Brain-computer interface and brain-computer interface assembly

Abstract

The invention discloses a brain-computer interface and a brain-computer interface component, the brain-computer interface comprises an implantation region and a non-implantation region, and the brain-computer interface comprises a substrate, an array layer, a light emitting layer and a bonding layer; wherein the substrate is located in the implantation region and the non-implantation region; the array layer is located on one side of the substrate and located in the implantation region; the light-emitting layer is located on the side, away from the substrate, of the array layer and located in the implantation area and comprises at least one light-emitting pixel. The bonding layer is arranged on one side of the substrate and located in the non-implantation area, the bonding layer is provided with a bonding part and a connecting wire electrically connected with the bonding part and the light-emitting pixels, and the bonding part is used for bonding a driving piece. Through the design, the implantation area has a light-emitting function, and can emit light to stimulate specific neurons after being implanted and used, so that the use effect is achieved.

Description

Technical Field

[0001] The present application relates to the field of medical technology, and in particular to a brain-computer interface and a brain-computer interface component. Background Art

[0002] At present, brain-computer interface projects have received widespread attention. In the past, electrical stimulation was used as a stimulation source, but brain tissue fluid is an electrolyte, and electrical stimulation will stimulate cells in a large area, making it difficult to achieve the need for precise stimulation of a small area, and at the same time, it will cause certain damage to brain nerve cells.

[0003] Therefore, there is an urgent need to improve the structure of the current brain-computer interface. Summary of the invention

[0004] The present application mainly provides a brain-computer interface and a brain-computer interface component that can reduce damage to brain nerve cells.

[0005] In order to solve the above technical problems, the technical solution adopted in the present application is: to provide a brain-computer interface, which includes an implantation area and a non-implantation area, and the brain-computer interface includes a substrate, an array layer, a light-emitting layer and a bonding layer; wherein the substrate is located in the implantation area and the non-implantation area; the array layer is located on one side of the substrate and in the implantation area; the light-emitting layer is located on the side of the array layer away from the substrate and in the implantation area, and includes at least one light-emitting pixel; the bonding layer is arranged on one side of the substrate and in the non-implantation area, and the bonding layer is provided with a bonding part and a connecting wire electrically connecting the bonding part and the light-emitting pixel, and the bonding part is used for bonding a driving component.

[0006] Wherein, the brain-computer interface also includes a packaging layer, which is located on the side of the light-emitting layer away from the substrate and located in the implantation area.

[0007] Preferably, the encapsulation layer is a thin film encapsulation layer.

[0008] The at least one light-emitting pixel includes at least one of a red light-emitting pixel, a green light-emitting pixel, and a blue light-emitting pixel.

[0009] Preferably, the at least one type of light-emitting pixels is arranged in an array.

[0010] Wherein, the brain-computer interface also includes a barrier layer, which is arranged between the substrate and the array layer.

[0011] Preferably, the material of the barrier layer includes an inorganic material.

[0012] Wherein, the brain-computer interface also includes a buffer layer, which is arranged between the barrier layer and the array layer.

[0013] Preferably, the material of the buffer layer includes inorganic material.

[0014] Preferably, the total thickness of the substrate, the barrier layer, the buffer layer, the array layer, the light-emitting layer and the encapsulation layer is in the range of 30-60 micrometers.

[0015] Wherein, the brain-computer interface also includes a supporting film, which is arranged on a side of the substrate away from the array layer.

[0016] Preferably, the support film has a thickness ranging from 35 to 40 microns.

[0017] Wherein, the substrate is a flexible substrate.

[0018] Preferably, the substrate is a single-layer structure or a multi-layer structure.

[0019] The non-implantation area and the implantation area are arranged in a first direction, and the brain-computer interface includes a first end and a second end arranged in the first direction, the first end is located in the implantation area, and the first end is a pointed structure.

[0020] The non-implantation area and the implantation area are arranged in a first direction, and the length of the brain-computer interface located in the implantation area in the first direction is no more than 5 mm.

[0021] And / or, the width of the brain-computer interface located in the implantation area in a second direction is no more than 1 mm, wherein the second direction is perpendicular to the first direction.

[0022] And / or, the thickness of the brain-computer interface located in the implant area ranges from 65 to 87 microns.

[0023] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a brain-computer interface component, which includes the brain-computer interface described in the above embodiment and a driving part bonded to the bonding part.

[0024] Preferably, the driving member is a flexible driving member.

[0025] The beneficial effect of the present application is that the implant area of ​​the brain-computer interface in the present application has a luminous function, which can emit light to stimulate specific neurons after implantation and use, accurately stimulate brain nerve cells, thereby guiding human behavior and achieving the purpose of scientific research or rehabilitation treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0027] Figure 1 This is a schematic diagram of the structure of an implementation scheme of a brain-computer interface in this application;

[0028] Figure 2 for Figure 1 A side view of an embodiment of an implant area in a mid-brain-computer interface;

[0029] Figure 3 for Figure 1 A side view of an embodiment of a non-implanted area in a mid-brain-machine interface;

[0030] Figure 4 This is a schematic structural diagram of an implementation scheme of the encapsulation layer in the present application.

[0031] Explanation of the reference numerals: 100 brain-computer interface; 1 implantation area; 2 non-implantation area; 3 first end; 4 second end; 10 substrate; 20 barrier layer; 30 buffer layer; 40 array layer; 50 light-emitting layer; 51 light-emitting pixel; 52 red light-emitting pixel; 53 green light-emitting pixel; 54 blue light-emitting pixel; 60 bonding layer; 61 connecting wire; 70 encapsulation layer; 71 inorganic layer; 72 organic layer; 73 first inorganic layer; 74 second inorganic layer; 80 support film; 90 driving element; X first direction; Y second direction. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0034] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0035] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0036] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0037] See also Figure 1 , Figure 2 and Figure 3 The present application provides a brain-computer interface 100, which includes an implantation area 1 and a non-implantation area 2, and the brain-computer interface 100 includes a substrate 10, an array layer 40, a light-emitting layer 50 and a bonding layer 60; wherein the substrate 10 is located in the implantation area 1 and the non-implantation area 2; the array layer 40 is located on one side of the substrate 10 and in the implantation area 1; the light-emitting layer 50 is located on the side of the array layer 40 away from the substrate 10 and in the implantation area 1, and the light-emitting layer 50 includes at least one light-emitting pixel 51; the bonding layer 60 is arranged on one side of the substrate 10 and in the non-implantation area 2, and the bonding layer 60 is provided with a bonding part (not shown) and a connecting wire 61 electrically connecting the bonding part and the light-emitting pixel 51, and the bonding part is used for bonding the driving component 90.

[0038] Specifically, the brain-computer interface 100 in the present application applies the principle of optogenetics to stimulate specific neurons, wherein the implantation area 1 is used to implant the part that needs stimulation, such as the head, and the non-implantation area 2 does not need to be implanted in the part that needs stimulation, and plays a role in supporting the operation of the implantation area 1. The implantation area 1 includes a substrate 10, an array layer 40 and a light-emitting layer 50. The substrate 10 plays a supporting role, and the array layer 40 includes a driving circuit (for example, a 7T1C circuit) for controlling the light-emitting pixels 51 in the light-emitting layer 50 to emit light. The light-emitting pixels 51 in the light-emitting layer 50 can emit light of a specific color to stimulate the neurons that need to be stimulated. A bonding layer 60 is provided in the non-implantation area 2, and the bonding layer 60 is provided with a bonding part (not shown in the figure), which is used to bond the driving component 90, and at the same time, the connecting wire 61 in the bonding layer 60 connects the light-emitting pixel 51 and the bonding part to realize the electrical connection between the external driving component 90 and the light-emitting pixel 51, so that the light emission of the light-emitting pixel 51 can be controlled. Therefore, the implant area 1 of the brain-computer interface 100 in the present application has a luminous function. After implantation and use, it can emit light to stimulate specific neurons and accurately stimulate brain nerve cells, thereby guiding human behavior and achieving the purpose of scientific research or rehabilitation treatment.

[0039] In one embodiment, there are multiple luminous pixels 51, so that multiple luminous pixels 51 can emit light to stimulate neurons, so that the brain-computer interface 100 has a multi-point stimulation function. And the specific stimulation point can be controlled by adjusting the position of the luminous pixel 51, so that the brain-computer interface 100 can achieve a multi-point precise stimulation function.

[0040] See also Figure 2 and Figure 4 The brain-computer interface 100 further includes an encapsulation layer 70, which is located on the side of the light-emitting layer 50 away from the substrate 10 and located in the implantation area 1. Specifically, the encapsulation layer 70 covers the surface of the light-emitting layer 50 away from the substrate 10, and is used to protect the light-emitting layer 50 from external water vapor intrusion, thereby affecting the lifespan.

[0041] In one embodiment, the encapsulation layer 70 is a thin film encapsulation layer; the use of a thin film encapsulation layer can effectively reduce the overall thickness of the encapsulation layer 70, which is conducive to the miniaturization of the brain-computer interface 100, reducing stimulation and minimizing damage.

[0042] The encapsulation layer 70 includes at least one inorganic layer 71 and at least one organic layer 72 stacked in layers; the combination of the inorganic layer 71 and the organic layer 72 is conducive to ensuring the encapsulation effect. By using the encapsulation layer 70, the light-emitting pixels 51 are protected from water vapor interference, the stability of the light-emitting layer 50 in the working state is protected, and the service life of the brain-computer interface 100 is extended.

[0043] In one embodiment, the number of inorganic layers 71 is two, namely, a first inorganic layer 73 and a second inorganic layer 74. The first inorganic layer 73, the organic layer 72 and the second inorganic layer 74 are stacked in sequence in the direction away from the substrate 10. The first inorganic layer 73 can effectively protect the light-emitting pixels 51 in the light-emitting layer 50 and block the light-emitting pixels 51 from contacting with water vapor. The organic layer 72 covers the surface of the first inorganic layer 73 away from the substrate 10. When dust particles fall on the surface of the first inorganic layer 73 in the production environment, the organic layer 72 can fix it to prevent the particles from piercing the first inorganic layer 73, forming a water vapor leakage channel, and further preventing water vapor from contacting and corroding the light-emitting pixels 51 through the leakage channel. The second inorganic layer 74 can isolate water vapor and prevent water vapor from invading the organic layer 72. At the same time, the second inorganic layer 74 and the first inorganic layer 73 provide double protection for the light-emitting layer 50, and the effect of isolating water vapor is better.

[0044] In one embodiment, the first inorganic layer 73 and the second inorganic layer 74 are made of the same material, so the first inorganic layer 73 and the second inorganic layer 74 can be prepared using the same process, which reduces the difficulty of preparation and saves preparation costs.

[0045] In one embodiment, the material of the first inorganic layer 73 / the second inorganic layer 74 includes at least one of silicon nitride SiNx and silicon dioxide SiO2.

[0046] Please continue reading Figure 1 , at least one luminous pixel 51 includes at least one of a red luminous pixel 52, a green luminous pixel 53, and a blue luminous pixel 54. Among them, the luminous layer 50 may include only red luminous pixels 52; or, the luminous layer 50 may include only green luminous pixels 53; or, the luminous layer 50 may include only blue luminous pixels 54. For the state in which the same cell only responds to a specific color of light and produces excitement or inhibition, the use of luminous pixels 51 of one color can meet the use requirements. In other embodiments, the luminous layer 50 may include a combination of two luminous pixels 51 or three luminous pixels 51. At this time, the brain-computer interface 100 can be applied to multiple purposes, thereby improving the applicability of the brain-computer interface 100.

[0047] In one embodiment, at least one type of luminescent pixel 51 is arranged in an array. Specifically, the number of the same type of luminescent pixel 51 can be 1, 3, 5, 8, 10, etc. The number of luminescent pixels 51 is not limited in the present application, and the actual number can be determined according to the range of cells that need to be stimulated in the depth direction. At the same time, the design of the array arrangement of the luminescent pixels 51 can ensure the light output effect.

[0048] Please continue reading Figure 2The brain-computer interface 100 further includes a barrier layer 20, which is disposed between the substrate 10 and the array layer 40. Specifically, the barrier layer 20 plays an isolation role, preventing particles in the substrate 10 material from moving into other film layers such as the array layer 40.

[0049] In one embodiment, the material of the barrier layer 20 includes an inorganic material.

[0050] In one embodiment, the material of the barrier layer 20 includes silicon nitride, which can play a good isolation role and meet the use requirements of the barrier layer 20.

[0051] Please continue reading Figure 2 The brain-computer interface 100 also includes a buffer layer 30, which is arranged between the barrier layer 20 and the array layer 40; the buffer layer 30 can not only play a buffering role, but also play a heat preservation role. In the working state, the temperature of the array layer 40 can be effectively adjusted without sudden rise and fall.

[0052] In one embodiment, the material of the buffer layer 30 includes an inorganic material. In one embodiment, the material of the buffer layer 30 includes at least one of silicon oxide and silicon oxide, which can play a good buffering and heat preservation role and meet the use requirements of the buffer layer 30.

[0053] In one embodiment, please continue to refer to Figure 2 , the total thickness H1 of the substrate 10, the barrier layer 20, the buffer layer 30, the array layer 40, the light-emitting layer 50 and the encapsulation layer 70 is in the range of 30-60 microns. Specifically, the total thickness of the substrate 10, the barrier layer 20, the buffer layer 30, the array layer 40, the light-emitting layer 50 and the encapsulation layer 70 may be 30, 35, 40, 45, 50, 55 or 60 microns.

[0054] Please continue reading Figure 2 The brain-computer interface 100 further includes a support film 80, which is disposed on the side of the substrate 10 away from the array layer 40. The support film 80 can play a supporting role, so as to facilitate the morphological stability of the brain-computer interface 100 and facilitate its use.

[0055] In one embodiment, the thickness of the support film 80 ranges from 35 to 40 microns. Specifically, the thickness of the support film 80 can be 35, 36, 37, 38, 39 or 40 microns to meet the support requirements while making the brain-computer interface 100 have a smaller volume.

[0056] Please continue reading Figure 2 or Figure 3, the substrate 10 is a flexible substrate 10. Specifically, when the substrate 10 is a flexible substrate 10, it can be a flexible carrier, such as: polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate PEN, etc., or it can be a metal foil, such as copper foil, aluminum foil, etc. Of course, in other embodiments, the substrate 10 can be a rigid substrate 10, such as rigid glass. Among them, setting the substrate 10 as a flexible substrate 10 can better fit the brain-computer interface 100 to the cerebral cortex, reduce rejection reactions, and reduce damage to cranial nerves.

[0057] In one embodiment, the substrate 10 is a single-layer structure, or a multi-layer structure. Specifically, the single-layer structure of the substrate 10 is simple to prepare, and can make the volume of the brain-computer interface 100 smaller. Of course, in other embodiments, the substrate 10 can also be a multi-layer structure, such as a double-layer PI. When a double-layer PI is used, the flexibility is better, and it can also provide better protection for the subsequent film preparation during the preparation process.

[0058] Please continue reading Figure 1 , the non-implantation area 2 and the implantation area 1 are arranged in a first direction X, wherein the brain-computer interface 100 includes a first end 3 and a second end 4 arranged in the first direction X, the first end 3 is located in the implantation area 1, and the first end 3 is a pointed structure. Specifically, the first end 3 is located on the side of the implantation area 1 away from the non-implantation area 2. When the brain-computer interface 100 is implanted in the working area, the first end 3 first contacts the working area. Therefore, the first end 3 is designed as a pointed structure, which can be easily implanted and used.

[0059] Please continue reading Figure 1 , the length L1 of the brain-computer interface 100 located in the implant area 1 in the first direction X is not greater than 5 mm. In order to reduce the damage of the brain-computer interface 100 to the brain tissue, the length of the brain-computer interface 100 located in the implant area 1 in the first direction X can be 2 mm, 3 mm, 4 mm or 5 mm.

[0060] Please continue reading Figure 1 , the width W1 of the brain-computer interface 100 located in the implant area 1 in the second direction Y is not greater than 1 mm, wherein the second direction Y is perpendicular to the first direction X. Specifically, in order to meet the use needs and ensure the use effect, the width of the brain-computer interface 100 located in the implant area 1 in the second direction Y can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm.

[0061] Please continue reading Figure 1, the thickness H2 of the brain-computer interface 100 located in the implantation area 1 ranges from 65 to 87 microns. Compared with the brain-computer interface 100 in the conventional process, the thickness of the brain-computer interface 100 in the present application in the implantation area 1 is significantly reduced, and the thickness of the brain-computer interface 100 located in the implantation area 1 can be 65 microns, 70 microns, 75 microns, 80 microns, 85 microns or 87 microns.

[0062] Please continue reading Figure 1 The present application also provides a brain-computer interface component, which includes the brain-computer interface 100 in the above embodiment and a driving component 90 bonded to the bonding part. The driving component 90 is bonded to the bonding layer 60 through the bonding part, and is connected to the light-emitting pixel 51 through the connecting wire 61 located in the bonding layer 60, so as to realize the light-emitting control of the light-emitting pixel 51.

[0063] In one embodiment, the driving member 90 is a flexible driving member. Specifically, the flexible driving member can be a flexible circuit board. The flexible circuit board has the advantage of being easy to use.

[0064] In order to better understand the brain-computer interface components in this application, the usage and working principle of the brain-computer interface components are introduced below:

[0065] When in use, the implantation area 1 is implanted in the part that needs stimulation (for example, in the cerebral cortex), and the non-implantation area 2 may not be implanted in the part that needs stimulation. In the process of implanting the implantation area 1 in the part that needs stimulation, the light-emitting pixel 51 needs to be adjusted to the correct position. When the part needs to be stimulated, the light-emitting pixel 51 is driven by the driving element 90 to emit light, thereby stimulating the neuron cells, guiding the behavior of the person, and achieving the effect of scientific research or rehabilitation treatment.

[0066] When there are multiple light-emitting pixels 51, the multiple light-emitting pixels 51 can emit light to stimulate neurons, thereby achieving a multi-point precise stimulation function.

[0067] Among them, when the substrate 10 is set as a flexible substrate 10, the brain-computer interface component has flexible characteristics, so that the brain-computer interface component can better fit the cerebral cortex, reduce rejection reactions, and reduce damage to brain nerves.

[0068] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A brain-computer interface, characterized in that: The brain-computer interface includes an implantation area and a non-implantation area, and the brain-computer interface includes: a substrate located in the implantation region and the non-implantation region; An array layer, located on one side of the substrate and in the implantation region; a light-emitting layer, located on a side of the array layer away from the substrate and located in the implantation region, and comprising at least one type of light-emitting pixel; The bonding layer is arranged on one side of the substrate and located in the non-implantation area. The bonding layer is provided with a bonding part and a connecting wire electrically connecting the bonding part and the light-emitting pixel. The bonding part is used for bonding the driving component.

2. The brain-computer interface according to claim 1, characterized in that: The brain-computer interface also includes: An encapsulation layer, located on a side of the light-emitting layer away from the substrate and located in the implantation region; Preferably, the encapsulation layer is a thin film encapsulation layer.

3. The brain-computer interface according to claim 1, characterized in that: The at least one light-emitting pixel includes at least one of a red light-emitting pixel, a green light-emitting pixel, and a blue light-emitting pixel; Preferably, the at least one type of light-emitting pixels is arranged in an array.

4. The brain-computer interface according to claim 2, characterized in that: The brain-computer interface also includes: A barrier layer, disposed between the substrate and the array layer; Preferably, the material of the barrier layer includes an inorganic material.

5. The brain-computer interface according to claim 4, characterized in that: The brain-computer interface also includes: a buffer layer, disposed between the barrier layer and the array layer; Preferably, the material of the buffer layer includes an inorganic material; Preferably, the total thickness of the substrate, the barrier layer, the buffer layer, the array layer, the light-emitting layer and the encapsulation layer is in the range of 30-60 micrometers.

6. The brain-computer interface according to claim 1, characterized in that: The brain-computer interface also includes: A supporting film is arranged on a side of the substrate away from the array layer; Preferably, the support film has a thickness ranging from 35 to 40 microns.

7. The brain-computer interface according to claim 1, characterized in that: The substrate is a flexible substrate; Preferably, the substrate is a single-layer structure or a multi-layer structure.

8. The brain-computer interface according to claim 1, characterized in that: The non-implantation area and the implantation area are arranged in a first direction, wherein the brain-computer interface includes a first end and a second end arranged in the first direction, the first end is located in the implantation area, and the first end is a pointed structure.

9. The brain-computer interface according to claim 1, characterized in that: The non-implantation area and the implantation area are arranged in a first direction, wherein the length of the brain-computer interface located in the implantation area in the first direction is no more than 5 mm; and / or, the width of the brain-computer interface located in the implantation area in a second direction is no greater than 1 mm, wherein the second direction is perpendicular to the first direction; And / or, the thickness of the brain-computer interface located in the implant area ranges from 65 to 87 microns.

10. A brain-computer interface component, characterized in that: The brain-computer interface assembly comprises the brain-computer interface according to any one of claims 1 to 9 and a driving member bonded to the bonding portion; Preferably, the driving member is a flexible driving member.

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