Display panel, display mother board and display device

Abstract

The display panel comprises a substrate, a light-emitting device and a packaging structure layer which are stacked in sequence, and further comprises a first dam and a second dam which are located in a non-display area. Wherein the first dam surrounds the second dam, and the second dam surrounds the display area; the packaging structure layer comprises a first inorganic packaging layer and an organic packaging layer which are stacked, and the organic packaging layer is located on the side, close to the substrate, of the first inorganic packaging layer; the first part organic packaging layer is located between the first dam and the second dam, and the first inorganic packaging layer is stopped between the first dam and the second dam. The first dam surrounds the second dam, and the first inorganic packaging layer is stopped between the first dam and the second dam, so that the overflow part of the organic packaging layer is blocked on the side, close to the display area, of the first dam, and the influence of the overflow part of the organic packaging layer on the display panel is reduced; and the reliability of the display panel is effectively improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a display motherboard and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) is a current-type light-emitting device that is widely used in display devices such as mobile phones and tablet computers due to its multiple characteristics such as self-luminescence, fast response, wide viewing angle and ability to be manufactured on flexible substrates.

[0003] However, there are still some problems in the packaging process of the OLED display panel in the prior art, which has a certain impact on the reliability and service life of the display panel. Summary of the invention

[0004] Embodiments of the present application provide a display panel, a display motherboard, and a display device, which are used to improve the problem that the packaging process affects the reliability of the display panel.

[0005] In a first aspect, a display panel is provided, the display panel comprising a display area and a non-display area surrounding the display area, the display panel comprising a substrate, a light emitting device, a first dam, a second dam and an encapsulation structure layer.

[0006] Among them, the light-emitting device is located on one side of the substrate and in the display area; the first dam and the second dam are located in the non-display area, the first dam surrounds the second dam, and the second dam surrounds the display area; the encapsulation structure layer is located on the side of the light-emitting device away from the substrate, the encapsulation structure layer includes a stacked first inorganic encapsulation layer and an organic encapsulation layer, the organic encapsulation layer is located on the side of the first inorganic encapsulation layer close to the substrate; the first part of the organic encapsulation layer is located between the first dam and the second dam, and the first inorganic encapsulation layer ends between the first dam and the second dam.

[0007] In combination with the first aspect, in certain implementations of the first aspect, a height of the first dam is greater than a height of the second dam.

[0008] In combination with the first aspect, in some implementations of the first aspect, a thickness of the first portion of the organic encapsulation layer is less than or equal to a smaller value of a height of the first dam and a height of the second dam.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the first inorganic encapsulation layer is in contact with a sidewall of the first dam.

[0010] In combination with the first aspect, in some implementations of the first aspect, the encapsulation structure layer further includes a second inorganic encapsulation layer located on a side of the organic encapsulation layer close to the substrate, and the second inorganic encapsulation layer terminates between the first dam and the second dam.

[0011] In combination with the first aspect, in some implementations of the first aspect, on a surface of the second dam facing away from the substrate, the second inorganic encapsulation layer is in contact with the first inorganic encapsulation layer.

[0012] In combination with the first aspect, in some implementations of the first aspect, the second inorganic encapsulation layer is in contact with a sidewall of the first dam.

[0013] In combination with the first aspect, in certain implementations of the first aspect, the display panel also includes a third dam, which is located on the side of the second dam close to the display area, and the second portion of the organic encapsulation layer is located between the second dam and the third dam; the thickness of the second portion of the organic encapsulation layer is less than or equal to the smaller value of the height of the second dam and the third dam.

[0014] In combination with the first aspect, in some implementations of the first aspect, the first portion of the organic encapsulation layer and the second portion of the organic encapsulation layer are spaced apart.

[0015] In a second aspect, a display motherboard is provided, the display motherboard comprising a plurality of display panels of any one of the above items and a cutting line, wherein the cutting line is arranged around the display panels and is located between first dams of adjacent display panels.

[0016] In a third aspect, a display device is provided, comprising any one of the display panels described above.

[0017] The display panel in the embodiment of the present application includes a substrate, a light-emitting device, and a packaging structure layer stacked in sequence, and also includes a first dam and a second dam located in a non-display area. The first dam surrounds the second dam, and the second dam surrounds the display area; the packaging structure layer includes a first inorganic packaging layer and an organic packaging layer stacked, and the organic packaging layer is located on the side of the first inorganic packaging layer close to the substrate; the first part of the organic packaging layer is located between the first dam and the second dam, and the first inorganic packaging layer ends between the first dam and the second dam.

[0018] The present application sets a first dam surrounding a second dam, and the first inorganic encapsulation layer ends between the first dam and the second dam, so as to block the overflow portion of the organic encapsulation layer on the side of the first dam close to the display area, thereby reducing the impact of the overflow portion of the organic encapsulation layer on the display panel, thereby effectively improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0020] Figure 1a It is a schematic diagram of a partial film layer structure of a display panel in the prior art.

[0021] Figure 1b for Figure 1a A top view of the panel is shown in FIG.

[0022] Figure 1c for Figure 1b The cross-sectional structure diagram of the display panel along the AA' direction is shown in FIG.

[0023] Figure 2a FIG. 1 is a schematic diagram of a partial film layer structure of a display panel in an embodiment of the present application.

[0024] Figure 2b FIG. 1 is a schematic diagram of a cross-sectional structure of a display panel in an embodiment of the present application.

[0025] Figure 2c for Figure 2b The cross-sectional structure diagram of the display panel along the AA' direction is shown in FIG.

[0026] Figure 3 A top view of a motherboard is shown in one embodiment of the present application.

[0027] Figure 4a It is a top view of a display motherboard in another embodiment of the present application.

[0028] Figure 4b yes Figure 4a The schematic diagram of the cross-sectional structure of the motherboard along the AA' direction is shown in FIG. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application. The features and exemplary embodiments of various aspects of the present application will be described in detail below.

[0030] Figure 1a It is a schematic diagram of a part of the film layer structure of a display panel in the prior art. Figure 1b for Figure 1a The top view of the display panel is shown in Figure 1c for Figure 1b The cross-sectional structure diagram of the panel along the A-A' direction is shown in FIG. Figure 1a , Figure 1band Figure 1c As shown, the display panel includes a display area AA and a non-display area NA surrounding the display area AA, and the non-display area NA also includes a bending area B. The display panel includes a substrate 100, a light-emitting device 200, a second dam 300, and an encapsulation structure layer 400. The light-emitting device 200 is located on one side of the substrate 100 and is located in the display area AA. The second dam 300 surrounds the display area AA, the second dam 300 is located on one side of the substrate 100, and the encapsulation structure layer 400 is located on a side of the second dam 300 away from the substrate 100. The encapsulation structure layer 400 includes a first inorganic encapsulation layer 410 and an organic encapsulation layer 420 stacked, and the organic encapsulation layer 420 is located on a side of the first inorganic encapsulation layer 410 close to the substrate 100.

[0031] In addition, the edge of the display panel also includes a cutting line C and a cutting path D centered on the cutting line C. It can be understood that the cutting line C is a straight line or curve pre-set on the display motherboard, and these lines indicate the position where the display motherboard is cut; the cutting path D is the actual track left by the cutting equipment in the process of cutting the display motherboard into multiple display panels along the cutting line.

[0032] Generally, the organic material forming the organic encapsulation layer 420 has good fluidity and is prone to overflow. The second dam 300 is provided to prevent the overflow of the organic material in the organic encapsulation layer 420. However, since the second dam 200 is close to the display area, the blocking ability of the second dam 300 is usually limited and cannot completely block the organic material. Figure 1a , Figure 1b and Figure 1c As shown, the organic material forming the organic encapsulation layer 420 overflows outside the second bank 300 and overflows into the cutting road D located at the edge of the substrate 100. The overflowing organic material may damage the encapsulation layer, making the display panel more susceptible to environmental damage, accelerating the aging process, and reducing the service life of the display panel.

[0033] In addition, Figure 1b As shown, the display panel also includes a bending area B located in the non-display area NA of the display panel. The overflowed organic material may flow along the cutting path D to the bending area B and accumulate in the bending area B. The bending area B will generate stress during repeated bending. The overflowed organic material may cause uneven distribution of the material in the bending area B, increase stress concentration points, thereby increasing the risk of crack generation and expansion, and reducing the reliability of the display panel.

[0034] In view of this, the present application provides a display panel, a display motherboard and a display device, which are used to reduce the influence of the overflow part of the organic encapsulation layer on the display panel. The present application sets a first dam to surround the second dam, and the first inorganic encapsulation layer is terminated between the first dam and the second dam, so as to block the overflow part of the organic encapsulation layer on the side of the first dam close to the display area, thereby reducing the influence of the overflow part of the organic encapsulation layer on the display panel, thereby effectively improving the reliability of the display panel.

[0035] Figure 2a This is a schematic diagram of a partial film layer structure of a display panel in an embodiment of the present application. Figure 2b is a schematic diagram of a cross-sectional structure of a display panel in an embodiment of the present application, Figure 2c for Figure 2b The cross-sectional structure diagram of the panel along the A-A' direction is shown in FIG. Figure 1a , Figure 1b and Figure 1c compared to, Figure 2a , Figure 2b and Figure 2c The display panel shown in FIG. 1 further includes a first dam 500 disposed on a side of the second dam 300 away from the display area AA.

[0036] Specifically, the display panel includes a display area AA and a non-display area NA surrounding the display area AA, and the display panel includes a substrate 100 , a light emitting device 200 , a first dam 500 , a second dam 300 , and an encapsulation structure layer 400 .

[0037] The light emitting device 200 is located on one side of the substrate 100 and in the display area AA; the first dam 500 and the second dam 300 are located in the non-display area NA, the first dam 500 surrounds the second dam 300, and the second dam 300 surrounds the display area AA. The encapsulation structure layer 400 is located on the side of the light emitting device 200 away from the substrate 100, and the encapsulation structure layer 400 includes a stacked first inorganic encapsulation layer 410 and an organic encapsulation layer 420, and the organic encapsulation layer 420 is located on the side of the first inorganic encapsulation layer 410 close to the substrate 100; the organic encapsulation layer 420 includes a first portion of the organic encapsulation layer 421, and the first portion of the organic encapsulation layer 421 is located between the first dam 500 and the second dam 300, and the first inorganic encapsulation layer 410 ends between the first dam 500 and the second dam 300.

[0038] In this embodiment, a first dam 500 is arranged to surround the second dam 300, and the first inorganic encapsulation layer 410 is terminated between the first dam 500 and the second dam 300, so as to block the overflow portion of the organic encapsulation layer 420 on the side of the first dam 500 close to the display area AA, thereby reducing the probability of the overflow portion of the organic encapsulation layer 420 flowing to the bending area B, reducing the influence of the overflow portion of the organic encapsulation layer 420 on the display panel, and thus effectively improving the reliability of the display panel.

[0039] In one embodiment, the substrate 100 may be a flexible substrate 100 made of materials such as polyimide (PI) and polyethylene terephthalate (PET), so that the non-display area NA of the display panel can be bent.

[0040] In one embodiment, the light emitting device 200 includes an anode layer 210, a light emitting layer 220 and a cathode layer 230, and the light emitting layer 220 includes a light emitting material layer, a hole transport layer and an electron transport layer, etc. When the anode layer 210 and the cathode layer 230 are energized, electrons and holes migrate from the electron transport layer and the hole transport layer to the light emitting material layer, respectively, and meet in the light emitting material layer to form excitons to excite the light emitting molecules, thereby generating visible light to achieve the purpose of display.

[0041] In one embodiment, the material of the first dam 500 can be selected from organic materials such as polyamide (PA), polyimide (PI), polyethylene (PE) or polyester (PET). Organic materials are not only convenient for preparing a thicker first dam 500, but also because the first dam 500 is located near the cutting line C, the organic material can buffer the stress of cutting, and the cutting and bending forces are stronger than those of inorganic materials.

[0042] In one embodiment, the second dam 300 may be made of an organic material such as polyamide (PA), polyimide (PI), polyethylene (PE) or polyester (PET).

[0043] In one embodiment, the second dam 300 is made of the same material as the first dam 500 in order to simplify the manufacturing process and improve production efficiency.

[0044] In one embodiment, the height of the first dam 500 is greater than the height of the second dam 300. In this embodiment, by setting the height of the first dam 500 to be greater than the height of the second dam 300, it can be ensured that the first dam 500 can block the organic material overflowing from the second dam 300 to the maximum extent, thereby effectively improving the reliability of the display panel.

[0045] In one embodiment, the main function of the organic encapsulation layer 420 is to protect the light-emitting device from moisture and oxygen in the external environment together with the inorganic encapsulation layer, thereby ensuring the stability of the light-emitting device to extend its service life. Among them, the organic encapsulation layer mainly plays a flattening role. By providing a flat surface, the flattening layer can reduce display quality problems caused by surface unevenness, such as uneven brightness or image distortion.

[0046] In one embodiment, the material of the organic encapsulation layer 420 includes organic polymers, crosslinking agents, additives and other materials. Among them, the organic polymer is the main component of the organic encapsulation layer, and organic polymers with high barrier properties, good film-forming properties and mechanical strength are usually selected. These polymers can effectively block the penetration of moisture and oxygen, while maintaining sufficient flexibility and adhesion to adapt to various deformations of the display panel during manufacturing and use; the crosslinking agent is to improve the stability and durability of the organic encapsulation layer. The crosslinking agent can react chemically with the polymer molecules to form a three-dimensional network structure, thereby enhancing the mechanical strength and weather resistance of the encapsulation layer; in order to improve the performance of the organic encapsulation layer, some additives such as antioxidants, UV inhibitors, etc. can also be added. These additives can improve the anti-oxidation and anti-aging capabilities of the encapsulation layer, and further extend the service life of the light-emitting device.

[0047] In one embodiment, the preparation method of the organic encapsulation layer 420 includes but is not limited to solution coating, spray coating or spin coating, and the organic material is uniformly coated on the light-emitting device by the above method, and the polymer is cross-linked and cured by heat treatment or ultraviolet irradiation to form a dense encapsulation layer. However, in the preparation process, if the coating amount is too large, the coating is uneven, the substrate is uneven, and the ambient humidity and temperature cause the fluidity of the organic material to increase, the organic material forming the organic encapsulation layer 420 is prone to overflow.

[0048] In one embodiment, the thickness of the first portion of the organic encapsulation layer 421 is less than or equal to the smaller value of the height of the first dam 500 and the height of the second dam 300. Figure 2a As shown, overflow of organic materials can be further prevented.

[0049] In one embodiment, the first inorganic encapsulation layer 410 is in contact with the side wall of the first dam 500. Such a configuration is conducive to simplifying the preparation process of the encapsulation structure layer 400. Specifically, in the preparation process of the display panel of this embodiment, the light-emitting device 200, the first dam 500 and the second dam 300 can be first prepared on the substrate 100, and then the organic encapsulation layer 420 and the first inorganic encapsulation layer 410 are prepared on the side of the light-emitting device 200, the first dam 500 and the second dam 300 away from the substrate 100. Therefore, setting the first inorganic encapsulation layer 410 and the side wall of the first dam 500 in contact will make the operation of the deposition process more convenient during the preparation process, which is conducive to simplifying the preparation process of the encapsulation structure layer 400.

[0050] In one embodiment, the encapsulation structure layer 400 further includes a second inorganic encapsulation layer 430, which is located on the side of the organic encapsulation layer 420 close to the substrate 100, and the second inorganic encapsulation layer 430 ends between the first dam 500 and the second dam 300. Such a configuration is also conducive to simplifying the preparation process of the encapsulation structure layer 400. Specifically, in the preparation process of the display panel of this embodiment, the light-emitting device 200, the first dam 500 and the second dam 300 can be prepared on the substrate 100 first, and then the second inorganic encapsulation layer 430, the organic encapsulation layer 420 and the first inorganic encapsulation layer 410 are prepared on the side of the light-emitting device 200, the first dam 500 and the second dam 300 away from the substrate 100. Therefore, setting the second inorganic encapsulation layer 430 and the sidewall contact of the first dam 500 will make it more convenient to operate the deposition process during the preparation process, which is conducive to simplifying the preparation process of the encapsulation structure layer 400.

[0051] In one embodiment, the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 are mainly composed of inorganic materials, including but not limited to silicon-based materials such as silicon oxide and silicon nitride, glass materials, metal oxide materials, etc. The above-mentioned inorganic materials are usually required to have excellent barrier properties and stability, which play a key role in protecting the internal structure of the display panel and extending its life.

[0052] In one embodiment, the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 are precisely deposited on the surface of the display panel by sputtering, evaporation or coating to form a dense and continuous encapsulation layer. The main function of the inorganic encapsulation layer is to prevent the penetration of other harmful substances such as moisture, oxygen and ions, while providing mechanical protection to ensure the stability and reliability of the display panel.

[0053] In one embodiment, the second inorganic encapsulation layer 430 is in contact with the first inorganic encapsulation layer 410 on the surface of the second dam 300 facing away from the substrate 100. This embodiment ensures that the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 still have a certain area of ​​overlap area under the premise of blocking the overflow of organic materials of the organic encapsulation layer 420, which can ensure that the encapsulation of the display panel is more rigorous, and can also improve the mechanical properties of the overall encapsulation structure layer 400, which helps the display panel resist external impact, vibration and bending, etc., and reduces the damage that the display panel may suffer during transportation, installation and use.

[0054] In one embodiment, the second inorganic encapsulation layer 430 contacts the sidewall of the first bank 500. This configuration helps to simplify the preparation process of the encapsulation structure layer 400.

[0055] In one embodiment, a third dam 600 is further included, which is located on the side of the second dam 300 close to the display area AA, and the second portion of the organic encapsulation layer is located between the second dam 300 and the third dam 600; the thickness of the second portion of the organic encapsulation layer is less than or equal to the smaller value of the height of the second dam 300 and the third dam 600.

[0056] In one embodiment, the third dam 600 may be made of organic materials such as polyamide (PA), polyimide (PI), polyethylene (PE) or polyester (PET), and the organic materials are convenient for preparing a thicker third dam 600, thereby ensuring the anti-overflow effect of the third dam 600. The third dam 600 may also be made of the same material as the first dam 500 and the second dam 300, so as to facilitate the process preparation and improve the production efficiency.

[0057] In one embodiment, the first part of the organic encapsulation layer 421 and the second part of the organic encapsulation layer 422 are arranged at intervals. Such an arrangement is conducive to ensuring that there is a certain area of ​​overlap between the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430, that is, ensuring that the second inorganic encapsulation layer 430 and the first inorganic encapsulation layer 410 are in contact with each other in a certain area. The mutual overlap of the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 ensures that the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 still have a certain area of ​​overlap under the premise of blocking the overflow of the organic material of the organic encapsulation layer 420, which can ensure that the encapsulation of the display panel is more rigorous, and can also improve the mechanical properties of the overall encapsulation structure layer 400, which helps the display panel resist external impact, vibration and bending, and reduce the damage that the display panel may suffer during transportation, installation and use.

[0058] The present application also provides a display motherboard, the display motherboard includes a plurality of display panels of any one of the above items and a cutting line C, the cutting line C is arranged around the display panel, and the cutting line C is located between the first dams of adjacent display panels. Figure 3 As shown, Figure 3 A top view of a motherboard is shown in one embodiment of the present application.

[0059] In the manufacturing process of display panels, in order to improve production efficiency, a structure of multiple display panels is usually manufactured based on a display motherboard with a larger area, and then the display motherboard is cut along the cutting line to separate multiple independent display panels. Figure 3 As shown, the manufacturing process of the display panel of this embodiment is to prepare a driving circuit layer, a light-emitting device layer 200 and a packaging structure layer 400 on a substrate 100 of a display motherboard to form a plurality of display units U arranged in a matrix, and cut the plurality of display units U on the display motherboard. In order to obtain a display panel of a special shape, cutting is performed along a cutting line C of the display unit U.

[0060] In this embodiment, since the display motherboard adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments. Specifically, the display motherboard of this embodiment is provided with a first dam 500 surrounding the second dam 300, and the first inorganic encapsulation layer 410 is terminated between the first dam 500 and the second dam 300, so as to block the overflow part of the organic encapsulation layer 420 on the side of the first dam 500 close to the display area AA, thereby reducing the probability of the overflow part of the organic encapsulation layer 420 flowing to the bending area B, reducing the influence of the overflow part of the organic encapsulation layer 420 on the display panel, and thus effectively improving the reliability of the display panel.

[0061] In one embodiment, the display motherboard may also have only one display unit U, as shown in FIG. Figure 4a and Figure 4b . Figure 4a It is a top view of a display motherboard in another embodiment of the present application. Figure 4b yes Figure 4a The schematic diagram of the cross-sectional structure of the motherboard along the A-A' direction is shown in FIG. Figure 4a and Figure 4b As shown, the cutting line C in this embodiment is located at the edge of the display motherboard.

[0062] In one embodiment, the display motherboard further includes a fourth dam 700, and the fourth dam 700 is located between the first dam 500 and the cutting line C. Figure 4a and Figure 4b .

[0063] In one embodiment, the fourth dam 700 includes a crack blocking dam, which is arranged between the first dam 500 and the cutting line C to cut off cracks generated during the cutting process to avoid damage to the light-emitting device 200 in the display area AA caused by the cutting cracks, thereby improving the reliability of the display panel and helping to extend the service life of the display panel.

[0064] In one embodiment, the height of the first dam 500 is greater than the height of the fourth dam 700. In this embodiment, the display motherboard is provided with the first dam 500 surrounding the second dam 300, and the first inorganic encapsulation layer 410 is terminated between the first dam 500 and the second dam 300, so as to block the overflow part of the organic encapsulation layer 420 on the side of the first dam 500 close to the display area AA, thereby reducing the probability of the overflow part of the organic encapsulation layer 420 flowing to the crack blocking dam, and preventing the overflow part of the organic encapsulation layer 420 from crossing the crack blocking dam with a lower height, thereby flowing to the bending area B along the cutting road D. Therefore, this embodiment reduces the influence of the overflow part of the organic encapsulation layer 420 on the display panel, thereby effectively improving the reliability of the display panel.

[0065] The present application also provides a display device, including any of the display panels described above. Since the display device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments. Specifically, the display panel used by the display device of this embodiment is provided with a first dam 500 surrounding the second dam 300, and the first inorganic encapsulation layer 410 is terminated between the first dam 500 and the second dam 300, so as to block the overflow portion of the organic encapsulation layer 420 on the side of the first dam 500 close to the display area AA, thereby reducing the probability of the overflow portion of the organic encapsulation layer 420 flowing to the bending area B, reducing the influence of the overflow portion of the organic encapsulation layer 420 on the display panel, thereby effectively improving the reliability of the display panel and extending the service life of the display device.

[0066] The display device may be any device with a display function, for example, a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. It may also be a non-mobile device such as a personal computer (PC), a television (TV), a teller machine, or an automated machine.

[0067] It should be noted that in the drawings of the present application document, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0068] In addition, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0069] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises a display area and a non-display area surrounding the display area, and the display panel comprises: substrate; A light emitting device, located on one side of the substrate and located in the display area; A first bank and a second bank are located in the non-display area, the first bank surrounds the second bank, and the second bank surrounds the display area; and A packaging structure layer is located on the side of the light-emitting device away from the substrate, and the packaging structure layer includes a first inorganic packaging layer and an organic packaging layer stacked together, and the organic packaging layer is located on the side of the first inorganic packaging layer close to the substrate; the first part of the organic packaging layer is located between the first dam and the second dam, and the first inorganic packaging layer ends between the first dam and the second dam.

2. The display panel according to claim 1, characterized in that: The height of the first dam is greater than the height of the second dam.

3. The display panel according to claim 1, characterized in that: The thickness of the first portion of the organic encapsulating layer is less than or equal to a smaller value of the heights of the first bank and the second bank.

4. The display panel according to claim 1, characterized in that: The first inorganic encapsulation layer is in contact with a sidewall of the first bank.

5. The display panel according to claim 1, characterized in that: The encapsulation structure layer further includes a second inorganic encapsulation layer located on a side of the organic encapsulation layer close to the substrate, and the second inorganic encapsulation layer terminates between the first dam and the second dam.

6. The display panel according to claim 5, characterized in that: The second inorganic encapsulating layer is in contact with the first inorganic encapsulating layer on a surface of the second bank facing away from the substrate.

7. The display panel according to claim 5, characterized in that: The second inorganic encapsulating layer contacts a sidewall of the first bank.

8. The display panel according to claim 1, characterized in that: It also includes a third dam, which is located on a side of the second dam close to the display area, and the second part of the organic encapsulation layer is located between the second dam and the third dam; the thickness of the second part of the organic encapsulation layer is less than or equal to the smaller value of the height of the second dam and the height of the third dam; Preferably, the first portion of the organic encapsulation layer and the second portion of the organic encapsulation layer are spaced apart.

9. A display motherboard, characterized in that: include: A plurality of display panels as claimed in any one of claims 1 to 8; and A cutting line is arranged around the display panel, and the cutting line is located between the first dams of adjacent display panels.

10. A display device, characterized in that: A display panel comprising any one of claims 1-8.

Images