Wafer productivity planning method and device, medium and product

Abstract

The embodiment of the invention relates to the field of wafer processing management, and discloses a wafer productivity planning method and device, a medium and a product. According to a production scheduling algorithm, performing timing scheduling on each machine device to obtain a first scheduling result, and storing the first scheduling result; according to the first scheduling result, obtaining unavailable time of each machine device, inputting the unavailable time as data of next timing scheduling into the production scheduling algorithm, and adding constraints to obtain a second scheduling result; in the next timing scheduling task, continuing to adjust the scheduling result based on the second scheduling result until a preset stop condition is met; and under the abnormal condition, adjusting the scheduled production task by adopting the order locking logic. The method and the device can be at least used for solving the problem of wafer productivity reduction caused by abnormal conditions in the production process.

Description

Technical Field

[0001] The present application relates to the field of wafer processing management, and in particular to a wafer capacity planning method, equipment, medium and product. Background Art

[0002] In the semiconductor manufacturing process, wafer cleaning (WET) and diffusion (Diffusion) equipment are key processing links, which usually need to operate in an efficient and continuous production mode. These process steps involve multiple product processing steps (steps), and there are usually strict waiting time (Qtime) constraints between each step. If a processing step is not completed within the specified time, it may cause oxidation or other defects on the wafer surface, thus affecting the quality of the final product.

[0003] Traditional wafer fab scheduling methods are usually based on simple scheduling algorithms that perform well when dealing with fixed production processes. However, in actual production processes, wafer fabs often face various uncertainties, such as the failure of scheduled wafer lots to arrive at designated workstations on time, sudden equipment failures leading to unplanned downtime, or the need for manual intervention to reassemble batches. The above abnormal situations will have a significant impact on the execution of production plans, resulting in idle equipment, reduced production capacity, and even wafer scrapping. Summary of the invention

[0004] One purpose of the present application is to provide a wafer capacity planning method, device, medium and product, at least to solve the problem of reduced wafer capacity due to abnormal conditions in the production process.

[0005] To achieve the above objectives, some embodiments of the present application provide the following aspects: On the first aspect, some embodiments of the present application also provide a wafer capacity planning method, including scheduling each machine equipment according to a production scheduling algorithm to obtain a first scheduling result, and storing the first scheduling result; according to the first scheduling result, obtaining the unavailable time of each machine equipment, and inputting the unavailable time into the production scheduling algorithm as the data for the next scheduled scheduling and adding constraints to obtain a second scheduling result; in the next scheduled scheduling task, continuing to adjust the scheduling result based on the second scheduling result until a preset stop condition is met; in the event of an abnormality, using the lock order logic to adjust the scheduled production tasks, the abnormality includes the lot not arriving on time, unplanned equipment downtime, and manual intervention in batching.

[0006] In a second aspect, some embodiments of the present application further provide an electronic device, comprising: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, cause the processor to perform the steps of the method described above.

[0007] In a third aspect, some embodiments of the present application further provide a computer-readable medium having computer program instructions stored thereon, wherein the computer program instructions can be executed by a processor to implement the method as described above.

[0008] In a fourth aspect, some embodiments of the present application further provide a computer program product, comprising a computer program / instruction, which implements the steps of the method described above when executed by a processor.

[0009] Compared with the related art, the solution provided in the embodiment of the present application significantly improves the capacity planning stability and equipment utilization rate of wafer cleaning and diffusion equipment under abnormal conditions by introducing order locking logic and a processing mechanism for abnormal situations. This solution can avoid frequent scheduling changes when dealing with sudden situations on the production line, thereby ensuring the continuity and execution efficiency of the production plan, while minimizing the capacity loss caused by equipment downtime or wafers not arriving on time. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0011] Figure 1 A schematic diagram of a process flow of a wafer production capacity planning method provided according to an embodiment of the present application; Figure 2 A schematic diagram of a process for handling a lot missing abnormal situation according to an embodiment of the present application; Figure 3 A schematic diagram of a process for handling an abnormal down situation of a machine that is out of plan according to an embodiment of the present application; Figure 4 A schematic diagram of a process of manual batch processing provided according to an embodiment of the present application; Figure 5 A schematic diagram of a loop scheduling process according to an embodiment of the present application; Figure 6 The present invention is a schematic diagram of the structure of an electronic device provided according to an embodiment of the present application. DETAILED DESCRIPTION

[0012] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0013] The following terms are used in this article.

[0014] Lot: A wafer fab product processing unit, with 1 to 25 silicon wafers forming a lot; Diffusion: Diffusion equipment in wafer fabs; WET: Cleaning equipment for wafer fabs; Loop: describes the processing path of a product between specific areas; Step: Each product processing step; Flow: describes the entire processing line of a product. Generally, there is more than one loop in a flow. Qtime: The waiting time allowed from the completion of one step to the next step of the lot; Bench: When cleaning a lot, some cleaning equipment needs to clean two lots together, with two lots forming one bench. Batch: When lots are diffused, they need to be grouped into batches, with 6-8 lots as one batch; Pre-batch: The lots are pre-batched before they arrive at the diffusion device; Dummy wafer: The diffusion area is used as a placeholder silicon wafer and is processed together with the normal silicon wafer to meet the constraint of 150 wafers.

[0015] In the wafer fab, wet and diffusion equipment are usually produced continuously, involving multiple steps, and there are strict qtime limits between each step. In order to ensure that the lot does not violate qtime, accurate capacity planning is required. The Diffusion (thermal diffusion) area of ​​the wafer fab is a batch production of lots. The required impurities are doped into the silicon substrate by the diffusion movement of impurities, that is, based on the impurities under high temperature and the protection of the silicon oxide layer, they diffuse to the surface of the semiconductor wafer to form a doping layer-diffusion layer resistance, thereby changing the local electrical properties of the wafer. Diffusion / oxidation equipment is essentially a thermal processing equipment. During the semiconductor production process, the equipment can oxidize, diffuse and anneal silicon wafers. It has the characteristics of strong stability, high precision, and continuous operation. The diffusion process takes 6-8 hours, and before the lot reaches the diffusion area, dust impurities, metals, ions, oxide layers, etc. on the wafer surface need to be removed, that is, WET. There are two types of wet machines, by lot (single wafer clean) and by bench. Single wafer clean can only process one wafer at a time. Single wafer cleaning can avoid cross contamination, remove particles without damage, better remove photoresist, uniformity and hole cleaning. The wet bench is to soak 50 wafers in an acid solution, or spray the acid solution on the chip. Through the chemical reaction between the solution and the etched object, the atoms on the surface of the film are removed to achieve the purpose of etching. After the wet is completed, the bench is untied and the pre_batch before the diffusion is performed. Since the WET area uses an acid solution to clean the silicon wafer, once the wet is completed, it is exposed to the air and the silicon wafer will oxidize when exposed to the air. Therefore, there is a qtime constraint from the wet to the difffusion area, that is, the diffusion must be started within the qtime time after the wet is completed, otherwise the wet needs to be repeated. Therefore, in the actual production process, the start time of the wet needs to be strictly controlled before the diffusion batch.

[0016] First embodiment

[0017] The first embodiment of the present application relates to a wafer production capacity planning method. Figure 1 As shown, the method may include the following steps: S101, schedule each machine device according to the production scheduling algorithm, obtain a first scheduling result, and store the first scheduling result. Schedule each machine device through a preset production scheduling algorithm to generate an initial scheduling result (first scheduling result). The scheduling result includes the arrangement of wafer lots that each machine device needs to process within a specific time period. Subsequently, the first scheduling result is stored for use in subsequent scheduling steps.

[0018] A production scheduling algorithm refers to a scheduling scheme that automatically generates and adjusts production tasks based on production demand, machine equipment availability, and dynamic changes in the production environment through mathematical modeling and optimization techniques. The production scheduling algorithm described in this application is a scheduling method commonly used in the prior art, including but not limited to scheduling methods based on constrained optimization, heuristic algorithms, or integer programming. Such algorithms are widely used in various production scheduling systems, especially in industries such as semiconductor manufacturing and electronic assembly to optimize the task scheduling of production lines.

[0019] S102, according to the first scheduling result, obtain the unavailable time of each machine equipment, and input the unavailable time as the data of the next scheduled scheduling into the production scheduling algorithm and add constraints to obtain the second scheduling result. By analyzing the first scheduling result, the unavailable time period of each machine equipment in the future (for example, the time period when the equipment is processing wafers) can be determined. These unavailable time periods are input into the next scheduling as constraints to avoid conflicts between subsequent scheduling tasks and previous scheduling results. Based on these constraints, the second scheduling result is generated to ensure the continuity of the production plan and the efficient use of equipment.

[0020] S103, in the next scheduled scheduling task, continue to adjust the scheduling result based on the second scheduling result until the preset stop condition is met. In each scheduled scheduling, the unavailable time obtained from the previous scheduling is used as the input condition, and the scheduling result is continuously adjusted and optimized until the preset stop condition is met. The stop condition can be the non-idle time of the machine equipment or the preset number of locked orders. Through this step-by-step adjustment method, the scheduling plan can be gradually optimized to achieve the best equipment utilization. The first scheduling result and the second scheduling result here refer to the processing order of the scheduling. The present application is a processing step within a cycle, that is, after obtaining the second scheduling result, the second scheduling result can be used as the first scheduling result of the next cycle for looping until there is a stop condition.

[0021] S104, in the event of an abnormal situation, the scheduled production tasks are adjusted using the lock order logic, which includes the lot not arriving on time, unplanned equipment downtime, and manual intervention in batch grouping. When an abnormal situation occurs during the production process, the lock order logic will be activated. The lock order logic is designed to make necessary adjustments to the scheduled production tasks to cope with emergencies while minimizing the impact on other scheduled tasks. For different abnormal situations, corresponding processing measures will be taken, such as replacing the lot that has not arrived, rescheduling the affected equipment, or adjusting the batch grouping method, so as to ensure the flexibility and stability of the production plan.

[0022] It is not difficult to find that compared with the related art, the solution provided by the embodiment of the present application introduces timed scheduling and lock order logic, which can significantly improve the stability of scheduling and equipment utilization when dealing with complex production environments and sudden abnormal situations. This method gradually optimizes the scheduling results during the timed scheduling process and effectively adjusts the production tasks when abnormalities occur, thereby avoiding frequent plan changes and equipment idleness, and ensuring the continuity and overall efficiency of production.

[0023] Second embodiment

[0024] The second embodiment of the present application relates to a wafer capacity planning method. The second implementation method is an improvement based on the first embodiment, and the specific improvements are: This application locks orders and handles exceptions based on loops (loops are divided into three types: single loop refers to a process that only requires one WET-difussion, with a qtime in the middle that needs to be considered; no qtime loop refers to a situation where there is only one Diffusion in the entire process, in which case no data exchange is required; multi loop is more complex and can mix multiple combinations of WET and Diffusion). Provides exception alarm function, as well as manual and automatic intervention scheduling algorithms and corresponding front-end operation interfaces Since Diffusion requires batch production and the processing time is long, once an abnormal situation occurs, it will have a great impact on production capacity, so it is very necessary to handle this abnormal situation. The above order locking situation is required to handle the abnormal situation, mainly considering the following three abnormal situations: like Figure 2 As shown in the figure, lot missing handles the situation where Lot (wafer batch) is missing in the scheduled wafer production task. It is mainly used to deal with the emergency situation that the Lot in the Difussion area has not arrived on time, so as to ensure the continuity of the production plan and the efficient use of equipment.

[0025] The scheduled monitoring task is to regularly check whether each scheduled lot arrives at the designated workstation as planned. If the lot arrives on time, the production plan will continue to be executed; if it does not arrive on time, it will proceed to the next step; if the first monitoring finds that the lot does not arrive on time, the situation of the lot will be recorded, but no warning will be issued, and the next monitoring will continue; if the second monitoring finds that the lot still has not arrived, the abnormal situation of the lot will be recorded, and an alarm message will be issued to prompt the operator or the system to pay further attention; if the lot still has not arrived at the station during the third monitoring, it will try to find out whether there is a lot to be scheduled with the same flow as the lot. If a matching lot is found, it will be directly replaced and the replacement operation will be recorded.

[0026] If no matching lot is found, check whether the time from the start of the batch scheduling is less than 60 minutes. If the time is less than 60 minutes, the lot will be deleted directly, and other lots in the batch will continue to be processed together with the dummy piece; if the time exceeds 60 minutes, the batch of the lot in the diffusion process will be unbound, and other scheduling results will be unbound, and the lock order will remain unchanged. Then, the new incoming WIP will be rescheduled with the unbound lot, and production will continue with the updated scheduling results; after the diffusion process is rescheduled, the WET process or other processes with Qtime restrictions will continue to be scheduled according to the loop information. If the lot arrives on time or the normal production is ensured by replacement or deletion, the system will end the current exception handling process. The specific number of monitoring and processing times and the distance from the start of the batch scheduling can be set accordingly according to the actual situation. It can effectively deal with the abnormal situation that the lot fails to arrive at the station on time during the production process, ensuring that the production tasks in the diffusion and cleaning processes can proceed smoothly, thereby improving the continuity of production and the utilization rate of equipment.

[0027] like Figure 3 The method of handling scheduled production tasks in the case of unplanned equipment downtime (downtime) is shown in the figure. It aims to minimize the impact of equipment downtime on production plans and ensure that production tasks before and after downtime can be reasonably adjusted and continued.

[0028] Determine whether the batch in the scheduling result involves the operation of the equipment after the shutdown. First, check whether there is any batch of Lot (wafer batch) in the scheduled production tasks that is planned to continue to run after the equipment is shut down. If it is found that a batch still has subsequent processes scheduled after the equipment is shut down, proceed to the next step; if it does not involve the equipment after the shutdown, no processing is done and the original plan is continued.

[0029] The scheduling results before the equipment shutdown are locked, and the batch scheduling after the shutdown is adjusted. For the scheduling tasks before the equipment shutdown, these scheduling results will be locked to ensure that they are not affected by this abnormal situation. At the same time, for all the lots that have been scheduled and batched after the equipment shutdown, these lots will be untied and rescheduled together with the next WIP (Work In Progress) that is about to arrive. Record the abnormal situation caused by the equipment shutdown, record the shutdown event and the adjustments made to the production plan, as reference data for subsequent production analysis and improvement. These records will help to further optimize the production plan to deal with similar situations in the future. It can effectively deal with unplanned equipment shutdowns, ensure the stable execution of production tasks before the shutdown, and flexibly adjust the production plan after the shutdown, so as to minimize the impact of equipment shutdown on overall production capacity and production plans.

[0030] like Figure 4 As shown in the figure, in the wafer production process, when manual intervention in batching is required, the method of adjusting the scheduled results is used. The purpose is to ensure the coordination of manual batching requirements with existing scheduling results while minimizing the impact on the production plan.

[0031] Determine whether the scheduling result conflicts with the demand of the manually grouped batch. First, check the existing scheduling result to determine whether there is a conflict with the manually added batch demand. If the scheduling result does not conflict with the demand of the manually grouped batch, no adjustment is required and production continues as planned; if a conflict is found, proceed to the next step.

[0032] All conflicting lots are processed. If a conflict is detected, all the lots associated with the conflicting lot ID and batched will be found and the abnormal situation will be recorded. Subsequently, these conflicting lots will be untied to separate them from the original schedule, while other unaffected lots will be locked to ensure that their production plans remain unchanged. The untied lots will be rescheduled starting from the Diffusion process of the current site.

[0033] After rescheduling the Diffusion process, continue to schedule the subsequent processes. After the Diffusion process is scheduled, the WET (cleaning) process or other processes with Qtime (time limit) will continue to be scheduled according to the loop information. This ensures that the production process after re-batching can be smoothly connected to avoid delays or conflicts in subsequent processes. It can effectively coordinate the conflict between manual batching requirements and existing scheduling results, ensure the flexibility and continuity of the production plan, and thus improve the efficiency and stability of the entire wafer production process.

[0034] It is not difficult to find that the method for handling abnormal situations that may occur in the wafer capacity planning process in the embodiment of the present application can effectively deal with sudden production abnormalities and ensure the flexibility and continuity of the production plan. Through real-time monitoring, abnormality recording, dynamic adjustment of scheduling and other means, the affected production tasks can be reasonably optimized and rearranged without affecting normal production tasks, minimizing the impact of abnormal situations on overall production capacity and equipment utilization.

[0035] Third embodiment

[0036] The third embodiment of the present application relates to a wafer capacity planning method. The third implementation method is an improvement based on the first embodiment, and the specific improvements are: like Figure 5 As shown in the figure, in the wafer production process, the capacity planning method for processing wafer scheduling between different loops is used. Determine the process flow of each production loop. There are usually multiple loops in the production system, such as the No QtimeLoop with no time limit, the Single Loop with a single qtime, and the Multi Loop with multiple qtimes. The lot of each loop is scheduled according to its own process flow, and the corresponding process is completed through different equipment and machines.

[0037] Plan cross-scheduling between different loops. According to production requirements, cross-scheduling between different loops is allowed. For example, the lot of No Qtime Loop can be assigned to the machine of Single Loop or Multi Loop for processing during planning. In addition, as long as the Coming WIP belongs to the same time point, different process steps in the loop can also be processed by the same equipment machine. For example, the first WET process of Multi Loop and the lot after the second WET process can be assigned to the Diffusion machine of Single Loop for processing.

[0038] The lock logic is used to handle repeated processing. When cross-scheduling between multiple loops, a lot may be repeatedly processed on the same machine. To avoid conflicts, the lock logic is used to ensure that the locked machine resources are not affected when the next scheduling is performed. For example, when a lot needs to be processed multiple times on the same Diffusion machine, the scheduling result of the machine is locked to ensure that the lot can continuously complete all the required processes without affecting the normal scheduling of other lots.

[0039] Execute cross-scheduling and record the scheduling results. According to the above planning and lock order logic, execute cross-scheduling between different loops. All involved lots will gradually complete their respective process flows according to the adjusted scheduling order. After the scheduling is completed, the usage of each machine and the processing history of each lot will be recorded to ensure the traceability of the production process and the integrity of the scheduling data.

[0040] By real-time monitoring of the status of each lot, if it is detected that a lot fails to arrive at the designated workstation on time, an abnormal alarm will be triggered and the relevant information will be recorded in the abnormal table. The abnormal alarm result table is as follows:

[0041] Because the lot did not arrive at the station, an alarm was generated in the exception table. From left to right, they represent the exception type (lot), the specific id of the exception (lot1), batchid (the batch to which the exception belongs. If it is null, it does not affect the subsequent diffusion and can be deleted directly), stepId (the step where the exception occurred), reason (unarrived_middle_step, that is, the lot did not arrive at the station), alarm time (2024.5.13 11:32), and alarm count (1, no processing is done at this time).

[0042] It should be noted that the third embodiment of the present application may also be an improvement based on the second embodiment.

[0043] It is not difficult to find that in the embodiment of the present application, the abnormal situation that the lot fails to arrive at the station on time can be discovered and recorded in time, and appropriate processing measures can be taken to avoid the impact of the abnormality on the subsequent production process. At the same time, the alarm log recorded by the system provides an effective abnormality management tool for operators, which helps to improve the accuracy and response speed of production management.

[0044] The step division of the above methods is only for the purpose of clear description. When implemented, they can be combined into one step or some steps can be split and decomposed into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this patent; adding insignificant modifications to the algorithm or process or introducing insignificant designs without changing the core design of the algorithm and process are all within the scope of protection of this patent.

[0045] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital processing, a cellular phone, a smart phone, a wearable device, and other similar computing devices.

[0046] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the method provided in any one or more of the above embodiments. Figure 6 An exemplary structural diagram of the electronic device is disclosed. Figure 6 As shown, the electronic device includes: one or more processors 1101, a memory 1102, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common motherboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0047] The electronic device may further include: an input device 1103 and an output device 1104. The processor 1101, the memory 1102, the input device 1103 and the output device 1104 may be connected via a bus or other means. Figure 6 The example of connecting through bus is taken in the following.

[0048] The input device 1103 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator rod, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 1104 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0049] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with a user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0050] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0051] The memory 1102 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 1101 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 1102, so as to implement the program instructions / modules corresponding to the method provided by any one or more embodiments in the embodiments of the present application.

[0052] The memory 1102 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 1102 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1102 may optionally include a memory remotely arranged relative to the processor 1101, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0053] It should be noted that the computer-readable medium described in this application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.

[0054] Computer readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.

[0055] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0056] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware or any combination thereof. For example, an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device may be used to implement the embodiments. In some embodiments, the software program of the present application may be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including related data structures) may be stored in a computer-readable recording medium, such as a RAM memory, a magnetic or optical drive or a floppy disk and the like. In addition, some steps or functions of the present application may be implemented by hardware, for example, as a circuit that cooperates with a processor to perform various steps or functions.

[0057] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from a website site, a computer, a server, or a data center to another website site, a computer, a server, or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid state disk (SSD)), etc.

[0058] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0059] The scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the device claim may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used to distinguish the description, and do not indicate any particular order, nor can they be understood as indicating or implying relative importance.

[0060] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A wafer capacity planning method, characterized in that: The method comprises: Performing regular scheduling on each machine device according to the production scheduling algorithm to obtain a first scheduling result, and storing the first scheduling result; According to the first scheduling result, the unavailable time of each machine equipment is obtained, and the unavailable time is input into the production scheduling algorithm as the data of the next scheduled scheduling and constraints are added to obtain the second scheduling result; In the next scheduled task, the scheduling result is continuously adjusted based on the second scheduling result until a preset stop condition is met; In the event of an abnormal situation, the lock order logic is used to adjust the scheduled production tasks. The abnormal situation includes the lot not arriving on time, unplanned equipment downtime, and manual intervention in batching.

2. The method according to claim 1, characterized in that The stop condition includes exceeding a given number of lock times or the machine equipment having no idle time.

3. The method according to claim 1, characterized in that The use of the lock order logic to adjust the scheduled production tasks includes: When an abnormal situation occurs that the lot fails to arrive at the station on time, monitoring whether the lot arrives at the station within the scheduled time; If the lot does not arrive on time, find out whether there are other waiting lots with the same flow as the lot to replace the lot that has not arrived; If there is no lot to be replaced, determine whether to delete the unreached lot or reschedule the batched lot according to the remaining time of the batch scheduling; The rescheduling includes unbinding the batch of the lot in Diffusion and locking the other scheduling results; and rescheduling the locked machines with the next batch of lots and the unbound lots.

4. The method according to claim 1, characterized in that: The use of the lock order logic to adjust the scheduled production tasks includes: When an abnormal situation occurs in which the equipment is out of service, it is determined whether the batch in the scheduling result is after the outage; The scheduling results before the shutdown are locked, and all other batched lots after the shutdown are unbound and rescheduled together with the next batch of lots, and the exception handling process is recorded.

5. The method according to claim 1, characterized in that The use of the lock order logic to adjust the scheduled production tasks includes: When the abnormal situation of manual intervention batching occurs, Determine whether the current scheduling result conflicts with the batching requirements of manual intervention; If there is a conflict, find all the lots that are batched with the conflicting lotids, record the exception and unbind them; and lock the other non-conflicting lots; The unbound lot will be rescheduled starting from the current site Diffusion.

6. The method according to claim 3 or 5, characterized in that: The method further comprises: After rescheduling is completed, the WET equipment or other processing steps with allowed waiting time are arranged forward according to the loop information.

7. The method according to any one of claims 1 to 5, characterized in that: The method further comprises: During the process of handling the abnormal situation, the generated alarm information is recorded, and an abnormality handling report is generated after the rescheduling is completed.

8. An electronic device, characterized in that: The electronic device comprises: one or more processors; and A memory storing computer program instructions, which, when executed, cause the processor to perform the steps of the method as claimed in any one of claims 1 to 7.

9. A computer readable medium having a computer program / instructions stored thereon, characterized in that: When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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