected out of the dead zone, thereby reducing the heat generation of the side-emitting lamp beads.

[0031] (2) The present invention optimizes the electrode holder, arranges the two electrode holders apart, and designs an installation gap between the electrode holders and the heat sink frame to reduce the mutual interference between light heat and electric heat. The electrode holder has a high shape, high structural strength, and good welding level, which can increase the amount of solder and improve the welding firmness. It can also increase more welding contact area, reduce the resistance at the welding point, and alleviate the electric heating phenomenon.

[0032] (3) The present invention reduces the thickness of the upper part of the LED lamp bead by setting the shell and the inclined end surface, so that the light is less blocked when escaping from the upper part, further reducing the dead zone range at the top of the shell and alleviating the heating condition. The top of the inclined end surface is inclined toward the heat sink, and the top plate can extend backward without affecting the dead zone range of the front part of the shell 1. At the same time, the top of the overall narrow side-emitting LED lamp bead is directionally widened to ensure that the LED mounting equipment can smoothly pick up the lamp bead. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a first perspective structural diagram of the present invention;

[0034] Figure 2 It is a second viewing angle structural diagram of the present invention;

[0035] Figure 3 It is a schematic diagram of the structure inside the housing of the present invention;

[0036] Figure 4 is a schematic diagram of the position between the heat sink and the wafer of the present invention;

[0037] Figure 5 It is a schematic diagram of the positions of the electrode holder, the heat sink and the wafer of the present invention;

[0038] Figure 6 It is another schematic diagram of the structure between the heat sink and the wafer of the present invention;

[0039] Figure 7 is a schematic diagram of the side view structure of the housing of the present invention;

[0040] Figure 8 It is a three-dimensional structural schematic diagram of the housing of the present invention;

[0041] Fig. 9 It is a structural schematic diagram of the LED lamp bead and its circuit board of the present invention;

[0042] Fig.10 It is an enlarged schematic diagram of the circuit board of the present invention.

[0043] Figure numerals: 1. shell; 11. shell; 12. pin; 13. inclined end face; 14. drainage groove; 15. electrode port; 16. convex edge; 17. light outlet; 18. limit block; 19. heat sink port; 2. circuit board; 3. chip; 4. packaging block; 5. electrode seat; 51. outer plate; 52. vertical part; 53. horizontal part; 54. inner plate; 6. heat sink frame; 61. bottom plate; 62. top plate; 63. grid groove; 64. rib; 65. vertical plate; 66. pad one; 67. pad two; 68. reflective block; 69. ear; 7. gold wire; 81. positive electrode sheet; 82. negative electrode sheet; 83. relay sheet; 91. sheet solder; 92. grid solder; 93. filling part. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0045] like Figure 1 - Fig.10 As shown, this embodiment provides a patch LED lamp bead, referring to Figure 1 and Figure 3 , including a packaging block 4, a circuit board 2 and a chip 3, the chip 3 is built in the packaging block 4, the packaging block 4 is made by curing the packaging material, and the circuit board 2 supplies power to the chip 3;

[0046] For the housing 1, refer to Figure 7 and Figure 8 The housing 1 is wrapped around the outside of the packaging block 4. The vertical side wall of the housing 1 has a light outlet 17. The light outlet 17 is located at the vertical side wall at the front end of the housing 1 to form a basic shell of a side-emitting LED lamp bead. The end of the housing 1 is penetrated by an electrode port 15. There are two electrode ports 15 and they are arranged at both ends of the long axis of the housing 1 to increase the distance between the two electrodes. A heat sink port 19 is opened in the middle of the housing 1. The bottom of the heat sink port 19 is completely open to install a heat sink frame 6 with a wider bottom.

[0047] For heat sink 6, refer to Figure 3 The front vertical side wall of the heat sink 6 is in direct contact with the wafer 3, and, in order to ensure insulation, an insulating thermally conductive solder is provided, wherein, with reference to Figure 4 The heat sink frame 6 is embedded in the heat sink opening 19. The heat sink frame 6 includes a vertical plate 65. The vertical plate 65 is vertically arranged on the side of the housing 1 away from the light outlet 17 so as to emit light toward the light outlet 17. The chip 3 is fixed to the vertical side wall of the vertical plate 65 to center the chip 3 in the vertical direction. At the same time, the vertical plate 65 is provided with a horizontal bottom plate 61 at the bottom end of the chip 3. A liner block 2 67 is provided at an angle between the top surface of the bottom plate 61 and the vertical side wall of the vertical plate 65 on the side where the chip 3 is installed. The vertical plate 65 is provided with a horizontal top plate 62 at the top end of the chip 3. A liner block 1 66 is provided at an angle between the bottom surface of the top plate 62 and the vertical side wall of the vertical plate 65 on the side where the chip 3 is installed. Figure 3 The end surface of the liner block 1 66 and the liner block 2 67 facing the chip 3 is inclined toward the light outlet 17, which reduces the dead zone range and increases the heat absorption area in the dead zone. The light from the upper and lower parts of the chip 3 can be reflected toward the light outlet 17, thereby improving the light utilization rate, avoiding excessive light from being totally reflected at the top and bottom of the housing 1 and turning into heat, and reducing the heat generation of the lamp beads;

[0048] Regarding the electrode holder 5, the electrode holder 5 supplies power to the wafer 3. Figure 3There are two electrode holders 5, and a separation gap is provided between the electrode holder 5 and the heat sink 6 to prevent the heat of the heat sink 6 from interfering with the temperature of the electrode holder 5. At the same time, the electrode holder 5 is embedded in the electrode port 15, and the installation is more stable. Figure 5 The electrode holder 5 includes an inner plate 54, which extends to the inner side of the outer shell 1. A gold wire 7 is welded and installed between the inner plate 54 and the chip 3. At the same time, a horizontal portion 53 is horizontally arranged at the bottom end of the inner plate 54. The horizontal portion 53 can increase the horizontal contact area with the circuit board 2, making the welding more horizontal and stable. In addition, a vertical outer plate 51 is provided at one end of the horizontal portion 53 located on the outer side of the outer shell 1. The outer plate 51 can increase the contact area with the air, and the electrode holder 5 itself can be cooled during the lighting operation. At the same time, a vertical portion 52 is installed between the vertical side walls of the outer plate 51 and the inner plate 54, which can form a relatively stable semi-enclosed three-dimensional structure with greater structural strength and less prone to deformation. It can also increase more surface area for welding fixation and heat dissipation.

[0049] In a further embodiment, referring to Figure 2 A rib 64 is fixedly installed between the bottom plate 61 and the top plate 62. The rib 64 extends to the outside of the housing 1 away from the side of the chip 3, assisting the bottom plate 61 and the top plate 62 to contact the air outside the housing 1, and can improve the structural strength of the top plate 62. The rib 64 is fixedly connected to the vertical side wall of the vertical plate 65 for more efficient heat dissipation, avoiding the horizontal top plate 62 from being squeezed and twisted when the patch is picked up, thereby ensuring the tightness of the package.

[0050] In a further embodiment, referring to Figure 5 and Figure 6 The top surface of the bottom plate 61 is located at the end of the backing block 2 67 away from the chip 3 and a reflective block 68 is installed. The reflective block 68 is arranged directly below the chip 3 and arranged at the light output position below the chip 3. The inclination direction of the reflective block 68 toward the side wall of the chip 3 is opposite to the inclination direction of the backing block 2 67 toward the side wall of the chip 3, so that part of the light emitted downward is reflected and emitted from the upper position, thereby reducing the amount of light output near the lower position of the chip 3, reducing the brightness of the light spot near the position of the LED lamp beads, and avoiding local overbrightness and halo. It should be noted that the height of the reflective block 68 is less than half the height of the backing block 2 67, and it will only reflect back a narrow range of light, and will not block a large range of light to cause the brightness directly below the chip 3 to be too low. In addition, multiple hemispheres, prisms or other astigmatism structures can be set on the top surface of the reflective block 68 to diffusely reflect the light irradiated on the top of the reflective block 68 to prevent the appearance of an obvious dividing line at the irradiation position and ensure the lighting effect.

[0051] In a further embodiment, referring to Figure 2 and Figure 8The shell 11 is provided with a convex edge 16 between the electrode seat 5 and the bottom plate 61. The convex edge 16 separates the electrode seat 5 and the bottom plate 61 to prevent the solder from connecting the electrode seat 5 and the bottom plate 61 during welding, thereby preventing a short circuit. At the same time, heat transfer between the electrode seat 5 and the bottom plate 61 through the solder can also be avoided. It should be noted that the convex edge 16 is bent and extended toward the electrode seat 5 to form an L-shape. The L-shaped convex edge 16 can increase the contact area with the circuit board 2 when the LED lamp beads are soldered and mounted, thereby preventing the overall narrow side-emitting LED lamp beads from tilting, ensuring a better fit, reducing uneven solder thickness caused by tilting, and avoiding abnormal heat caused by excessive resistance at the welding point.

[0052] In a further embodiment, referring to Figure 2 and Figure 3 The bottom surface of the bottom plate 61 is flush with the bottom surface of the housing 1. After welding, the bottom plate 61 will be in direct contact with the circuit board 2 for heat conduction. In addition, a grid groove 63 is provided at the bottom surface of the bottom plate 61. The grid groove 63 has a larger contact area, and more thermal conductive silicone grease can be filled between the bottom plate 61 and the circuit board 2, thereby improving the efficiency of the heat sink 6 using the circuit board 2 to dissipate heat to the chip 3.

[0053] In a further embodiment, referring to Fig.10 In order to increase the auxiliary heat dissipation effect of the circuit board 2, the circuit board 2 includes a relay sheet 83. The relay sheet 83 is made of metal. Compared with the plastic material of the circuit board 2, it has a better thermal conductivity. In addition, the relay sheet 83 is provided with a support plate directly below the bottom plate 61. The support plate can transfer the heat absorbed by the heat sink frame 6 to other positions using the strip-shaped relay sheet 83 to avoid accumulation at the position where the LED lamp beads are mounted. The top surface of the support plate and the grid groove 63 are filled with grid solder 92, which can be fixed to avoid virtual connection. It can also fill the gap to improve the thermal conductivity efficiency and reduce the influence of light and heat on the stability of the electrode welding point.

[0054] In a further embodiment, referring to Fig. 9 and Fig.10The circuit board 2 also includes a positive electrode sheet 81 and a negative electrode sheet 82. The positive electrode sheet 81 and the negative electrode sheet 82 are both in strip shape and serve as power supply components. They are insulated from each other. A sheet solder 91 is provided between the positive electrode sheet 81 and the negative electrode sheet 82 and the two electrode holders 5, respectively, so that they can be stably welded with the electrode holders 5. The sheet solder 91 is located between the electrode holder 5 and the electrode port 15 to form a filling portion 93. The filling portion 93 will fill the gap between the electrode holder 5 and the positive electrode sheet 81, and between the electrode holder 5 and the negative electrode sheet 82. A drainage groove 14 is formed between the convex edge 16 and the electrode holder 5. At the same time, the solder will be filled in the drainage groove 14, so that the outer shell 1 has a larger contact area with the positive electrode sheet 81 and the negative electrode sheet 82. When the gap between the electrode holder 5 and the positive electrode sheet 81 and the negative electrode sheet 82 is small, more solder can be accommodated, thereby improving the welding firmness and reducing the resistance at the welding point.

[0055] In a further embodiment, referring to Figure 5 Two ears 69 are provided on the upper part of the vertical plate 65, and the two ears 69 are located on the side of the vertical plate 65 close to the inner plate 54. The provision of the ears 69 increases the contact area between the vertical plate 65 and the top plate 62, and can increase the path for light and heat to be transmitted on the upper part of the shell 1. At the same time, the ears 69 extend above the inner plate 54, and the top plate 62 extends horizontally to be flush with the ears 69. The ears 69 and the inner plate 54 will also maintain a distance to avoid excessive heat interference between the chip 3 and the power supply line.

[0056] In a further embodiment, referring to Figure 7 and Figure 8 The shell 11 is provided with an inclined end surface 13 on one side of the light outlet 17. The inclined end surface 13 can reduce the upper thickness of the LED lamp bead, and the light is less blocked when escaping from the upper part, further reducing the dead zone range at the top of the shell 1, making it easier for the light to be emitted. The top of the inclined end surface 13 is inclined toward the heat sink 6, and can also reduce the overall thickness of the upper part of the shell 1 where heat dissipation is difficult, thereby reducing the heat accumulation in the upper inner part of the shell 1, and avoiding deformation or even cracking of the LED lamp bead caused by local overheating. The end surface of the packaging block 4 on the side of the light outlet 17 is flush with the inclined end surface 13. It should be noted that the top plate 62 can extend backward without affecting the dead zone range of the front part of the shell 1, thereby widening the overall narrow top of the side-emitting LED lamp bead, and also facilitating the LED mounting equipment to pick up the LED lamp bead.

[0057] In a further embodiment, referring to Figure 2 and Figure 8A limit block 18 is provided between the outer plate 51 and the inner plate 54 of the shell 11. A through hole is opened in the middle of the outer plate 51. A pin 12 is installed at the position of the limit block 18 corresponding to the through hole. The pin 12 is inserted into the through hole. At the same time, the outer wall of the limit block 18 is in direct contact with the vertical portion 52 and the horizontal portion 53. The limit block 18 is tightly pressed against the vertical portion 52 and the horizontal portion 53, which can increase the contact stability between the outer plate 51 and the shell 11 and play a positioning role. In addition, this limitation can avoid displacement of the electrode holder 5 when the gold wire 7 is welded and the packaging block 4 is cast and solidified, and prevent misalignment or breakage.

[0058] The working principle of this embodiment is as follows:

[0059] When the chip is picked up, the top plate 62 can be extended in the direction away from the wafer 3, thereby widening the top of the overall narrow side-emitting LED lamp bead, making it easier for the LED mounting equipment to pick up the LED lamp bead without affecting the dead zone range of the front part of the housing 1;

[0060] When the welding is solidified, the two electrode seats 5 of the LED lamp bead are welded to the supply electrode of the circuit board 2, and the bottom surface of the horizontal portion 53 is used to be welded and fixed to the top surface of the circuit board 2. The bottom surface of the L-shaped convex edge 16 is flush with the bottom surface of the horizontal portion 53. When the LED lamp bead is welded and mounted, the convex edge 16 cooperates with the electrode seat 5 to increase the effective contact area between the welding position, which can increase the total span of the contact surface between the electrode seat 5 and the circuit board 2, and provide auxiliary support to avoid the overall narrow side-emitting LED lamp bead from tilting;

[0061] After welding, when the gap between the electrode holder 5 and the positive electrode sheet 81 and the negative electrode sheet 82 is small, the solder will fill the drainage groove 14, so that more solder can be accommodated between the housing 1 and the positive electrode sheet 81 and the negative electrode sheet 82, thereby improving the welding firmness and reducing the resistance at the welding point;

[0062] When the light is on, the heat sink 6 dissipates heat to the chip 3 in a targeted manner, and the outer plate 51 can be used to dissipate the heat generated by the resistance at the welding point when the power is turned on. There is a gap between the inner plate 54 and the heat sink 6, which can be used for electric heat isolation, reduce the mutual influence between electric heat and light heat, and avoid light heat causing the welding position of the electrode holder 5 to be desoldered;

[0063] In order to alleviate the heating in the top and bottom dead zones of the side-emitting LED lamp beads, the liner block 1 66 and the liner block 2 67 can reflect the light in the dead zones toward the light outlet 17, reduce the total reflection of the light, and improve the light utilization rate. At the same time, the bottom plate 61 of the heat sink frame 6 can absorb the heat generated by the total reflection of the light below, while the top plate 62 of the heat sink frame 6 can absorb the heat generated by the total reflection of the light above, and transfer it to the outside of the shell 1 for transfer. The bottom plate 61 of the heat sink frame 6 can directly contact the circuit board 2, disperse part of the heat into the circuit board 2, and reduce the photothermal phenomenon.

[0064] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention.

Claims

1. A SMD LED lamp bead, comprising a packaging block (4), a circuit board (2) and a chip (3), wherein the chip (3) is built into the packaging block (4), and the circuit board (2) supplies power to the chip (3), characterized in that: Also includes: A shell (1) wrapped around the outside of the packaging block (4), the vertical side wall of the shell (1) having a light outlet (17), an electrode port (15) penetrating through the end of the shell (1), and a heat sink port (19) in the middle of the shell (1); A heat sink frame (6) in direct contact with the chip (3), the heat sink frame (6) being embedded in the heat sink opening (19), the heat sink frame (6) comprising a vertical plate (65), the vertical plate (65) being vertically arranged on a side of the housing (1) away from the light outlet (17), the chip (3) being fixed to a vertical side wall of the vertical plate (65), the vertical plate (65) being provided with a horizontal bottom plate (61) at the bottom end of the chip (3), a second pad (67) being provided at an angle between the top surface of the bottom plate (61) and the vertical side wall of the vertical plate (65) on the side where the chip (3) is mounted, the vertical plate (65) being provided with a horizontal top plate (62) at the top end of the chip (3), a first pad (66) being provided at an angle between the bottom surface of the top plate (62) and the vertical side wall of the vertical plate (65) on the side where the chip (3) is mounted, the first pad (66) and the second pad (67) being inclined toward the end surface of one side of the chip (3) towards the light outlet (17); An electrode holder (5) for supplying power to a wafer (3), a separation gap being provided between the electrode holder (5) and the heat sink frame (6), the electrode holder (5) being embedded and installed in the electrode port (15), the electrode holder (5) comprising an inner plate (54), a gold wire (7) being welded and installed between the inner plate (54) and the wafer (3), a horizontal portion (53) being provided at the bottom end of the inner plate (54), a vertical outer plate (51) being provided at one end of the horizontal portion (53) being located outside the housing (1), and a vertical portion (52) being installed between the vertical side walls of the outer plate (51) and the inner plate (54); The housing (1) comprises a shell (11), wherein the shell (11) is provided with a convex edge (16) between the electrode seat (5) and the bottom plate (61), and the convex edge (16) is bent and extended in the direction of the electrode seat (5) to form an L-shape.

2. The SMD LED lamp bead according to claim 1, characterized in that: A rib (64) is fixedly mounted between the bottom plate (61) and the top plate (62), the rib (64) being fixedly connected to a vertical side wall of the vertical plate (65), and the rib (64) extending to the outside of the housing (1) away from a side of the wafer (3).

3. The SMD LED lamp bead according to claim 2, characterized in that: A reflective block (68) is installed on the top surface of the bottom plate (61) at the end of the backing block 2 (67) away from the wafer (3); the inclination direction of the reflective block (68) toward the side wall of the wafer (3) is opposite to the inclination direction of the backing block 2 (67) toward the side wall of the wafer (3); and the height of the reflective block (68) is less than half the height of the backing block 2 (67).

4. The SMD LED lamp bead according to claim 1, characterized in that: The bottom surface of the bottom plate (61) is flush with the bottom surface of the outer shell (1), and a grid groove (63) is provided on the bottom surface of the bottom plate (61).

5. The SMD LED lamp bead according to claim 4, characterized in that: The circuit board (2) comprises a relay sheet (83), wherein the relay sheet (83) is provided with a support plate located directly below the bottom plate (61), and grid solder (92) is filled between the top surface of the support plate and the grid groove (63).

6. The SMD LED lamp bead according to claim 5, characterized in that: The circuit board (2) further comprises a positive electrode sheet (81) and a negative electrode sheet (82); a drainage groove (14) is formed between the convex edge (16) and the electrode seat (5); sheet solder (91) is provided between the positive electrode sheet (81) and the negative electrode sheet (82) and the two electrode seats (5); the sheet solder (91) is located between the electrode seat (5) and the electrode opening (15) to form a filling portion (93).

7. The SMD LED lamp bead according to claim 1, characterized in that: Two ears (69) are provided on the upper part of the vertical plate (65). The two ears (69) are located on a side of the vertical plate (65) close to the inner plate (54). The ears (69) extend upwards from the inner plate (54). The top plate (62) extends horizontally and is flush with the ears (69).

8. The SMD LED lamp bead according to claim 7, characterized in that: The housing (11) is provided with an oblique end surface (13) on one side of the light outlet (17), the top end of the oblique end surface (13) being inclined in the direction of the heat sink (6), and the end surface of the packaging block (4) on the side of the light outlet (17) is flush with the oblique end surface (13).

9. The SMD LED lamp bead according to claim 8, characterized in that: A through hole is provided in the middle of the outer plate (51), and a limit block (18) is provided on the housing (11) between the outer plate (51) and the inner plate (54). The outer wall of the limit block (18) is in direct contact with the vertical portion (52) and the horizontal portion (53), and a pin (12) is installed at a position of the limit block (18) corresponding to the through hole.

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