Polishing and grinding rotary table and polishing and grinding device

Abstract

The polishing and grinding rotary table comprises a marble platform and a polishing disc, a mounting frame is arranged on the marble platform, a hollow direct-drive motor connected with the polishing disc is arranged on the mounting frame, a hollow pipe is further arranged in a motor rotor and fixedly connected with the polishing disc, and the bottom of the hollow pipe is connected with a magnetic ring. A reading sensor is arranged at the bottom of the mounting frame and is matched with the magnetic ring to form a magnetic ring encoder; a plurality of air floatation supporting blocks are evenly arranged on the marble platform in the peripheral direction of the mounting frame, the top end faces of the air floatation supporting blocks are arranged below the polishing disc, flow channels are formed in the air floatation supporting blocks, one end of each flow channel is connected with an air source, and air outlet holes of the flow channels are located in the top end faces of the air floatation supporting blocks; polishing pads are arranged on the surfaces of the polishing discs; the magnetic ring encoder is used for detecting the jerk value when the polishing disc rotates, and the air source controls the air supply pressure according to the jerk value. In the machining process, good stability is achieved, jumping in the using process is greatly reduced, and the polishing quality is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor preparation, and in particular to a polishing and grinding turntable and a polishing and grinding device. Background Art

[0002] The wafer polishing platform is a key equipment used for wafer surface flattening in semiconductor manufacturing. The wafer polishing platform mainly removes different materials on the wafer surface at the micron / nano level through a combination of chemical action and mechanical grinding technology, achieves nano-level flattening of the wafer surface, wafer thinning and other effects, and prepares for the next lithography process.

[0003] The polishing disc on the polishing platform cooperates with the carrier head to squeeze the wafer in the middle for polishing or thinning. At the same time, a liquid supply device is also provided on the polishing platform to provide polishing liquid used in the processing process. During the processing, the force of the carrier head will be applied to the polishing disc and is located on one side of the polishing disc surface. Under the premise of the applied force, the tiny gaps between the various components of the polishing platform will cause jumping during the rotation. During the processing, the jumping degree will cause thermal deformation and vibration, resulting in a decrease in the quality of the processed surface and an increase in roughness, which greatly affects the processing quality. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a polishing and grinding turntable and a polishing and grinding device, which have good stability during processing, greatly reduce the jumping during use, and improve the polishing quality.

[0005] In order to solve the above technical problems, the present invention provides a polishing and grinding turntable, comprising a marble platform and a polishing disc, wherein a mounting frame is arranged on the marble platform, a hollow direct-drive motor is arranged on the mounting frame, and a rotor end surface of the hollow direct-drive motor is connected to the bottom of the polishing disc;

[0006] A hollow tube is also provided inside the rotor, the top of the hollow tube is fixedly connected to the polishing disc, the bottom of the hollow tube passes through the hollow direct drive motor and is connected to the mounting base plate, a magnetic ring is provided on the mounting base plate, a reading sensor is provided at the bottom of the mounting frame, and the reading sensor cooperates with the magnetic ring to form a magnetic ring encoder;

[0007] A plurality of air-floating support blocks are evenly arranged on the marble platform in the peripheral direction of the mounting frame, the top end surface of the air-floating support block is arranged below the polishing plate, a flow channel is arranged inside the air-floating support block, one end of the flow channel is connected to the air source, and the air outlet of the flow channel is located on the top end surface of the air-floating support block;

[0008] The surface of the polishing disc is provided with a polishing pad;

[0009] The magnetic ring encoder is used to detect the amount of runout when the polishing disc rotates, and the air source controls the air supply pressure according to the amount of runout.

[0010] Furthermore, the polishing plate includes an upper fixed plate and a lower cooling plate, a middle portion of the lower cooling plate is provided with an avoidance hole, a cooling channel is provided in the lower cooling plate, the cooling channel and the inlet and outlet are both provided in the avoidance hole and are equipped with pipe joints.

[0011] Furthermore, the cooling channel includes a plurality of fan-shaped grooves, an inlet channel is provided on the side wall of the fan-shaped groove close to the avoidance hole, an outlet channel is provided on the side wall away from the avoidance hole, a reflux channel is provided in the lower cooling plate below the fan-shaped groove, one end of the reflux channel is through-connected with the avoidance hole, and a connecting channel is provided between the other end of the reflux channel and the outlet channel.

[0012] Furthermore, a mounting hole is provided on the upper fixed plate, and a mounting groove is provided on the lower cooling plate. A thickness gauge is fixed in the mounting hole. The data line of the thickness gauge is arranged along the mounting groove, the avoidance hole and the hollow tube. The detection window of the thickness gauge is highly consistent with the surface of the upper fixed plate.

[0013] Furthermore, a gas-electric slip ring is also provided at the bottom of the installation base plate, and the data line and the pipe joint of the thickness gauge are connected to the gas-electric slip ring.

[0014] Furthermore, a screw rod is provided at the bottom of the air-floating support block, an internal thread base is provided on the marble platform, and the screw rod is fixedly connected to the internal thread base via a nut.

[0015] Furthermore, a liquid receiving baffle ring is arranged on the outer periphery of the polishing plate, and a liquid receiving groove is arranged at the bottom of the liquid receiving baffle ring.

[0016] Furthermore, at least two lifting cylinders are arranged between the bottom of the liquid receiving baffle ring and the marble platform, and the lifting cylinder drives the liquid receiving baffle ring to rise and fall. A guide slider is fixedly installed on one side of the lifting cylinder, and a transverse support arm is arranged on the top of the guide slider. The transverse support arm is connected to the bottom of the liquid receiving baffle through an adapter, and the transverse support arm is also connected to the telescopic rod of the lifting cylinder.

[0017] Furthermore, a gas pressure regulating valve is provided between the gas source and each air-floating support block, and the gas pressure regulating valve controls the gas supply pressure of the corresponding air-floating support block, and the polishing disc is adjusted by the gas supply pressure. The adjustment method includes the following steps:

[0018] Step 1. Multiple gas pressure regulating valves supply gas at the same basic pressure P and perform rotation detection. The rotation detection includes driving the polishing disc to rotate n times by a hollow direct drive motor, and the polishing disc drives the magnetic ring to rotate synchronously. The detection value of the magnetic ring in each circle is read by a reading sensor and the average runout value after n turns is calculated. If the average runout value meets the requirements, the adjustment is completed. If the average runout value does not meet the requirements, continue with the following steps:

[0019] Step 2: Perform pressure increase adjustment on one of the gas pressure regulating valves, and the other gas pressure regulating valves supply gas for the base pressure P, and perform rotation detection to obtain the average monotonic pressure jump value. Each gas pressure regulating valve corresponds to an average monotonic pressure jump value. When the average monotonic pressure jump value obtained by one rotation detection meets the requirements, the adjustment is completed. If the average monotonic pressure jump value does not meet the requirements, continue with the following steps:

[0020] Step 3, group multiple gas pressure regulating valves, perform pressure-boosting adjustment on the gas pressure regulating valves in a single group, and supply gas to the other gas pressure regulating valves at the base pressure P, and perform rotation detection to obtain a multi-pressure-adjusting average jump value. Each group of gas pressure regulating valves corresponds to a multi-pressure-adjusting average jump value. When the multi-pressure-adjusting average jump value obtained by one rotation detection meets the requirements, the adjustment is completed. If the single pressure-adjusting average jump value does not meet the requirements, a manual intervention operation is prompted;

[0021] The calculation method of the above rotation detection is as follows: use a reading sensor to read the detection value of the magnetic ring in each circle, and record the maximum and minimum values ​​of each circle, take the average of the n maximum values ​​to get the jump height MAX, take the average of the n minimum values ​​to get the jump height MIN, and calculate the difference between the jump height MAX and the jump height MIN.

[0022] A polishing and grinding device comprises any one of the wafer polishing platforms described above, wherein a carrier head, a cleaning brush and a liquid supply device are arranged above the wafer polishing platform.

[0023] Beneficial effects of the present invention:

[0024] 1. A hollow direct-drive motor is used as the driving power source. It is easy to connect with the polishing disc. Reducing the number of connecting parts can effectively reduce the difficulty of component assembly and improve assembly accuracy.

[0025] 2. Multiple air-floating support blocks are evenly distributed at the bottom of the polishing disc and exert force. Since the air-floating support blocks use air pressure as floating power, they do not contact the polishing disc during the support process, avoiding friction during the support process that causes aggravated vibration. The air pressure of each air-floating support block is independently adjustable, so the magnetic ring encoder can effectively control the air outlet pressure of each air-floating support block, thereby effectively suppressing the vibration of the polishing disc during rotation. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 It is a schematic diagram of the structure of the present invention located at the lower part of the marble platform;

[0028] Figure 3 It is a schematic diagram of the cross-sectional structure of the present invention;

[0029] Figure 4 It is a schematic diagram of the structure of the air-floating support block of the present invention;

[0030] Figure 5 It is a schematic diagram of the structure of a turntable with a liquid-contacting baffle ring according to the present invention;

[0031] Figure 6 It is a schematic diagram of the structure of the lifting and lowering driving part of the liquid receiving baffle ring of the present invention;

[0032] Figure 7 It is a schematic diagram of the structure of the lower cooling plate of the present invention;

[0033] Figure 8 It is a schematic structural diagram of the polishing and grinding device of the present invention;

[0034] Fig. 9 It is a gas circuit block diagram of the air floating support block of the present invention.

[0035] Explanation of the numbers in the figure: 1. marble platform; 2. polishing plate; 3. mounting frame; 4. hollow direct drive motor; 5. hollow tube; 6. wafer polishing platform; 7. mounting base; 8. magnetic ring; 9. reading sensor; 10. air floating support block; 11. flow channel; 12. polishing pad; 13. upper fixed plate; 14. lower cooling plate; 15. avoidance hole; 16. cooling channel; 17. pipe joint; 18. fan-shaped groove; 1 9. Inflow channel; 20. Outflow channel; 21. Return channel; 22. Connecting channel; 23. Mounting hole; 24. Mounting slot; 25. Thickness gauge; 27. Pneumatic slip ring; 28. Screw; 29. ​​Internal thread base; 30. Liquid receiving ring; 31. Liquid receiving slot; 32. Lifting cylinder; 33. Guide slider; 34. Horizontal support arm; 35. Adapter; 36. Load-bearing head; 37. Cleaning brush; 38. Liquid supply device. DETAILED DESCRIPTION

[0036] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0037] Reference Figures 1 to 4As shown, an embodiment of the polishing and grinding turntable of the present invention includes a marble platform 1 and a polishing disk 2, a mounting frame 3 is arranged on the marble platform, a hollow direct-drive motor 4 is arranged on the mounting frame, and the rotor end face of the hollow direct-drive motor is connected to the bottom of the polishing disk; the stator of the hollow direct-drive motor is fixed on the mounting frame and does not rotate, and the mounting frame is fixed on the marble platform, which can provide a higher flatness to reduce the vibration during operation, and the rotor of the hollow direct-drive motor directly drives the polishing disk to rotate to reduce the connecting components, thereby reducing the vibration during operation.

[0038] During operation, since it is difficult to detect the amount of runout on the periphery of the polishing disk, a hollow tube 5 is further provided inside the rotor, the top of the hollow tube is fixedly connected to the polishing disk, the bottom of the hollow tube passes through the hollow direct-drive motor and is connected to the mounting base plate 7, a magnetic ring 8 is provided on the mounting base plate, the hollow tube is used to connect the magnetic ring and the polishing disk into an integrated structure, and can rotate synchronously, a reading sensor 9 is provided at the bottom of the mounting frame, the reading sensor and the magnetic ring cooperate to form a magnetic ring encoder; the reading sensor obtains position information by detecting changes in the magnetic field, and converts it into an electrical signal output, that is, when the magnetic ring rotates, the reading sensor can sense the change in the magnetic field, thereby generating a corresponding voltage signal, and the phase difference of these voltage signals is used to calculate the rotation angle of the magnetic ring, so that the height difference can be obtained and the amount of runout during the rotation process can be obtained, and the requirement can be met when the runout is less than 10μm.

[0039] Based on the ability to conveniently detect the amount of runout during rotation, a plurality of air-floating support blocks 10 are evenly arranged on the marble platform in the peripheral direction of the mounting frame. The top end surface of the air-floating support block is arranged below the polishing disk. The two are not in contact and there is a gap. The gap size is between 3-5 μm, so that the gas can be output to achieve the effect of air flotation. Specifically, a flow channel 11 is arranged in the air-floating support block. Figure 4 As shown, one end of the flow channel is connected to the gas source, which can be an independent air supply pump or a centrally supplied high-pressure gas; the air outlet of the flow channel is located on the top end face of the air floating support block to release high-pressure gas to the bottom of the polishing platform, and the entire polishing plate is forced upward as a whole through the high-pressure gas to suppress the rotation and jumping of the polishing plate.

[0040] Specifically, the magnetic ring encoder is used to detect the amount of runout when the polishing disc rotates. The gas source controls the gas supply pressure according to the runout to ensure that the polishing disc rotates stably through the appropriate gas supply pressure. A high-precision gas pressure regulating valve can be set between the gas source and each air-floating support block. The gas pressure regulating valve can be a precision pressure reducing valve or an electric proportional valve. The precision pressure reducing valve and the electric proportional valve can also be used together, so that the outlet pressure of each air-floating support block can be independently adjusted. Fig. 9As shown, according to the number of air-floating support blocks, the polishing disc is divided into a plurality of independently adjustable force areas, and then the areas are adjusted according to the detected runout to achieve a stable rotation effect.

[0041] A polishing pad 12 is provided on the surface of the polishing disc for polishing and grinding;

[0042] Reference Figure 1 , Figure 3 and Figure 7 As shown, the polishing plate includes an upper fixed plate 13 and a lower cooling plate 14, a avoidance hole 15 is arranged in the middle of the lower cooling plate, a cooling channel 16 is arranged in the lower cooling plate, the cooling channel and the inlet and outlet are arranged in the avoidance hole and are installed with a pipe joint 17, the pipe joint is connected to the liquid inlet and outlet connecting pipe to supply the coolant into the cooling channel, and guide the coolant to reflux and cool down, take away the heat, so that the temperature of the upper fixed plate during the processing is controlled, that is, the temperature on the polishing pad is taken away, and the grinding and polishing is guaranteed to be within a suitable temperature range.

[0043] Reference Figure 7 As shown, the above-mentioned cooling channel includes a plurality of fan-shaped grooves 18, an inlet channel 19 is arranged on the side wall of the fan-shaped groove close to the avoidance hole, and an outlet channel 20 is arranged on the side wall away from the avoidance hole. A return channel 21 is arranged in the lower cooling plate below the fan-shaped groove, one end of the return channel is connected with the avoidance hole, and a connecting channel 22 is arranged between the other end of the return channel and the outflow channel. The coolant enters the fan-shaped groove from the inlet channel. The fan-shaped groove has a larger space to increase the contact area between the coolant and the upper fixed plate. The coolant is then discharged from the fan-shaped groove through the outflow channel, the connecting channel and the return channel, and the purpose of continuous temperature control is achieved through circulation.

[0044] Reference Figure 3 As shown, a mounting hole 23 is provided on the upper fixed plate, and the mounting hole is located on the path of the polished wafer. A mounting groove 24 is provided on the lower cooling plate, and a thickness gauge 25 is fixed in the mounting hole. The data line of the thickness gauge is arranged along the mounting groove, the avoidance hole and the hollow tube. The detection window of the thickness gauge is highly consistent with the surface of the upper fixed plate to ensure the flatness of the polishing pad after installation. During the rotation process, the thickness gauge can effectively detect the thickness of the wafer after processing. It is an online detection method to improve the preparation efficiency and quality.

[0045] Since the polishing disc rotates during use, in order to facilitate the setting of pipelines and connecting lines, a gas-electric slip ring 27 is also provided at the bottom of the installation base plate. The data line of the thickness gauge and the pipe joint are connected to the gas-electric slip ring. The pipe joint is a joint for liquid supply and outlet. Therefore, it can be understood here that the liquid inlet and outlet connecting pipe on the pipe joint is connected to the gas-electric slip ring.

[0046] A screw 28 is provided at the bottom of the air-floating support block, and an internal thread base 29 is provided on the marble platform. The screw is fixedly connected to the internal thread base through a nut. By rotating the screw, the gap value between the air-floating support block and the bottom of the polishing plate can be effectively adjusted, and the assembly is convenient and reliable.

[0047] Reference Figure 3 , Figure 5 and Figure 6 As shown, a liquid receiving baffle ring 30 is provided on the outer periphery of the polishing disk, and a liquid receiving groove 31 is provided at the bottom of the liquid receiving baffle ring. During the processing, the polishing liquid will move from the polishing pad to the outer periphery and splash during the rotation of the polishing disk, and will eventually be blocked by the liquid receiving baffle ring, and slide down along its inner wall into the liquid receiving groove for collection, and finally be discharged from the discharge port at the bottom of the liquid receiving groove.

[0048] In order to effectively catch the splashing polishing liquid, the liquid receiving baffle ring needs to be higher than the polishing disc by a certain distance. This setting will cause the auxiliary components that move horizontally and laterally to interfere with it. Therefore, the existing auxiliary components all use a lifting mechanism to assist in avoidance. The auxiliary components are lifted by the lifting mechanism and then moved horizontally and laterally. This type of lifting mechanism needs to have a large stroke, which increases the equipment preparation cost and occupies too much internal space, making the space compact. Therefore, at least two lifting cylinders 32 are arranged between the bottom of the liquid receiving baffle ring and the marble platform. The lifting cylinder drives the liquid receiving baffle ring to rise and fall. A guide slider 33 is fixedly installed on one side of the lifting cylinder. A transverse support arm 34 is arranged on the top of the guide slider. The transverse support arm is connected to the bottom of the liquid receiving baffle through an adapter 35. The transverse support arm is also connected to the telescopic rod of the lifting cylinder. The lifting cylinder provides lifting power and ensures the stability of lifting through the guide slider. The direction is clear, and the adapter provides a stable connection support effect. When the auxiliary component needs to move horizontally to the top of the polishing pad for work, the lifting cylinder drives the liquid receiving baffle ring to descend for avoidance. After moving into place, the lifting cylinder drives the liquid receiving baffle ring to rise, meeting the use requirements. The liquid receiving baffle ring that can be raised and lowered also facilitates the replacement of the polishing pad, making the operation more convenient.

[0049] In one embodiment, a gas pressure regulating valve is arranged between the gas source and each air floating support block. The gas pressure regulating valve controls the gas supply pressure of the corresponding air floating support block, and the polishing disc is adjusted by the gas supply pressure. The adjustment method mainly adopts single-stage adjustment and multi-stage adjustment to gradually adjust to determine the final adjustment plan.

[0050] First, multiple gas pressure regulating valves divide the polishing disc into multiple areas, and the number of gas pressure regulating valves is at least 4 to ensure the adjustment accuracy. For the basis of adjustment, multiple gas pressure regulating valves are all supplied with basic pressure P before adjustment. In this case, the original runout value after the current assembly can be measured under this working condition. First, according to the single-stage adjustment, it is determined whether the pressure output adjustment of a single gas pressure regulating valve can meet the requirements, and the original runout value is adjusted to the runout range value that meets the requirements. The single-stage adjustment is to adjust the pressure of a single gas pressure regulating valve, and then detect the overall adjusted runout value. If the requirements are met, the adjustment can be completed. In some assembly situations, there may be a situation where the output pressure value of a single gas pressure regulating valve cannot meet the requirements. Therefore, the gas supply pressure can be adjusted simultaneously through multiple gas pressure regulating valves to work together to apply pressure to the polishing disc, which is multi-stage adjustment. At this time, the runout value of the polishing disc can basically be adjusted to the range that meets the requirements. If it still cannot be met, there may be a large deviation in the assembly, and reassembly and adjustment are required.

[0051] Specifically, multiple gas pressure regulating valves are first used to supply gas at the same basic pressure P, and rotation detection is performed. The rotation detection includes a hollow direct-drive motor driving the polishing disk to rotate n circles, and the polishing disk drives the magnetic ring to rotate synchronously. The detection value of the magnetic ring in each circle is read by a reading sensor, and the average jump value after rotating n circles is calculated; if the average jump value meets the requirements, it means that the rotation stability can be guaranteed by the basic pressure P after assembly, that is, the adjustment is completed, and if the average jump value does not meet the requirements, it means that the jump is large and it is necessary to continue to try to adjust.

[0052] First, one of the gas pressure regulating valves is pressurized to determine whether the jitter can be reduced after the gas pressure regulating valve increases the gas supply pressure. After the single gas pressure regulating valve is pressurized, the remaining multiple gas pressure regulating valves still supply gas at the basic pressure P. The average jitter value is continued to be measured through the above-mentioned rotation detection to obtain the monotonic pressure average jitter value. Each gas pressure regulating valve is pressurized and tested once in the above-mentioned manner, that is, each gas pressure regulating valve corresponds to a monotonic pressure average jitter value. When the monotonic pressure average jitter value obtained by one of the rotation tests meets the requirements, the adjustment is completed. If the monotonic pressure average jitter value does not meet the requirements, the pressurization scheme is continued to be changed to multi-stage adjustment.

[0053] When single-stage regulation does not meet the requirements, multi-stage regulation can be performed, that is, multiple gas pressure regulating valves are grouped, and the gas pressure regulating valves in a single group are pressurized. The remaining gas pressure regulating valves supply gas for the base pressure P, and perform rotation detection to obtain a multi-pressure average jump value. Each group of gas pressure regulating valves corresponds to a multi-pressure average jump value. When the multi-pressure average jump value obtained by one rotation detection meets the requirements, the adjustment is completed. If the single pressure average jump value does not meet the requirements, a manual intervention operation is prompted;

[0054] For the above-mentioned boosting method, the pressure value increased during boosting is a constant value, so that the pressure value after boosting becomes P+1. If the average fluctuation value of a single pressure adjustment in the detection result tends to meet the requirements, the boosting can continue, and the pressure value is P+1+1, and the pressure values ​​of the remaining gas pressure regulating valves are all P; in the multi-stage adjustment process, the pressure values ​​of the first group of gas pressure regulating valves can all be P+1+1, and the pressure values ​​of adjacent gas pressure regulating valves are all P; based on the multi-stage adjustment scheme, boosting can also be performed in a gradient form in a group of gas pressure regulating valves currently being adjusted. For example, if the group has three gas pressure regulating valves, the pressure value of the middle gas pressure regulating valve is P+1+1, the pressure values ​​of the remaining two gas pressure regulating valves are P+1, and the pressure values ​​of the remaining gas pressure regulating valves outside the group are P.

[0055] The calculation method of the above rotation detection is as follows: use a reading sensor to read the detection value of the magnetic ring in each circle, and record the maximum and minimum values ​​of each circle, take the average of the n maximum values ​​to get the jump height MAX, take the average of the n minimum values ​​to get the jump height MIN, and calculate the difference between the jump height MAX and the jump height MIN.

[0056] In one embodiment, referring to Figure 8 As shown, the present application also discloses a polishing and grinding device, which adopts the above-mentioned wafer polishing platform 6. A carrying head 36, a cleaning brush 37 and a liquid supply device 38 are arranged above the wafer polishing platform. The carrying head is used to adsorb and press the wafer on the polishing pad of the wafer polishing platform, and can drive the wafer to rotate at the same time. The liquid supply device provides polishing liquid, and supplies the heated polishing liquid to the polishing pad. After the polishing pad rotates, the polishing liquid is brought under the carrying head and participates in polishing and grinding. The cleaning brush is used to clean the particles dropped during the polishing process to ensure the polishing quality.

[0057] The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Any equivalent substitution or change made by a person skilled in the art based on the present invention is within the protection scope of the present invention.

Claims

1. A polishing and grinding turntable, characterized in that: It includes a marble platform and a polishing disc, wherein a mounting frame is arranged on the marble platform, a hollow direct-drive motor is arranged on the mounting frame, and a rotor end surface of the hollow direct-drive motor is connected to the bottom of the polishing disc; A hollow tube is also provided inside the rotor, the top of the hollow tube is fixedly connected to the polishing disc, the bottom of the hollow tube passes through the hollow direct drive motor and is connected to the mounting base plate, a magnetic ring is provided on the mounting base plate, a reading sensor is provided at the bottom of the mounting frame, and the reading sensor cooperates with the magnetic ring to form a magnetic ring encoder; A plurality of air-floating support blocks are evenly arranged on the marble platform in the peripheral direction of the mounting frame, the top end surface of the air-floating support block is arranged below the polishing plate, a flow channel is arranged inside the air-floating support block, one end of the flow channel is connected to the air source, and the air outlet of the flow channel is located on the top end surface of the air-floating support block; The surface of the polishing disc is provided with a polishing pad; The magnetic ring encoder is used to detect the amount of runout when the polishing disc rotates, and the air source controls the air supply pressure according to the amount of runout.

2. The polishing and grinding turntable according to claim 1, characterized in that: The polishing plate comprises an upper fixed plate and a lower cooling plate, a middle portion of the lower cooling plate is provided with an avoidance hole, a cooling channel is provided in the lower cooling plate, the cooling channel and the inlet and outlet are all provided in the avoidance hole and are equipped with pipe joints.

3. The polishing and grinding turntable according to claim 2, characterized in that: The cooling channel includes a plurality of fan-shaped grooves, an inlet channel is arranged on the side wall of the fan-shaped groove close to the avoidance hole, an outlet channel is arranged on the side wall away from the avoidance hole, a reflux channel is arranged in the lower cooling plate below the fan-shaped groove, one end of the reflux channel is connected with the avoidance hole, and a connecting channel is arranged between the other end of the reflux channel and the outlet channel.

4. The polishing and grinding turntable according to claim 2, characterized in that: The upper fixed plate is provided with a mounting hole, the lower cooling plate is provided with a mounting groove, a thickness gauge is fixed in the mounting hole, a data line of the thickness gauge is arranged along the mounting groove, the avoidance hole and the hollow tube, and a detection window of the thickness gauge is highly consistent with the surface of the upper fixed plate.

5. The polishing and grinding turntable according to claim 4, characterized in that: A gas-electric slip ring is also arranged at the bottom of the installation base plate, and the data line and the pipe joint of the thickness gauge are connected to the gas-electric slip ring.

6. The polishing and grinding turntable according to claim 1, characterized in that: A screw is provided at the bottom of the air-floating support block, an internal thread base is provided on the marble platform, and the screw is fixedly connected to the internal thread base via a nut.

7. The polishing and grinding turntable according to claim 1, characterized in that: A liquid receiving baffle ring is arranged on the outer periphery of the polishing plate, and a liquid receiving groove is arranged at the bottom of the liquid receiving baffle ring.

8. The polishing and grinding turntable according to claim 1, characterized in that: At least two lifting cylinders are arranged between the bottom of the liquid receiving baffle ring and the marble platform, and the lifting cylinders drive the liquid receiving baffle ring to rise and fall. A guide slider is fixedly installed on one side of the lifting cylinder, and a transverse support arm is arranged on the top of the guide slider. The transverse support arm is connected to the bottom of the liquid receiving baffle through an adapter, and the transverse support arm is also connected to the telescopic rod of the lifting cylinder.

9. The polishing and grinding turntable according to claim 1, characterized in that: A gas pressure regulating valve is arranged between the gas source and each air-floating support block. The gas pressure regulating valve controls the gas supply pressure of the corresponding air-floating support block, and the polishing disc is adjusted by the gas supply pressure. The adjustment method includes the following steps: Step 1. Multiple gas pressure regulating valves supply gas at the same basic pressure P and perform rotation detection. The rotation detection includes driving the polishing disc to rotate n times by a hollow direct drive motor, and the polishing disc drives the magnetic ring to rotate synchronously. The detection value of the magnetic ring in each circle is read by a reading sensor and the average runout value after n turns is calculated. If the average runout value meets the requirements, the adjustment is completed. If the average runout value does not meet the requirements, continue with the following steps: Step 2: Perform pressure increase adjustment on one of the gas pressure regulating valves, and the other gas pressure regulating valves supply gas for the base pressure P, and perform rotation detection to obtain the average monotonic pressure jump value. Each gas pressure regulating valve corresponds to an average monotonic pressure jump value. When the average monotonic pressure jump value obtained by one rotation detection meets the requirements, the adjustment is completed. If the average monotonic pressure jump value does not meet the requirements, continue with the following steps: Step 3, group multiple gas pressure regulating valves, perform pressure-boosting adjustment on the gas pressure regulating valves in a single group, and supply gas to the other gas pressure regulating valves at the base pressure P, and perform rotation detection to obtain a multi-pressure-adjusting average jump value. Each group of gas pressure regulating valves corresponds to a multi-pressure-adjusting average jump value. When the multi-pressure-adjusting average jump value obtained by one rotation detection meets the requirements, the adjustment is completed. If the single pressure-adjusting average jump value does not meet the requirements, a manual intervention operation is prompted; The calculation method of the above rotation detection is as follows: use a reading sensor to read the detection value of the magnetic ring in each circle, and record the maximum and minimum values ​​of each circle, take the average of the n maximum values ​​to get the jump height MAX, take the average of the n minimum values ​​to get the jump height MIN, and calculate the difference between the jump height MAX and the jump height MIN.

10. A polishing and grinding device, characterized in that: It comprises a wafer polishing platform as described in any one of claims 1 to 8, wherein a carrier head, a cleaning brush and a liquid supply device are arranged above the wafer polishing platform.

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