Drive mechanism

Abstract

A driving mechanism is used for driving an optical element to move and mainly comprises a fixed part, a movable part and a driving assembly. The movable part is movably connected with the fixed part, the optical element is arranged on the movable part, and the driving assembly is used for driving the movable part to move relative to the fixed part.

Description

Technical Field

[0001] The present invention relates to a driving mechanism, and more particularly to a driving mechanism capable of driving an optical element to move. Background Art

[0002] With the development of technology, many electronic devices (such as smart phones or digital cameras) now have the function of taking photos or recording videos. These electronic devices are becoming more and more popular and are developing in the direction of convenient and thinner designs to provide users with more choices.

[0003] Some electronic devices with camera or video recording functions are equipped with a lens drive module to drive an optical element to move, thereby achieving the functions of autofocus and optical image stabilization (OIS). Light can pass through the aforementioned optical element to form an image on a photosensitive element.

[0004] However, the lens driving module often needs to include a plurality of magnets and coils disposed around the optical element, which makes it impossible to further reduce the size of the lens driving module and the electronic device. Therefore, how to solve the above problem has become an important issue. Summary of the invention

[0005] The object of the present invention is to provide a driving mechanism to solve at least one of the above problems.

[0006] In view of the above-mentioned known problems, an embodiment of the present invention provides a driving mechanism for driving an optical element to move, wherein the optical element has an optical axis, and the driving mechanism includes a fixed portion, a movable portion, and a driving assembly. The movable portion is movably connected to the fixed portion, and the optical element is disposed on the movable portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.

[0007] In one embodiment, the driving mechanism further includes an upper spring sheet, and the fixing portion has a shell and a base connected to each other, wherein the shell forms a top cover and at least one side wall, the side wall extends from the top cover toward the base, and the upper spring sheet is disposed on an inner surface of the top cover.

[0008] In one embodiment, the side wall of the shell is formed with two ribs, and the driving component has a coil and a magnetic element, the coil is disposed on the movable portion, and the magnetic element is fixed on the side wall and located between the ribs.

[0009] In one embodiment, the driving mechanism further includes a circuit board, the base is formed with a first limiting structure and a second limiting structure extending toward the shell, and the circuit board is fixed between the first limiting structure and the second limiting structure.

[0010] In one embodiment, the first limiting structure forms a first groove, the second limiting structure forms a second groove, and glue is disposed in the first groove and the second groove to bond the circuit board and the first limiting structure and the second limiting structure.

[0011] In one embodiment, the base further forms a first boss and a second boss, the first boss and the second boss are respectively connected to the first limiting structure and the second limiting structure, and the first boss, the second boss and the first limiting structure and the second limiting structure extend into the shell.

[0012] In one embodiment, the shell further forms a protruding structure, and the first protruding column has an external connection portion, wherein the external connection portion forms an inner concave structure, and the inner concave structure and the protruding structure are located at a corner of the driving mechanism and bonded to each other.

[0013] In one embodiment, the driving mechanism further includes a gel, and the first protruding column further has an inner connecting portion, wherein the gel connects the inner connecting portion and the movable portion.

[0014] In one embodiment, the inner connecting portion is formed with a groove for accommodating the gel.

[0015] In one embodiment, the driving mechanism further includes a lower spring sheet and a conductive member, wherein the lower spring sheet is connected to the base and the movable portion, the conductive member is embedded in the base, and a conductive portion of the conductive member is exposed on the top side of the base, wherein an end portion of the lower spring sheet is electrically connected to the conductive portion of the conductive member, and the end portion and the conductive portion are both located on the outside of the first protrusion.

[0016] In one embodiment, the protruding structure, the end of the lower spring sheet, and the conductive portion of the conductive element partially overlap in the direction of the optical axis.

[0017] In one embodiment, the end portion of the lower spring sheet is located between the protruding structure of the housing and the conductive portion of the conductive element.

[0018] In one embodiment, the driving mechanism further includes two wires and two lower spring sheets, wherein the lower spring sheets are connected to the base and the movable portion and each has a recessed portion, and the movable portion has two winding posts, wherein the wires are respectively wound around the winding posts and are respectively electrically connected to the recessed portions.

[0019] In one embodiment, each of the aforementioned recessed portions is formed with an opening, and the aforementioned openings are all facing the same direction.

[0020] In one embodiment, the fixing portion has a shell and a base connected to each other, the base has a first boss extending toward the shell, and the shell has a protruding structure, wherein the first boss has an external connection portion, the external connection portion has an inner concave structure, and the inner concave structure and the protruding structure are located at a corner of the driving mechanism and are bonded to each other.

[0021] The beneficial effect of the present invention is that, through the aforementioned special mechanism design, this embodiment can not only effectively utilize the internal space of the driving mechanism to achieve miniaturization of the driving mechanism, but also enhance the bonding strength between the shell and the base, thereby greatly improving the overall performance and reliability of the driving mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A perspective view showing a driving mechanism according to an embodiment of the present invention.

[0023] Figure 2 express Figure 1 Another perspective stereogram of the drive mechanism in .

[0024] Figure 3 express Figure 1 and Figure 2 Exploded diagram of the drive mechanism in .

[0025] Figure 4 express Figure 1 and Figure 2 Another exploded view of the drive mechanism.

[0026] Figure 5 express Figure 3 and Figure 4 A three-dimensional view of the upper spring leaf and the housing after assembly.

[0027] Figure 6 express Figure 5 A partial enlarged view of the upper spring and housing after assembly.

[0028] Figure 7 express Figure 3 and Figure 4 A three-dimensional view of the base in FIG.

[0029] Figure 8 express Figure 7 A three-dimensional diagram of the base and circuit board after they are combined.

[0030] Fig. 9 A three-dimensional diagram showing the combination of the lower spring, base and circuit board.

[0031] Fig.10 A three-dimensional image from another perspective showing the combination of the lower spring, base and circuit board.

[0032] Fig.11 A top view showing the combination of the coil, magnetic element, carrier, lower spring, base and circuit board.

[0033] Fig.12 express Fig.11 A partial enlarged view showing that the conductive portion of the conductive member and the end of the lower spring leaf are located outside the protruding column.

[0034] Fig.13 along Figure 1 A partial cross-sectional view of the line segment A1-A2 in FIG.

[0035] The reference numerals are as follows:

[0036] 100: Driving mechanism

[0037] B: Plastic base

[0038] B1: Boss (first boss)

[0039] B11: Internal connection

[0040] B2: Boss (second boss)

[0041] B21: Inner connection

[0042] B3:Protruding pillar

[0043] B31: Internal connection

[0044] B4: convex column

[0045] B41: Internal connection

[0046] BT: Conductive parts

[0047] BT1: Conductive part

[0048] BS: Lower reed

[0049] BS1: End

[0050] BS2: Joint

[0051] BS3: Depression

[0052] BP: Bump

[0053] C: Coil

[0054] F: Circuit Board

[0055] FS: Upper reed

[0056] H: Shell

[0057] H0: Top cover

[0058] H1: Protruding structure

[0059] H2: Protruding structure

[0060] H3: Ribs

[0061] HM:Magnet

[0062] HS: Magnetic field sensing element

[0063] h: side wall

[0064] LH: Bearing

[0065] LH1: Winding column

[0066] M: Magnetic components

[0067] O: Optical axis

[0068] O': Center axis

[0069] P1: Limiting structure (first limiting structure)

[0070] P2: Limiting structure (second limiting structure)

[0071] P11: First groove

[0072] P12: Second groove

[0073] R1: External connection

[0074] R2: External connection DETAILED DESCRIPTION

[0075] The following describes the drive mechanism of the embodiment of the present invention. However, it is easy to understand that the embodiment of the present invention provides many suitable inventive concepts and can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific way, and are not intended to limit the scope of the present invention.

[0076] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0077] The above and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are used to illustrate and are not used to limit the present invention.

[0078] First, please refer to Figures 1 to 4 ,in Figure 1 A three-dimensional diagram showing a driving mechanism 100 according to an embodiment of the present invention, Figure 2 express Figure 1 Another perspective view of the driving mechanism 100, Figure 3 express Figure 1 and Figure 2 An exploded view of the drive mechanism 100 in FIG. Figure 4 express Figure 1 and Figure 2 Another exploded view of the drive mechanism 100 in FIG.

[0079] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the driving mechanism 100 of the present embodiment is, for example, a voice coil motor (VCM), which can be installed in a mobile phone or other portable electronic device to drive an optical element (such as an optical lens) to move, thereby achieving functions such as auto focusing (AF) or optical image stabilization (OIS).

[0080] The driving mechanism 100 mainly includes a plastic housing H, a plastic base B, a circuit board F, a carrier LH, an upper spring FS, at least one lower spring BS, at least one magnetic element M and at least one coil C.

[0081] In this embodiment, the housing H has a hollow structure and is combined with a quadrilateral base B, and the circuit board F is fixed to one side of the base B, wherein the housing H and the base B can together constitute a fixed portion of the driving mechanism 100. During the assembly process, the four bosses B1, B2, B3, B4 and the two limiting structures P1, P2 on the base B will extend into the housing H, wherein the limiting structures P1, P2 can be used to position the circuit board F, and the bosses B1, B2, B3, B4 and the limiting structures P1, P2 can be fixed to the inner surface of the housing H by gluing.

[0082] The carrier LH is movably accommodated in the housing H, and an optical element (not shown) can be disposed on the carrier LH, wherein the carrier LH constitutes a movable portion that can move relative to the fixed portion (housing H and base B).

[0083] Specifically, the aforementioned carrier LH is connected to the housing H and the base B through the upper and lower springs FS and BS, respectively, so that the carrier LH can be suspended in the driving mechanism 100 in a movable manner. Through the aforementioned mechanism configuration, external light can enter the driving mechanism 100 along the optical axis O (Z-axis direction) of the optical element, and the light will pass through the optical element (such as an optical lens) and reach an image sensing element (not shown) located below the base B, thereby generating a digital image.

[0084] It should be particularly noted that a coil C is provided on both sides of the aforementioned carrier LH, and a magnetic element M (such as a magnet) corresponding to the aforementioned coil C is provided on the inner side of the shell H, wherein the aforementioned coil C and the magnetic element M can constitute a driving component.

[0085] When a current signal is applied to the aforementioned coil C, the magnetic force generated between the coil C and the magnetic element M can drive the carrier LH and the optical element disposed therein to move relative to the base B and the shell H along the optical axis O direction (Z-axis direction), thereby achieving the function of auto focus (AF) or optical image stabilization (OIS).

[0086] from Figure 3 and Figure 4 As can be seen from the figure, a magnet HM is provided on one side of the carrier LH, and a magnetic field sensing element HS (such as Fig.10 and Fig.11 As shown in the figure, the magnetic field sensing element HS is used to sense the position change of the magnet HM. For example, the magnetic field sensing element HS can be a Hall effect sensor, a magnetoresistive sensor (MR sensor), or a fluxgate sensor, which can be used to sense the position of the magnet HM, so as to know the position change of the carrier LH relative to the fixed part (shell H and base B).

[0087] On the other hand, from Figure 1 and Figure 3 It can also be seen that two conductive parts BT protrude from one side of the plastic base B, wherein the conductive parts BT are combined with the inside of the plastic base B by insert molding. Specifically, the conductive part BT1 of each conductive part BT is exposed at two corners of the top side of the base B ( Figure 3 ), and it can be electrically connected to the end BS1 of each lower spring sheet BS by welding. In addition, the end of the aforementioned conductive member BT protrudes from the side surface of the base B along the -Y axis direction and is electrically connected to the circuit board.

[0088] In this embodiment, each lower spring leaf BS also has two joint portions BS2 ( Figure 3 and Figure 4 ), glue can be applied to the joint portion BS2 during assembly to bond the lower spring sheet BS and the base B. In addition, each of the lower spring sheets BS also has a recessed portion BS3, the openings of the recessed portions BS3 are all facing the same direction, and are respectively located below the two winding posts LH1 of the carrier LH, wherein the distance between the two recessed portions BS3 is greater than 0.4 mm, and during assembly, the two wires connected to the coil C and wound on the two winding posts LH1 can be electrically connected to the recessed portions BS3 of the two lower spring sheets BS by welding or soldering.

[0089] In addition, when viewed along the X-axis direction, the magnet HM and the winding post LH1 at least partially overlap. By arranging the magnet HM and the winding post LH1 on the same side of the carrier LH, the drive mechanism 100 has an eccentric structural design. That is, when viewed along the Z-axis direction, the optical axis O of the optical element and the central axis O' ( Fig.11 ) do not overlap. As a result, the drive mechanism 100 is more suitable for use in smart phones or portable electronic devices, especially when used as a front lens. The eccentric structural design allows the drive mechanism 100 and the optical elements (such as optical lenses) carried therein to be closer to the edge of the mobile phone. When the user operates the mobile phone or views the mobile phone screen, the impact of the front lens on the viewing experience of the screen can be effectively reduced, thereby improving the usability of the mobile phone.

[0090] Please also refer to Figure 3 , Figure 4 , Figure 5 and Figure 6 ,in Figure 5 express Figure 3 and Figure 4 The upper spring FS and the housing H are in a three-dimensional view after assembly. Figure 6 express Figure 5 A partial enlarged view of the upper spring leaf FS and the housing H after assembly.

[0091] like Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the housing H is substantially quadrilateral and has a top cover H0 and four side walls h extending from the top cover H0 toward the base B. The upper spring FS is fixed to the inner surface of the top cover H0 of the housing H.

[0092] It should be noted that protruding structures H1 and H2 are formed at two adjacent corners of the inner side of the top cover H0. Figure 5 ), wherein the two protruding structures H1 and H2 will be adjacent to the bosses B1 and B2 on the base B respectively after assembly, and during the assembly process of the driving mechanism 100, glue can be applied between the protruding structure H1 and the boss B1, and glue can be applied between the protruding structure H2 and the boss B2, thereby improving the bonding strength between the shell H and the base B.

[0093] On the other hand, from Figure 5 and Figure 6 It can also be seen that a number of ribs H3 extending in the Z-axis direction are formed on two opposite side walls h of the shell H, wherein the aforementioned magnetic element M (such as a magnet) can be positioned between two adjacent ribs H3 during assembly, and the aforementioned magnetic element M can be bonded to the side wall h of the shell H by glue; in this way, in addition to preventing the magnetic element M from falling off from the shell H, the positioning accuracy of the magnetic element M can also be greatly increased, thereby improving the overall performance and reliability of the drive mechanism 100.

[0094] Please also read Figure 7 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 and Fig.12 ,in Figure 7 express Figure 3 and Figure 4 A three-dimensional view of the base B in FIG. Figure 8 express Figure 7 The three-dimensional picture of the base B and the circuit board F after they are combined, Fig. 9 A three-dimensional diagram showing the combination of the lower spring BS, the base B and the circuit board F. Fig.10 Another perspective view showing the combination of the lower spring BS, the base B and the circuit board F. Fig.11 It shows the top view of the coil C, magnetic element M, carrier LH, lower spring BS, base B and circuit board F after being combined. Fig.12 express Fig.11A partial enlarged view of the conductive portion BT1 of the conductive member BT and the end BS1 of the lower spring sheet BS located outside the boss B1.

[0095] like Figure 7 and Figure 8 As shown, the base B of this embodiment has four bosses B1, B2, B3, B4 extending in the Z-axis direction and two limiting structures P1, P2 extending in the Z-axis direction, and the aforementioned conductive part BT, limiting structures P1, P2 and circuit board F are all located on the same side of the base B, wherein the boss B1 (first boss) is connected to the limiting structure P1 (first limiting structure), the boss B2 (second boss) is connected to the limiting structure P2 (second limiting structure), and the circuit board F is arranged between the two limiting structures P1, P2.

[0096] Specifically, a first groove P11 is formed on the outer surface of the aforementioned limiting structure P1 (first limiting structure), and a second groove P21 is formed on the outer surface of the aforementioned limiting structure P1 (second limiting structure). During assembly, glue can be applied in the first groove P11 and the second groove P21, and the circuit board F can be bonded and fixed to the outer surfaces of the limiting structures P1 and P2 by the aforementioned glue. Figure 8 ).

[0097] In addition, from Figure 7 to Figure 12 It can be seen that internal connection parts B11, B21, B31, B41 are respectively formed on the inner sides of the bosses B1, B2, B3, B4 of the aforementioned base B, and external connection parts R1, R2 are respectively formed on the outer sides of the bosses B1, B2, wherein the aforementioned internal connection parts B11, B21, B31, B41 form grooves for accommodating gel, and the aforementioned external connection parts R1, R2 form grooves for accommodating glue.

[0098] During the assembly process of the driving mechanism 100, gel can be applied between the inner connecting parts B11, B21, B31, B41 of the aforementioned bosses B1, B2, B3, B4 and the carrier LH to connect the aforementioned bosses B1, B2, B3, B4 and the four corners of the carrier LH.

[0099] Furthermore, during assembly, glue may be applied to the outer connection portions R1 and R2 of the bosses B1 and B2 to connect the bosses B1 and B2 and the two protruding structures H1 and H2 located at the corners of the shell H, thereby significantly improving the bonding strength between the shell H and the base B.

[0100] On the other hand, from Figure 7 to Figure 12It can also be seen that the two conductive parts BT1 of the conductive element BT are exposed at the two corners of the base B and are respectively adjacent to the external connection parts R1 and R2 of the bosses B1 and B2, and the two end parts BS1 of the lower spring sheet BS will be respectively overlapped on the aforementioned conductive parts BT1 during assembly, and the end parts BS1 of the lower spring sheet BS and the conductive parts BT1 of the conductive element BT can be electrically connected to each other by welding.

[0101] It should be noted that the outer connecting portion R1 of the boss B1 in this embodiment forms a concave structure, and the end BS1 of the lower spring BS and the conductive portion BT1 of the conductive element BT are both located outside the boss B1 (eg Fig.12 Similarly, the outer connection portion R2 of the other protrusion B2 is also formed with a corresponding concave structure, and the other end portion BS1 of the lower spring sheet BS and the other conductive portion BT1 of the conductive member BT are both located on the outside of the protrusion B2, so that the internal space of the driving mechanism 100 can be effectively utilized, thereby being able to help achieve the miniaturization of the driving mechanism 100.

[0102] In addition, bumps BP are formed at the four corners of the base B. During assembly, the bumps BP can pass through the joints BS2 of the lower spring sheet BS respectively, and glue can be applied to the joints BS2 and the bumps BP to bond them together, thereby strengthening the fixing effect between the lower spring sheet BS and the base B.

[0103] Please see again Fig.13 ,in Fig.13 along Figure 1 A partial cross-sectional view of the line segment A1-A2 in FIG.

[0104] from Fig.13 It can be seen that the outer connection portion R1 of the boss B1 faces the protruding structure H1 located at the corner of the housing H, and the bump BP located on the base B passes through the joint portion BS2 of the lower spring sheet BS in the Z-axis direction. On the other hand, the end BS1 of the lower spring sheet BS and the conductive portion BT1 of the conductive member BT are both located outside the boss B1, wherein the protruding structure H1 of the housing H, the end BS1 of the lower spring sheet BS and the conductive portion BT1 of the conductive member BT at least partially overlap each other in the Z-axis direction, and the end BS1 of the lower spring sheet BS is located between the protruding structure H1 of the housing H and the conductive portion BT1 of the conductive member BT.

[0105] Through the aforementioned special mechanism design, this embodiment can not only effectively utilize the internal space of the driving mechanism 100 to achieve miniaturization of the driving mechanism 100, but also enhance the bonding strength between the shell H and the base B, thereby greatly improving the overall performance and reliability of the driving mechanism 100.

[0106] Although the embodiments of the present invention and their advantages have been disclosed as above, it should be understood that those skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufactures, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any technician in the relevant technical field can understand the current or future developed processes, machines, manufactures, material compositions, devices, methods and steps from the disclosure of the present invention. As long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can all be used according to the present invention. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufactures, material compositions, devices, methods and steps. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes the combination of each claim and embodiment.

[0107] Although the present invention has been disclosed above in terms of preferred embodiments, they are not intended to limit the present invention. Those skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A driving mechanism for driving an optical element to move, wherein the optical element has an optical axis, the driving mechanism comprising: a fixing portion; a movable portion movably connected to the fixed portion, the optical element being disposed on the movable portion; as well as A driving assembly is used to drive the movable part to move relative to the fixed part.

2. The driving mechanism as described in claim 1, wherein the driving mechanism also includes an upper spring leaf, and the fixing portion has a shell and a base connected to each other, wherein the shell is formed with a top cover and at least one side wall, the side wall extends from the top cover toward the base, and the upper spring leaf is arranged on an inner surface of the top cover.

3. The driving mechanism as described in claim 2, wherein the side wall of the shell is formed with two ribs, and the driving component has a coil and a magnetic element, the coil is arranged on the movable part, and the magnetic element is fixed on the side wall and is located between the two ribs.

4. The driving mechanism as described in claim 2, wherein the driving mechanism also includes a circuit board, the base is formed with a first limiting structure and a second limiting structure extending toward the shell, and the circuit board is fixed between the first limiting structure and the second limiting structure.

5. The driving mechanism as described in claim 4, wherein the first limiting structure forms a first groove, the second limiting structure forms a second groove, and a glue is arranged in the first groove and the second groove to bond the circuit board and the first limiting structure and the second limiting structure.

6. The driving mechanism as described in claim 4, wherein the base is also formed with a first boss and a second boss, the first boss and the second boss are respectively connected to the first limiting structure and the second limiting structure, and the first boss, the second boss and the first limiting structure and the second limiting structure extend into the shell.

7. The driving mechanism as described in claim 6, wherein the shell is further formed with a protruding structure, and the first protruding column has an external connecting portion, wherein the external connecting portion is formed with a concave structure, and the concave structure and the protruding structure are located at a corner of the driving mechanism and are bonded to each other.

8. The driving mechanism as claimed in claim 7, wherein the driving mechanism further comprises a gel, and the first protruding column further has an inner connecting portion, wherein the gel connects the inner connecting portion and the movable portion.

9. The driving mechanism as claimed in claim 8, wherein the inner connecting portion is formed with a groove for accommodating the gel.

10. The driving mechanism as described in claim 7, wherein the driving mechanism further comprises a lower spring sheet and a conductive member, the lower spring sheet is connected to the base and the movable portion, the conductive member is embedded in the base, and a conductive portion of the conductive member is exposed on the top side of the base, wherein an end portion of the lower spring sheet is electrically connected to the conductive portion of the conductive member, and the end portion and the conductive portion are both located on the outside of the first protrusion. 11 . The driving mechanism of claim 10 , wherein the protruding structure, the end portion of the lower spring sheet, and the conductive portion of the conductive member partially overlap in the optical axis direction. 12 . The driving mechanism of claim 10 , wherein the end portion of the lower spring leaf is located between the protruding structure of the housing and the conductive portion of the conductive member.

13. The driving mechanism as described in claim 2, wherein the driving mechanism further comprises two wires and two lower spring sheets, wherein the two lower spring sheets are connected to the base and the movable part and respectively have a recessed part, and the movable part has two winding posts, wherein the two wires are respectively wound around the winding posts and respectively electrically connected to the two recessed parts.

14. The driving mechanism of claim 13, wherein each of the two recessed portions is formed with an opening, and the two openings face the same direction.

15. A driving mechanism as described in claim 2, wherein the fixing portion has a shell and a base connected to each other, the base is formed with a first boss extending toward the shell, and the shell is formed with a protruding structure, wherein the first boss has an external connecting portion, the external connecting portion is formed with an inner concave structure, the inner concave structure and the protruding structure are located at a corner of the driving mechanism and are bonded to each other. 16 . The driving mechanism as claimed in claim 15 , wherein the driving mechanism further comprises a gel, and the first protruding column further has an inner connecting portion, wherein the gel connects the inner connecting portion and the movable portion.

17. The driving mechanism of claim 16, wherein the inner connecting portion is formed with a groove for accommodating the gel.

18. A driving mechanism as described in claim 15, wherein the driving mechanism further includes a lower spring sheet and a conductive member, the lower spring sheet is connected to the base and the movable portion, the conductive member is embedded in the base, and a conductive portion of the conductive member is exposed on the top side of the base, wherein an end portion of the lower spring sheet is electrically connected to the conductive portion of the conductive member, and the end portion and the conductive portion are both located on the outside of the first protrusion. 19 . The driving mechanism of claim 18 , wherein the protruding structure, the end portion of the lower spring leaf, and the conductive portion of the conductive member partially overlap in the optical axis direction. 20 . The driving mechanism of claim 18 , wherein the end portion of the lower spring leaf is located between the protruding structure of the housing and the conductive portion of the conductive member.

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