Spiral heat dissipation structure of computer
By introducing spiral fins and spiral water pipes into the heat pipe heat dissipation structure, combined with the design of the heat dissipation fan, the problems of uneven heat dissipation and lack of protective frame are solved, and more efficient heat dissipation and structural maintenance are achieved.
Patent Information
- Application Number
- CN202411336903.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-01-14
AI Technical Summary
The existing heat pipe heat dissipation structure mainly relies on air cooling. The single air cooling structure does not have the effect of blowing the heat dissipation from the heat pipe fins, and lacks a protective frame that is easy to disassemble, resulting in uneven heat dissipation and difficult to maintain.
A computer spiral heat dissipation structure is designed, including a substrate, support plate, heat pipe, spiral fins and a heat dissipation fan. The outer wall of the heat pipe is connected to the spiral fins, and the spiral water pipe is closely combined with the fins. The spiral design increases the heat dissipation area and dissipates heat by The fan strengthens air circulation, while a detachable protective frame is provided to protect the heat dissipation structure.
Through the design of spiral fins and spiral water pipes, the heat dissipation efficiency and uniformity are significantly improved, and the removable protective frame is conveniently maintained and cleaned, enhancing the protective effect of the heat dissipation structure.
Smart Images

Figure CN119311093A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of computer heat dissipation structures, and in particular to a computer spiral heat dissipation structure. Background Art
[0002] Computer heat dissipation is a key link to ensure the stable operation of hardware. Poor heat dissipation will cause hardware overheating, which will affect performance or even damage the hardware. Computer heat dissipation methods mainly include air cooling, water cooling, heat pipe cooling, etc. Air cooling is the most common heat dissipation method. It drives air flow through a fan and transfers heat to the air through the heat sink. Water cooling takes away heat through liquid circulation and usually has higher heat dissipation efficiency. Heat pipe cooling uses the phase change heat transfer principle of heat pipes to transfer heat through the process of evaporation and condensation. Heat pipe radiators have good thermal conductivity and can reduce the volume of the radiator without affecting the heat dissipation effect.
[0003] Most of the existing heat pipe cooling structures are only used in conjunction with fan cooling. The single air cooling structure has a general effect on dissipating the heat dispersed by the fins of the heat pipe. The heat dissipation of the fins far away from the fan end is uneven, and there is no protective frame on the outside of the heat dissipation structure that is easy to disassemble. When in use, the protective frame can protect the heat dissipation structure, and it is also convenient to disassemble the protective frame for dust removal or maintenance of the heat dissipation structure. Summary of the invention
[0004] In order to solve the technical problems that most of the existing heat pipe cooling structures are only used in conjunction with fan cooling, the single air cooling structure has a general effect on dissipating the heat dispersed by the fins of the heat pipe, the heat of the fins far away from the fan end is unevenly dissipated, and there is no protective frame on the outside of the heat dissipation structure that is easy to disassemble, the present invention provides a computer spiral heat dissipation structure.
[0005] A computer spiral heat dissipation structure comprises a base plate, a support plate and a plurality of heat pipes, wherein one end portion of the plurality of heat pipes is partially embedded in the base plate and the other end is fixed on the support plate, a liquid storage tank is fixedly arranged at the outer end of the support plate, a heat dissipation fan is arranged on the support plate, spiral fins are fixedly connected to the outer walls of the plurality of heat pipes, a spiral water pipe is arranged on the outer side of each spiral fin, the two ends of the plurality of spiral water pipes are respectively communicated with the same water inlet pipe and the same return pipe, and a refrigeration plate is fixedly arranged inside the liquid storage tank.
[0006] More preferably, a through slot is provided on the support plate, support frames are fixedly provided at both ends of the through slot, and the heat dissipation fan is fixedly provided between the support frames and can rotate inside the through slot.
[0007] More preferably, a heat insulation board is fixedly arranged on one side of the substrate close to the cooling fan, and one end of the plurality of heat pipes penetrates through the rear section of the heat insulation board and is embedded in the substrate, and the other end is fixedly arranged on the outer wall of the support plate or the outer wall of the support frame.
[0008] More preferably, the spiral water pipe is arranged close to the spiral fins to conduct the emitted cold air to the spiral fins.
[0009] More preferably, the outer wall of the liquid storage tank is also provided with a liquid inlet, and the liquid inlet is movably provided with a cover body. One end of the water inlet pipe and the return pipe are connected to the liquid storage tank, and the other end is respectively connected to a plurality of water distribution pipes. The plurality of water distribution pipes can connect a plurality of spiral water pipes, and a circulating pump is also provided on the return pipe.
[0010] More preferably, the outer walls of the base plate and the support plate are also provided with bolt structures, which are detachably connected to the protection frame via the bolt structures, and the outer wall of the protection frame is a ventilation mesh plate with ventilation holes.
[0011] More preferably, a plurality of threaded holes are provided at one end of the protective frame close to the bolt structure, and the bolt structure includes a plurality of groups of fixing blocks fixed to the outer walls of the base plate and the support plate, and a threaded rod is rotatably provided between each group of fixing blocks. The threaded rod can pass through the threaded holes and use nuts to fix the two ends of the protective frame to the base plate and the support plate.
[0012] More preferably, several heat pipes are filled with working medium and each includes an evaporation section, an insulation section and a cooling section. The evaporation section is a section embedded in the substrate below the insulation board, the insulation section is a section running through the middle of the insulation board, and the cooling section is a section above the insulation board.
[0013] Compared with the prior art, the beneficial effects of the present invention are: the substrate is installed on the computer heating structure, the generated heat circulates in the heat pipe and enters the cooling end for cooling, the spiral fins can better disperse the heat in the heat pipe, increase the contact area with the air, and the spiral water pipes close to the spiral fins circulate with refrigerant to accelerate the reduction of the heat of the spiral fins. At the same time, the cooling fan is used to further enhance the air circulation and dissipate part of the heat. The outside of the heat dissipation structure is detachably provided with a protective frame through a bolt structure, which can play a good protective role and avoid damage to the heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a front cross-sectional schematic diagram of the structure of the present invention;
[0015] Figure 2 It is a front view schematic diagram of the structure of the present invention;
[0016] Figure 3 It is a schematic side view of the spiral water pipe 7 of the present invention;
[0017] Figure 4 It is a schematic side view of the structural support plate 2 of the present invention;
[0018] Figure 5 It is a schematic diagram of the structure of the present invention;
[0019] Figure 6 It is a schematic diagram of the partial structure A of the present invention;
[0020] Figure 7 It is a schematic diagram of partial structure B of the present invention.
[0021] In the figure: 1. base plate; 2. support plate; 3. heat pipe; 4. liquid storage tank; 5. cooling fan; 6. spiral fin; 7. spiral water pipe; 8. water inlet pipe; 9. return pipe; 10. refrigeration plate; 11. insulation board; 12. through groove; 13. support frame; 14. liquid inlet; 15. water distribution pipe; 16. circulation pump; 17. bolt structure; 18. protection frame; 19. threaded hole; 20. fixing block; 21. threaded rod; 22. nut; 23. evaporation section; 24. insulation section; 25. cooling section. DETAILED DESCRIPTION
[0022] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.
[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so as to describe the embodiments of the present invention described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0024] In the present invention, the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.
[0025] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to the specific circumstances. In addition, the term "plurality" should mean two or more than two.
[0026] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. Figure 1-Figure 7 The present invention is described in detail with reference to embodiments.
[0027] A computer spiral heat dissipation structure comprises a base plate 1, a support plate 2 and a plurality of heat pipes 3, wherein one end of the plurality of heat pipes 3 is partially embedded in the base plate 1 and the other end is fixed on the support plate 2, a heat insulation plate 11 is also fixedly provided on one side of the base plate 1 close to a heat dissipation fan 5, one end of the plurality of heat pipes 3 passes through the heat insulation plate 11 and the rear portion is partially embedded in the base plate 1, and the other end is fixedly provided on the outer wall of the support plate 2 or the outer wall of a support frame 13.
[0028] The bottom wall of the substrate 1 is fitted with the computer components to form a heated area. When the computer components are working, the heat generated is transferred to the substrate 1 and then to the evaporation section 23 of the heat pipe 3. Since the plurality of heat pipes 3 include a sealed tube, a liquid wick and a steam channel. The liquid wick surrounds the tube wall of the sealed tube and is soaked with a volatile working medium, which can be distilled water, ammonia, methanol or acetone, etc. The plurality of heat pipes 3 include an evaporation section 23, an insulation section 24 and a cooling section 25. The evaporation section 23 is a section embedded in the interior of the substrate 1 below the insulation board 11, the insulation section 24 is a section running through the middle of the insulation board 11, and the cooling section 25 is a section above the insulation board 11.
[0029] When the heat pipe 3 is in operation, its evaporation section 23 absorbs the heat generated by the computer components, causing the working medium in the liquid wick tube to boil and become steam. The steam with heat flows from the evaporation section 23 of the heat pipe 3 to the cooling section 25 through the insulation section 24 in sequence. When the steam transfers the heat to the cooling section 25, the steam condenses into liquid working medium. The condensed liquid returns to the evaporation section 23 through the capillary action of the liquid wick on the tube wall. The above cycle is repeated to continuously dissipate heat.
[0030] A liquid storage tank 4 is fixedly provided at the outer end of the support plate 2 through four connecting columns. A liquid inlet 14 is also provided on the outer wall of the liquid storage tank 4. The liquid inlet 14 is movably provided with a cover. By opening the cover, refrigerant can be poured into or discharged from the liquid storage tank 4 through the liquid inlet 14, which is convenient for regular replacement of the refrigerant. Both ends of a number of spiral water pipes 7 are respectively connected to the same water inlet pipe 8 and the same return pipe 9. A refrigeration plate 10 is fixedly provided inside the liquid storage tank 4 to cool the refrigerant liquid.
[0031] One end of the water inlet pipe 8 and the return pipe 9 are both connected to the liquid storage tank 4, and the other ends are respectively connected to a plurality of water distribution pipes 15. The plurality of water distribution pipes 15 can connect the plurality of spiral water pipes 7. A circulating pump 16 is also provided on the return pipe 9. The circulating pump 16 is started to drive the refrigerant to flow from the water inlet pipe 8 into the plurality of water distribution pipes 15, and then into the plurality of spiral water pipes 7, to exchange heat with the adjacent spiral fins 6, thereby accelerating the heat exchange speed of the heat pipe 3. The refrigerant after heat exchange flows back from the return pipe 9 to the liquid storage tank 4, and the cycle is repeated in this way to achieve the purpose of water circulation heat exchange.
[0032] The outer walls of the heat pipes 3 are fixedly connected with spiral fins 6 , and a spiral water pipe 7 is arranged outside each spiral fin 6 . The spiral water pipe 7 is arranged close to the spiral fin 6 and can conduct the emitted cold air to the spiral fin 6 .
[0033] The spiral water pipe 7 is coiled in the spiral gap between the spiral fins 6 and is adjacent to the spiral fins 6. The spiral water pipe 7 is a hard water pipe, such as copper or aluminum with good heat exchange performance, and is made into a spiral shape through a specific processing method so that it can be better fixed next to the spiral fins 6.
[0034] The spiral heat dissipation structure of the spiral water pipe 7 and the spiral fins 6 can provide a larger heat dissipation area within a limited volume, thereby more effectively dissipating the heat generated when the computer is running. The spiral shape design allows more heat to be transferred to the air through the increased surface area, thereby achieving faster heat dissipation.
[0035] A cooling fan 5 is arranged on the support plate 2. A through slot 12 is arranged on the support plate 2. Support frames 13 are fixedly arranged at both ends of the through slot 12. The support frame 13 is composed of a plurality of supporting circular plates and a plurality of supporting columns fixedly connected. The cooling fan 5 is fixedly arranged between the middle supporting circular plates in the support frame 13. The other supporting circular plates are used to support the other end of the heat pipe 3. When the cooling fan 5 is started, the cooling fan 5 can rotate inside the through slot 12, which can accelerate the air circulation of the heat pipe 3, take away the emitted heat, and accelerate the exchange of cold air and hot air.
[0036] The outer walls of the base plate 1 and the support plate 2 are also provided with a bolt structure 17, which is detachably connected to the protection frame 18 through the bolt structure 17. The outer wall of the protection frame 18 is a ventilation mesh plate with ventilation holes, which plays a protective role without affecting the circulation of hot air.
[0037] A plurality of threaded holes 19 are provided at one end of the protective frame 18 close to the bolt structure 17. The bolt structure 17 includes a plurality of groups of fixing blocks 20 fixed to the outer walls of the base plate 1 and the support plate 2. A threaded rod 21 is rotatably provided between each group of fixing blocks 20. The threaded rod 21 can pass through the threaded holes 19 and use nuts 22 to fix the two ends of the protective frame 18 to the base plate 1 and the support plate 2.
[0038] When it is necessary to remove dust or overhaul the spiral fins 6 and other components inside the protective frame 18, loosen the nut 22 and pull out the threaded rod 21 so that the protective frame 18 can be separated from the outer wall of the substrate 1 and the support plate 2. After the overhaul, bring the protective frame 18 close to the outer wall of the substrate 1 and the support plate 2 so that the threaded rod 21 passes through the fixing block 20 and the threaded hole 19 in turn, and tighten the nut 22 to fix the protective frame 18 on the outer wall of the substrate 1 and the support plate 2.
[0039] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A computer spiral heat dissipation structure, comprising a base plate (1), a support plate (2) and a plurality of heat pipes (3), characterized in that: One end section of a plurality of heat pipes (3) is embedded in the interior of a base plate (1), and the other end is fixed on a support plate (2); a liquid storage tank (4) is fixedly arranged at the outer end of the support plate (2); a heat dissipation fan (5) is arranged on the support plate (2); spiral fins (6) are fixedly connected to the outer walls of the plurality of heat pipes (3); a spiral water pipe (7) is arranged on the outer side of each spiral fin (6); the two ends of the plurality of spiral water pipes (7) are respectively connected to the same water inlet pipe (8) and the same return pipe (9); and a cooling fin (10) is fixedly arranged inside the liquid storage tank (4).
2. A computer spiral heat dissipation structure according to claim 1, characterized in that: A through slot (12) is provided on the support plate (2), support frames (13) are fixedly provided at both ends of the through slot (12), and a heat dissipation fan (5) is fixedly provided between the support frames (13) and can rotate inside the through slot (12).
3. A computer spiral heat dissipation structure according to claim 2, characterized in that: A heat insulation board (11) is fixedly arranged on one side of the base plate (1) close to the heat dissipation fan (5), and one end of a plurality of heat pipes (3) penetrates through the rear section of the heat insulation board (11) and is embedded in the base plate (1), while the other end is fixedly arranged on the outer wall of the support plate (2) or the outer wall of the support frame (13).
4. A computer spiral heat dissipation structure according to claim 2 or 3, characterized in that: The spiral water pipe (7) is arranged close to the spiral fin (6) and can conduct the emitted cold air to the spiral fin (6).
5. The computer spiral heat dissipation structure according to claim 4, characterized in that: The outer wall of the liquid storage box (4) is also provided with a liquid inlet (14), and the liquid inlet (14) is movably provided with a cover body. One end of the water inlet pipe (8) and the return pipe (9) are both connected to the liquid storage box (4), and the other end is respectively connected to a plurality of water distribution pipes (15). The plurality of water distribution pipes (15) can make the plurality of spiral water pipes (7) connected. A circulation pump (16) is also provided on the return pipe (9).
6. The computer spiral heat dissipation structure according to claim 2, characterized in that: The outer walls of the base plate (1) and the support plate (2) are also provided with bolt structures (17), which are detachably connected to the protection frame (18) via the bolt structures (17); the outer wall of the protection frame (18) is a ventilation mesh plate with ventilation holes.
7. The computer spiral heat dissipation structure according to claim 6, characterized in that: A plurality of threaded holes (19) are arranged at one end of the protection frame (18) close to the bolt structure (17). The bolt structure (17) comprises a plurality of groups of fixing blocks (20) fixed to the outer walls of the base plate (1) and the support plate (2). A threaded rod (21) is rotatably arranged between each group of fixing blocks (20). The threaded rod (21) can pass through the threaded holes (19) and use nuts (22) to fix the two ends of the protection frame (18) to the base plate (1) and the support plate (2).
8. The computer spiral heat dissipation structure according to claim 7, characterized in that: The plurality of heat pipes (3) are filled with a working medium and each comprises an evaporation section (23), an insulation section (24) and a cooling section (25); the evaporation section (23) is a section embedded in the interior of the base plate (1) below the insulation board (11); the insulation section (24) is a section running through the middle of the insulation board (11); and the cooling section (25) is a section above the insulation board (11).