Through type lower image wafer cutting device
Through the through-type image wafer cutting device, combined with the motion platform and the image acquisition system, the problem of accuracy in the acquisition and cutting of the wafer surface is solved, and the accurate cutting and redirection lifting of the wafer is achieved, ensuring the next process Normal production.
Patent Information
- Application Number
- CN202411541494.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-01-14
AI Technical Summary
During wafer processing, it is necessary to accurately obtain the center of the glass surface of the lower surface of the wafer to ensure cutting accuracy and peeling effect, but the prior art is difficult to achieve this goal, especially when the polymer packaging surface is inconsistent with the glass surface center. In case.
A through-type image wafer cutting device is designed, including platform base, column, cross beam, cutting stage, Y- and X-directional motion platform, through-type image, stage frame, screw motor, light source and uniform The optical plate, through these components, can achieve the contour acquisition and transfer and lift mechanism of the lower surface of the wafer to ensure cutting accuracy.
It realizes the accuracy of the profile data acquisition and cutting of the lower surface of the wafer, ensures the normal production of the next process, provides a reliable transshipment lifting mechanism, and improves the efficiency and accuracy of wafer cutting processing.
Smart Images
Figure CN119314909A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field related to wafer processing, and in particular to a through-type lower-image wafer cutting device. Background Art
[0002] One of the processes of wafer processing is to perform border cutting on it. During the processing, the wafer needs to be placed according to the following requirements, that is, the upper surface of the wafer is a polymer surface, and the lower surface is a glass surface. The glass surface on the lower surface cannot be seen on the polymer surface on the upper surface. Before cutting the wafer, it is necessary to obtain the contour data of the cut wafer. Since the center of the polymer packaging surface used in the wafer packaging process is not concentric with the center of the glass surface, in order to ensure a good peeling effect in the next process, it is necessary to accurately find the center of the polymer packaging surface and the center of the glass surface of the wafer. Therefore, it is necessary to obtain the center of the glass surface of the wafer. According to the center of the glass surface and the center of the polymer surface, a difference between the two can be given. By compensating for this interpolation during the cutting process, the cutting accuracy can be ensured, which is convenient for the separation of the next process. Therefore, a mechanism is needed to obtain the contour of the lower surface of the wafer. At the same time, when the wafer is placed on the wafer cutting stage, it is also necessary to provide a lifting mechanism in the wafer stage that can supply wafer transfer.
[0003] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a through-type bottom-image wafer cutting device to make it more valuable for industrial use. Summary of the invention
[0004] In order to solve any of the above technical problems, an object of the present invention is to provide a through-type bottom-image wafer cutting device.
[0005] To achieve the above object, the present invention adopts the following technical solution:
[0006] A through-type bottom-image wafer cutting device comprises a platform base, a left column and a right column are respectively installed on the left and right sides of the platform base, a crossbeam is installed on the top between the left column and the right column, and a wafer cutting stage is installed on the platform base below the crossbeam;
[0007] A Y-axis motion platform is installed on the platform base, the Y-axis motion platform drives the X-axis motion platform above to move in the front-back direction, the X-axis motion platform drives the wafer cutting stage above to move in the left-right direction, and a through-type lower image is installed between the left column and the right column, and the through-type lower image runs through the inner side of the wafer cutting stage along the left-right direction;
[0008] The wafer cutting platform includes a platform frame, which is a hollow rectangular frame structure. A base is installed on the top outer side of the platform frame, and an outer platform and a middle transfer platform are installed on the base from the outside to the inside. A lead screw motor is installed on the base directly below the middle transfer platform, and the driving end at the top of the lead screw motor drives the upper middle transfer platform to move in the vertical direction.
[0009] As a further improvement of the present invention, a plurality of outer suction cups are evenly distributed on the outer loading platform, and a plurality of inner suction cups are evenly distributed on the middle transfer platform.
[0010] As a further improvement of the present invention, a dust collecting tray is arranged on the outer side of the outer platform, and the dust collecting tray above is driven to move in the vertical direction by a cylinder installed on the base through a cylinder support block.
[0011] As a further improvement of the present invention, a light source is installed at the inner bottom of the stage frame, and a light homogenizing plate is installed on the stage frame just above the light source.
[0012] As a further improvement of the present invention, a protective plate is installed on the outer platform.
[0013] As a further improvement of the present invention, the screw motor is installed on the base through a motor fixing plate, and the screw motor drives the screw rod and the slider at the top to be connected to the intermediate transfer platform above.
[0014] As a further improvement of the present invention, the through-type lower image includes an image support rod, the left side of the image support rod is installed on the left column through the left support plate, and the right side of the image support rod is installed on the right column through the right support plate. The camera lens assembly, light source and adjustment frame are installed on the image support rod from left to right in sequence, the camera lens assembly is coaxial with the light source on the right, and the adjustment frame is obliquely installed on the image support rod through the adjustment frame support block.
[0015] As a further improvement of the present invention, the camera lens assembly is mounted on the image support rod via a plurality of pressing blocks.
[0016] By means of the above scheme, the present invention has at least the following advantages:
[0017] The present invention provides a lower imaging mechanism capable of acquiring the contour of the lower surface of a wafer, and a light source and a light homogenizing plate are arranged on a frame table, so as to supplement the upper image.
[0018] The present invention provides a lifting mechanism for wafer transfer, and various mechanisms cooperate together to complete the transfer after the wafer polymer surface is cut and processed, thereby ensuring the normal production of the next process.
[0019] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.
[0021] Figure 1 It is a structural schematic diagram of a through-type bottom-image wafer cutting device of the present invention;
[0022] Figure 2 yes Figure 1 Schematic diagram of the structure of the wafer cutting stage;
[0023] Figure 3 yes Figure 2 Schematic diagram of the internal structure;
[0024] Figure 4 yes Figure 1 Schematic diagram of the structure of the middle through-type lower image.
[0025] The meanings of the various reference numerals in the figures are as follows.
[0026] Left column 1, beam 2, wafer cutting stage 3, through-type lower image 4, right column 5, X-axis motion platform 6, Y-axis motion platform 7, platform base 8;
[0027] The stage frame 301, the outer suction cup 302, the middle transfer platform 303, the inner suction cup 304, the outer stage 305, the dust collecting tray 306, the cylinder 307, the base 308, the cylinder support block 309, the light source 310, the light homogenizing plate 311, the protective plate 312, the slider 313, the screw motor 314, and the motor fixing plate 315;
[0028] The left side support plate 401 , the image support rod 402 , the camera lens assembly 403 , the pressing block 404 , the light source 405 , the adjustment frame 406 , the adjustment frame support block 407 , and the right side support plate 408 . DETAILED DESCRIPTION
[0029] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0030] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.
[0031] like Figure 1 to Figure 4 As shown, a through-type lower image wafer cutting device includes a platform base 8, on the left and right sides of the platform base 8 are respectively installed a left column 1 and a right column 5, a crossbeam 2 is installed on the top between the left column 1 and the right column 5, and a wafer cutting carrier 3 is installed on the platform base 8 below the crossbeam 2.
[0032] A Y-axis motion platform 7 is installed on the platform base 8, and the Y-axis motion platform 7 drives the X-axis motion platform 6 above to move in the front-to-back direction. The X-axis motion platform 6 drives the wafer cutting stage 3 above to move in the left-to-right direction. A through-type lower image 4 is installed between the left column 1 and the right column 5, and the through-type lower image 4 penetrates the inner side of the wafer cutting stage 3 along the left-to-right direction.
[0033] The wafer cutting stage 3 includes a stage frame 301, which is a hollow rectangular frame structure. A base 308 is installed on the top outer side of the stage frame 301. The outer stage 305 and the intermediate stage 303 are installed on the base 308 from the outside to the inside. A screw motor 314 is installed on the base 308 directly below the intermediate stage 303. The driving end at the top of the screw motor 314 drives the intermediate stage 303 above to move in the vertical direction. The screw motor 314 is installed on the base 308 through a motor fixing plate 315. The screw motor 314 drives the screw at the top and the slider 313 to connect with the intermediate stage 303 above.
[0034] A plurality of outer suction cups 302 are evenly distributed on the outer stage 305 , and a plurality of inner suction cups 304 are evenly distributed on the middle stage 303 .
[0035] A dust collecting tray 306 is arranged outside the outer stage 305 , and a cylinder 307 mounted on a base 308 through a cylinder support block 309 drives the dust collecting tray 306 above to move in a vertical direction. A protective plate 312 is mounted on the outer stage 305 .
[0036] The through-type lower image 4 includes an image support rod 402, the left side of the image support rod 402 is installed on the left column 1 through the left support plate 401, and the right side of the image support rod 402 is installed on the right column 5 through the right support plate 408. A camera lens assembly 403, a light source 405 and an adjustment frame 406 are installed on the image support rod 402 from left to right. The camera lens assembly 403 is coaxial with the right light source 405, and the adjustment frame 406 is tiltedly installed on the image support rod 402 through an adjustment frame support block 407. The camera lens assembly 403 is installed on the image support rod 402 through a plurality of pressing blocks 404.
[0037] A light source 310 is installed at the inner bottom of the stage frame 301 , and a light homogenizing plate 311 is installed on the stage frame 301 just above the light source 310 .
[0038] The working process of the present invention is briefly described as follows:
[0039] The X-axis motion platform 6 and the Y-axis motion platform 7 drive the wafer cutting stage 3 to perform circular interpolation motion by interpolating circular arc motion. The camera lens assembly 403 on the through-type lower image 4 obtains the contour data of the bottom wafer glass, which is compared and analyzed with the polymer contour data on the upper part of the wafer, and the difference data is fitted to perform wafer cutting processing. When the through-type lower image 4 is used to obtain the contour data, the dust collecting tray 306 installed above the cylinder 307 is opened. During processing, the dust collecting tray 306 installed above the cylinder 307 is closed to suck away the processed particles after processing to ensure the cleanliness of the processed wafer. After processing, the screw motor 314 drives the transfer platform 303 to rise, and the robot takes away the wafer to complete the cutting processing and transfer of the wafer.
[0040] The present invention provides a through-type bottom-image wafer cutting device, which includes a mechanism capable of acquiring the contour of the bottom surface of the wafer, and also includes a lifting mechanism capable of supplying wafer transfer. The various mechanisms cooperate together to complete the cutting process of the wafer polymer surface and the transfer of the wafer, thereby ensuring the normal production of the next process.
[0041] Among them, the X-axis direction described in this article is Figure 1 The left and right directions in the Y-axis direction are Figure 1 The front-to-back direction, the Z-axis direction is Figure 1 The vertical direction in .
[0042] The present invention can obtain the lower image mechanism of the wafer lower surface contour, and at the same time, a light source and a light homogenizing plate are arranged on the frame table to fill in the image above. The lifting mechanism for wafer transfer is provided, and each mechanism cooperates to complete the transfer after the wafer polymer surface is cut and processed, ensuring the normal production of the next process.
[0043] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.
[0044] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.
Claims
1. A through-type bottom-image wafer cutting device, comprising a platform base (8), a left column (1) and a right column (5) are respectively installed on the left and right sides of the platform base (8), a crossbeam (2) is installed on the top between the left column (1) and the right column (5), and a wafer cutting carrier (3) is installed on the platform base (8) below the crossbeam (2); characterized in that: A Y-axis motion platform (7) is installed on the platform base (8), and the Y-axis motion platform (7) drives the X-axis motion platform (6) above to move in the front-rear direction, and the X-axis motion platform (6) drives the wafer cutting platform (3) above to move in the left-right direction. A through-type lower image (4) is installed between the left column (1) and the right column (5), and the through-type lower image (4) penetrates the inner side of the wafer cutting platform (3) along the left-right direction; The wafer cutting platform (3) comprises a platform frame (301), wherein the platform frame (301) is a hollow rectangular frame structure, a base (308) is installed on the top outer side of the platform frame (301), an outer platform (305) and a middle transfer platform (303) are installed on the base (308) from the outside to the inside, a screw motor (314) is installed on the base (308) directly below the middle transfer platform (303), and a driving end at the top of the screw motor (314) drives the middle transfer platform (303) above to move in a vertical direction.
2. The through-type bottom-image wafer cutting device according to claim 1, characterized in that: A plurality of outer suction cups (302) are evenly distributed on the outer platform (305), and a plurality of inner suction cups (304) are evenly distributed on the middle transfer platform (303).
3. The through-type bottom-image wafer cutting device according to claim 1, characterized in that: A dust collecting tray (306) is arranged on the outside of the outer carrier (305), and a cylinder (307) installed on the base (308) via a cylinder support block (309) drives the dust collecting tray (306) above to move in a vertical direction.
4. The through-type bottom-image wafer cutting device according to claim 1, characterized in that: A light source (310) is installed at the inner bottom of the carrier frame (301), and a light homogenizing plate (311) is installed on the carrier frame (301) directly above the light source (310).
5. The through-type bottom-image wafer cutting device according to claim 1, characterized in that: A protective plate (312) is installed on the outer platform (305).
6. The through-type bottom-image wafer cutting device according to claim 1, characterized in that: The screw motor (314) is installed on the base (308) through a motor fixing plate (315), and the screw motor (314) drives the screw rod and the slider (313) at the top to connect with the intermediate transfer platform (303) above.
7. The through-type bottom-image wafer cutting device according to claim 1, characterized in that: The through-type lower image (4) comprises an image support rod (402), the left side of the image support rod (402) is mounted on the left column (1) via a left support plate (401), and the right side of the image support rod (402) is mounted on the right column (5) via a right support plate (408). A camera lens assembly (403), a light source (405) and an adjustment frame (406) are sequentially mounted on the image support rod (402) from left to right, the camera lens assembly (403) is coaxial with the light source (405) on the right, and the adjustment frame (406) is obliquely mounted on the image support rod (402) via an adjustment frame support block (407).
8. The through-type bottom-image wafer cutting device according to claim 7, characterized in that: The camera lens assembly (403) is mounted on the image support rod (402) via a plurality of pressing blocks (404).