A PCB board and a polishing device thereof

Abstract

The invention relates to a PCB board and a grinding device thereof, belonging to the technical field of PCB board processing. The PCB board and the grinding device thereof comprise a grinding platform, a turntable is rotatably arranged on the upper side of the grinding platform, a first servo motor driving the turntable to rotate is fixedly arranged on the lower side of the grinding platform, a plurality of positioning grooves are arranged on the turntable, a waste material groove penetrating the turntable is provided at the bottom of the plurality of positioning grooves, a feed trough cooperating with the waste material groove is penetrating one side of the grinding platform, a glue storage mechanism is slidably arranged inside the feed trough, a copper powder storage mechanism connected to the glue storage mechanism is arranged on the upper side of the glue storage mechanism, an attaching mechanism is vertically movably arranged inside the glue storage mechanism, the attaching mechanism drives glue and copper powder to rise in turn during the raising process, so that the glue and copper powder are attached to the side wall of the PCB board hole, and in the invention, the waste chips on the inner wall of the hole can be cleaned, and the epoxy resin cut from the inner wall of the hole can be protected.

Description

Technical Field

[0001] The invention belongs to the technical field of PCB board processing, and in particular relates to a PCB board and a grinding device thereof. Background Art

[0002] In recent years, the PCB industry has shown a sustained growth trend. In today's world where electronic products are used in large quantities, the PCB industry must focus on its own technology and improve its ability to make high-end products. Burrs are inevitable during the mechanical punching of PCB boards. These burrs seriously affect product quality and process stability, and may even affect the safety and stability of the final product. Therefore, this type of product usually needs to be polished after mechanical punching.

[0003] For example, in a Chinese utility model patent with the announcement number CN218364084U and the name of a PCB circuit board hole grinding device, the workbench includes a placing block fixedly connected to the workbench, the upper surface of the placing block is provided with a stepped groove for placing the PCB circuit board, the workbench is elastically slidably connected to a rectangular frame, and a rubber pressure block is fixedly connected inside the rectangular frame; although the above-mentioned prior art can grind off the burrs on the inner wall of the hole on the PCB board, the inner wall of the hole is easily degraded and broken after long-term exposure due to the epoxy resin being cut, so that the conductivity of the PCB board is reduced, affecting the performance of the produced PCB board. In order to clean the waste chips in the hole and protect the hole, a PCB board and a grinding device thereof are now needed. Summary of the invention

[0004] The purpose of the present invention is to provide a PCB board and a grinding device thereof with a simple structure and reasonable design in order to solve the above problems.

[0005] The present invention achieves the above-mentioned purpose through the following technical solutions:

[0006] A PCB board polishing device comprises a polishing platform, a turntable is rotatably provided on the upper side of the polishing platform, a first servo motor for driving the turntable to rotate is fixedly provided on the lower side of the polishing platform, a plurality of positioning grooves are provided on the turntable, a waste groove penetrating the turntable is provided at the bottom of the plurality of positioning grooves, a polishing mechanism cooperating with the positioning groove is provided above the turntable, a feed trough cooperating with the waste groove is penetrating on one side of the polishing platform, a glue storage mechanism is slidably provided inside the feed trough, a copper powder storage mechanism connected with the glue storage mechanism is provided on the upper side of the glue storage mechanism, an attachment mechanism is vertically movably provided inside the glue storage mechanism, and the attachment mechanism drives glue and copper powder to rise in turn during the lifting process so that the glue and copper powder are attached to the side wall of the PCB board hole.

[0007] As a further optimization scheme of the present invention, the glue storage mechanism includes a glue storage box slidably arranged inside a feed trough, a guide groove is provided on the inner side wall of the feed trough, sliding blocks slidably connected to the inner side of the guide groove are provided on both sides of the glue storage box, a third electric telescopic rod for driving the glue storage box to slide is fixedly arranged on the outer side of the grinding platform, a glue filling pipe is provided on the top of the glue storage box, and a glue observation window is provided on the side wall of the glue storage box.

[0008] As a further optimization scheme of the present invention, the copper powder storage mechanism includes a copper powder storage box fixedly arranged on the upper side of the glue storage box, the side wall of the copper powder storage box is provided with a powder filling tube and a copper powder observation window, the copper powder storage box adopts an inner and outer concentric circular cavity structure, the inner circular ring of the copper powder storage box forms a powder pasting channel, the inner side of the circular cavity structure is connected with the glue storage box, the inner side wall of the copper powder storage box is provided with a plurality of powder outlet holes, the inner sides of the plurality of powder outlet holes are rotatably provided with powder outlet balls, and there is a gap between the powder outlet balls and the powder outlet holes.

[0009] As a further optimization scheme of the present invention, the attachment mechanism includes a return spring fixedly arranged at the inner bottom of the glue storage box, a limiting plate is fixedly arranged at the upper end of the return spring, a movable rod is fixedly arranged on the upper side of the limiting plate, and a magnet is arranged at the upper end of the movable rod.

[0010] As a further optimization solution of the present invention, the upper arc surface fixing sleeve of the movable rod is provided with a cylindrical sponge sleeve, the upper end plane of the movable rod is provided with a groove, and the magnet is arranged on the inner side of the groove.

[0011] As a further optimization scheme of the present invention, the grinding mechanism includes a slide seat movably arranged above the feeding trough, a second electric telescopic rod is fixedly arranged on the upper side of the slide seat, a guide rod bracket slidably connected to the slide seat is fixedly arranged on the output end of the second electric telescopic rod, a lifting plate is fixedly arranged on the lower end of the guide rod bracket, a second servo motor is fixedly arranged on the upper side of the lifting plate, a mounting seat rotatably arranged on the lower side of the lifting plate is fixedly arranged on the output end of the second servo motor, a grinding head is fixedly arranged on the lower end of the mounting seat, a driving mechanism for driving the slide seat to slide is arranged above the grinding platform, and a plurality of transfer mechanisms are arranged on the edge of the grinding platform.

[0012] As a further optimization scheme of the present invention, the driving mechanism includes a fixed column fixedly arranged on the edge of the grinding platform, a hanging plate is fixedly arranged on the upper end of the fixed column, a sliding groove is opened on the hanging plate and slidably cooperates with the slide seat, and a first electric telescopic rod is fixedly arranged on the upper side of the hanging plate to drive the slide seat to slide in the sliding groove.

[0013] As a further optimization solution of the present invention, a frustum-conical sponge sleeve is provided on the outer fixed sleeve at the upper end of the grinding head, and the small opening end of the frustum-conical sponge sleeve faces downward.

[0014] As a further optimization scheme of the present invention, the transfer mechanism includes a limit seat fixedly arranged on the edge of the grinding platform, a rotating rod is rotatably arranged on the upper side of the limit seat through a bearing, a third servo motor for driving the rotating rod to rotate is fixedly arranged on the lower side of the limit seat, a mounting plate is fixedly arranged on the upper end of the rotating rod, a fourth electric telescopic rod is fixedly arranged on one side of the mounting plate, a vacuum suction cup cooperating with the positioning groove is fixedly arranged on the output end of the fourth electric telescopic rod, a vacuum generator is fixedly arranged on the upper side of the mounting plate, and one end of the vacuum generator is connected to an air pipe communicated with the vacuum suction cup.

[0015] A PCB board includes a PCB multilayer board, wherein four corners of the PCB multilayer board are provided with through holes, the PCB multilayer board includes a top plate and a bottom plate, a plurality of intermediate layers are pressed and arranged between the top plate and the bottom plate, a plurality of conductive protrusions are arranged on the upper surfaces of the intermediate layers and the bottom plate, and a plurality of conductive grooves are arranged on the lower surfaces of the intermediate layers and the top plate for electrically engaging with the conductive protrusions.

[0016] The beneficial effects of the present invention are:

[0017] 1. In the present invention, the holes on the PCB multilayer board are polished by the polishing head, and when the polishing is completed, the lifting plate is driven to descend by the second electric telescopic rod, so that the polishing head on the lower side of the lifting plate can continue to descend, so that the frustum sponge sleeve on the upper end of the polishing head descends, and the frustum sponge sleeve is inserted from the upper side of the hole of the PCB multilayer board. Since the diameter of the frustum sponge sleeve continuously increases when passing through the hole, the waste chips on the inner wall of the hole can be cleaned up to prevent the waste chips from scratching the PCB multilayer board, so that the hole of the PCB multilayer board is protected.

[0018] 2. In the present invention, when the lower end of the grinding head is inserted into the groove, it is attracted by the magnet. At this time, the lower end of the grinding head stops descending, and the second electric telescopic rod drives the lifting plate to rise, so that the grinding head on the lower side of the lifting plate can be raised, driving the movable rod to rise together. Since the cylindrical sponge cover on the outer side of the movable rod is always immersed in the glue, the cylindrical sponge cover will absorb the glue and drive the cylindrical sponge cover to rise. During the process of the cylindrical sponge cover rising, the cylindrical sponge cover will pass through the powder sticking channel and squeeze the powder ball to rotate, so that the powder ball drives the copper powder storage The copper powder in the storage box is discharged from the edge of the powder outlet hole, and the copper powder is adhered to the outer surface of the cylindrical sponge sleeve by glue. When the movable rod is raised to the hole of the PCB multilayer board, the copper powder on the outer surface of the cylindrical sponge sleeve will be adhered to the inner wall of the hole by glue. The copper powder can make the two adjacent layers of the PCB multilayer board connected, and the epoxy resin at the cutout part of the inner wall of the hole can be sealed and protected by glue to prevent the epoxy resin at the cutout part from degradation and chain breaking after long-term exposure, thereby avoiding reducing the conductivity of the PCB multilayer board and affecting the performance of the produced PCB multilayer board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front view schematic diagram of the overall structure of the present invention;

[0020] Figure 2 It is a schematic diagram of the overall structure of the present invention when viewed from above;

[0021] Figure 3 It is a schematic diagram of the overall structure of the grinding platform and the turntable of the present invention;

[0022] Figure 4 It is a schematic diagram of the first overall structure of the grinding platform of the present invention;

[0023] Figure 5 It is a second overall structural schematic diagram of the grinding platform of the present invention;

[0024] Figure 6 It is a third overall structural schematic diagram of the polishing platform of the present invention;

[0025] Figure 7 is a fourth overall structural schematic diagram of the polishing platform of the present invention;

[0026] Figure 8 The present invention Figure 3 Enlarged view of point A in the middle;

[0027] Fig. 9 The present invention Figure 4 Enlarged view of point B in the middle;

[0028] Fig.10 The present invention Figure 5 Enlarged view of point C in the middle;

[0029] Fig.11 The present invention Figure 6 Enlarged view of point D in the middle;

[0030] Fig.12 The present invention Figure 7 Enlarged view of point E in the middle;

[0031] Fig.13 This is a first expanded and enlarged schematic diagram of the PCB board of the present invention;

[0032] Fig.14 This is a second expanded and enlarged schematic diagram of the PCB board of the present invention;

[0033] Fig.15 It is an overall schematic diagram of the PCB multilayer board pressing of the present invention.

[0034] In the figure: 1. grinding platform; 2. turntable; 3. first servo motor; 4. transfer mechanism; 401. limit seat; 402. rotating rod; 403. third servo motor; 404. mounting plate; 405. vacuum generator; 406. air pipe; 407. vacuum suction cup; 408. fourth electric telescopic rod; 5. positioning groove; 6. waste trough; 7. lifting plate; 8. second servo motor; 9. mounting seat; 10. grinding head; 11. round table sponge cover; 12. fixed column; 13. hanging plate; 14. first electric telescopic rod; 15. sliding seat; 16. guide rod bracket; 17. second electric telescopic rod; 18. sliding groove; 19. third electric telescopic rod; 20. unloading trough; 21. glue Water storage mechanism; 2101, glue storage box; 2102, glue filling tube; 2103, glue observation window; 22, copper powder storage mechanism; 2201, copper powder storage box; 2202, powder outlet hole; 2203, powder outlet ball; 2204, powder pasting channel; 2205, powder filling tube; 2206, copper powder observation window; 23, attachment mechanism; 2301, movable rod; 2302, groove; 2303, magnet; 2304, cylindrical sponge sleeve; 2305, limit plate; 2306, reset spring; 24, guide groove; 25, PCB multilayer board; 2501, top plate; 2502, bottom plate; 2503, middle layer; 2504, conductive protrusion; 2505, conductive groove. DETAILED DESCRIPTION

[0035] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0036] Example 1: Fig.13 , Fig.14 , Fig.15As shown, a PCB board includes a PCB multilayer board 25, and through holes are opened at four corners of the PCB multilayer board 25. The PCB multilayer board 25 includes a top plate 2501 and a bottom plate 2502. A plurality of intermediate layers 2503 are arranged between the top plate 2501 and the bottom plate 2502. In this embodiment, three intermediate layers 2503 are taken as an example. The specific number of layers can be flexibly adjusted according to the process. The three intermediate layers 2503 are pressed together with the top plate 2501 and the bottom plate 2502. The upper surface of the three intermediate layers 2503 and the bottom plate 2502 are pressed together. A plurality of conductive protrusions 2504 are provided on the surface, and a plurality of conductive grooves 2505 are provided on the lower surface of the three middle layers 2503 and the top plate 2501. During the pressing process, the conductive grooves 2505 of two adjacent middle layers 2503 are electrically snap-fitted with the conductive protrusions 2504, so that the inner layer of the entire pressed PCB multilayer board 25 is conductive, and the cooperation between the conductive grooves 2505 and the conductive protrusions 2504 can make the connection between the PCB multilayer boards 25 tighter to prevent delamination and cracking.

[0037] like Figure 1 , Figure 2 , Figure 3 , Figure 8As shown, a PCB board polishing device comprises a polishing platform 1, a turntable 2 is rotatably arranged on the upper side of the polishing platform 1, a first servo motor 3 is fixedly arranged on the lower side of the polishing platform 1, an output end of the first servo motor 3 passes through the polishing platform 1 and is fixedly connected to the center of the turntable 2, the turntable 2 can be driven to rotate on the upper side of the polishing platform 1 by the first servo motor 3, a plurality of positioning grooves 5 are arranged on the turntable 2, only three positioning grooves 5 are shown in this embodiment, and the specific number can be flexibly adjusted according to the process, a waste groove 6 passing through the turntable 2 is opened at the bottom of the three positioning grooves 5, the waste groove 6 and the positioning groove 5 form a stepped groove, the size of the waste groove 6 is smaller than the size of the positioning groove 5, when the PCB multilayer board 25 is loaded, it is only necessary to put the PCB multilayer board 25 The upper side of the waste trough 6 is used to support the PCB multilayer board 25. At this time, the size of the PCB multilayer board 25 is consistent with the size of the positioning groove 5. A feed trough 20 cooperating with the waste trough 6 is provided on one side of the polishing platform 1. The length directions of the three feed troughs 20 are all in line with the diameter direction of the polishing platform 1. A collection box (not shown in the figure) is provided below the feed trough 20. The waste scraps cleaned up can be collected through the collection box for easy recycling. A slide seat 15 is movably provided above the feed trough 20. A second electric telescopic rod 17 is fixedly provided on the upper side of the slide seat 15. A guide rod bracket 16 slidably connected to the slide seat 15 is fixedly provided at the output end of the second electric telescopic rod 17. The lower end of the guide rod bracket 16 is fixedly provided A lifting plate 7 is arranged, a second servo motor 8 is fixedly arranged on the upper side of the lifting plate 7, a mounting seat 9 rotatably arranged on the lower side of the lifting plate 7 is fixedly arranged on the output end of the second servo motor 8, a grinding head 10 is arranged on the lower end of the mounting seat 9, when grinding the holes on the PCB multilayer board 25, the grinding head 10 is driven to rotate by the second servo motor 8, and then the lifting plate 7 is driven to descend by the second electric telescopic rod 17, thereby driving the grinding head 10 on the lower side of the lifting plate 7 to descend, so that the PCB multilayer board 25 inside the positioning groove 5 can be ground, a frustum sponge sleeve 11 is fixedly provided on the outer side of the upper end of the grinding head 10, the small end of the frustum sponge sleeve 11 faces downward, and the large end faces upward, during the grinding process, when the grinding head 10 moves the PCB multilayer board After the grinding of the plate 25 is completed, the grinding is stopped. At this time, the second electric telescopic rod 17 continues to drive the lifting plate 7 to descend, and then drives the grinding head 10 on the lower side of the lifting plate 7 to continue to descend, so that the frustum sponge sleeve 11 on the upper end of the grinding head 10 descends, so that the frustum sponge sleeve 11 is inserted from the upper side of the hole of the PCB multilayer board 25. Since the diameter of the frustum sponge sleeve 11 continuously increases when passing through the hole, the waste chips on the inner wall of the hole can be cleaned up to prevent the waste chips from scratching the PCB multilayer board 25. A fixed column 12 is fixedly arranged on the edge of the grinding platform 1, and a hanging plate 13 is fixedly arranged on the upper end of the fixed column 12. The length direction of the hanging plate 13 is in line with the diameter of the turntable 2, and a slide groove 18 that slides with the slide seat 15 is opened on the hanging plate 13.A first electric telescopic rod 14 is fixedly provided on the upper side of the suspension plate 13 to drive the slide 15 to slide in the slide groove 18. During the grinding process, the first electric telescopic rod 14 drives the slide 15 to slide on the suspension plate 13, so that the grinding head 10 below the slide 15 can move below the suspension plate 13. Since the length direction of the suspension plate 13 is in line with the diameter of the turntable 2, the grinding head 10 moves in the diameter direction of the turntable 2, which is convenient for grinding the PCB multilayer board 25 on the turntable 2 and improving the grinding accuracy.

[0038] like Figure 4 , Figure 5 , Fig. 9 As shown, a glue storage mechanism 21 is slidably provided inside the feed chute 20, and the glue storage mechanism 21 includes a glue storage box 2101 slidably provided inside the feed chute 20. A heating pipe (not shown in the figure) can be provided inside the glue storage box 2101. The heating pipe can make the glue in the glue storage box 2101 fluid, thereby preventing the glue from solidifying. A through hole is provided on the upper side of the glue storage box 2101, and a guide groove 24 is provided on the inner side wall of the feed chute 20. Slide blocks slidably connected to the inner side of the guide groove 24 are provided on both sides of the glue storage box 2101. A third electric telescopic rod 19 for driving the glue storage box 2101 to slide is fixedly provided on the outer side of the grinding platform 1. A glue filling pipe 2102 is provided on the top of the glue storage box 2101, and a side of the glue storage box 2101 is provided. A glue observation window 2103 is provided on the wall, through which the glue observation window 2103 is convenient for observing the glue content inside the glue storage box 2101, so that personnel can replenish new glue in time through the glue filling tube 2102. When in use, the third electric telescopic rod 19 drives the glue storage box 2101 to slide on the inner side of the discharge chute 20, so that the glue storage box 2101 can be moved to just below the grinding head 10, so that the lower end of the grinding head 10 can coat the glue inside the glue storage box 2101 on the side wall of the hole of the PCB multilayer board 25, so that the epoxy resin in the cutout part of the inner wall of the hole is sealed and protected, so as to prevent the epoxy resin in the cutout part from degrading and breaking after long-term exposure, so as to avoid reducing the conductivity of the PCB multilayer board 25 and affecting the performance of the produced PCB multilayer board 25.

[0039] like Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 , Fig. 9 , Fig.10 , Fig.11As shown, a copper powder storage mechanism 22 connected to the glue storage mechanism 21 is provided on the upper side thereof, and the copper powder storage mechanism 22 comprises a copper powder storage box 2201 fixedly arranged on the upper side of the glue storage box 2101, and a powder filling tube 2205 and a copper powder observation window 2206 are provided on the side wall of the copper powder storage box 2201, and the copper powder storage box 2201 adopts an inner and outer concentric circular cavity structure, and the inner and outer concentric circular cavity structure is convenient for storing copper powder. The copper powder storage box 2201 of this embodiment stores copper powder inside, and the type of powder can also be adjusted according to actual process requirements, such as tin powder or gold powder, etc. The particle size of the copper powder in this embodiment is 0.2-20μm, and the inner ring of the copper powder storage box 2201 forms a powder pasting channel 2204, the powder channel 2204 adopts a circular ring structure that penetrates the upper and lower parts, and the lower end of the powder channel 2204 is connected to the through hole on the upper side of the glue storage box 2101. The inner wall of the copper powder storage box 2201 is provided with a plurality of powder outlet holes 2202, and the inner sides of the plurality of powder outlet holes 2202 are rotatably provided with powder outlet balls 2203. There is a gap between the powder outlet balls 2203 and the powder outlet holes 2202, and the gap in this embodiment is 20-50μm. The copper powder storage box 2201 adopts a metal material with good thermal conductivity, which can transfer the heat inside the glue storage box 2101 to the copper powder storage box 2201, thereby preventing the glue adhering to the powder outlet holes 2202 from solidifying and avoiding the glue from clogging the powder outlet holes 2202.

[0040] like Figure 5 , Figure 6 , Figure 7 , Fig.10 , Fig.11 , Fig.12As shown, the glue storage mechanism 21 is vertically movable inside with an attaching mechanism 23, the attaching mechanism 23 includes a reset spring 2306 fixedly arranged at the bottom of the inner side of the glue storage box 2101, a limit plate 2305 is fixedly arranged at the upper end of the reset spring 2306, a movable rod 2301 is fixedly arranged on the upper side of the limit plate 2305, the top of the movable rod 2301 is lower than the upper liquid surface of the glue, that is, the movable rod 2301 is immersed in the glue, the movable rod 2301 is located just below the through hole above the glue storage box 2101, and the upper end of the movable rod 2301 is arranged There is a magnet 2303, and the upper arc surface fixed sleeve of the movable rod 2301 is provided with a cylindrical sponge sleeve 2304. The cylindrical sponge sleeve 2304 is immersed in the glue and absorbs the glue. The diameter of the cylindrical sponge sleeve 2304 is smaller than the diameter of the through hole on the upper side of the glue storage box 2101, which is convenient for the cylindrical sponge sleeve 2304 to pass through the through hole. A groove 2302 is opened on the upper end plane of the movable rod 2301, and the magnet 2303 is arranged on the inner side of the groove 2302. The grinding head 10 is made of magnetic material, and the lower end of the grinding head 10 is convenient to be inserted through the groove 2302, and is in contact with the magnetic material. The iron 2303 attracts and cooperates. Since the movable rod 2301 is completely immersed in the glue, when the lower end of the grinding head 10 is inserted into the groove 2302, the heat on the surface of the grinding head 10 will be transferred to the glue and the movable rod 2301, and the movable rod 2301 will transfer the heat to the glue, so that the heat on the surface of the grinding head 10 is dissipated, thereby improving the heat dissipation effect. When in use, when the grinding head 10 attracts the magnet 2303, the grinding head 10 rises through the attraction of the magnet 2303, driving the movable rod 2301 to rise. When the movable rod 2301 drives the cylindrical sponge sleeve When 2304 rises to the hole of the PCB multilayer board 25 to be polished, the limit plate 2305 will be pressed by the lower surface of the through hole above the glue storage box 2101, so that the movable rod 2301 will no longer rise and will be pulled back by the elastic force of the reset spring 2306. During the process of pulling back the movable rod 2301 and the cylindrical sponge sleeve 2304, the movable rod 2301 and the cylindrical sponge sleeve 2304 will rock back and forth, which can stir the glue and conduct the heat on the movable rod 2301 to the glue, thereby improving the heat dissipation effect and facilitating the heat dissipation of the next polishing by the polishing head 10.

[0041] During the grinding process, the grinding head 10 is driven to rotate by the second servo motor 8, and then the lifting plate 7 is driven to descend by the second electric telescopic rod 17, and then the grinding head 10 on the lower side of the lifting plate 7 is driven to descend, so that the inner wall of the hole on the PCB multilayer board 25 inside the positioning groove 5 can be polished. When the grinding of the PCB multilayer board 25 is completed, the grinding head 10 stops rotating. At this time, the lifting plate 7 is continued to be driven to descend by the second electric telescopic rod 17, and then the grinding head 10 on the lower side of the lifting plate 7 is driven to continue to descend, so that the frustum sponge cover 11 at the upper end of the grinding head 10 is descended, so that the frustum sponge cover 11 is inserted from the upper side of the hole of the PCB multilayer board 25, so that the waste chips on the inner wall of the hole can be cleaned up, and the cleaned up waste chips can be removed by The glue storage box 2101 is driven by the third electric telescopic rod 19 to slide on the inner side of the material chute 20, so that the glue storage box 2101 moves to the bottom of the grinding head 10, and then the second electric telescopic rod 17 continues to drive the lifting plate 7 to descend, and then drives the grinding head 10 on the lower side of the lifting plate 7 to continue to descend. When the lower end of the grinding head 10 is inserted into the bottom of the groove 2302, it stops descending. At this time, the grinding head 10 is attracted by the magnet 2303 on the inner side of the groove 2302, and then the second electric telescopic rod 17 drives the lifting plate 7 to rise, and then drives the grinding head 10 on the lower side of the lifting plate 7 to rise, driving the movable rod 2301 to rise in the glue storage box 2101, and at the same time makes the cylindrical sea with glue adsorbed The sponge sleeve 2304 rises together, when the cylindrical sponge sleeve 2304 passes through the powder sticking channel 2204, it will squeeze the powder ball 2203 to rotate, so that the powder ball 2203 drives the copper powder in the copper powder storage box 2201 to be discharged from the edge of the powder outlet hole 2202, and the copper powder is adhered to the outer surface of the cylindrical sponge sleeve 2304 through glue. When the movable rod 2301 rises to the hole of the PCB multilayer board 25, the copper powder on the outer surface of the cylindrical sponge sleeve 2304 will be adhered to the inner wall of the hole by glue, and the copper powder helps to connect the two adjacent layers of the PCB multilayer board 25, and the epoxy resin at the incision of the inner wall of the hole can be sealed and protected by glue to prevent the epoxy resin at the incision from being degraded and broken after long-term exposure. In order to avoid reducing the conductivity of the PCB multilayer board 25 and affecting the performance of the produced PCB multilayer board 25, the limit plate 2305 at the bottom of the movable rod 2301 will be against the lower side of the circular hole. At this time, the second electric telescopic rod 17 drives the lifting plate 7 to continue to rise, and then drives the grinding head 10 on the lower side of the lifting plate 7 to continue to rise, so that the grinding head 10 slides out from the inside of the groove 2302, and the elastic force of the reset spring 2306 makes the movable rod 2301 and the limit plate 2305 return to their original positions. During the recovery process, the movable rod 2301 and the limit plate 2305 will rock back and forth, so that the glue can be stirred, so that the heat in the glue is conducted away, which is convenient for the subsequent heat dissipation of the grinding head 10 and improves the service life of the grinding head 10.

[0042] Embodiment 2: Based on embodiment 1, further improvement is made in that Figure 1 , Figure 2 4, and the PCB multilayer board 25 is fixedly mounted on the upper side of the limit seat 401. A rotating rod 402 is rotatably mounted on the upper side of the limit seat 401 through a bearing. A third servo motor 403 for driving the rotating rod 402 to rotate is fixedly mounted on the lower side of the limit seat 401. A mounting plate 404 is fixedly mounted on the upper end of the rotating rod 402. A fourth electric telescopic rod 408 is fixedly mounted on one side of the mounting plate 404. The output end of the movable telescopic rod 408 is fixedly provided with a vacuum suction cup 407 that cooperates with the positioning groove 5, and a vacuum generator 405 is fixedly provided on the upper side of the mounting plate 404. One end of the vacuum generator 405 is connected to an air pipe 406 that is connected to the vacuum suction cup 407. The above feeding process is explained, and the rotating rod 402 is driven to rotate by the third servo motor 403, so that the rotating rod 402 rotates to the outside of the turntable 2, and the PCB multilayer board 25 (not shown in the figure) is arranged on the outside of the turntable 2, and then the vacuum suction cup 407 is driven to rise and fall by the fourth electric telescopic rod 408, and the vacuum suction cup 407 generates negative pressure by the vacuum generator 405, so that the vacuum suction cup 407 attracts the PCB multilayer board 25, and then the rotating rod 402 is driven to rotate and recover by the third servo motor 403, and the vacuum suction cup 407 is controlled by the vacuum generator 405 to drop the PCB multilayer board 25 into the inside of the positioning groove 5 to complete the feeding.

[0043] It should be noted that, when the PCB multilayer board polishing device is in use, the third servo motor 403 is first used to drive the rotating rod 402 to rotate, so that the rotating rod 402 rotates to the outside of the turntable 2, and the outside of the turntable 2 is provided with a PCB multilayer board 25 (not shown in the figure), and then the fourth electric telescopic rod 408 is used to drive the vacuum suction cup 407 to rise and fall, and the vacuum suction cup 407 is used to generate negative pressure through the vacuum generator 405, so that the vacuum suction cup 407 attracts the PCB multilayer board 25, and then the third servo motor 403 is used to drive the rotating rod 402 to rotate and recover, and the vacuum suction cup 407 is controlled by the vacuum generator 405 to drop the PCB multilayer board 25 into the interior of the positioning groove 5, and then the first servo motor 3 drives the turntable 2 to rotate 120°, so that The PCB multilayer board 25 on the turntable 2 is rotated to the right below the grinding head 10, and then the grinding head 10 is driven to rotate by the second servo motor 8, and then the lifting plate 7 is driven to descend by the second electric telescopic rod 17, and then the grinding head 10 on the lower side of the lifting plate 7 is driven to descend, so that the PCB multilayer board 25 inside the positioning groove 5 can be polished, and a frustum sponge sleeve 11 is provided on the outer fixed sleeve of the upper end of the grinding head 10. During the grinding process, when the grinding head 10 finishes grinding the PCB multilayer board 25, the grinding is stopped. At this time, the second electric telescopic rod 17 continues to drive the lifting plate 7 to descend, and then the grinding head 10 on the lower side of the lifting plate 7 continues to descend, so that the frustum sponge sleeve 11 on the upper end of the grinding head 10 descends, so that the frustum sponge sleeve 11 is removed from the PCB The upper side of the hole of the multilayer board 25 of B is inserted. Since the diameter of the frustum sponge sleeve 11 continuously increases when passing through the hole, the waste chips on the inner wall of the hole can be cleaned up to prevent the waste chips from scratching the PCB multilayer board 25. Then the glue storage box 2101 is driven by the third electric telescopic rod 19 to slide on the inner side of the discharge trough 20, so that the glue storage box 2101 moves to the bottom of the grinding head 10. Then the second electric telescopic rod 17 continues to drive the lifting plate 7 to descend, and then drives the grinding head 10 on the lower side of the lifting plate 7 to continue to descend. When the lower end of the grinding head 10 is inserted into the bottom of the groove 2302, it stops descending. At this time, the grinding head 10 is attracted by the magnet 2303 inside the groove 2302. Then the second electric telescopic rod 17 drives the lifting plate 7 to rise, and then The grinding head 10 on the lower side of the lifting plate 7 is driven to rise, and the movable rod 2301 is driven to rise in the glue storage box 2101, and the cylindrical sponge sleeve 2304 adsorbed with glue is raised together. When the cylindrical sponge sleeve 2304 passes through the powder pasting channel 2204, it will squeeze the powder ball 2203 to rotate, so that the powder ball 2203 drives the copper powder in the copper powder storage box 2201 to be discharged from the edge of the powder outlet hole 2202, and the copper powder is adhered to the outer surface of the cylindrical sponge sleeve 2304 through the glue. When the movable rod 2301 is raised to the hole of the PCB multilayer board 25, the copper powder on the outer surface of the cylindrical sponge sleeve 2304 will be adhered to the inner wall of the hole by the glue, and the two adjacent layers of the PCB multilayer board 25 can be connected through the copper powder.In addition, the epoxy resin at the cutout of the inner wall of the hole can be sealed and protected by the glue to prevent the epoxy resin at the cutout from degradation and breakage after long-term exposure, thereby preventing the conductivity of the PCB multilayer board 25 from being reduced and affecting the performance of the produced PCB multilayer board 25. At this time, the limit plate 2305 at the bottom of the movable rod 2301 will be against the lower side of the circular hole. At this time, the second electric telescopic rod 17 drives the lifting plate 7 to continue to rise, and then drives the grinding head 10 on the lower side of the lifting plate 7 to continue to rise, so that the grinding head 10 slides out from the inside of the groove 2302, and the elastic force of the reset spring 2306 makes the movable rod 2301 and the limit plate 2305 return to their original positions. At this time, the grinding of a hole is completed. When the PCB multilayer needs to be polished, When grinding other positions of the board 25, it is only necessary to drive the slide 15 to slide on the upper side of the suspension plate 13 through the first electric telescopic rod 14, so that the grinding head 10 on the lower side of the slide 15 can slide to the specified position, and the turntable 2 can be driven to rotate by the first servo motor 3, so that the PCB multilayer board 25 on the turntable 2 is rotated to the bottom of the grinding head 10, and the remaining holes are ground. Finally, the turntable 2 is driven to rotate 120° by the first servo motor 3, so that the polished PCB multilayer board 25 is rotated to the bottom of the vacuum suction cup 407 for unloading. In the whole grinding process, the loading, unloading and grinding of the PCB multilayer board 25 can be carried out simultaneously, thereby improving the grinding efficiency of the PCB multilayer board 25.

[0044] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A PCB board polishing device, comprising a polishing platform (1), characterized in that: A turntable (2) is rotatably provided on the upper side of the polishing platform (1), a first servo motor (3) for driving the turntable (2) to rotate is fixedly provided on the lower side of the polishing platform (1), a plurality of positioning grooves (5) are provided on the turntable (2), a waste material groove (6) penetrating the turntable (2) is provided at the bottom of the plurality of positioning grooves (5), a polishing mechanism cooperating with the positioning groove (5) is provided above the turntable (2), a feeding trough (20) cooperating with the waste material groove (6) is provided through one side of the polishing platform (1), a glue storage mechanism (21) is slidably provided inside the feeding trough (20), a copper powder storage mechanism (22) connected to the glue storage mechanism (21) is provided on the upper side of the glue storage mechanism (21), and an attaching mechanism (23) is vertically movably provided inside the glue storage mechanism (21), and the attaching mechanism (23) drives the glue and the copper powder to rise in turn during the raising process, so that the glue and the copper powder are attached to the side wall of the hole of the PCB board; The glue storage mechanism (21) comprises a glue storage box (2101) slidably arranged inside a feed chute (20), a guide groove (24) is provided on the inner side wall of the feed chute (20), sliding blocks slidably connected to the inner side of the guide groove (24) are provided on both sides of the glue storage box (2101), a third electric telescopic rod (19) for driving the glue storage box (2101) to slide is fixedly arranged on the outer side of the polishing platform (1), a glue filling tube (2102) is provided at the top of the glue storage box (2101), and a glue observation window (2103) is provided on the side wall of the glue storage box (2101); The copper powder storage mechanism (22) comprises a copper powder storage box (2201) fixedly arranged on the upper side of the glue storage box (2101); a powder filling pipe (2205) and a copper powder observation window (2206) are arranged on the side wall of the copper powder storage box (2201); the copper powder storage box (2201) adopts an inner and outer concentric annular cavity structure; the inner annular cavity structure of the copper powder storage box (2201) forms a powder pasting channel (2204); the inner side of the annular cavity structure is connected to the glue storage box (2101); a plurality of powder outlet holes (2202) are opened on the inner side wall of the copper powder storage box (2201); a powder outlet ball (2203) is rotatably arranged on the inner side of each of the powder outlet holes (2202); and a gap exists between the powder outlet ball (2203) and the powder outlet hole (2202).

2. A PCB board polishing device according to claim 1, characterized in that: The attachment mechanism (23) comprises a return spring (2306) fixedly arranged at the bottom of the inner side of the glue storage box (2101), a limit plate (2305) fixedly arranged at the upper end of the return spring (2306), a movable rod (2301) fixedly arranged on the upper side of the limit plate (2305), and a magnet (2303) arranged at the upper end of the movable rod (2301).

3. A PCB board polishing device according to claim 2, characterized in that: The upper arc surface fixed sleeve of the movable rod (2301) is provided with a cylindrical sponge sleeve (2304), the upper plane of the movable rod (2301) is provided with a groove (2302), and the magnet (2303) is arranged on the inner side of the groove (2302).

4. A PCB board polishing device according to claim 3, characterized in that: The grinding mechanism comprises a slide (15) movably arranged above a material discharge chute (20); a second electric telescopic rod (17) is fixedly arranged on the upper side of the slide (15); a guide rod bracket (16) slidably connected to the slide (15) is fixedly arranged at the output end of the second electric telescopic rod (17); a lifting plate (7) is fixedly arranged at the lower end of the guide rod bracket (16); a second servo motor (8) is fixedly arranged on the upper side of the lifting plate (7); a mounting seat (9) rotatably arranged on the lower side of the lifting plate (7) is fixedly arranged at the output end of the second servo motor (8); a grinding head (10) is arranged at the lower end of the mounting seat (9); a driving mechanism for driving the slide (15) to slide is arranged above the grinding platform (1); and a plurality of transfer mechanisms (4) are arranged at the edge of the grinding platform (1).

5. A PCB board polishing device according to claim 4, characterized in that: The driving mechanism comprises a fixed column (12) fixedly arranged on the edge of the grinding platform (1), a hanging plate (13) fixedly arranged on the upper end of the fixed column (12), a sliding groove (18) slidably matched with the sliding seat (15) being formed on the hanging plate (13), and a first electric telescopic rod (14) for driving the sliding seat (15) to slide in the sliding groove (18) being fixedly arranged on the upper side of the hanging plate (13).

6. A PCB board polishing device according to claim 5, characterized in that: A truncated cone sponge sleeve (11) is provided on the outer side of the upper end of the grinding head (10), and the small end of the truncated cone sponge sleeve (11) faces downwards.

7. A PCB board polishing device according to claim 4, characterized in that: The transfer mechanism (4) comprises a limit seat (401) fixedly arranged at the edge of the grinding platform (1); a rotating rod (402) is rotatably arranged on the upper side of the limit seat (401) via a bearing; a third servo motor (403) for driving the rotating rod (402) to rotate is fixedly arranged on the lower side of the limit seat (401); a mounting plate (404) is fixedly arranged at the upper end of the rotating rod (402); a fourth electric telescopic rod (408) is fixedly arranged on one side of the mounting plate (404); a vacuum suction cup (407) cooperating with the positioning groove (5) is fixedly arranged at the output end of the fourth electric telescopic rod (408); a vacuum generator (405) is fixedly arranged on the upper side of the mounting plate (404); one end of the vacuum generator (405) is connected to an air pipe (406) communicating with the vacuum suction cup (407).

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